Circuit board lap structure
By using conductive elastomer in the circuit board lap structure to contact the base on the rotating member, selective control of electrical conduction is achieved, solving the problems of high material preparation cost and assembly complexity in the prior art, and reducing production Error rate and reduce the risk of electrostatic discharge and electromagnetic interference.
Patent Information
- Application Number
- CN202110901603.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-09-18
- Filing Date
- 2021-08-06
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2041-08-06
AI Technical Summary
When assembling electronic products, different materials need to be prepared according to whether the existing circuit board overlap structure is electrically conductive, resulting in high material preparation costs and increased assembly complexity, and it is easy to cause electrostatic discharge or electromagnetic interference problems.
The circuit board overlap structure is adopted that includes a base, a base body, a support column and a rotating member. The conductive elastic body contacts the base on the rotating member to achieve electrical conduction or isolation, avoiding the preparation of overlap materials of different materials. , simplifies the assembly process.
It enables selective control of the electrical conduction of the circuit board without changing the overlapping material, reducing the cost of material preparation and assembly complexity, while reducing the production error rate, and reducing the risk of electrostatic discharge and electromagnetic interference.
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Figure CN114205999B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a circuit board overlapping structure, and in particular to a circuit board overlapping structure capable of selectively conducting electricity or not. Background Art
[0002] Figure 1 Schematic diagram of a known circuit board overlap structure. Existing electronic products often have a stacking structure between circuit boards or with other components. Figure 1 As shown, in order to overlap the first circuit board 1, the second circuit board 2 and the base 3, they can be connected by the overlap column 4. The overlap column 4 can overlap multiple components together by, for example, screw connection, clamping connection, etc. Here, screw connection is used as an example, and the overlap column 4 includes a stud 41 and a nut 42. The two ends of the stud 41 pass through the through hole 11 of the first circuit board 1 and the through hole 21 of the second circuit board 2, one end is locked on the base 3, and the other end is locked with the nut 42.
[0003] In some cases, in order to make the two circuit boards electrically connected, the through holes 11 and 21 are conductive holes, and the lap post 4 is also made of a conductive material. However, in some cases, if the lap position is located in an electrically sensitive area on the circuit board, a lap post 4 made of an electrically insulating material will be used for lap connection. In this way, problems such as electrostatic discharge (ESD) or electromagnetic interference (EMI) caused by the electrical connection caused by the lap can be avoided. Therefore, when assembling electronic products, lap posts 4 of different materials need to be used for lap connection according to different needs. In this way, not only the material preparation cost is increased, but also the assembly complexity and production error rate are increased. Summary of the invention
[0004] An object of the present invention is to provide a circuit board overlapping structure to solve at least one of the above problems.
[0005] In view of the above problems, one embodiment of the present invention proposes a circuit board overlap structure suitable for connecting a first circuit board and a second circuit board. The circuit board overlap structure includes: a base, a base body, a support column and a rotating member. The base is used to be set on the first circuit board, and includes a contact surface, and the contact surface has a conductive portion and an isolation portion. The base body is used to be set on the second circuit board. The support column is connected between the base and the base body. The rotating member is electrically connected to the base body, and includes a rotating surface and a conductive elastomer. The supporting column passes through the rotating member. The conductive elastomer is connected to the rotating surface and extends toward the base. The rotating member can rotate relative to the base so that the conductive elastomer contacts the conductive portion or the isolation portion.
[0006] In some embodiments, the conductive portion and the isolation portion are respectively at the same distance from positions where the support pillar contacts the contact surface.
[0007] In some embodiments, the conductive elastic body is an arc segment. One end of the arc segment has an extension portion, which is connected to the rotating surface of the rotating member. The other end of the arc segment has a contact portion, which contacts the contact surface of the base.
[0008] In some embodiments, the conductive elastic body is an arc segment. The arc segment includes two extensions located at opposite ends and a contact portion located between the two extensions. The two extensions are connected to the rotating surface of the rotating member. The contact portion contacts the contact surface of the base.
[0009] In some embodiments, the circuit board overlapping structure further includes a conductive component located between the base and the rotating component, so that the rotating component is electrically connected to the base via the conductive component.
[0010] In some embodiments, the conductive component includes at least one conductive spring sheet, which is in a coiled shape and abuts against the rotating member.
[0011] In some embodiments, the conductive component includes a plurality of conductive springs, which are in an arched grid shape and surround and protrude from the base.
[0012] In some embodiments, the rotating member is cylindrical and covers the outer side of the seat body, and has an annular side wall, and the annular side wall is connected to the conductive component.
[0013] In some embodiments, the base includes a conductive base and an isolation base that overlap each other. The conductive base has a conductive bump, and the isolation base has a through hole. The conductive bump is exposed on the surface of the isolation base through the through hole to form a conductive portion.
[0014] In some embodiments, the isolation seat further has a positioning groove to form an isolation portion.
[0015] In some embodiments, the conductive seat includes a first conductive seat and a second conductive seat overlapped with each other. The first conductive seat has a conductive column, and the first conductive seat has an opening. The conductive column protrudes through the opening to form a conductive bump.
[0016] According to the circuit board overlap structure of some embodiments of the present invention, two circuit boards can be overlapped together, and it can be selected whether the two circuit boards are electrically connected through the overlap structure. In this way, there is no need to prepare different overlap materials according to whether they are electrically connected or not, which can save material preparation costs. On the other hand, it can also reduce assembly complexity and production error rate. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of a known circuit board overlapping structure.
[0018] Figure 2 It is a three-dimensional cross-sectional view of a circuit board overlapping structure according to an embodiment of the present invention.
[0019] Figure 3 FIG. 4 is a cross-sectional view of a circuit board overlapping structure according to an embodiment of the present invention.
[0020] Figure 4 FIG. 4 is a cross-sectional view of another state of a circuit board overlapping structure according to an embodiment of the present invention.
[0021] Figure 5 This is a three-dimensional exploded view of a circuit board overlapping structure according to an embodiment of the present invention (I).
[0022] Figure 6 This is a three-dimensional exploded view of a circuit board overlapping structure according to an embodiment of the present invention (II).
[0023] Figure 7 and Figure 8 Schematic diagram of a conductive elastomer according to some embodiments of the present invention.
[0024] Fig. 9 It is a three-dimensional exploded view of a base according to another embodiment of the present invention.
[0025] Fig.10 FIG. 4 is a cross-sectional view of a circuit board overlapping structure according to another embodiment of the present invention.
[0026] The reference numerals are as follows:
[0027] 1: First circuit board
[0028] 11:Through hole
[0029] 2: Second circuit board
[0030] 21:Through hole
[0031] 3: Base
[0032] 4: Lap column
[0033] 41: Stud
[0034] 42: Nut
[0035] 100: Base
[0036] 110: Conductive part
[0037] 120: Contact surface
[0038] 121: Conductive part
[0039] 122: Isolation Department
[0040] 130: Conductive seat
[0041] 131: Conductive bump
[0042] 132: Pillar
[0043] 140: Isolation seat
[0044] 141:Through hole
[0045] 142: Positioning slot
[0046] 143: Window
[0047] 144: Hollow column
[0048] 150: first conductive seat
[0049] 151: Conductive column
[0050] 160: Second conductive seat
[0051] 161: Opening
[0052] 162: Pillar
[0053] 200: base body
[0054] 210: Conductive part
[0055] 220: abutment surface
[0056] 221: Groove
[0057] 230: Connecting part
[0058] 300: Support column
[0059] 310: Card connection part
[0060] 400: Rotating parts
[0061] 410: Rotational surface
[0062] 420: Conductive elastomer
[0063] 421: Extension
[0064] 422:Contact Department
[0065] 430:Through hole
[0066] 440: Ring side wall
[0067] 500: Conductive component
[0068] 510: Conductive shrapnel
[0069] 520: Conductive shrapnel
[0070] 530: Conductive tape
[0071] 610: first circuit board
[0072] 620: Second circuit board DETAILED DESCRIPTION
[0073] Merge References Figures 2 to 6 . Figure 2 It is a three-dimensional cross-sectional view of a circuit board overlapping structure according to an embodiment of the present invention. Figure 3 FIG. 4 is a cross-sectional view of a circuit board overlapping structure according to an embodiment of the present invention. Figure 4 FIG. 4 is a cross-sectional view of another state of a circuit board overlapping structure according to an embodiment of the present invention. Figure 5 This is a three-dimensional exploded view of a circuit board overlapping structure according to an embodiment of the present invention (I). Figure 6 FIG2 is a perspective exploded view of a circuit board overlapping structure according to an embodiment of the present invention. The circuit board overlapping structure can be suitable for connecting a first circuit board 610 and a second circuit board 620. The circuit board overlapping structure includes a base 100, a base body 200, a support column 300 and a rotating member 400.
[0074] The base 100 is used to be set on the first circuit board 610. The base 100 includes a conducting portion 110 and a contact surface 120. The contact surface 120 has a conductive portion 121 and an isolating portion 122. The conducting portion 110 is electrically connected to the conducting portion 121, and the conducting portion 110 is electrically isolated from the isolating portion 122. When the base 100 is set on the first circuit board 610, the conductive portion 121 can be electrically connected to the first circuit board 610 via the conducting portion 110. In this embodiment, the conducting portion 110 can also be fixedly set on the first circuit board 610 by surface mount technology (SMT), but the present invention is not limited to this. In some embodiments, the base 100 can be fixedly set on the first circuit board 610 by other means (such as plugging, screwing, clamping, etc.).
[0075] The base 100 is composed of a plurality of components. Here, the base 100 includes a conductive base 130 and an isolation base 140 which are overlapped. The conductive base 130 is made of a conductive material, and the isolation base 140 is made of an electrically insulating material. The conductive base 130 has a conductive bump 131, and the isolation base 140 has a through hole 141. The conductive bump 131 is exposed on the surface of the isolation base 140 through the through hole 141 to form a conductive portion 121. The isolation base 140 also has a positioning groove 142 to form the isolation portion 122. The conductive base 130 also has a column 132, and the isolation base 140 also has a window 143 and a hollow column 144. The window 143 is connected to the internal space of the hollow column 144, and the internal space of the hollow column 144 corresponds to the column 132. Thus, the column 132 can extend into the internal space of the hollow column 144 through the window 143 to form a support column 300.
[0076] In some embodiments, the isolation seat 140 is formed by injection molding.
[0077] In some embodiments, the conductive portion 121 is made of a conductive material, and the isolation portion 122 is made of an electrically insulating material. In some embodiments, the isolation portion 122 is made of a conductive material and is electrically isolated from the conductive portion 110 by other electrically insulating elements.
[0078] The seat body 200 is disposed on the second circuit board 620. The seat body 200 includes a conductive portion 210, a contact surface 220 and a connecting portion 230. The conductive portion 210 is electrically connected to the connecting portion 230. The connecting portion 230 is electrically connected to the rotating member 400. In this embodiment, the circuit board overlap structure further includes a conductive component 500. The conductive component 500 is made of a conductive material. The conductive component 500 is located between the seat body 200 and the rotating member 400, and is electrically connected to the rotating member 400 and the connecting portion 230 of the seat body 200 respectively. Thus, the rotating member 400 can be electrically connected to the seat body 200 via the conductive component 500. In some embodiments, the connecting portion 230 can be electrically connected to the rotating member 400 by other means, such as adding a conductive agent (such as conductive oil) between the tightly stacked rotating member 400 and the seat body 200.
[0079] Reference Figure 4 , the support column 300 is connected between the base 100 and the base body 200, so that the base 100 and the base body 200 maintain a distance. In this embodiment, one end of the support column 300 is fixedly connected to the base 100, and the other end of the support column 300 abuts against the abutment surface 220 of the base body 200. Here, the abutment surface 220 is opposite to the conductive portion 210, but the present invention is not limited to this. It should be noted that in order to clearly present the rotating member 400, Figure 2 and Figure 3 The schematic diagram shows a state where the support column 300 has not yet abutted against the abutting surface 220 of the base body 200 .
[0080] like Figure 2 and Figure 5 As shown, in some embodiments, the contact surface 220 of the base 200 includes a groove 221, which can accommodate a portion of the support column 300 to assist in firmly contacting the support column 300. Here, the opening shape of the groove 221 is a circular shape, but the present invention is not limited to this. When the support column 300 contacts the base 200, the base 100 contacts the rotating member 400 (in order to present the conductive elastic body 420, Figure 4 The base 100 and the rotating member 400 provide a supporting force to maintain the distance between the first circuit board 610 and the second circuit board 620 .
[0081] The rotating member 400 includes a rotating surface 410 and a conductive elastic body 420. The rotating surface 410 has a through hole 430, through which the supporting column 300 can pass through the rotating member 400, so that the rotating surface 410 of the rotating member 400 can rotate with the supporting column 300 as the axis. The conductive elastic body 420 is connected to the rotating surface 410 and extends toward the base 100. Therefore, the conductive elastic body 420 can contact the conductive part 121 or the isolation part 122 by rotating the rotating member 400 relative to the base 100. When the conductive elastic body 420 contacts the conductive part 121, the conductive part 110 of the base 100 and the conductive part 210 of the base 200 are electrically connected, so that the first circuit board 610 and the second circuit board 620 can be electrically connected through this overlapping structure. When the conductive elastic body 420 contacts the isolation portion 122 , the conductive portion 110 of the base 100 and the conductive portion 210 of the base body 200 are electrically isolated, so that the first circuit board 610 and the second circuit board 620 are not electrically connected via the overlapping structure.
[0082] In some embodiments, the support column 300 is fixedly connected to at least one of the base 100 and the base body 200 .
[0083] In some embodiments, the support column 300 is detachably connected to the base 100 and the base body 200 , and the rotating member 400 is rotatable relative to the support column 300 .
[0084] In this embodiment, one end of the support column 300 has a clamping portion 310. The clamping portion 310 is an arrow-shaped elastic claw for hooking the rotating member 400 to prevent the rotating member 400 from detaching from the support column 300. The arrow-shaped portion at the end of the support column 300 (i.e., the end of the clamping portion 310) can be received in the groove 221 (such as the groove 221 of the abutting surface 220 of the seat body 200) Figure 4 shown).
[0085] In this embodiment, the rotating member 400 further includes an annular sidewall 440 connected to the rotating surface 410, so that the rotating member 400 is in a cylindrical shape. The rotating member 400 covers the outer side of the base 200. In other words, the inner space of the cylindrical shape is used to accommodate the conductive member 500 and the base 200. The annular sidewall 440 is connected to the conductive member 500, so that the base 200 and the rotating member 400 are electrically connected via the conductive member 500.
[0086] In some embodiments, the conductive member 500 may be implemented in the form of a wire or a conductive spring. In the present embodiment, the conductive member 500 includes a plurality of conductive springs 510 and 520. The conductive springs 520 are in an arched grid shape and surround and protrude from the base 200. In other words, the conductive springs 520 are arranged at intervals around the side of the base 200, and each conductive spring 520 is arched and protrudes in a direction away from the base 200. The protruding portion of the conductive spring 520 abuts against the annular side wall 440 of the rotating member 400 to maintain the electrical connection between the conductive member 500 and the rotating member 400, and furthermore, the rotating member 400 can be kept stable. The conductive member 500 further includes two conductive strips 530, which are respectively connected to the two ends of the conductive spring 520. In the present embodiment, the number of conductive springs 510 is two, but the present invention is not limited thereto, and the number may be more or less. One end of the conductive spring sheet 510 is connected to other components of the conductive member 500 (here, the conductive strip 530) to be electrically connected to the base 200. The conductive spring sheet 510 is in a coiled shape and has elastic restoring force, which can fully abut against the rotating member 400 to maintain the electrical connection between the conductive member 500 and the rotating member 400. The conductive spring sheet 510 is coiled toward the base 200. In addition to abutting against the rotating member 400, the end of the conductive spring sheet 510 can also contact the base 200.
[0087] The base 200 further includes a connecting portion 230 for connecting the conductive member 500. In this embodiment, the connecting portion 230 is located on the side of the base 200 and is recessed relative to the conductive portion 210 and the abutting surface 220, so that the grid-shaped conductive spring 520 and the two conductive strips 530 of the conductive member 500 can be clamped therein.
[0088] In this embodiment, the conductive elastic body 420 is an arc segment, including two extension portions 421 located at opposite ends and a contact portion 422 located between the extension portions 421. The extension portion 421 is connected to the rotating surface 410 of the rotating member 400. The contact portion 422 contacts the contact surface 120 of the base 100. Thus, the position where the conductive elastic body 420 contacts the base 100 can be changed by rotating the rotating member 400 left (clockwise) or right (counterclockwise).
[0089] Reference Figure 7 and Figure 8 , is a three-dimensional schematic diagram of a conductive elastic body 420 of some embodiments of the present invention. Different from the conductive elastic body 420 of the previous embodiment having two extensions 421, the conductive elastic body 420 here has only one extension 421, and the extension 421 is located at one end of the conductive elastic body 420. The other end of the conductive elastic body 420 has a contact portion 422 for contacting the contact surface 120 of the base 100. Figure 7The rotating member 400 shown is suitable for changing the position where the conductive elastic body 420 contacts the base 100 by rotating counterclockwise; Figure 8 The rotating member 400 shown is suitable for changing the position where the conductive elastic body 420 contacts the base 100 by rotating right.
[0090] In some embodiments, the contact portion 422 has a bump that can be positioned on the conductive portion 121 or the isolation portion 122 , but the invention is not limited thereto.
[0091] In some embodiments, the conductive elastic body 420 is formed into an arc segment by punching the rotating surface 410 of the rotating member 400 .
[0092] Reference Figure 3 and Figure 6 In some embodiments, corresponding to the arc segment of the conductive elastic body 420, the conductive portion 121 and the isolation portion 122 of the base 100 are respectively at the same distance from the position where the support column 300 contacts the contact surface 120. In other words, the conductive portion 121 and the isolation portion 122 are located on a circle with the position where the support column 300 contacts the contact surface 120 as the center.
[0093] Reference Fig. 9 and Fig.10 . Fig. 9 FIG. 1 is a perspective exploded view of a base 100 according to another embodiment of the present invention. Fig.10 1 is a cross-sectional view of a circuit board overlap structure according to another embodiment of the present invention. The difference from the aforementioned embodiment is that the conductive seat 130 can be composed of multiple components. Here, the conductive seat 130 includes a first conductive seat 150 and a second conductive seat 160 that overlap each other. The first conductive seat 150 has a conductive column 151, and the second conductive seat 160 has an opening 161 and a column 162. The conductive column 151 protrudes through the opening 161 to form a conductive bump 131. The column 162 can extend into the inner space of the hollow column 144 to form the aforementioned support column 300. Compared with forming the conductive seat 130 with a single component, forming the conductive seat 130 with multiple components can reduce the difficulty of forming each component.
[0094] In some embodiments, the first conductive seat 150 and the second conductive seat 160 are fixed by gluing.
[0095] In some embodiments, the base 200 and the rotating member 400 are made of conductive materials.
[0096] The shapes of the base 100 , the base body 200 , the support column 300 , the rotating member 400 and the conductive component 500 in the above-mentioned embodiment are merely examples, and the present invention is not limited thereto.
[0097] According to the circuit board overlap structure of some embodiments of the present invention, two circuit boards can be overlapped together, and it can be selected whether the two circuit boards are electrically connected through the overlap structure. In this way, there is no need to prepare different overlap materials according to whether they are electrically connected or not, which can save material preparation costs. On the other hand, it can also reduce assembly complexity and production error rate. In addition, according to the circuit board overlap structure of some embodiments of the present invention, it is set on the circuit board through SMT, which can save the wiring space of the circuit board.
Claims
1. A circuit board overlapping structure, suitable for connecting a first circuit board and a second circuit board, the circuit board overlapping structure comprising: A base, used to be disposed on the first circuit board, the base comprising a contact surface, the contact surface having a conductive portion and an isolation portion; A seat body, used to be arranged on the second circuit board; A support column connected between the base and the base body; and a rotating member, the rotating member comprising a rotating surface and a conductive elastic body, the supporting column passing through the rotating member, the conductive elastic body connected to the rotating surface and extending toward the base, the rotating member can rotate relative to the base so that the conductive elastic body contacts the conductive part or the isolation part; in, The seat body includes a conducting portion, a contact surface and a connecting portion. The conducting portion is electrically connected to the connecting portion, and the connecting portion is electrically connected to the rotating member through a conducting component made of a conducting material.
2. The circuit board overlapping structure as claimed in claim 1, wherein the conductive portion and the isolation portion are respectively at the same distance from the position where the support column contacts the contact surface.
3. The circuit board overlapping structure as described in claim 1, wherein the conductive elastomer is an arc segment, one end of the arc segment has an extension portion, the extension portion is connected to the rotating surface of the rotating member, and the other end of the arc segment has a contact portion, the contact portion contacts the contact surface of the base.
4. The circuit board overlapping structure as described in claim 1, wherein the conductive elastomer is an arc segment, the arc segment includes two extension portions located at opposite ends and a contact portion located between the two extension portions, the two extension portions are connected to the rotating surface of the rotating member, and the contact portion contacts the contact surface of the base.
5. The circuit board overlapping structure as claimed in claim 1, wherein the conductive component is located between the base and the rotating component, so that the rotating component is electrically connected to the base via the conductive component. 6 . The circuit board bonding structure as claimed in claim 5 , wherein the conductive component comprises at least one conductive spring sheet, and the at least one conductive spring sheet is in a coiled shape and abuts against the rotating member. 7 . The circuit board connection structure as claimed in claim 5 , wherein the conductive component comprises a plurality of conductive spring sheets, and the plurality of conductive spring sheets are in an arched grid shape and surround and protrude from the base.
8. The circuit board overlapping structure as claimed in claim 5, wherein the rotating member is cylindrical and covers the outer side of the base body, and has an annular side wall, and the annular side wall is connected to the conductive component.
9. The circuit board overlapping structure as described in claim 1, wherein the base comprises a conductive seat and an isolation seat stacked on each other, the conductive seat has a conductive bump, and the isolation seat has a through hole, and the conductive bump is exposed on the surface of the isolation seat through the through hole to form the conductive part. 10 . The circuit board overlapping structure as claimed in claim 9 , wherein the isolation seat further has a positioning groove to form the isolation portion.
11. The circuit board overlapping structure as claimed in claim 9, wherein the conductive seat comprises a first conductive seat and a second conductive seat overlapped with each other, the first conductive seat has a conductive column, the second conductive seat has an opening, and the conductive column protrudes through the opening to form the conductive bump.
Citation Information
Patent Citations
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