Circuit board, display device, and method for selecting mounting circuit

Abstract

The present application provides a method for selecting a circuit board, a display device, and a mounting circuit, wherein the circuit board includes: a chip; a connecting circuit, the connecting circuit includes a first end connected to the chip; a first mounting circuit, the first mounting circuit is used to mount a first seat; a second mounting circuit, the second mounting circuit is used to mount a second seat; a third mounting circuit, the third mounting circuit is used to mount a third seat, the first mounting circuit, the second mounting circuit, and the third mounting circuit include a first multiplexing pin connected to each other, the first multiplexing pin is connected to the second end of the connecting circuit; wherein the first end and the second end are connected through a capacitor or a resistor, so that the first multiplexing pin and the chip are connected through the circuit board. The circuit board does not need to set different chips according to different screen output interfaces, which reduces the number of chip designs and saves costs.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a circuit board, a display device, and a method for selecting an installation circuit. Background Art

[0002] At present, with the diversification of screen output interfaces in the display field, such as monitors, televisions, advertising machines, science and education machines, etc., the interfaces are incompatible with each other, resulting in manufacturers needing to design different PCB boards according to different screen output interfaces, resulting in waste of resources and increased costs. Summary of the invention

[0003] An embodiment of the present application provides an electronic device that solves the problem of designing different PCB boards due to different screen output interfaces.

[0004] An embodiment of the present application provides a circuit board, including:

[0005] chip;

[0006] A connecting circuit, the connecting circuit comprising a first end connected to the chip;

[0007] A first mounting circuit, wherein the first mounting circuit is used to mount a first seat;

[0008] a second mounting circuit, the second mounting circuit being used for mounting a second seat;

[0009] A third mounting circuit, the third mounting circuit is used to mount a third socket, the first mounting circuit, the second mounting circuit and the third mounting circuit include first multiplexing pins connected to each other, and the first multiplexing pin is connected to the second end of the connecting circuit;

[0010] The first end and the second end are connected through a capacitor or a resistor, so that the first multiplexing pin and the chip are connected through the connecting circuit.

[0011] Optionally, the first mount is mounted on the first mounting circuit, and the first end and the second end are connected via the capacitor, so that the first multiplexing pin and the chip are connected via the capacitor.

[0012] Optionally, the second mount is mounted on the second mounting circuit or the third mount is mounted on the third mounting circuit, and the first end and the second end are connected through the resistor, so that the first multiplexing pin and the chip are connected through the resistor.

[0013] Optionally, the first mounting circuit, the second mounting circuit and the third mounting circuit are arranged adjacent to each other.

[0014] Optionally, the first socket installed on the first mounting circuit is a Vbyone socket, the second socket installed on the second mounting circuit is an LVDS socket, and the third socket installed on the third mounting circuit is a Point-to-Point socket.

[0015] Optionally, the second mounting circuit is arranged between the first mounting circuit and the third mounting circuit.

[0016] Optionally, the connecting circuit is arranged on a side of the first mounting circuit away from the second mounting circuit, and the chip is arranged on a side of the connecting circuit away from the first mounting circuit.

[0017] Optionally, the capacitor is 0.1uf and the resistor is 0Ω.

[0018] The present application also provides a display device, including:

[0019] Display panel;

[0020] A circuit board as described in any one of the above items;

[0021] A wiring harness is used to connect the display panel and the circuit board.

[0022] The present application also provides a method for selecting a mounting circuit, which is applied to a display device, wherein the display device includes a display panel and any one of the above-mentioned circuit boards, and the selection method includes:

[0023] Acquire a display interface of the display panel;

[0024] When the display interface is the first interface, the first mounting circuit mounts the first seat, and the first end and the second end of the connection circuit are connected through a capacitor;

[0025] When the display interface is the second interface, the second mounting circuit mounts the second seat, and the first end and the second end of the connection circuit are connected through a resistor;

[0026] When the display interface is the third interface, the third mounting circuit mounts the third seat, and the first end and the second end of the connection circuit are connected via a resistor.

[0027] The beneficial effects of the present application are as follows: the embodiment of the present application provides a circuit board including an installation circuit and a connection circuit for installing different sockets, and the installation circuit includes a first multiplexing pin. The first end and the second end of the connection circuit are connected through a capacitor or a resistor, thereby connecting the first multiplexing pin and the chip. Through this circuit board, there is no need to set different chips according to different screen output interfaces, thereby reducing the number of chip designs and saving costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0029] In order to more completely understand the present application and its beneficial effects, the following description will be made in conjunction with the accompanying drawings. In the following description, the same reference numerals represent the same parts.

[0030] Figure 1 A schematic diagram of the first structure of a circuit board provided in an embodiment of the present application;

[0031] Figure 2 A second structural schematic diagram of a circuit board provided in an embodiment of the present application;

[0032] Figure 3 A third structural schematic diagram of a circuit board provided in an embodiment of the present application;

[0033] Figure 4 A schematic diagram of the structure of a display device provided in an embodiment of the present application;

[0034] Figure 5 A flowchart of a method for selecting an installation circuit provided in an embodiment of the present application. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0036] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0037] The chip on the existing circuit board is connected to the output interface on the display device through the socket so that the chip controls the display. However, the interfaces of current display screens are diverse. If different chips on the circuit board are replaced according to different display screen interfaces, it will cause resource waste and increase costs.

[0038] Therefore, in order to solve the above problems, the present application proposes an electronic device. The present application is further described below in conjunction with the accompanying drawings and implementation methods.

[0039] See also Figure 1 to Figure 2 , Figure 1 A schematic diagram of the first structure of a circuit board provided in an embodiment of the present application, Figure 2A second structural schematic diagram of a circuit board provided in an embodiment of the present application. This embodiment provides a circuit board 100, and the circuit board 100 includes a chip 10, a connecting circuit 20, a first mounting circuit 30, a second mounting circuit 40, and a third mounting circuit 50. Among them, the first mounting circuit 30 is used to install the first seat 60, the second mounting circuit 40 is used to install the second seat 70, and the third mounting circuit 50 is used to install the third seat 80. It should be noted that the first mounting circuit 30, the second mounting circuit 40, and the third mounting circuit 50 include a first multiplexing pin 910 connected to each other. The connecting circuit 20 includes a first end 210 connected to the chip 10 and a second end 220 connected to the first multiplexing pin 910, and this embodiment connects the first end 210 and the second end 220 through a capacitor or a resistor so that the first multiplexing pin 910 and the chip 10 are connected through the connecting circuit 20. In the embodiment of the present application, the first end 210 and the second end 220 of the connecting circuit 20 are connected through a capacitor or a resistor, thereby connecting the first multiplexing pin 910 and the chip 10. Through this circuit board 100, there is no need to set different chips 10 according to different screen output interfaces, thereby reducing the number of chip 10 designs and saving costs.

[0040] It should be noted that the current mainstream TV processing chips 10 generally include SOC, MTK, Amlogic, RTK and HiSilicon, and the current screen output interfaces generally include Vbyone (V-by-one), LVDS (Low-Voltage DifferentialSignaling), P2P (Point-to-Point), EPI, CEDS, CMPI, ISP, CSPI, USIT, etc. The embodiment of the present application multiplexes the functions of the screen output interface pins, multiplexes some signal line sequences on the same output module, and reduces the number of IC pins. Among them, the differential impedance requirements of the P2P signal, Vbyone signal, and LVDS signal are the same, all of which are 90~100Ω, so the routing layout on the circuit board 100 can be exactly the same. Therefore, the embodiment of the present application takes the first socket 60 installed on the first mounting circuit 30 as a Vbyone socket, the second socket 70 installed on the second mounting circuit 40 as an LVDS socket, and the third socket 80 installed on the third mounting circuit 50 as a P2P (Point-to-Point) socket as an example for explanation, and it should not be understood as a limitation on the first mounting circuit 30, the second mounting circuit 40 and the third mounting circuit 50.

[0041] Among them, pins 0 to 7 in the Vbyone socket need to be connected with a capacitor in series to be connected to the chip 10, pins 0 to 11 in the P2P socket are connected with the chip 10 without a resistor or capacitor in series, and pins 0 to 4 in the LVDS socket are connected with the chip 10 without a resistor or capacitor in series.

[0042] It is understandable that if the first mounting circuit 30 is mounted with the first socket 60, the first end 210 and the second end 220 are connected through a capacitor, so that the first multiplexing pin 910 and the chip 10 are connected through a capacitor. Exemplarily, if the first mounting circuit 30 is mounted with a Vbyone socket, the first end 210 and the second end 220 are connected through a capacitor, so that the first multiplexing pin 910 and the chip 10 are connected through a capacitor.

[0043] If the second mounting circuit 40 is mounted with a second socket 70, the first end 210 and the second end 220 are connected through a resistor, so that the first multiplexing pin 910 and the chip 10 are connected through a resistor. Exemplarily, if the second mounting circuit 40 is mounted with an LVDS socket, the first end 210 and the second end 220 are connected through a resistor, so that the first multiplexing pin 910 and the chip 10 are connected through a resistor.

[0044] If the third mounting circuit 50 is mounted with the third socket 80, the first end 210 and the second end 220 are connected through a resistor, so that the first multiplexing pin 910 and the chip 10 are connected through a resistor. Exemplarily, if the third mounting circuit 50 is mounted with a P2P socket, the first end 210 and the second end 220 are connected through a resistor, so that the first multiplexing pin 910 and the chip 10 are connected through a resistor.

[0045] Exemplarily, when the display interface connection requires a VB1 socket interface, a VB1 socket is installed on the first mounting circuit 30, an LVDS socket is not installed on the second mounting circuit 40, and a P2P socket is not installed on the third mounting circuit 50, and a capacitor is attached between the first end 210 and the second end 220 of the connection circuit 20 connected to the first multiplexing pin 910, so that the VB1 socket is connected to the chip 10. When the display interface connection requires an LVDS socket interface, an LVDS socket is installed on the second mounting circuit 40, a VB1 socket is not installed on the first mounting circuit 30, and a P2P socket is not installed on the third mounting circuit 50, and a resistor is attached between the first end 210 and the second end 220 of the connection circuit 20 connected to the first multiplexing pin 910, so that the LVDS socket is connected to the chip 10. Similarly, when the display screen interface connection requires a P2P socket interface, a P2P socket is installed on the third mounting circuit 50, an LVDS socket is not installed on the second mounting circuit 40, and a VB1 socket is not installed on the first mounting circuit 30, and a resistor is attached between the first end 210 and the second end 220 of the connection circuit 20 connected to the first multiplexing pin 910 to connect the P2P socket to the chip 10. The embodiment of the present application designs a circuit board 100 that is compatible with Vbyone sockets, LVDS sockets, and P2P sockets. By using the same circuit board 100 to be compatible with the design requirements of different output interfaces of Vbyone, LVDS, and P2P, the reuse rate of the chip 10 in the television is improved, and the same movement is avoided. Different circuit boards 100 are designed and derived due to different screen output interfaces, thereby reducing the number of PCB designs.

[0046] In some embodiments, the capacitor is 0.1uf and the resistor is 0Ω. By setting the capacitor or resistor, the design requirements of three different interfaces can be compatible and the purposes of different screen interfaces can be met at the same time.

[0047] It should be noted that the first multiplexing pin 910 includes a first part 911 in which the first mounting circuit 30, the second mounting circuit 40 and the third mounting circuit 50 are interconnected, and a second part 912 in which the first mounting circuit 30 and the second mounting circuit 40 are interconnected. Among them, the first part 911 and the second part 912 of the first multiplexing pin 910 both need to be connected to the connection circuit 20 through the pin on the first mounting circuit 30, so that the first multiplexing pin 910 and the chip 10 can be connected.

[0048] Please continue reading Figure 3 , Figure 3The third structural schematic diagram of the circuit board provided in the embodiment of the present application. In the circuit board 100 provided in the embodiment of the present application, the first mounting circuit 30, the second mounting circuit 40 and the third mounting circuit 50 are arranged adjacent to each other. By arranging the first mounting circuit 30, the second mounting circuit 40 and the third mounting circuit 50 adjacent to each other, the occupied area of ​​the first mounting circuit 30, the second mounting circuit 40 and the third mounting circuit on the circuit board 100 can be reduced, and the volume of the circuit board 100 can be reduced. And the adjacent arrangement can ensure that the distance between the seats is not too large, and ensure the quality of signal transmission, and reduce the error caused by wire breakage.

[0049] It can be understood that the connection circuit 20 is arranged on a side of the first mounting circuit 30 away from the second mounting circuit 40, and the chip 10 is arranged on a side of the connection circuit 20 away from the first mounting circuit 30. Because the first mounting circuit 30 needs to pass through the connection circuit 20 to be conductive, the first mounting circuit 30 is arranged on a side of the second mounting circuit 40 close to the connection circuit 20, so that the distance between the first mounting circuit 30 and the connection circuit 20 is shorter, the wiring is simpler, and the occupied area is reduced.

[0050] In some embodiments, the second mounting circuit 40 is arranged between the first mounting circuit 30 and the second mounting circuit 40. Exemplarily, the second mounting circuit 40 for mounting the LVDS socket is arranged between the first mounting circuit 30 for mounting the Vbyone socket and the third mounting circuit 50 for mounting the P2P socket. Because the first part 911 and the second part 912 of the multiplexed pin both need to pass through the connection circuit 20 to connect the multiplexed pin to the chip 10, and the second part 912 is the pin connecting the first mounting circuit 30 and the second mounting circuit 40, the embodiment of the present application arranges the second mounting circuit 40 on the side of the first mounting circuit 30 away from the connection circuit 20, and arranges the third mounting circuit 50 on the side of the second mounting circuit 40 away from the connection circuit 20, and arranges the first mounting circuit 30, the second mounting circuit 40 and the third mounting circuit 50 in sequence, which can make the wiring easier and reduce the occupied area of ​​the first mounting circuit 30, the second mounting circuit 40 and the third mounting circuit 50 on the circuit board 100.

[0051] The second mounting circuit 40 and the third mounting circuit 50 further include a second multiplexing pin 920, one end of which is connected to the second mounting circuit 40, and the other end of which is connected to the chip 10. Since the second multiplexing pin 920 does not need to pass through the connecting circuit 20, it can be directly connected to the chip 10. Therefore, in some embodiments, the first multiplexing pin 910 is arranged below the connecting circuit 20, that is, the first multiplexing pin 910 is equidistant from the second end 220 of the connecting circuit 20. The second multiplexing pin 920 is arranged on one side of the first multiplexing pin 910, and the connecting circuit 20 is not arranged between the second multiplexing pin 920 and the chip 10. By arranging the first multiplexing pin 910 below the connecting circuit 20, the mounting circuit can be better arranged on the circuit board 100, thereby improving the space utilization.

[0052] The first mounting circuit 30 further includes a non-multiplexed pin, and the non-multiplexed pin of the first mounting circuit 30 is connected to the chip 10 through a resistor.

[0053] The second mounting circuit 40 further includes non-multiplexed pins, and the non-multiplexed pins of the second mounting circuit 40 are directly connected to the chip 10 .

[0054] The third mounting circuit 50 further includes non-multiplexed pins, and the non-multiplexed pins of the third mounting circuit 50 are directly connected to the chip 10 .

[0055] In some embodiments, the non-multiplexed pin of the second mounting circuit 40 is arranged between the first multiplexing pin 910 and the non-multiplexed pin of the third mounting circuit 50 .

[0056] It should be noted that the circuit board 100 provided in the embodiment of the present application is not limited to the screen interface scenario, and can also be used in high-speed signal transmission and interfaces with functional multiplexing.

[0057] Please continue reading Figure 4 , Figure 4 This is a schematic diagram of the structure of a display device provided in an embodiment of the present application. This embodiment also provides a display device 1, which includes a display panel 600, a circuit board 100 as described in any one of the above, and a wiring harness 500, wherein the wiring harness 500 is used to connect the display panel 600 and the circuit board 100.

[0058] The display device 1 includes a detection circuit, which is used to detect whether the screen interface of the display panel 600 is the first interface, the second interface or the third interface. The first socket 60 is used to connect the first interface and the chip 10, the second socket 70 is used to connect the second interface and the chip 10, and the third socket 80 is used to connect the third interface and the chip 10.

[0059] The display device 1 also includes a selection circuit for selecting the first socket 60, the second socket 70 or the third socket 80 to connect with the chip 10, so that when the screen interface of the display panel 600 is identified as the first interface, the first socket 60 is selected to connect the chip 10 and the first interface, when the screen interface of the display panel 600 is identified as the second interface, the second socket 70 is selected to connect the chip 10 and the second interface, and when the screen interface of the display panel 600 is identified as the third interface, the third socket 80 is selected to connect the chip 10 and the third interface. Different sockets are set on the circuit board 100 through the interface of the display panel 600, so that the display panel 600 and the chip 10 are connected, avoiding the situation of designing and deriving different circuit boards 100 due to different screen output interfaces, and reducing the number of PCB designs.

[0060] It should be noted that the display device 1 can be a television, a computer, an advertising machine, etc., and no specific limitation is made here.

[0061] Please continue reading Figure 5 , Figure 5 A flowchart of a method for selecting an installation circuit provided in an embodiment of the present application. An embodiment of the present application provides a method for selecting an installation circuit, and an installation machine is used to apply the method for selecting an installation circuit to a display device 1, wherein the display device 1 is any of the display devices 1 described above. The selection method is specifically as follows:

[0062] 101. Obtain a display interface of a display panel.

[0063] The display interface of the detection display panel 600 is the first interface, the second interface or the third interface. The first socket 60 is used to connect the first interface and the chip 10, the second socket 70 is used to connect the second interface and the chip 10, and the third socket 80 is used to connect the third interface and the chip 10.

[0064] 102. When the display interface is the first interface, the first mounting circuit is mounted on the first seat, and the first end and the second end of the connection circuit are connected through the capacitor.

[0065] When the display interface is identified as the first interface, the selection circuit selects the first mounting circuit 30 to mount the first socket 60. Exemplarily, the VB1 socket is mounted on the first mounting circuit 30, the second mounting circuit 40 is not mounted with an LVDS socket, and the third mounting circuit 50 is not mounted with a P2P socket, and a capacitor is attached between the first end 210 and the second end 220 of the connection circuit 20 connected to the first multiplexing pin 910, so that the VB1 socket connects the chip 10 and the first interface of the display panel 600.

[0066] 103. When the display interface is the second interface, the second mounting circuit is mounted on the second seat, and the first end and the second end of the connection circuit are connected via a resistor.

[0067] When the display interface is identified as the second interface, the selection circuit selects the second mounting circuit 40 to mount the second socket 70. Exemplarily, an LVDS socket is mounted on the second mounting circuit 40, the first mounting circuit 30 does not mount the VB1 socket, and the third mounting circuit 50 does not mount the P2P socket, and a resistor is attached between the first end 210 and the second end 220 of the connection circuit 20 connected to the first multiplexing pin 910, so that the LVDS socket connects the chip 10 and the first interface of the display panel 600.

[0068] 104. When the display interface is the third interface, the third mounting circuit is mounted on a third seat, and the first end and the second end of the connection circuit are connected via a resistor.

[0069] When the display interface is identified as the third interface, the selection circuit selects the third mounting circuit 50 to mount the third socket 80. Exemplarily, a P2P socket is mounted on the third mounting circuit 50, the second mounting circuit 40 is not mounted with an LVDS socket, and the first mounting circuit 30 is not mounted with a VB1 socket, and a resistor is attached between the first end 210 and the second end 220 of the connection circuit 20 connected to the first multiplexing pin 910, so that the P2P socket connects the chip 10 and the first interface of the display panel 600.

[0070] The embodiment of the present application provides a circuit board 100 including an installation circuit for installing different sockets and a connecting circuit 20, wherein the installation circuit includes a first multiplexing pin 910, and the first end 210 and the second end 220 of the connecting circuit 20 are connected via a capacitor or a resistor, thereby connecting the first multiplexing pin 910 and the chip 10. Through this circuit board 100, there is no need to set different chips 10 according to different screen output interfaces, thereby reducing the number of chip 10 designs and saving costs.

[0071] The above is a detailed introduction to a circuit board, a display device, and a method for selecting an installation circuit provided in the embodiments of the present application. Specific regulations are used herein to explain the principles and implementation methods of the present application, and the description of the above embodiments is only used to help understand the present application. At the same time, for those skilled in the art, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A circuit board, characterized in that: include: chip; A connecting circuit, the connecting circuit comprising a first end connected to the chip; A first mounting circuit, wherein the first mounting circuit is used to mount a first seat; a second mounting circuit, the second mounting circuit being used for mounting a second seat; A third mounting circuit, the third mounting circuit is used to mount a third socket, the first mounting circuit, the second mounting circuit and the third mounting circuit include first multiplexing pins connected to each other, and the first multiplexing pin is connected to the second end of the connecting circuit; Wherein, the first end and the second end are connected via a capacitor or a resistor, so that the first multiplexing pin and the chip are connected via the connecting circuit; The first mounting circuit is mounted with the first seat, and the first end and the second end are connected through the capacitor, so that the first multiplexing pin and the chip are connected through the capacitor; the second mounting circuit is mounted with the second seat or the third mounting circuit is mounted with the third seat, and the first end and the second end are connected through the resistor, so that the first multiplexing pin and the chip are connected through the resistor; The first socket installed on the first installation circuit is a Vbyone socket, the second socket installed on the second installation circuit is an LVDS socket, and the third socket installed on the third installation circuit is a Point-to-Point socket; The second mounting circuit is arranged between the first mounting circuit and the third mounting circuit; the connecting circuit is arranged on a side of the first mounting circuit away from the second mounting circuit, and the chip is arranged on a side of the connecting circuit away from the first mounting circuit; The second mounting circuit and the third mounting circuit also include a second multiplexing pin, one end of the second multiplexing pin is connected to the second mounting circuit, and the other end of the second multiplexing pin is connected to the chip; the first multiplexing pin and the second end of the connecting circuit are equidistantly arranged, the second multiplexing pin is arranged on one side of the first multiplexing pin, and the connecting circuit is not arranged between the second multiplexing pin and the chip.

2. The circuit board according to claim 1, characterized in that: The first mounting circuit, the second mounting circuit and the third mounting circuit are arranged adjacent to each other.

3. The circuit board according to claim 1, characterized in that: The capacitor is 0.1uf, and the resistor is 0Ω.

4. A display device, characterized in that: include: Display panel; The circuit board as claimed in any one of claims 1 to 3; A wiring harness is used to connect the display panel and the circuit board.

5. A method for selecting an installation circuit, applied to a display device, characterized in that: The display device comprises a display panel and a circuit board as claimed in any one of claims 1 to 3, and the selection method comprises: Acquire a display interface of the display panel; When the display interface is the first interface, the first seat is installed on the first installation circuit, and the first end and the second end of the connection circuit are connected through a capacitor; When the display interface is the second interface, the second seat is installed on the second installation circuit, and the first end and the second end of the connection circuit are connected through a resistor; When the display interface is the third interface, the third seat is installed on the third installation circuit, and the first end and the second end of the connection circuit are connected through a resistor.

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