Array substrate and preparation method thereof, and light-emitting device

Abstract

The present application provides an array substrate, a method for manufacturing the same, and a light-emitting device, relating to the field of display technology. The array substrate comprises: a substrate; a first conductive layer located on the substrate, the first conductive layer comprising a plurality of first hollow regions; a second conductive layer located on a side of the first conductive layer away from the substrate and insulated from the first conductive layer; the second conductive layer comprising a plurality of conductive pad groups, each including at least one conductive pad; the orthographic projection of the conductive pad on the first conductive layer being located within the first hollow region; and a plurality of protective electrodes, the protective electrodes being located in the first hollow region, the orthographic projection of the conductive pad on the substrate being located within the orthographic projection of the protective electrodes on the substrate; wherein, for protective electrodes and conductive pads whose orthographic projections overlap, the voltage of the protective electrodes is greater than or equal to the voltage of the conductive pads. This array substrate solves the problem of array substrate failure caused by electrochemical corrosion of the conductive pads in related technologies, thereby improving the reliability of the array substrate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an array substrate and a preparation method thereof, and a light-emitting device. Background Art

[0002] With the rapid development of display technology, Mini LED (sub-millimeter light-emitting diode) and Micro LED (micro light-emitting diode) display products have attracted widespread attention. However, in high temperature and high humidity environments, electrochemical reactions are prone to occur between the electrodes and solder pads of Mini LED or Micro LEDs, resulting in corrosion problems and reducing the reliability of Mini LED or Micro LED display products.

[0003] Currently, there is an urgent need to provide a new array substrate to solve the above problems. Summary of the Invention

[0004] The embodiments of this application adopt the following technical solutions:

[0005] In one aspect, an embodiment of the present application provides an array substrate, comprising:

[0006] substrate;

[0007] a first conductive layer located on the substrate, wherein the first conductive layer includes a plurality of hollow regions;

[0008] a second conductive layer, located on a side of the first conductive layer away from the substrate and insulated from the first conductive layer; the second conductive layer includes a plurality of conductive pad groups, each of which includes at least one conductive pad; an orthographic projection of the conductive pad on the first conductive layer is located within the hollow area;

[0009] a plurality of protective electrodes, wherein the protective electrodes are located in the hollow area, and the orthographic projection of the conductive pad on the substrate is located within the orthographic projection of the protective electrodes on the substrate;

[0010] Wherein, for the protective electrode and the conductive pad having an overlapping area in their orthographic projections, the voltage of the protective electrode is greater than or equal to the voltage of the conductive pad.

[0011] In some embodiments of the present application, the array substrate further includes a plurality of components, one of the components being electrically connected to the same group of the conductive pads; wherein, at least some of the components have their orthographic projections on the substrate located within the orthographic projection of the protective electrode on the substrate.

[0012] In some embodiments of the present application, the voltages of the protection electrodes are the same.

[0013] In some embodiments of the present application, the first conductive layer includes a plurality of driving lines extending along a first direction, the protection electrode is electrically connected to the driving lines, and a voltage of the protection electrode is equal to a driving voltage of the driving lines.

[0014] In some embodiments of the present application, the first conductive layer includes a plurality of trace groups arranged in an array, the trace groups including the driving lines, ground lines, and power lines extending along the first direction and sequentially arranged along the second direction; the first direction and the second direction intersect;

[0015] Part of the protection electrode is located between the ground line and the driving line, and the remaining part of the protection electrode is located between the ground line and the power line;

[0016] The protection electrode located between the ground line and the driving line is directly electrically connected to the driving line, and the protection electrode located between the ground line and the power line is electrically connected to the driving line in the adjacent wiring group via a bridge structure.

[0017] In some embodiments of the present application, the first conductive layer includes the first hollow area, the second hollow area, the third hollow area and the fourth hollow area;

[0018] The second hollow area is configured to separate the driving line and the ground line; the third hollow area is configured to separate the power line and the ground line, and the orthographic projection of the drive control device on the first conductive layer is located within the third hollow area; the fourth hollow area is configured to separate the power line and the driving line in the adjacent routing group;

[0019] Part of the first hollow area is connected to the second hollow area, and the remaining part of the first hollow area is connected to the third hollow area.

[0020] In some embodiments of the present application, the voltages of at least some of the protection electrodes are the same.

[0021] In some embodiments of the present application, the first conductive layer further includes a plurality of first protection traces and a plurality of second protection traces extending along a first direction and arranged along a second direction; the first direction and the second direction intersect;

[0022] Part of the protection electrodes are electrically connected to the first protection routing, and the remaining part of the protection electrodes are electrically connected to the second protection routing; the voltages of the protection electrodes electrically connected to the first protection routing are the same, and the voltages of the protection electrodes electrically connected to the second protection routing are the same.

[0023] In some embodiments of the present application, the first conductive layer includes a plurality of routing groups arranged in an array, the routing groups including a driving line, the first protection routing line, a ground line, the second protection routing line, and a power line extending along the first direction and sequentially arranged along the second direction;

[0024] Wherein, a voltage of at least one of the first protection wiring and the second protection wiring is greater than or equal to a driving voltage of the driving line.

[0025] In some embodiments of the present application, the first conductive layer includes the first hollow area, the second hollow area and the third hollow area;

[0026] The second hollow area is configured to separate the driving line and the ground line; the third hollow area is configured to separate the power line and the ground line, and the orthographic projection of the driving control device on the first conductive layer is located in the third hollow area;

[0027] Part of the first hollow areas are connected together and connected to the second hollow area; the remaining part of the first hollow areas are connected to the third hollow areas respectively.

[0028] In some embodiments of the present application, the distance between the first protection trace and the driving line along a direction opposite to the second direction, the distance between the first protection trace and the ground line along the second direction, the distance between the second protection trace and the ground line along a direction opposite to the second direction, and the distance between the second protection trace and the power line along the second direction are all greater than or equal to 80 μm.

[0029] In some embodiments of the present application, the protective electrode and the first conductive layer are provided in the same layer.

[0030] In some embodiments of the present application, the component includes a light-emitting device and a drive control device, and the drive control device is configured to control at least one of the light-emitting devices to be turned on or off simultaneously;

[0031] The orthographic projection of the light emitting device on the substrate is located within the orthographic projection of the protective electrode on the substrate, and the orthographic projection of the driving control device on the substrate does not overlap with the orthographic projection of the protective electrode on the substrate.

[0032] In some embodiments of the present application, the light emitting device includes a first electrode and a second electrode, the conductive pad group includes a first conductive pad and a second conductive pad, the first electrode and the first conductive pad are electrically connected, and the second electrode and the second conductive pad are electrically connected.

[0033] On the other hand, an embodiment of the present application provides a light-emitting device including the array substrate as described above.

[0034] On the other hand, an embodiment of the present application provides a method for preparing an array substrate, which is applied to prepare the array substrate described above, and the method includes:

[0035] providing a substrate;

[0036] forming a first conductive layer and a plurality of protective electrodes; wherein the first conductive layer includes a plurality of first hollow regions, and the protective electrodes are located in the first hollow regions;

[0037] A second conductive layer is formed; the second conductive layer is located on a side of the first conductive layer away from the substrate and is insulated from the first conductive layer; the second conductive layer includes a plurality of conductive pad groups, and the conductive pad groups include at least one conductive pad; the orthographic projection of the conductive pad on the first conductive layer is located within the first hollow area; wherein, for the protective electrode and the conductive pad whose orthographic projections have an overlapping area, the voltage of the protective electrode is greater than or equal to the voltage of the conductive pad.

[0038] Embodiments of the present application provide an array substrate, a preparation method thereof, and a light-emitting device, wherein the array substrate includes: a substrate; a first conductive layer located on the substrate, the first conductive layer including a plurality of first hollow areas; a second conductive layer located on a side of the first conductive layer away from the substrate and insulated from the first conductive layer; the second conductive layer including a plurality of conductive pad groups, the conductive pad groups including at least one conductive pad; the orthographic projection of the conductive pad on the first conductive layer is located within the first hollow area; a plurality of protective electrodes, the protective electrodes are located in the first hollow area, and the orthographic projections of the conductive pads on the substrate are located within the orthographic projections of the protective electrodes on the substrate; wherein, for the protective electrodes and the conductive pads whose orthographic projections have overlapping areas, the voltage of the protective electrodes is greater than or equal to the voltage of the conductive pads.

[0039] In this way, by setting the orthographic projection of the conductive pad on the substrate to be within the orthographic projection of the protective electrode on the substrate, and setting the voltage of the protective electrode in the overlapping area of ​​the orthographic projection and the conductive pad to be greater than or equal to the voltage of the conductive pad, when the array substrate is in a water and oxygen environment, since the voltage of the protective electrode is greater than the voltage of the conductive pad, the conductive pad and the protective electrode undergo an electrochemical reaction, the protective electrode serves as the anode in the electrochemical reaction and is corroded, and the conductive pad serves as the cathode in the electrochemical reaction and is protected; on the one hand, the conductive pad that is easily exposed to water and oxygen is protected; on the other hand, since the protective electrode is located in the first hollow area, it is not easily exposed to water and oxygen, so that the degree of corrosion of the protective electrode is extremely small; when the voltage of the protective electrode is equal to the voltage of the conductive pad, no electrochemical reaction occurs between the protective electrode and the conductive pad; thereby solving the problem of array substrate failure caused by electrochemical corrosion of the conductive pad and improving the reliability of the array substrate.

[0040] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0042] Figure 1 A schematic structural diagram of an array substrate in a related art provided in an embodiment of the present application;

[0043] Figure 2 for Figure 1 The circuit connection diagram of the array substrate shown;

[0044] Figure 3 for Figure 1 The schematic diagram of the corrosion of the array substrate is shown;

[0045] Figure 4 A microscope image of a corrosion area of ​​an array substrate in a related art provided in an embodiment of the present application;

[0046] Figure 5a A schematic structural diagram of an array substrate in another related technology provided in an embodiment of the present application;

[0047] Figure 5b for Figure 5a Cross-sectional view along direction B1B2;

[0048] Figure 6a A schematic structural diagram of an array substrate provided in an embodiment of the present application;

[0049] Figure 6b for Figure 6a Cross-sectional view along the C1C2 direction;

[0050] Figure 6c for Figure 6a The schematic diagram of the corrosion of the array substrate is shown;

[0051] Figure 7a A schematic structural diagram of another array substrate provided in an embodiment of the present application;

[0052] Figure 7b for Figure 7a The circuit connection diagram of the array substrate shown;

[0053] Figure 8 A flow chart of a method for preparing an array substrate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0055] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present application. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0056] In the embodiments of the present application, words such as "first" and "second" are used to distinguish identical or similar items with substantially the same functions and effects. This is only for the purpose of clearly describing the technical solutions of the embodiments of the present application, and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0057] Combine Figure 1 and Figure 2 As shown in the figure, in the Mini LED array substrate of the related art, a lamp area D includes four Mini LED light-emitting devices (a, b, c and d), and these four Mini LED light-emitting devices are simultaneously controlled to turn on or off by a driver control device (IC) 7. The positive electrode of the Mini LED light-emitting device is electrically connected to the drive line (VLED) 22, and the negative electrode of the Mini LED light-emitting device is electrically connected to the ground line (GND) 21 through the driver control device (IC) 7. The power line 23 (PWR) is configured to provide power to the driver control device (IC) 7.

[0058] Specifically, refer to Figure 1 As shown, the positive electrode (P) of the first Mini LED light-emitting device a is directly electrically connected to the driving line (VLED) 22, the negative electrode (N) of the first Mini LED light-emitting device a is electrically connected to the positive electrode of the second Mini LED light-emitting device b through the connecting wire 43, the negative electrode of the second Mini LED light-emitting device b is electrically connected to the positive electrode of the third Mini LED light-emitting device c through the connecting wire 43, the negative electrode of the third Mini LED light-emitting device c is electrically connected to the positive electrode of the fourth Mini LED light-emitting device c through the connecting wire 43, and the negative electrode of the fourth Mini LED light-emitting device c is electrically connected to the ground wire 21 through the driving control device (IC) 7.

[0059] In actual applications, in the area near the Mini LED light-emitting device 6, since the driving voltage of the Mini LED light-emitting device 6 is relatively large (for example, the driving voltage range is 15V to 30V), there is a voltage difference between the positive electrode (or negative electrode) of the Mini LED light-emitting device 6 and the conductive pad, and between the conductive pad (41 or 42) and the ground wire (GND). In a high temperature and high humidity environment, electrochemical reactions occur between the positive electrode (or negative electrode) of the Mini LED light-emitting device 6 and the conductive pad (41 or 42), and between the conductive pad (41 or 42) and the ground wire (GND), thereby causing the conductive pad (41 or 42) to be corroded, forming the following: Figure 4 The corrosion area F shown in FIG causes the MiniLED light emitting device 6 to go out or explode. Figure 5a and Figure 5b As shown, in the related art, the ground line 21 (GND) located under the conductive pads (41 and 42) is hollowed out to improve the situation. However, the effect is minimal and there is still a serious problem of lamp extinguishing or lamp explosion. Figure 5b for Figure 5a Cross-sectional view in the B1B2 direction.

[0060] Based on this, the embodiment of the present application provides an array substrate, Figure 6a and Figure 6b As shown, or combined Figure 7a and Figure 7b As shown, including:

[0061] Substrate 1;

[0062] A first conductive layer 2 located on the substrate 1, the first conductive layer 2 including a plurality of first hollow areas K1;

[0063] The second conductive layer 4 is located on a side of the first conductive layer 2 away from the substrate 1 and is insulated from the first conductive layer 2. The second conductive layer 4 includes a plurality of conductive pad groups, each of which includes at least one conductive pad (41 or 42). The orthographic projection of the conductive pad (41 or 42) on the first conductive layer 2 is located within the outline of the first hollow area K1.

[0064] A plurality of protective electrodes 200 , wherein the protective electrodes 200 are located in the first hollow area K1 , and the orthographic projection of the conductive pad ( 41 or 42 ) on the substrate 1 is located within the orthographic projection of the protective electrode 200 on the substrate 1 ;

[0065] Wherein, for the protective electrode 200 and the conductive pad ( 41 or 42 ) having an overlapping area in their orthographic projections, the voltage of the protective electrode 200 is greater than or equal to the voltage of the conductive pad ( 41 or 42 ).

[0066] The substrate 1 may be a glass substrate, or a PCB (Printed Circuit Board) substrate, and the specific method may be determined according to actual conditions.

[0067] In an exemplary embodiment, the conductive material in a partial area of ​​the first conductive layer 2 is removed to form a first hollow area. In actual applications, the area where the first hollow area K1 is located is not truly hollow, but is filled with other film layers or materials, for example, filled with insulating materials.

[0068] In an exemplary embodiment, an insulating layer 3 is provided between the first conductive layer 2 and the second conductive layer 4 , and the insulating layer may extend to the area within the first hollow region K1 excluding the area where the protection electrode 200 is provided.

[0069] In the exemplary embodiment, there is no limitation on the projection shape of the first hollow area K1, and the projection shape may be circular, elliptical or polygonal.

[0070] In an exemplary embodiment, the orthographic projections of the conducting pads in the same conducting pad group on the first conducting layer 2 may all be located within the same first hollow area K1 .

[0071] In an exemplary embodiment, the orthographic projection of the conductive pad (41 or 42) on the first conductive layer 2 is located within the first hollow area K1, which means that the orthographic projection outline of the conductive pad (41 or 42) on the first conductive layer 2 is located within the outline of the first hollow area K1; or, the orthographic projection outline of the conductive pad (41 or 42) on the first conductive layer 2 overlaps with the outline of the first hollow area K1.

[0072] In an exemplary embodiment, the orthographic projection of the conductive pad (41 or 42) on the substrate 1 is located within the orthographic projection of the protective electrode 200 on the substrate 1, which means that the orthographic projection outline of the conductive pad (41 or 42) on the substrate 1 is located within the orthographic projection outline of the protective electrode 200 on the substrate 1; or, the orthographic projection outline of the conductive pad (41 or 42) on the substrate 1 overlaps with the orthographic projection outline of the protective electrode 200 on the substrate 1.

[0073] It should be noted that, in the embodiment of the present application, since the orthographic projection of the conductive pad (41 or 42) on the first conductive layer 2 is located within the first hollow area K1, the protective electrode 200 is located in the first hollow area K1, and the orthographic projection of the conductive pad (41 or 42) on the substrate 1 is located within the orthographic projection of the protective electrode 200 on the substrate 1, therefore, in actual application, the projection size of the first hollow area K1 is greater than the projection size of the protective electrode 200, and the projection size of the protective electrode 200 is greater than or equal to the projection size of the conductive pad (41 or 42).

[0074] In an exemplary embodiment, the orthographic projections of the conductive pads (41 and 42) in the same conductive pad group on the substrate 1 are all located within the orthographic projection of the same protective electrode 200 on the substrate 1. It should be noted that the drawings provided in the embodiments of this application are all drawn based on the example that the orthographic projections of the conductive pads (41 and 42) in the same conductive pad group on the substrate 1 are all located within the orthographic projection of the same protective electrode 200 on the substrate 1.

[0075] Exemplarily, the conductive pad may be a pad.

[0076] In an exemplary embodiment, for the protective electrode 200 and the conductive pad (41 or 42) whose orthographic projections have an overlapping area, the meaning of the voltage of the protective electrode 200 being greater than or equal to the voltage of the conductive pad (41 or 42) is: for the protective electrode 200 and the conductive pad whose positional relationship is that there is an overlapping area of ​​the orthographic projections, the relationship between their voltage magnitudes is that the voltage of the protective electrode 200 is greater than or equal to the voltage of the conductive pad (41 or 42); for the protective electrode 200 and the conductive pad whose positional relationship does not have a projection overlap, the relationship between their voltage magnitudes is not limited here.

[0077] In an exemplary embodiment, for the protective electrode 200 and the conductive pad (41 or 42) having an overlapping area in their orthographic projections, when the voltage of the protective electrode 200 is greater than the voltage of the conductive pad (41 or 42), the protective electrode 200 serves as the anode in the electrochemical reaction and is corroded, and the conductive pad (41 or 42) serves as the cathode in the electrochemical reaction and is protected; when the voltage of the protective electrode 200 is equal to the voltage of the conductive pad (41 or 42), no electrochemical reaction occurs between the two.

[0078] In an exemplary embodiment, a protective layer 5 and a reflective layer are sequentially provided on the second conductive layer 4, wherein the protective layer 5 exposes the area where the conductive pad is located in the second conductive layer 4, and the reflective layer covers the protective layer 5. Therefore, in actual applications, the area where the conductive pad is located is extremely susceptible to water and oxygen penetration.

[0079] For example, the material of the protective layer 5 may be an insulating material.

[0080] Exemplarily, the material of the reflective layer may be any one or more combinations of white ink, silicone white glue, or reflective sheet.

[0081] In the embodiment of the present application, by setting the orthographic projection of the conductive pad (41 or 42) on the substrate 1 to be within the orthographic projection of the protective electrode 200 on the substrate 1, and setting the voltage of the protective electrode 200 in the overlapping area of ​​the orthographic projection and the conductive pad (41 or 42) to be greater than or equal to the voltage of the conductive pad (41 or 42), when the array substrate is in a high-humidity and high-oxygen environment, when the voltage of the protective electrode 200 is greater than the voltage of the conductive pad (41 or 42), the conductive pad (41 or 42) and the protective electrode 200 undergo an electrochemical reaction, and the protective electrode 200 is The protective electrode 200 is corroded by the anode in the electrochemical reaction, and the conductive pad (41 or 42) is protected by the cathode in the electrochemical reaction; on the one hand, the conductive pad that is easily exposed to water and oxygen is protected; on the other hand, since the protective electrode 200 is located in the first hollow area K1, it is not easily exposed to water and oxygen, so that the degree of corrosion of the protective electrode 200 is extremely small; when the voltage of the protective electrode 200 is equal to the voltage of the conductive pad, no electrochemical reaction will occur between the protective electrode 200 and the conductive pad; thereby solving the problem of failure of the array substrate caused by electrochemical corrosion of the conductive pad and improving the reliability of the array substrate.

[0082] Specifically, in the related art, refer to Figure 1As shown, since the driving line 22 is electrically connected to the first conductive pad 41 via the connecting trace, the first conductive pad 41 is electrically connected to the first electrode (P electrode) 63 of the light-emitting device 6, and the second electrode (N electrode) 62 of the light-emitting device 6 is electrically connected to the second conductive pad 42, and the orthographic projections of the first conductive pad 41 and the second conductive pad 42 on the substrate 1 are both located within the orthographic projection of the ground line 21 on the substrate 1; wherein, the driving line 22, the ground line 21, and the power line 23 constitute the first conductive layer 2, and the conductive pads and the connecting traces constitute the second conductive layer 4. In actual applications, since the conductive pad (41 or 42) needs to be electrically connected to the electrode (P electrode or N electrode) of the light-emitting device 6, a protective layer is not provided on the conductive pad (41 or 42). When the array substrate is exposed to a water and oxygen environment, the conductive pad (41 or 42) is easily corroded by electrochemical reactions.

[0083] refer to Figure 3 As shown, the voltage provided by the driving line 22 is V LED , the voltage drop generated by a light emitting device 6 is U, and the voltage of the first conductive pad 41 and the connecting line 43 electrically connected to the first electrode (P electrode) 63 of the first light emitting device a is V LED The voltage of the second conductive pad 42 and the connecting line 43 electrically connected to the second electrode (N electrode) 62 of the first light emitting device a is V LED -U; the voltage of the ground line 21 is 0. Figure 3 for Figure 1 Cross-sectional view in the A1A2 direction.

[0084] exist Figure 3 Near the position marked ①, an electrochemical reaction occurs between the connecting trace 43 and the grounding wire 21. The connecting trace 43 here is the anode of the electrochemical reaction, and the grounding wire 21 here is the cathode of the electrochemical reaction. According to the principle of electrochemical reaction, the anode connecting trace 43 of the electrochemical reaction is corroded, and the cathode grounding wire 21 of the electrochemical reaction is protected. Since the connecting trace 43 here is directly electrically connected to the second conductive pad 42, the second conductive pad 42 will also be corroded.

[0085] exist Figure 3 Near the position marked ②, an electrochemical reaction occurs between the second pole (N pole) 62 of the first light-emitting device a and the second conductive pad 42. The second pole (N pole) 62 of the first light-emitting device a is the cathode of the electrochemical reaction, and the second conductive pad 42 is the anode of the electrochemical reaction. At this time, the second pole (N pole) 62 of the first light-emitting device a is protected, and the second conductive pad 42 is corroded.

[0086] exist Figure 3At the position marked ③, an electrochemical reaction occurs between the first pole (P pole) 63 of the first light-emitting device a and the first conductive pad 41. The first pole (P pole) of the first light-emitting device a is the anode of the electrochemical reaction, and the first conductive pad 41 is the cathode of the electrochemical reaction. At this time, the first conductive pad 41 is protected and the first pole (P pole) of the first light-emitting device a is corroded. However, in actual applications, since an insulating layer and a protective layer are provided on the first pole (P pole) of the light-emitting device a, the degree of corrosion of the first pole (P pole) of the light-emitting device 6 is extremely small.

[0087] exist Figure 3 At the position marked ④ in the middle, an electrochemical reaction occurs between the connecting trace 43 and the grounding wire 21. The connecting trace 43 directly connected to the first conductive pad 41 serves as the anode of the electrochemical reaction, and the grounding wire 21 serves as the cathode of the anode of the electrochemical reaction. At this time, the grounding wire 21 is protected, and the connecting trace 43 directly connected to the first conductive pad 41 is corroded, and the first conductive pad 41 is also affected to a certain extent.

[0088] In actual applications, since the electrochemical reactions at position ① and position ② will corrode the second conductive pad 42, under the dual effects, the probability of the second conductive pad 42 being corroded is extremely high and the degree of corrosion is also relatively serious.

[0089] However, in the examples of this application, reference is made to Figure 6c As shown, by setting the orthographic projection of the conductive pad (41 or 42) on the substrate 1 to be within the orthographic projection of the protective electrode 200 on the substrate 1, and setting the voltage of the protective electrode 200 in the overlapping area and the conductive pad (41 or 42) to be greater than the voltage of the conductive pad (41 or 42), when the array substrate is in a high-humidity and high-oxygen environment, the electrochemical reaction at position ① corrodes the protective electrode 200, protecting the connecting wire 43 connected to the second conductive pad 42; the electrochemical reaction at position ② corrodes the second conductive pad 42, protecting the second pole (N pole) 62 of the light-emitting device a; the electrochemical reaction at position ③ protects the second conductive pad 41, corrodes the first pole (P pole) of the light-emitting device 6; the electrochemical reaction at position ④ protects the connecting wire 43 electrically connected to the second conductive pad 41, and corrodes the protective electrode 200. In this way, the protective effect of the electrochemical reaction at position ① on the second conductive pad 42 and the corrosive effect of the electrochemical reaction at position ② on the second conductive pad 42 can be offset; the electrochemical reaction at position ③ and the electrochemical reaction at position ④ both play a protective role on the first conductive pad 41, thereby solving the problem of array substrate failure caused by electrochemical corrosion of the conductive pad and improving the reliability of the array substrate. Figure 6c for Figure 6a Cross-sectional view along the C1C2 direction.

[0090] It should be noted that in the array substrate provided in the embodiments of the present application, since the protective electrode 200 is located on the side of the first conductive layer 2 away from the light-emitting device 6, the protective electrode 200 is exposed to very little water and oxygen. Therefore, even if the protective electrode 200 is corroded by the electrochemical reaction, the corrosion is very mild and will not affect the reliability of the array substrate. In addition, since the outer layers of the two electrodes of the light-emitting device 6 (the first electrode 63 and the second electrode 62) are coated with a protective material, even if they are corroded by the electrochemical reaction, the corrosion is very mild and will not affect the reliability of the array substrate.

[0091] In addition, for the protective electrode 200 and the conductive pad where there is an overlapping area in the orthographic projection, no electrochemical reaction occurs when the voltages of the two are the same. Compared with the situation in the related art, setting the voltages of the protective electrode 200 and the conductive pad where there is an overlapping area in the orthographic projection to be the same can also improve the problem of electrochemical corrosion of the conductive pad to a certain extent.

[0092] In practical applications, the greater the voltage difference between the protection electrode 200 and the conductive pad where the orthographic projections overlap, the more severe the corrosion caused by the electrochemical reaction.

[0093] In some embodiments of the present application, reference is made to Figure 6a-Figure 7a As shown, the array substrate also includes multiple components (6 or 7), and one component (6 or 7) is electrically connected to the same group of conductive pads; wherein, the orthographic projections of at least some of the components (6 or 7) on the substrate 1 are located within the orthographic projection of the protective electrode 200 on the substrate 1.

[0094] In an exemplary embodiment, the components include a light emitting device 6 and a drive control device 7 .

[0095] Exemplarily, the light emitting device 6 may include a Mini LED or a Micro LED.

[0096] In an exemplary embodiment, the orthographic projection of each light-emitting device 6 on the substrate 1 is located within the orthographic projection of the protective electrode 200 on the substrate 1 , and the orthographic projection of the drive control device 7 on the substrate 1 does not overlap with the orthographic projection of the protective electrode 200 on the substrate 1 .

[0097] In an exemplary embodiment, the orthographic projections of the light emitting devices 6 and the driving control device 7 on the substrate 1 are respectively located within the orthographic projections of the protection electrode 200 on the substrate 1 .

[0098] In some embodiments of the present application, the components include a light emitting device 6 and a drive control device 7 , wherein the drive control device 7 is configured to control at least one light emitting device 6 to be turned on or turned off simultaneously;

[0099] The orthographic projection of the light emitting device 6 on the substrate 1 is within the orthographic projection of the protection electrode 200 on the substrate 1 , and the orthographic projection of the driving control device 7 on the substrate 1 does not overlap with the orthographic projection of the protection electrode 200 on the substrate 1 .

[0100] In the embodiment of the present application, since the multiple light-emitting devices 6 located in a lamp area D are electrically connected to the ground wire 21 through the same drive control device 7, in actual applications, the voltage difference between the drive control device 7 and the ground wire 21 near it is very small, and the probability of an electrochemical reaction is low. Even if an electrochemical reaction occurs, the corrosion effect on the conductive pad electrically connected to the drive control device 7 is very small, and there is almost no impact on the array substrate. Therefore, there is no need to set a protective electrode 200 for the drive control device 7.

[0101] In some embodiments of the present application, the voltages of the protection electrodes 200 are the same.

[0102] In an exemplary embodiment, when the voltage of the protection electrode 200 is greater than the driving voltage provided by the driving line 22 , the voltage of the protection electrode 200 is greater than the voltage of any conductive pad in the conductive pad group corresponding to any light emitting device 6 .

[0103] In an exemplary embodiment, when the voltage of the protection electrode 200 is equal to the driving voltage provided by the driving line 22, Figure 6a In the lamp area D shown, the voltage of the protective electrode 200 is greater than the voltage of the second conductive pad 42 in the conductive pad group corresponding to the first light-emitting device a (the light-emitting device electrically connected to the driving line 22), and the voltage of the protective electrode 200 is greater than the voltage of any conductive pad in the conductive pad group corresponding to the other three light-emitting devices (a, b or c).

[0104] When the orthographic projection of the driving control device 7 on the substrate 1 is outside the orthographic projection of the protective electrode 200 on the substrate 1, there is no limitation on the voltage relationship between the conductive pad corresponding to the driving control device 7 and the protective electrode, which can be determined according to actual conditions.

[0105] In some embodiments of the present application, reference is made to Figure 6a As shown, the first conductive layer 2 includes a plurality of driving lines 22 extending along a first direction OA, the protection electrode 200 is electrically connected to the driving lines 22 , and the voltage of the protection electrode 200 is equal to the driving voltage of the driving lines 22 .

[0106] Specifically, the first conductive layer 2 includes a plurality of wiring groups arranged in an array, the wiring groups including a driving line 22, a ground line 21, and a power line 23 extending along a first direction OA and sequentially arranged along a second direction OB; the first direction OA and the second direction OB intersect;

[0107] Part of the protection electrode 200 is located between the ground line 21 and the driving line 22 , and the remaining part of the protection electrode 200 is located between the ground line 21 and the power line 23 ;

[0108] The protection electrode 200 between the ground line 21 and the driving line 22 is directly electrically connected to the driving line 22 , and the protection electrode 200 between the ground line 21 and the power line 23 is electrically connected to the driving line 22 in the adjacent wiring group via a bridge structure Q.

[0109] The specific structure of the bridge structure Q is not limited here, and all methods that can achieve electrical connection between the protection electrode 200 and the driving line 22 are within the protection scope of this application.

[0110] It should be noted that, in the drawings provided in the embodiments of the present application, the positions of the black circular structures represent electrical connections through connecting vias.

[0111] In some embodiments of the present application, reference is made to Figure 6a As shown, the first conductive layer 2 includes a first hollow area K1, a second hollow area K2, a third hollow area K3 and a fourth hollow area K4;

[0112] Each protection electrode 200 is located in the first hollow area K1; the second hollow area K2 is configured to separate the driving line 22 and the ground line 21; the third hollow area K3 is configured to separate the power line 23 and the ground line 21, and the orthographic projection of the drive control device 7 on the first conductive layer 2 is located within the third hollow area K3; the fourth hollow area K4 is configured to separate the power line 23 and the driving line 22 in the adjacent routing group;

[0113] Part of the first hollow area K1 is connected to the second hollow area K2, and the remaining part of the first hollow area K1 is connected to the third hollow area K3.

[0114] In an exemplary embodiment, the second hollow area K2 is located between the driving line 22 and the ground line 21 , and an extending direction of the second hollow area K2 is the same as an extending direction of the driving line 22 .

[0115] In an exemplary embodiment, the third hollow area K3 is located between the ground line 21 and the power line 23 , and an extending direction of the third hollow area K3 is the same as an extending direction of the driving line 22 .

[0116] In an exemplary embodiment, the orthographic projection of the connection wire 43 for connecting the driving control devices 7 of the two lamp zones D on the first conductive layer 2 is located within the third hollow area K3.

[0117] In the array substrate provided by the embodiment of the present application, by electrically connecting the protection electrode 200 and the driving line 22, the voltage of each protection electrode 200 is the same as the voltage of the driving line 22, so that the voltage of each conductive pad connected to the light-emitting device 6 is less than or equal to the voltage of each protection electrode 200. When the voltage of the protection electrode 200 is greater than the voltage of the conductive pad (41 or 42), the conductive pad (41 or 42) and the protection electrode 200 undergo an electrochemical reaction, and the protection electrode 200 serves as the anode in the electrochemical reaction and is corroded, while the conductive pad (41 or 42) serves as the cathode in the electrochemical reaction and is protected. On the one hand, the conductive pad that is easily exposed to water and oxygen is protected. On the other hand, since the protection electrode 200 is located in the first hollow area K1, it is not easily exposed to water and oxygen, so that the degree of corrosion of the protection electrode 200 is extremely small. When the voltage of the protection electrode 200 is equal to the voltage of the conductive pad, no electrochemical reaction occurs between the protection electrode 200 and the conductive pad. This solves the problem of array substrate failure caused by electrochemical corrosion of the conductive pad, thereby improving the reliability of the array substrate.

[0118] In some embodiments of the present application, the voltages of at least some of the protection electrodes 200 are the same.

[0119] In some embodiments of the present application, reference is made to Figure 7a As shown, the first conductive layer 2 further includes a plurality of first protection traces 24 and a plurality of second protection traces 25 extending along the first direction OA and arranged along the second direction OB; the first direction OA intersects the second direction OB;

[0120] Among them, part of the protection electrodes 200 is electrically connected to the first protection trace 24, and the remaining protection electrodes are electrically connected to the second protection trace 25; the voltage of each protection electrode 200 electrically connected to the first protection trace 24 is the same, and the voltage of each protection electrode 200 electrically connected to the second protection trace 25 is the same.

[0121] In an exemplary embodiment, the voltages of the first protection trace 24 and the second protection trace 25 may be the same, or may be different, which is not limited here.

[0122] In practical applications, the first protection trace 24 and the second protection trace 25 can be directly electrically connected to the binding terminal (not drawn in the figure) of the array substrate, and the binding terminal can provide voltage signals to the first protection trace 24 and the second protection trace 25 respectively.

[0123] In some embodiments of the present application, reference is made to Figure 7a and Figure 7bAs shown, the first conductive layer 2 includes a plurality of wiring groups arranged in an array, and the wiring group includes a driving line 22, a first protection wiring 24, a ground line 21, a second protection wiring 25 and a power line 23 extending along a first direction OA and sequentially arranged along a second direction OB;

[0124] The voltage of at least one of the first protection wiring 24 and the second protection wiring 25 is greater than or equal to the driving voltage of the driving line 22 .

[0125] In an exemplary embodiment, the first direction OA is perpendicular to the second direction OB.

[0126] In an exemplary embodiment, referring to Figure 7a As shown, for the first light-emitting device a, the conductive pad electrically connected to its first electrode 63 (P electrode) is directly connected to the driving line 22 through the connecting wire 43. Therefore, the voltage of the conductive pad electrically connected to its first electrode 63 (P electrode) is the same as the voltage of the driving line 22. Since the protective electrode 200 and the conductive pad (41 or 42) have an overlapping area in the orthographic projection, the voltage of the protective electrode 200 is greater than the voltage of the conductive pad (41 or 42). Therefore, the voltage provided by the first protective wire 24 to the protective electrode 200 is greater than or equal to the driving voltage V of the driving line 22. LED For example Figure 7a For the third light emitting device c shown in FIG, if the voltage drop generated by a light emitting device 6 is U, the voltage of the conductive pad electrically connected to the first electrode 63 (P electrode) of the third light emitting device c is V LED -2U, the voltage of the second electrode 62 (N electrode) of the third light emitting device c is less than V LED -2U, then the voltage provided by the second protection line 25 to the protection electrode 200 must be at least greater than or equal to V LED -2U.

[0127] In an exemplary embodiment, to simplify the design, the voltages in the first protection trace 24 and the second protection trace 25 may be set to be the same, such that both are greater than or equal to the driving voltage provided by the driving line 22 .

[0128] In some embodiments of the present application, reference is made to Figure 7a As shown, the first conductive layer 2 includes a first hollow area K1, a second hollow area K2 and a third hollow area K3;

[0129] The second hollow area K2 is configured to separate the driving line 22 and the ground line 21; the third hollow area K3 is configured to separate the power line 23 and the ground line 21, and the orthographic projection of the driving control device 7 on the first conductive layer 2 is located in the third hollow area K3;

[0130] Part of the first hollow area K1 is connected together and is connected to the second hollow area K2; the remaining part of the first hollow area K1 is connected to the third hollow area K3.

[0131] In an exemplary embodiment, referring to Figure 7a As shown, the first hollow area K1 between the driving line 22 and the ground line 21 is connected together, and further connected together with the second hollow area K2 for separating the driving line 22 and the ground line 21, forming a fifth hollow area K5.

[0132] In an exemplary embodiment, the orthographic projection of the first protection trace 24 on the first conductive layer 2 is located within the second hollow area K2 , and the orthographic projection of the second protection trace 25 on the first conductive layer 2 is located within the third hollow area K3 .

[0133] In an exemplary embodiment, the orthographic projection of the connection wire 43 for connecting the driving control devices 7 of the two lamp zones D on the first conductive layer 2 is located within the third hollow area K3.

[0134] In some embodiments of the present application, reference is made to Figure 7a As shown, a distance d1 between the first protection trace 24 and the driving line 22 along a direction opposite to the second direction OB, a distance d2 between the first protection trace 24 and the ground line 21 along the second direction OB, a distance d3 between the second protection trace 25 and the ground line 21 along a direction opposite to the second direction OB, and a distance d4 between the second protection trace 25 and the power line 23 along the second direction OB are all greater than or equal to 80 μm.

[0135] In some embodiments of the present application, the protective electrode 200 and the first conductive layer 2 are provided in the same layer.

[0136] In an exemplary embodiment, the protection electrode 200 and the first conductive layer 2 disposed in the same layer can be formed by a single patterning process, which can include film formation, exposure, development, and etching.

[0137] In some embodiments of the present application, Figure 6a and Figure 6b As shown, the light emitting device 6 includes a first electrode (P electrode) 63 and a second electrode 62 (N electrode), and the conductive pad group includes a first conductive pad 41 and a second conductive pad 42. The first electrode 63 is electrically connected to the first conductive pad 41, and the second electrode 62 is electrically connected to the second conductive pad 42.

[0138] An embodiment of the present application provides a light-emitting device, comprising the array substrate as described above.

[0139] The light-emitting device can be used as a backlight device or a display device. Specifically, if the multiple components in the light-emitting device include light-emitting devices 6 that emit a single color of light, the light-emitting device can be used as a backlight device; if the multiple components in the light-emitting device include light-emitting devices 6 that emit light of different colors, such as three light-emitting devices that emit red, green, and blue light, the light-emitting device can be used as a display device.

[0140] The light-emitting device provided in the embodiments of the present application may be a Mini LED light-emitting device, or may be a Micro LED light-emitting device.

[0141] In practical applications, these light-emitting devices are mostly used in backlighting due to cost constraints. Compared to OLED (Organic Light-Emitting Diode) light-emitting devices, Mini LED light-emitting devices have smaller crystal sizes, significantly shortening the light mixing distance between adjacent lamp beads (Mini LED light-emitting devices). They offer advantages such as adjustable regional brightness, high color rendering, and high contrast. Furthermore, their thinness, energy efficiency, and flexibility make them more flexible in application.

[0142] In the embodiment of the present application, a plurality of components in a light-emitting device include a light-emitting device 6 that emits light of a single color, and the light-emitting device is used as a backlight device as an example for description.

[0143] In the light-emitting device provided in the embodiment of the present application, the orthographic projection of the conductive pad (41 or 42) on the substrate 1 is set to be within the orthographic projection of the protective electrode 200 on the substrate 1, and the voltage of the protective electrode in the protective electrode 200 and the conductive pad (41 or 42) in the overlapping area of ​​the orthographic projection is set to be greater than or equal to the voltage of the conductive pad (41 or 42). When the array substrate is in a high-humidity and high-oxygen environment, when the voltage of the protective electrode 200 is greater than the voltage of the conductive pad (41 or 42), the conductive pad (41 or 42) and the protective electrode 200 undergo an electrochemical reaction, and the protective electrode 200 0 is the anode in the electrochemical reaction and is corroded, and the conductive pad (41 or 42) is the cathode in the electrochemical reaction and is protected; on the one hand, the conductive pad that is easily exposed to water and oxygen is protected; on the other hand, since the protective electrode 200 is located in the first hollow area K1, it is not easy to be exposed to water and oxygen, so that the degree of corrosion of the protective electrode 200 is extremely small; when the voltage of the protective electrode 200 is equal to the voltage of the conductive pad, no electrochemical reaction will occur between the protective electrode 200 and the conductive pad; thereby solving the problem of failure of the array substrate caused by electrochemical corrosion of the conductive pad and improving the reliability of the light-emitting device.

[0144] The embodiment of the present application provides a method for preparing an array substrate, which is used to prepare the array substrate as described above. Figure 8 As shown, the method includes:

[0145] S901, provide Figure 6b The substrate 1 shown;

[0146] The substrate 1 may be a glass substrate, or a PCB substrate, and the specific method may be determined according to actual conditions.

[0147] S902, forming a first conductive layer 2 and a plurality of protective electrodes 200; wherein the first conductive layer 2 includes a plurality of first hollow areas K1, and the protective electrodes 200 are located in the first hollow areas K1;

[0148] In an exemplary embodiment, the first conductive layer 2 includes multiple first hollow areas K1, which means that the conductive material in some areas of the first conductive layer 2 is removed. In actual applications, the area where the first hollow area K1 is located is not truly hollow, but is filled with other film layers or materials, for example, filled with insulating materials.

[0149] In an exemplary embodiment, since the protection electrode 200 is located in the first hollow area K1 , the area in the first hollow area K1 except where the protection electrode 200 is located is filled with an insulating material.

[0150] In the exemplary embodiment, there is no limitation on the projection shape of the first hollow area K1, and the projection shape may be circular, elliptical or polygonal.

[0151] S903, forming a second conductive layer 4; the second conductive layer 4 is located on the side of the first conductive layer 2 away from the substrate 1, and is insulated from the first conductive layer 2; the second conductive layer 2 includes a plurality of conductive pad groups, and the conductive pad group includes at least one conductive pad (41 or 42); the orthographic projection of the conductive pad on the first conductive layer 2 is located within the first hollow area K1; wherein, for the protective electrode 200 and the conductive pad (41 or 42) whose orthographic projections have an overlapping area, the voltage of the protective electrode 200 is greater than or equal to the voltage of the conductive pad (41 or 42).

[0152] In an exemplary embodiment, an insulating layer 3 is provided between the first conductive layer 2 and the second conductive layer 4 , and the insulating layer may extend to the area within the first hollow region K1 excluding the area where the protection electrode 200 is provided.

[0153] In an exemplary embodiment, the orthographic projections of the conducting pads in the same conducting pad group on the first conducting layer 2 may all be located within the same first hollow area K1 .

[0154] It should be noted that, in the embodiment of the present application, since the orthographic projection of the conductive pad (41 or 42) on the first conductive layer 2 is located within the first hollow area K1, the protective electrode 200 is located in the first hollow area K1, and the orthographic projection of the conductive pad (41 or 42) on the substrate 1 is located within the orthographic projection of the protective electrode 200 on the substrate 1, therefore, in actual application, the projection size of the first hollow area K1 is greater than the projection size of the protective electrode 200, and the projection size of the protective electrode 200 is greater than or equal to the projection size of the conductive pad (41 or 42).

[0155] In an exemplary embodiment, the orthographic projections of the conductive pads (41 and 42) in the same conductive pad group on the substrate 1 are all located within the orthographic projection of the same protective electrode 200 on the substrate 1. It should be noted that the drawings provided in the embodiments of this application are all drawn based on the example that the orthographic projections of the conductive pads (41 and 42) in the same conductive pad group on the substrate 1 are all located within the orthographic projection of the same protective electrode 200 on the substrate 1.

[0156] The array substrate prepared by the preparation method provided in the embodiment of the present application is configured such that the orthographic projection of the conductive pad (41 or 42) on the substrate 1 is located within the orthographic projection of the protective electrode 200 on the substrate 1, and the voltage of the protective electrode in the protective electrode 200 and the conductive pad (41 or 42) in the overlapping area of ​​the orthographic projection is set to be greater than or equal to the voltage of the conductive pad (41 or 42). When the array substrate is in a high-humidity and high-oxygen environment, the conductive pad (41 or 42) and the protective electrode 200 undergo an electrochemical reaction. When the voltage of the protective electrode 200 is greater than the voltage of the conductive pad (41 or 42), the protective electrode 200 is electrochemically reacted. The electrode 200 is the anode in the electrochemical reaction and is corroded, and the conductive pad (41 or 42) is the cathode in the electrochemical reaction and is protected; on the one hand, the conductive pad that is easily exposed to water and oxygen is protected; on the other hand, since the protective electrode 200 is located in the first hollow area K1, it is not easily exposed to water and oxygen, so that the degree of corrosion of the protective electrode 200 is extremely small; when the voltage of the protective electrode 200 is equal to the voltage of the conductive pad, no electrochemical reaction will occur between the protective electrode 200 and the conductive pad; thereby solving the problem of failure of the array substrate caused by electrochemical corrosion of the conductive pad and improving the reliability of the array substrate.

[0157] In some embodiments of the present application, step S902, forming a first conductive layer and a plurality of protection electrodes, includes:

[0158] S9021 , forming the first conductive layer 2 and the protective electrode 200 simultaneously.

[0159] In some embodiments of the present application, the protective electrode 200 and the first conductive layer 2 are provided in the same layer.

[0160] In an exemplary embodiment, the protection electrode 200 and the first conductive layer 2 disposed in the same layer can be formed by a single patterning process, which can include film formation, exposure, development, and etching.

[0161] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An array substrate, characterized in that: include: substrate; a first conductive layer located on the substrate, wherein the first conductive layer includes a plurality of first hollow regions; a second conductive layer, located on a side of the first conductive layer away from the substrate and insulated from the first conductive layer; the second conductive layer includes a plurality of conductive pad groups, each of which includes at least one conductive pad; an orthographic projection of the conductive pad on the first conductive layer is located within the first hollow area; a plurality of protective electrodes, wherein the protective electrodes are located in the first hollow area, and the orthographic projection of the conductive pad on the substrate is located within the orthographic projection of the protective electrodes on the substrate; Wherein, for the protective electrode and the conductive pad having an overlapping area in their orthographic projections, the voltage of the protective electrode is greater than or equal to the voltage of the conductive pad.

2. The array substrate according to claim 1, wherein: The array substrate further comprises a plurality of components, and one of the components is electrically connected to the same group of the conductive pads; Wherein, the orthographic projections of at least part of the components on the substrate are located within the orthographic projection of the protective electrode on the substrate.

3. The array substrate according to claim 1, wherein: The voltages of the protective electrodes are the same.

4. The array substrate according to claim 3, wherein: The first conductive layer includes a plurality of driving lines extending along a first direction. The protection electrode is electrically connected to the driving lines, and a voltage of the protection electrode is equal to a driving voltage of the driving lines.

5. The array substrate according to claim 4, wherein: The first conductive layer includes a plurality of wiring groups arranged in an array, the wiring groups including the driving lines, grounding lines, and power lines extending along the first direction and sequentially arranged along the second direction; the first direction and the second direction intersect; Part of the protection electrode is located between the ground line and the driving line, and the remaining part of the protection electrode is located between the ground line and the power line; The protection electrode located between the ground line and the driving line is directly electrically connected to the driving line, and the protection electrode located between the ground line and the power line is electrically connected to the driving line in the adjacent wiring group via a bridge structure.

6. The array substrate according to claim 5, wherein: The array substrate further includes a driving control device, and the first conductive layer includes the first hollow area, the second hollow area, the third hollow area and the fourth hollow area; The second hollow area is configured to separate the driving line and the ground line; the third hollow area is configured to separate the power line and the ground line, and the orthographic projection of the drive control device on the first conductive layer is located within the third hollow area; the fourth hollow area is configured to separate the power line and the driving line in the adjacent routing group; Part of the first hollow area is connected to the second hollow area, and the remaining part of the first hollow area is connected to the third hollow area.

7. The array substrate according to claim 1, wherein: The voltages of at least some of the guard electrodes are the same.

8. The array substrate according to claim 7, wherein: The first conductive layer further includes a plurality of first protection traces and a plurality of second protection traces extending along a first direction and arranged along a second direction; the first direction and the second direction intersect; Part of the protection electrodes are electrically connected to the first protection routing, and the remaining part of the protection electrodes are electrically connected to the second protection routing; the voltages of the protection electrodes electrically connected to the first protection routing are the same, and the voltages of the protection electrodes electrically connected to the second protection routing are the same.

9. The array substrate according to claim 8, wherein: The first conductive layer includes a plurality of wiring groups arranged in an array, wherein the wiring groups include a driving line, a first protection wiring, a ground line, a second protection wiring, and a power line extending along the first direction and sequentially arranged along the second direction; Wherein, a voltage of at least one of the first protection wiring and the second protection wiring is greater than or equal to a driving voltage of the driving line.

10. The array substrate according to claim 9, wherein: The array substrate further includes a driving control device, and the first conductive layer includes the first hollow area, the second hollow area and the third hollow area; The second hollow area is configured to separate the driving line and the ground line; the third hollow area is configured to separate the power line and the ground line, and the orthographic projection of the driving control device on the first conductive layer is located in the third hollow area; Part of the first hollow areas are connected together and connected to the second hollow area; the remaining part of the first hollow areas are connected to the third hollow areas respectively.

11. The array substrate according to claim 9, wherein: The distance between the first protection trace and the driving line along a direction opposite to the second direction, the distance between the first protection trace and the ground line along the second direction, the distance between the second protection trace and the ground line along a direction opposite to the second direction, and the distance between the second protection trace and the power line along the second direction are all greater than or equal to 80 μm.

12. The array substrate according to claim 1, wherein: The protective electrode and the first conductive layer are arranged on the same layer.

13. The array substrate according to claim 2, wherein: The components include a light emitting device and a drive control device, wherein the drive control device is configured to control at least one of the light emitting devices to be turned on or off simultaneously; The orthographic projection of the light emitting device on the substrate is located within the orthographic projection of the protective electrode on the substrate, and the orthographic projection of the driving control device on the substrate does not overlap with the orthographic projection of the protective electrode on the substrate.

14. The array substrate according to claim 13, wherein: The light emitting device includes a first electrode and a second electrode, the conductive pad group includes a first conductive pad and a second conductive pad, the first electrode is electrically connected to the first conductive pad, and the second electrode is electrically connected to the second conductive pad.

15. A light emitting device, characterized in that: The invention comprises an array substrate as claimed in any one of claims 1 to 14.

16. A method for preparing an array substrate, characterized in that: The method for preparing an array substrate according to any one of claims 1 to 14 comprises: providing a substrate; forming a first conductive layer and a plurality of protective electrodes; wherein the first conductive layer includes a plurality of hollow areas, and the protective electrodes are located in the hollow areas; A second conductive layer is formed; the second conductive layer is located on a side of the first conductive layer away from the substrate and is insulated from the first conductive layer; the second conductive layer includes a plurality of conductive pad groups, and the conductive pad group includes at least one conductive pad; the orthographic projection of the conductive pad on the first conductive layer is located within the hollow area; wherein, for the protective electrode and the conductive pad whose orthographic projections have an overlapping area, the voltage of the protective electrode is greater than or equal to the voltage of the conductive pad.

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