Semiconductor process equipment, tray, and cassette

Abstract

The present application discloses a semiconductor process equipment, a tray and a cassette, relating to the field of semiconductor equipment. A semiconductor process equipment includes a process chamber, a transfer chamber and a loading chamber. The loading chamber is used to accommodate the cassette, and the cassette is used to carry the tray. A transfer device is provided in the transfer chamber for transferring the tray between the process chamber and the loading chamber. An image recognition device is provided at the junction of the loading chamber and the transfer chamber. The image recognition device is used to recognize a preset feature image on the tray during the process of the transfer device carrying the tray to move, so as to determine the feature information of the tray. The semiconductor process equipment further includes a controller, and the controller is used to obtain the feature information, search for transfer parameters corresponding to the feature information from a preset tray information library, and control the transfer device to transfer the tray according to the transfer parameters. A tray is applied to the semiconductor process equipment. A cassette is used to carry the tray. The present application can solve problems such as low transfer accuracy, time-consuming and laborious

Description

Technical Field

[0001] This application belongs to the technical field of semiconductor equipment, and particularly relates to a semiconductor process equipment, a tray and a cassette. Background Art

[0002] An enhanced plasma enhanced chemical vapor deposition (PECVD) equipment is a thin film deposition equipment widely used in related fields such as LEDs, ICs, and micro electro mechanical systems (MEMS). It is mainly used in the process of depositing SiO2, SiN x or SiON thin films on the surfaces of wafers of specifications such as 2 inches, 4 inches, and 6 inches. Currently, this type of equipment has been widely used in related semiconductor fields.

[0003] When the PECVD equipment deposits a thin film, the wafer needs to be loaded in the loading chamber, taken out from the loading chamber by a manipulator, transferred in the transfer chamber, and then transferred to the process chamber for a process reaction. Due to the process requirements for wafers of different sizes in the same reaction chamber, the wafers are generally placed on a tray for transfer. To ensure that the position of the wafer in the reaction chamber is relatively accurate to ensure the repeatability of the process, the accurate transfer of trays of different sizes during the transfer process is crucial.

[0004] However, some transfer equipment cannot accurately position trays of different specifications in the loading chamber, resulting in low transfer accuracy; the parameters of different trays need to be manually input, and when switching trays of different sizes, the cavity needs to be opened for calibration of each station and active wafer centering (AWC) calibration, resulting in time-consuming and laborious work and prone to human errors, affecting the transfer accuracy. Summary of the Invention

[0005] The purpose of the embodiments of this application is to provide a semiconductor process equipment, a tray and a cassette, which can solve problems such as low transfer accuracy, time-consuming and laborious work, etc.

[0006] To solve the above technical problems, this application is implemented as follows:

[0007] The embodiments of this application provide a semiconductor process equipment, including a process chamber, a transfer chamber, and a loading chamber. The process chamber is used to perform semiconductor processes, the loading chamber is used to accommodate a cassette, the cassette is used to carry a tray, and a transfer device is provided in the transfer chamber for transferring the tray between the process chamber and the loading chamber;

[0008] An image recognition device is provided at the junction of the loading chamber and the transfer chamber. The image recognition device is configured to recognize a preset feature image on the tray and determine the feature information of the tray during the process that the transfer device carries the tray from the loading chamber to the transfer chamber.

[0009] The semiconductor process equipment further includes a controller. The controller is configured to obtain the feature information, search for transfer parameters corresponding to the feature information from a preset tray information library, and control the transfer device to transfer the tray according to the transfer parameters.

[0010] An embodiment of the present application also provides a tray, which is applied to the above semiconductor process equipment. A feature image is provided on the top surface of the tray. The feature image can be recognized by the image recognition device, and the feature image includes the feature information of the tray.

[0011] An embodiment of the present application also provides a cassette for carrying the above tray. The cassette includes a plurality of carrying positions. Each carrying position includes a first support block and a second support block which are oppositely arranged. At least one positioning pin is respectively provided on the first support block and the second support block for cooperating with at least two positioning holes on the tray to limit the position of the tray in the cassette, so that the point on the tray contour farthest from the transfer chamber along the tray transfer direction is located at a preset position.

[0012] In the embodiment of the present application, the preset feature image on the tray can be recognized by the image recognition device, so as to determine the feature information of the tray. After the controller obtains the feature information, it searches for the transfer parameters corresponding to the feature information from the preset tray information library, and then controls the transfer device to move according to the transfer parameters to realize the transfer of the tray. Based on the above settings, trays of different specifications can be automatically recognized, thus effectively solving the problems of time-consuming, laborious and easy to have errors caused by the manual input method, and ensuring the transfer accuracy of trays with different feature information. In addition, the controller can search for the corresponding transfer parameters from the preset tray information library and make the transfer device transfer the tray according to the transfer parameters, so that it is not necessary to open the chamber for the transfer device station calibration, effectively solving the problem of time-consuming and laborious caused by opening the chamber. Therefore, the embodiment of the present application can achieve automatic and intelligent transfer while ensuring the transfer accuracy, reduce manual labor and improve the transfer efficiency. Description of the Drawings

[0013] Figure 1 It is a schematic structural diagram of the semiconductor process equipment disclosed in the embodiment of the present application;

[0014] Figure 2 It is a schematic structural diagram of the cassette disclosed in the embodiment of the present application;

[0015] Figure 3 Schematic diagrams of different forms of barcodes (a)-(h) disclosed in the embodiments of the present application;

[0016] Figure 4 Schematic diagram of the tray transfer principle disclosed in the embodiments of the present application;

[0017] Figure 5 Schematic diagram of the principle of establishing a tray information library disclosed in the embodiments of the present application.

[0018] Description of reference numerals:

[0019] 100 - Loading chamber;

[0020] 200 - Transfer chamber;

[0021] 300 - Process chamber;

[0022] 400 - Cassette; 410 - Locating pin; 420 - First support block; 430 - Second support block;

[0023] 500 - Tray; 510 - Barcode;

[0024] 600 - Transfer device;

[0025] 700 - Image recognition device;

[0026] 810 - First AWC sensor; 820 - Second AWC sensor. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0028] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or multiple.

[0029] Refer to Figures 1 to 5 , the embodiments of the present application disclose a semiconductor processing equipment. As Figure 1As shown, the disclosed semiconductor processing equipment includes a loading chamber 100, a transfer chamber 200, and a processing chamber 300. Among them, the processing chamber 300 is used to perform semiconductor processes, for example, processes such as etching a wafer and forming a film on the surface of the wafer. The loading chamber 100 is used to accommodate a cassette 400, the cassette 400 is used to carry a tray 500, and the tray 500 is used to carry wafers. In this way, before the wafers are processed, they are placed in the loading chamber 100 for storage through the tray 500 and the cassette 400. When the wafers need to be processed, they can be transferred from the loading chamber 100 to the processing chamber 300 through the transfer chamber 200 to process the wafers in the processing chamber 300.

[0030] In some embodiments, the loading chamber 100, the transfer chamber 200, and the processing chamber 300 are arranged in sequence. In order to transfer the wafers in the loading chamber 100 to the processing chamber 300, a transfer device 600 is provided in the transfer chamber 200. Optionally, the transfer device 600 may include a manipulator. Through the transfer device 600, the tray 500 can be transferred between the processing chamber 300 and the loading chamber 100, and the wafers can be carried by the tray 500 for transfer.

[0031] In order to identify various different specifications of trays 500, an image recognition device 700 is provided at the junction of the loading chamber 100 and the transfer chamber 200. During the process of the transfer device 600 carrying the tray 500 moving from the loading chamber 100 to the transfer chamber 200, the preset characteristic image on the tray 500 can be recognized by the image recognition device 700, so as to determine the characteristic information (such as number, serial number, identification, etc.) of the tray 500 according to the characteristic image.

[0032] Based on this, by providing the image recognition device 700 at the junction of the loading chamber 100 and the transfer chamber 200, an image recognition area is formed in the area near the junction of the loading chamber 100 and the transfer chamber 200. In this way, when the transfer device 600 carries the tray 500 through the image recognition area, since different specifications of trays 500 are provided with different characteristic images, the characteristic image on the currently transferred tray 500 can be recognized by the image recognition device 700, and the characteristic information of the tray 500 can be obtained according to the recognized characteristic image of the tray 500, so as to prepare for adjusting the transfer mode of the transfer device 600.

[0033] The semiconductor processing equipment further includes a controller. The controller can be respectively connected to the above-mentioned image recognition device 700 and the transfer device 600 to realize signal transmission. Specifically, the image recognition device 700 can send the characteristic information of the tray 500 to the controller, which is analyzed and processed by the controller, and then the transfer device 600 is controlled to perform corresponding transfer actions according to the analysis and processing results.

[0034] Among them, the controller can obtain the characteristic information of the currently transported tray 500. At the same time, a tray information library can be stored in the controller. The tray information library includes the characteristic information of multiple trays 500 with different specifications, and the transmission parameters corresponding to the multiple trays 500 with different specifications respectively. In this way, after the controller obtains the characteristic information of the currently transported tray 500, it searches for the corresponding transmission parameter from the tray information library according to this characteristic information. When the corresponding transmission parameter is found, it controls the transmission device 600 to transport the tray 500 according to this transmission parameter.

[0035] The specific process of transporting the semiconductor process equipment tray 500 provided by the embodiment of the present application is as follows:

[0036] Place the cassette 400 carrying multiple trays 500 in the loading chamber 100. Each tray 500 can carry wafers. The controller controls the transmission device 600 to move from the transmission chamber 200 to the loading chamber 100, pick up the tray 500, and control the transmission device 600 to carry the tray 500 and move from the loading chamber 100 towards the transmission chamber 200. During the movement, when the tray 500 moves to the image recognition area of the image recognition device 700, the image recognition device 700 can recognize the preset characteristic image on the tray 500, and determine the characteristic information of the tray 500 according to the characteristic image. At the same time, the determined characteristic information is transmitted to the controller. The controller searches for the corresponding transmission parameter from the preset tray information library according to this characteristic information, and then controls the transmission device 600 to transport the tray 500 according to this transmission parameter.

[0037] Based on the above settings, the image recognition device 700 can automatically recognize trays 500 with different specifications, thus effectively solving the problems of time-consuming, laborious, and easy to have errors caused by the manual input method, and ensuring the transmission accuracy and transmission efficiency of trays 500 with different specifications. In addition, the controller can search for the corresponding transmission parameter from the preset tray information library, and make the transmission device 600 transport the tray 500 according to the corresponding transmission parameter, so that there is no need to open the chamber for the station calibration of the transmission device 600, effectively solving the problem of time-consuming and laborious caused by opening the chamber. Therefore, the embodiment of the present application can achieve automatic and intelligent transmission while ensuring the transmission accuracy, reduce manual labor, and improve the transmission efficiency.

[0038] In order to be able to search for the characteristic information of the currently transported tray 500 and the transmission parameter corresponding to this characteristic information in the tray information library, in the embodiment of the present application, the controller compares the obtained characteristic information with the characteristic information pre-stored in the tray information library, so as to judge whether the characteristic information of the currently transported tray 500 and the corresponding transmission parameter are stored in the tray information library.

[0039] In the first case, the feature information of the current transported pallet 500 is stored in the pallet information database. In this case, during transportation, the corresponding transmission parameters can be found from the pallet information database, so that the transmission device 600 can transport the pallet 500 according to the transmission parameters.

[0040] In the second case, the feature information of the current transported pallet 500 does not exist in the pallet information database. In this case, if the transportation of the pallet 500 is to be realized, it is necessary to first establish an information file of the pallet 500 in the pallet information database, including the feature information of the pallet and the corresponding transmission parameters, so as to lay a foundation for subsequent search.

[0041] Considering that the feature information of the pallets 500 transported in two adjacent times can be the same or different. When they are the same, the transmission parameters corresponding to the pallets 500 transported in two adjacent times are the same. Therefore, when transporting the current pallet 500, the transmission parameters of the previous transported pallet 500 can be used, so that the transportation of the current pallet 500 can be realized without switching the transmission parameters; when they are different, the transmission parameters corresponding to the pallets 500 transported in two adjacent times are different. Therefore, when transporting the current pallet 500, it is necessary to first switch to the transmission parameters corresponding to the current transported pallet 500.

[0042] Based on the above situation, in the first case above, it is also necessary to further determine whether the feature information of the current transported pallet 500 is consistent with the feature information of the previous transported pallet 500. When the feature information of the pallets 500 transported twice is consistent, it indicates that the pallets 500 transported twice belong to the same specification of pallets 500. At this time, there is no need to switch the transmission parameters, so the transmission parameters of the previous time can be directly used, that is, the transmission parameters stored in the current controller. Based on this, the transmission efficiency can be greatly improved, and the accuracy of the transmission parameters can also be ensured, thereby ensuring the transmission accuracy. On the contrary, when the feature information of the pallets 500 transported twice is inconsistent, it indicates that the current transported pallet 500 and the previous transported pallet 500 have different specifications, and the transmission parameters need to be switched to the transmission parameters corresponding to the current transported pallet 500. In this way, the transmission parameters corresponding to the feature information of the current transported pallet 500 can be found from the pre-stored pallet information database in the controller. After finding the corresponding transmission parameters, the transmission device 600 can be controlled to transport the pallet 500 according to the transmission parameters. Based on this, the automatic search and switching of the transmission parameters can be realized to ensure the accuracy of the transmission parameters, thereby ensuring the transmission accuracy.

[0043] In the second case above, an information file of the pallet 500 can be established in the pallet information database. As Figure 5 shown, the specific process is as follows:

[0044] First, check the transmission conditions. When the transmission test conditions are met, place the tray 500 on the cassette 400 and perform precise positioning. If there is no problem with the placement of the tray 500, record the characteristic information of the current tray 500, such as its size, etc.; after the recording is completed, calibrate each station of the process chamber 300 according to the calibration method of the transfer device 600 stations; record the station values after the calibration is completed. After the calibration is completed, the transfer device 600 carries the tray 500 through the process chamber 300, and the AWC sensor records the teaching center when the transfer device 600 carries the tray 500 through the process chamber 300 to complete the AWC calibration, thereby forming an information file of the currently transferred tray 500. The debugging process covers various trays 500 of different specifications that need to be used, so as to establish a tray information library for the transfer of multiple trays 500 of different specifications.

[0045] It can be understood that when the characteristic information of the currently transferred tray 500 does not exist in the tray information library, it can be prompted that the tray 500 cannot be transferred, and it is necessary to open the chamber for debugging to establish the characteristic information and transfer parameters of the tray 500. In some embodiments, the station calibration and AWC calibration can be carried out according to the above-mentioned debugging process of the transfer device 600. After the calibration is completed, the corresponding transfer parameters can be stored in the tray information library, including the station parameters and the AWC sensor parameters. Thus, an information file of the currently transferred tray 500 is formed in the tray information library for subsequent calling when transferring trays 500 of this specification.

[0046] Based on the above settings, store the characteristic information of the tray 500 in the tray information library, that is, establish an information file of the tray 500 in the tray information library. In this way, when it is necessary to transfer trays 500 of this specification subsequently, it can be directly called from the tray information library, thus eliminating the need to open the chamber for station calibration and AWC calibration, and improving the transfer efficiency of the tray 500.

[0047] Optionally, the transfer parameters may include the size of the tray 500 and the station parameters corresponding to the tray 500 of this size. Based on this, when transferring a tray 500 of a certain size, the station parameters corresponding to the tray 500 of this size can be called from the tray information library, so that the tray 500 can be transferred to the corresponding station according to these station parameters.

[0048] Among them, the station parameters may include the station telescopic value, the station rotation value, the station high position value, and the station low position value. According to these parameter values, the specific transfer position of the tray 500 can be determined, so as to ensure the transfer accuracy of the tray 500.

[0049] It should be noted here that the above-mentioned station telescopic value, station rotation value, station high position value, and station low position value can all be understood as parameters related to the transfer station of the tray 500. Based on these parameter values, the transfer method of the tray 500 can be determined.

[0050] Optionally, two AWC sensors for automatic wafer centering are provided at the junction of the transfer chamber 200 and the process chamber 300, namely, the first AWC sensor 810 and the second AWC sensor 820. The connection line of the two AWC sensors is perpendicular to the transfer path of the tray 500, and the distances of the two AWC sensors from the foot of the perpendicular are not equal.

[0051] Optionally, the transfer parameters further include: the AWC sensor parameters corresponding to the tray 500 of this size, where the AWC sensor parameters include: the front trigger delay time of the first AWC sensor 810, the rear trigger delay time of the first AWC sensor 810, the front trigger delay time of the second AWC sensor 820, and the rear trigger delay time of the second AWC sensor 820.

[0052] Based on the above settings, during the process of the transfer device 600 transferring the tray 500, it will pass by each AWC sensor twice, a total of four times. The center of the currently transferred tray 500 can be calculated through the positions of the transfer device 600 when passing by the AWC sensors four times, thereby realizing the AWC calibration of the transfer device 600. Based on this, the transfer station in the process chamber 300 can be taught according to the above AWC calibration method of the transfer device 600 to determine the teaching center of the transfer device 600. During the actual movement process, when there is a deviation between the actual center and the teaching center when the transfer device 600 carries the tray 500 through the AWC sensor, when the transfer device 600 moves to the process chamber 300, the transfer device 600 can perform compensation according to the deviation to ensure the consistency of the position of the tray 500 in the process chamber 300.

[0053] In the embodiment of the present application, the transfer parameters of the tray 500 may include the tray number, tray size, corresponding station parameters, and corresponding AWC sensor parameters. For details, see the following table.

[0054]

[0055] Optionally, the image recognition device 700 may be a barcode recognition sensor. Correspondingly, the feature image may be the barcode 510. In this way, when the transfer device 600 carries the tray 500 and moves from the loading chamber 100 to the transfer chamber 200, the barcode recognition sensor can recognize the barcode 510 on the tray 500, so as to determine the feature information of the tray 500. Of course, the image recognition device 700 may also adopt other components, and the corresponding feature image may also adopt other forms. In the embodiments of the present application, the specific forms of the image recognition device 700 and the feature image are not specifically limited.

[0056] In order to be able to call the feature information of trays 500 with different specifications and the corresponding transfer parameters, and apply the transfer parameters to the transfer device 600, so that the transfer device 600 can accurately and quickly transfer the tray 500, in the embodiments of the present application, the feature information of trays 500 with a variety of different specifications and the corresponding transfer parameters are stored in the tray information library.

[0057] For example, a certain specification of tray 500 has corresponding tray 500 dimensions and corresponding transfer parameters. When it is necessary to transfer this type of tray 500, the feature information of the tray 500 and the transfer parameters corresponding to the feature information can be directly called from the tray information library, including the dimensions of the tray 500, the station parameters corresponding to the dimensions, and the AWC sensor parameters corresponding to the dimensions, so as to control the transfer device 600 to transfer the tray 500 according to the above various transfer parameters, without re-entering the transfer parameters, improving the transfer efficiency and ensuring the transfer accuracy.

[0058] The embodiments of the present application also disclose a tray 500, which is applied to the above semiconductor process equipment. Among them, a feature image is provided on the top surface of the tray 500, and the feature image can be recognized by the image recognition device 700, and the feature image includes the feature information of the tray 500.

[0059] Optionally, the feature image may be the barcode 510. Correspondingly, the image recognition device 700 may adopt a barcode recognition sensor. Different specifications of trays 500 have different forms of barcodes 510, specifically as Figure 3 shown.

[0060] In order to realize the positioning of the tray 500, in some embodiments, at least two positioning holes are provided on the tray 500, and the at least two positioning holes are used to cooperate with at least two positioning pins 410 provided on the cassette 400 to limit the position of the tray 500 in the cassette 400, so that the point on the contour of the tray 500 that is farthest from the transfer chamber 200 along the transfer direction of the tray 500 is located at a preset position.

[0061] When placing the tray 500, the positioning holes on the tray 500 are correspondingly mated with the positioning pins 410 on the cartridge 400. In this way, the cartridge 400 can bear the tray 500, and the precise positioning of the tray 500 can be achieved through the cooperation of the positioning pins 410 and the positioning holes, thereby ensuring the position accuracy of the tray 500 on the cartridge 400, and further ensuring the accuracy of the initial position of the tray 500 in the loading chamber 100.

[0062] Optionally, two positioning holes are provided on the tray 500. Correspondingly, two positioning pins 410 are provided on the cartridge 400, and the two positioning holes on the tray 500 are symmetrically arranged on both sides of the transmission direction, that is, the connection line of the two positioning holes is perpendicular to the transmission direction. In this way, various trays 500 with different sizes required by the process can be covered. The positions of the two positioning holes on different-sized trays 500 are different, and the setting method of the positions of the two positioning holes needs to meet the requirement that different-sized trays 500 are placed regularly for the transfer device 600 to pick up. For example, after trays 500 with different sizes are placed on the cartridge 400 based on the positioning holes, the points on the contours of different-sized trays 500 that are farthest from the transfer chamber 200 along the transmission direction of the tray 500 are all located at a preset position, that is, the contours of different-sized trays 500 are tangent at this preset position, and this preset position can be flexibly set according to the structure and size of the cartridge 400.

[0063] Optionally, the thickness of the tray 500 can be 4 mm - 6 mm, and the height of the positioning pin 410 is designed to be 1.5 mm, and the diameter is designed to be 4 mm. Correspondingly, the depth of the positioning hole provided on the tray 500 can be 2 mm, and the diameter is 6 mm to ensure that the positioning pin 410 can penetrate into the positioning hole. Based on the above settings, through the cooperation of at least two positioning holes and at least two positioning pins 410, the uniqueness of the position of the tray 500 placed on the cartridge 400 can be ensured, so as to ensure the position accuracy of different-sized trays 500 in the loading chamber 100.

[0064] Reference Figure 2 Referring to

[0065] Optionally, the cassette 400 may include a top plate, a bottom plate, a first side plate, and a second side plate. The top plate and the bottom plate are arranged in parallel with a certain distance therebetween. The first side plate and the second side plate are both connected between the top plate and the bottom plate, and the first side plate and the second side plate are spaced apart. In order to carry a plurality of trays 500, a plurality of first support blocks 420 are provided on the side of the first side plate facing the second side plate. The plurality of first support blocks 420 are spaced apart in a direction perpendicular to the top plate. Thus, a first slot for accommodating a part of the tray 500 is formed between two adjacent first support blocks 420. Similarly, a second slot for accommodating a part of the tray 500 is formed between two adjacent second support blocks 430. And the plurality of first slots and the plurality of second slots are arranged in one-to-one correspondence. Thus, the correspondingly arranged first slot and second slot form a carrying position for carrying the tray 500.

[0066] In addition, the same cassette 400 can be compatible with a variety of trays 500 of different sizes. When designing the cassette 400, the size of the cassette 400 is designed according to the size of the largest tray 500. Based on this, after the tray 500 is placed in the cassette 400, the edge of the tray 500 is abutted against the edge of one side of the cassette 400. Thus, the different-sized trays 500 can be accurately positioned by the cassette 400 to ensure the position accuracy of the tray 500 in the loading chamber 100.

[0067] To achieve the positioning of the tray 500, positioning structures can be respectively provided on the cassette 400 and the tray 500. In some embodiments, at least one positioning pin 410 is provided on the correspondingly arranged first support block 420, at least one positioning pin 410 is provided on the second support block 430, and at least two positioning holes are provided on the tray 500. Thus, when the tray 500 is carried on the cassette 400, the positioning holes and the positioning pins 410 are in one-to-one correspondence and cooperation. At this time, the position of the point on the contour of the tray 500 that is farthest from the transfer chamber 200 along the transfer direction can be determined. Thus, the tray 500 in the cassette 400 can be accurately positioned.

[0068] In the semiconductor process equipment provided by the embodiments of the present application, the transfer mode of the tray is as Figure 4 shown, specifically including:

[0069] The tray 500 carried on the cassette 400 is positioned by the mutually cooperating positioning pins 410 and positioning holes; the transfer device 600 carries the tray 500 and moves from the loading chamber 100 to the transfer chamber 200; during the movement, the image recognition device 700 recognizes the image features on the tray 500 and determines the feature information of the tray 500 according to the image features; after obtaining the feature information of the tray 500, the controller compares the feature information with the feature information stored in the tray information database to determine whether the feature information of the currently transferred tray 500 is stored in the tray information database; in the case where the feature information of the currently transferred tray 500 is stored in the tray information database, it is determined whether the feature information of the currently transferred tray 500 is consistent with the feature information of the previously transferred tray 500; when the feature information of the currently transferred tray 500 is consistent with the feature information of the previously transferred tray 500, the currently transferred tray 500 is directly transferred using the current transfer parameters; when the feature information of the currently transferred tray 500 is inconsistent with the feature information of the previously transferred tray 500, the transfer parameters corresponding to the feature information of the currently transferred tray 500 are searched for in the tray information database, and the transfer device 600 is controlled to transfer the tray 500 according to the transfer parameters; in the case where the feature information of the currently transferred tray 500 does not exist in the tray information database, an information file of the current tray 500 is established in the tray information database to facilitate the calling of the feature information and transfer parameters of the tray 500 of this specification.

[0070] In summary, in the embodiments of the present application, precise positioning of trays 500 of different specifications is achieved, and automatic identification of the trays 500 is realized. When switching trays 500 of different specifications, the feature information and corresponding transfer parameters of the transfer device 600 are automatically called, and the tray 500 is transferred according to the corresponding transfer parameters to ensure the precise and efficient transfer of trays 500 of different specifications.

[0071] The embodiments of the present application have been described above with reference to the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them fall within the protection scope of the present application.

Claims

1. A semiconductor process equipment, comprising a process chamber, a transfer chamber and a loading chamber. The process chamber is used to perform semiconductor processes. The loading chamber is used to accommodate a cassette, and the cassette is used to carry a tray. A transfer device is provided in the transfer chamber, and the transfer device is used to transfer the tray between the process chamber and the loading chamber. It is characterized in that an image recognition device is provided at the junction of the loading chamber and the transfer chamber. The image recognition device is used to recognize a preset feature image on trays of different specifications during the process of the transfer device carrying the tray moving from the loading chamber to the transfer chamber, and determine the feature information of the tray; the semiconductor process equipment further includes a controller, and the controller is used to obtain the feature information, search for transfer parameters corresponding to the feature information from a preset tray information library, and control the transfer device to transfer the tray according to the transfer parameters; the controller is further used to obtain the feature information, compare it with the pre-stored characteristic information in the tray information library, and judge whether the feature information exists in the tray information library; in the case where the feature information exists in the tray information library, judge whether the feature information is consistent with the feature information of the tray transferred last time; when the feature information is consistent with the feature information of the tray transferred last time, directly transfer the tray using the current transfer parameters; when the feature information is inconsistent with the feature information of the tray transferred last time, search for the transfer parameters corresponding to the feature information from the tray information library again, and control the transfer device to transfer the tray according to the transfer parameters.

2. The semiconductor processing equipment according to claim 1, wherein The transfer parameters include: the size of the tray and the station parameters corresponding to the tray of this size. The station parameters include a station telescopic value, a station rotation value, a station high position value and a station low position value.

3. The semiconductor processing equipment according to claim 2, wherein Two AWC sensors for automatic wafer centering are provided at the junction of the transfer chamber and the process chamber. The connection line of the two AWC sensors is perpendicular to the transfer path of the tray, and the distances of the two AWC sensors from the foot of the perpendicular are not equal.

4. The semiconductor processing equipment according to claim 3, wherein, The transfer parameters further include: the AWC sensor parameters corresponding to the tray of this size. The AWC sensor parameters include a front trigger delay time of the first AWC sensor, a rear trigger delay time of the first AWC sensor, a front trigger delay time of the second AWC sensor and a rear trigger delay time of the second AWC sensor.

5. The semiconductor process equipment according to claim 1, characterized in that, The image recognition device is a bar code recognition sensor, and the feature image is a bar code.

6. A tray, which is used in the semiconductor processing equipment according to any one of claims 1-5, is characterized in that, A feature image is provided on the top surface of the tray, and the feature image can be recognized by the image recognition device. The feature image includes the feature information of the tray.

7. The tray according to claim 6, wherein The feature image is a bar code.

8. The tray according to claim 6, characterized in that, At least two positioning holes are further provided on the tray. The at least two positioning holes are used to cooperate with at least two positioning pins provided on the cassette to limit the position of the tray in the cassette, so that the point on the contour of the tray farthest from the transfer chamber along the tray transfer direction is located at a preset position.

9. A cassette for carrying the tray according to any one of claims 6-8, characterized in that, The cartridge includes a plurality of carrying positions, each of the carrying positions includes a first support block and a second support block which are oppositely arranged, and at least one positioning pin is respectively arranged on the first support block and the second support block for cooperating with at least two positioning holes on the tray to limit the position of the tray in the cartridge, so that the point on the tray contour farthest from the transmission chamber along the tray transmission direction is located at a preset position.

Images