Resin molding device and method for manufacturing resin molded product

Abstract

The molding die, resin molding device and method for manufacturing a resin molded product of the present invention do not require an ejector pin for stripping off unnecessary resin to simplify the structure of the molding die, and are a molding die comprising an upper die (2) and a lower die (3) arranged opposite to each other, wherein a cavity (2a) for injecting resin material (J) is formed in the upper die (2), and a resin injection portion (4) for injecting resin material (J) into the cavity (2a) is provided in the lower die (3), and in order to avoid the need for an ejector pin to contact and strip off the unnecessary resin (K) remaining between the cavity (2a) and the resin injection portion (4), the contact area between the unnecessary resin (K) and the lower die (3) and the resin injection portion (4) is larger than the contact area between the unnecessary resin (K) and the upper die (2).

Description

Technical Field

[0001] The present invention relates to a forming die, a resin forming device and a method for manufacturing a resin formed product. Background Art

[0002] In the past, for example, as shown in Patent Document 1, in a molding die used in transfer molding, a pick pool ejector pin is provided on the upper mold for peeling off a pick pool of unnecessary resin from a pick pool block of the upper mold. In addition, a cavity ejector pin is also provided on the upper mold for peeling off a semiconductor device as a resin molded product from a mold cavity.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2014-41899 Summary of the invention

[0006] [Problems to be solved by the invention]

[0007] However, since the molding die is provided with a sump ejector pin and a cavity ejector pin, not only the number of parts increases, but also the structure of the molding die becomes complicated. In addition, in the case of a structure in which a semiconductor device as a resin molded product and a sump as an unnecessary resin are separated from the upper mold at different times, the sump ejector pin and the cavity ejector pin must be driven independently, thereby complicating the structure of the molding die.

[0008] Therefore, the present invention is made to solve the above-mentioned problems, and a main problem thereof is to simplify the structure of the molding die used in transfer molding by eliminating the need for an ejector pin for peeling off unnecessary resin.

[0009] [Technical means to solve the problem]

[0010] That is, the forming mold of the present invention includes a first mold and a second mold arranged opposite to each other, and in the forming mold, a mold cavity for injecting resin material is formed in at least one of the first mold or the second mold, and a resin injection part for injecting the resin material into the mold cavity is provided in the second mold, and in order to prevent the ejector pin from contacting the unnecessary resin remaining between the mold cavity and the resin injection part and being peeled off from the first mold, the contact area between the unnecessary resin and the second mold and the resin injection part is made larger than the contact area between the unnecessary resin and the first mold.

[0011] Furthermore, the resin molding apparatus of the present invention includes: the molding die described above; and a mold clamping mechanism for clamping the first mold and the second mold.

[0012] The resin molding device of the present invention includes: the molding mold; and a mold clamping mechanism, which clamps the first mold and the second mold, and the resin injection portion includes: a groove block, which is formed with a groove for accommodating the resin material, is arranged to be able to advance and retreat relative to the second mold via an elastic member, and includes an extension portion extending on the mold surface of the second mold; and a transfer mechanism, which includes a plunger arranged in the groove, and moves the plunger in a state where the first mold and the second mold are clamped to inject the resin material from the groove into the mold cavity, and in the mold opening action of the mold clamping mechanism to open the first mold and the second mold, the transfer mechanism moves the plunger toward the first mold to separate the resin molded product on the mold surface of the second mold from the unnecessary resin on the groove block.

[0013] The resin molding device of the present invention includes: the molding mold; a clamping mechanism for clamping the first mold and the second mold; and a conveying mechanism for moving the unnecessary resin on the slot block after resin molding, the resin injection portion includes: a slot block, which is arranged on the second mold, has a slot for accommodating the resin material, and includes an extension portion extending on the mold surface of the second mold; and a transfer mechanism, including a plunger arranged in the slot, which moves the plunger in a state where the first mold and the second mold are clamped to inject the resin material from the slot into the mold cavity, the conveying mechanism includes an unnecessary resin adsorption portion for adsorbing the unnecessary resin, after the conveying mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the slot block, the transfer mechanism moves the plunger toward the first mold to peel off the unnecessary resin from the slot block, and thereafter, the conveying mechanism uses the unnecessary resin adsorption portion to adsorb the unnecessary resin and move the unnecessary resin out.

[0014] Furthermore, a method for producing a resin molded product according to the present invention is a method for producing a resin molded product using the resin molding apparatus.

[0015] [Effects of the Invention]

[0016] According to the present invention thus constituted, it is possible to eliminate the need for an ejector pin for peeling off unnecessary resin, thereby simplifying the structure of the molding die used in transfer molding. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram showing the structure of a resin molding device according to one embodiment of the present invention.

[0018] Figure 2 It is a schematic diagram showing the structure of the forming module of the above-mentioned embodiment.

[0019] Figure 3(a) is a plan view schematically showing a tank block according to the embodiment, and (b) is a schematic view showing unnecessary resin.

[0020] Figure 4 (b) is a plan view schematically showing the structure of the transmission mechanism of the embodiment and (b) is a right side view.

[0021] Figure 5 It is a perspective view schematically showing the slot block and the recessed portion of the upper die facing the slot block according to the embodiment.

[0022] Figure 6 It is a schematic diagram showing a substrate mounting state and a resin material filling state of the molding module according to the embodiment.

[0023] Figure 7 It is a schematic diagram showing the mold clamping state of the molding module according to the above embodiment.

[0024] Figure 8 It is a schematic diagram showing a resin injection state of the molding module according to the embodiment.

[0025] Fig. 9 Schematic diagram showing a reference position X of the forming module according to the embodiment.

[0026] Fig.10 It is a schematic diagram showing the peeling state of the forming module of the above-mentioned embodiment.

[0027] Fig.11 It is a schematic diagram showing the state of the molding module at the start of the mold opening operation according to the above embodiment.

[0028] Fig.12 It is a schematic diagram showing a gate disconnection operation in a mold opening operation of the molding module according to the embodiment.

[0029] Fig.13 It is a schematic diagram showing a state after a gate is disconnected during a mold opening operation of the molding module according to the embodiment.

[0030] Fig.14 It is a schematic diagram showing the mold opening state of the forming module of the embodiment.

[0031] Fig.15 It is a schematic diagram showing a state in which each suction part of the unloader of the above-mentioned embodiment is in contact with a resin molded product and unnecessary resin.

[0032] Fig.16 This is a schematic diagram showing a state in which unnecessary resin rises and an unnecessary resin adsorption portion shrinks in the above embodiment.

[0033] Fig.17This is a schematic diagram showing a state in which the unloader of the above-mentioned embodiment absorbs and carries out resin molded products and unnecessary resin.

[0034] Fig.18 Schematic diagrams showing (a) a scraping position and (b) a loading position in the scraping operation of the embodiment.

[0035] Fig.19 It is a schematic diagram showing the structure of a forming module according to a modified embodiment.

[0036] Description of Reference Symbols 2: First die (upper die, forming die)

[0037] 2a, 3a: mold cavity

[0038] 2b, 3M: concave part

[0039] 2c, 3c: runner part 3: second mold (lower mold, forming mold)

[0040] 3b, 41b: Material removal pool

[0041] 4: Resin injection part

[0042] 5: Clamping mechanism

[0043] 11: Forming object supply unit

[0044] 12: Resin material supply department

[0045] 13: Transport device (loader)

[0046] 14: Storage section 15: Transport mechanism (transport device, unloader) 15a: Adsorption section for molded products

[0047] 15a1, 15b1: Adsorption opening

[0048] 15b: Adsorption section for unnecessary resin

[0049] 31, 41: slot block

[0050] 31a, 41a: Slot

[0051] 32, 33, 61: Ejector pin

[0052] 41c: Gate

[0053] 41d: Connection

[0054] 42: Transmission mechanism

[0055] 43: Elastic member

[0056] 62: Ejector plate

[0057] 63: Elastic member

[0058] 64: Return pin

[0059] 100: Resin molding device

[0060] 100A: Supply module

[0061] 100B: Forming module

[0062] 100C: Storage module

[0063] 101: Upper die holder

[0064] 102: Upper pressure plate

[0065] 103: Upper mold base plate

[0066] 104: Lower die holder

[0067] 105: Movable pressure plate

[0068] 106: Lower mold base plate

[0069] 151: Base member

[0070] 152: Keep Claw

[0071] 153: Mobile mechanism

[0072] 410: Cylindrical member

[0073] 411: Extension

[0074] 421: Plunger

[0075] 422: Fixed block

[0076] 423: Plunger drive unit

[0077] COM: Control Department

[0078] J: Resin material

[0079] K: Unnecessary resin

[0080] K1: Residue

[0081] KM: Unnecessary resin body

[0082] W1: Molding object

[0083] W2: Resin molded product (molding object)

[0084] Wx: Electronic parts

[0085] X: Reference position

[0086] Y: Peeling position DETAILED DESCRIPTION

[0087] Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following description.

[0088] As described above, the forming mold of the present invention includes a first mold and a second mold arranged opposite to each other, and the forming mold is formed with a mold cavity for injecting resin material in at least one of the first mold or the second mold, and a resin injection part for injecting the resin material into the mold cavity is provided in the second mold, and in order to prevent the ejector pin from contacting the unnecessary resin remaining between the mold cavity and the resin injection part and being peeled off from the first mold, the contact area between the unnecessary resin and the second mold and the resin injection part is made larger than the contact area between the unnecessary resin and the first mold.

[0089] According to the molding die, the contact area between the unnecessary resin and the second mold and the resin injection portion is larger than the contact area between the unnecessary resin and the first mold, so that the unnecessary resin can be peeled off from the first mold without using an ejector pin for peeling off the unnecessary resin from the first mold. As a result, the ejector pin for peeling off the unnecessary resin can be eliminated, thereby simplifying the structure of the molding die used in transfer molding.

[0090] As a specific structure of the resin injection part, it is considered that the resin injection part includes a groove block, the groove block is formed with a groove for accommodating the resin material, and includes a protruding part protruding on the mold surface of the second mold. By using the molding mold with such a structure, edge gate type transfer molding can be performed.

[0091] In the structure, as a specific implementation method for making the contact area between the unnecessary resin and the second mold and the resin injection part larger than the contact area between the unnecessary resin and the first mold, it is considered that the groove block includes a material removal pool portion formed corresponding to the groove, and the material removal pool portion contacts the bottom and side surfaces of the unnecessary resin.

[0092] In order to further increase the contact area between the unnecessary resin and the resin injection portion, it is desirable that a plurality of the grooves are formed in the groove block, and a plurality of the material removal pools are formed corresponding to the plurality of the grooves.

[0093] In order to further increase the contact area between the unnecessary resin and the resin injection portion, it is desirable that the groove block is formed with a connecting portion that connects the mutually adjacent ejection pool portions.

[0094] According to the above structure, the unnecessary resin remaining corresponding to each of the plurality of grooves can be connected by the connecting portion, so that the unnecessary resin on the groove block can be integrated after the resin is formed. Therefore, not only can the unnecessary resin be stably recovered, but also the structure of the conveying mechanism for recovering the unnecessary resin can be simple.

[0095] In addition, since the plurality of grooves are connected by the connecting portion, even if the transmission mechanism is configured to move the plurality of plungers by the same amount, the injection pressure of the resin material can be made uniform by the resin material injected from each groove moving back and forth in the connecting portion, so that the transmission mechanism does not need to include an isobaric mechanism. Thus, the structure of the transmission mechanism can be simplified.

[0096] In order to make the contact area between the unnecessary resin and the second mold and the resin injection portion larger than the contact area between the unnecessary resin and the first mold, the contact surface of the upper mold with the unnecessary resin may be a flat surface.

[0097] In order to easily peel the unnecessary resin from the first mold, the second mold preferably includes a recessed portion into which the resin that becomes a part of the unnecessary resin enters.

[0098] Furthermore, the resin molding apparatus of the present invention includes: the molding die described above; and a mold clamping mechanism for clamping the first mold and the second mold.

[0099] Furthermore, the resin molding device of the present invention includes: the molding mold; and a clamping mechanism for clamping the first mold and the second mold, the resin injection portion includes: a groove block, which is formed with a groove for accommodating the resin material, is arranged to be able to advance and retreat relative to the second mold via an elastic member, and includes an extension portion extending on the mold surface of the second mold; and a transfer mechanism, including a plunger arranged in the groove, and when the first mold and the second mold are clamped, the plunger is moved to inject the resin material from the groove to the mold cavity, and in the mold opening action of the clamping mechanism to open the first mold and the second mold, the transfer mechanism moves the plunger toward the first mold to separate the resin molded product on the mold surface of the second mold from the unnecessary resin on the groove block.

[0100] According to the above structure, the unnecessary resin on the groove block is pressed toward the first mold by the plunger, so the resin molded product can be reliably separated from the unnecessary resin without increasing the elastic force of the elastic member that moves the groove block forward and backward. In addition, since there is no need to increase the elastic force of the elastic member, the elastic member is prevented from being enlarged, and thus the molding die or the unnecessary resin is not enlarged.

[0101] In addition, in order to reliably separate the resin molded product from the unnecessary resin by utilizing the elastic force of the elastic member compressed when the mold is closed, it is ideal that the transfer mechanism moves the plunger toward the first mold during the mold opening action while the groove block moves toward the first mold due to the restoring force of the elastic member, thereby separating the resin molded product from the unnecessary resin.

[0102] In addition, the resin molding device of the present invention includes: the molding mold; a clamping mechanism for clamping the first mold and the second mold; and a conveying mechanism for moving the unnecessary resin on the groove block after resin molding, the resin injection part includes: a groove block, which is arranged on the second mold, has a groove for accommodating the resin material, and includes an extension extending on the mold surface of the second mold; and a transfer mechanism, which includes a plunger arranged in the groove, and moves the plunger in the state where the first mold and the second mold are clamped to inject the resin material from the groove to the mold cavity, the conveying mechanism includes an unnecessary resin adsorption part for adsorbing the unnecessary resin, after the conveying mechanism brings the unnecessary resin adsorption part into contact with the unnecessary resin on the groove block, the transfer mechanism moves the plunger toward the first mold to peel off the unnecessary resin from the groove block, and thereafter, the conveying mechanism uses the unnecessary resin adsorption part to adsorb the unnecessary resin and move the unnecessary resin out.

[0103] With the above-described structure, after the unnecessary resin adsorption portion is brought into contact with the unnecessary resin on the slot block, the plunger is moved toward the first mold to peel the unnecessary resin from the slot block, and then the unnecessary resin is adsorbed by the unnecessary resin adsorption portion, thereby stably recovering the unnecessary resin on the slot block.

[0104] In particular, in the present invention, the contact area between the slot block and the unnecessary resin is increased, which may make it difficult to peel off the unnecessary resin from the slot block. However, since a plunger is used to peel off the unnecessary resin from the slot block as in the above structure, the unnecessary resin on the slot block can be stably recovered.

[0105] Specifically, before the unnecessary resin is absorbed by the unnecessary resin absorption part, the unnecessary resin is peeled off from the slot block by the plunger, so even if the contact area between the unnecessary resin K and the slot block 41 is increased, the unnecessary resin absorbed by the unnecessary resin absorption part can be reliably recovered from the slot block. In addition, when the unnecessary resin is peeled off from the slot block by the plunger, the unnecessary resin absorption part contacts the unnecessary resin, so that poor absorption caused by the unnecessary resin tilting on the slot block can be prevented. Through the above, the unnecessary resin on the slot block can be stably recovered.

[0106] Even when the plunger is moved toward the first mold to peel the unnecessary resin from the groove block, if the plunger and the unnecessary resin are closely joined, there may be a problem in subsequent recovery of the unnecessary resin.

[0107] In order to solve the above problem, it is preferable that the transfer mechanism moves the plunger to the side opposite to the first mold to peel the unnecessary resin from the plunger before moving the plunger to the first mold to peel the unnecessary resin from the slot block.

[0108] According to the above structure, the plunger and the unnecessary resin are separated in advance, so the unnecessary resin can be easily recovered.

[0109] Ideally, the slot block is in a state of sandwiching the unnecessary resin between the slot block and the first mold by utilizing the restoring force of the elastic member during a specified period from the start of the mold opening action, and after the specified period, the unnecessary resin is peeled off from the first mold while maintaining the unnecessary resin.

[0110] According to the above structure, the resin molded product is separated from the unnecessary resin when the slot block sandwiches the unnecessary resin between the slot block and the first mold, thereby preventing the unnecessary resin from accidentally falling off from the slot block when they are separated. In addition, the unnecessary resin does not fall off from the slot block when they are separated, thereby preventing poor adsorption caused by the unnecessary resin tilting on the slot block.

[0111] Furthermore, a method for producing a resin molded product using the resin molding apparatus is also one embodiment of the present invention.

[0112] <One embodiment of the present invention>

[0113] Hereinafter, one embodiment of the resin molding device of the present invention will be described with reference to the accompanying drawings. In order to facilitate understanding, any of the following drawings are schematically depicted in an appropriately omitted or exaggerated manner. The same components are marked with the same reference numerals and the description thereof is appropriately omitted.

[0114] <Overall structure of resin molding device>

[0115] The resin molding apparatus 100 of the present embodiment performs resin molding of a molding target object W1 to which an electronic component Wx is connected by transfer molding using a resin material J.

[0116] Here, the molding object W1 includes, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, a wiring substrate, a lead frame, etc., regardless of whether or not there is wiring. In addition, the resin material J used for resin molding is, for example, a composite material containing a thermosetting resin, and the resin material J is in the form of particles, powder, liquid, sheet, or small pieces. Furthermore, the electronic component Wx connected to the upper surface of the molding object W1 is, for example, a bare chip or a chip sealed with resin.

[0117] Specifically, if Figure 1 As shown, the resin molding device 100 includes the following components as constituent elements: a supply module 100A, which supplies a molding object W1 and a resin material J before molding; a molding module 100B, which performs resin molding; and a storage module 100C, which stores a molding object W2 (hereinafter referred to as a resin molded product W2) after molding. Furthermore, the supply module 100A, the molding module 100B, and the storage module 100C are mutually detachable and replaceable relative to other constituent elements. In addition, the molding module 100B can be set to two or three, etc., to increase each constituent element.

[0118] The supply module 100A is provided with the following components: a forming object supply section 11 for supplying a forming object W1; a resin material supply section 12 for supplying a resin material J; and a conveying device 13 (hereinafter referred to as a loader 13) for receiving the forming object W1 from the forming object supply section 11 and conveying it to the forming module 100B, and for receiving the resin material J from the resin material supply section 12 and conveying it to the forming module 100B.

[0119] The loader 13 reciprocates between the supply module 100A and the forming module 100B, and moves along a rail (not shown) provided across the supply module 100A and the forming module 100B.

[0120] like Figure 2 As shown, the forming module 100B includes: a first mold 2 (hereinafter referred to as the upper mold 2), which is one of the forming molds having a mold cavity 2a for injecting a resin material J; a second mold 3 (hereinafter referred to as the lower mold 3), which is another of the forming molds arranged opposite to the upper mold 2 and provided with a resin injection portion 4 for injecting the resin material J into the mold cavity 2a; and a clamping mechanism 5 for clamping the upper mold 2 and the lower mold 3. The upper mold 2 is held by an upper mold holder 101, and the upper mold holder 101 is fixed to an upper platen 102. In addition, the upper mold 2 is mounted on the upper mold holder 101 via an upper mold base plate 103. The lower mold 3 is held by a lower mold holder 104, and the lower mold holder 104 is fixed to a movable platen 105 raised and lowered by the clamping mechanism 5. In addition, the lower mold 3 is mounted on the lower mold holder 104 via a lower mold base plate 106.

[0121] The resin injection unit 4 includes a slot block 41 having a slot 41a for receiving the resin material J and a transfer mechanism 42 including a plunger 421 disposed in the slot 41a. The slot 41a is formed by, for example, a cylindrical member 410. The cylindrical member 410 is inserted into a through hole formed in the slot block 41.

[0122] The slot block 41 is elastically supported by the elastic member 43 so as to be able to rise and fall relative to the lower mold 3. That is, the slot block 41 is provided so as to be able to rise and fall relative to the lower mold 3 via the elastic member 43. In addition, the elastic member 43 is provided on the lower side of the slot block 41.

[0123] In addition, at the upper end of the groove block 41, there is formed an extension portion 411 extending from the mold surface which is the upper surface of the lower mold 3. Furthermore, on the upper surface of the groove block 41, there are formed a material removal pool portion 41b and a gate portion 41c which serve as a resin flow path for introducing the resin material J injected from the groove 41a into the mold cavity 2a. In addition, when the upper mold 2 and the lower mold 3 are closed, the upper surface of the extension portion 411 contacts the upper mold 2, and the lower surface sandwiches the molding object W1 between the mold surface of the lower mold 3.

[0124] The slot block 41 of this embodiment is as follows Figure 3 As shown in (a), a plurality of grooves 41a are formed in a row, for example, in a straight line. Figure 3 (a) shows an example in which eight grooves 41a are formed in one groove block 41, but it is not limited thereto and can be changed as appropriate. In addition, a plurality of material removal pools 41b are formed on the upper surface of the groove block 41 corresponding to the plurality of grooves 41a, and a plurality of gates 41c are formed corresponding to the plurality of material removal pools 41b.

[0125] Furthermore, a connecting portion 41d is formed in the slot block 41 for connecting the unnecessary resin K remaining corresponding to the plurality of slots 41a. Furthermore, the unnecessary resin K is the resin that remains between the mold cavity 2a and the resin injection portion 4 and hardens after the resin is formed, and in the present embodiment, is the resin that remains on the slot block 41 and hardens. In addition, the connecting portion 41d connects mutually adjacent pick-up pool portions 41b and is, for example, in the shape of a slot. Here, the connecting portion 41d is formed to connect four consecutive pick-up pool portions 41b, thereby, as shown in FIG. Figure 3 As shown in (b), the plurality of unnecessary resins K remaining corresponding to the plurality of grooves 41a are divided into a plurality of groups (here, two groups) and connected. In addition, hereinafter, the plurality of unnecessary resins K connected together are also referred to as an unnecessary resin body KM.

[0126] The transfer mechanism 42 moves the plurality of plungers 421 in a state where the upper mold 2 and the lower mold 3 are clamped, and injects the resin material J from the plurality of grooves 41 a into the cavity 2 a .

[0127] The transmission mechanism 42 has a structure that does not include an isobaric mechanism such as an elastic member for making the injection pressure of the resin material J uniform, and moves the plurality of plungers 421 in the respective grooves 41 a by the same amount.

[0128] Specifically, the transmission mechanism 42 is particularly as follows Figure 4As shown, it includes: a plurality of plungers 421, which are arranged inside each of the plurality of grooves 41a and are used to pressurize the molten resin material J; a fixed block 422, which is used to fix the plurality of plungers 421; and a plunger driving unit 423, which moves the plurality of plungers 421 at the same amount by moving the fixed block 422.

[0129] The fixing block 422 is substantially in the shape of a rectangular parallelepiped, and a plurality of plungers 421 are fixed in a straight line on one side (upper surface) of the rectangular shape. The arrangement of the plurality of plungers 421 corresponds to the arrangement of the plurality of grooves 41a. Furthermore, the plurality of plungers 421 are fixed to the fixing block 422, for example, by fixing screws. Furthermore, the plurality of plungers 421 are mutually in the same shape.

[0130] The plunger driving unit 423 causes the plurality of plungers 421 to move up and down relative to the plurality of grooves 41a at the same amount of movement by causing the fixed block 422 to move up and down relative to the lower mold 3. The plunger driving unit 423 of this embodiment is disposed on the lower side of the fixed block 422. Here, as the plunger driving unit 423, for example, a combination of a servo motor and a ball screw mechanism or a combination of an air cylinder, a hydraulic cylinder and a rod can be used.

[0131] In the upper mold 2 Figure 2 As shown, a cavity 2a is formed, and the cavity 2a accommodates the electronic component Wx of the molding object W1 and is injected with molten resin material J. In addition, in the upper mold 2, a recess 2b is formed in the portion facing the groove block 41, and a runner portion 2c is formed to connect the material removal pool portion 41b and the gate portion 41c of the groove block 41 with the cavity 2a. Furthermore, although not shown in the figure, an exhaust port is formed in the upper mold 2 on the side opposite to the groove block 41. In addition, the runner portion 2c can be omitted, and the material removal pool portion 41b can be directly connected to the cavity 2a via the gate portion 41c.

[0132] In addition, a plurality of ejector pins 61 are provided in the upper mold 2, and the plurality of ejector pins 61 are used to demold the molded object W2 after resin molding from the upper mold 2. These ejector pins 61 are provided to penetrate the required parts of the upper mold 2 and can be raised and lowered relative to the upper mold 2, and are fixed to the ejector plate 62 provided on the upper side of the upper mold 2. The ejector plate 62 is provided on the upper pressing plate 102 or the like via an elastic member 63, and includes a return pin 64. When the mold is closed, the return pin 64 contacts the outside of the loading area of ​​the molded object W1 in the lower mold 3, thereby raising the ejector plate 62 relative to the upper mold 2. As a result, when the mold is closed, the ejector pin 61 is in a state of being retracted into the mold surface of the upper mold 2. On the other hand, when the mold is opened, as the lower mold 3 descends, the ejector plate 62 descends relative to the upper mold 2, and the ejector pin 61 uses the elastic force of the elastic member 63 to demold the resin molded product W2 from the upper mold 2.

[0133] When the upper mold 2 and the lower mold 3 are clamped by the clamping mechanism 5, the resin flow path including the material removal pool 41b, the gate portion 41c, the recessed portion 2b and the runner portion 2c connects the plurality of grooves 41a with the mold cavity 2a (see Figure 7 ). In addition, when the upper mold 2 and the lower mold 3 are molded together, the groove side end of the molding object W1 is sandwiched between the lower surface of the extension 411 of the groove block 41 and the mold surface of the lower mold 3. When the molten resin material J is injected into the mold cavity 2a using the plurality of plungers 421 in this state, the electronic component Wx of the molding object W1 is sealed with resin.

[0134] Furthermore, in the present embodiment, in order to eliminate the need for an ejector pin to come into contact with the unnecessary resin K and to peel off the unnecessary resin K from the upper mold 2, the contact area between the unnecessary resin K and the lower mold 3 and the resin injection portion 4 (especially the groove block 41) is made larger than the contact area between the unnecessary resin K and the upper mold 2.

[0135] Specifically, if Figure 3 and Figure 5 As shown, by forming a material removal pool portion 41b and a gate portion 41c in the groove block 41, the contact area between the groove block 41 and the unnecessary resin K is made larger than the contact area between the upper mold 2 and the unnecessary resin K. In particular, the material removal pool portion 41b is in contact with the bottom and side surfaces of the unnecessary resin K, and the recessed portion 2b of the upper mold 2 is in contact with the upper surface of the unnecessary resin K, so that the contact area between the groove block 41 and the unnecessary resin K is larger than the contact area between the upper mold 2 and the unnecessary resin K. In addition, the connecting portion 41d also contributes to the increase of the contact area between the groove block 41 and the unnecessary resin K. On the other hand, as Figure 5 As shown, the concave portion 2b of the upper mold 2 has a uniform cross-sectional shape corresponding to the upper surface shape of the groove block 41, and has no concave-convex structure in the front-to-back direction (the arrangement direction of the plurality of grooves 41a). Figure 5 The flow channel portion 2c is omitted in the figure.

[0136] like Figure 1 As shown, the storage module 100C is provided with a storage section 14 for storing the resin molded product W2 and a conveying device 15 (hereinafter referred to as an unloader 15 ) for receiving the resin molded product W2 from the molding module 100B and conveying it to the storage section 14 .

[0137] The unloader 15 reciprocates between the forming module 100B and the storage module 100C, and moves along a rail (not shown) provided across the forming module 100B and the storage module 100C.

[0138] <Operation of resin molding device 100>

[0139] Reference Figure 6 to Figure 17 The operation of the resin molding device 100 will be briefly described. Figure 6 to Figure 17 Only one side (left side) of the slot block 41 is shown, and the other side (right side) is omitted, but the state of the other side in each figure is the same as the state of one side. In addition, the following actions are performed by, for example, controlling each part by the control unit COM provided in the supply module 100A.

[0140] like Figure 6 As shown in FIG. 1 , in the state where the upper mold 2 and the lower mold 3 are opened, the loader 13 conveys the molding object W1 before molding, and transfers it to the lower mold 3 and places it. At this time, the upper mold 2 and the lower mold 3 are heated to a temperature at which the resin material J can be melted and hardened. Thereafter, the resin material J is conveyed by the loader 13 and accommodated in the plurality of grooves 41a of the groove block 41.

[0141] In the above state, when the lower mold 3 is raised by the mold clamping mechanism 5, Figure 7 As shown in FIG. 1 , the groove block 41 contacts the upper mold 2 and descends relative to the lower mold 3, and the lower surface of the protruding portion 411 contacts the groove side end of the molding object W1. In addition, the lower surface of the upper mold 2 contacts the outer peripheral portion of the molding object W1 that is not contacted by the protruding portion 411. In this way, the upper mold 2 and the lower mold 3 are molded together. After the mold is closed, when the transmission mechanism 42 uses the plunger driving unit 423 to raise the plurality of plungers 421, as shown in FIG. Figure 8 As shown in FIG. 1 , the molten resin material J in the plurality of grooves 41a is injected into the cavity 2a through the resin passage. At this time, the injection pressure of the resin material J injected from each groove 41a becomes uniform through the connecting portion 41d. Then, after a predetermined molding time has passed and the resin material J has hardened in the cavity 2a, the clamping mechanism 5 opens the upper mold 2 and the lower mold 3.

[0142] Here, the resin molding apparatus 100 of the present embodiment performs an operation (gate breaking operation) of separating the resin molded product W2 from the unnecessary resin K during the mold opening operation in which the mold clamping mechanism 5 opens the upper mold 2 and the lower mold 3 .

[0143] For example, just before the molding time is about to pass (before the start of the mold opening action), Fig. 9 As shown, the transmission mechanism 42 reduces the force of the plurality of plungers 421 pressing the unnecessary resin K to a predetermined force (e.g., a relatively small force that can maintain the contact state between the plurality of plungers 421 and the unnecessary resin K without peeling off). The pressing force of the plurality of plungers 421 is measured by a force sensor (including a weight sensor, a load cell, etc.) such as a load cell (not shown) provided on a driving shaft (transmission shaft) of the plunger driving unit 423.

[0144] Then, the control unit COM stores the position of the plunger 421 when the force becomes the predetermined value as the reference position X (refer to Fig. 9The reference position X is a position that serves as a reference for the gate disconnection operation described later and the demolding / recovery of the unnecessary resin K. The reference position X is not limited to the position of the plunger 421, and may be set to the position of other components such as the drive shaft (transmission shaft) of the plunger drive unit 423 connected to the plunger 421.

[0145] Then, before the mold opening operation begins, Fig.10 As shown in FIG. 1 , the transmission mechanism 42 causes the plurality of plungers 421 to descend to the side opposite to the upper mold 2 and to descend to a predetermined peeling position Y. By causing the plurality of plungers 421 to descend to the peeling position Y, the upper surfaces of the plurality of plungers 421 are peeled off from the lower surface of the unnecessary resin K. After the peeling action, the transmission mechanism 42 causes the plurality of plungers 421 to ascend to the reference position X. At this time, the upper surfaces of the plurality of plungers 421 are in contact with the lower surface of the unnecessary resin K ( Fig. 9 status).

[0146] Then, if Fig.11 As shown, the mold clamping mechanism 5 starts the descent of the lower mold 3 and starts the mold opening action. When the mold clamping mechanism 5 starts the mold opening action and the clamping force is reduced to a specified value (different from the specified value in the transmission mechanism 42), as shown in FIG. Fig.12 As shown, the transmission mechanism 42 causes the plurality of plungers 421 to rise toward the upper mold 2. As a result, the unnecessary resin K on the groove block 41 is pressed toward the upper mold 2 by the plurality of plungers 421. Furthermore, the clamping force is measured by a force sensor (including a weight sensor, a load sensor, etc.) such as a load sensor (not shown) provided on the clamping shaft of the mold clamping mechanism 5.

[0147] In addition, when the transmission mechanism 42 causes the plurality of plungers 421 to rise to the upper mold 2, as shown in FIG. Fig.12 As shown, the slot block 41 is subjected to the restoring force, i.e., the elastic force, of the compressed elastic member 43 and rises from the lower mold 3 to the upper mold 2. That is, in the mold opening operation, while the slot block 41 is subjected to the elastic force of the elastic member 43 and rises from the lower mold 3 to the upper mold 2, the transmission mechanism 42 causes the plurality of plungers 421 to rise from the lower mold 3 to the upper mold 2.

[0148] Furthermore, during the mold opening operation, the timing at which the slot block 41 begins to rise from the lower mold 3 to the upper mold 2 due to the elastic force of the elastic member 43 and the timing at which the plurality of plungers 421 begin to rise from the lower mold 3 to the upper mold 2 using the transmission mechanism 42 may be the same or different.

[0149] By utilizing the rise of the plurality of plungers 421 of the transmission mechanism 42 and the rise of the slot block 41 utilizing the elastic force of the elastic member 43, as shown in FIG. Fig.13 As shown, the resin molded product W2 on the mold surface of the lower mold 3 is separated from the unnecessary resin K on the groove block 41 (gate disconnection).

[0150] At this time, the resin molded product W2 on the lower mold 3 is pressed toward the mold surface of the lower mold 3 by the ejector pin 61 provided on the upper mold 2, and the lower surface of the resin molded product W2 is in close contact with the mold surface of the lower mold 3 (refer to Fig.12 The ejector pin 61 functions as a pressing member for pressing the resin molded product W2 against the mold surface of the lower mold 3 when separating the resin molded product W2 from the unnecessary resin K. Since the resin molded product W2 is pressed against the mold surface of the lower mold 3 by the pressing member as described above, shear stress is easily applied between the resin molded product W2 and the unnecessary resin K, and the gate is easily disconnected.

[0151] Here, the ejector pin 61 as the pressing member presses the resin molded product W2 against the mold surface of the lower mold 3 at least until the resin molded product W2 is separated from the unnecessary resin K. In other words, during the mold opening operation, while the ejector pin 61 is pressing the resin molded product W2, the separation of the resin molded product W2 from the unnecessary resin K is completed by the rise of the groove block 41 and the rise of the plunger 421.

[0152] In the gate cutoff, the unnecessary resin K is sandwiched between the upper surface of the slot block 41 pressed upward by the elastic force of the elastic member 43 and the lower surface of the upper mold 2 (see Fig.12 and Fig.13 ). That is, the groove block 41 is in a state of sandwiching unnecessary resin K between the upper mold 2 and the groove block 41 by the elastic force of the elastic member 43 during a predetermined period from the start of the mold opening operation. The so-called predetermined period is at least a period until the gate is disconnected and the lower mold 3 is lowered to the initial state (the state before being pressed and compressed by the upper mold 2) of the elastic member 43.

[0153] Then, after a predetermined period of time, the lower mold 3 is further lowered by the mold clamping mechanism 5. Fig.14 As shown, the groove block 41 peels the unnecessary resin K from the upper mold 2 while retaining the unnecessary resin K. Here, the groove block 41 is formed with a material removal pool 41b and a gate 41c, and the contact area between the groove block 41 and the unnecessary resin K is larger than the contact area between the upper mold 2 and the unnecessary resin K, so that the unnecessary resin K is not peeled off from the groove block 41, but is peeled off from the upper mold 2. In this way, in this embodiment, the timing of peeling the unnecessary resin K from the upper mold 2 by using the groove block 41 is later than the timing of peeling the resin molded product W2 from the upper mold 2 by using the ejector pin 61.

[0154] Furthermore, as the transmission mechanism 42 raises the plurality of plungers 421 toward the upper die 2 , the extension portion 411 of the slot block 41 changes from a state where the resin molded product W2 is sandwiched between the die surface of the lower die 3 to a state where the extension portion 411 is not in contact with the resin molded product W2 .

[0155] In addition to the gate disconnection, the transmission mechanism 42 causes the plurality of plungers 421 to rise toward the upper mold 2 until the elastic member 43 on the lower side of the slot block 41 returns to the initial state before the mold is closed (see Fig.14 ). Thus, in the next resin molding, when the molding object W1 is placed on the lower side of the protruding portion 411, the protruding portion 411 does not become an obstacle.

[0156] After the mold opening operation is performed as described above and the resin molded product W2 is separated from the unnecessary resin K, Figure 15 to Figure 17 As shown, the resin molded product W2 and unnecessary resin K are unloaded by the unloader 15 .

[0157] like Fig.15 As shown, the unloader 15 includes a suction portion 15a for molded products and a suction portion 15b for unnecessary resin. The suction portion 15a for molded products and the suction portion 15b for unnecessary resin both include suction pads made of resin, and in particular, the suction portion 15b for unnecessary resin is, for example, a bellows type (also called an accordion type), and has better elasticity than the suction portion 15a for molded products. In addition, the suction portion 15a for molded products and the suction portion 15b for unnecessary resin are arranged on the base member 151, and are connected to a suction source such as a suction pump not shown. The suction portion 15a for molded products sucks air using the suction source, thereby sucking the resin molded product W2 at its suction opening 15a1. The suction portion 15b for unnecessary resin sucks air using the suction source, thereby sucking the unnecessary resin K at its suction opening 15b1.

[0158] Furthermore, at least the molded product suction unit 15a is configured to be movable in the left-right direction and the up-down direction relative to the base member 151 by a moving mechanism 153. The moving mechanism 153 includes: a left-right direction moving unit including, for example, a rail and a slider for moving the molded product suction unit 15a in the left-right direction; and an up-down direction moving unit including, for example, a rail and a slider for moving the molded product suction unit 15a in the up-down direction. In addition, the unloader 15 is provided with a holding claw 152 for holding the resin molded product W2 sucked by the molded product suction unit 15a and preventing it from falling.

[0159] After the mold opening operation is completed, the unloader 15 is moved between the upper mold 2 and the lower mold 3. Fig.15As shown, the suction opening 15a1 of the molded product suction part 15a is brought into contact with the upper surface of the resin molded product W2, and the suction opening 15b1 of the unnecessary resin suction part 15b is brought into contact with the upper surface of the unnecessary resin K. Here, the transfer mechanism 42 raises the plunger 421 toward the upper mold 2 until the elastic member 43 returns to the initial state, so that the front and rear groove blocks 41 do not rise accidentally before and after the unnecessary resin suction part 15b is brought into contact with the unnecessary resin, thereby enabling stable recovery of the unnecessary resin K.

[0160] In the above state, Fig.16 As shown, the transfer mechanism 42 causes the plurality of plungers 421 to rise and lift the unnecessary resin K from the groove block 41. Here, in the case where the unnecessary resin K remains in the plurality of grooves 41a, the residual portion K1 rises to a degree that does not hinder the recovery of the unnecessary resin K. As a result, the unnecessary resin K is demolded from the groove block 41 and is in close contact with the unnecessary resin adsorption portion 15b. At this time, the unnecessary resin adsorption portion 15b is elastically deformed and shrunk in a state where the adsorption opening 15b1 is in contact with the unnecessary resin K.

[0161] Here, the slot block 41 is as shown in FIG. Figure 3 The plurality of pick pools 41b shown in (a) are connected to each other by connecting portions 41d, so that Figure 3 As shown in (b), the unnecessary resin K becomes an unnecessary resin body KM connected across a plurality of pick pools 41b, thereby reducing the number of unnecessary resins K separated from each other on the slot block 41. Accordingly, the number of unnecessary resin adsorption parts 15b can also be reduced.

[0162] After the unnecessary resin suction part 15b is set to the contracted state, suction of the unnecessary resin suction part 15b is started, and the suction opening 15b1 of the unnecessary resin suction part 15b suctions the unnecessary resin K. In addition, suction of the molded product suction part 15a is started, and the suction opening 15a1 of the molded product suction part 15a suctions the resin molded product W2.

[0163] Then, if Fig.17 As shown in FIG. 1 , the molded product adsorption portion 15a adsorbing the resin molded product W2 is moved in a direction away from the tank block 41 by the moving mechanism 153, so that the resin molded product W2 is moved outside the extension portion 411. Thereafter, the unloader 15 is raised and then withdrawn from the upper mold 2 and the lower mold 3. Thus, the resin molded product W2 and the unnecessary resin K are carried out by the unloader 15. Here, as described above, the unnecessary resin K is separated from the plunger 421 before being separated from the tank block 41, so that the unnecessary resin K can be easily recovered.

[0164] Here, the unloader 15 may include a cleaning mechanism (not shown) for cleaning the upper mold 2 and the lower mold 3. The cleaning mechanism may include a rotating brush and a suction unit that sucks and discharges dust.

[0165] In this case, the unloader 15 having sucked the resin molded product W2 and unnecessary resin K stays between the upper mold 2 and the lower mold 3 and performs a cleaning operation.

[0166] Here, first, the transfer mechanism 42 performs the action of scraping out the resin adhering to the plurality of grooves 41a. Fig.18 As shown, the transmission mechanism 42 raises the plurality of plungers 421 to a predetermined scraping position. Here, the predetermined scraping position is, for example, a position where the upper surface of the plunger 421 is located above the opening position of the groove 41a. Then, the transmission mechanism 42 is lowered from the predetermined scraping position to a loading position for accommodating the resin material J. Thereafter, the transmission mechanism 42 again raises the plurality of plungers 421 to the predetermined scraping position. Thus, the resin attached to the plurality of grooves is scraped out of the plurality of grooves 41a.

[0167] Thereafter, the upper mold 2, the lower mold 3, the groove block 41 and the plurality of plungers 421 are cleaned by a cleaning mechanism provided in the unloader 15. After the cleaning operation is completed, the unloader 15 withdraws from the upper mold 2 and the lower mold 3 to carry out the resin molded product W2 and unnecessary resin K.

[0168] <Effects of the present embodiment>

[0169] According to the resin molding device 100 of the present embodiment, the contact area between the unnecessary resin K and the lower mold 3 and the resin injection portion 4 is made larger than the contact area between the unnecessary resin K and the upper mold 2, so that the unnecessary resin K can be peeled off from the upper mold 2 without using an ejector pin for peeling off the unnecessary resin K from the upper mold 2. As a result, the ejector pin for peeling off the unnecessary resin K is not required, so that the structure of the molding mold 2 and the molding mold 3 used in the transfer molding can be simplified.

[0170] In addition, the removal pool portion 41b formed in the groove block 41 contacts the bottom and side surfaces of the unnecessary resin K, so that the contact area between the unnecessary resin K and the lower mold 3 and the resin injection portion 4 can be made larger than the contact area between the unnecessary resin K and the upper mold 2 without complicating the structure of the lower mold 3.

[0171] Here, the groove block 41 is formed with a connecting portion 41d that connects the mutually adjacent pick pool portions 41b, so that the contact area between the unnecessary resin K and the groove block 41 can be further increased. In addition, the unnecessary resin K remaining corresponding to each of the plurality of grooves 41a can be connected by the connecting portion 41d, so that the unnecessary resin K on the groove block 41 can be integrated after the resin is formed. Therefore, not only can the unnecessary resin K be stably recovered, but also the structure of the unloader 15 for recovering the unnecessary resin K can be simple.

[0172] In addition, since the plurality of grooves 41a are connected by the connecting portion 41d, even if the transmission mechanism 42 is configured to move the plurality of plungers 421 by the same amount, the injection pressure of the resin material J can be made uniform by the resin material J injected from each groove 41a moving back and forth in the connecting portion 41d, and the transmission mechanism 42 does not need to include an isobaric mechanism. Thus, the structure of the transmission mechanism 42 can be simplified.

[0173] In addition, in the present embodiment, the unnecessary resin K is peeled off from the tank block 41 by the plunger 421 before the unnecessary resin adsorption portion 15b adsorbs the unnecessary resin K. Therefore, even if the contact area between the unnecessary resin K and the tank block 41 is increased, the unnecessary resin K adsorbed by the unnecessary resin adsorption portion 15b can be reliably recovered from the tank block 41. In addition, when the unnecessary resin K is peeled off from the tank block 41 by the plunger 421, the unnecessary resin adsorption portion 15b contacts the unnecessary resin K, so that poor adsorption caused by the unnecessary resin K tilting on the tank block 41 can be prevented. With the above, the unnecessary resin K on the tank block 41 can be stably recovered.

[0174] Here, in this embodiment, before the unnecessary resin K is peeled off from the groove block 41, the plunger 421 is lowered to the side opposite to the upper mold 2, and the lower surface of the unnecessary resin K is peeled off from the upper surface of the plunger 421, so that the separated unnecessary resin K can be easily recovered.

[0175] In addition, in the present embodiment, when the unnecessary resin K is peeled off from the groove block 41, the unnecessary resin adsorption portion 15b is elastically deformed and contracted while being in contact with the unnecessary resin K, so that the unnecessary resin adsorption portion 15b can be maintained in contact with the unnecessary resin K without hindering the peeling of the unnecessary resin K from the groove block 41. Therefore, the unnecessary resin K after peeling can be reliably adsorbed.

[0176] Furthermore, in this embodiment, the unloading machine 15 includes a suction portion 15a for the molded product and a suction portion 15b for the unnecessary resin, so that the resin molded product W2 and the unnecessary resin K can be carried out at one time using a common conveying mechanism, thereby shortening their carrying-out time and simplifying the structure of the resin molding device 100.

[0177] In addition, in the present embodiment, during the mold opening operation, while the groove block 41 is lifted by the elastic force of the elastic member 43, the transmission mechanism 42 lifts the plunger 421 to separate the resin molded product W2 from the unnecessary resin K. Therefore, the elastic force of the elastic member 43 compressed during mold closing can be used to reliably separate the resin molded product W2 from the unnecessary resin K. In addition, since the plunger 421 is used to separate the resin molded product W2 from the unnecessary resin K, it is not necessary to increase the elastic force of the elastic member 43, thereby preventing the elastic member 43 from being enlarged, and further does not cause the molding die 2, the molding die 3 to be enlarged or the unnecessary resin K to be enlarged.

[0178] Furthermore, in the present embodiment, the unnecessary resin K is sandwiched between the groove block 41 and the upper mold 2 during the period from the start of the mold opening operation to the completion of the gate disconnection, so that the unnecessary resin K can be prevented from accidentally falling off from the groove block 41 due to the reaction of the unnecessary resin K being separated from the resin molded product W2. In addition, the unnecessary resin K does not fall off from the groove block 41 during their separation, so that poor adsorption caused by the unnecessary resin K tilting on the groove block can be prevented.

[0179] <Other Modified Embodiments>

[0180] Furthermore, the present invention is not limited to the above-described embodiments.

[0181] For example, in the embodiment, before the resin molded product W2 is separated from the unnecessary resin K, the plunger 421 is lowered to peel off the upper surface of the plunger 421 from the lower surface of the unnecessary resin K, but the plunger 421 may be lowered to peel off the upper surface of the plunger 421 from the lower surface of the unnecessary resin K after the resin molded product W2 is separated from the unnecessary resin K and before the groove block 41 is peeled off from the unnecessary resin K.

[0182] In the above embodiment, the plunger 421 is raised when separating the resin molded product W2 from the unnecessary resin K. However, the resin molded product W2 and the unnecessary resin K may be separated only by the elastic member 43 without raising the plunger 421 .

[0183] Furthermore, in the above-described embodiment, the resin molded product W2 and the unnecessary resin K are both carried out by the common unloading machine 15, but the following structure may be provided: a conveying mechanism for carrying out the resin molded product W2 and a conveying mechanism for carrying out the unnecessary resin K are included separately.

[0184] In addition, in the embodiment, the following structure is set: before the resin molded product W2 is separated from the unnecessary resin K, the resin molded product W2 is pressed against the mold surface of the lower mold 3 using the ejector pin 61 provided on the upper mold 2, but in addition to the ejector pin 61, a pressing member for pressing the resin molded product W2 against the mold surface of the lower mold 3 may also be provided.

[0185] Furthermore, in the embodiment, a removal pool portion 41b, a gate portion 41c and a connecting portion 41d are formed in the groove block 41, but if the structure is to make the contact area between the unnecessary resin K and the lower mold 3 and the resin injection portion 4 larger than the contact area between the unnecessary resin K and the upper mold 2, the removal pool portion, the gate portion or the connecting portion may be formed in the upper mold 2.

[0186] The resin molding apparatus of the above embodiment performs edge gate type transfer molding by including the extension portion 411 in the groove block 41, but it may also be Fig.19 As shown in FIG. 1 , transfer molding of the side gate type is performed. Fig.19 In FIG. 1 , the cavity 3 a is formed not only in the upper mold 2 but also in the lower mold 3 .

[0187] exist Fig.19 In the forming molds 2 and 3 shown, a material removal pool portion 3b and a flow channel portion 3c are formed in the lower mold 3, and a groove block 31 is provided in such a manner that a groove 31a opens at the bottom surface of the material removal pool portion 3b. On the other hand, the portion of the upper mold 2 facing the material removal pool portion 3b, the flow channel portion 3c and the groove block 31 is a flat surface. Thus, the contact area between the unnecessary resin K and the lower mold 3 and the resin injection portion 4 is made larger than the contact area between the unnecessary resin K and the upper mold 2. Here, the material removal pool portion 3b and the flow channel portion 3c of the lower mold 3 are in contact with the bottom and side surfaces of the unnecessary resin K, and the flat surface of the upper mold 2 is in contact with the upper surface of the unnecessary resin K. As a result, an ejector pin for contacting the unnecessary resin K and peeling the unnecessary resin K from the upper mold 2 is no longer necessary. Furthermore, in Fig.19 In the embodiment, in addition to the ejector pin 32 for peeling the resin molded product from the lower mold 3, the lower mold 3 is also provided with an ejector pin 33 for peeling the unnecessary resin K from the lower mold 3. Furthermore, instead of the ejector pin 33 for peeling the unnecessary resin K from the lower mold 3, the plunger 421 may be used to peel the unnecessary resin K from the lower mold 3. Fig.19In order to make it easier to peel the unnecessary resin K from the upper mold 2, a recess 3M for the resin that becomes a part of the unnecessary resin K to enter is formed in the lower mold 3 or the groove block 31, but the recess 3M may not be provided.

[0188] The resin molding apparatus of the present invention is not limited to ordinary transfer molding, and may be any structure as long as it includes a transfer mechanism.

[0189] In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

Claims

1. A resin molding device, comprising: The forming die includes a first die and a second die arranged facing each other; and a mold clamping mechanism for clamping the first mold and the second mold, and A cavity for injecting a resin material is formed in at least one of the first mold or the second mold. The second mold is provided with a resin injection portion for injecting the resin material into the mold cavity. The resin injection part includes: a slot block having a plurality of slots for receiving the resin material, being arranged to be able to advance and retreat relative to the second die via an elastic member, and including a protruding portion protruding on a die surface of the second die; as well as a transfer mechanism including a plunger disposed in the groove, wherein the plunger is moved when the first mold and the second mold are in a clamped state to inject the resin material from the groove into the mold cavity, The groove block is formed with a plurality of material removal pools corresponding to the plurality of grooves, a plurality of gates corresponding to the plurality of material removal pools, and a connecting portion connecting the mutually adjacent material removal pools. The connecting portion connects the unnecessary resin remaining corresponding to each of the plurality of grooves. The first mold has a uniform cross-sectional shape corresponding to the upper surface shape of the slot block and has no concave-convex structure in the arrangement direction of the plurality of slots. The sprue pool, the gate, and the connection portion of the molding die are in contact with the bottom and side surfaces of the unnecessary resin, and the first mold is in contact with the upper surface of the unnecessary resin. After the resin material injected into the mold cavity hardens, the plurality of plungers are lowered by the transfer mechanism to peel off the plungers from the unnecessary resin, and the clamping mechanism starts the mold opening operation of opening the first mold and the second mold. The groove block is moved toward the first mold by the restoring force of the elastic member, and the resin molded product on the mold surface of the second mold is separated from the unnecessary resin on the groove block while the unnecessary resin is sandwiched between the groove block and the first mold. Thereafter, the groove block peels off the unnecessary resin from the first mold while holding the unnecessary resin.

2. The resin molding device according to claim 1, comprising: The conveying mechanism removes unnecessary resin from the slot block after the resin is formed. The conveying mechanism includes an unnecessary resin adsorption portion for adsorbing the unnecessary resin. After the conveying mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the slot block, the transfer mechanism moves the plunger toward the first mold to peel the unnecessary resin from the slot block, and then the conveying mechanism uses the unnecessary resin adsorption portion to adsorb the unnecessary resin and carry the unnecessary resin out.

3. A method for manufacturing a resin molded product, which is a method for manufacturing a resin molded product using the resin molding apparatus according to claim 1 or 2, the method for manufacturing a resin molded product comprising: A mold clamping step of clamping the first mold and the second mold to perform resin molding in a state where a molding object and a resin material are supplied to the first mold and the second mold; as well as A step of carrying out the first mold and the second mold by opening the first mold and carrying out the resin-molded object from the molding mold.

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