Heat pump integrated module and automobile air conditioning system

Abstract

The present invention provides a heat pump integrated module and an automobile air conditioning system, which relates to the technical field of automobile air conditioning heat pumps, and includes: at least two layers of substrates, the interior of the substrates is hollow and filled with refrigerant; a connector is arranged between two adjacent layers of the substrates, and is used to connect the two adjacent layers of the substrates; wherein the two adjacent layers of the substrates respectively form a high-temperature refrigeration side and a low-temperature refrigeration side, and a heat-insulating gap layer is formed between the high-temperature refrigeration side and the low-temperature refrigeration side. The present invention adopts a multi-layer substrate design, has a heat-insulating effect, and can reduce the occurrence of refrigerant heat crosstalk.

Description

Technical Field

[0001] The present invention relates to the technical field of automobile air-conditioning heat pumps, and in particular to a heat pump integrated module and an automobile air-conditioning system. Background Art

[0002] At present, electric vehicles are developing in the direction of high integration, and automobile air conditioners are especially so as a commonly used system device in automobiles; the main core components of traditional automobile air conditioners are scattered in the engine compartment and the passenger compartment, and the components are connected by air conditioning pipes, which takes up a large space; electric vehicle air conditioners currently use highly integrated heat pump integrated modules, which greatly reduce the space occupied, but the integrated plates of the refrigerant are usually forged, machined and brazed, which are difficult to process and have high processing costs; in addition, the heat pump integrated modules currently on the market have no transition area between the cold and hot conversion of the refrigerant in the heat pump, which is prone to heat cross-contamination. Therefore, there is room for improvement in the heat pump integrated modules in the prior art. Summary of the invention

[0003] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a heat pump integrated module and an automobile air-conditioning system, so as to solve the problems of low integration and high processing cost of the heat pump integrated module in the prior art.

[0004] To achieve the above-mentioned purpose and other related purposes, the present invention provides a heat pump integrated module, comprising: at least two layers of substrates, the interior of the substrates is hollow and filled with refrigerant; a connecting piece is arranged between two adjacent layers of the substrates, and is used to connect the two adjacent layers of the substrates; wherein the two adjacent layers of the substrates respectively form a high-temperature refrigeration side and a low-temperature refrigeration side, and an insulating gap layer is formed between the high-temperature refrigeration side and the low-temperature refrigeration side.

[0005] In one embodiment of the present invention, the substrate is made by die casting and machining.

[0006] In one embodiment of the present invention, a plurality of mounting positions are reserved on the substrate for integrating various valve bodies in the automobile air-conditioning system.

[0007] In one embodiment of the present invention, a flow channel is formed inside the substrate through processing to allow the refrigerant to flow inside the substrate.

[0008] In one embodiment of the present invention, a plurality of ports for the refrigerant to flow in or out are formed on the side wall of the substrate, and the ports are in communication with the flow channel.

[0009] In one embodiment of the present invention, three interfaces are provided on the substrate and are respectively connected to the compressor, the evaporator or the condenser.

[0010] The present invention further provides an automobile air conditioning system, comprising the heat pump integrated module as described above, and a variety of components integrated on the heat pump integrated module.

[0011] In one embodiment of the present invention, the automobile air conditioning system further includes a compressor, an internal condenser, and an evaporator for cooling or heating the passenger compartment, which are sequentially connected to the substrate to form a loop.

[0012] In one embodiment of the present invention, an electronic expansion valve, a one-way valve and a shut-off valve are also integrated on the substrate, and the electronic expansion valve, the one-way valve and the shut-off valve are connected to the flow channel in the substrate to form a cooling or heating cycle.

[0013] In one embodiment of the present invention, the automobile air conditioning system further includes a control unit, and the control unit is one of a central processing unit, a single-chip microcomputer, and an embedded processor.

[0014] As described above, a heat pump integrated module and an automobile air conditioning system of the present invention have the following beneficial effects:

[0015] 1. By adopting the structural design of multi-layer substrate, the high-temperature side of the refrigeration and the low-temperature side of the refrigeration in the entire automobile air-conditioning system are distinguished, and a heat-insulating gap layer is formed between the high-temperature side of the refrigeration and the low-temperature side of the refrigeration, thereby reducing the occurrence of refrigerant heat cross-talk and achieving the purpose of heat insulation.

[0016] 2. The substrate can also be formed into various flow channels by first casting the basic outline and then machining. On the one hand, the flow direction of the refrigerant in the flow channel is consistent; on the other hand, the weight of the substrate can be reduced and the production cost can be reduced.

[0017] 3. The machining process on the substrate can reserve multiple installation positions, which can be used to integrate various valve bodies in the automotive air-conditioning system; in addition, the installation positions reserved on the substrate can be adjusted according to different air-conditioning systems to meet the assembly requirements of different models. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Shown is an axonometric view of a heat pump integrated module according to an embodiment of the present invention;

[0019] Figure 2 Shown is a schematic structural diagram of a substrate of a heat pump integrated module in one embodiment of the present invention;

[0020] Figure 3 Shown is a schematic structural diagram of a heat insulation gap layer in an embodiment of a heat pump integrated module of the present invention;

[0021] Figure 4 Shown is a system diagram of an automobile air conditioning system in one embodiment of the present invention.

[0022] Component number description

[0023] 100. Heat pump integrated module; 110. Base plate; 111. Interface; 112. Insulation groove; 120. Connector; 130. Insulation gap layer; 140. Electronic expansion valve; 150. Shut-off valve; 160. Check valve; 200. Automobile air-conditioning system; 210. Compressor; 220. Internal condenser; 230. Evaporator; 240. Gas-liquid separator; 250. Coaxial tube; 260. Water-cooled condenser; 270. Chiller. DETAILED DESCRIPTION

[0024] The following is an explanation of the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the features in the following embodiments and the embodiments can be combined with each other without conflict. It should also be understood that the terms used in the embodiments of the present invention are intended to describe specific embodiments, rather than to limit the scope of protection of the present invention. The test methods for which specific conditions are not specified in the following examples are usually carried out under conventional conditions or according to the conditions recommended by the manufacturers.

[0025] See also Figures 1 to 4 . It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0026] See also Figure 1 , Figure 2 and Figure 3The present invention provides a heat pump integrated module, comprising at least two layers of substrates 110 and a connector 120. The substrate 110 is hollow and filled with refrigerant; the connector 120 is arranged between two adjacent layers of substrates 110, and is used to connect the two adjacent layers of substrates 110; in addition, the two adjacent layers of substrates 110 respectively form a high-temperature cooling side and a low-temperature cooling side, and a heat-insulating gap layer 130 is formed between the high-temperature cooling side and the low-temperature cooling side, so as to reduce the occurrence of heat transfer between the two adjacent layers of substrates 110.

[0027] Furthermore, in some embodiments of the present invention, the substrate 110 may be three-layer, four-layer, five-layer, six-layer, etc., and the present invention does not impose too many restrictions on the number of layers of the substrate 110; the specific number of layers of the substrate 110 can be selected according to the application scenario of the heat pump integrated module 100 in the present invention, so as to adapt to different automobile air-conditioning systems 200.

[0028] See also Figure 1 , Figure 2 and Figure 3 In this embodiment, the substrate 110 and the connector 120 are made by die casting and machining. By forming the heat pump integrated module 100 by die casting, the brazing process in the conventional processing method can be omitted, thereby greatly reducing the production cost, reducing the processing time, and improving the production efficiency. In addition, the production process of machining on the substrate 110 can reserve multiple installation positions (not marked in the figure), which can be used to integrate various valve bodies in the automobile air conditioning system 200; it should be noted that the various installation positions reserved on the substrate 110 can be adjusted according to different automobile air conditioning systems 200 to meet the assembly requirements of different models.

[0029] See also Figure 1 , Figure 2 and Figure 3 In this embodiment, a flow channel is formed inside the substrate 110 by machining for the refrigerant to circulate; it should be noted that in the present invention, the refrigerant includes any one or a mixture of more than one of HCFC, HFC, HC, and HFO; a plurality of interfaces 111 for the refrigerant to flow in or out are also provided on the side wall of the substrate 110, and the interfaces 111 are connected to the flow channel. In this embodiment, three interfaces 111 are provided on one substrate, and the three interfaces 111 are respectively connected to the compressor, the evaporator, and the condenser.

[0030] See also Figure 1 , Figure 2 and Figure 3In this embodiment, the middle position of one of the substrates 110 is hollowed out to form a heat insulation groove 112. It should be noted that the substrate 110 is the high-temperature cooling side of the entire heat pump integrated module 100, which facilitates the heat dissipation of the substrate 110 and improves the cooling performance. In addition, the flow channel inside the substrate 110 is a circulation flow channel, and the refrigerant in the flow channel flows in the same direction, flowing in from the high-pressure side of the compressor and out from the low-pressure side of the compressor to achieve a cooling or heating cycle. The setting of this flow channel can also simplify the structure of the substrate 110, reduce the weight of the substrate 110, and reduce the production cost.

[0031] See also Figure 4 The present invention also provides an automobile air conditioning system, comprising the heat pump integrated module 100, the compressor 210, the internal condenser 220, the evaporator 230 and the air conditioning box internal circulation damper (not shown in the figure). The air conditioning box internal circulation damper is used to switch the introduction of either the internal air or the external air from the vehicle compartment; the compressor 210 is connected to the interface 111 on the substrate 110 to adjust the temperature; the evaporator 230 is connected to the interface 111 on the substrate 110 to change the material form of the refrigerant; the internal condenser 220 is connected to the interface 111 on the substrate 110 to convert steam or gas into liquid.

[0032] See also Figure 4 In this embodiment, the heat pump integrated module 100 is also provided with a variety of valve bodies. It should be noted that the various valve bodies are electronic expansion valves 140, stop valves 150, and one-way valves 160. In this embodiment, two electronic expansion valves 140 are provided, which can play a role in throttling and reducing the pressure of the refrigerant; two stop valves 150 are provided in this embodiment, which play a role in opening and closing the refrigerant in the flow channel of the substrate 110; two one-way valves 160 are provided in this embodiment, which play a role in one-way flow and reverse cutoff.

[0033] See also Figure 4In this embodiment, the automobile air conditioning system 200 further includes a gas-liquid separator 240, a coaxial tube 250, a water-cooled condenser 260 and a Chiller (battery cooler) 270. The coaxial tube 250 is used to connect the refrigerant between the evaporator 230, the compressor 210 and the internal condenser 220. The coaxial tube 250 can be both an air conditioning pipeline and a heat exchanger. It should be noted that the coaxial tube 250 includes a low-pressure tube and a high-pressure tube, wherein the low-pressure tube flows with a low-temperature and low-pressure refrigerant of 5 to 10 degrees, and the high-pressure tube flows with a high-temperature and high-pressure refrigerant of 70 to 80 degrees. The high-pressure tube transfers heat to the low-pressure tube to realize secondary heat exchange in the automobile air conditioning system 200, thereby improving the heat exchange efficiency. The gas-liquid separator 240 is installed after the evaporator and before the compressor 210, and is connected through a pipeline. The gas-liquid separator 240 separates the gas-liquid mixture from the evaporator 230 in the gas-liquid separator 240. The gas directly enters the compressor 210 from the outlet pipe at the top of the gas-liquid separator 240, and the separated liquid is stored at the bottom of the gas-liquid separator 240. The liquid refrigerant therein is heated and vaporized and then enters the outlet pipe of the gas-liquid separator 240. The lubricating oil that cannot be liquefied flows from the oil return hole into the outlet pipe and then enters the compressor 210. The chiller (battery cooler) 270 is a key component of the thermal management of the battery of a pure electric or hybrid vehicle. It mainly plays the role of introducing the refrigerant in the vehicle air conditioning system 200. The refrigerant is throttled and evaporated in the electronic expansion valve 140, so that the refrigerant absorbs the heat of the coolant in the battery cooling circuit. In this process, the refrigerant takes away the heat of the coolant in the battery cooling circuit through heat exchange, thereby playing the role of cooling the battery. In addition, the water-cooled condenser 260 is connected between the compressor 210 and the internal condenser 220, and the water-cooled condenser 260 can take away the heat released by the refrigerant through cooling water. The cooling water can be used once or circulated. It should be noted that the water-cooled condenser 260 can be divided into plate heat exchangers, vertical shell and tube types, horizontal shell and tube types, and sleeve types according to its different structural types. In this embodiment, the water-cooled condenser 260 is a plate heat exchanger or other partition wall heat exchanger. The water-cooled condenser 260 in the present invention can be adaptively adjusted according to actual use or assembly requirements.

[0034] See also Figure 4In this embodiment, the compressor 210 plays the role of compressing and driving the refrigerant in the automobile air conditioning system 200. The compressor extracts the refrigerant from the low-pressure area, compresses it, and sends it to the high-pressure area for cooling and condensation. The heat is dissipated into the air through the heat sink on the internal condenser 220, and the refrigerant also changes from gas to liquid, and the pressure increases. The refrigerant then flows from the high-pressure area to the low-pressure area, and is sprayed into the evaporator 230 through the capillary tube. The pressure drops suddenly, and the liquid refrigerant immediately changes into a gas-liquid two-phase state, and absorbs a large amount of heat in the air through the heat sink on the internal condenser 220. In this way, the machine keeps working, and the heat at one end of the low-pressure area is continuously absorbed into the refrigerant and then sent to the high-pressure area to be dissipated into the air, which plays a role in regulating the temperature.

[0035] See also Figure 4 In this embodiment, high-pressure liquid refrigerant enters the evaporator 230 through the electronic expansion valve 140. Due to the atomization effect of the electronic expansion valve 140, the liquid refrigerant becomes mist, and the mist refrigerant is converted into gas under low-pressure conditions; heat is absorbed during the conversion process, so the evaporator 230 is in a low-temperature state at this time. After the air in the blower passes through, the air temperature can be reduced, thereby achieving the purpose of refrigeration.

[0036] See also Figure 4 In this embodiment, the automobile air conditioning system further includes a control unit, and the control unit is one of a central processing unit, a single-chip microcomputer, and an embedded processor.

[0037] During the entire cycle, the compressor 210 compresses and transports the refrigerant vapor, and creates a low pressure in the evaporator 230 and a high pressure in the condenser. It is the heart of the entire system. The electronic expansion valve 140 throttles and reduces the pressure of the refrigerant and adjusts the refrigerant flow entering the evaporator 230. The evaporator 230 is a device for outputting cold capacity. The refrigerant absorbs the heat of the cooled object in the evaporator 230, thereby achieving the purpose of generating cold capacity. The condenser is a device for outputting heat. The heat absorbed from the evaporator 230 and the heat converted from the work consumed by the compressor 210 are taken away by the cooling medium in the condenser.

[0038] In summary, the present invention uses a multi-layer substrate 110 structural design to distinguish the high-temperature cooling side from the low-temperature cooling side in the entire automobile air conditioning system 200, and forms a heat-insulating gap layer 130 between the high-temperature cooling side and the low-temperature cooling side, thereby reducing the occurrence of refrigerant heat cross-talk and achieving the purpose of heat insulation. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0039] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A heat pump integrated module, characterized in that: include: At least two layers of substrates, wherein the interior of the substrates is hollow and filled with a refrigerant; A connecting member, disposed between two adjacent layers of the substrate, and used to connect the two adjacent layers of the substrate; Wherein, two adjacent layers of the substrates respectively form a high-temperature refrigeration side and a low-temperature refrigeration side, and a heat-insulating gap layer is formed between the high-temperature refrigeration side and the low-temperature refrigeration side; A flow channel is formed inside the substrate through processing, so that the refrigerant can flow inside the substrate.

2. The heat pump integrated module according to claim 1, characterized in that: The base plate is manufactured by die casting and machining.

3. The heat pump integrated module according to claim 1, characterized in that: A plurality of mounting positions are reserved on the substrate for integrating various valve bodies in the automobile air-conditioning system.

4. The heat pump integrated module according to claim 1, characterized in that: A plurality of interfaces for the refrigerant to flow in or out are provided on the side wall of the substrate, and the interfaces are communicated with the flow channel.

5. The heat pump integrated module according to claim 4, characterized in that: The base plate is provided with three interfaces, which are respectively connected with the compressor, the evaporator or the condenser.

6. An automobile air conditioning system, characterized in that: The heat pump integrated module comprises the heat pump integrated module as claimed in any one of claims 1 to 5, and a plurality of components integrated on the heat pump integrated module.

7. The automobile air conditioning system according to claim 6, characterized in that: The automobile air conditioning system further includes a compressor, an internal condenser, and an evaporator for cooling or heating a passenger compartment, which are sequentially connected to the substrate to form a loop.

8. The automobile air conditioning system according to claim 6, characterized in that: The substrate is also integrated with an electronic expansion valve, a one-way valve and a stop valve, which are connected to the flow channel in the substrate to form a cooling or heating cycle.

9. The automobile air conditioning system according to claim 6, characterized in that: The automobile air conditioning system also includes a control unit, and the control unit is one of a central processing unit, a single-chip microcomputer, and an embedded processor.

Images