Workpiece chip detection device and use method thereof

Abstract

The present invention introduces a workpiece chip entanglement detection device and a method for using the same. When there is chip entanglement on the workpiece, a robot arm, a detection power supply, a relay, a substrate, the workpiece and the chip entanglement form a closed detection loop, and the relay is energized to send a detection signal to the robot arm control system, and the robot arm is controlled to put the workpiece with chip entanglement into a chute A; when there is no chip entanglement on the workpiece, the robot arm clamps the workpiece from between the arc grooves and places it in the chute B. The workpiece chip entanglement detection device of the present invention has a simple structure, can automatically judge and detect, distinguish workpieces, reduce the labor intensity of workers, improve work efficiency, effectively eliminate chip entanglement workpieces, and ensure the accuracy and safety of machine tool processing in subsequent processes; the setting of the adjustment plate can be applicable to workpieces of different sizes, thereby improving the scope of application.

Description

Technical Field

[0001] The present invention relates to the technical field of machine tool automated processing, and in particular to a workpiece chip entanglement detection device and a use method thereof. Background Art

[0002] In the process of automated machining of machine tools, most of the time, unmanned operation is achieved through robot arms. Robot arms replace manual labor to operate machine tools and realize loading and unloading. During the working process of one unit, multiple machine tools are set up continuously, and automation is achieved by controlling multiple machine tools according to the processing sequence through a robot arm; however, this degree of automation is affected by the chips entangled in the workpiece and requires manual intervention, otherwise it will affect the machining efficiency, and also affect the appearance of the workpiece and the life of the machine tool tools. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a workpiece chip entanglement detection device and a method of using the same, so as to realize automatic judgment of chip entanglement, improve the working efficiency of the robot, liberate manual labor and realize maximum benefit.

[0004] The technical solution adopted by the present invention is:

[0005] A workpiece chip entanglement detection device, comprising a support seat, a detection baffle, a detection power supply, a robot arm, a relay, a PLC controller, a support frame, a slide A and a slide B;

[0006] The support seat is arranged on the first process machine tool; the detection baffle comprises a substrate, an insulating plate and a measuring plate; the substrate is a rectangular plate, an arc-shaped groove is arranged in the middle of one side of the substrate, the rear ends of the two substrates are respectively arranged horizontally on the support seat through the insulating plates, a gap is left between the two substrates, and the arc-shaped grooves in the middle of the two substrates are arranged oppositely; the measuring plates are respectively arranged at the front ends of the two substrates;

[0007] The positive electrode of the detection power supply is connected to the robot arm, and the negative electrode is connected to the two substrates respectively through the relay load end, and the normally open contact end of the relay is connected to the PLC controller, and the PLC controller controls the robot arm to clamp the workpiece and operate; the support frame and the support seat are arranged on the second process machine tool adjacent to the first process machine tool in a corresponding position; the slide groove A and the slide groove B are arranged on the support frame with a downward tilt respectively.

[0008] Preferably, the measuring plate is a flat plate structure or a contour plate matching the shape of the workpiece; a waist-shaped adjustment hole is provided on the measuring plate, and screws pass through the waist-shaped adjustment hole to respectively set the two measuring plates at the front ends of the two substrates.

[0009] A method for using a workpiece chip detection device, the specific steps are:

[0010] Step 1: According to the structural features of the workpiece, if the workpiece has a simple structure, a flat measuring plate should be selected; if the workpiece has a complex shape and requires high precision, a contour plate that matches the shape of the workpiece should be selected; according to the size of the workpiece, the distance between the two measuring plates is adjusted through the waist-shaped adjustment hole to complete the deployment of the detection device;

[0011] Step 2: After the first process is completed, the robot arm clamps the workpiece and enters between the two measuring plates from the front gap of the two substrates. When there is entangled chips on the workpiece, after the entangled chips contact the measuring plate, the robot arm, the detection power supply, the relay, the substrate, the measuring plate, the workpiece and the entangled chips form a closed detection loop. The relay is energized to send the detection signal to the PLC controller. The PLC controller controls the robot arm to withdraw the workpiece with entangled chips from between the two substrates and put it into the slide A. The workpiece slides down along the slide to the lower end of the slide A and waits for cleaning.

[0012] Step 3: When there is no tangled chips on the workpiece, the robot arm clamps the workpiece and enters from the gap at the front end of the two substrates. There is no contact between the workpiece and the adjustment plate, and no closed loop is formed. The relay sends no signal, and the PLC controller controls the robot arm to move the workpiece backward to the arc groove, lift the workpiece upward from between the arc grooves and place it in slide B. The workpiece slides down along slide B, waiting to enter the process of the second process machine tool.

[0013] A workpiece chip entanglement detection device, comprising a support seat, a detection baffle, a detection power supply, a robot arm, a PLC controller, a relay, a support frame, a slide A and a slide B;

[0014] The support seat is arranged on the first process machine tool; the detection baffle comprises a substrate, an insulating plate and a measuring block; the substrate is a rectangular plate, and the rear end of the substrate is horizontally arranged on the support seat through the insulating plate; the shape of the measuring block matches the inner hole of the workpiece to be detected, and the measuring block is arranged at the front end of the substrate;

[0015] The positive pole of the detection power supply is connected to the robot arm, the negative pole is connected to the substrate through the relay load end, the normally open contact end of the relay is connected to the PLC controller, and the PLC controller controls the robot arm to clamp the workpiece and operate; the support frame and the support seat are arranged on the second process machine tool adjacent to the first process machine tool in a corresponding position; the slide groove A and the slide groove B are respectively arranged on the support frame with a downward tilt.

[0016] A method for using a workpiece chip detection device, the specific steps are:

[0017] Step 1: According to the size of the inner hole of the workpiece, select a measuring block that matches the inner hole of the workpiece; the measuring block is installed on the upper side of the front end of the substrate to complete the deployment of the detection device;

[0018] Step 2: After the first process is completed, the robot arm clamps the workpiece and puts it above the measuring block. When there is entangled chips on the workpiece, the entangled chips contact the measuring block, and the robot arm, detection power supply, relay, substrate, measuring block, workpiece and entangled chips form a closed detection loop. The relay is energized to send the detection signal to the PLC controller. The PLC controller controls the robot arm to lift the workpiece with entangled chips upward and put it into the slide A. The workpiece slides down along the slide to the lower end of the slide A and waits for cleaning;

[0019] Step 3: When there is no swarf entangled on the workpiece, the robot arm clamps the workpiece and puts it above the measuring block. There is no contact between the workpiece and the measuring block, and no closed loop is formed. The relay does not send any signal. The PLC controller controls the robot arm to lift the workpiece upward and place it in slide B. The workpiece slides down along slide B and waits to enter the process of the second process machine tool.

[0020] Preferably, the support seat is a bent plate member, including a lower end plate, an upper end plate and a connecting arm; the lower end plate is located in the vertical direction, the upper end plate is located in the horizontal direction, the lower end plate and the upper end plate are connected by a connecting arm, the lower end plate is fixed to the first process machine tool by bolts, and reinforcing ribs are provided between the upper end plate, the lower end plate and the connecting arm.

[0021] Preferably, the support frame is a right-angle plate structure, the vertical plate of the support frame is fixed to the second process machine tool by a fixing rod, two groups of legs are relatively arranged on the horizontal plate of the support frame, the legs are fixed to the support frame by bolts, the upper end surfaces of the two groups of legs are relatively inclined, and the slide groove A and the slide groove B are respectively arranged on the support frame through two groups of legs.

[0022] Preferably, the chute A and chute B are both long rod structures with U-shaped cross-sections, and baffles are provided at the downwardly inclined ends of the chute A and chute B. The length of the chute A is greater than the length of the chute B. The lower end of the chute A is located outside the second process machine tool, and the lower end of the chute B corresponds to the second process machine tool.

[0023] Due to the adoption of the above-mentioned technical solution, the present invention has the following advantages:

[0024] The workpiece chip entanglement detection device of the present invention has a simple structure, can automatically determine and detect chips entanglement, separate workpieces, reduce the labor intensity of workers, and improve work efficiency; based on the principle of chip conductivity, it can effectively eliminate chip entangled workpieces to ensure the accuracy and safety of machine tool processing in subsequent processes; the detection device can be applied to workpieces of different sizes and structures, and is suitable for workpieces processed on outer surfaces and inner holes, meeting diversified production detection needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall installation of Embodiment 1 and Embodiment 2 of the present invention.

[0026] Figure 2 It is a schematic diagram of the positions of the support base, the detection baffle and the robot arm in Example 1 and Example 2 of the present invention.

[0027] Figure 3 It is a schematic diagram of the positions of the support frame, slide slot A, slide slot B and the robot arm of the present invention.

[0028] Figure 4 It is a connection diagram of the detection circuit of Example 1 of the present invention.

[0029] Figure 5 It is a connection diagram of the detection circuit of Example 2 of the present invention.

[0030] Figure 6 It is a connection diagram of the detection circuit of Example 3 of the present invention.

[0031] Figure 7 It is a connection diagram of the relay of the present invention and the PLC controller.

[0032] In the figure: 1-support seat, 11-lower end plate, 12-upper end plate, 13-connecting arm, 14-reinforcement rib, 2-detection baffle, 21-base plate, 211-arc groove, 22-insulating plate, 23-measuring plate, 24-measuring block, 3-detection power supply, 4-relay, 5-support frame, 51-fixing rod, 52-leg, 6-slide A, 7-slide B, 8-baffle, 9-first process machine tool, 10-second process machine tool, 101-robot arm, 102-workpiece. DETAILED DESCRIPTION

[0033] The present invention is further explained below in conjunction with the accompanying drawings and embodiments, which cannot be used to limit the scope of protection of the present invention. The purpose of disclosing the present invention is to protect all technical improvements within the scope of the present invention.

[0034] As attached Figure 1-4 A workpiece chip entanglement detection device shown includes a support base 1, a detection baffle 2, a detection power supply 3, a robot arm 101, a relay 4, a PLC controller, a support frame 5, a slide A6 and a slide B7;

[0035] The support seat 1 is arranged on the first process machine tool 9; the detection baffle 2 includes a substrate 21, an insulating plate 22 and a measuring plate 23; the substrate 21 is a rectangular plate, and an arc-shaped groove 211 is arranged in the middle of one side of the substrate 21. The rear ends of the two substrates 21 are horizontally arranged on the support seat 1 through the insulating plates 22 respectively, and a gap is left between the two substrates 21. The arc-shaped grooves 211 in the middle of the two substrates 21 are arranged oppositely; the measuring plate 23 is a flat plate structure, and a waist-shaped adjustment hole is arranged on the measuring plate 23. The screws pass through the waist-shaped adjustment holes to respectively arrange the two measuring plates 23 at the front ends of the two substrates 21.

[0036] The positive pole of the detection power supply 3 is connected to the robot arm 101, and the negative pole is connected to the two substrates 21 respectively through the load end of the relay 4. The normally open contact end of the relay 4 is connected to the PLC controller, and the PLC controller controls the robot arm 101 to clamp the workpiece 102 for operation; the support frame 5 is arranged on the second process machine tool 10 adjacent to the first process machine tool 9 in a position corresponding to the support seat 1; the slide groove A6 and the slide groove B7 are respectively arranged on the support frame 5 to be tilted downward.

[0037] As attached Figure 1-4 The method for using the workpiece chip detection device shown in the figure comprises the following specific steps:

[0038] Step 1: According to the structural features of the workpiece 102, the workpiece 102 has a simple structure and a flat measuring plate 23 is selected; according to the size of the workpiece 102, the distance between the two measuring plates 23 is adjusted through the waist-shaped adjustment hole to complete the deployment of the detection device;

[0039] Step 2: After the first process machine tool 9 is processed, the robot arm 101 clamps the workpiece 102 and enters between the two measuring plates 23 from the front end gap of the two substrates 21. When there are entangled chips on the workpiece 102, after the entangled chips contact the measuring plate 23, the robot arm 101, the detection power supply 3, the relay 4, the substrate 21, the measuring plate 23, the workpiece 102 and the entangled chips form a closed detection loop, and the relay 4 is energized to send the detection signal to the PLC controller. The PLC controller controls the robot arm 101 to withdraw the workpiece 102 with entangled chips from between the two substrates 21 and put it into the slide A6. The workpiece 102 slides down along the slide to the lower end of the slide A6 and waits for cleaning;

[0040] Step three: When there is no tangled debris on the workpiece 102, the robot arm 101 clamps the workpiece 102 and enters from the gap at the front end of the two substrates 21. There is no contact between the workpiece 102 and the adjustment plate, and no closed loop is formed. No signal is sent from the relay 4. The PLC controller controls the robot arm 101 to move the workpiece 102 backward to the arc groove 211, lift the workpiece 102 upward from between the arc grooves 211 and place it in the slide groove B7. The workpiece 102 slides downward along the slide groove B7, waiting to enter the process of the second process machine tool 10.

[0041] Example 2

[0042] like Figure 5 A workpiece chip entanglement detection device is shown, and its connection relationship is the same as that of Example 1. In this embodiment, the measuring plate 23 adopts a contour plate structure that matches the shape of the workpiece 102, and the inner wall of the contour plate is set to a concave-convex structure that matches the shape of the workpiece 102, thereby increasing the contact position between the workpiece 102 and the measuring plate 23, thereby ensuring the accuracy of chip entanglement detection of the workpiece 102 with a complex shape structure.

[0043] Example 3

[0044] A workpiece chip entanglement detection device, comprising a support seat 1, a detection baffle 2, a detection power supply 3, a robot arm 101, a PLC controller, a relay 4, a support frame 5, a slide groove A6 and a slide groove B7;

[0045] The support seat 1 is arranged on the first process machine tool 9; the detection baffle 2 includes a substrate 21, an insulating plate 22 and a measuring block 24; the substrate 21 is a rectangular plate, and the rear end of the substrate 21 is horizontally arranged on the support seat 1 through the insulating plate 22; the shape of the measuring block 24 matches the inner hole of the workpiece 102 to be detected, and the measuring block 24 is arranged at the front end of the substrate 21.

[0046] like Figure 6 As shown, the positive pole of the detection power supply 3 is connected to the robot arm 101, and the negative pole is connected to the substrate 21 through the load end of the relay 4. The normally open contact end of the relay 4 is connected to the PLC controller, and the PLC controller controls the robot arm 101 to clamp the workpiece 102 for operation; the support frame 5 and the support seat 1 are arranged on the second process machine tool 10 adjacent to the first process machine tool 9 in a position corresponding to each other; the slide groove A6 and the slide groove B7 are respectively arranged on the support frame 5 to be tilted downward.

[0047] like Figure 6 The method for using the workpiece chip detection device shown is characterized by the following specific steps:

[0048] Step 1: According to the inner hole size of the workpiece 102, a measuring block 24 matching the inner hole of the workpiece 102 is selected; the measuring block 24 is installed on the upper side of the front end of the substrate 21, and the detection device is deployed;

[0049] Step 2: After the first process of the machine tool 9 is completed, the robot arm 101 clamps the workpiece 102 and puts it on the measuring block 24. When there are entangled chips on the workpiece 102, after the entangled chips contact the measuring block 24, the robot arm 101, the detection power supply 3, the relay 4, the substrate 21, the measuring block 24, the workpiece 102 and the entangled chips form a closed detection loop, and the relay 4 is energized to send the detection signal to the PLC controller. The PLC controller controls the robot arm 101 to lift the workpiece 102 with entangled chips upward and put it into the slide A6. The workpiece 102 slides down along the slide to the lower end of the slide A6 and waits for cleaning;

[0050] Step three: When there is no scaffolding on the workpiece 102, the robot arm 101 clamps the workpiece 102 and puts it on the measuring block 24. There is no contact between the workpiece 102 and the measuring block 24, and no closed loop is formed. The relay 4 sends no signal, and the PLC controller controls the robot arm 101 to lift the workpiece 102 upward and place it in the slide groove B7. The workpiece 102 slides downward along the slide groove B7, waiting to enter the process of the second process machine tool 10.

[0051] like Figure 1-3 As shown, preferably, the support seat 1 is a bent plate, including a lower end plate 11, an upper end plate 12 and a connecting arm 13; the lower end plate 11 is located in the vertical direction, the upper end plate 12 is located in the horizontal direction, the lower end plate 11 and the upper end plate 12 are connected by the connecting arm 13, the lower end plate 11 is fixed to the first process machine tool 9 by bolts, and reinforcing ribs 14 are provided between the upper end plate 12, the lower end plate 11 and the connecting arm 13.

[0052] Preferably, the support frame 5 is a right-angle plate structure, the vertical plate of the support frame 5 is fixed to the second process machine tool 10 by a fixing rod 51, two groups of legs 52 are relatively arranged on the horizontal plate of the support frame 5, the legs 52 are fixed to the support frame 5 by bolts, the upper end surfaces of the two groups of legs 52 are relatively inclined, and the slide groove A6 and the slide groove B7 are respectively arranged on the support frame 5 through the two groups of legs 52.

[0053] Preferably, the slide groove A6 and the slide groove B7 are both long rod structures with a U-shaped cross-section, and the downward inclined ends of the slide groove A6 and the slide groove B7 are both provided with a baffle 8. The length of the slide groove A6 is greater than that of the slide groove B7. The lower end of the slide groove A6 is located outside the second process machine tool 10, and the lower end of the slide groove B7 corresponds to the second process machine tool 10.

[0054] The parts not described in detail in this invention are prior art.

[0055] The embodiments selected herein for the purpose of disclosing the invention are currently considered to be suitable, but it should be understood that the invention is intended to include all changes and modifications of the embodiments that fall within the scope of the concept and invention.

Claims

1. A method for using a workpiece chip detection device, characterized in that: The detection device includes a support seat, a detection baffle, a detection power supply, a robot arm, a relay, a PLC controller, a support frame, a slide A and a slide B; The support seat is arranged on the first process machine tool; the detection baffle comprises a substrate, an insulating plate and a measuring plate; the substrate is a rectangular plate, an arc-shaped groove is arranged in the middle of one side of the substrate, the rear ends of the two substrates are respectively arranged horizontally on the support seat through the insulating plate, a gap is left between the two substrates, and the arc-shaped grooves in the middle of the two substrates are arranged oppositely; the measuring plate is a flat plate structure or a contour plate matching the shape of the workpiece; a waist-shaped adjustment hole is arranged on the measuring plate, and screws are passed through the waist-shaped adjustment hole to respectively arrange the two measuring plates at the front ends of the two substrates; The positive electrode of the detection power supply is connected to the robot arm, and the negative electrode is connected to the two substrates through the relay load end. The normally open contact end of the relay is connected to the PLC controller, and the PLC controller controls the robot arm to clamp the workpiece and operate; the support frame and the support seat are arranged on the second process machine tool adjacent to the first process machine tool in a corresponding position; the slide groove A and the slide groove B are arranged on the support frame with a downward tilt respectively; The method for using the workpiece chip detection device comprises the following specific steps: Step 1: According to the structural features of the workpiece, if the workpiece has a simple structure, a flat measuring plate should be selected; if the workpiece has a complex shape and requires high precision, a contour plate that matches the shape of the workpiece should be selected; according to the size of the workpiece, the distance between the two measuring plates is adjusted through the waist-shaped adjustment hole to complete the deployment of the detection device; Step 2: After the first process is completed, the robot arm clamps the workpiece and enters between the two measuring plates from the front gap of the two substrates. When there is entangled chips on the workpiece, after the entangled chips contact the measuring plate, the robot arm, the detection power supply, the relay, the substrate, the measuring plate, the workpiece and the entangled chips form a closed detection loop. The relay is energized to send the detection signal to the PLC controller. The PLC controller controls the robot arm to withdraw the workpiece with entangled chips from between the two substrates and put it into the slide A. The workpiece slides down along the slide to the lower end of the slide A and waits for cleaning. Step 3: When there is no tangled chips on the workpiece, the robot arm clamps the workpiece and enters from the gap at the front end of the two substrates. There is no contact between the workpiece and the adjustment plate, and no closed loop is formed. The relay sends no signal, and the PLC controller controls the robot arm to move the workpiece backward to the arc groove, lift the workpiece upward from between the arc grooves and place it in slide B. The workpiece slides down along slide B, waiting to enter the process of the second process machine tool.

2. A method for using a workpiece chip detection device, characterized in that: The detection device includes a support seat, a detection baffle, a detection power supply, a robot arm, a PLC controller, a relay, a support frame, a slide A and a slide B; The support seat is arranged on the first process machine tool; the detection baffle comprises a substrate, an insulating plate and a measuring block; the substrate is a rectangular plate, and the rear end of the substrate is horizontally arranged on the support seat through the insulating plate; the shape of the measuring block matches the inner hole of the workpiece to be detected, and the measuring block is arranged at the front end of the substrate; The positive electrode of the detection power supply is connected to the robot arm, the negative electrode is connected to the substrate through the relay load end, the normally open contact end of the relay is connected to the PLC controller, and the PLC controller controls the robot arm to clamp the workpiece and operate; the support frame and the support seat are arranged on the second process machine tool adjacent to the first process machine tool in a corresponding position; the slide groove A and the slide groove B are arranged on the support frame with a downward tilt respectively; The method for using the workpiece chip detection device is characterized by comprising the following specific steps: Step 1: According to the size of the inner hole of the workpiece, select a measuring block that matches the inner hole of the workpiece; the measuring block is installed on the upper side of the front end of the substrate to complete the deployment of the detection device; Step 2: After the first process is completed, the robot arm clamps the workpiece and sets it above the measuring block. When there are entangled chips on the workpiece, after the entangled chips contact the measuring block, the robot arm, the detection power supply, the relay, the substrate, the measuring block, the workpiece and the entangled chips form a closed detection loop. The relay is energized to send the detection signal to the PLC controller. The PLC controller controls the robot arm to lift the workpiece with entangled chips upward and put it into the slide A. The workpiece slides down along the slide to the lower end of the slide A and waits for cleaning; Step 3: When there is no swarf entangled on the workpiece, the robot arm clamps the workpiece and the rotating sleeve is set above the measuring block. There is no contact between the workpiece and the measuring block, and no closed loop is formed. The relay does not send any signal. The PLC controller controls the robot arm to lift the workpiece upward and place it in the slide B. The workpiece slides down along the slide B and waits to enter the process of the second process machine tool.

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