Silicon wafer transfer device and silicon wafer transfer method

Abstract

The present invention provides a silicon wafer transfer device and a silicon wafer transfer method. The silicon wafer transfer device includes: a water tank assembly for accommodating silicon wafers to be transferred; a transmission assembly; a sensor for detecting whether the water tank assembly is located in any of a first area, a second area, a third area, and a fourth area; a loading assembly, disposed corresponding to the first area and configured to move silicon wafers into the water tank assembly when the sensor detects that the water tank assembly is located in the first area; a manipulator, disposed corresponding to the second area and configured to remove silicon wafers from the water tank assembly when the sensor detects that the water tank assembly is located in the second area; a drainage assembly, disposed corresponding to the third area and configured to control the drainage of the water tank assembly when the sensor detects that the water tank assembly is located in the third area; and a cleaning assembly, disposed corresponding to the fourth area and configured to clean the water tank assembly when the sensor detects that the water tank assembly is located in the fourth area. The present invention improves the convenience of silicon wafer transfer.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing, and in particular to a silicon wafer transfer device and a silicon wafer transfer method. Background Art

[0002] The processing of semiconductors such as silicon wafers typically involves multiple independent steps, and therefore, are performed using independent equipment. Consequently, after one step is completed, the finished wafers must be manually moved to the next step. To prevent interference between equipment, different devices may be located in separate workshops, relatively far apart. Consequently, existing methods of transporting wafers require considerable physical effort, and the transfer process can contaminate the wafers. Consequently, existing methods of transferring wafers are relatively inconvenient. Summary of the Invention

[0003] The embodiments of the present invention provide a silicon wafer transfer device and a silicon wafer transfer method to solve the problem that the existing silicon wafer transfer method is relatively inconvenient.

[0004] In a first aspect, an embodiment of the present invention provides a silicon wafer transfer device, comprising:

[0005] A water tank assembly for accommodating silicon wafers to be transferred;

[0006] A transmission component, the transmission component extends from the first area to the fourth area through the second area and the third area in sequence, and the transmission component is used to transmit the water tank assembly to move along the first area, the second area, the third area and the fourth area;

[0007] a plurality of sensors arranged along an extension direction of the transmission assembly, the sensors being used to detect whether the water tank assembly is located in any one of the first area, the second area, the third area, and the fourth area;

[0008] a loading assembly, disposed corresponding to the first area, and configured to move a silicon wafer into the water tank assembly when the sensor detects that the water tank assembly is located in the first area;

[0009] a manipulator, disposed corresponding to the second area, and configured to remove the silicon wafer in the water tank assembly when the sensor detects that the water tank assembly is located in the second area;

[0010] a drainage assembly, arranged corresponding to the third area, and configured to control the sink assembly to drain water when the sensor detects that the sink assembly is located in the third area;

[0011] The cleaning component is provided corresponding to the fourth area and is configured to clean the water tank component when the sensor detects that the water tank component is located in the fourth area.

[0012] In some embodiments, the first area and the fourth area of ​​the transmission component are adjacent to each other, and the transmission component is further used to transmit the water tank assembly located in the fourth area to the first area.

[0013] In some embodiments, the sink assembly comprises:

[0014] a water tank base, matched with the transmission assembly to move under the transmission of the transmission assembly;

[0015] A water tank body is arranged on the water tank base, and is provided with a drain outlet and an air inlet;

[0016] A silicon wafer clip is movably accommodated in the water tank body, and the silicon wafer clip is used to fix the silicon wafer located in the water tank body.

[0017] In some embodiments, the robot is configured to move the silicon wafer clamp and the silicon wafer fixed on the silicon wafer clamp from the water tank body to the separation area when the sensor detects that the water tank assembly is located in the second area, and after separating the silicon wafer clamp and the silicon wafer in the separation area, move the silicon wafer clamp into the water tank body.

[0018] In some embodiments, the transmission assembly includes a first track extending from the first area to the second area, and a second track extending from the second area to the third area, and the first track and the second track overlap in the second area;

[0019] The sink base includes a first engaging component matching the first track and a second engaging component matching the second track, and the arrangement angle between the first engaging component and the second engaging component is equal to the overlapping angle between the first track and the second track in the second area.

[0020] In some embodiments, a locking device is further included, wherein the locking device comprises:

[0021] a first locking assembly disposed corresponding to the first area, configured to lock the water tank assembly when the sensor detects that the water tank assembly is located in the first area, and to unlock the water tank assembly after the loading assembly moves a silicon wafer into the water tank assembly;

[0022] a second locking assembly disposed corresponding to the second area, configured to lock the water tank assembly when the sensor detects that the water tank assembly is located in the second area, and to unlock the water tank assembly after the manipulator removes the silicon wafer from the water tank assembly;

[0023] a third locking assembly provided corresponding to the third area, configured to lock the sink assembly when the sensor detects that the sink assembly is located in the third area, and to unlock the sink assembly after the drain assembly controls the sink assembly to drain water;

[0024] The fourth locking component provided corresponding to the fourth area is configured to lock the water tank assembly when the sensor detects that the water tank assembly is located in the fourth area, and to unlock the water tank assembly after the cleaning component cleans the water tank assembly.

[0025] In some embodiments, the fourth area includes a first sub-area and a second sub-area, the cleaning component is located in the first sub-area, and the silicon wafer transfer device also includes a water injection component, which is located in the second sub-area. The water injection component is configured to inject water into the water tank component after the cleaning component cleans the water tank component.

[0026] In a second aspect, an embodiment of the present invention provides a silicon wafer transfer method, which is applied to the silicon wafer transfer device described in any one of the first aspects, wherein the method is used to transfer silicon wafers between a first process and a second process, wherein the first area is provided to correspond to the unloading area of ​​the first process, and the second area is provided to correspond to the loading area of ​​the second process;

[0027] The method comprises the following steps:

[0028] Move the target silicon wafer that has completed the first process into the target water tank assembly located in the first area through the loading assembly;

[0029] The target water tank assembly is moved to the second area by the transport assembly, and the target silicon wafer is moved from the target water tank assembly to the loading area of ​​the second process by a robot;

[0030] Move the target water tank assembly to the third area through the transmission assembly, and control the target water tank assembly to drain water through the drainage assembly;

[0031] The target water tank assembly is moved to the fourth area by the transmission assembly, and the target water tank assembly is cleaned by the cleaning assembly.

[0032] In some embodiments, after cleaning the target sink assembly by the cleaning assembly, the method further includes:

[0033] The target water tank assembly is moved from the fourth area to the first area by the transmission assembly.

[0034] In some embodiments, before moving the target water tank assembly from the fourth area to the first area by the transmission assembly, the method further includes:

[0035] Water is injected into the target water tank assembly through the water injection assembly.

[0036] The embodiment of the present invention utilizes a water tank assembly to accommodate silicon wafers to be transferred, and then realizes the transfer of the water tank assembly between different processes by setting up a transmission assembly. After the transfer of the silicon wafers is completed, the used water tank is cleaned. In this way, no manual handling is required. At the same time, the possibility of silicon wafer contamination is reduced, and the convenience of silicon wafer transfer is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0038] Figure 1 This is a schematic structural diagram of a silicon wafer transfer device according to an embodiment of the present invention;

[0039] Figure 2 This is another structural schematic diagram of a silicon wafer transfer device according to an embodiment of the present invention;

[0040] Figure 3 It is a structural schematic diagram of a water injection assembly in one embodiment of the present invention. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. The following embodiments and features in the embodiments can be combined with each other if there is no conflict. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0042] An embodiment of the present invention provides a silicon wafer transfer device.

[0043] like Figure 1 and Figure 2As shown, in one embodiment, the silicon wafer transfer device includes: a water tank assembly 100, a transmission assembly 200, a plurality of sensors 300, a loading assembly, a robot 400, a drainage assembly 500 and a cleaning assembly 600.

[0044] In some embodiments, the water tank assembly 100 is used to accommodate silicon wafers to be transferred, so as to summarize the silicon wafer transfer process. A protective liquid is injected into the water tank assembly 100. The protective liquid can be deionized water or other protective liquid selected as needed. It can play a buffering and shock-absorbing role, and can also reduce the contact between the silicon wafer and the external environment, which helps to improve the reliability of the silicon wafer and reduce the possibility of damage or contamination of the silicon wafer.

[0045] like Figure 1 and Figure 2 As shown, in some embodiments, the sink assembly 100 includes a sink base 101 , a sink body 102 and a silicon wafer clip 103 .

[0046] The water tank base 101 is matched with the transmission component 200 , so that the transmission component 200 can drive the water tank base 101 to move, thereby driving the water tank component 100 to move.

[0047] The water tank body 102 is disposed on the water tank base 101 . The water tank body 102 is used to accommodate silicon wafers to be transferred. The water tank body 102 is provided with a drain port 1021 and an air inlet 1022 to achieve drainage and air intake functions.

[0048] The silicon wafer clamp 103 is movably accommodated in the water tank body 102. The silicon wafer clamp 103 is used to fix the silicon wafer located in the water tank body 102 to prevent the silicon wafer clamp 103 from shaking in the water tank body 102. It can also prevent the silicon wafer from directly contacting the inner wall of the water tank body 102, which helps to protect the silicon wafer.

[0049] like Figure 2 As shown, the transmission component 200 can be a device such as a conveyor belt or a conveyor gear for realizing the transmission function. In some embodiments, the transmission component 200 extends from the first area through the second area and the third area to the fourth area in sequence. The transmission component 200 is used to transmit the water tank component 100 to move in the directions of the first area, the second area, the third area and the fourth area.

[0050] A plurality of sensors 300 are provided along the extension direction of the transmission assembly 200 . The sensors 300 are used to detect the position of the water tank assembly 100 , specifically to detect whether the water tank assembly 100 is located in any one of the first area, the second area, the third area and the fourth area.

[0051] The loading assembly is disposed corresponding to the first area and is configured to move the silicon wafer into the water tank assembly 100 when the sensor 300 detects that the water tank assembly 100 is located in the first area.

[0052] It needs to be understood that loading and unloading are relative. After the silicon wafer completes unloading in one process step, it needs to enter the loading stage of the next process step. Therefore, the loading component in this embodiment corresponds to the loading of the transfer process, which actually corresponds to the unloading of the previous process step. It can be understood that after the silicon wafer completes unloading in the previous process, it enters the loading stage of the transfer process.

[0053] During the loading stage of the transfer process, the loading assembly moves the silicon wafers into the water tank assembly 100 to complete the loading.

[0054] The robot arm 400 is disposed corresponding to the second area and is configured to remove the silicon wafer in the water tank assembly 100 when the sensor 300 detects that the water tank assembly 100 is located in the second area.

[0055] The robot arm 400 is used to perform unloading of silicon wafers in transit, and further, can correspond to loading of the next process. In other words, the silicon wafers can be moved to a specified position by the robot arm 400, completing the unloading of the transit process and the loading of the next process in one step.

[0056] It can be understood that the first area actually corresponds to the unloading area of ​​the previous process, and the second area corresponds to the loading area of ​​the next process. According to the positions of the first area and the second area, the extension direction of the transmission component 200 can be configured, and the positions of the third area and the fourth area can be adjusted accordingly.

[0057] In some embodiments, when the sink assembly 100 includes a silicon wafer clamp, the manipulator 400 can be further configured to move the silicon wafer clamp 103 and the silicon wafer fixed on the silicon wafer clamp 103 from the sink body 102 to the separation area when the sensor 300 detects that the sink assembly 100 is located in the second area, and after separating the silicon wafer clamp 103 and the silicon wafer in the separation area, move the silicon wafer clamp 103 into the sink body 102.

[0058] The drain assembly 500 is provided for the third area and is configured to control the sink assembly 100 to drain water when the sensor 300 detects that the sink assembly 100 is in the third area. The cleaning assembly 600 is provided for the fourth area and is configured to clean the sink assembly 100 when the sensor 300 detects that the sink assembly 100 is in the fourth area.

[0059] It can be understood that the drainage component 500 is used to drain the water in the sink component 100 through the drain port 1021 after the silicon wafers are unloaded in the transfer process. Next, the sink component 100 is cleaned using the cleaning component 600, thereby avoiding possible cross contamination and improving the cleanliness of the silicon wafers.

[0060] The cleaning component specifically includes a flushing module 601 and a blowing module 602. During cleaning, deionized water can be first flushed into the sink component 100 through the flushing module 601 to clean it, and then high-pressure air can be blown into the blowing module 602 through the air inlet 1022 using a cylinder or a hair dryer to remove residual moisture and reduce the possibility of residual contamination.

[0061] The embodiment of the present invention utilizes the water tank assembly 100 to accommodate the silicon wafers to be transferred, and then realizes the transfer of the water tank assembly 100 between different processes by setting up the transmission assembly 200. After the transfer of the silicon wafers is completed, the used water tank is cleaned. In this way, no manual handling is required. At the same time, the possibility of silicon wafer contamination is reduced, and the convenience of silicon wafer transfer is improved.

[0062] An embodiment of the present invention provides a silicon wafer transfer method, which is applied to the silicon wafer transfer device in the embodiment of the present invention. The method is used to transfer silicon wafers between a first process and a second process, wherein the first area corresponds to the unloading area of ​​the first process, and the second area corresponds to the loading area of ​​the second process. For details, please refer to the above description and will not be repeated here.

[0063] In some embodiments, the method comprises the following steps:

[0064] The target silicon wafer that has completed the first process is moved into the target water tank assembly 100 located in the first area by the loading assembly;

[0065] The target water tank assembly 100 is moved to the second area by the transport assembly 200, and the target silicon wafer is moved from the target water tank assembly 100 to the loading area of ​​the second process by the robot 400;

[0066] The target water tank assembly 100 is moved to the third area by the transmission assembly 200, and the target water tank assembly 100 is controlled to drain water by the drainage assembly 500;

[0067] The target water tank assembly 100 is moved to the fourth area by the transmission assembly 200 , and the target water tank assembly 100 is cleaned by the cleaning assembly 600 .

[0068] In some embodiments, the first area and the fourth area of ​​the transmission assembly 200 are adjacent to each other, and the transmission assembly 200 is further used to transmit the water tank assembly 100 located in the fourth area to the first area.

[0069] In some embodiments, after cleaning the target water tank assembly 100 by the cleaning assembly 600, the method further includes:

[0070] The target water tank assembly 100 is moved from the fourth area to the first area by the transmission assembly 200 .

[0071] In this embodiment, the transmission component 200 can be set to form a loop, so that the water tank component 100 after cleaning can return to the first area through the transmission component 200 to perform the next silicon wafer transfer and transportation. In this way, the recycling of the water tank component 100 is realized, convenience is improved, and it also helps to reduce costs.

[0072] In some other embodiments, a prompt signal may be sent to remind the staff, and the staff may manually move the sink assembly 100 to the first area, thereby enabling the reuse of the sink assembly 100.

[0073] In some embodiments, a locking device 800 is further included, and the locking device 800 includes:

[0074] The first locking component set corresponding to the first area is configured to lock the water tank assembly 100 when the sensor 300 detects that the water tank assembly 100 is located in the first area, and unlock the water tank assembly 100 after the loading component moves the silicon wafer into the water tank assembly 100.

[0075] The second locking assembly corresponding to the second area is configured to lock the water tank assembly 100 when the sensor 300 detects that the water tank assembly 100 is located in the second area, and to unlock the water tank assembly 100 after the robot 400 moves out the silicon wafer in the water tank assembly 100.

[0076] The third locking assembly corresponding to the third area is configured to lock the sink assembly 100 when the sensor 300 detects that the sink assembly 100 is located in the third area, and unlock the sink assembly 100 after the drain assembly 500 controls the sink assembly 100 to drain.

[0077] The fourth locking assembly corresponding to the fourth area is configured to lock the sink assembly 100 when the sensor 300 detects that the sink assembly 100 is located in the fourth area, and unlock the sink assembly 100 after the cleaning assembly 600 cleans the sink assembly 100.

[0078] Each locking device 800 in this embodiment can lock the position of the sink assembly 100 by locking the transmission assembly 200, or can only lock the position of the sink assembly 100. For example, the transmission assembly 200 includes a plurality of rollers, and the locking assembly includes a pin. During implementation, when the rollers continue to rotate, the pins can be used to prevent the sink assembly 100 from continuing to move, thereby locking the position of the sink assembly 100.

[0079] During implementation, when the sensor 300 detects that the water tank assembly 100 is located at different positions, the water tank assembly 100 is locked, and further corresponding operations are performed through corresponding components, thereby helping to improve stability and reliability.

[0080] In some embodiments, the fourth area includes a first sub-area and a second sub-area, the cleaning component 600 is located in the first sub-area, and the silicon wafer transfer device also includes a water injection component 700, which is located in the second sub-area. The water injection component 700 is configured to inject water into the water tank component 100 after the cleaning component 600 cleans the water tank component 100.

[0081] like Figure 3 As shown, in some embodiments, the water injection component 700 includes a control valve and a flow meter 703, and the valve may further include a manual valve 701 and an automatic valve 702. During implementation, an appropriate amount of liquid can be injected through the automatic valve 702 in conjunction with the flow meter 703 under the control of the control module 704 as needed, or the operator can control the liquid intake through the manual valve 701.

[0082] In some embodiments, before moving the target water tank assembly 100 from the fourth area to the first area by the transmission assembly 200, the method further includes:

[0083] Water is poured into the target water tank assembly 100 through the water filling assembly 700 .

[0084] Furthermore, in order to improve reliability, a liquid leakage detection device can also be set. Specifically, a liquid leakage detection belt can be set corresponding to the water injection component 700 or along the edge of the water tank component 100 to avoid excessive injection of liquid or liquid leakage. The liquid leakage detection structure itself can refer to relevant technologies and will not be repeated here.

[0085] The water tank assembly 100 after being filled with water is used as a container for transferring silicon wafers for recycling. It can be understood that the weight of the water tank assembly 100 after being filled with water is relatively large. Therefore, the second sub-area can be set to a position closer to the first area to improve the convenience of transferring the water tank assembly 100.

[0086] In some embodiments, the transmission component 200 includes a first track 201 extending from the first area to the second area, and a second track 202 extending from the second area to the third area, and the first track 201 and the second track 202 overlap in the second area; the sink base 101 includes a first engaging component matching the first track 201 and a second engaging component matching the second track 202, and the arrangement angle between the first engaging component and the second engaging component is equal to the overlapping angle of the first track 201 and the second track 202 in the second area.

[0087] In this embodiment, it can be understood that the water tank assembly 100 is transported in different directions through the first track 201 and the second track 202. In this way, since the angle between the first track 201 and the second track 202 is equal to the arrangement angle between the first meshing assembly and the second meshing assembly, the direction of the water tank assembly 100 during the transmission process is fixed, which is more convenient for subsequent adjustment of the position of the water tank assembly 100.

[0088] Similarly, the transport assembly 200 may further include a third track and a fourth track, with the first track 201, the second track 202, the third track, and the fourth track connected end to end, thereby achieving a cyclic transport of the water tank assembly 100. At the same time, the intersection of each track can be set with reference to the intersection of the first track 201 and the second track 202 described above, which can maintain the direction and posture of the water tank assembly 100 when it moves cyclically and returns to the first area, without having to adjust its posture, thereby improving convenience of use.

[0089] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A silicon wafer transfer device, characterized in that: include: A water tank assembly for accommodating silicon wafers to be transferred; A transmission component, the transmission component extends from the first area to the fourth area through the second area and the third area in sequence, and the transmission component is used to transmit the water tank assembly to move along the first area, the second area, the third area and the fourth area; a plurality of sensors arranged along an extension direction of the transmission assembly, the sensors being used to detect whether the water tank assembly is located in any one of the first area, the second area, the third area, and the fourth area; a loading assembly, disposed corresponding to the first area, and configured to move a silicon wafer into the water tank assembly when the sensor detects that the water tank assembly is located in the first area; a manipulator, disposed corresponding to the second area, and configured to remove the silicon wafer in the water tank assembly when the sensor detects that the water tank assembly is located in the second area; a drainage assembly, arranged corresponding to the third area, and configured to control the sink assembly to drain water when the sensor detects that the sink assembly is located in the third area; a cleaning component, disposed corresponding to the fourth area and configured to clean the water tank component when the sensor detects that the water tank component is located in the fourth area; The water tank assembly includes: a water tank base, matched with the transmission assembly to move under the transmission of the transmission assembly; A water tank body is arranged on the water tank base, and is provided with a drain outlet and an air inlet; A silicon wafer clip is movably accommodated in the water tank body, and the silicon wafer clip is used to fix the silicon wafer located in the water tank body.

2. The silicon wafer transfer device according to claim 1, characterized in that: The first area of ​​the transmission component is adjacent to the fourth area, and the transmission component is further used to transmit the water tank component located in the fourth area to the first area.

3. The silicon wafer transfer device according to claim 1, characterized in that: The robot is configured to move the silicon wafer clamp and the silicon wafer fixed on the silicon wafer clamp from the water tank body to the separation area when the sensor detects that the water tank assembly is located in the second area, and after separating the silicon wafer clamp and the silicon wafer in the separation area, move the silicon wafer clamp into the water tank body.

4. The silicon wafer transfer device according to claim 1, characterized in that: The transmission assembly includes a first track extending from the first area to the second area, and a second track extending from the second area to the third area, the first track and the second track overlapping in the second area; The sink base includes a first engaging component matching the first track and a second engaging component matching the second track, and the arrangement angle between the first engaging component and the second engaging component is equal to the overlapping angle between the first track and the second track in the second area.

5. The silicon wafer transfer device according to any one of claims 1 to 4, characterized in that: Also included is a locking device, the locking device comprising: a first locking assembly disposed corresponding to the first area, configured to lock the water tank assembly when the sensor detects that the water tank assembly is located in the first area, and to unlock the water tank assembly after the loading assembly moves a silicon wafer into the water tank assembly; a second locking assembly disposed corresponding to the second area, configured to lock the water tank assembly when the sensor detects that the water tank assembly is located in the second area, and to unlock the water tank assembly after the manipulator removes the silicon wafer from the water tank assembly; a third locking assembly provided corresponding to the third area, configured to lock the sink assembly when the sensor detects that the sink assembly is located in the third area, and to unlock the sink assembly after the drain assembly controls the sink assembly to drain water; The fourth locking component provided corresponding to the fourth area is configured to lock the water tank assembly when the sensor detects that the water tank assembly is located in the fourth area, and to unlock the water tank assembly after the cleaning component cleans the water tank assembly.

6. The silicon wafer transfer device according to claim 5, characterized in that: The fourth area includes a first sub-area and a second sub-area, the cleaning component is located in the first sub-area, and the silicon wafer transfer device also includes a water injection component, which is located in the second sub-area. The water injection component is configured to inject water into the water tank component after the cleaning component cleans the water tank component.

7. A silicon wafer transfer method, characterized in that: The silicon wafer transfer device according to any one of claims 1 to 6 is used to transfer silicon wafers between a first process and a second process, wherein the first area is provided corresponding to the unloading area of ​​the first process, and the second area is provided corresponding to the loading area of ​​the second process; The method comprises the following steps: Move the target silicon wafer that has completed the first process into the target water tank assembly located in the first area through the loading assembly; The target water tank assembly is moved to the second area by the transport assembly, and the target silicon wafer is moved from the target water tank assembly to the loading area of ​​the second process by a robot; Move the target water tank assembly to the third area through the transmission assembly, and control the target water tank assembly to drain water through the drainage assembly; The target water tank assembly is moved to the fourth area by the transmission assembly, and the target water tank assembly is cleaned by the cleaning assembly.

8. The method according to claim 7, characterized in that After the target water tank assembly is cleaned by the cleaning assembly, the method further comprises: The target water tank assembly is moved from the fourth area to the first area by the transmission assembly.

9. The method according to claim 8, characterized in that Before moving the target water tank assembly from the fourth area to the first area by the transmission assembly, the method further includes: Water is injected into the target water tank assembly through the water injection assembly.

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