Circuit board tape and docking method thereof

Abstract

The present invention relates to a circuit board tape and a method for docking the same. The circuit board tape comprises a plurality of substrate units, each of which has a transmission hole arrangement area, a circuit layout area, and a docking mark. The transmission hole arrangement area has three or more transmission holes (an odd number), the circuit layout area has a first circuit layout and a second circuit layout, and the docking mark extends with a virtual line located between the first and second circuit layouts. Adjacent substrate units have an odd number of transmission holes between the virtual lines. Unqualified substrate units are cut along the virtual lines of different substrate units to separate the circuit board tape into a front tape portion and a rear tape portion. After the front tape portion and the rear tape portion are joined, the first circuit layout arranged on the front tape portion and the second circuit layout arranged on the rear tape portion form a composite circuit layout area.

Description

Technical Field

[0001] The present invention relates to a circuit board tape and a method for connecting the same, in particular to a circuit board tape that can be connected after cutting unqualified substrate units and a method for connecting the same. Background Art

[0002] Conventional circuit board tape designs typically employ multiple circuit layouts on a substrate, with multiple transmission holes disposed on both sides of the substrate. Each circuit layout has an even number of transmission holes on each side, and the pitch between the transmission holes must match the tooth pitch of a transmission member (such as a transmission wheel or transmission bar) to facilitate the transmission member's transmission of the substrate for processes such as wafer bonding and adhesive coating.

[0003] However, during the inspection step, the area with the unqualified circuit layout is cut away, so that the circuit board tape is formed into a front tape portion and a rear tape portion. Then, the front tape portion and the rear tape portion are connected to perform subsequent processes. However, due to the operator's uncertain cutting position, after the front and rear parts of the circuit board tape are connected, the new hole pitch between the transmission hole located in the front tape portion and the transmission hole located in the rear tape portion will be different from the hole pitch between the other transmission holes. Therefore, when the transmission member transmits the substrate, the transmission member will be separated from the transmission member, making it impossible to perform subsequent processes. Summary of the Invention

[0004] The main purpose of the present invention is to increase the number of circuit layouts without changing the hole pitch between the transmission holes and the length of the circuit board tape; and after removing the cutting section and the joining step, the transmission holes can be arranged at equal intervals to solve the problem in the prior art that the hole pitch between the transmission holes after joining varies due to the operator's uncertain cutting position, making it impossible to carry out subsequent processes.

[0005] A circuit board tape of the present invention includes a plurality of substrate units arranged along a transmission direction, each of the substrate units having a first transmission hole arrangement area, a second transmission hole arrangement area, a circuit layout area, and a docking mark. The first transmission hole arrangement area has three or more first transmission holes, an odd number of which are evenly spaced on one side of the substrate unit along the transmission direction. The second transmission hole arrangement area has three or more second transmission holes, an odd number of which are symmetrically spaced and evenly spaced on the other side of the substrate unit along the transmission direction. The circuit layout area is located between the first transmission hole arrangement area and the second transmission hole arrangement area. The circuit layout area has a first circuit layout and a second circuit layout, and the first and second circuit layouts can be separated from the circuit board tape into single circuit substrates. A virtual line extends from the docking mark, the virtual line being located between the first circuit layout and the second circuit layout, and an odd number of first transmission holes is located between each of the virtual lines of adjacent substrate units.

[0006] Preferably, the number of the first transmission holes located between two adjacent virtual lines is the same as the number of the first transmission holes located in the first transmission hole setting area.

[0007] Preferably, the virtual line divides the first transmission hole setting area into a first area and a second area, the first area is located on one side of the first circuit layout, the second area is located on one side of the second circuit layout, and the number of the first transmission holes located in the first area is an even number, and the number of the first transmission holes located in the second area is an odd number.

[0008] Preferably, the docking mark is arranged in the first transmission hole arrangement area, and the docking mark is located between two adjacent first transmission holes.

[0009] Preferably, along the transmission direction, the second circuit layout has a plurality of external pins, and the virtual line passes through the external pins of the second circuit layout.

[0010] Preferably, along the transmission direction, the virtual line is located between multiple external pins of the first circuit layout and multiple external pins of the second circuit layout, and the virtual line does not pass through the external pins of the first circuit layout or the external pins of the second circuit layout.

[0011] Preferably, the docking mark is selected from geometric figures, numbers or texts. When the docking mark is a geometric figure, the docking mark has an angle, the angle faces the circuit layout area, and the virtual line passes through the angle.

[0012] Preferably, each of the substrate units further has a first sequence mark and a second sequence mark, the first sequence mark corresponds to the first circuit layout and is located on one side of the first circuit layout, the second sequence mark corresponds to the second circuit layout and is located on one side of the second circuit layout, the appearance of the first sequence mark is different from the appearance of the second sequence mark, and the appearance of the first sequence mark and the second sequence mark are different from the docking mark, and the first sequence mark and the second sequence mark are selected from geometric figures, numbers or text.

[0013] Preferably, the first sequence mark is set in the first area, and the second sequence mark is set in the second area.

[0014] A method for docking a circuit board tape according to the present invention comprises providing the above-mentioned circuit board tape, the circuit board tape comprising a plurality of substrate units, wherein the first circuit layout or / and the second circuit layout of each substrate unit that does not meet the specification requirements are marked with a non-conforming mark; selecting a cutting section, using two virtual lines adjacent to the first circuit layout or / and the second circuit layout that does not meet the specification requirements as boundaries to define the cutting section, a front tape portion located before the cutting section, and a rear tape portion located after the cutting section, wherein the cutting section comprises the first circuit layout or / and the second circuit layout of each substrate unit marked with the non-conforming mark; removing the cutting section, cutting the cutting section along the two virtual lines defining the cutting section, so that the circuit board tape is separated into the front tape portion and the rear tape portion, wherein the front tape portion has a first joint end portion, and the The first joining end retains a first circuit layout of a circuit layout area and a first area of ​​a first transmission hole setting area, and the rear roll portion has a second joining end, and the second joining end retains a second circuit layout of another circuit layout area and a second area of ​​another first transmission hole setting area; and a joining step, joining the second joining edge of the second joining end with the first joining edge of the first joining end, so that the first circuit layout located at the first joining end and the second circuit layout located at the second joining end form a composite circuit layout area, and the first area located at the first joining end and the second area located at the second joining end form a composite first transmission hole setting area, and the composite first transmission hole setting area has the same number as the first transmission holes in each of the first transmission hole setting areas of each of the substrate units, and is an odd number and arranged at equal intervals.

[0015] Preferably, it further includes providing a fitting, the circuit board tape having a first surface and a second surface, the first circuit layout and the second circuit layout being arranged on the first surface, the first circuit layout located at the first joint end being projected onto the second surface and forming a first joint area, the second circuit layout located at the second joint end being projected onto the second surface and forming a second joint area, the fitting being attached to the first joint area and the second joint area so as to combine the front tape portion and the rear tape portion into one.

[0016] By means of the above technical solution, the circuit board tape and the method for connecting the same of the present invention have at least the following advantages and effects:

[0017] The present invention is to increase the number of circuit layouts in a circuit board tape of the same length by arranging the first circuit layout and the second circuit layout between three or more first transmission holes (an odd number) and three or more second transmission holes (an odd number) of each substrate unit without changing the hole pitch between the transmission holes; and to define the cutting section by two virtual lines adjacent to the first circuit layout or / and the second circuit layout that do not meet the specification requirements, so that the number of the first transmission holes in the composite first transmission hole setting area and each first transmission hole setting area of ​​each substrate unit after removing the cutting section and the joining step is the same and odd and arranged at equal intervals, so as to solve the problem in the prior art that the hole pitch between the transmission holes after joining varies due to the operator's uncertain cutting position, making it impossible to carry out subsequent processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 : A top view of the circuit board tape of the present invention.

[0019] Figure 2 : Bottom view of the circuit board tape of the present invention.

[0020] Figures 3A to 3D : Schematic diagram of a circuit board tape of the present invention having a substrate unit that does not meet specification requirements.

[0021] Figure 4 : Schematic diagram of removing the cut section of the circuit board tape of the present invention.

[0022] Figure 5 : Schematic diagram of the connection between the front and rear winding parts of the circuit board winding tape of the present invention.

[0023] Figure 6 : Schematic diagram of the connection between the front and rear winding parts of the circuit board winding tape of the present invention.

[0024] Figure 7 : A cross-sectional view of the front and rear winding portions of the circuit board winding tape of the present invention.

[0025]

Main component symbol description

[0026] 100: Circuit board tape 101: First surface

[0027] 102: Second surface 100a: Substrate unit

[0028] 100b: first joint end 100c: second joint end

[0029] 100d: first bonding edge 100e: second bonding edge

[0030] 100x: front tape portion 100y: rear tape portion

[0031] 110: first transmission hole setting area 110a: first area

[0032] 110b: Second area 110X: Compound first transmission hole setting area

[0033] 111: first transmission hole 120: second transmission hole setting area

[0034] 121: Second transmission hole 130: Circuit layout area

[0035] 130X: composite circuit layout area 131: first circuit layout

[0036] 131a: Chip setting area 131b: External pins

[0037] 131x: first bonding area 132: second circuit layout

[0038] 132a: Chip setting area 132b: External pins

[0039] 132x: Second bonding area 140: Docking mark

[0040] 141: Angle 142: First order mark

[0041] 143: Second order mark 150: Virtual line

[0042] 200: Lamination A: Unqualified mark

[0043] C: cutting section Y: transmission direction DETAILED DESCRIPTION

[0044] See also Figure 1 and Figure 2A circuit board tape 100 of the present invention has a first surface 101 and a second surface 102. The circuit board tape 100 includes a plurality of substrate units 100a arranged along a transmission direction Y. Each substrate unit 100a has a first transmission hole arrangement area 110, a second transmission hole arrangement area 120, a circuit layout area 130, and at least one docking mark 140. The first transmission hole arrangement area 110 has at least three first transmission holes 111, an odd number of which are evenly spaced on one side of the substrate unit 100a. Figure 1 and Figure 2 In the partially enlarged view in the embodiment, the first transmission hole setting area 110 is described as having 11 first transmission holes 111, but this is not limiting.

[0045] See also Figure 1 and Figure 2 The second transmission hole setting area 120 has more than three second transmission holes 121 with an odd number. Along the transmission direction Y, each second transmission hole 121 is symmetrical to each first transmission hole 111 and is arranged at equal intervals on the other side of the substrate unit 100a.

[0046] See also Figure 1 The circuit layout area 130 is located between the first transmission hole arrangement area 110 and the second transmission hole arrangement area 120. The circuit layout area 130 includes a first circuit layout 131 and a second circuit layout 132. In this embodiment, the first circuit layout 131 and the second circuit layout 132 are sequentially arranged on the first surface 101. After steps such as chip bonding and adhesive coating, the first circuit layout 131 and the second circuit layout 132 can be separated from the circuit board tape 100 into a single circuit substrate. In this embodiment, the first circuit layout 131 and the second circuit layout 132 are identical circuit layouts. The first circuit layout 131 includes a chip arrangement area 131 a and a plurality of external pins 131 b. Along the transmission direction Y, the external pins 131 b are located outside the chip arrangement area 131 a. The second circuit layout 132 includes a chip arrangement area 132 a and a plurality of external pins 132 b. Along the transmission direction Y, the external pins 132 b are located outside the chip arrangement area 132 a.

[0047] See also Figure 1 and Figure 2The docking mark 140 is at least provided on one of the first surface 101 or the second surface 102. In this embodiment, the docking mark 140 is provided in the first transmission hole setting area 110, and the docking mark 140 is located between two adjacent first transmission holes 111. A virtual line 150 extends from the docking mark 140, and the virtual line 150 is located between the first circuit layout 131 and the second circuit layout 132. There is an odd number of the first transmission holes 111 between each of the virtual lines 150 of each adjacent substrate unit 100a. Preferably, the number of the first transmission holes 111 between two adjacent virtual lines 150 is the same as the number of the first transmission holes 111 located in the first transmission hole setting area 110. The virtual line 150 divides the first transmission hole setting area 110 into the first area 1 10a and a second area 110b, the first area 110a is located on one side of the first circuit layout 131, and the second area 110b is located on one side of the second circuit layout 132, and the number of the first transmission holes 111 located in the first area 110a is an even number, and the number of the first transmission holes 111 located in the second area 110b is an odd number. In this embodiment, along the transmission direction Y, the virtual line 150 passes through the external pin 132b of the second circuit layout 132. Preferably, the virtual line 150 is located between the external pin 131b of the first circuit layout 131 and the external pin 132b of the second circuit layout 132, and the virtual line 150 does not pass through the external pin 131b of the first circuit layout 131 or the external pin 132b of the second circuit layout 132.

[0048] See also Figure 1 and Figure 2 The docking mark 140 is selected from geometric figures, numbers or text. When the docking mark 140 is a geometric figure, the docking mark 140 has an angle 141, the angle 141 is toward the circuit layout area 130, and the virtual line 150 passes through the angle 141.

[0049] See also Figure 1 and Figure 2Preferably, each substrate unit 100a further has a first sequence mark 142 and a second sequence mark 143, and the first sequence mark 142 and the second sequence mark 143 are arranged on at least one of the first surface 101 or the second surface 102. The first sequence mark 142 corresponds to the first circuit layout 131 and is located on a side of the first circuit layout 131. Preferably, the first sequence mark 142 is arranged in the first area 110a, and the second sequence mark 143 corresponds to the second circuit layout 132 and is located on a side of the second circuit layout 132. Preferably, the second sequence mark 143 is arranged in the second area 110b. The appearance of the first sequence mark 142 is different from that of the second sequence mark 143, and the appearance of the first sequence mark 142 and the second sequence mark 143 are different from those of the docking mark 140. The first sequence mark 142 and the second sequence mark 143 are selected from geometric figures, numbers or text.

[0050] See also Figures 1 to 7 The present invention provides a method for connecting a circuit board tape, which includes providing the circuit board tape 100, selecting a cut section, removing the cut section, and connecting the sections.

[0051] See also Figure 1 and Figure 2 In the step of providing the circuit board tape 100, the circuit board tape 100 has been manually or electrically tested, see Figure 3A 、 Figure 3B 、 Figure 3C and Figure 3D After manual or electrical testing, the substrate unit 100a that does not meet the specification requirements is marked with a failure mark A. The failure mark A is selected from perforation or color marking, but is not limited to this.

[0052] See also Figure 1 and Figure 3A , which illustrates an embodiment in which the second circuit layout 132 of the substrate unit 100a of the circuit board tape 100 is found to be non-compliant after inspection, and the non-compliant second circuit layout 132 is marked with a non-compliant mark A. In the step of selecting a cutting segment, two virtual lines 150 adjacent to the non-compliant second circuit layout 132 serve as boundaries to define a cutting segment C, a front tape portion 100x located before the cutting segment C, and a rear tape portion 100y located after the cutting segment C. The cutting segment C includes the second circuit layout 132 marked with the non-compliant mark A.

[0053] See also Figure 1 and Figure 3B, which illustrates an embodiment in which the first circuit layout 131 of the substrate unit 100a of the circuit board tape 100 is found to be non-compliant after inspection, and the non-compliant first circuit layout 131 is marked with the non-compliant mark A. Similarly, in the step of selecting a cutting segment, two virtual lines 150 adjacent to the non-compliant first circuit layout 131 serve as boundaries to define the cutting segment C, the front tape portion 100x, and the rear tape portion 100y. The cutting segment C includes the first circuit layout 131 marked with the non-compliant mark A.

[0054] See also Figure 1 and Figure 3C , which illustrates an embodiment in which the second circuit layout 132 of one substrate unit 100a and the first circuit layout 131 of another substrate unit 100a of the circuit board tape 100 are found to be non-compliant circuit layouts after inspection. The non-compliant second circuit layout 132 and the non-compliant first circuit layout 131 in each substrate unit 100a are marked with a non-compliant mark A. Similarly, in the step of selecting a cutting segment, two virtual lines 150 adjacent to the non-compliant second circuit layout 132 and the non-compliant first circuit layout 131 serve as boundaries to define the cutting segment C, the front tape portion 100x, and the rear tape portion 100y. The cutting segment C includes the second circuit layout 132 and the first circuit layout 131 marked with the non-compliant mark A.

[0055] See also Figure 3D , which illustrates an embodiment in which the first circuit layout 131 of one substrate unit 100a and the first circuit layout 131 of another substrate unit 100a of the circuit board tape 100 are found to be non-compliant circuit layouts after inspection, and the two non-compliant first circuit layouts 131 are marked with a non-compliant mark A. Similarly, in the step of selecting a cutting segment, two virtual lines 150 adjacent to the two non-compliant first circuit layouts 131 serve as boundaries to define the cutting segment C, the front tape portion 100x, and the rear tape portion 100y. The cutting segment C includes the two first circuit layouts 131 marked with the non-compliant mark A.

[0056] See also Figures 3A to 3D and Figure 4In the step of removing the cut section, the cut section C is cut along two imaginary lines 150 defining the cut section C, so that the circuit board tape 100 is separated into the front tape portion 100x and the rear tape portion 100y. The front tape portion 100x has a first joint end portion 100b, which retains a first circuit layout 131 of a circuit layout area 130 and a first area 110a of a first transmission hole setting area 110. The rear tape portion 100y has a second joint end portion 100c, which retains a second circuit layout 132 of another circuit layout area 130 and a second area 110b of another first transmission hole setting area 110.

[0057] See also Figure 4 and Figure 5 In the joining step, the first joining edge 100d of the first joining end portion 100b is joined to the second joining edge 100e of the second joining end portion 100c to join the front tape portion 100x and the rear tape portion 100y, and the first circuit layout 131 located at the first joining end portion 100b and the second circuit layout 132 located at the second joining end portion 100c form a composite circuit layout area 130X, and the first area 110a located at the first joining end portion 100b and the second area 110b located at the second joining end portion 100c form a composite first transmission hole setting area 110X, and the number of the first transmission holes 111 located in the composite first transmission hole setting area 110X is odd and is arranged at equal intervals on one side of the composite first transmission hole setting area 110X.

[0058] See also Figure 5 、 Figure 6 and Figure 7 In the joining step, the first joining end 100b of the front tape portion 100x and the second joining end 100c of the rear tape portion 100y are joined with a fitting member 200. In this embodiment, the first circuit layout 131 located at the first joining end 100b is projected onto the second surface 102 and forms a first joining area 131x. The second circuit layout 132 located at the second joining end 100c is projected onto the second surface 102 and forms a second joining area 132x. The fitting member 200 is attached to the first joining area 131x and the second joining area 132x to combine the front tape portion 100x and the rear tape portion 100y into one.

[0059] The present invention increases the number of circuit layouts in a circuit board tape of the same length by arranging the first circuit layout 131 and the second circuit layout 132 between three or more first transmission holes 111 (an odd number) and three or more second transmission holes 121 (an odd number) of each substrate unit 100a without changing the hole pitch between the transmission holes.

[0060] In addition, since each substrate unit 100a has the docking mark 140, the cutting section C can be defined by two virtual lines 150 adjacent to the first circuit layout 131 and / or the second circuit layout 132 that do not meet the specification requirements. Therefore, in the joining step, the composite circuit layout area 130X can have the same first circuit layout 131 and the second circuit layout 132 as each substrate unit 100a, and the composite first transmission hole setting area 110X and each first transmission hole setting area 110 of each substrate unit 100a have the same number of the first transmission holes 111, which is an odd number and arranged at equal intervals. This solves the problem in the prior art that the hole pitch between the transmission holes after joining varies due to the operator's uncertain cutting position, making it impossible to carry out subsequent processes.

[0061] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with the present profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A circuit board tape comprising a plurality of substrate units arranged along a transmission direction, characterized in that Each of the substrate units has: A first transmission hole arrangement area has three or more first transmission holes, the number of which is an odd number. The first transmission holes are arranged at equal intervals on a side edge of the base unit along the transmission direction. A second transmission hole arrangement area has three or more second transmission holes, the number of which is an odd number. Along the transmission direction, the second transmission holes are symmetrical to the first transmission holes and are arranged at equal intervals on the other side of the base unit; a circuit layout area located between the first transmission hole arrangement area and the second transmission hole arrangement area, the circuit layout area having a first circuit layout and a second circuit layout, the first circuit layout and the second circuit layout being separable from the circuit board tape into a single circuit substrate; as well as A virtual line extends from the docking mark, and the virtual line is located between the first circuit layout and the second circuit layout. An odd number of the first transmission holes is provided between the virtual lines of adjacent substrate units.

2. The circuit board tape according to claim 1, wherein: The number of the first transmission holes located between two adjacent virtual lines is the same as the number of the first transmission holes located in the first transmission hole setting area.

3. The circuit board tape according to claim 1, wherein: The virtual line divides the first transmission hole setting area into a first area and a second area, the first area is located on one side of the first circuit layout, the second area is located on one side of the second circuit layout, and the number of the first transmission holes located in the first area is an even number, and the number of the first transmission holes located in the second area is an odd number.

4. The circuit board tape according to claim 3, wherein: The docking mark is arranged in the first transmission hole arrangement area, and the docking mark is located between two adjacent first transmission holes.

5. The circuit board tape according to claim 4, wherein: Wherein, along the transmission direction, the second circuit layout has a plurality of external pins, and the virtual line passes through the external pins of the second circuit layout.

6. The circuit board tape according to claim 4, wherein: Wherein, along the transmission direction, the virtual line is located between multiple external pins of the first circuit layout and multiple external pins of the second circuit layout, and the virtual line does not pass through the external pins of the first circuit layout or the external pins of the second circuit layout.

7. The circuit board tape according to claim 3, wherein: The docking mark is selected from geometric figures, numbers or text. When the docking mark is a geometric figure, the docking mark has an angle, the angle faces the circuit layout area, and the virtual line passes through the angle.

8. The circuit board tape according to claim 3, wherein: Each substrate unit further has a first sequence mark and a second sequence mark, the first sequence mark corresponds to the first circuit layout and is located on one side of the first circuit layout, the second sequence mark corresponds to the second circuit layout and is located on one side of the second circuit layout, the appearance of the first sequence mark is different from the appearance of the second sequence mark, and the appearance of the first sequence mark and the second sequence mark are different from the docking mark, and the first sequence mark and the second sequence mark are selected from geometric figures, numbers or text.

9. The circuit board tape according to claim 8, wherein: The first sequence mark is set in the first area, and the second sequence mark is set in the second area.

10. A method for connecting a circuit board tape, characterized in that: Include: A circuit board tape according to any one of claims 1 to 9 is provided, wherein the circuit board tape comprises a plurality of substrate units, and the first circuit layout and / or the second circuit layout of each substrate unit that does not meet specification requirements is marked with a rejection mark; Selecting a cutting section, using two imaginary lines adjacent to the first circuit layout or / and the second circuit layout that do not meet the specification requirements as boundaries to define the cutting section, a front tape portion located before the cutting section, and a rear tape portion located after the cutting section, wherein the cutting section includes the substrate units of the first circuit layout or / and the second circuit layout marked with the unqualified mark; removing the cut section and cutting the cut section along two imaginary lines defining the cut section to separate the circuit board tape into the front tape portion and the rear tape portion, wherein the front tape portion has a first joint end portion retaining a first circuit layout of a circuit layout area and a first area of ​​a first transmission hole setting area, and the rear tape portion has a second joint end portion retaining a second circuit layout of another circuit layout area and a second area of ​​another first transmission hole setting area; and A joining step is to join the first joining edge of the first joining end to the second joining edge of the second joining end, so that the first circuit layout located at the first joining end and the second circuit layout located at the second joining end form a composite circuit layout area, and the first area located at the first joining end and the second area located at the second joining end form a composite first transmission hole setting area, and the composite first transmission hole setting area has the same number as the first transmission holes in each of the first transmission hole setting areas of each of the substrate units, which is an odd number and is arranged at equal intervals.

11. The method for connecting circuit board tapes according to claim 10, wherein: It also includes providing a bonding piece, the circuit board tape has a first surface and a second surface, the first circuit layout and the second circuit layout are arranged on the first surface, the first circuit layout located at the first joint end is projected onto the second surface and forms a first joint area, and the second circuit layout located at the second joint end is projected onto the second surface and forms a second joint area, and the bonding piece is attached to the first joint area and the second joint area to combine the front tape portion and the rear tape portion into one.

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