Packaging module and packaging method thereof, and electronic equipment

Abstract

The present application provides a packaging module and a packaging method thereof, and an electronic device. The packaging module includes at least two device groups and a shielding structure for shielding at least two device groups. The shielding structure includes an isolation wall for electromagnetically isolating two adjacent device groups. The isolation wall includes a plurality of conductive columns and a conductive glue, and the conductivity of the conductive columns is greater than the conductivity of the conductive glue. The plurality of conductive columns are arranged at intervals and electrically connected to the stratum of the substrate, and the conductive glue is filled in the gaps between any adjacent conductive columns, and any adjacent conductive columns are electrically connected through the conductive glue. It can be seen from the above description that the isolation wall is composed of conductive columns and conductive glue, and the conductivity of the conductive columns is greater than the conductive glue, thereby improving the conductivity of the isolation wall; the conductive columns are used as part of the isolation wall, which reduces the use of conductive glue, reduces the cost of the entire shielding structure, and thus reduces the cost of the entire packaging module.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a packaging module and a packaging method thereof, and an electronic device. Background Art

[0002] As the internal modules of electronic devices such as mobile phones and smart watches become more and more compact, the distance between components in electronic devices is getting smaller and smaller, making the components in electronic devices susceptible to electromagnetic interference from other adjacent components. For example, the mobile hotspot (Wi-Fi) transceiver and Bluetooth transceiver in electronic devices are often set adjacent to each other. The interference signal generated by the Wi-Fi transceiver when working will interfere with the operation of the Bluetooth transceiver. Similarly, the interference signal generated by the Bluetooth transceiver when working will also interfere with the operation of the Wi-Fi transceiver.

[0003] In order to reduce electromagnetic interference between adjacent components and reduce the space occupied by the electromagnetic shielding module in electronic devices, system in a package (SIP) is expected to become the mainstream electromagnetic shielding solution. Taking Wi-Fi transceivers and Bluetooth transceivers as examples, Figure 1 As shown, in the current system-level package, the Wi-Fi transceiver 3 and the Bluetooth transceiver 2 are arranged on the same surface of the substrate 1, and a metal layer 4 is arranged on the outer surface of the system-level package, and the metal layer 4 and the substrate 1 constitute a space for accommodating the Wi-Fi transceiver 3 and the Bluetooth transceiver 2. At the same time, a metal partition wall 5 is also arranged between the Wi-Fi transceiver 3 and the Bluetooth transceiver 2, and the metal partition wall 5 can divide the above space into two independent subspaces. One of the subspaces can accommodate the Wi-Fi transceiver 3, and the other subspace can accommodate the Bluetooth transceiver 2. Plastic packaging material 6 is also filled between the Wi-Fi transceiver 3 and the metal partition wall 5, and between the Bluetooth transceiver 2 and the metal partition wall 5. The metal partition wall 5 is mostly solidified by conductive glue, but the current conductive glue mostly contains precious metal materials such as gold and silver, which makes the cost of the conductive glue high, which is not conducive to reducing the process cost of the system-level package. In addition, compared with metal conductors, the conductivity of the conductive glue is lower, and the electromagnetic shielding effect is not ideal. The shielding requirements cannot be met. Summary of the invention

[0004] The present application provides a packaging module and a packaging method thereof, and an electronic device, aiming to improve the shielding effect of the packaging module.

[0005] In a first aspect, a packaging module is provided, which is applied to an electronic device to improve the shielding effect of the packaging module. The packaging module includes a substrate for carrying a device, and at least two device groups arranged on the substrate, and the at least two device groups are different device groups that need electromagnetic isolation. The packaging module also includes a shielding structure for shielding at least two device groups. The shielding structure includes an isolation wall for electromagnetically isolating each two adjacent device groups. In order to improve the shielding effect, the isolation wall provided by the present application includes at least a conductive column and a conductive glue, wherein the conductivity of the conductive column is greater than the conductivity of the conductive glue. There are multiple conductive columns, and the multiple conductive columns are electrically connected to the ground layer of the substrate. The multiple conductive columns are arranged at intervals when arranged, and there is a gap between any adjacent conductive columns. The conductive glue is filled in the gap between any adjacent conductive columns, and any adjacent conductive columns are electrically connected through the conductive glue, so that the conductive column and the conductive glue form a wall-like structure to electromagnetically isolate the two device groups. From the above description, it can be seen that the isolation wall is composed of conductive columns and conductive glue. On the one hand, when the conductive columns are used as part of the isolation wall, the conductivity of the conductive columns is greater than the conductivity of the conductive glue, thereby improving the conductivity of the isolation wall; on the other hand, using the conductive columns as part of the isolation wall can reduce the use of conductive glue, reduce the cost of the entire shielding structure, and thus reduce the cost of the entire packaging module.

[0006] In a specific possible implementation, the shielding structure further includes a shielding cover, the shielding cover faces at least a portion of the surface of the substrate and is electrically connected to the ground layer of the substrate, the at least two device groups are located in a space enclosed by the shielding cover and the substrate; the conductive adhesive is electrically connected to the shielding cover. The shielding cover and the substrate form a space for accommodating at least two electrical devices.

[0007] In a specific possible implementation, the conductive pillar contacts the inner wall of the shielding cover, thereby achieving connection between the isolation wall and the shielding cover.

[0008] In a specific implementation scheme, a gap is provided between the conductive pillar and the shielding cover, and the conductive glue fills the gap between the shielding cover and the conductive pillar. The electrical connection between the isolation wall and the shielding cover can be achieved in different ways.

[0009] In a specific implementation manner, when there is a gap between the conductive pillar and the shielding cover, the gap is less than or equal to 300 μm. The conductive pillar has a certain height, which can improve the isolation effect of the isolation wall.

[0010] In a specific implementation scheme, the spacing between the conductive pillars is greater than or equal to 50 μm and less than or equal to 100 μm, thereby increasing the density of the conductive pillars and improving the shielding effect of the isolation wall.

[0011] In a specific implementation method, the conductive column can be a column of different shapes such as a rectangular column, an elliptical column, a circular column, etc. The shielding effect of the isolation wall can be improved by conductive columns of different shapes.

[0012] In a specific implementation scheme, when the conductive column is a cylinder, the diameter of the conductive column is greater than or equal to 20 μm and less than or equal to 50 μm, thereby ensuring that the conductive column has a certain volume and improving the shielding effect of the isolation wall.

[0013] In a specific possible implementation, the plurality of conductive pillars are arranged in a plurality of rows, the direction of the rows being the length direction of the isolation wall; the packaging module further comprises a plastic package, the at least two device groups are both plastic-packaged in the plastic package, and part of the side wall of each conductive pillar is wrapped by the plastic package; there is a slot between two adjacent rows of conductive pillars, and part of the side wall of each conductive pillar is exposed in the slot; the conductive glue is filled in the slot and wraps the part of the side wall of each conductive pillar exposed in the slot. By filling the conductive glue into the slot, the conductive pillar is electrically connected to the conductive glue.

[0014] In a specific embodiment, the plurality of conductive pillars are arranged in two rows, and the conductive pillars in the two rows are aligned one by one; or, the plurality of conductive pillars are arranged in two rows, and the conductive pillars in the two rows are staggered. The conductive pillars can be arranged in different ways.

[0015] In a specific possible implementation manner, the plurality of conductive pillars are arranged into a plurality of rows, and the direction of the rows is the length direction of the isolation wall;

[0016] The packaging module also includes a plastic package body, the at least two device groups are plastic-packaged in the plastic package body, and part of the side wall of each conductive column is wrapped by the plastic package body; there is a filling hole between each four adjacent conductive columns, and part of the side wall of each conductive column is exposed in the corresponding filling hole; the conductive glue is filled in each filling hole, and the conductive glue wraps the part of the side wall of each conductive column exposed in the corresponding filling hole. The electrical connection between the conductive column and the conductive glue is achieved by setting the filling hole and filling the conductive glue into the filling hole.

[0017] In a specific possible implementation, the plurality of conductive pillars are arranged in a row; the packaging module further includes a plastic package, the at least two device groups are plastic-packaged in the plastic package, and part of the side wall of each conductive pillar is wrapped by the plastic package; there is a filling hole between each two adjacent conductive pillars, and part of the side wall of each conductive pillar is exposed in the corresponding filling hole; the conductive glue is filled in each filling hole, and the conductive glue wraps the part of the side wall of each conductive pillar exposed in the corresponding filling hole. The electrical connection between the conductive pillar and the conductive glue is achieved by setting the filling hole and filling the conductive glue into the filling hole.

[0018] In a specific implementation scheme, the volume ratio of the plurality of conductive pillars to the volume of the isolation wall is greater than or equal to 10% and less than or equal to 30%, thereby ensuring the proportion of the conductive pillars in the isolation wall, increasing the conductivity of the isolation wall, and thus improving the shielding effect of the isolation wall.

[0019] In the second aspect, an electronic device is provided, which can be a mobile terminal such as a mobile phone, a tablet computer, a smart watch, etc. The electronic device includes a circuit board and a packaging module as described in any one of the above items, and the packaging module is fixed on the circuit board. In the above technical solution, the isolation wall is formed by a conductive column and a conductive adhesive. On the one hand, when the conductive column is used as a part of the isolation wall, the conductivity of the conductive column is greater than the conductivity of the conductive adhesive, thereby improving the conductivity of the isolation wall; on the other hand, the conductive column is used as a part of the isolation wall, which can reduce the use of the conductive adhesive, reduce the cost of the entire shielding structure, and thus reduce the cost of the entire packaging module.

[0020] In a specific possible implementation, the circuit board of the electronic device is the substrate of the packaging module, thereby simplifying the structure of the electronic device.

[0021] In a third aspect, a method for preparing a packaging module is provided, the method comprising the following steps:

[0022] Disposing at least two device groups on a substrate;

[0023] A plurality of conductive pillars electrically connected to the ground layer of the substrate are arranged on the substrate; wherein the plurality of conductive pillars are arranged at intervals, and the plurality of conductive pillars isolate each two adjacent device groups;

[0024] Filling conductive glue in the gaps between the plurality of conductive pillars and electrically connecting adjacent conductive pillars;

[0025] The conductive pillars and the conductive glue electromagnetically isolate every two adjacent device groups.

[0026] In the above technical solution, an isolation wall is formed by conductive columns and conductive glue. On the one hand, when the conductive columns are used as part of the isolation wall, the conductivity of the conductive columns is greater than the conductivity of the conductive glue, thereby improving the conductivity of the isolation wall. On the other hand, using the conductive columns as part of the isolation wall can reduce the use of conductive glue, reduce the cost of the entire shielding structure, and thereby reduce the cost of the entire packaging module.

[0027] In a specific possible implementation scheme, a plurality of conductive pillars electrically connected to the ground layer of the substrate are arranged on the substrate; wherein the plurality of conductive pillars are arranged at intervals, and the plurality of conductive pillars isolate each two adjacent device groups; specifically:

[0028] The plurality of conductive pillars are arranged in a plurality of rows;

[0029] Disposing a plastic package to encapsulate the at least two device groups and the plurality of conductive pillars;

[0030] There is a slot between two adjacent rows of conductive pillars, part of the side wall of each conductive pillar is wrapped by the plastic package body, and part of the side wall is exposed in the slot;

[0031] The groove is filled with conductive glue, and the conductive glue wraps the side wall of each conductive column exposed in the groove. By filling the groove with conductive glue, the conductive column and the conductive glue are electrically connected to form an isolation wall.

[0032] In a specific possible implementation scheme, a plurality of conductive pillars electrically connected to the ground layer of the substrate are arranged on the substrate; wherein the plurality of conductive pillars are arranged at intervals, and the plurality of conductive pillars isolate each two adjacent device groups; specifically:

[0033] The plurality of conductive pillars are arranged in a plurality of rows;

[0034] Disposing a plastic package to encapsulate the at least two device groups and the plurality of conductive pillars;

[0035] A filling hole is opened between each of four adjacent conductive pillars, a part of the side wall of each conductive pillar is wrapped by the plastic package body, and a part of the side wall is exposed in the corresponding filling hole;

[0036] Conductive glue is filled in the filling hole, and the conductive glue wraps the part of the side wall of each conductive column exposed in the corresponding filling hole. By filling the conductive glue in the filling hole, the conductive column and the conductive glue are electrically connected to form an isolation wall.

[0037] In a specific possible implementation scheme, a plurality of conductive pillars electrically connected to the ground layer of the substrate are arranged on the substrate; wherein the plurality of conductive pillars are arranged at intervals, and the plurality of conductive pillars isolate each two adjacent device groups; specifically:

[0038] The plurality of conductive pillars are arranged in a row;

[0039] Disposing a plastic package to encapsulate the at least two device groups and the plurality of conductive pillars;

[0040] A filling hole is opened between every two adjacent conductive pillars, a part of the side wall of each conductive pillar is wrapped by the plastic package body, and a part of the side wall is exposed in the corresponding filling hole;

[0041] Conductive glue is filled in the filling hole, and the conductive glue wraps the part of the side wall of each conductive column exposed in the corresponding filling hole. By filling the conductive glue in the filling hole, the conductive column and the conductive glue are electrically connected to form an isolation wall. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a structural schematic diagram of a packaging module in the prior art;

[0043] Figure 2a A cross-sectional view of a packaging module provided in an embodiment of the present application;

[0044] Figure 2b A top view of a partition wall of a packaging module provided in an embodiment of the present application;

[0045] Figure 3 A corresponding relationship diagram between the conductivity and shielding effect of the material provided in the embodiment of the present application;

[0046] Figure 4a to Figure 4g The preparation process of the packaging module provided in the embodiment of the present application;

[0047] Figure 5a A cross-sectional view of a packaging module provided in an embodiment of the present application;

[0048] Figure 5b A top view of a partition wall of a packaging module provided in an embodiment of the present application;

[0049] Figure 6a A cross-sectional view of a packaging module provided in an embodiment of the present application;

[0050] Figure 6b A top view of a partition wall of a packaging module provided in an embodiment of the present application;

[0051] Figure 7a A cross-sectional view of a packaging module provided in an embodiment of the present application;

[0052] Figure 7b A top view of a partition wall of a packaging module provided in an embodiment of the present application;

[0053] Figure 8a A cross-sectional view of a packaging module provided in an embodiment of the present application;

[0054] Figure 8b A top view of a partition wall of a packaging module provided in an embodiment of the present application;

[0055] Figure 9a A cross-sectional view of a packaging module provided in an embodiment of the present application;

[0056] Figure 9bA top view of a partition wall of a packaging module provided in an embodiment of the present application;

[0057] Fig.10 A schematic diagram of the structure of a smart watch provided in an embodiment of the present application. DETAILED DESCRIPTION

[0058] The embodiments of the present application will be further described below in conjunction with the accompanying drawings.

[0059] First, the packaging module is described. The packaging module is applied to electronic devices with communication functions, such as compact and portable electronic devices (such as smart phones, smart watches, wireless routers, etc.). These electronic devices include devices that are susceptible to radio frequency interference, such as Wifi, Bluetooth, and cellular signal-related radio frequency transceiver circuits, as well as other devices that require clock signals, such as processors, storage, etc. The above-mentioned devices may generate electromagnetic interference with each other during normal operation. In order to protect the equipment from electromagnetic interference, some circuits (such as radio frequency transceivers) can be wrapped with metal shielding covers and integrated into packaging modules to block signals and shield electromagnetic interference. When the packaging module is integrated, there are generally at least two devices that will generate electromagnetic interference in the packaging module, so the devices will be isolated in the packaging module. In the prior art, silver glue is used to form isolation between devices inside the packaging module, but the silver glue is relatively expensive on the one hand, and the isolation effect is relatively low on the other hand, and it can no longer meet the current isolation requirements. For this reason, the present application embodiment provides a packaging module for improving the isolation effect, and the packaging module provided by the present application embodiment is described below in conjunction with the accompanying drawings and specific embodiments.

[0060] Figure 2a A cross-sectional view of a packaging module provided by an embodiment of the present application is shown. The packaging module includes a substrate 10, and a device on the supporting substrate 10, and also includes a shielding structure (not shown in the figure) for shielding the device. The shielding structure is used to electromagnetically isolate the device to shield the devices from each other or from the external environment. The above-mentioned device can be a radio frequency transceiver circuit related to Wifi, Bluetooth, or cellular signals, or a device using a clock signal, such as a processor, a storage, etc.

[0061] The substrate 10 may be a substrate of different types, such as a printed circuit board or a board layer with a circuit. The substrate 10 has a bearing surface, which may be two opposite surfaces on the substrate 10, or one of the surfaces. When setting a device, the device may be set on the bearing surface and electrically connected to the circuit layer of the substrate 10. The circuit layer includes a metal layer arranged on or in the substrate 10, and a pad for electrically connecting to the device and the shielding structure. When setting the shielding structure, the shielding structure may be electrically connected to the ground layer (a part of the circuit in the circuit layer) of the substrate 10 to achieve electromagnetic isolation of the device.

[0062] The same bearing surface of the substrate 10 can bear multiple devices. For the convenience of description, the devices are divided into at least two device groups according to the arrangement positions of the devices and the electromagnetic interference between the devices, and each device group does not contain devices that will electromagnetically interfere with each other.

[0063] Figure 2a , the packaging module includes two device groups. The packaging module includes a first device group 20 and a second device group 30. The first device group 20 and the second device group 30 are both combinations including at least one device. The first device group 20 may include only one device, or may include two or more devices. It should be understood that when the first device group 20 includes two or more devices, the two or two devices should not generate electromagnetic interference. The second device group 30 can refer to the description of the first device group 20, which will not be repeated here. When specifically dividing the first device group 20 and the second device group 30, the number of devices in the first device group 20 and the second device group 30 may be the same or different. For example, the first device group 20 includes N devices, the second device group 30 includes N devices, and N is a natural number; or, the first device group 20 includes N devices, the second device group 30 includes M devices, and N and M are unequal natural numbers.

[0064] As an optional solution, the packaging module further includes a plastic package 40, which is used to wrap at least two device groups to ensure the devices in each device group. The plastic package 40 can be made of different materials, such as epoxy resin, acrylic resin material, dielectric material, thermosetting material, thermoplastic material, rubber or other insulating materials. During preparation, the plastic package 40 can be formed in a molding tool by an injection process, and the plastic package 40 wraps the devices in each device group to protect each device and isolate the devices from each other.

[0065] The shielding structure is used to shield at least two device groups to avoid electromagnetic interference. The shielding structure includes a shielding cover 60 and an isolation wall 50. The shielding cover 60 faces at least a portion of the surface of the substrate 10 and is electrically connected to the ground layer of the substrate 10 to achieve grounding. The shielding cover 60 and the substrate 10 enclose a containing space, and the first device group 20 and the second device group 30 are contained in the space enclosed by the shielding cover 60 and the substrate 10. The shielding cover 60 can adopt different structures. For example, the shielding cover 60 can be a metal layer covering the plastic package 40, or it can also be a shell structure.

[0066] The isolation wall 50 is disposed in the shielding case 60 and is electrically connected to the shielding case 60. In addition, the isolation wall 50 divides the space in the shielding case 60 into a plurality of subspaces. Each subspace accommodates a device group, and each subspace is a shielded space formed by the shielding case 60 and the isolation wall 50.

[0067] Taking the first device group 20 and the second device group 30 as an example, when electromagnetically isolating the first device group 20 and the second device group 30, the isolation wall 50 is used to electromagnetically isolate the first device group 20 and the second device group 30. It should be understood that when there are at least two device groups, such as three, four, or other different numbers, the isolation wall 50 should be able to electromagnetically isolate each two adjacent device groups in at least two device groups for electromagnetic isolation. When the packaging module has a plastic package 40, the isolation wall 50 can be embedded in the plastic package 40 to facilitate the arrangement of the isolation wall 50.

[0068] The isolation wall 50 between every two adjacent device groups has a similar structure, so the isolation wall 50 between the first device group 20 and the second device group 30 is taken as an example for description.

[0069] For reference Figure 2a and Figure 2b , Figure 2b A partial top view of the isolation wall is shown. For the convenience of description, direction a and direction b are defined. Direction a is the arrangement direction of the first device group 20 and the second device group 30; direction b is the direction in which the first device group 20 and the second device group 30 need signal isolation. The plane where direction b and direction a are located is parallel to the bearing surface of the substrate 10. Direction b can be perpendicular to direction a or have an angle with direction a, and the angle can be any acute angle greater than 0° and less than 90°, such as 5°, 10°, 30°, 50°, 60°, 89° and other different angles.

[0070] The isolation wall 50 is located between the first device group 20 and the second device group 30 , and the length direction of the isolation wall 50 is set along the direction in which the signal needs to be isolated from the first device group 20 and the second device group 30 , that is, the length direction of the isolation wall 50 is along direction b.

[0071] The isolation wall 50 is a structure in which a conductive column 51 and a conductive adhesive 52 are mixed. The isolation wall 50 includes a plurality of conductive columns 51, and the plurality of conductive columns 51 are arranged in two rows. The conductive columns 51 in each row are arranged along direction b, and the two rows of conductive columns are arranged along direction a. In the two rows of conductive columns 51, there is a gap between two adjacent conductive columns 51 along direction a, and there is also a gap between two adjacent conductive columns 51 along direction b. As an optional solution, the conductive columns 51 in the two rows of conductive columns are aligned one by one, that is, the two conductive columns 51 are arranged in a row along direction a, and the plurality of conductive columns 51 are arranged in a matrix.

[0072] When the conductive pillar 51 is disposed on the substrate 10, the conductive pillar 51 is electrically connected to the ground layer of the substrate 10. When the package module has a plastic package 40, the plastic package 40 wraps the first device group 20, the second device group 30 and the plurality of conductive pillars 51. In addition, a groove is formed on the plastic package 40 (not shown in the figure, the shape of the groove can refer to the shape of the conductive glue 52), and the groove is used to accommodate the conductive glue 52. When the conductive glue 52 is filled into the groove, it is electrically connected to the conductive pillar 51 and forms an isolation wall 50.

[0073] When forming the slot body, a slot is opened between two adjacent rows of conductive pillars 51, and the length direction of the slot body is along direction b. Figure 2b The example in the figure shows that the slot body is a rectangular slot body, but the slot body provided in the embodiment of the present application can also adopt other shapes, such as oval, long waist and other different shapes. Regardless of the shape of the slot body, it should be ensured that only part of the side wall of each conductive column 51 is exposed in the slot body, and part is wrapped by the plastic package 40. Figure 2b Taking the rectangular slot body shown in the figure as an example, the bottom wall of the slot body is the bearing surface of the substrate 10, and part of the side wall of each conductive column 51 is exposed in the slot body, that is, part of the structure of each conductive column 51 protrudes into the slot body.

[0074] The slot body can be prepared by different processes. For example, the slot body can be formed by laser etching or other etching methods. The above-mentioned laser cutting uses a focused high-power density laser beam to irradiate the workpiece, so that the irradiated material quickly melts, vaporizes, ablates or reaches the ignition point, and at the same time uses a high-speed airflow coaxial with the beam to blow away the molten material, thereby achieving the workpiece. When using the laser cutting method, the accuracy of the slotting can be guaranteed, thereby ensuring that part of the side wall of the conductive column 51 is exposed in the slot body.

[0075] When the conductive glue 52 is filled in the slot, the entire slot is filled. The filled conductive glue 52 wraps the side wall of each conductive column 51 exposed in the slot and is conductively connected to the conductive column 51. Figure 2a and Figure 2bIt can be seen that when the conductive glue 52 is set, the conductive glue 52 is filled in the gap between any adjacent conductive columns 51, and any adjacent conductive columns 51 can be electrically connected through the conductive glue 52, so that the conductive columns 51 and the conductive glue 52 form a wall-like structure. Combined with the arrangement of the conductive columns 51 and the conductive glue 52, the isolation wall 50 can be regarded as using the conductive columns 51 as the main structure, and the conductive glue 52 as a connecting structure to connect multiple conductive columns 51 in series to form a wall structure. When the conductive columns 51 and the conductive glue 52 are selected, the conductivity of the conductive columns 51 is greater than the conductivity of the conductive glue 52, so that the conductivity of the isolation wall 50 is increased by the conductive columns 51. In addition, when the conductive columns 51 and the conductive glue 52 are mixed to form the isolation wall 50, the side of the conductive column 51 (the surface of the part of the side wall wrapped by the plastic package 40) can be used as an electromagnetic signal reflection surface, which improves the reflection of the electromagnetic signal by the isolation wall 50 and improves the isolation degree of the isolation wall 50.

[0076] As an optional solution, the area of ​​the part of the side wall of the conductive pillar 51 exposed in the slot body accounts for between 1 / 4 and 1 / 2 of the area of ​​the side wall of the conductive pillar 51, such as the area of ​​the part of the side wall of the conductive pillar 51 exposed in the slot body accounts for different proportions such as 1 / 2, 1 / 3, and 1 / 4 of the total area of ​​the side wall of the conductive pillar 51. When the above arrangement is adopted, the contact area between the conductive pillar 51 and the conductive adhesive 52 is guaranteed, the resistance of the isolation wall 50 is reduced, and at the same time, the amount of conductive adhesive 52 used can be reduced.

[0077] As an optional solution, the ratio of the total volume V1 of the plurality of conductive pillars 51 to the volume V2 of the isolation wall 50 is greater than or equal to 10% and less than or equal to 30%. The total volume V1 of the plurality of conductive pillars 51 is the sum of the volumes v of the plurality of conductive pillars 51; the volume V2 of the isolation wall 50 is the sum of the total volume V1 of the plurality of conductive pillars 51 and the volume V3 of the conductive glue 52. Exemplarily, the ratio of V1:V2 can be any value between 10% and 30%, such as 10%, 15%, 20%, 25%, 30%. When the above ratio is adopted, it can be ensured that the conductive pillars 51 provided can improve the conductivity of the entire isolation wall 50. In addition, when the conductive pillars 51 of the above ratio are adopted, when the total volume V2 of the isolation wall 50 remains unchanged, the amount of conductive glue 52 used can be reduced by 10% to 30% compared with the isolation wall of equal volume prepared by conductive glue in the prior art.

[0078] As an optional solution, the spacing between the conductive pillars 51 is greater than or equal to 50 μm and less than or equal to 100 μm, so as to meet the slotting process of the prior art, reduce the size of the slotting, and thus reduce the amount of conductive glue 52 used. Exemplarily, the spacing between the conductive pillars 51 can be any distance between 50 μm and 100 μm, such as 50 μm, 80 μm, 120 μm, 200 μm, 240 μm, 280 μm, 100 μm, etc. It should be understood that the spacing between the above-mentioned conductive pillars 51 includes both the spacing between two conductive pillars 51 adjacent to each other along direction a and the spacing between two conductive pillars 51 adjacent to each other along direction b.

[0079] The conductive column 51 can be made of different materials, such as copper, aluminum, iron, silver, gold and other common conductive materials. Preferably, the conductive column 51 is made of copper, which has good conductivity and low cost. When the conductive glue 52 is made of silver glue and the conductive column 51 is made of copper, the cost of the isolation wall 50 can be reduced. In addition, by adopting the above-mentioned arrangement of the conductive column 51 and the conductive glue 52, the amount of the conductive glue 52 can be reduced, further reducing the cost of the isolation wall 50.

[0080] The conductive column 51 can be in different shapes, such as a rectangular column, an elliptical column, a cylinder, etc. In the embodiment of the present application, the conductive column 51 is preferably a cylinder, which is convenient for preparation and convenient for connection with the conductive adhesive 52. In addition, the conductive column 51 can be a straight cylinder with a constant diameter, or a stepped column or a tapered column with a variable diameter, which can be determined according to actual needs in specific applications.

[0081] As an optional solution, when the conductive pillar 51 is a cylinder, the diameter of the conductive pillar 51 is greater than or equal to 20 μm and less than or equal to 50 μm, ensuring that the conductive pillar 51 has a certain volume. Exemplarily, the diameter of the conductive pillar 51 can be 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 5 μm, or any other size between 20 μm and 50 μm.

[0082] When the conductive pillars 51 are electrically connected to the ground layer of the substrate 10, each conductive pillar 51 is electrically connected to the ground layer through the pads on the substrate 10. When the conductive pillars 51 are connected to the pads, different methods can be used. Exemplarily, the conductive pillars 51 can be implanted in two rows of conductive pillars 51 on the substrate 10 through a wire bonding process. Wire bonding is a method of using thin metal wires to tightly weld metal wires to the pads of the substrate 10 using heat, pressure, and ultrasonic energy. Alternatively, the conductive pillars 51 can also be electrically connected through different welding methods such as argon arc welding and laser welding.

[0083] As an optional solution, the diameter of the pad on the substrate 10 is larger than the diameter of the conductive column 51. For example, the diameter of the pad can be 60 μm, 70 μm, 80 μm, etc., which are larger than the diameter of the conductive column 51. When a larger pad is used, it is convenient to weld the conductive column 51 with the pad, and the electrical connection effect between the conductive column 51 and the ground formation can be improved through the larger pad.

[0084] As an optional solution, part of the pads of the substrate 10 are exposed in the slot body, and when the conductive glue 52 is filled into the slot body, the conductive glue 52 can be electrically connected to the pads exposed in the slot body, thereby improving the effect of the electrical connection between the isolation wall 50 and the stratum, thereby improving the electromagnetic isolation effect of the isolation wall 50.

[0085] When the isolation wall 50 is electrically connected to the shielding cover 60, it includes but is not limited to the top and side walls of the isolation wall 50 being electrically connected to the top wall and side walls of the shielding cover respectively, the top of the isolation wall 50 being electrically connected to the top wall of the shielding cover 60, or the side end of the isolation wall 50 being electrically connected to the side wall of the shielding cover 60. Figure 2a A direction c is introduced, and the direction c is perpendicular to the bearing surface of the substrate 10, and the direction c is perpendicular to the direction a and the direction b. Figure 2a As shown, the height of the isolation wall 50 is along the direction c, and the top of the isolation wall 50 refers to the end face of the isolation wall 50 away from the substrate 10. When the isolation wall 50 is set, the top of the isolation wall 50 is electrically connected to the top surface of the shielding cover 60 (the surface of the shielding cover 60 facing the substrate 10 where the first device group 20 is set). When the shielding cover 60 adopts a metal layer, the isolation wall 50 is exposed outside the plastic package 40. When the metal layer is formed on the plastic package 40, it covers the top of the isolation wall 50 and is electrically connected to the isolation wall 50.

[0086] When the top of the isolation wall 50 is electrically connected to the top surface of the shielding cover 60, different methods can be used. For example, the shielding cover 60 is electrically connected to the isolation wall 50 only through the conductive adhesive 52, and the conductive column 51 is not directly electrically connected to the shielding cover 60. Figure 2aAs shown in , the shielding cover 60 covers the conductive glue 52 and is electrically connected to the conductive glue 52. There is a gap between the conductive column 51 and the shielding cover 60, and the conductive column 51 is electrically connected to the shielding cover 60 through the conductive glue 52. For example, the gap between the conductive column 51 and the shielding cover 60 is less than or equal to 300μm. Specifically, the size of the gap between the conductive column 51 and the shielding cover 60 along the direction c can be 10μm, 20μm, 50μm, 100μm, 120μm, 150μm, 200μm, 250μm, 290μm, 300μm, etc., any gap less than or equal to 300μm. When the above structure is adopted, the length of the conductive column 51 satisfies the minimum distance from the inner wall of the shielding cover 60 to be less than or equal to 300μm, ensuring that the conductive column 51 has a sufficient height to enhance the isolation effect between the first device group 20 and the second device group 30. When the isolation wall 50 is connected to the shielding cover 60, the conductive pillar 51 can also be used to connect to the shielding cover 60, that is, the top of the conductive pillar 51 contacts the inner wall of the shielding cover 60, and the two are directly connected. When the conductive pillar 51 is directly connected to the shielding cover 60, multiple conductive pillars 51 isolate the first device group 20 and the second device group 30, which can improve the isolation effect between the first device group 20 and the second device group 30.

[0087] To facilitate understanding of the effect of the isolation wall 50 provided in the embodiment of the present application, the following is combined with Figure 3 Explain it. Figure 3 The following table shows the simulation diagrams of different conductivity materials for different frequency signals. Figure 3 It can be seen that the electromagnetic shielding effectiveness of the structure with low conductivity is lower than that of the structure with high conductivity. For example, the shielding effectiveness for low-frequency signals will be 15db less, and the shielding effectiveness for high-frequency signals will be 2-8db less. The metal glue material in the prior art is a porous structure, and its conductivity is about 5e 5 S / m, which is lower than the conductivity of pure copper (5.7e 7 ) is about 2 orders of magnitude lower than that of the electromagnetic performance. However, the isolation wall 50 provided in this embodiment adopts a structure of a mixture of copper pillars and silver glue, which can improve the conductivity of the overall structure and thus bring about a better electromagnetic shielding effect.

[0088] To facilitate understanding of the preparation process of the packaging module provided in the embodiment of the present application, the preparation process is described in detail below.

[0089] The method for preparing the packaging module provided in the embodiment of the present application comprises the following steps:

[0090] Step 001: Arrange at least two device groups on a substrate;

[0091] like Figure 4aAs shown, the above steps include preparing a substrate 10, which can be a printed circuit board or other types of substrates. Regardless of the type of substrate used, the substrate 10 includes at least one metal circuit layer. The metal circuit layer includes a circuit layer and a ground layer for electrically connecting to at least two device groups. In addition, a plurality of pads are provided on the substrate 10, such as pads for electrically connecting to at least two device groups, and pads for electrically connecting to a shielding structure. Figure 4b As shown, when at least two device groups are provided, devices are mounted on the bearing surface of the substrate 10, such as Figure 4b The first device group 20 and the second device group 30 are shown in FIG. The devices in the device group may include various active and passive devices, chips, isolated components or component packages (packaged chips).

[0092] Step 002: a plurality of conductive pillars electrically connected to the ground layer of the substrate are arranged on the substrate 10; wherein the plurality of conductive pillars are arranged at intervals, and the plurality of conductive pillars isolate each two adjacent device groups;

[0093] like Figure 4c As shown, a signal isolation area is designed between two device groups, and two rows of conductive pillars 51 are implanted in the signal isolation area using a wire bonding process. Wire bonding is a process that uses thin metal wires and utilizes heat, pressure, and ultrasonic energy to tightly weld the metal leads to the pads on the substrate 10. The conductive pillars 51 can be copper pillars, the diameter of which can be 30 μm, and the diameter of the pads connected to the copper pillars can be 60 μm. The distance between the centers of two adjacent copper pillars is greater than or equal to 150 and less than or equal to 300 μm. In addition, the height of the copper pillars is not higher than the height of the plastic package of the entire system-level package, and the possible height range is 0.1 mm to 1.5 mm.

[0094] Step 003: filling the gaps between the plurality of conductive pillars with conductive glue and electrically connecting the gaps with the adjacent conductive pillars;

[0095] like Figure 4d As shown, a plastic package 40 is provided to wrap the first device group 20, the second device group 30 and the plurality of conductive pillars 51, so as to encapsulate the first device group 20, the second device group 30 and the plurality of conductive pillars 51. Exemplarily, the material of the plastic package 40 can be made of epoxy resin, acrylic resin material, dielectric material, thermosetting material, thermoplastic material, rubber or other insulating material. The preparation process can form an insulating layer in a molding tool by an injection process. When there are at least two device groups, the plastic package 40 wraps at least two device groups.

[0096] like Figure 4eAs shown, there is a slot between two adjacent rows of conductive pillars, part of the side wall of each conductive pillar is wrapped by the plastic package, and part of the side wall is exposed in the slot. Specifically, laser etching is used in the copper pillar area (between two adjacent rows of copper pillars) to etch the slot body 41. Exemplarily, a laser cutting process can be used. Laser cutting is to irradiate the workpiece with a focused high-power density laser beam, so that the irradiated material is quickly melted, vaporized, ablated or reaches the ignition point, and at the same time, the molten material is blown away by a high-speed airflow coaxial with the beam, thereby achieving the cutting of the workpiece. Based on the sensitivity of the material used in the plastic package 40 to the absorption of laser energy of different wavelengths, selective slotting can be achieved. When slotting, only the insulating material of the plastic package 40 can be selectively removed, while the conductive pillar 51 is retained. Thereby, part of the side wall of each conductive pillar 51 is exposed in the slot body 41. Optionally, the width of the groove is greater than or equal to 100 μm and less than or equal to 300 μm, such as 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, etc., any width between 100 μm and 300 μm. The width of the groove is the width of the groove body 41 along the arrangement direction of the first device group 20 and the second device group 30. Optionally, when the groove is formed, the top of the copper column may be exposed or not.

[0097] like Figure 4f As shown, a conductive glue is filled in the groove, and the conductive glue wraps the part of the side wall of each conductive column exposed in the groove. By filling the conductive glue 52 in the groove body, the conductive column 51 is electrically connected with the conductive glue 52, and an isolation wall 50 is formed. Specifically, the conductive glue 52 material is filled in the etched groove body. The partially exposed surface of the conductive column 51 and the conductive glue 52 material are electrically connected. The conductive glue 52 in the implementation case of the present application can be made of silver glue material. The silver glue has a certain fluidity. Under certain pressure and temperature conditions, it can fill the slot structure and ensure good contact with the conductive column 51. After filling the silver glue material, the silver glue material is thermally cured. Exemplarily, the curing process can be baked in an environment of 100 to 175 degrees Celsius for 0.5 to 2 hours.

[0098] Step 004: Prepare the shielding cover 60.

[0099] like Figure 4gAs shown, a shielding cover 60 is attached to the upper surface and side wall of the entire packaging module. Electrical conduction is achieved between the conductive adhesive 52 and the shielding cover 60. When preparing the shielding cover 60, a physical sputtering deposition process can be used. The shielding cover 60 can be a combination of a single layer of stainless steel layer and a copper layer or multiple layers. In addition to stainless steel, the material of the shielding cover 60 can also be other depositable metal materials, such as copper, nickel and aluminum. In addition, the shielding cover 60 can also be prepared by chemical vapor deposition of metal, electroplating and other methods. The prepared shielding cover 60 is electrically connected to the isolation wall 50 and the stratum of the substrate 10. The electrical connection method of the shielding cover 60 and the isolation wall 50 can refer to the relevant structural description in the above embodiment, which will not be repeated here.

[0100] It can be seen from the above description that in the packaging module prepared by the above preparation method, the isolation wall 50 is composed of the conductive column 51 and the conductive glue 52. On the one hand, the conductivity of the conductive column 51 is greater than that of the conductive glue 52, thereby improving the conductivity of the isolation wall 50; on the other hand, using the conductive column 51 as a part of the isolation wall 50 can reduce the use of the conductive glue 52, which can reduce the cost of the entire shielding structure, and thus reduce the cost of the entire packaging module.

[0101] Figure 5a and Figure 5b , Figure 5a A modified structure of the system-level package provided in an embodiment of the present application is shown. Figure 5b A top view of the separation wall 50 is shown. Figure 5a and Figure 5b Some of the numbers in the Figure 2a and Figure 2b The same number as in . Figure 5a and Figure 5b In the isolation wall 50 shown, a plurality of conductive columns 51 are arranged in two rows, the conductive columns 51 in each row are arranged along direction b, and the two rows of conductive columns are arranged along direction a. In the two rows of conductive columns 51, there is a gap between two adjacent conductive columns 51 along direction a, and there is also a gap between two adjacent conductive columns 51 along direction b. As an optional solution, the conductive columns 51 in the two rows of conductive columns 51 are staggered. That is, along direction b, the setting positions of the two rows of conductive columns 51 are staggered. When filling the conductive glue 52, the conductive glue 52 wraps the part of the side wall of each conductive column 51 exposed in the slot body. When adopting the method as shown in FIG. Figure 5b In the arrangement of the conductive pillars 51 shown, the two rows of staggered conductive pillars 51 expose more side walls of the conductive pillars 51 in the b direction, thereby providing more electromagnetic signal reflection surfaces and bringing about a better electromagnetic shielding effect.

[0102] Figure 6a and Figure 6b , Figure 6a A modified structure of the system-level package provided in an embodiment of the present application is shown. Figure 6b A top view of the separation wall 50 is shown. Figure 6a and Figure 6b Some of the numbers in the Figure 2a and Figure 2b The same number as in . Figure 6a and Figure 6b In the isolation wall 50 shown, a plurality of conductive pillars 51 are arranged in two rows. To fill the conductive glue 52, a filling hole is provided between each four adjacent conductive pillars 51, and a portion of the side wall of each conductive pillar 51 is exposed in the corresponding filling hole. Figure 6b Take the structure shown as an example. A filling hole is provided between any four adjacent conductive pillars 51, and the multiple filling holes are arranged along direction b. The filling holes are arranged alternately with a row of conductive pillars 51 (conductive pillars 51 arranged in a row along direction a). Each conductive pillar 51 corresponds to at least one filling hole, and part of the side wall of each conductive pillar 51 is exposed in the corresponding filling hole. Conductive glue 52 is filled in each filling hole, and the conductive glue 52 wraps the part of the side wall of each conductive pillar 51 exposed in the corresponding filling hole. Figure 6b Taking the structure shown in the figure as an example, the conductive glue 52 filled in each filling hole is electrically connected to the part of the side wall of each conductive column 51 exposed in the filling hole. By alternately arranging the filling holes and a row of conductive columns 51, multiple conductive columns 51 are conductively connected together. Figure 2a and Figure 2b The slotting method shown can further reduce the usage of silver paste, reduce the cost of the shielding structure, and also reduce the cost of the packaging module.

[0103] As an optional solution, the diameter of the filling hole can be greater than or equal to 100 μm and less than or equal to 300 μm. For example, the diameter of the filling hole can be 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, or any other size between 100 μm and 300 μm. When the above-mentioned hole diameter is adopted, the electrical connection effect between the conductive pillars 51 can be ensured, the resistance of the formed isolation wall 50 can be reduced, and the amount of conductive glue 52 used can be reduced as much as possible.

[0104] When the above structure is adopted, the corresponding preparation method is Figure 2a and Figure 2b The corresponding preparation methods are similar. The only difference is the step of filling the gaps between the conductive pillars 51 with conductive glue 52 and electrically connecting the conductive pillars 51. When the filling hole structure is adopted, this step can be adopted: setting a plastic package 40 to wrap the first device group 20, the second device group 30 and the plurality of conductive pillars 51. For specific solutions, please refer to Figure 4dA filling hole is opened between each of the four adjacent conductive pillars 51, and part of the side wall of each conductive pillar 51 is wrapped by the plastic package, and part of the side wall is exposed in the corresponding filling hole. The process of opening the hole can refer to the process of opening the slot body, which will not be described here. Conductive glue 52 is filled in the filling hole, and the conductive glue 52 wraps the conductive glue 52. The conductive glue 52 wraps the part of the side wall of each conductive pillar 51 exposed in the corresponding filling hole. The material and filling process of the conductive glue 52 can be referred to Figure 4e The relevant description in will not be repeated here.

[0105] Figure 7a and Figure 7b , Figure 7a A modified structure of the system-level package provided in an embodiment of the present application is shown. Figure 7b A top view of the separation wall 50 is shown. Figure 7a and Figure 7b Some of the numbers in the Figure 2a and Figure 2b The same number as in . Figure 7a and Figure 7b In the isolation wall 50 shown, a plurality of conductive columns 51 are arranged into three rows, each row of conductive columns 51 is arranged along direction b, and the three rows of conductive columns 51 are arranged along direction a. In the three rows of conductive columns 51, there is a gap between two adjacent conductive columns 51 along direction a, and there is also a gap between two adjacent conductive columns 51 along direction b. As an optional scheme, the conductive columns 51 in the three rows of conductive columns 51 are aligned one by one, that is, three conductive columns 51 are arranged in rows along direction a, and a plurality of conductive columns 51 are arranged in a matrix. The plastic package body 40 is provided with two slots, the two slots are arranged along direction b, and a row of conductive columns 51 is located between the two slots. Part of the side wall of each conductive column 51 is exposed in the corresponding slot, and when the conductive glue 52 is filled, the conductive glue 52 is electrically connected to the part of the side wall of the conductive column 51 exposed in the slot. By Figure 7a and Figure 7b It can be seen that in the isolation wall 50 provided in the embodiment of the present application, multiple rows of conductive pillars 51 may also be used, which can also achieve the effect of isolating the first device group 20 and the second device group 30 .

[0106] Figure 8a and Figure 8b , Figure 8a A modified structure of the system-level package provided in an embodiment of the present application is shown. Figure 8b A top view of the separation wall 50 is shown. Figure 8a and Figure 8b Some of the numbers in the Figure 2a and Figure 2b The same number as in . Figure 9a and Figure 9bIn the isolation wall 50 shown, a plurality of conductive pillars 51 are arranged into three rows, and each row of conductive pillars 51 is arranged along direction b, and the three rows of conductive pillars 51 are arranged along direction a. In the three rows of conductive pillars 51, there is a gap between two adjacent conductive pillars 51 along direction a, and there is also a gap between two adjacent conductive pillars 51 along direction b. As an optional scheme, the conductive pillars 51 in the three rows of conductive pillars 51 are aligned one by one, that is, three conductive pillars 51 are arranged in rows along direction a, and a plurality of conductive pillars 51 are arranged in a matrix. When the slot body is opened, part of the side walls of the plurality of conductive pillars 51 located in the outermost layer are exposed in the slot body; and the side walls of the conductive pillars 51 located in the middle are exposed in the slot body. When filling the conductive glue 52, the conductive glue 52 wraps the part of the side walls of the conductive pillars 51 located in the outermost layer that are exposed in the slot body. By Figure 8a and Figure 8b It can be seen that in the isolation wall 50 provided in the embodiment of the present application, multiple rows of conductive pillars 51 may also be used, which can also achieve the effect of isolating the first device group 20 and the second device group 30 .

[0107] Figure 9a and Figure 9b , Figure 9a A modified structure of the system-level package provided in an embodiment of the present application is shown. Figure 9b A top view of the separation wall 50 is shown. Figure 9a and Figure 9b Some of the numbers in the Figure 2a and Figure 2b The same number as in . Figure 9a and Figure 9b In the isolation wall 50 shown, a plurality of conductive pillars 51 are arranged in a single row. Figure 9b As shown in , multiple conductive pillars 51 are arranged along direction b and in a single row. Along direction b, there is a gap between adjacent conductive pillars 51. The conductive glue 52 is filled in the gap, and the conductive glue 52 and the multiple conductive pillars 51 are alternately arranged to electrically connect the multiple conductive pillars 51 into one. When the conductive glue 52 is specifically arranged, the plastic package 40 is provided with multiple filling holes, each of which is arranged between any two adjacent conductive pillars 51. Figure 9b As shown, multiple filling holes are arranged along direction b, and the filling holes and the conductive pillars 51 are arranged alternately. Each conductive pillar 51 corresponds to at least one filling hole, and part of the side wall of each conductive pillar 51 is exposed in the corresponding filling hole. When filling the conductive glue 52, the conductive glue 52 is filled in each filling hole, and the conductive glue 52 wraps the part of the side wall of each conductive pillar 51 exposed in the corresponding filling hole. That is, the conductive glue 52 in each filling hole wraps the part of the side wall of the conductive pillar 51 exposed in the filling hole. Figure 9b It can be seen from the structure shown that, by using the alternating arrangement of the conductive pillars 51 and the conductive adhesive 52 , an isolation wall 50 along the length direction b can also be formed to isolate the first device group 20 from the second device group 30 .

[0108] As an optional solution, the diameter of the filling hole can be greater than or equal to 100 μm and less than or equal to 300 μm. For example, the diameter of the filling hole can be 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, or any other size between 100 μm and 300 μm. When the above-mentioned hole diameter is adopted, the electrical connection effect between the conductive pillars 51 can be ensured, the resistance of the formed isolation wall 50 can be reduced, and the amount of conductive glue 52 used can be reduced as much as possible.

[0109] When the above structure is adopted, the corresponding preparation method is Figure 2a and Figure 2b The corresponding preparation methods are similar. The only difference is the step of filling the gaps between the conductive pillars 51 with conductive glue 52 and electrically connecting the conductive pillars 51. When the filling hole structure is adopted, this step can be adopted: setting a plastic package 40 to wrap the first device group 20, the second device group 30 and the plurality of conductive pillars 51. For specific solutions, please refer to Figure 4d A filling hole is opened between each two adjacent conductive pillars 51, and part of the side wall of each conductive pillar 51 is wrapped by the plastic package body, and part of the side wall is exposed in the corresponding filling hole. The process of opening the hole can refer to the process of opening the slot body, which will not be repeated here. The conductive glue 52 is filled in the filling hole, and the conductive glue 52 wraps the conductive glue 52 to wrap the part of the side wall of each conductive pillar 51 exposed in the corresponding filling hole. The material and filling process of the conductive glue 52 can be referred to Figure 4e The relevant description in will not be repeated here.

[0110] By the above Figure 2b , Figure 5b , Figure 6b , Figure 7b , Figure 8b It can be seen that the multiple conductive pillars 51 provided in the embodiment of the present application can be arranged in multiple rows, and the direction of each row is the length direction of the isolation wall. Conductive glue 52 is filled between two adjacent rows of conductive pillars 51, and the conductive glue 52 wraps part of the side wall of the conductive pillar 51, so that the multiple conductive pillars 51 can be electrically connected into one, forming an isolation wall 50. Of course, the conductive pillars 51 can also be arranged in a single row, such as Figure 9bAs shown in , it is also possible to electrically connect multiple conductive pillars 51 into one to form an isolation wall 50. It should be understood that in the several isolation walls 50 in the above examples, the isolation walls 50 are all arranged along a straight line. However, the isolation wall 50 used in the embodiment of the present application is not limited to the straight line type listed above, and other methods can also be used. It only needs to be a method in which the isolation wall 50 is mixed with the conductive pillars 51 and the conductive glue 52 to be applied in the embodiment of the present application. For example, the isolation wall 50 can also adopt other methods such as S-shaped, arc-shaped, wavy and other different shapes. When the isolation wall 50 adopts different shapes, the corresponding arrangement of the conductive pillars 51 and the filling method of the conductive glue 52 can be adapted to the shape of the isolation wall 50.

[0111] When there are multiple device groups, there may be multiple isolation walls 50, and the arrangement of the isolation walls 50 corresponds to the arrangement of the device groups. For example, when multiple device groups are arranged in an array, the isolation walls 50 may also form a grid, and each grid may accommodate one device group. Each grid may be surrounded by three, four, five, or other different numbers of isolation walls 50. When multiple device groups are arranged in a single row, there may be multiple isolation walls 50, and multiple isolation walls 50 are arranged in parallel, and a space for accommodating the device groups is isolated between two adjacent isolation walls 50.

[0112] The embodiment of the present application also provides an electronic device, which is an electronic device with communication function, such as a compact and portable electronic device, such as a smart phone, a smart watch, a wireless router, etc. These electronic devices include devices susceptible to radio frequency interference, such as Wifi, Bluetooth, and cellular signal-related radio frequency transceiver circuits; and other devices that need to use clock signals, such as processors, storage, etc.

[0113] The electronic device provided in the embodiment of the present application comprises a circuit board and any of the above-mentioned packaging modules, wherein the packaging module is fixed on the circuit board, and the circuit board is electrically connected to the substrate. Fig.10 Taking the smart watch shown as an example, the smart watch includes a housing 100, a circuit board 200 arranged in the housing 100, and a packaging module 300 arranged on the circuit board 200. The circuit board 200 is electrically connected to the substrate of the packaging module 300 to realize the function of the device in the substrate. As an option, the circuit board 200 can also be used as the substrate of the packaging module 300, thereby simplifying the structure in the electronic device. When the above structure is adopted, the isolation wall is formed by conductive columns and conductive glue. On the one hand, the conductive column is used as a part of the isolation wall, and the conductivity of the conductive column used is greater than that of the conductive glue, thereby improving the conductivity of the isolation wall; on the other hand, the conductive column is used as a part of the isolation wall, which can reduce the use of conductive glue, reduce the cost of the entire shielding structure, and thus reduce the cost of the entire electronic device.

[0114] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A packaging module, characterized in that: It comprises a substrate, at least two device groups arranged on the substrate, and a shielding structure for shielding the at least two device groups; The shielding structure comprises an isolation wall, wherein the isolation wall is used to electromagnetically isolate each two adjacent device groups of the at least two device groups; The isolation wall includes a plurality of conductive pillars and conductive glue, wherein the plurality of conductive pillars are electrically connected to the ground layer of the substrate; the plurality of conductive pillars are arranged at intervals, the conductive glue is filled in the gaps between each adjacent conductive pillar, and the conductive glue electrically connects the adjacent conductive pillars; The conductivity of the conductive column is greater than the conductivity of the conductive glue; The plurality of conductive pillars are arranged in a plurality of rows, and the direction of the rows is the length direction of the isolation wall; The packaging module further includes a plastic package, wherein the at least two device groups are both plastic-packaged in the plastic package, and a portion of the side wall of each conductive column is wrapped by the plastic package; There is a filling hole between every four adjacent conductive pillars, and part of the side wall of each conductive pillar is exposed in the corresponding filling hole; the conductive glue is filled in each filling hole, and the conductive glue wraps the part of the side wall of each conductive pillar exposed in the corresponding filling hole.

2. The packaging module according to claim 1, wherein: The shielding structure further includes a shielding cover, the shielding cover faces at least a portion of the surface of the substrate and is electrically connected to the ground layer of the substrate, and the at least two device groups are located in a space enclosed by the shielding cover and the substrate; The conductive adhesive is electrically connected to the shielding cover.

3. The packaging module according to claim 2, characterized in that: The conductive column contacts the inner wall of the shielding case.

4. The packaging module according to claim 2, characterized in that: There is a gap between the conductive column and the shielding cover, and the conductive glue fills the gap between the shielding cover and the conductive column.

5. The packaging module according to claim 3, characterized in that: When there is a gap between the conductive pillar and the shielding cover, the gap is less than or equal to 300 μm.

6. The packaging module according to any one of claims 1 to 5, characterized in that: A ratio of a total volume of the plurality of conductive pillars to a volume of the isolation wall is greater than or equal to 10% and less than or equal to 30%.

7. An electronic device, characterized in that: It comprises a circuit board and a packaging module as claimed in any one of claims 1 to 6, wherein the packaging module is fixed on the circuit board.

8. A method for preparing a packaging module, characterized in that: The following steps are involved: Disposing at least two device groups on a substrate; A plurality of conductive pillars electrically connected to the ground layer of the substrate are arranged on the substrate; wherein the plurality of conductive pillars are arranged at intervals, and the plurality of conductive pillars isolate each two adjacent device groups; Filling conductive glue in the gaps between the plurality of conductive pillars and electrically connecting adjacent conductive pillars; The conductive pillars and the conductive glue electromagnetically isolate every two adjacent device groups; A plurality of conductive pillars electrically connected to the ground layer of the substrate are arranged on the substrate; wherein the plurality of conductive pillars are arranged at intervals, and the plurality of conductive pillars isolate each two adjacent device groups; specifically: The plurality of conductive pillars are arranged in a plurality of rows; Disposing a plastic package to encapsulate the at least two device groups and the plurality of conductive pillars; A filling hole is opened between each of four adjacent conductive pillars, a part of the side wall of each conductive pillar is wrapped by the plastic package body, and a part of the side wall is exposed in the corresponding filling hole; The filling hole is filled with conductive glue, and the conductive glue wraps the part of the side wall of each conductive column exposed in the corresponding filling hole.

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