Wafer bonding method and system

Abstract

Embodiments of the present application provide a wafer bonding method and system, the method comprising: providing a bonding relationship, the bonding relationship being used to indicate a bonding between at least two wafer groups; obtaining basic information of a wafer group corresponding to the bonding relationship according to the bonding relationship; performing a first rule check on the basic information, and after the check is successful, transferring the wafer group to a bonding site; updating the basic information of the wafer group transferred to the bonding site to obtain updated basic information; performing a second rule check on the updated basic information, and after the check is successful, performing wafer bonding on the wafer group transferred to the bonding site according to the bonding relationship.

Description

[0001] Case Analysis

[0002] This application is a divisional application of Chinese patent application No. 202011375319.4, filed on November 30, 2020, entitled "A Wafer Bonding Method and System". Technical Field

[0003] This application relates to the field of semiconductor manufacturing, and more particularly to a wafer bonding method and system. Background Technology

[0004] Currently, wafer bonding processes are typically controlled manually. Wafer bonding is usually selected based on the number of layers the wafers are in within a wafer cassette. For example, the first wafer to be bonded is placed in the first wafer cassette, and the second wafer to be bonded is placed in the second wafer cassette. The first wafer is taken from the first layer of the first wafer cassette, and the second wafer is taken from the first layer of the second wafer cassette for bonding, without considering the potential problems of individual wafers within the wafer cassette, such as defects. This results in a very low yield rate for the bonded products. Summary of the Invention

[0005] In view of this, embodiments of this application provide a wafer bonding method and system to solve at least one problem existing in the prior art.

[0006] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows:

[0007] In a first aspect, embodiments of this application provide a wafer bonding method, the method comprising:

[0008] Provide a bonding relationship, which is used to indicate bonding between at least two wafer sets;

[0009] Based on the bonding relationship, obtain the basic information of the wafer group corresponding to the bonding relationship;

[0010] The basic information is checked using the first rule. If the check is successful, the wafer assembly is transmitted to the bonding site.

[0011] The basic information of the wafer group transmitted to the bonding site is updated to obtain the updated basic information;

[0012] The updated basic information is checked using a second rule. If the check is successful, the wafer assembly transmitted to the bonding site is bonded according to the bonding relationship.

[0013] In one optional implementation, the basic information includes at least one of the following: wafer group process information, wafer group health information, wafer grade within the wafer group, wafer group abnormal status, wafer group risk assessment, wafer group process abnormality, and wafer group defects.

[0014] In one optional implementation, before performing the first rule check on the basic information, the method further includes:

[0015] Based on the basic information, the yield of the wafer group after bonding corresponding to the bonding relationship is predicted, and the predicted bonding result is obtained.

[0016] If the predicted bonding result meets the preset criteria, then the first rule check is performed.

[0017] In one optional implementation, before performing the first rule check on the basic information, the method further includes:

[0018] The basic information is checked using a third rule. Once the check is successful, the basic information is uploaded to the information backup site.

[0019] In one alternative implementation, the third rule includes at least one of the following: whether the product identifier matches, whether the wafer grade matches, whether the wafer group is arranged for bonding, and whether the wafer is bonded to multiple wafers.

[0020] In one optional implementation, before performing the first rule check on the basic information, the method further includes:

[0021] Verify whether the fabrication process of the aforementioned wafer set has been completed;

[0022] Once the wafer assembly fabrication process is complete, the wafer assembly identifier is sent to the bonding site.

[0023] In one alternative implementation, the first rule includes at least one of the following: whether the wafer group fabrication process is completed, whether the product identification matches, whether the bonding type and pairing combination matches, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, and whether the wafer is bonded to multiple wafers.

[0024] In one alternative implementation, the second rule includes at least one of the following: whether the wafer group fabrication process is completed, whether the product identification matches, whether the bonding type and pairing combination matches, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, whether the wafer is bonded to multiple wafers, and whether the wafer group is qualified.

[0025] In one optional implementation, if the verification fails during the first rule check, the second rule check, or the third rule check, a system error is reported, and the binding relationship is re-acquired.

[0026] In one alternative implementation, before transferring the wafer assembly to the bonding site, the method further includes:

[0027] The fabrication process of the wafer assembly is obtained based on the basic information;

[0028] The bonding type is determined based on the preparation process.

[0029] In one optional implementation, before performing the first rule check based on the basic information, the method further includes:

[0030] The bonding relationship is modified;

[0031] Determine whether the fabrication process of the wafer assembly corresponding to the bonding relationship has been completed;

[0032] If the fabrication process of the wafer assembly is not completed, the bonding relationship is successfully changed;

[0033] If the fabrication process of the wafer assembly has been completed, the bonding relationship change will not be successful.

[0034] In an optional implementation, if the bonding relationship is successfully changed, the method further includes:

[0035] Based on the modified bonding relationship, the basic information of the modified wafer set corresponding to the modified bonding relationship is re-acquired.

[0036] Based on the modified wafer set basic information, the first rule check and the second rule check are performed sequentially. After the check is successful, wafer bonding is performed according to the modified bonding relationship.

[0037] Secondly, embodiments of this application provide a wafer bonding system, comprising:

[0038] A receiving module is configured to provide a bonding relationship, the bonding relationship being used to indicate bonding between at least two wafer sets;

[0039] The process module is used to obtain basic information about the wafer group corresponding to the bonding relationship based on the bonding relationship;

[0040] The transition module is used to perform a first rule check on the basic information, and after the check is successful, the wafer assembly is transmitted to the bonding site.

[0041] An update module is used to update the basic information of the wafer group transmitted to the bonding site to obtain the updated basic information;

[0042] The bonding module is used to perform a second rule check on the updated basic information, and after the check is successful, to perform wafer bonding on the wafer group transmitted to the bonding station according to the bonding relationship.

[0043] In one optional implementation, the basic information includes at least one of the following: wafer group process information, wafer group health information, wafer grade within the wafer group, wafer group abnormal status, wafer group risk assessment, wafer group process abnormality, and wafer group defects.

[0044] In one alternative implementation, it further includes:

[0045] The prediction module is used to predict the yield of the wafer group after bonding based on the basic information, and obtain the predicted bonding result.

[0046] If the predicted bonding result meets the preset criteria, then the first rule check is performed.

[0047] In one alternative implementation, it further includes:

[0048] The backup module is used to perform third-rule verification on the basic information, and upload the basic information to the information backup site after successful verification.

[0049] In one alternative implementation, the third rule includes at least one of the following: whether the product identifier matches, whether the wafer grade matches, whether the wafer group is arranged for bonding, and whether the wafer is bonded to multiple wafers.

[0050] In one alternative implementation, it further includes:

[0051] The process control module is used to verify whether the fabrication process of the wafer assembly has been completed.

[0052] Once the wafer assembly fabrication process is complete, the wafer assembly identifier is sent to the bonding site.

[0053] In one alternative implementation, the first rule includes at least one of the following: whether the wafer group fabrication process is completed, whether the product identification matches, whether the bonding type and pairing combination matches, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, and whether the wafer is bonded to multiple wafers.

[0054] In one alternative implementation, the second rule includes at least one of the following: whether the wafer group fabrication process is completed, whether the product identification matches, whether the bonding type and pairing combination matches, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, whether the wafer is bonded to multiple wafers, and whether the wafer group is qualified.

[0055] In one optional implementation, if the verification fails during the steps of the transition module performing the first rule check, the bonding module performing the second rule check, or the backup module performing the third rule check, a system error is reported, and the bonding relationship is re-acquired through the receiving module.

[0056] In one alternative implementation, it further includes:

[0057] The determination module is used to obtain the fabrication process of the wafer assembly based on the basic information; and to determine the bonding type based on the fabrication process.

[0058] In one alternative implementation, it further includes:

[0059] The modification module is used to modify the bonding relationship; determine whether the fabrication process of the wafer group corresponding to the bonding relationship is completed; if the fabrication process of the wafer group is not completed, the bonding relationship modification is successful; if the fabrication process of the wafer group is completed, the bonding relationship modification is unsuccessful.

[0060] In an optional implementation, if the bonding relationship is successfully changed, the process module is further configured to re-obtain the basic information of the changed wafer set corresponding to the changed bonding relationship based on the changed bonding relationship.

[0061] The transition module is also used to perform a first rule check based on the modified basic information of the wafer batch, and the bonding module is also used to perform a second rule check based on the modified basic information of the wafer batch. After the check is successful, wafer bonding is performed according to the modified bonding relationship.

[0062] This application provides a wafer bonding method and system. The method includes: providing a bonding relationship, which indicates bonding between at least two wafer groups; obtaining basic information of the wafer group corresponding to the bonding relationship; performing a first rule check on the basic information, and transmitting the wafer group to a bonding station after successful check; updating the basic information of the wafer group transmitted to the bonding station to obtain updated basic information; performing a second rule check on the updated basic information, and performing wafer bonding on the wafer group transmitted to the bonding station according to the bonding relationship after successful check. This application provides a wafer bonding method that obtains basic information of the corresponding wafer group through the bonding relationship, and performs a first rule check and a second rule check based on the basic information of the wafer group before bonding to ensure the quality of the wafer group during bonding. This not only greatly improves the yield of wafer bonding but also strengthens the control of the bonding process. Attached Figure Description

[0063] Figure 1 A schematic diagram illustrating the implementation process of a wafer bonding method provided in an embodiment of this application;

[0064] Figure 2 A schematic diagram of the wafer-level structure provided for embodiments of this application;

[0065] Figure 3 A schematic diagram illustrating the implementation process of a wafer bonding method provided in an embodiment of this application;

[0066] Figure 4 This is a schematic diagram of the composition structure of a wafer bonding system provided in an embodiment of this application. Detailed Implementation

[0067] Exemplary embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope of the disclosure of the present application to those skilled in the art.

[0068] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0069] In the accompanying drawings, for clarity, the dimensions of layers, areas, and elements, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0070] It should be understood that spatial relation terms such as “below,” “under,” “below,” “below,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “below” can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0071] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0072] This application provides a wafer bonding method. Figure 1 This is a schematic diagram illustrating the implementation process of a wafer bonding method provided in an embodiment of this application, as shown below. Figure 1 As shown, the method mainly includes the following steps:

[0073] Step 101: Provide a bonding relationship, which is used to indicate the bonding between at least two wafer sets.

[0074] In this application embodiment, a bonding relationship is provided to indicate bonding between at least two wafer groups, such as indicating bonding between a first wafer group and a second wafer group. It should be noted that the embodiments of this application are not limited to this; the wafer bonding method provided in this application embodiment can also be used for bonding between more than two wafer groups. In practical applications, the bonding relationship between the wafer groups to be bonded can be set according to actual bonding requirements. It should be noted that this application embodiment uses the bonding relationship to indicate bonding between two wafer groups as an example for illustration; however, the execution of the wafer bonding method may include multiple sets of bonding relationships as described above. In other words, in practical applications, the wafer bonding method provided in this application embodiment can be executed according to multiple sets of bonding relationships. Here, the wafers within the wafer group corresponding to the bonding relationship may include silicon, germanium, silicon carbide, silicon on insulating substrate, or a combination thereof. In some embodiments, the wafers within the wafer group corresponding to the bonding relationship may include silicon (such as monocrystalline silicon, polycrystalline silicon), silicon germanium, gallium arsenide, germanium, silicon-coated insulator, germanium-coated insulator, or any suitable combination thereof. In practical applications, the first wafer group may be a memory array wafer group, and the second wafer group may be a peripheral circuit wafer group.

[0075] In this embodiment, 25 wafers can be defined as a wafer lot. The fabrication process of the wafer lot is performed in wafer lot form. It should be noted that the first wafer lot and the second wafer lot have the same number of wafers, thus allowing for one-to-one bonding of wafers in the first wafer lot and wafers in the second wafer lot. In practical applications, the bonding between the first wafer lot and the second wafer lot specifically refers to the bonding between one wafer in the first wafer lot and one wafer in the second wafer lot.

[0076] It should be noted that when providing the bonding relationship, the wafer set corresponding to the bonding relationship may not have completed its fabrication process yet. Since the bonding method provided in this application involves numerous preliminary verification procedures, to save bonding time, preliminary verification of the bonding process can be performed before the wafer set has completed its fabrication process.

[0077] Step 102: Obtain the basic information of the wafer group corresponding to the bonding relationship based on the bonding relationship.

[0078] In this embodiment of the application, based on the bonding relationship, basic information of the wafer group corresponding to the bonding relationship is obtained from the wafer fabrication process control system. The basic information includes at least one of the following: wafer lot process information, wafer lot health information, wafer grade within the wafer group, wafer abnormal status, wafer lot risk evaluation, wafer lot process different from standard process, and wafer lot defect.

[0079] Figure 2 A schematic diagram of the wafer-level provided in the embodiments of this application, as shown below. Figure 2 As shown, the wafers in the wafer group can be classified into four levels: Normal, Low Risk, Middle Risk, and High Risk.

[0080] In this embodiment, the wafer fabrication process control system is a system that controls all fabrication processes of the wafer group. The wafer fabrication process control system contains the process flow for each step the wafer needs to undergo. That is, the wafer fabrication process control system schedules the processes to be performed on the memory array wafer group and the peripheral circuit wafer group.

[0081] In this embodiment, the yield of the wafer group after bonding corresponding to the bonding relationship can be predicted based on the basic information to obtain a predicted bonding result. If the predicted bonding result meets a preset standard, a first rule check is performed. In practical applications, the process properties and yield of the wafer group corresponding to the bonding relationship can be predicted first based on the basic information, and then the yield of the wafer group after bonding can be predicted based on the process properties and yield of the wafer group to obtain a predicted bonding result. If the predicted bonding result meets the preset standard, a first rule check is then performed.

[0082] In this embodiment, before performing the first rule check, a third rule check can be performed on the basic information. After successful verification, the basic information is uploaded to an information backup site. The third rule includes at least one of the following: product ID matching, wafer grade matching, wafer lot bonding, and wafer bonding with multiple wafers. Here, the third rule is a bonding rule. Performing a third rule check on the basic information is equivalent to performing a bonding rule check on the basic information. Here, the product ID matching is used as an example to illustrate the third rule. The product ID can be used to obtain the number of layers and the fabrication process of the product, such as a 64-layer product, a 64-layer memory array process, and a 64-layer peripheral circuit process. Based on the basic information of the wafer group, it is determined whether the number of layers and the fabrication process of the wafers within the wafer group match the number of layers and the fabrication process of the product obtained through the product ID. If they match, the first rule check is successful.

[0083] In this embodiment of the application, if the third rule verification fails, a system error is reported, and the key relationship is re-acquired. In practical applications, if the third rule verification fails, a system error will be reported. After receiving the system error instruction, the engineer will update the key relationship, and after the system is refreshed, the updated key relationship can be re-acquired.

[0084] In this embodiment, the information backup site can be an information transmission site between the wafer fabrication process control system and the bonding management system. The basic information is uploaded to the information backup site, allowing the bonding management system to retrieve the basic information from the information backup site.

[0085] In this embodiment, after performing the third rule check, it can also be checked whether the fabrication process of the wafer group is complete; if the fabrication process of the wafer group is complete, the wafer group identifier is sent to the bonding site. In practical applications, the fabrication processes of the memory array wafer group and the peripheral circuit wafer group can be checked separately; if the fabrication process of the memory array wafer group is completed first, the memory array wafer group identifier is sent to the bonding site first; if the fabrication process of the peripheral circuit wafer group is completed first, the peripheral circuit wafer group identifier is sent to the bonding site first. Here, the bonding site is the site where the bonding process is performed, and the bonding process of the bonding site is controlled by the bonding management system.

[0086] Step 103: Perform a first rule check on the basic information. If the check is successful, transfer the wafer assembly to the bonding site.

[0087] In this embodiment, the basic information is checked using a first rule. Upon successful verification, the wafer group is transferred to the bonding station. The first rule includes at least one of the following: whether the wafer group's fabrication process is complete, whether the product ID matches, whether the bond type and pairing group match, whether the wafer grade matches, whether the wafer group ID covers every wafer, whether bonding is arranged in the wafer group, and whether the wafer is bonded to multiple wafers. Here, after successful verification of the first rule, the wafer group is transferred from the wafer fabrication process control system to the bonding station of the bonding management system.

[0088] In this embodiment of the application, if the first rule verification fails, a system error is reported, and the key relationship is re-acquired. In practical applications, if the first rule verification fails, a system error will be reported. After receiving the system error instruction, the engineer will update the key relationship, and after the system is refreshed, the updated key relationship can be re-acquired.

[0089] In this embodiment, before transferring the wafer assembly to the bonding site, the method further includes: obtaining the fabrication process of the wafer assembly based on the basic information; and determining the bonding type based on the fabrication process. Specifically, obtaining the fabrication process of the wafer assembly based on the basic information can involve obtaining the fabrication processes of the memory array wafer assembly and the peripheral circuit wafer assembly based on the basic information, and then classifying the memory array wafer assembly and the peripheral circuit wafer assembly for bonding based on their respective fabrication processes. In practical applications, the wafer assembly can be classified for bonding based on the risk level associated with its fabrication process. Different bonding types correspond to different bonding yields based on the bonding types obtained from the bonding classification, thus the bonding yield can be obtained based on the bonding type. It should be noted that the bonding yield here is only a predicted yield.

[0090] Step 104: Update the basic information of the wafer group transmitted to the bonding site to obtain the updated basic information.

[0091] In this embodiment, after the wafer assembly arrives at the bonding site, the basic information of the wafer assembly is updated to obtain updated basic information. Here, the updated basic information can be obtained from the wafer fabrication process control system.

[0092] Step 105: Perform a second rule check on the updated basic information. If the check is successful, perform wafer bonding on the wafer group transmitted to the bonding site according to the bonding relationship.

[0093] In this embodiment, the updated basic information is checked using a second rule. Upon successful verification, the bonding management system controls the wafer group transferred to the bonding station for wafer bonding based on the bonding relationship. The second rule includes at least one of the following: whether the wafer group's fabrication process is complete, whether the product ID matches, whether the bond type and pairing group match, whether the wafer grade matches, whether the wafer group ID covers every wafer, whether the wafer group is arranged for bonding, whether the wafer is bonded with multiple wafers, and whether the wafer group is qualified. Here, the qualification of the wafer group is used to determine whether any accidents, such as contamination, occurred when the wafer group was transferred to the bonding station.

[0094] In this embodiment, if the second rule verification fails, a system error is reported, and the key relationship is re-acquired. In practical applications, if the second rule verification fails, a system error will be reported. After receiving the system error instruction, the engineer will update the key relationship, and after the system is refreshed, the updated key relationship can be re-acquired.

[0095] In this embodiment of the application, a bonding information system is also provided. This system tracks the process progress of the wafer set in real time. Every process the wafer set undergoes is recorded by the bonding information system. In addition, the system also records the wafer set's health information, wafer grade within the wafer set, abnormal states of the wafer set, risk assessments of the wafer set, process anomalies, and defects. This allows the wafer set to perform bonding checks based on its own basic information during bonding process verification and to perform bonding based on that information.

[0096] In this embodiment, the bonding relationship can also be modified. The specific process is as follows: modify the bonding relationship; determine whether the fabrication process of the wafer group corresponding to the bonding relationship is complete; if the fabrication process of the wafer group is not complete, the bonding relationship modification is successful; if the fabrication process of the wafer group is complete, the bonding relationship modification is unsuccessful. In some embodiments, it can also be further determined whether the fabrication process of the wafer group corresponding to the bonding relationship is complete; if the fabrication process of the wafer group is not complete, the bonding relationship is modified; if the fabrication process of the wafer group is complete, the bonding relationship cannot be modified.

[0097] In this embodiment of the application, if the bonding relationship is successfully changed, the basic information of the changed wafer group corresponding to the changed bonding relationship is re-obtained according to the changed bonding relationship; the third rule check, the first rule check, and the second rule check are performed in sequence according to the basic information of the changed wafer group; after the check is successful, wafer bonding is performed according to the changed bonding relationship.

[0098] The wafer bonding method provided in this application embodiment can also be applied to situations where no bonding relationship is provided. The wafer to be bonded can be provided directly, and the wafer to be bonded can be subjected to a series of pre-bonding checks through the above wafer bonding method. Wafer bonding can be performed after the checks are successful.

[0099] This application provides a wafer bonding method, comprising: providing a bonding relationship, the bonding relationship indicating bonding between at least two wafer groups; obtaining basic information of the wafer group corresponding to the bonding relationship; performing a first rule check on the basic information, and transmitting the wafer group to a bonding station after successful check; updating the basic information of the wafer group transmitted to the bonding station to obtain updated basic information; performing a second rule check on the updated basic information, and performing wafer bonding on the wafer group transmitted to the bonding station according to the bonding relationship after successful check. This application provides a wafer bonding method that obtains basic information of the corresponding wafer group through a provided bonding relationship, and performs a first rule check and a second rule check based on the basic information of the wafer group before bonding to ensure the quality of the wafer group during bonding. This not only greatly improves the yield of wafer bonding but also strengthens the control of the bonding process.

[0100] This application provides a wafer bonding method. Figure 3 This application provides a schematic diagram of the implementation process of a wafer bonding method, which mainly includes the following steps:

[0101] Step 301: Provide the bonding relationship.

[0102] In this embodiment of the application, the bonding relationship is used to indicate the bonding between at least two wafer groups; basic information of the wafer group corresponding to the bonding relationship is obtained according to the bonding relationship.

[0103] Step 302: Based on the basic information, predict the yield of the wafer group after bonding corresponding to the bonding relationship, and obtain the predicted bonding result.

[0104] In this embodiment of the application, if the predicted bonding result meets the preset standard, then step 303 is executed; if the predicted bonding result does not meet the preset standard, then the system rejects the bonding and returns to step 301.

[0105] Step 303: Perform the third rule check.

[0106] In this embodiment of the application, if the third rule verification is successful, step 304 is executed; if the third rule verification is unsuccessful, the system reports an error and performs a system refresh. After the system refresh indicates that the system error has been processed, the process returns to step 301 to re-acquire the bonding relationship.

[0107] Step 304: Upload the basic information to the information backup site.

[0108] Step 305: Verify whether the fabrication process of the wafer assembly is complete.

[0109] In this embodiment of the application, if the wafer assembly fabrication process is completed, step 306 is executed; if the wafer assembly fabrication process is not completed, step 306 is executed after the wafer assembly fabrication process is completed.

[0110] Step 306: Send the wafer group identifier to the bonding site.

[0111] Step 307: Perform the first rule check.

[0112] In this embodiment of the application, if the first rule verification is successful, step 308 is executed; if the first rule verification is unsuccessful, the system reports an error and performs a system refresh. After the system refresh indicates that the system error has been processed, the process returns to step 301 to re-acquire the bonding relationship.

[0113] Step 308: Transfer the wafer assembly to the bonding site.

[0114] Step 309: Perform the second rule check.

[0115] In this embodiment of the application, if the second rule verification is successful, step 310 is executed; if the second rule verification is unsuccessful, the system reports an error and performs a system refresh. After the system refresh indicates that the system error has been processed, the process returns to step 301 to re-acquire the bonding relationship.

[0116] Step 310: Perform wafer bonding on the wafer group transmitted to the bonding station according to the bonding relationship.

[0117] This application provides a wafer bonding method. The method first predicts the bonding result using basic information about the wafer set. If the bonding result meets preset standards, it then sequentially passes a third rule check, a first rule check, and a second rule check. Only after all checks are successfully passed can the wafer set, delivered to the bonding station, be bonded according to the bonding relationship. Thus, this method incorporates multiple checkpoints to ensure the yield of the bonded wafers and the overall yield after bonding. Furthermore, if a check fails during each process, a system error is reported to facilitate troubleshooting and resolution by engineers, thereby improving the control and optimization of the bonding process.

[0118] Based on the same technical concept as the aforementioned wafer bonding methods, embodiments of this application provide a wafer bonding system. In some embodiments, the wafer bonding system can be implemented using software modules. Figure 4 This is a schematic diagram of the composition structure of a wafer bonding system provided in an embodiment of this application. See also... Figure 4 The wafer bonding system 400 provided in this application embodiment includes:

[0119] Receiver module 401 is configured to provide a bonding relationship, the bonding relationship being used to indicate bonding between at least two wafer sets;

[0120] Process module 402 is used to obtain basic information of the wafer group corresponding to the bonding relationship based on the bonding relationship;

[0121] Transition module 403 is used to perform a first rule check on the basic information, and after the check is successful, the wafer assembly is transmitted to the bonding site;

[0122] Update module 404 is used to update the basic information of the wafer group transmitted to the bonding site to obtain the updated basic information;

[0123] The bonding module 405 is used to perform a second rule check on the updated basic information, and after the check is successful, perform wafer bonding on the wafer group transmitted to the bonding station according to the bonding relationship.

[0124] In other embodiments, the basic information includes at least one of the following: wafer group process information, wafer group health information, wafer grade within the wafer group, wafer group abnormal status, wafer group risk assessment, wafer group process abnormality, and wafer group defects.

[0125] In other embodiments, it also includes:

[0126] Prediction module 406 is used to predict the yield of the wafer group after bonding corresponding to the bonding relationship based on the basic information, and obtain the predicted bonding result;

[0127] If the predicted bonding result meets the preset criteria, then the first rule check is performed.

[0128] In other embodiments, it also includes:

[0129] The backup module 407 is used to perform a third-rule check on the basic information, and after the check is successful, upload the basic information to the information backup site.

[0130] In other embodiments, the third rule includes at least one of the following: whether the product identifier matches, whether the wafer grade matches, whether the wafer group is arranged for bonding, and whether the wafer is bonded to multiple wafers.

[0131] In other embodiments, it also includes:

[0132] Process control module 408 is used to check whether the fabrication process of the wafer assembly is completed;

[0133] Once the wafer assembly fabrication process is complete, the wafer assembly identifier is sent to the bonding site.

[0134] In other embodiments, the first rule includes at least one of the following: whether the wafer group fabrication process is completed, whether the product identification matches, whether the bonding type and pairing combination matches, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, and whether the wafer is bonded to multiple wafers.

[0135] In other embodiments, the second rule includes at least one of the following: whether the wafer group fabrication process is completed, whether the product identification matches, whether the bonding type and pairing combination matches, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, whether the wafer is bonded to multiple wafers, and whether the wafer group is qualified.

[0136] In other embodiments, if the verification fails during the steps of the transition module 403 performing the first rule check, the bonding module 405 performing the second rule check, or the backup module 407 performing the third rule check, a system error is reported, and the bonding relationship is re-acquired through the receiving module 401.

[0137] In other embodiments, it also includes:

[0138] The determination module 409 is used to obtain the fabrication process of the wafer assembly based on the basic information; and to determine the bonding type based on the fabrication process.

[0139] In other embodiments, it also includes:

[0140] The modification module 410 is used to modify the bonding relationship; determine whether the fabrication process of the wafer group corresponding to the bonding relationship is completed; if the fabrication process of the wafer group is not completed, the bonding relationship modification is successful; if the fabrication process of the wafer group is completed, the bonding relationship modification is unsuccessful.

[0141] In other embodiments, if the bonding relationship is successfully changed, the process module 402 is further configured to re-obtain the basic information of the changed wafer set corresponding to the changed bonding relationship based on the changed bonding relationship.

[0142] The transition module 403 is further configured to perform a first rule check based on the modified basic information of the wafer batch, and the bonding module 405 is further configured to perform a second rule check based on the modified basic information of the wafer batch. After successful check, wafer bonding is performed based on the modified bonding relationship.

[0143] In the embodiments of this application, the components can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional module.

[0144] It is understood that the embodiments described herein can be implemented in hardware, software, firmware, middleware, microcode, or a combination thereof. For hardware implementation, the processing unit can be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), general-purpose processors, controllers, microcontrollers, microprocessors, other electronic units for performing the functions described herein, or combinations thereof.

[0145] For software implementation, the techniques described herein can be achieved through modules (e.g., procedures, functions, etc.) that perform the functions described herein. The software code can be stored in memory and executed by a processor. The memory can be implemented within the processor or externally.

[0146] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this application, the sequence numbers of the above-described processes do not imply a sequential order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application. The sequence numbers of the above-described embodiments are merely descriptive and do not represent the superiority or inferiority of the embodiments.

[0147] In the several embodiments provided in this application, it should be understood that the disclosed methods and apparatus can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple units or components can be combined, or integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, and can be electrical, mechanical, or other forms.

[0148] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected to achieve the purpose of this embodiment according to actual needs.

[0149] Furthermore, in the various embodiments of this application, all functional units can be integrated into one processing module, or each unit can be a separate unit, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or in a combination of hardware and software functional units. Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps of the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as mobile storage devices, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0150] The methods disclosed in the several method embodiments provided in this application can be arbitrarily combined without conflict to obtain new method embodiments.

[0151] The features disclosed in the several product embodiments provided in this application can be arbitrarily combined without conflict to obtain new product embodiments.

[0152] The features disclosed in the several method or device embodiments provided in this application can be arbitrarily combined without conflict to obtain new method or device embodiments.

[0153] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A wafer bonding method, characterized in that, The method includes: A bonding relationship is provided to indicate bonding between at least two wafer groups; the at least two wafer groups include a first wafer group and a second wafer group, wherein the first wafer group and the second wafer group contain the same number of wafers; Based on the bonding relationship, obtain the basic information of the wafer group corresponding to the bonding relationship; the basic information includes at least one of the following: wafer group process information, wafer group health information, wafer grade within the wafer group, wafer group abnormal status, wafer group risk assessment, wafer group process abnormality, and wafer group defects. The basic information is checked according to the first rule. If the check is successful, the wafer group is transmitted to the bonding site. The first rule includes at least one of the following: whether the wafer group's fabrication process is completed, whether the product identification matches, whether the bonding type and pairing combination matches, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, and whether the wafer is bonded to multiple wafers. The basic information of the wafer group transmitted to the bonding site is updated to obtain the updated basic information; The updated basic information is checked using a second rule. If the check is successful, the wafer group transmitted to the bonding site is bonded according to the bonding relationship. The second rule includes at least one of the following: whether the wafer group's fabrication process is complete, whether the product identification matches, whether the bonding type and pairing combination matches, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, whether the wafer is bonded to multiple wafers, and whether the wafer group is qualified.

2. The wafer bonding method according to claim 1, characterized in that, Before performing the first rule check on the basic information, the method further includes: Based on the basic information, the yield of the wafer group after bonding corresponding to the bonding relationship is predicted, and the predicted bonding result is obtained. If the predicted bonding result meets the preset criteria, then the first rule check is performed.

3. The wafer bonding method according to claim 1, characterized in that, Before performing the first rule check on the basic information, the method further includes: The basic information is checked using a third rule. Once the check is successful, the basic information is uploaded to the information backup site.

4. The wafer bonding method according to claim 3, characterized in that, The third rule includes at least one of the following: whether the product identification matches, whether the wafer grade matches, whether the wafer group is arranged for bonding, and whether the wafer is bonded to multiple wafers.

5. The wafer bonding method according to claim 1, characterized in that, Before performing the first rule check on the basic information, the method further includes: Verify whether the fabrication process of the aforementioned wafer set has been completed; Once the wafer assembly fabrication process is complete, the wafer assembly identifier is sent to the bonding site.

6. The wafer bonding method according to claim 3, characterized in that, If the verification fails during the first rule check, the second rule check, or the third rule check, a system error is reported, and the binding relationship is retrieved again.

7. The wafer bonding method according to claim 1, characterized in that, Before transferring the wafer assembly to the bonding site, the method further includes: The fabrication process of the wafer assembly is obtained based on the basic information; The bonding type is determined based on the preparation process.

8. The wafer bonding method according to claim 1, characterized in that, Before performing the first rule check based on the basic information, the method further includes: The bonding relationship is modified; Determine whether the fabrication process of the wafer assembly corresponding to the bonding relationship has been completed; If the fabrication process of the wafer assembly is not completed, the bonding relationship is successfully changed; If the fabrication process of the wafer assembly has been completed, the bonding relationship change will not be successful.

9. The wafer bonding method according to claim 8, characterized in that, If the bonding relationship is successfully changed, the method further includes: Based on the modified bonding relationship, the basic information of the modified wafer set corresponding to the modified bonding relationship is re-acquired. Based on the modified wafer set basic information, the first rule check and the second rule check are performed sequentially. After the check is successful, wafer bonding is performed according to the modified bonding relationship.

10. A wafer bonding system, characterized in that, include: A receiving module is configured to provide a bonding relationship, the bonding relationship being used to indicate bonding between at least two wafer sets; The at least two wafer groups include a first wafer group and a second wafer group, wherein the number of wafers in the first wafer group and the second wafer group is the same; The process module is used to obtain basic information of the wafer group corresponding to the bonding relationship based on the bonding relationship; the basic information includes at least one of the following: wafer group process information, wafer group health information, wafer grade within the wafer group, wafer group abnormal status, wafer group risk assessment, wafer group process abnormality, and wafer group defects. The transition module is used to perform a first rule check on the basic information, and after the check is successful, the wafer group is transmitted to the bonding site; the first rule includes at least one of the following: whether the wafer group's fabrication process is completed, whether the product identification matches, whether the bonding type and pairing combination matches, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, and whether the wafer is bonded to multiple wafers. An update module is used to update the basic information of the wafer group transmitted to the bonding site to obtain the updated basic information; The bonding module is used to perform a second rule check on the updated basic information, and after the check is successful, perform wafer bonding on the wafer group transmitted to the bonding station according to the bonding relationship. The second rule includes at least one of the following: whether the wafer group fabrication process is completed, whether the product identification matches, whether the bonding type and pairing combination matches, whether the wafer grade matches, whether the wafer group identification covers each wafer, whether the wafer group is arranged for bonding, whether the wafer is bonded to multiple wafers, and whether the wafer group is qualified.

11. The wafer bonding system according to claim 10, characterized in that, Also includes: The prediction module is used to predict the yield of the wafer group after bonding based on the basic information, and obtain the predicted bonding result. If the predicted bonding result meets the preset criteria, then the first rule check is performed.

12. The wafer bonding system according to claim 10, characterized in that, Also includes: The backup module is used to perform third-rule verification on the basic information, and upload the basic information to the information backup site after successful verification.

13. The wafer bonding system according to claim 12, characterized in that, The third rule includes at least one of the following: whether the product identification matches, whether the wafer grade matches, whether the wafer group is arranged for bonding, and whether the wafer is bonded to multiple wafers.

14. The wafer bonding system according to claim 10, characterized in that, Also includes: The process control module is used to verify whether the fabrication process of the wafer assembly has been completed. Once the wafer assembly fabrication process is complete, the wafer assembly identifier is sent to the bonding site.

15. The wafer bonding system according to claim 12, characterized in that, If the verification fails during the steps of the transition module performing the first rule check, the bonding module performing the second rule check, or the backup module performing the third rule check, a system error is reported, and the bonding relationship is re-acquired through the receiving module.

16. The wafer bonding system according to claim 10, characterized in that, Also includes: The determination module is used to obtain the fabrication process of the wafer assembly based on the basic information; and to determine the bonding type based on the fabrication process.

17. The wafer bonding system according to claim 10, characterized in that, Also includes: The modification module is used to modify the bonding relationship; determine whether the fabrication process of the wafer group corresponding to the bonding relationship is completed; if the fabrication process of the wafer group is not completed, the bonding relationship modification is successful; if the fabrication process of the wafer group is completed, the bonding relationship modification is unsuccessful.

18. The wafer bonding system according to claim 17, characterized in that, If the bonding relationship is successfully changed, the process module is also used to re-obtain the basic information of the changed wafer set corresponding to the changed bonding relationship based on the changed bonding relationship. The transition module is also used to perform a first rule check based on the modified basic information of the wafer batch, and the bonding module is also used to perform a second rule check based on the modified basic information of the wafer batch. After the check is successful, wafer bonding is performed according to the modified bonding relationship.

19. A wafer bonding system, characterized in that, The wafer bonding system includes: Network interfaces are used to enable communication and connection between components; Memory, used to store executable instructions; A processor, when executing executable instructions stored in the memory, implements the wafer bonding method according to any one of claims 1 to 9.

20. A storage medium, characterized in that, The storage medium stores a computer program that, when executed by at least one processor, implements the wafer bonding method according to any one of claims 1 to 9.

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