Display module and electronic device including the same

Abstract

A display module and an electronic device including the same are provided. The electronic device includes: an upper component including a window portion having a front surface and a back surface facing each other, a protective layer disposed on the front surface of the window portion, and an impact absorbing layer disposed on the back surface of the window portion; a display panel disposed at a lower portion of the upper component; a first adhesive layer disposed between the window portion and the protective layer; and a second adhesive layer disposed between the window portion and the impact absorbing layer, the first adhesive layer exposing an edge of the front surface of the window portion, and the window portion exposing an edge of the second adhesive layer.

Description

Technical Field

[0001] The present invention relates to a foldable electronic device. Background Art

[0002] Electronic devices include active areas that are activated by electrical signals. These active areas can sense external inputs and display various images to provide information to users. In recent years, electronic devices have been developed in a variety of shapes, and active areas with these shapes have also been realized. Summary of the Invention

[0003] An object of the present invention is to provide an electronic device in which there is no interference between adhesive layers arranged with a window portion interposed therebetween.

[0004] The electronic device to which the present invention relates includes: an upper component, including a window portion having a front surface and a back surface facing each other, a protective layer arranged on the front surface of the window portion, and an impact absorbing layer arranged on the back surface of the window portion; a display panel arranged at the lower part of the upper component; a first adhesive layer arranged between the window portion and the protective layer; and a second adhesive layer arranged between the window portion and the impact absorbing layer, the first adhesive layer exposing an edge of the front surface of the window portion, and the window portion exposing an edge of the second adhesive layer.

[0005] The present invention may be characterized in that the edge of the second adhesive layer exposed through the window portion surrounds the first adhesive layer.

[0006] The invention may be characterized in that the first adhesive layer exposes an edge of the back surface of the protective layer.

[0007] The electronic device may be characterized in that the electronic device further includes a light shielding layer disposed between the second adhesive layer and the impact absorbing layer, and the light shielding layer is disposed along an edge of the impact absorbing layer.

[0008] The electronic device may be characterized in that the electronic device further includes an anti-fingerprint layer disposed on the back side of the protective layer exposed through the first adhesive layer.

[0009] It may be characterized in that the electronic device further includes: an anti-reflection component arranged between the upper component and the display panel.

[0010] The display module disclosed herein includes: an upper component, including a window portion having a front surface and a back surface facing each other, a protective layer arranged on the front surface of the window portion, and an impact-absorbing layer arranged on the back surface of the window portion; a release film covering the upper component; a display panel arranged at the lower portion of the upper component; a first adhesive layer arranged between the window portion and the protective layer; and a second adhesive layer arranged between the window portion and the impact-absorbing layer, the first adhesive layer exposing an edge of the front surface of the window portion, and the window portion exposing an edge of the second adhesive layer.

[0011] The present invention may be characterized in that the edge of the second adhesive layer exposed through the window portion surrounds the first adhesive layer.

[0012] The invention may be characterized in that the first adhesive layer exposes an edge of the back surface of the protective layer.

[0013] The display module may be characterized in that the display module further includes a light shielding layer disposed between the second adhesive layer and the impact absorbing layer, and the light shielding layer is disposed along an edge of the impact absorbing layer.

[0014] (Effects of the Invention)

[0015] According to the present invention, the areas of the adhesive layers spaced apart from each other with the window portion interposed therebetween are different, thereby preventing the adhesive layers from failing to bond to each other when subjected to external force or when folded. This provides an electronic device with improved reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1a It is a perspective view of an electronic device according to an embodiment of the present invention.

[0017] Figure 1b It is a perspective view of an electronic device according to an embodiment of the present invention.

[0018] Figure 2 It is a block diagram of an electronic device according to an embodiment of the present invention.

[0019] Figure 3a is a cross-sectional view of an electronic device according to an embodiment of the present invention.

[0020] Figure 3b is a cross-sectional view of an electronic device according to an embodiment of the present invention.

[0021] Figure 4a It is along Figure 1a A cross-sectional view taken along line I-I'.

[0022] Figure 4bIt is a plan view schematically showing the arrangement relationship of adhesive layers that are arranged to be spaced apart from each other with a window portion interposed therebetween according to an embodiment of the present invention.

[0023] Figure 5 is a cross-sectional view of an electronic device according to an embodiment of the present invention.

[0024] Figure 6a It is a cross-sectional view showing a process of pressurizing the display module according to one embodiment of the present invention.

[0025] Figure 6b This is a cross-sectional view showing a state where a display module according to an embodiment of the present invention is pressurized.

[0026] Figure 7 is a cross-sectional view of a display module according to an embodiment of the present invention.

[0027] Figure 8 is a cross-sectional view of a display module according to an embodiment of the present invention.

[0028] Figure 9 is a cross-sectional view of a display module according to an embodiment of the present invention.

[0029] Figure 10 is a cross-sectional view of a display module according to an embodiment of the present invention.

[0030] (Explanation of Symbols)

[0031] 1000: electronic device; 100: display panel; 200: anti-reflection component; 300: upper component; 400: protective film; 500: gasket component; 600: metal plate; AD1: first adhesive layer; AD2: second adhesive layer. DETAILED DESCRIPTION

[0032] In this specification, when a certain component (or region, layer, part, etc.) is mentioned as being located on, connected to, or combined with other components, it means that it can be directly configured / connected / combined on other components, or a third component can be configured in between.

[0033] The same symbols refer to the same components. In addition, in each drawing, the thickness, ratio and size of each component are exaggerated for the effective description of the technical content.

[0034] "And / or" includes all possible combinations of more than one of the related components.

[0035] Terms such as first and second may be used to describe various components, but the components should not be limited to the terms. The terms are used solely to distinguish one component from other components. For example, a first component may be named a second component, and similarly, a second component may be named a first component, without exceeding the scope of the present invention. A singular expression includes a plurality unless otherwise expressly stated.

[0036] In addition, terms such as "below", "on the lower side", "above", and "upper side" are used to explain the connection relationship between the components shown in the drawings. These terms are relative concepts and are explained based on the directions shown in the drawings.

[0037] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification have the same meaning as those generally understood by those skilled in the art. In addition, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the relevant technology and should not be interpreted as idealized or overly formalized unless explicitly defined in this application.

[0038] Terms such as "including" or "having" should be understood as referring to the existence of features, numbers, steps, operations, constituent elements, parts or their combinations recorded in the specification, and do not exclude in advance the existence or additional possibility of one or more other features, numbers, steps, operations, constituent elements, parts or their combinations.

[0039] Figure 1a It is a perspective view of an electronic device according to an embodiment of the present invention. Figure 1b It is a perspective view of an electronic device according to an embodiment of the present invention. Figure 2 It is a block diagram of an electronic device according to an embodiment of the present invention.

[0040] Reference Figure 1a and Figure 1b , the electronic device 1000 may be a device that is activated according to an electrical signal. For example, the electronic device 1000 may be a mobile phone, a tablet, a car navigation system, a game console, or a wearable device, but is not limited thereto. Figure 1a illustratively shows a case where the electronic device 1000 is a mobile phone.

[0041] The electronic device 1000 can display images via the active area 1000A. When the electronic device 1000 is unfolded, the active area 1000A may include a plane defined by a first direction DR1 and a second direction DR2. The thickness direction of the electronic device 1000 may be aligned with a third direction DR3 that intersects the first direction DR1 and the second direction DR2. Therefore, the front surface (or top surface) and back surface (or bottom surface) of each component constituting the electronic device 1000 may be defined with reference to the third direction DR3.

[0042] The active region 1000A may include a first region 1000A1, a second region 1000A2, and a third region 1000A3. The second region 1000A2 may be folded about a folding axis FX extending along a second direction DR2. Therefore, the first region 1000A1 and the third region 1000A3 may be referred to as non-folding regions, and the second region 1000A2 may be referred to as a folding region.

[0043] If the electronic device 1000 is folded, the first region 1000A1 and the third region 1000A3 may face each other. Therefore, in the fully folded state, the active region 1000A may not be exposed to the outside, which may be referred to as in-folding. However, this is an example, and the operation of the electronic device 1000 is not limited thereto.

[0044] For example, in one embodiment of the present invention, if the electronic device 1000 is folded, the first region 1000A1 and the third region 1000A3 may be opposed to each other. Therefore, in the folded state, the active region 1000A may be exposed to the outside, which may be referred to as out-folding.

[0045] The electronic device 1000 may implement only one of the inward folding and outward folding operations. Alternatively, the electronic device 1000 may implement both the inward folding and outward folding operations. In this case, the same area of the electronic device 1000 (e.g., the second area 1000A2) may be folded inward and outward. Alternatively, some areas of the electronic device 1000 may be folded inward and other areas may be folded outward.

[0046] exist Figure 1a and Figure 1b , one folding area and two non-folding areas are illustrated, but the number of folding areas and non-folding areas is not limited thereto. For example, the electronic device 1000 may include more than two non-folding areas and multiple folding areas disposed between adjacent non-folding areas.

[0047] exist Figure 1a and Figure 1b , the folding axis FX is shown as being aligned with the short axis of the electronic device 1000, but the present invention is not limited thereto. For example, the folding axis FX may extend along the long axis of the electronic device 1000 (e.g., a direction aligned with the first direction DR1). In this case, the first region 1000A1, the second region 1000A2, and the third region 1000A3 may be sequentially arranged along the second direction DR2.

[0048] The electronic device 1000 may include a sensing area 100SA, and at least one module requiring light may be disposed below the sensing area 100SA.

[0049] The sensing area 100SA may overlap with the camera module and the proximity illumination sensor, but is not limited thereto. The sensing area 100SA may be completely surrounded by the active area 1000A, or at least partially surrounded by the active area 1000A, without limitation.

[0050] Reference Figure 2 The electronic device 1000 of the present invention may include a display panel 100, a power supply module PM, a first electronic module EM1, and a second electronic module EM2. The display panel 100, the power supply module PM, the first electronic module EM1, and the second electronic module EM2 may be electrically connected to each other.

[0051] The display panel 100 may include a display layer 110 and a sensor layer 120. The display layer 110 may be a component that substantially generates an image. Externally, the image generated by the display layer 110 may be recognized by a user through the active area 1000A.

[0052] The first electronic module EM1 and the second electronic module EM2 include various functional modules for operating the electronic device 1000. The first electronic module EM1 may be directly mounted on a main board electrically connected to the display panel 100, or may be mounted on a separate substrate and electrically connected to the main board via a connector (not shown).

[0053] The first electronic module EM1 may include a control module CM, a wireless communication module TM, an image input module IIM, an audio input module AIM, a memory MM, and an external interface IF. Some of the modules may not be mounted on the mainboard but may be electrically connected to the mainboard via a flexible circuit substrate.

[0054] The control module CM controls the overall operation of the electronic device 1000. The control module CM may be a microprocessor. For example, the control module CM activates or deactivates the display panel 100. The control module CM may also control other modules, such as the image input module IIM or the audio input module AIM, based on touch signals received from the display panel 100.

[0055] The wireless communication module TM can transmit and receive wireless signals with other terminals using Bluetooth or Wi-Fi connections. It can also transmit and receive audio signals using standard communication lines. The wireless communication module TM includes a transmitter TM1 that modulates the transmitted signal for reception and a receiver TM2 that demodulates the received signal.

[0056] The image input module IIM processes image signals and converts them into image data displayable by the display panel 100. The audio input module AIM receives external audio signals through a microphone in recording mode, voice recognition mode, and other modes and converts them into electrical audio data.

[0057] The external interface IF functions as an interface for connecting to an external charger, a wired / wireless data port, a card holder (eg, a memory card, a SIM / UIM card), and the like.

[0058] The second electronic module EM2 may include an audio output module AOM, a light emitting module LM, a light receiving module LRM, and a camera module CMM, etc. These components may be directly mounted on the mainboard, or mounted on a separate substrate and electrically connected to the display panel 100 or the first electronic module EM1 via a connector (not shown).

[0059] The sound output module AOM converts the sound data received from the wireless communication module TM or the sound data stored in the memory MM and outputs the converted sound data to the outside.

[0060] The light emitting module LM generates light for output. The light emitting module LM can output infrared rays. For example, the light emitting module LM may include an LED element. For example, the light receiving module LRM can sense infrared rays. The light receiving module LRM may be activated when infrared rays above a predetermined level are sensed. The light receiving module LRM may include a CMOS sensor. After the infrared light generated by the light emitting module LM is output, it is reflected by an external subject (for example, a user's finger or face), and the reflected infrared light may be input to the light receiving module LRM. The camera module CMM captures external images.

[0061] At least a portion of the electronic module according to one embodiment of the present invention may be disposed below the display panel 100, overlapping the sensing area 100SA. The electronic module may include at least one of a first electronic module EM1 and a second electronic module EM2. For example, the electronic module may include at least one of a camera, a speaker, a light sensor, and a heat sensor.

[0062] The electronic module can sense the external object received through the sensing area 100SA or provide sound signals such as sound to the outside through the sensing area 100SA. In addition, the electronic module can also include multiple components and is not limited to any one embodiment.

[0063] On the other hand, although not shown, the electronic device 1000 according to one embodiment of the present invention may further include a transparent component disposed between the electronic module and the display panel 100. The transparent component may be an optically transparent film, so that external input transmitted through the sensing area 100SA is transmitted to the electronic module through the transparent component. The transparent component may be attached to the back surface of the display panel 100 or disposed between the display panel 100 and the electronic module without a separate adhesive layer. The electronic device 1000 according to one embodiment of the present invention may have various structures and is not limited to any one embodiment.

[0064] According to the present invention, the electronic module can be assembled to overlap with the sensing area 100SA included in the active area 1000A in a plane, thereby preventing the peripheral area 1000NA from increasing due to the storage of the electronic module, thereby improving the aesthetics of the electronic device 1000.

[0065] Figure 3a is a cross-sectional view of an electronic device according to an embodiment of the present invention. Figure 3b is a cross-sectional view of an electronic device according to an embodiment of the present invention.

[0066] Reference Figure 3a The display panel 100 may be a component that generates an image and senses an input applied from the outside. For example, the display panel 100 may include a display layer 110 and a sensor layer 120.

[0067] The display layer 110 may be a structure that substantially generates an image and may be a light-emitting display layer, for example, an organic light-emitting display layer, a quantum dot display layer, or a micro-LED display layer.

[0068] The display layer 110 may include a base layer 111 , a circuit layer 112 , a light emitting element layer 113 , and an encapsulation layer 114 .

[0069] The base layer 111 may include a synthetic resin film. The synthetic resin film may include a thermosetting resin. The base layer 111 may have a multi-layer structure. For example, the base layer 111 may also have a three-layer structure of a synthetic resin layer, an adhesive layer, and a synthetic resin layer.

[0070] In particular, the synthetic resin layer may be a polyimide resin layer, and its material is not particularly limited. The synthetic resin layer may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, aminomethyl acetic acid resin, cellulose resin, siloxane resin, polyamide resin, and perylene resin. Furthermore, the base layer 111 may include a glass substrate or an organic / inorganic composite substrate.

[0071] The circuit layer 112 can be disposed on the base layer 111. The circuit layer 112 can include an insulating layer, a semiconductor pattern, a conductive pattern, and signal lines. After forming the insulating layer, semiconductor layer, and conductive layer on the base layer 111 by coating, deposition, or other methods, the insulating layer, semiconductor layer, and conductive layer can be selectively patterned through multiple photolithography steps. Subsequently, the semiconductor pattern, conductive pattern, and signal lines included in the circuit layer 112 can be formed.

[0072] The light emitting element layer 113 may be disposed on the circuit layer 112. The light emitting element layer 113 may include a light emitting element. For example, the light emitting element layer 113 may include an organic light emitting substance, quantum dots, quantum rods, or micro LEDs.

[0073] The encapsulation layer 114 may be disposed on the light emitting element layer 113. The encapsulation layer 114 may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence, but the layers constituting the encapsulation layer 114 are not limited thereto.

[0074] Each inorganic layer can protect the light-emitting element layer 113 from moisture and oxygen, and the organic layer can protect the light-emitting element layer 113 from foreign matter such as dust particles. Each inorganic layer can include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer can include an acrylic organic layer, but is not limited thereto.

[0075] The sensor layer 120 can be configured on the display layer 110. The sensor layer 120 can sense external input applied from the outside. The external input can include various forms of input provided from outside the electronic device 1000. For example, in addition to contact caused by a part of the user's body such as a hand, the external input can also include external input applied by being close to or adjacent to the electronic device 1000 at a predetermined distance (for example, hovering). In addition, various forms such as force, pressure, and light can be used, and the external input is not limited to any one embodiment.

[0076] The sensor layer 120 can be formed on the display layer 110 through a continuous process. In this case, the sensor layer 120 can be directly disposed on the display layer 110. Directly disposed can mean that no third component is disposed between the sensor layer 120 and the display layer 110. In other words, no separate adhesive member is disposed between the sensor layer 120 and the display layer 110.

[0077] Alternatively, the sensor layer 120 and the display layer 110 may be bonded to each other by an adhesive member. The adhesive member may include a general adhesive or a bonding agent.

[0078] Reference Figure 3b , the display panel 100-1 and Figure 3a Compared with the display panel 100 described in FIG, the display panel 100 may further include an anti-reflection layer 130. In this case, the electronic device 1000 (refer to FIG. 1 ) including the display panel 100-1 may further include an anti-reflection layer 130. Figure 2 ) can be omitted in the anti-reflection component 200 (refer to Figure 4a ) and the third adhesive layer AD3 (refer to Figure 4a ). Hereinafter, repeated descriptions are omitted.

[0079] The display panel 100 - 1 may include a display layer 110 , a sensor layer 120 , and an anti-reflection layer 130 .

[0080] The anti-reflection layer 130 according to one embodiment of the present invention may include a plurality of color filters. The plurality of color filters may have a predetermined arrangement. The arrangement of the color filters may be determined based on the luminous colors of the pixels included in the display layer 110. Furthermore, the anti-reflection layer 130 may further include a black matrix adjacent to the color filters.

[0081] The anti-reflection layer 130 according to one embodiment of the present invention may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light reflected from the first reflective layer and the second reflective layer, respectively, may destructively interfere with each other, thereby reducing the reflectivity of external light.

[0082] Figure 4a It is along Figure 1a A cross-sectional view taken along line I-I'. Figure 4b It is a plan view schematically showing the arrangement relationship of adhesive layers that are arranged to be spaced apart from each other with a window portion interposed therebetween according to an embodiment of the present invention. Figure 5 is a cross-sectional view of an electronic device according to an embodiment of the present invention. Figure 6a It is a cross-sectional view showing a process of pressurizing the display module according to one embodiment of the present invention. Figure 6b This is a cross-sectional view showing a state where a display module according to an embodiment of the present invention is pressurized.

[0083] Reference Figure 4a The electronic device 1000 according to the present invention may include a display panel 100, an anti-reflection member 200, an upper member 300, a protective film 400, a spacer member 500, and a metal plate 600. As described above, the display panel 100 may generate an image or sense an external input.

[0084] The anti-reflection member 200 is disposed on the display panel 100. The anti-reflection member 200 can reduce the reflectivity of external light incident from the outside. The anti-reflection member 200 may include a stretched synthetic resin film. For example, the anti-reflection member 200 may be provided by dyeing a polyvinyl alcohol film (PVA film) with an iodine compound. However, this is merely an example, and the material constituting the anti-reflection member 200 is not limited to this example.

[0085] The upper member 300 may be disposed on the anti-reflection member 200 . In this embodiment, the upper member 300 may include a protective layer 310 , a window portion 320 , and an impact absorbing layer 330 .

[0086] Protective layer 310 can be disposed on window portion 320. Protective layer 310 can protect components disposed beneath protective layer 310. Protective layer 310 can further include a hard coating layer, anti-fingerprint layer, etc. to enhance chemical resistance and wear resistance. Protective layer 310 can comprise a film having an elastic modulus of 15 GPa or less at room temperature.

[0087] The window portion 320 may be disposed below the protective layer 310. The window portion 320 may comprise an optically transparent insulating material. For example, the window portion 320 may comprise a glass substrate or a synthetic resin film. If the window portion 320 is a glass substrate, the thickness of the window portion 320 may be less than 80 microns, but the thickness of the window portion 320 is not limited thereto.

[0088] In the case where the window portion 320 is a synthetic resin film, the window portion 320 may include a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0089] The window portion 320 may have a multi-layer structure or a single-layer structure. For example, the window portion 320 may include a plurality of synthetic resin films bonded together with an adhesive, or a glass substrate and a synthetic resin film bonded together with an adhesive.

[0090] The impact absorbing layer 330 is disposed below the window portion 320. The impact absorbing layer 330 may be a functional layer for protecting the display panel 100 from external impacts. The impact absorbing layer 330 may be selected from films having an elastic modulus of 1 GPa or greater at room temperature. The impact absorbing layer 330 may be a stretched film having an optical function. For example, the impact absorbing layer 330 may be an optical axis control film. For example, the impact absorbing layer 330 may be a biaxially stretched PET film.

[0091] The light shielding layer 340 may be disposed on the impact absorbing layer 330. The light shielding layer 340 may be provided by printing on the upper surface of the impact absorbing layer 330. The light shielding layer 340 may overlap with the peripheral area 1000NA. The light shielding layer 340 may be a colored layer and may be formed by coating.

[0092] The light shielding layer 340 may include a polymer resin and a pigment mixed in the polymer resin. The polymer resin may be, for example, an acrylic resin or polyester, and the pigment may be a carbon-based pigment. However, the material constituting the light shielding layer 340 is not limited thereto.

[0093] The lower functional layer may be disposed below the display panel 100. For example, the lower functional layer may include a protective film 400, a spacer member 500, and a metal plate 600.

[0094] Although not shown, the lower functional layer may also include a height compensation component to maintain the radius of curvature of the folding region 1000A2 when folded. Furthermore, the components included in each functional layer are not limited to this. At least some of the above components may be omitted, and other components may be added.

[0095] The protective film 400 is disposed below the display panel 100. The protective film 400 can prevent scratches on the back of the display panel 100 during the manufacturing process of the display panel 100. The protective film 400 can be a colored polyimide film. For example, the protective film 400 can be an opaque yellow film, but is not limited thereto.

[0096] The spacer member 500 may be disposed below the protective film 400. The spacer member 500 may protect the display panel 100 from impacts transmitted from below. The spacer member 500 may improve the impact resistance of the electronic device 1000.

[0097] The gasket member 500 may include a barrier film and a cushion layer. The barrier film may be provided to improve impact resistance. The barrier film may prevent deformation of the display panel 100. The barrier film may be a synthetic resin film (eg, a polyimide film), but is not limited thereto.

[0098] The cushion layer may comprise, for example, a foam or sponge. The foam may comprise polyurethane foam or thermoplastic polyurethane foam. In the case where the cushion layer comprises a foam, the cushion layer may be formed with a barrier film as a base layer. For example, a foaming agent may be foamed on the barrier film to form the cushion layer.

[0099] At least one of the barrier film and the cushion layer may have a color that absorbs light. For example, at least one of the barrier film and the cushion layer may be black. In this case, it is possible to prevent the components disposed below the spacer member 500 from being recognized from the outside.

[0100] The metal plate 600 may be disposed at a lower portion of the gasket member 500. The metal plate 600 may include a plate, a lower adhesive layer, and a cover layer.

[0101] Metal plate 600 can be made of a material with an elastic modulus of 60 GPa or greater at room temperature. For example, metal plate 600 can be SUS304, but is not limited thereto. Metal plate 600 can support the various components disposed above it. Furthermore, metal plate 600 can improve the heat dissipation performance of electronic device 1000.

[0102] Although not shown, a portion of the metal plate 600 overlapping the second area 1000A2 may define an opening. The metal plate 600 may have an opening overlapping the folded area so that the portion of the metal plate 600 overlapping the second area 1000A2 can be more easily deformed.

[0103] Although not shown, a heat sink with high thermal conductivity may be further provided below the metal plate 600. The heat sink may be a graphitized polymer film, such as a polyimide film.

[0104] The electronic device 1000 of the present invention may include a plurality of adhesive layers. Each adhesive layer may include any one of a pressure sensitive adhesive film (PSA), an optically clear adhesive film (OCA), and an optically clear adhesive resin (OCR). Figure 4a The first adhesive layer AD1, the second adhesive layer AD2 and the third adhesive layer AD3 are shown in the figure, but it is not limited to this. Adhesive layers can also be configured between the display panel 100 and the anti-reflection component 200, between the display panel 100 and the protective film 400, and between the gasket component 500 and the metal plate 600.

[0105] The first adhesive layer AD1 can be disposed between the protective layer 310 and the window portion 320 to bond the protective layer 310 and the window portion 320. An edge 320-U of the front surface of the window portion 320 can be exposed from the first adhesive layer AD1. Furthermore, an edge 310-E of the back surface of the protective layer 310 can be exposed from the first adhesive layer AD1. In the present invention, an "edge" can be defined as the border of each component on a plane.

[0106] The second adhesive layer AD2 may be disposed between the window portion 320 and the impact absorbing layer 330 to couple the window portion 320 and the impact absorbing layer 330 . An edge AD2 -U of the second adhesive layer AD2 may be exposed from the window portion 320 .

[0107] Figure 4b A simple illustration of Figure 4a The window portion 320 is shown by a dotted line. According to the present invention, the area of the first adhesive layer AD1 in the first direction DR1 and the second direction DR2 may be smaller than the area of the second adhesive layer AD2.

[0108] Therefore, an edge 320-U of the front surface of the window portion 320 may be exposed from the first adhesive layer AD1, and an edge AD2-U of the second adhesive layer AD2 may be exposed from the window portion 320. In addition, the edge AD2-U of the second adhesive layer AD2 exposed through the window portion 320 may surround the first adhesive layer AD1.

[0109] According to the present invention, the adhesive layers AD1 and AD2 disposed on different layers sandwiching the window portion 320 have different areas, so that when there is an external impact or folding, there is no interference between the adhesive layers AD1 and AD2.

[0110] According to the present invention, the side surfaces of the second adhesive layer AD2, the impact absorbing layer 330, the anti-reflection member 200, the display panel 100, and the protective film 400, respectively adjacent to the edge AD2-U of the second adhesive layer AD2, may be aligned with one another.

[0111] The aligned side surfaces may be defined as a module side portion EG, which may be formed by simultaneously cutting the second adhesive layer AD2, the impact absorbing layer 330, the anti-reflection member 200, the display panel 100, and the protective film 400 in the same process.

[0112] Reference Figure 5 The electronic device 1000-1 according to the present invention may include a display panel 100, an anti-reflection member 200, an upper member 300-1, a protective film 400, a spacer member 500, and a metal plate 600. In addition, the electronic device 1000-1 may include a plurality of adhesive layers AD1, AD2, and AD3.

[0113] exist Figure 5 The components of the electronic device 1000-1 shown in FIG. 1 may be the same as those in FIG. Figure 4a The electronic device 1000 has the same structure as described in , and repeated description is omitted.

[0114] The upper component 300 - 1 involved in this embodiment may include a protection layer 310 , a window portion 320 , an impact absorbing layer 330 , a light shielding layer 340 , and an anti-fingerprint layer 350 .

[0115] The protective layer 310 may be disposed on the window portion 320 and may be bonded to the protective layer 310 via a first adhesive layer AD1. The impact absorbing layer 330 may be disposed below the window portion 320 and may be bonded to the impact absorbing layer 330 via a second adhesive layer AD2.

[0116] The light shielding layer 340 may be disposed on the impact absorbing layer 330. The light shielding layer 340 may be provided by printing on the upper surface of the impact absorbing layer 330. The light shielding layer 340 may overlap with the peripheral area 1000NA. The light shielding layer 340 may be a colored layer and may be formed by coating.

[0117] The anti-fingerprint layer 350 can be placed on the edge 310-E of the back side of the protective layer 310 that is exposed through the first adhesive layer AD1. The anti-fingerprint layer 350 prevents the second adhesive layer AD2 from directly bonding with the protective layer 310 due to external impact or external forces applied during folding. This provides an upper component 300-1 with improved reliability.

[0118] The anti-fingerprint layer 350 may include a fingerprint-resistant material. For example, the anti-fingerprint layer 350 may include at least one of a metal oxide such as titanium oxide, a silicon-based compound, and a fluorine-based compound. The anti-fingerprint layer 350 may be formed by a wet coating or dry coating process on the edge 310 -E of the back surface of the protective layer 310 .

[0119] Figure 6a and Figure 6b As an example, a process of bonding the protective layer 310 , the window portion 320 , and the impact absorbing layer 330 by a lamination process is shown.

[0120] Reference Figure 6a and Figure 6b The lamination process may be performed while attaching a release film RF to the protective layer 310 and applying pressure in the second direction DR2 by the roller RL. The release film RF may be removed after the lamination process.

[0121] When the roller RL applies pressure, the edge of the protective layer 310 and the edge of the second adhesive layer AD2 may come close to or contact each other due to the height difference caused by the area difference between the first adhesive layer AD1 and the protective layer 310 and the first adhesive layer AD1 and the second adhesive layer AD2.

[0122] According to the present invention, by making the area of the first adhesive layer AD1 smaller than the area of the second adhesive layer AD2 (refer to Figure 4b ), even when pressurized by the roller RL, the problem of the first adhesive layer AD1 and the second adhesive layer AD2 arranged with the window portion 320 interposed therebetween being bonded to each other can be prevented.

[0123] Furthermore, by including the anti-fingerprint layer 350 on the back side of the protective layer 310, even if the edge of the protective layer 310 is adjacent to the second adhesive layer AD2 during pressure application, direct contact is prevented by the anti-fingerprint layer 350, thereby preventing the second adhesive layer AD2 from bonding to the protective layer 310. Furthermore, during the application of the anti-fingerprint layer 350 to the protective layer 310, the adhesive strength of the edge of the second adhesive layer AD2 may decrease.

[0124] Figure 7 is a cross-sectional view of a display module according to an embodiment of the present invention. Figure 8 is a cross-sectional view of a display module according to an embodiment of the present invention. Figure 9 is a cross-sectional view of a display module according to an embodiment of the present invention. Figure 10 1 to 2 are cross-sectional views of a display module according to an embodiment of the present invention. Figure 6b The same or similar components are denoted by the same or similar reference numerals, and duplicate descriptions are omitted.

[0125] Figures 7 to 10 is included in Figures 6a to 6b Hereinafter, in the present invention, a state where a release film is disposed on a protective layer may be defined as a display module.

[0126] Reference Figure 7 In this embodiment, the display module 1000-A may include a display panel 100, an anti-reflection component 200, an upper component 300-A, a protective film 400, a spacer component 500, and a metal plate 600. In addition, a release film RF-A may be included on the upper component 300-A.

[0127] The upper component 300 -A involved in this embodiment may include a protective layer 310 , a window portion 320 , an impact absorbing layer 330 , a light shielding layer 340 and an anti-fingerprint layer 350 .

[0128] The protective layer 310 may be disposed on the window portion 320 and may be bonded to the protective layer 310 via a first adhesive layer AD1. The impact absorbing layer 330 may be disposed below the window portion 320 and may be bonded to the impact absorbing layer 330 via a second adhesive layer AD2.

[0129] The light shielding layer 340 may be disposed on the impact absorbing layer 330. The light shielding layer 340 may be provided by printing on the upper surface of the impact absorbing layer 330. The light shielding layer 340 may overlap with the peripheral area 1000NA. The light shielding layer 340 may be a colored layer and may be formed by coating.

[0130] The anti-fingerprint layer 350 can be placed on the edge 310-E of the back side of the protective layer 310 that is exposed through the first adhesive layer AD1. The anti-fingerprint layer 350 prevents the second adhesive layer AD2 from bonding with the protective layer 310 due to external impact or external forces applied during folding. This provides an upper component 300-A with improved reliability.

[0131] In this embodiment, the release film RF-A may include a first film R1 and a second film R2. The first film R1 may overlap with the second adhesive layer AD2, and the second film R2 may protrude from the first film R1 in the second direction DR2 in cross-section. In this embodiment, the side surface of the second film R2 may protrude further in the second direction DR2 than the module side surface EG. Therefore, the release film RF-A may cover the entire surface of the protective layer 310.

[0132] Reference Figure 8 In this embodiment, the display module 1000-B may include a display panel 100, an anti-reflection component 200, an upper component 300-B, a protective film 400, a spacer component 500, and a metal plate 600. In addition, a release film RF-B may be included on the upper component 300-B.

[0133] The upper component 300 -B involved in this embodiment may include a protective layer 310 -B, a window portion 320 , an impact absorbing layer 330 , a light shielding layer 340 and an anti-fingerprint layer 350 -B.

[0134] Protective layer 310-B may include a first portion 311 and a second portion 312. First portion 311 may overlap second adhesive layer AD2, and second portion 312 may protrude from first portion 311 in a second direction DR2 in cross-section. In this embodiment, a side surface of second portion 312 may protrude further in second direction DR2 than module side portion EG.

[0135] In this embodiment, the release film RF-B may include a first film R1 and a second film R2. The first film R1 may overlap the first portion 311, and the second film R2 may overlap the second portion 312. In this embodiment, the side surface of the second film R2 may protrude further in the second direction DR2 than the module side portion EG.

[0136] The anti-fingerprint layer 350 -B may be disposed on the entire surface of the second portion 312 and the first portion 311 adjacent to the second portion 312 .

[0137] According to this embodiment, by including a protective layer 310-B having a second portion 312 protruding further in one direction than the module side EG, when the release film RF-B is removed, the external force applied to the protective layer 310-B can be dispersed to the second portion 312 separated from the second adhesive layer AD2.

[0138] Reference Figure 9 In this embodiment, the display module 1000-C may include a display panel 100, an anti-reflection component 200, an upper component 300, a protective film 400, a spacer component 500, and a metal plate 600. Furthermore, the display module 1000-C may include a release film RF-C disposed on the upper component 300 and an additional anti-fingerprint layer R-BM.

[0139] The upper component 300 involved in this embodiment may include a protective layer 310 , a window portion 320 , an impact absorbing layer 330 , a light shielding layer 340 , and an anti-fingerprint layer 350 .

[0140] Protective layer 310 may be disposed on window 320 and bonded to each other via first adhesive layer AD1. Shock absorbing layer 330 may be disposed below window 320 and bonded to each other via second adhesive layer AD2.

[0141] The light shielding layer 340 may be disposed on the impact absorbing layer 330. The light shielding layer 340 may be provided by printing on the upper surface of the impact absorbing layer 330. The light shielding layer 340 may overlap with the peripheral area 1000NA. The light shielding layer 340 may be a colored layer and may be formed by coating.

[0142] The anti-fingerprint layer 350 can be placed at the edge 310-E of the back side of the protective layer 310 that is exposed through the first adhesive layer AD1. The anti-fingerprint layer 350 prevents the second adhesive layer AD2 from bonding with the protective layer 310 due to external impact or external forces applied during folding. This provides an upper component 300 with improved reliability. The anti-fingerprint layer 350 can include a fingerprint-resistant material.

[0143] The additional anti-fingerprint layer R-BM can be disposed between the protective layer 310 and the release film RF-C. Specifically, the additional anti-fingerprint layer R-BM can overlap the edge of the second adhesive layer AD2. The additional anti-fingerprint layer R-BM can be applied to the upper surface of the release film RF-C. The additional anti-fingerprint layer R-BM can include a fingerprint-resistant material.

[0144] According to this embodiment, the additional anti-fingerprint layer R-BM is included to overlap the edge of the second adhesive layer AD2 exposed from the window portion 320. This can reduce the bonding force between the release film RF-C and the protective layer 310 in the area where the additional anti-fingerprint layer R-BM is provided. As a result, when the release film RF-C is removed from the protective layer 310, the external force applied to the protective layer 310 can be reduced.

[0145] Reference Figure 10 In this embodiment, the display module 1000-D may include a display panel 100, an anti-reflection component 200, an upper component 300, a protective film 400, a spacer component 500, and a metal plate 600. In addition, a release film RF-D may be included on the upper component 300.

[0146] In this embodiment, the release film RF-D may include a third portion R3 and a fourth portion R4 stacked along a third direction DR3. The fourth portion R4 is disposed on the protective layer 310, covering the entire surface of the protective layer 310. The third portion R3 is disposed on the fourth portion R4, leaving an edge R4-U of the fourth portion R4 exposed. In plan view, the third portion R3 may have a smaller area than the first adhesive layer AD1.

[0147] The thickness of the release film RF-D with only the fourth portion R4 is smaller than that of the release film RF-D with both the third and fourth portions R3 and R4. Therefore, the adhesive strength of the release film RF-D can be reduced in the thinner areas. According to this embodiment, the bonding strength between the release film RF-D and the protective layer 310 can be relatively weaker at the edge R4-U of the fourth portion R4 than at other areas. Consequently, the external force applied to the protective layer 310 during removal of the release film RF-D can be reduced.

[0148] The above description is based on the preferred embodiments of the present invention, but those skilled in the art or those skilled in the art should understand that various modifications and changes can be made to the present invention without departing from the scope of the concept and technical field of the present invention as described in the claims.

[0149] Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined only by the claims.

Claims

1. An electronic device comprising: an upper member including a window portion having a front surface and a back surface facing each other, a protective layer disposed on the front surface of the window portion, and a shock absorbing layer disposed on the back surface of the window portion; a display panel disposed at a lower portion of the upper component; a first adhesive layer disposed between the window portion and the protective layer; as well as The second adhesive layer is disposed between the window portion and the impact absorbing layer. The first adhesive layer exposes the edge of the front surface of the window portion. The window portion exposes an edge of the second adhesive layer.

2. The electronic device according to claim 1, wherein: The edge of the second adhesive layer exposed through the window portion surrounds the first adhesive layer.

3. The electronic device according to claim 1, wherein: The first adhesive layer exposes an edge of the back surface of the protective layer.

4. The electronic device according to claim 1, wherein: Also includes: The light shielding layer is disposed between the second adhesive layer and the impact absorbing layer and is disposed along an edge of the impact absorbing layer.

5. The electronic device according to claim 1, wherein: Also includes: The anti-fingerprint layer is disposed on the back side of the protective layer exposed through the first adhesive layer.

6. The electronic device according to claim 1, wherein: Also includes: The anti-reflection component is arranged between the upper component and the display panel.

7. A display module, comprising: an upper member including a window portion having a front surface and a back surface facing each other, a protective layer disposed on the front surface of the window portion, and a shock absorbing layer disposed on the back surface of the window portion; a release film covering the upper component; a display panel disposed at a lower portion of the upper component; a first adhesive layer disposed between the window portion and the protective layer; as well as The second adhesive layer is disposed between the window portion and the impact absorbing layer. The first adhesive layer exposes the edge of the front surface of the window portion. The window portion exposes an edge of the second adhesive layer.

8. The display module according to claim 7, wherein: The edge of the second adhesive layer exposed through the window portion surrounds the first adhesive layer.

9. The display module according to claim 7, wherein: The first adhesive layer exposes an edge of the back surface of the protective layer.

10. The display module according to claim 7, wherein: Also includes: The light shielding layer is disposed between the second adhesive layer and the impact absorbing layer and is disposed along an edge of the impact absorbing layer.

Images