Antenna, electronic device including antenna, and portable communication device

Abstract

The portable communication device includes: a housing including a front plate, a rear plate facing away from the front plate, and a side member; a non-conductive member including a conductive portion formed in one or more regions of the non-conductive member; an antenna module including a second PCB and an antenna array. The second PCB includes: a first peripheral edge portion; a second peripheral edge portion opposite to the first peripheral edge portion; a third peripheral edge portion extending between a first end of the first peripheral edge portion and a first end of the second peripheral edge portion; and a fourth peripheral edge portion extending between a second end of the first peripheral edge portion and a second end of the second peripheral edge portion. The antenna array includes a plurality of antenna elements to form a directional beam. The first peripheral edge portion is parallel to a horizontal direction in which the plurality of antenna elements are arranged, and the conductive portion is formed on at least two peripheral edge portions among the second peripheral edge portion, the third peripheral edge portion, and the fourth peripheral edge portion.

Description

[0001] This application document is a divisional application of invention patent application No. 202010101982.9, filed on February 19, 2020, with the invention name of “Antenna, electronic device including antenna, and portable communication device”. Technical Field

[0002] The present disclosure relates to a technology for implementing an electronic device including an antenna and a conductive pattern formed around the antenna. Background Art

[0003] With the development of communication technology, electronic devices equipped with antennas are being widely supplied. Electronic devices can use antennas to send / receive voice signals and radio frequency (RF) signals including data (e.g., messages, photos, videos, music files, or games). Electronic devices can use high frequencies (e.g., 5G communications or millimeter waves) to perform communications. When performing high-frequency communications, array antennas can be applied to overcome high transmission losses.

[0004] The above information is presented as background information only to assist in understanding the present disclosure. No determination has been made and no assertion has been made as to whether any of the above content may be applicable as prior art with respect to the present disclosure. Summary of the invention

[0005] Meanwhile, nowadays, an antenna module in which an antenna and a radio frequency integrated circuit are combined may be provided in an electronic device.

[0006] The antenna module of the electronic device may be mounted on an injection molding material made of a non-conductive material. The signal radiated by the antenna module may be radiated to the outside of the electronic device through at least a portion of the housing of the electronic device. At this time, a surface wave may be generated along the injection molding material in the antenna module. When the signal is radiated from the injection molding material through the surface wave, the signal radiated by the antenna module may be distorted.

[0007] In addition, in at least part of the housing of the electronic device, such as the surface of the back cover, some signals may be reflected into the electronic device, thereby causing multiple reflections. When the signal is reflected from the injection molding material through multiple reflections, the signal radiated by the antenna module may be distorted.

[0008] Aspects of the present disclosure will at least solve the above-mentioned problems and / or disadvantages and provide at least the following advantages. Therefore, one aspect of the present disclosure is to provide an electronic device that prevents distortion of a signal radiated by an antenna module and increases the gain of a signal radiated to the outside of the electronic device by forming a conductive pattern for preventing surface waves and multiple reflections that occur when the antenna module is installed.

[0009] According to one aspect of the present disclosure, an electronic device may include: a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected to the second plate or formed integrally with the second plate, and including a conductive material; an injection molding material disposed in the housing in the space between the first plate and the second plate and formed of a non-conductive material; an antenna module including a plurality of conductive radiators and supported by the injection molding material; and a conductive pattern disposed on a first surface of the injection molding material adjacent to the second plate or disposed within the injection molding material, and disposed adjacent to at least a portion of an edge of the antenna module corresponding to a boundary between the antenna module and the injection molding material when viewed from the second plate in the direction of the first plate. At least some of the plurality of conductive radiators may be configured to transmit and / or receive signals through the second plate.

[0010] According to another aspect of the present disclosure, an electronic device may include: a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected to the second plate or formed integrally with the second plate, and including a conductive material; an injection molding material disposed in the housing in the space between the first plate and the second plate and formed of a non-conductive material; an antenna module including a plurality of conductive radiators and supported by the injection molding material; and a conductive pattern disposed on a first surface of the injection molding material adjacent to the second plate or disposed within the injection molding material, and disposed adjacent to at least a portion of an edge of the antenna module corresponding to a boundary between the antenna module and the injection molding material when viewed from the second plate in the direction of the first plate. At least some of the conductive radiators of the plurality of conductive radiators may be configured to send and / or receive signals through the second plate. The plurality of conductive patterns may include at least one first conductive pattern configured to send or receive signals below 6 GHz. Each of the plurality of conductive patterns may be spaced apart from each other.

[0011] Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description in conjunction with the accompanying drawings, in which:

[0013] Figure 1 is a block diagram illustrating an electronic device in a network environment according to various embodiments;

[0014] Figure 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments;

[0015] Figure 3A is a perspective view of the third antenna module when viewed from one side;

[0016] Figure 3B is a perspective view of the third antenna module when viewed from the other side;

[0017] Figure 3C is a cross-sectional view of the third antenna module along line AA';

[0018] Figure 4 The third antenna module is shown along Figure 3A A cross-sectional view taken along line BB';

[0019] Figure 5 is a diagram showing an electronic device including an antenna module according to an embodiment;

[0020] Figure 6 is a diagram showing an electronic device including an antenna module according to another embodiment;

[0021] Figure 7 is a diagram illustrating a signal radiated by an antenna module according to an embodiment;

[0022] Figure 8 is a diagram showing an antenna module, a protruding portion, and a plurality of conductive patterns according to an embodiment;

[0023] Fig. 9 is a diagram illustrating an antenna module, a protruding portion, a plurality of antenna radiators, and a plurality of conductive patterns according to an embodiment;

[0024] Fig.10 is a diagram showing an electronic device according to an embodiment;

[0025] Fig.11 is along Fig.10 A cross-sectional view taken along line AB;

[0026] Fig. 12A is a diagram illustrating a signal radiated by an antenna module according to an embodiment;

[0027] Fig. 12B is a diagram illustrating a signal radiated by an antenna module according to another embodiment;

[0028] Fig.13 is a diagram illustrating a signal radiated by an antenna module according to an embodiment;

[0029] Fig.14 is a diagram illustrating an electronic device according to an embodiment; and

[0030] Fig.15 is a diagram illustrating an electronic device according to an embodiment. DETAILED DESCRIPTION

[0031] Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. However, those skilled in the art will recognize that various modifications, equivalents and / or substitutions may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure.

[0032] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit.For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0033] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0034] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123.

[0035] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0036] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0037] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0038] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as a part of the speaker.

[0039] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0040] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0041] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0042] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0043] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0045] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0046] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0047] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0049] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as a part of the antenna module 197.

[0050] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0051] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0052] Figure 2 2 is a block diagram 200 of an electronic device 101 for supporting both traditional network communications and 5G network communications according to various embodiments. Figure 2 , the electronic device 101 may include a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna 248. The electronic device 101 may also include a processor 120 and a memory 130. The network 199 may include a first network 292 and a second network 294. According to another embodiment, the electronic device 101 may also include Figure 1The network 199 may further include at least one of the components shown, and at least one other network. According to an embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may form at least part of the wireless communication module 192. According to another embodiment, the fourth RFIC 228 may be omitted, or may be included as part of the third RFIC 226.

[0053] The first communication processor 212 may establish a communication channel for a frequency band to be used for wireless communication with the first network 292, and may support traditional network communication through the established communication channel. According to various embodiments, the first network may be a traditional network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor 214 may support the establishment of a communication channel corresponding to a designated frequency band (e.g., about 6 GHz to about 60 GHz) to be used for wireless communication with the second network 294 among the frequency bands, and may support 5G network communication via the established communication channel. According to various embodiments, the second network 294 may be a 5G network defined in 3GPP. In addition, according to an embodiment, the first communication processor 212 or the second communication processor 214 may establish a communication channel corresponding to another designated frequency band (e.g., about 6 GHz or lower) to be used for wireless communication with the second network 294 among the frequency bands, and may support 5G network communication through the established communication channel. According to an embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be implemented in a single chip or a single package together with the processor 120 , the auxiliary processor 123 , or the communication module 190 .

[0054] In the case of transmitting a signal, the first RFIC 222 may convert a baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first network 292. In the case of receiving a signal, an RF signal may be obtained from the first network 292 (e.g., a legacy network) through an antenna (e.g., the first antenna module 242), and the RF signal may be pre-processed by an RFFE (e.g., the first RFFE 232). The first RFIC 222 may convert the pre-processed RF signal into a baseband signal so that it is processed by the first communication processor 212.

[0055] In the case of transmitting a signal, the second RFIC 224 may convert a baseband signal generated by the first communication processor 212 or the second communication processor 214 into an RF signal (hereinafter referred to as a "5G Sub6 RF signal") in a Sub6 frequency band (e.g., about 6 GHz or lower) used in a second network 294 (e.g., a 5G network). In the case of receiving a signal, a 5G Sub6 RF signal may be obtained from a second network 294 (e.g., a 5G network) through an antenna (e.g., a second antenna module 244), and the 5G Sub6 RF signal may be preprocessed by an RFFE (e.g., a second RFFE 234). The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal, so that it is processed by a communication processor corresponding to the 5G Sub6 RF signal among the first communication processor 212 or the second communication processor 214.

[0056] The third RFIC 226 may convert the baseband signal generated by the second communication processor 214 into an RF signal in a 5G Above 6 frequency band (e.g., about 6 GHz to about 60 GHz) to be used in the second network 294 (e.g., a 5G network) (hereinafter referred to as a "5G Above 6 RF signal"). In the case of receiving a signal, the 5G Above 6 RF signal may be obtained from the second network 294 (e.g., a 5G network) through an antenna (e.g., antenna 248), and the 5G Above 6 RF signal may be pre-processed by the third RFFE 236. The third RFIC 226 may convert the pre-processed 5G Above 6 RF signal into a baseband signal so as to be processed by the second communication processor 214. According to an embodiment, the third RFFE 236 may be formed as part of the third RFIC 226.

[0057] According to an embodiment, the electronic device 101 may include a fourth RFIC 228 that is independent of the third RFIC 226 or as at least part of the third RFIC 226. In this case, the fourth RFIC 228 may convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as an "IF signal") in an intermediate frequency band (e.g., a range from about 9 GHz to about 11 GHz), and may provide the IF signal to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above 6 RF signal. In the case of receiving a signal, a 5G Above 6 RF signal may be received from a second network 294 (e.g., a 5G network) through an antenna (e.g., an antenna 248), and the 5G Above 6 RF signal may be converted into an IF signal through the third RFIC. The fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process the baseband signal.

[0058] According to an embodiment, the first RFIC 222 and the second RFIC 224 may be implemented with a single chip or a portion of a single package. According to an embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as at least a portion of a single chip or a single package. According to an embodiment, at least one of the first antenna module 242 or the second antenna module 244 may be omitted or may be connected to another antenna module, and then RF signals of a plurality of corresponding frequency bands may be processed.

[0059] According to an embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form a third antenna module 246. For example, the wireless communication module 192 or the processor 120 may be disposed on a first substrate (e.g., a main PCB). In this case, the third RFIC 226 may be disposed in a local area (e.g., a bottom surface) of a second substrate (e.g., a sub-PCB) separated from the first substrate; the antenna 248 may be disposed in another local area (e.g., an upper surface), thereby forming a third antenna module 246. According to an embodiment, for example, the antenna 248 may include an antenna array capable of beamforming. By positioning the third RFIC 226 and the antenna 248 on the same substrate, the length of the transmission line between the third RFIC 226 and the antenna 248 may be reduced. The reduction in the length of the transmission line may make it possible to reduce the loss (or attenuation) of the signal in the high frequency band (e.g., about 6 GHz to about 60 GHz) for 5G network communication due to the transmission line. As such, the electronic device 101 may improve the quality or speed of communication with the second network 294 (e.g., a 5G network).

[0060] The second network 294 (e.g., a 5G network) can be used independently of the first network 292 (e.g., a traditional network) (e.g., independent networking (SA)), or can be used in combination with the first network 292 (e.g., non-independent networking (NSA)). For example, in the 5G network, only an access network (e.g., a 5G radio access network (RAN) or a next-generation RAN (NG RAN)) may exist, and a core network (e.g., a next-generation core (NGC)) may not exist in the 5G network. In this case, the electronic device 101 can access the access network of the 5G network, and then can access an external network (e.g., the Internet) under the control of the core network (e.g., the evolved packet core (EPC)) of the traditional network. Protocol information for communicating with a traditional network (e.g., LTE protocol information) or protocol information for communicating with a 5G network (e.g., new radio NR protocol information) can be stored in the memory 130 so as to be accessed by another component (e.g., the processor 120, the first communication processor 212, or the second communication processor 214).

[0061] Figures 3A to 3C Shown is a reference Figure 2 An embodiment of a third antenna module 246 is described. Figure 3A is a perspective view of the third antenna module 246 when viewed from one side, Figure 3B is a perspective view of the third antenna module 246 when viewed from the other side. Figure 3C is a cross-sectional view of the third antenna module 246 taken along line AA′.

[0062] Reference Figures 3A to 3C In an embodiment, the third antenna module 246 may include a printed circuit board 310, an antenna array 330, a radio frequency integrated circuit (RFIC) 352, a power management integrated circuit (PMIC) 354, and a module interface. Optionally, the third antenna module 246 may further include a shielding member 390. In various embodiments, at least one of the above components may be omitted, or at least two of the components may be integrally formed.

[0063] The printed circuit board 310 may include a plurality of conductive layers and a plurality of non-conductive layers, and the conductive layers and the non-conductive layers may be alternately stacked. The printed circuit board 310 may provide electrical connections with various electronic components disposed on or outside the printed circuit board 310 by using conductive lines and conductive paths formed in the conductive layers.

[0064] Antenna array 330 (eg, Figure 2 248) may include a plurality of antenna elements 332, 334, 336, and 338 configured to form a directional beam. Figures 3A to 3CAs shown, the antenna element may be formed on the first surface of the printed circuit board 310. According to another embodiment, the antenna array 330 may be formed within the printed circuit board 310. According to an embodiment, the antenna array 330 may include a plurality of antenna arrays (e.g., a dipole antenna array and / or a patch antenna array) of the same or different shapes or types.

[0065] RFIC 352 (e.g. Figure 2 226) may be disposed on another area of ​​the printed circuit board 310 (e.g., a second surface facing away from the first surface) so as to be spaced apart from the antenna array. The RFIC may be configured to process a signal in a selected frequency band transmitted / received through the antenna array 330. According to an embodiment, in the case of transmitting a signal, the RFIC 352 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal. In the case of receiving a signal, the RFIC 352 may convert an RF signal received through the antenna array 352 into a baseband signal, and may provide the baseband signal to the communication processor.

[0066] According to another embodiment, in the case of transmitting a signal, the RFIC 352 may transmit the signal from an intermediate frequency integrated circuit (IFIC) (e.g., Figure 2 228) obtained by up-converting the IF signal (e.g., about 9 GHz to about 11 GHz) into an RF signal. In the case of receiving a signal, the RFIC 352 can down-convert the RF signal obtained by the antenna array 352 into an IF signal, and can provide the IF signal to the IFIC.

[0067] The PMIC 354 may be disposed on another area (e.g., a second surface) of the printed circuit board 310 that is spaced apart from the antenna array. The PMIC may be supplied with voltage from a main PCB (not shown), and the PMIC may provide power necessary for various components (e.g., RFIC 352) on the antenna module.

[0068] The shielding member 390 may be disposed at a portion of the printed circuit board 310 (eg, on the second surface) so that at least one of the RFIC 352 or the PMIC 354 is electromagnetically shielded. According to an embodiment, the shielding member 390 may include a shield can.

[0069] Although not shown in the drawings, in various embodiments, the third antenna module 246 can be electrically connected to another printed circuit board (e.g., a main circuit board) through a module interface. The module interface may include a connecting member, such as a coaxial cable connector, a board-to-board connector, an insert, or a flexible printed circuit board (FPCB). The RFIC 352 and / or PMIC 354 of the third antenna module 246 can be electrically connected to the printed circuit board through a connecting member.

[0070] Figure 4 The third antenna module 246 is shown along Figure 3A In the illustrated embodiment, the printed circuit board 310 may include an antenna layer 411 and a network layer 413 .

[0071] The antenna layer 411 may include at least one dielectric layer 437 - 1 , and the antenna element 336 and / or the feed portion 425 formed on an outer surface of the dielectric layer 437 - 1 or formed therein. The feed portion 425 may include a feed point 427 and / or a feed line 429 .

[0072] The network layer 413 may include at least one dielectric layer 437 - 2 , and at least one ground layer 433 , at least one conductive via 435 , a transmission line 423 , and / or a signal line 429 formed on an outer surface of the dielectric layer 437 - 2 or formed therein.

[0073] Additionally, in the illustrated embodiment, Figure 2 The third RFIC 226 can be electrically connected to the network layer 413, for example, through the first and second connection parts (e.g., solder bumps) 440-1 and 440-2. In various embodiments, various connection structures (e.g., solder or ball grid array (BGA)) can be used instead of the connection part. The third RFIC 226 can be electrically connected to the antenna element 336 through the first connection part 440-1, the transmission line 423 and the feeding part 425. Moreover, the third RFIC 226 can be electrically connected to the ground layer 433 through the second connection part 440-2 and the conductive path 435. Although not shown, the third RFIC 226 can also be electrically connected to the above-mentioned module interface through the signal line 429.

[0074] Figure 5 2 is a diagram showing an electronic device (eg, Figure 1 The electronic device 101 according to the embodiment may include a housing 510, an antenna module 520, an injection molding material 530 or a conductive pattern 540.

[0075] In an embodiment, the housing 510 may include a first plate, a second plate facing away from the first plate, and a side member that surrounds the space between the first plate and the second plate, is connected to the second plate or is formed integrally with the second plate, and includes a conductive material. The extension portion 511 may be formed from the side member of the housing 510 between the first plate and the second plate. The extension portion 511 may include a fixing portion 512 that can fix the extension portion 511 to the first plate and the second plate.

[0076] In an embodiment, the injection molding material 530 may be located within the housing 510. The injection molding material 530 may be located in the space between the first plate and the second plate. The injection molding material 530 may be made of a non-conductive material. The injection molding material 530 may be a non-conductive plastic. The injection molding material 530 may fill the space between the first plate and the second plate of the housing 510. The injection molding material 530 may fix the position of the antenna module 520 disposed within the housing 510. The injection molding material 530 may be different from the non-conductive material of the printed circuit board 310.

[0077] In an embodiment, the antenna module 520 may be supported by the injection molding material 530. For example, the antenna module 520 may be installed in the injection molding material 530, or may be fixed by the injection molding material 530. For another example, the antenna module 520 may be supported by a support member (e.g., Figure 7 The antenna module 520 includes a support member 570 (supported by a support member 570). The support member 570 may be made of an injection molding material or a metal such as stainless steel (Sus). The first to fourth patch antennas 521, 522, 523, and 524 may be provided in the antenna module 520. The first to fourth dipole antennas 525, 526, 527, and 528 may be provided in a direction of the side member of the antenna module 520 facing the housing 510.

[0078] In an embodiment, the conductive pattern 540 may be disposed on the injection molding material 530. The conductive pattern 540 may be disposed in a horizontal direction (X-axis direction). The conductive pattern 540 may be patterned and disposed on the injection molding material 530. For example, the conductive pattern 540 may be generated by generating a plating pattern on the injection molding material 530 (for example, using laser direct structuring (LDS)). The conductive pattern 540 may be disposed at least partially adjacent to the edge of the antenna module 520. The conductive pattern 540 may be formed by a metal guide structure on a first side direction (-X-axis direction), a second side direction (-Y-axis direction), and a third side direction (+X-axis direction) of the antenna module 520. The conductive pattern 540 may suppress the surface wave propagating from the antenna module 520 to the injection molding material 530. The conductive pattern 540 may suppress the signal source generated by the surface wave. The conductive pattern 540 may attenuate the reflected wave reflected from the antenna module 520 by the back cover (not shown) and then incident on the injection molding material 530. The conductive pattern 540 may suppress an unwanted signal source to reduce deformation of a beam radiated from the antenna module 520 .

[0079] In an embodiment, the conductive pattern 540 may be provided to surround the edge of the antenna module 520. The conductive pattern 540 may be a metal guide structure in the form of a periphery surrounding the antenna module 520. For example, the conductive pattern 540 may be provided to surround at least a portion (e.g., four surfaces) of the edge of the antenna module 520.

[0080] In an embodiment, the conductive pattern 540 may be disposed around edges other than edges where the first to fourth dipole antennas 525, 526, 527, and 528 of the antenna module 520 are disposed. In order not to affect the radiation patterns of the first to fourth dipole antennas 525, 526, 527, and 528 disposed in the antenna module 520, the conductive pattern 540 may be disposed on three surfaces other than edges where the first to fourth dipole antennas 525, 526, 527, and 528 are disposed.

[0081] In an embodiment, the electronic device 101 may further include a camera 550. The camera 550 may be disposed adjacent to the conductive pattern 540. The camera decoration 554 may be positioned to surround the camera 550 in the edge of the camera 550. The camera decoration 554 may be positioned on the injection molding material 530. The camera decoration 554 may fix or support the camera 550 to a specified position. The camera decoration 554 may be a supporting member made of a metal such as stainless steel (Sus). The camera decoration 554 may be used as a part of the conductive pattern 540. The camera 550 may include first to third camera sensors 551, 552, and 553. The camera 550 may take pictures using the first to third camera sensors 551, 552, and 553.

[0082] In an embodiment, the electronic device 101 may further include a printed circuit board 560. When viewed from above the second board, the printed circuit board 560 may be disposed on the lower layer of the injection molding material 530 and the antenna module 520. For example, Figure 5 As shown, the printed circuit board 560 may be spaced apart from the conductive pattern 540. However, the embodiment is not limited thereto. When the conductive pattern 540 functions as at least part of an antenna, the printed circuit board 560 may be electrically and / or physically connected to the conductive pattern 540.

[0083] Figure 6 FIG. 2 is a diagram showing an electronic device (eg, Figure 1 According to another embodiment, the electronic device 101 may include a housing 510, an antenna module 520, an injection molding material 530, first to seventh sub-patterns 611, 612, 613, 614, 615, 616 and 617, a camera 550 and / or a printed circuit board 560. According to another embodiment, the housing 510, the antenna module 520, the injection molding material 530, the camera 550 and the printed circuit board 560 of the electronic device 101 are Figure 5 The housing 510, the antenna module 520, the injection molding material 530, the camera 550 and the printed circuit board 560 described in the accompanying drawings are substantially the same, and thus descriptions thereof are omitted.

[0084] In an embodiment, the first to seventh sub-patterns 611, 612, 613, 614, 615, 616, and 617 may be disposed adjacent to an edge of the antenna module 520. For example, the first to seventh sub-patterns 611, 612, 612, 613, 614, 615, 616, and 617 may be located at positions close to the antenna module 520 among positions where coupling with the antenna module 520 does not occur. The first to seventh sub-patterns 611, 612, 613, 614, 615, 616, and 617 may be formed by Figure 5 The conductive pattern 540 is formed of substantially the same material. Each of the first to seventh sub-patterns 611, 612, 613, 614, 615, 616, and 617 may be spaced apart from each other.

[0085] In an embodiment, the first to third sub-patterns 611, 612, and 613 may be disposed adjacent to an edge in a first lateral direction (-X axis direction) of the antenna module 520. The first sub-pattern 611 adjacent to the first dipole antenna 525 may be disposed in parallel to an edge in a fourth lateral direction (+Y axis direction) of the antenna module 520, the edge being positioned in a direction in which the first to fourth dipole antennas 525, 526, 527, and 528 form a beam. For example, in order to prevent the performance of the first to fourth dipole antennas 525, 526, 527, and 528 from being affected, a virtual first straight line A1 extending from an edge in a fourth lateral direction (+Y axis direction) of the antenna module 520 may correspond to an edge of the first sub-pattern 611. The fourth sub-pattern 614 may be disposed adjacent to an edge in a second lateral direction (-Y axis direction) of the antenna module 520. The seventh sub-pattern 617 may be disposed adjacent to an edge in a third lateral direction (+X axis) of the antenna module 520, thereby corresponding to the first sub-pattern 611. For example, a virtual first straight line A1 extending from an edge in the fourth side direction (+Y axis) of the antenna module 520 may correspond to an edge of the seventh sub-pattern 617. The fifth to sixth sub-patterns 615 and 616 may be disposed adjacent to an edge in the third side direction (+X axis) of the antenna module 520.

[0086] Figure 7 is a diagram 700 illustrating a signal radiated by antenna module 520 according to an embodiment.

[0087] In an embodiment, the antenna module 520 may radiate a signal to an electronic device (eg, Figure 1 The first patch antenna 521 included in the antenna module 520 may radiate a signal in a direction facing the back cover 710.

[0088] In an embodiment, the injection molding material 530 may be disposed around the antenna module 520. The injection molding material 530 may fix the position of the antenna module 520. When a signal is transmitted from the antenna module 520 to the injection molding material 530 in the form of a surface wave, unwanted signal radiation may occur in the injection molding material 530, and thus distortion of the signal may occur.

[0089] In an embodiment, the conductive pattern 720 may be disposed on both sides of the antenna module 520. The conductive pattern 720 may be disposed in the first vertical direction (+Z axis direction). For example, the conductive pattern 720 may be formed by a metal member of stainless steel (Sus) that fixes the antenna module 520. For another example, the conductive pattern 720 may be formed in the form of plating on the side portion of the antenna module 520 (for example, disposed on Figure 5 The conductive pattern 720 may be formed on the side surface of the injection molding material 530 in a form such as printing or plating. The conductive pattern 720 may prevent the signal radiated by the antenna module 520 from propagating into the injection molding material 530. The conductive pattern 720 surrounding the antenna module 520 may prevent the radiation of an unwanted signal from occurring in the injection molding material 530, and may reduce distortion of the signal.

[0090] In an embodiment, the support member 570 may be disposed on one surface of the antenna module 520 disposed in the second vertical direction (−Z-axis direction). The support member 570 may fix the position of the antenna module 520 .

[0091] In an embodiment, the protrusion 810 may be formed in the injection molding material 530. The protrusion 810 may be disposed in a portion of the injection molding material 530 adjacent to the conductive pattern 720. The protrusion 810 may be disposed to surround the conductive pattern 720. The protrusion 810 may be formed to have a height higher than that of the conductive pattern 720. The protrusion 810 may support or fix the conductive pattern 720.

[0092] Figure 8 800 is a diagram illustrating an antenna module 520 , a protrusion portion 810 , and a plurality of conductive patterns 821 , 822 , 823 , 824 , and 825 according to an embodiment.

[0093] In an embodiment, the housing 510 may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected to the second plate or formed integrally with the second plate, and including a conductive material.

[0094] In an embodiment, the injection molding material 530 may be disposed in the space between the first plate and the second plate within the housing 510 and may be made of a non-conductive material.

[0095] In an embodiment, the antenna module 520 may be supported by the injection molding material 530. For example, the antenna module 520 may be installed in the injection molding material 530, or may be fixed by the injection molding material 530.

[0096] In an embodiment, the protrusion 810 may surround the edge of the antenna module 520. The protrusion 810 may be made of a non-conductive material. The protrusion 810 may have a height higher than the injection molding material 530. The protrusion 810 may be used as a guide for installing or fixing the antenna module 520.

[0097] In an embodiment, the first to fifth conductive patterns 821, 822, 823, 824, and 825 may be disposed in the injection molding material 530. The first to fifth conductive patterns 821, 822, 823, 824, and 825 may be disposed at least partially adjacent to the protrusion portion 810.

[0098] In an embodiment, the first conductive pattern 821 may be used as a conventional antenna for 3G or 4G communication. The second conductive pattern 822 may prevent surface waves from propagating to the injection molding material 530. The first conductive pattern 821 and the second conductive pattern 822 may be spaced apart from each other. The 3G or 4G communication signal radiated by the first conductive pattern 821 may not be affected by the second conductive pattern 822.

[0099] In an embodiment, the first to fifth conductive patterns 821, 822, 823, 824, and 825 may extend from the antenna module 520 in at least one of the first side direction (-X axis direction), the second side direction (-Y axis direction), the third side direction (+X axis direction), or the fourth side direction (+Y axis direction). For example, the first to fifth conductive patterns 821, 822, 823, 824, and 825 may extend to face the first side surface, the second side surface, the third side surface, and / or the fourth side surface of the side member constituting the housing 510. When the areas of the first to fifth conductive patterns 821, 822, 823, 824, and 825 are increased, the performance of preventing the signal from propagating to the injection molding material 530 may be improved.

[0100] In an embodiment, the first to fifth conductive patterns 821, 822, 823, 824, and 825 may be formed adjacent to the protruding portion 810. For another example, at least some regions of the third conductive pattern 823 may overlap at least some regions of the protruding portion 810. When the first to fifth conductive patterns 821, 822, 823, 824, and 825 are formed adjacent to the protruding portion 810 or overlap at least some regions of the protruding portion 810, the performance of preventing the signal from propagating to the injection molding material 530 may be improved.

[0101] In an embodiment, the protrusion 810 may be the same material as the injection molding material 530. Each of the protrusion 810 and the injection molding material 530 may be a non-conductive plastic. When the protrusion 810 and the injection molding material 530 are formed of the same material as each other, the protrusion 810 and the injection molding material 530 may be formed by a single process.

[0102] In an embodiment, when the antenna module 520 is viewed in the X-axis direction, the protrusion 810 may protrude further in the first vertical direction (+Z-axis direction) than the antenna module 520. The protrusion 810 may have a height higher than that of the antenna module 520 to serve as a guide for stably installing the antenna module 520.

[0103] In an embodiment, at least portions of the first to fifth conductive patterns 821, 822, 823, 824, and 825 may contact the protrusion portion 810. For example, at least portions of the first, second, and fourth conductive patterns 821, 822, and 824 may contact the protrusion portion 810. When at least portions of the first to fifth conductive patterns 821, 822, 823, 824, and 825 contact the protrusion portion 810, a signal may be further prevented from being transmitted from the antenna module 520 to the injection molding material 530.

[0104] Fig. 9 900 is a diagram illustrating an antenna module 520 , a protrusion portion 810 , a plurality of antenna radiators 911 , 912 , 913 , and / or a plurality of conductive patterns 921 , 922 , 923 , and 924 according to an embodiment. Fig. 9 The housing 510, the antenna module 520, the injection molding material 530 and the protrusion 810 are Figure 8 The housing 510, the antenna module 520, the injection molding material 530 and the protrusion 810 are substantially the same, and thus a description thereof is omitted.

[0105] In an embodiment, the first to third antenna radiators 911, 912, and 913 may be disposed adjacent to the antenna module 520. The first to third antenna radiators 911, 912, and 913 may be disposed on the injection molding material 530. For example, the first to third antenna radiators 911, 912, and 913 may be used as a conventional antenna. The first to third antenna radiators 911, 912, and 913 may be formed adjacent to the antenna module 520, thereby reducing surface waves transmitted to the injection molding material 530. The first to third antenna radiators 911, 912, and 913 may be at least partially adjacent to the protrusion 810. The first to third antenna radiators 911, 912, and 913 may be spaced apart from the first to fourth conductive patterns 921, 922, 923, and 924. The first to fourth conductive patterns 921, 922, 923, and 924 may prevent signals from being transmitted from the antenna module 520 to the injection molding material 530 in the form of surface waves.

[0106] Fig.10 is a diagram showing an electronic device (eg, Figure 1 The electronic device 101 according to the embodiment may include a housing 510, an antenna module 520, an injection molding material 530 and / or a conductive pattern 1020. Fig.10 The housing 510, the antenna module 520 and the injection molding material 530 are Figure 5 The housing 510, the antenna module 520 and the injection molding material 530 are substantially the same, and thus a description thereof is omitted.

[0107] In an embodiment, the conductive pattern 1020 may be supported by the injection molding material 530. The conductive pattern 1020 may be disposed adjacent to at least one edge formed in the inner direction of the housing 510 among the edges of the antenna module 520. For example, the conductive pattern 1020 may surround all of one edge of the antenna module 520 (e.g., an edge in the second side direction (-Y axis direction)). The conductive pattern 1020 may surround at least a portion of an edge in the first side direction (-X axis direction) and an edge in the third side direction (+X axis direction) of the antenna module 520. For example, the conductive pattern 1020 may surround an edge adjacent to the second side direction (-Y axis direction) among the edges in the first side direction (-X axis direction) and the third side direction (+X axis direction) of the antenna module 520.

[0108] In an embodiment, the electronic device 101 may further include first to fourth antenna radiators 1011 , 1012 , 1013 , and 1014 . The first to fourth antenna radiators 1011 , 1012 , 1013 , and 1014 may be disposed on the injection molding material 530 .

[0109] In an embodiment, the first to fourth antenna radiators 1011, 1012, 1013, and 1014 may be spaced apart from the antenna module 520 and the conductive pattern 1020. The first to fourth antenna radiators 1011, 1012, 1013, and 1014 may work as at least one conventional antenna. The first to fourth antenna radiators 1011, 1012, 1013, and 1014 may reduce the signal from the antenna module 520 to the injection molding material 530 in the form of a surface wave, thereby being substantially the same as the conductive pattern 1020. The first to fourth antenna radiators 1011, 1012, 1013, and 1014 may perform communication in a frequency band of wireless communication (e.g., 3G, 4G, LTE band, Wi-Fi, GPS, and / or Sub-6 GHz (3.5GHz)). The antenna module 520 may perform communication of millimeter waves (mmWave). The conductive pattern 1020 may reduce the transmission of a signal from the antenna module 520 to the injection molding material 530 in the form of a surface wave.

[0110] Fig.11 is along Fig.10 1100 is a cross-sectional view taken along line AB of an electronic device (e.g., Figure 1 The electronic device 101 may include a housing 510 , an antenna module 520 , an injection molding material 530 , a camera 550 and / or a conductive pattern 1020 . Fig.11 The housing 510, the antenna module 520, the injection molding material 530 and the camera 550 are Figure 5 The housing 510, the antenna module 520, the injection molding material 530 and the camera 550 are substantially the same, and thus a description thereof is omitted.

[0111] In an embodiment, the antenna module 520 may be fixed by a support member 570. The support member 570 may be disposed on the printed circuit board 560. The support member 570 may be surrounded by the injection molding material 530. For example, the support member 570 may be formed to such a height that at least one side surface corresponds to the antenna module 520 at the height. The support member 570 may be made of an injection molding material or a metal such as stainless steel (Sus).

[0112] In an embodiment, the conductive pattern 1020 may be at least partially disposed on the injection molding material 530. For example, the conductive pattern 1020 may be disposed on at least a portion of the injection molding material 530 disposed adjacent to the antenna module 520. At least a portion of the injection molding material 530 surrounding the antenna module 520 may be formed to protrude further than the antenna module 520. The conductive pattern 1020 may be disposed at the periphery of the antenna module 520. For example, when viewed from the top, the conductive pattern 1020 may be disposed around the antenna module 520 in a shape such as an L-type, a C-type, or an I-type. The conductive pattern 1020 may prevent a signal from being transmitted from the antenna module 520 to the injection molding material 530 in the form of a surface wave.

[0113] In an embodiment, the electronic device 101 may further include a printed circuit board 560. The printed circuit board 560 may be interposed between the injection molding material 530 and the first board. The printed circuit board 560 may include a plurality of conductive layers and a plurality of non-conductive layers, and the conductive layers and the non-conductive layers may be alternately stacked. The injection molding material 530 may be different from the non-conductive material of the printed circuit board 560.

[0114] In an embodiment, the conductive pattern 1020 may be connected to a ground layer (eg, Figure 4 ground layer 433) or a communication module (eg, Figure 1 The conductive pattern 1020 may be connected to the ground layer 433 or the communication module 190 in the form of at least one via or C-clip, thereby serving as a part of the antenna (eg, Fig. 9 Antenna radiators 911, 912 and 913).

[0115] Fig. 12A FIG. 1 is a diagram showing an antenna module (eg, Figure 5 1210 is a diagram of a signal radiated by antenna module 520). Fig. 12B is a diagram 1220 illustrating signals radiated by the antenna module 520 according to another embodiment. Fig. 12A and Fig. 12B The cross section in the figure may correspond to the electronic device along the Figure 3A A section taken from the line A-A' to the Z axis. For example, Fig. 12A The radiation pattern may correspond to the radiation pattern of a signal in the frequency band of 28 GHz radiated by the antenna module 520; Fig. 12B The radiation pattern of φ may correspond to a radiation pattern of a signal in a frequency band of 39 GHz radiated by the antenna module 520 .

[0116] Reference Fig. 12A and Fig. 12B , the radiation pattern of the signal radiated by the antenna module 520 can be seen on the back cover (e.g., Figure 7 The antenna module 520 may be formed to be uniformly formed in the direction of the rear cover 710. A signal radiated around the antenna module 520 may be formed.

[0117] In an embodiment, it can be seen that unwanted signals radiated through the back cover 710 and / or the injection molding material 530 are greatly reduced. For example, when the surface wave propagating through the injection molding material 530 reaches the back cover of the electronic device 101 (e.g., Figure 7 When the back cover 710 or the back plate is removed, the surface wave may be radiated, and thus a deformation may occur in the radiation pattern of the antenna module 520. Fig. 12A and Fig. 12B ,like Fig. 12AArea 1298 Neutralization Fig. 12B As shown in the region 1299 of FIG. 129 , the conductive pattern 540 can substantially prevent the deformation of the radiation pattern. In this case, it can be seen that the radiation pattern formed by the antenna module 520 has an improved electric field distribution.

[0118] In an embodiment, the surface wave propagating from the antenna module 520 to the injection molding material 530 can be suppressed, and thus the signal distortion can be reduced. Moreover, the distribution of the electric field formed by the antenna module 520 can be uniformly changed to reduce the deformation of the entire radiation pattern. In addition, the Figure 1 A null point is generated in the -180 degree direction of the reference visual axis of the electronic device 101), thereby easily performing beamforming.

[0119] Fig.13 FIG. 1 is a diagram showing an antenna module (eg, Figure 5 1300 is a diagram of a signal radiated by antenna module 520).

[0120] In an embodiment, the radiation pattern 1310 shown by the dotted line and the radiation pattern 1320 shown by the thin solid line may be the radiation pattern when the conductive pattern 1020 is not present; the radiation pattern 1330 shown by the thick solid line may be the radiation pattern of the electronic device according to the embodiment (for example, Figure 1 The radiation pattern measured by the electronic device 101). Fig.13 As shown, the deformation of the beam pattern can be reduced on the reference visual axis (e.g., -180 degree direction). The radiation pattern formed by the antenna module 520 can be increased on the reference visual axis and can be reduced in the lateral direction. It can be seen that the side lobes of the radiation pattern formed by the antenna module 520 are reduced and the radiation pattern is flattened. Therefore, the peak gain of the signal formed by the antenna module 520 can be increased on the reference visual axis.

[0121] Fig.14 is a diagram showing an electronic device 1400 (eg, Figure 1 The electronic device 1400 according to the embodiment may include a first board 1410, a display 1420 (eg, Figure 1 , a display device 160 , a bracket support member 1430 , a printed circuit board 1440 (eg, Fig.11 PCB 560), injection molding material 1450 (e.g., Fig.11 of injection molding material 530), antenna module 1460 (eg, Fig.11 The antenna module 520), the support member 570, the conductive pattern 1470 (eg, Fig.11The conductive pattern 1020 and the second plate 1480 are at least one of the conductive pattern 1020 and the second plate 1480.

[0122] In an embodiment, the first plate 1410 may form a front surface of the electronic device 1400. The display 1420 may be exposed through at least a portion of the first plate 1410.

[0123] In an embodiment, the bracket support member 1430 may be disposed in a space between the display 1420 and the printed circuit board 1440. The bracket support member 1430 may support the printed circuit board 1440.

[0124] In an embodiment, the injection molding material 1450 may be disposed in a space between the printed circuit board 1440 and the second board 1480. The injection molding material 1450 may include a first portion 1451 and / or a second portion 1452 formed to surround the antenna module 1460.

[0125] In an embodiment, the antenna module 1460 may be supported by the first portion 1451 of the injection material 1450, the second portion 1452 of the injection material 1450, and the support member 570. The support member 570 may be disposed between the PCB 1440 and the antenna module 1460. The radiator 1461 may be formed on one surface of the antenna module 1460.

[0126] In an embodiment, the conductive pattern 1470 may be disposed between the injection molding material 1450 and the second board 1480. The conductive pattern 1470 may be disposed adjacent to the antenna module 1460.

[0127] Fig.15 FIG. 1 is a diagram showing an electronic device 1500 (eg, Figure 1 The electronic device 1500 according to the embodiment may include a first board 1510, a display 1520 (eg, Figure 1 , a display device 160, a bracket support member 1530, a printed circuit board 1540 (eg, Fig.11 PCB 560), injection molding material 1550 (e.g., Fig.11 injection molding material 530), antenna module 1560 (eg Fig.11 antenna module 520), a support member 570, a conductive pattern 1570 (eg, Fig.11 The conductive pattern 1020 and the second plate 1580 are at least one of the conductive pattern 1020 and the second plate 1580. Fig.15 The first board 1510, the display 1520, the bracket support member 1530, the printed circuit board 1540 and the second board 1580 are Fig.14The first board 1410, the display 1420, the bracket supporting member 1430, the printed circuit board 1440, the injection molding material 1450 and the second board 1480 are substantially the same components, and thus a description thereof is omitted.

[0128] In an embodiment, the antenna module 1560 may be disposed on the bracket support member 1530. The antenna module 1560 may be disposed on one side surface of the printed circuit board 1540 and the injection molding material 1550. The antenna module 1560 may be supported by the injection molding material 1550 and the support member 570. The support member 570 may be disposed between one side of the antenna module 1560 and one side of each of the PCB 1540 and the injection molding material 1550. The antenna module 1560 may be installed so that a beam pattern is formed by the radiator 1561 to be substantially parallel to the second board 1580. For example, the antenna module 1560 may be disposed substantially perpendicular to the second board 1580.

[0129] In an embodiment, the conductive pattern 1570 may be disposed on the injection molding material 1550. The conductive pattern 1570 may be disposed adjacent to the antenna module 1560.

[0130] According to various embodiments, an electronic device (eg, Figure 1 The electronic device 101 may include: a housing (eg, Figure 5 The housing 510 includes a first plate (eg, Fig.14 1410), a second plate facing away from the first plate 1410 (eg, Fig.14 The second plate 1480), and a side member surrounding the space between the first plate 1410 and the second plate 1480, connected to the second plate 1480 or formed integrally with the second plate 1480, and including a conductive material; an injection molding material (e.g., Figure 5 The injection molding material 530 is disposed in the housing 510 in the space between the first plate 1410 and the second plate 1480 and is formed of a non-conductive material; an antenna module (eg, Figure 5 antenna module 520), supported by injection molding material 530; and a conductive pattern (eg, Figure 5 The conductive pattern 540 is disposed on the injection molding material 530 and adjacent to at least a portion of an edge of the antenna module 520. For example, the antenna module may include a plurality of conductive radiators (eg, Figure 5At least some of the plurality of conductive radiators may be provided to transmit and / or receive signals through the second board 1480. For example, the conductive pattern may be provided on a first surface of the injection molding material 530 adjacent to the second board 1480, or within the injection molding material 530, and may be provided adjacent to at least a portion of an edge of the antenna module 520 corresponding to a boundary between the antenna module 520 and the injection molding material 530 when viewed from the second board 1480 in the direction of the first board 1410.

[0131] In an embodiment, when viewed from the second board 1480 in the direction of the first board 1410, the conductive pattern 540 may be disposed on the first surface to surround at least a portion of the edge of the antenna module 520. For example, when viewed from the second board 1480 in the direction of the first board 1410, the conductive pattern 540 may be disposed on the first surface to surround the edge of the antenna module 520. For another example, at least a portion of the plurality of conductive radiators 521, 522, 523, 524, 525, 526, 527, and 528 may form dipole antennas 525, 526, 527, and 528; when viewed from the second board 1480 in the direction of the first board 1410, the conductive pattern 540 may be disposed on the first surface adjacent to at least a portion of the remaining area of ​​the edge of the antenna module 520 except for the area in which the dipole antennas 525, 526, 527, and 528 are disposed.

[0132] In an embodiment, the conductive pattern 540 may include a plurality of sub-patterns (eg, Figure 6 The plurality of first to seventh sub-patterns 611, 612, 613, 614, 615, 616, and 617 may each be spaced apart from one another.

[0133] In an embodiment, when viewed from the second plate 1480 in the direction of the first plate 1410, the plurality of sub-patterns 611, 612, 613, 614, 615, 616, and 617 are disposed only on the first surface along the second direction (e.g., -Y direction) from the first straight line (e.g., Figure 6 The first direction is a region extending from the first straight line A1 on the first surface. For example, the first straight line may be a virtual straight line extending from an edge adjacent to the plurality of dipole antennas 525, 526, 527, and 528 of the antenna module; the second direction is perpendicular to the first straight line A1 on the first surface and is opposite to the first direction (e.g., +Y direction). For example, the first direction may be a direction away from the edge adjacent to the plurality of dipole antennas 525, 526, 527, and 528 to the antenna module 520.

[0134] According to an embodiment, at least part of the plurality of sub-patterns 611, 612, 613, 614, 615, 616, 617 may be configured to transmit and / or receive frequency signals in a second frequency band (e.g., approximately less than 6 GHz) different from the plurality of conductive radiators 521 to 528 of the antenna module 520. For example, the plurality of conductive radiators 521 to 528 of the antenna module 520 may be configured to transmit and / or receive frequency signals in a first frequency band (e.g., signals of 6 GHz or higher). For example, the lower limit of the first frequency band may be higher than the upper limit of the second frequency band.

[0135] In an embodiment, the electronic device may further include a camera (eg, Figure 5 The camera 550 of the conductive pattern 540 and a conductive camera support member (eg, camera decoration 554) configured to support the camera 550 and surround the edge of the camera 550. The camera support member 554 may be at least a portion of the conductive pattern 540.

[0136] According to various embodiments, an electronic device (eg, Figure 1 The electronic device 101 may include: a housing 510 including a first plate 1410, a second plate 1480 facing away from the first plate 1410, and a side member surrounding a space between the first plate 1410 and the second plate 1480, connected to the second plate 1480 or formed integrally with the second plate 1480, and including a conductive material; an injection molding material 530 disposed in the housing 510 in the space between the first plate 1410 and the second plate 1480 and formed of a non-conductive material; an antenna module 520 supported by the injection molding material 530; and a plurality of conductive patterns (e.g., Figure 8 The first to fifth conductive patterns 821, 822, 823, 824 and 825 are disposed on the injection molding material 530. For example, the antenna module may include a plurality of conductive radiators (eg, Figure 5 The conductive pattern 540 may be provided on a first surface of the injection molding material 530 adjacent to the second board 1480, or within the injection molding material 530, and may be provided adjacent to at least a portion of an edge of the antenna module 520 corresponding to a boundary between the antenna module 520 and the injection molding material 530 when viewed from the second board 1480 in the direction of the first board 1410. The plurality of conductive patterns 821, 822, 823, 824, and 825 may include at least one first conductive pattern configured to transmit or receive signals below 6 GHz, and may be spaced apart from each other.

[0137] In an embodiment, the electronic device 101 may further include a protruding portion (eg, Figure 8 The protrusion 810 surrounds the edge of the antenna module 520, protrudes from the first surface in the direction of the second board 1480, and is formed of a non-conductive material. For example, the protrusion 810 may be the same material as the injection molding material 530. For another example, the protrusion 810 may be higher than the antenna module 520 in the first vertical direction (e.g., Figure 7 For another example, the protrusion 810 may protrude further on the first surface than the antenna module 520 along the second board direction.

[0138] According to an embodiment, the plurality of conductive patterns 821, 822, 823, 824, 825 may be at least partially disposed adjacent to the protruding portion 810, and may further include at least one second conductive pattern 822, 823 for blocking at least part of the signal radiated using at least part of the plurality of radiators in the antenna module from being transmitted to the injection molding material 530. For example, the at least one second conductive pattern may include at least one second conductive pattern 823 overlapping at least part of the protruding portion 810 on the first surface. For example, the plurality of conductive patterns 821, 822, 823, 824, 825 may be engraved or plated on the first surface of the injection molding material 530.

[0139] According to an embodiment, the electronic device 101 may further include a communication circuit (eg, Figure 1 For example, at least one first conductive pattern 821 may be electrically connected to the communication circuit 190 through at least one via or C-clip; at least one second conductive pattern 822 and 823 may be electrically connected to the ground layer (e.g., Figure 4 ground layer 433).

[0140] In an embodiment, at least part of the plurality of conductive patterns 821, 822, 823, 824, and 825 may be at least one first conductive pattern 821 used as a conventional antenna for performing wireless communication other than 5G. For example, the plurality of conductive radiators of the antenna module 520 may be configured to transmit or receive signals of 6 GHz or higher.

[0141] According to an embodiment, the antenna module 520 may include a wireless communication circuit (eg, Figure 4 The wireless communication circuit is located on a third surface, and the third surface and the patch antenna element ( Figure 5521 to 524). For example, the antenna module 520 may be arranged so that the second plate and the third surface are substantially horizontal in the housing. For another example, the antenna module 520 may be arranged so that the second plate and the third surface are substantially perpendicular to each other in the housing.

[0142] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0143] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0144] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0145] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0146] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0147] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0148] According to the embodiments disclosed in the specification, the surface wave can be prevented from being transmitted to the injection molding material by the conductive pattern arranged around the antenna module, and the conductive pattern can be used to prevent multiple reflections from occurring. In this way, the distortion of the signal radiated by the antenna module can be prevented, and the gain of the signal radiated by the antenna module to the outside of the electronic device can be increased.

[0149] Furthermore, various effects directly or indirectly understood by the present disclosure can be provided.

[0150] While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

[0151] This application is based on and claims the benefit of priority from Korean Patent Application No. 10-2019-0019113 filed on February 19, 2019 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.

Claims

1. A portable communication device, comprising: a housing, wherein the housing comprises a front plate, a rear plate facing away from the front plate, and side members surrounding a space formed between the front plate and the rear plate; First PCB; a non-conductive member including a conductive portion formed in one or more regions of the non-conductive member; as well as an antenna module, formed in the space, The antenna module comprises: The second PCB includes: a first peripheral edge portion; a second peripheral edge portion opposite the first peripheral edge portion; a third peripheral edge portion extending between the first end of the first peripheral edge portion and the first end of the second peripheral edge portion; and a fourth peripheral edge portion extending between a second end of the first peripheral edge portion and a second end of the second peripheral edge portion; and Antenna arrays, which include multiple antenna elements to form a directional beam, wherein the first peripheral edge portion is parallel to a horizontal direction toward which the plurality of antenna elements are arranged, wherein the conductive portion is formed on at least two peripheral edge portions among the second peripheral edge portion, the third peripheral edge portion, and the fourth peripheral edge portion except the first peripheral edge portion.

2. The portable communication device of claim 1, wherein the second PCB comprises a conductive material and a first non-conductive material, and The non-conductive member comprises a second non-conductive material different from the first non-conductive material.

3. The portable communication device according to claim 2, wherein the first PCB comprises the conductive material and a third non-conductive material, and The non-conductive member includes the second non-conductive material which is different from the third non-conductive material. The portable communication device according to claim 1 , wherein the second PCB is smaller than the first PCB.

5. The portable communication device of claim 1, wherein at least a portion of the conductive portion is parallel to the second peripheral edge portion.

6. The portable communication device of claim 1, wherein at least a portion of the conductive portion is disposed around the second peripheral edge portion, at least a portion of the third peripheral edge portion, and at least a portion of the fourth peripheral edge portion.

7. The portable communication device of claim 1, wherein a length of the conductive portion is longer than a length of the first peripheral edge portion.

8. The portable communication device of claim 1, wherein the non-conductive member is at least a portion of the back plate.

9. The portable communication device of claim 1 , wherein the antenna array is configured to transmit or receive signals in a first frequency band, and The conductive portion is coupled to the antenna array to be configured to transmit or receive signals in the first frequency band.

10. The portable communication device of claim 1, wherein the antenna array comprises a plurality of patch antennas.

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