Power device constant junction temperature aging device

Abstract

The present invention provides a constant junction temperature aging device for power devices, comprising: a heat source module, including the power device itself or the power device itself and adjacent power devices, for generating heat through self-heating or mutual heating based on applied heat consumption to provide a base temperature for constant junction temperature aging; a temperature monitoring module connected to the power device and the heat consumption control module, respectively, for monitoring and controlling the temperature of the power device, maintaining the temperature of the power device at a target base temperature, and transmitting the monitored temperature to the heat consumption control module; the heat consumption control module is further connected to the heat source module, for generating a temperature warning message when the temperature of the power device exceeds a preset temperature threshold and cannot be adjusted to within the preset temperature threshold range, and adjusting the heat consumption of the power device to the target heat consumption according to the temperature warning message, so that the power device undergoes constant junction temperature aging based on the target base temperature and target heat consumption. The present invention can achieve precise control of the base temperature and heat consumption of the power device, thereby achieving constant junction temperature aging.

Description

Technical Field

[0001] The present invention relates to the technical field of power device reliability, and in particular to a constant junction temperature aging device for a power device. Background Art

[0002] With the widespread application of power devices in industrial, civil, and national defense fields, quality issues are inevitable. This requires packaging and testing factories to strictly control quality. Reliability testing is a key step in verifying the quality of power devices and plays an irreplaceable role in power device quality assessment. Constant junction temperature aging is an indispensable part of reliability testing. Constant junction temperature aging reliability testing requires not only controlling appropriate heat dissipation but also controlling the corresponding bottom temperature.

[0003] Currently, constant-junction-temperature aging reliability tests use a constant-temperature aging chamber to control heat dissipation and bottom temperature, thereby achieving constant-junction-temperature aging of power devices. However, constant-temperature aging chambers are expensive, and they cannot precisely control heat dissipation and bottom temperature of power devices during reliability tests. Furthermore, they can easily cause power devices to heat up too quickly and burn out. Summary of the Invention

[0004] An embodiment of the present invention provides a constant junction temperature aging device for a power device to solve the problem of being unable to accurately control heat consumption and bottom temperature of the power device when a constant temperature aging chamber is used for reliability testing.

[0005] In a first aspect, an embodiment of the present invention provides a constant junction temperature aging device for a power device, comprising: a heat source module, a temperature monitoring module, and a heat consumption control module;

[0006] The heat source module includes the power device itself or the power device itself and adjacent power devices, and is used to generate heat by self-heating or mutual heating based on applied heat consumption to provide a base temperature for constant junction temperature aging;

[0007] The temperature monitoring module is connected to the power device and the heat consumption control module respectively, and is used to monitor and control the temperature of the power device so that the temperature of the power device is maintained at the target bottom temperature, and send the monitored temperature to the heat consumption control module;

[0008] The heat consumption control module is also connected to the heat source module, and is used to generate temperature warning information when the temperature of the power device exceeds the preset temperature threshold and cannot be adjusted to reach the preset temperature threshold range, and adjust the heat consumption of the power device according to the temperature warning information, so that the power device is aged at a constant junction temperature based on the target bottom temperature and the target heat consumption.

[0009] In a possible implementation, the heat consumption control module includes: a leakage voltage control unit and a gate voltage control unit;

[0010] The leakage voltage control unit is connected to the drain voltage input terminal of the power device and is used to control the drain voltage of the power device;

[0011] The gate voltage control unit is connected to the gate of the power device and is used to adjust the gate voltage of the power device based on the drain current of the power device.

[0012] In a possible implementation, the gate voltage control unit includes: a single chip microcomputer, a digital-to-analog converter, a first operational amplifier, a second operational amplifier, a current sampling chip, and an analog-to-digital converter;

[0013] The single-chip microcomputer is respectively connected to the temperature monitoring module and the digital-to-analog converter, and is used to compare the received temperature information sent by the temperature monitoring module with a preset temperature threshold, and control the temperature monitoring module to control the temperature of the power device according to the comparison result, or send a first digital signal for adjusting the gate voltage to the digital-to-analog converter;

[0014] The digital-to-analog converter is further connected to the first operational amplifier, and is configured to convert the received first digital signal into a first analog signal and send it to the first operational amplifier;

[0015] The first operational amplifier is further connected to the gate of the power device, and is used to process the received first analog signal and output a reverse voltage, and input the reverse voltage into the gate of the power device to form a drain current in the power device;

[0016] The current sampling chip is connected to the drain of the power device and the second operational amplifier, respectively, for collecting the drain current of the power device and converting the drain current into a voltage signal to transmit to the second operational amplifier;

[0017] The second operational amplifier is further connected to the analog-to-digital converter, and is configured to invert the received voltage signal and send the obtained second analog signal to the analog-to-digital converter;

[0018] The analog-to-digital converter is also connected to the single-chip microcomputer, and is used to convert the second analog signal into a second digital signal, and transmit the second digital signal to the single-chip microcomputer;

[0019] The single chip microcomputer is further used to calibrate the second digital signal, and when the calibration fails, continue to send the digital signal for regulating the gate voltage.

[0020] In a possible implementation, the number of the digital-to-analog converter, the first operational amplifier, the second operational amplifier, the current sampling chip, and the power device is at least one;

[0021] The gate voltage control unit further includes: at least one analog switch;

[0022] One end of the at least one analog switch is correspondingly connected to at least one output end of the single-chip microcomputer, and the other end is correspondingly connected to at least one digital-to-analog converter. Each digital-to-analog converter is correspondingly connected to the first operational amplifier, the power device, the current sampling chip and the second operational amplifier in sequence. Each second operational amplifier is respectively jointly connected to at least one input pin of the analog-to-digital converter. At least one output pin of the analog-to-digital converter is correspondingly connected to the at least one analog switch. The at least one analog switch is used to be turned on or off according to the instruction of the single-chip microcomputer.

[0023] In a possible implementation, the heat consumption control module further includes: a relay;

[0024] One end of the relay is connected to the leakage voltage control unit, and the other end is connected to the drain voltage input end of the power device.

[0025] In a possible implementation, the temperature monitoring module includes: a temperature monitoring device and a temperature control device;

[0026] The temperature monitoring device is arranged at the bottom of the power device and connected to the single chip microcomputer, and is used to monitor the bottom temperature of the power device and send the bottom temperature to the single chip microcomputer;

[0027] The temperature control device is connected to the single chip microcomputer and is used to reduce the temperature of the power device after receiving a temperature reduction instruction sent by the single chip microcomputer.

[0028] In a possible implementation, the temperature control device is a fan.

[0029] In a possible implementation, the temperature monitoring module further includes: a temperature stabilization board;

[0030] The temperature stabilizing plate is arranged at the bottom of the temperature monitoring device and is used to stabilize the bottom temperature of the power device.

[0031] In a possible implementation, the temperature stabilizing plate is a cavity structure, and at least one through hole communicating with the cavity structure is provided on an upper surface of the cavity structure, the through hole being used to place a liquid having a specific heat capacity greater than a preset value into the cavity structure;

[0032] Any two corresponding side surfaces of the cavity structure of the temperature stabilizing plate are arranged as an X-shaped structure.

[0033] In a possible implementation, the temperature stabilizing plate is made of copper and / or aluminum.

[0034] An embodiment of the present invention provides a constant junction temperature aging device for power devices, which monitors the temperature of the power device through a temperature monitoring module. When the temperature is not within a preset temperature threshold range, the temperature of the power device is controlled to maintain the temperature at a target bottom temperature. When the temperature is not within the preset temperature threshold range and cannot be further controlled, the heat consumption control module generates temperature warning information and adjusts the heat consumption of the power device to the target heat consumption according to the temperature warning information, so that the power device is subjected to constant junction temperature aging based on the target bottom temperature and the target heat consumption, thereby achieving precise control of the bottom temperature and heat consumption of the power device and realizing constant junction temperature aging. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0036] Figure 1 Schematic diagram of a constant junction temperature aging device for a power device provided by an embodiment of the present invention;

[0037] Figure 2 is a schematic diagram of a heat consumption control module provided in an embodiment of the present invention;

[0038] Figure 3 is a schematic diagram of a temperature monitoring module provided by an embodiment of the present invention;

[0039] Figure 4 Schematic diagram of a temperature stabilizing plate provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0040] In the following description, specific details such as particular system structures and techniques are provided for purposes of illustration, not limitation, to facilitate a thorough understanding of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0041] In order to make the purpose, technical solutions and advantages of the present invention more clear, specific embodiments will be described below with reference to the accompanying drawings.

[0042] Figure 1 A schematic diagram of a constant junction temperature aging device for a power device provided by an embodiment of the present invention, the constant junction temperature aging device for a power device may include: a heat source module 10, a temperature monitoring module 20 and a heat consumption control module 30;

[0043] The heat source module 10 includes the power device 40 itself or the power device 40 itself and adjacent power devices, and is used to generate heat by self-heating or mutual heating based on applied heat consumption to provide a base temperature for constant junction temperature aging;

[0044] The temperature monitoring module 20 is connected to the power device 40 and the heat consumption control module 30 respectively, and is used to monitor and control the temperature of the power device 40, so that the temperature of the power device 40 is maintained at the target bottom temperature, and send the monitored temperature to the heat consumption control module 30;

[0045] The heat consumption control module 30 is also connected to the heat source module 10, and is used to generate temperature warning information when the temperature of the power device 40 exceeds the preset temperature threshold and cannot be adjusted to within the preset temperature threshold range, and adjust the heat consumption of the power device 40 according to the temperature warning information, so that the power device 40 is aged at a constant junction temperature based on the target bottom temperature and target heat consumption.

[0046] The temperature monitoring module 20 and the heat consumption control module 30 form a negative feedback regulation mechanism. Here, the negative feedback regulation mechanism is that when the temperature of the power device exceeds the preset temperature threshold upper limit and cannot be further adjusted to reduce the temperature of the power device, the junction temperature of the power device is adjusted by reducing the heat consumption of the power device.

[0047] Optional, such as Figure 2 As shown, the heat consumption control module 30 includes: a leakage voltage control unit 301 and a gate voltage control unit 302;

[0048] The drain voltage control unit 301 is connected to the drain voltage input terminal of the power device 40 and is used to control the drain voltage of the power device 40;

[0049] The gate voltage control unit 302 is connected to the gate of the power device 40 and is configured to adjust the gate voltage of the power device 40 based on the drain current of the power device 40 .

[0050] Optionally, one end of the leakage voltage control unit 301 is used to connect to the power supply 304 , and the other end is connected to the drain voltage input terminal of the power device 40 . The power supply 304 can provide power for the leakage voltage control unit 301 .

[0051] The heat consumption control module 30 further includes: a relay 303;

[0052] One end of the relay 303 is connected to the leakage voltage control unit 301 , and the other end is connected to the drain voltage input terminal of the power device 40 , and is used to control the on and off of the leakage voltage control unit 301 .

[0053] Optionally, the gate voltage control unit 302 includes: a single chip microcomputer 3021, a digital-to-analog converter 3022, a first operational amplifier 3023, a second operational amplifier 3024, a current sampling chip 3025 and an analog-to-digital converter 3026;

[0054] The single-chip microcomputer 3021 is connected to the temperature monitoring module 20 and the digital-to-analog converter 3022, respectively, and is used to compare the temperature information received from the temperature monitoring module 20 with a preset temperature threshold, and control the temperature monitoring module 20 to control the temperature of the power device 40 according to the comparison result, or send a first digital signal to the digital-to-analog converter 3022 to adjust the gate voltage;

[0055] It should be noted that a prerequisite for sending the first digital signal for adjusting the gate voltage to the digital-to-analog converter 3022 is that the temperature exceeds a preset upper temperature threshold and cannot be regulated within the preset temperature threshold range by the temperature monitoring module 20. "Cannot be regulated within the preset temperature threshold range by the temperature monitoring module 20" here means that the temperature still exceeds the preset upper temperature threshold after a preset number of adjustments. The preset number of adjustments can be set based on actual needs, and the specific value of the preset number of adjustments is not limited in this embodiment.

[0056] The digital-to-analog converter 3022 is further connected to the first operational amplifier 3023 and is configured to convert the received first digital signal into a first analog signal and send it to the first operational amplifier 3023;

[0057] The first operational amplifier 3023 is also connected to the gate of the power device 40 and is used to process the received first analog signal and output a reverse voltage, and input the reverse voltage into the gate of the power device 40 to form a drain current in the power device 40;

[0058] The current sampling chip 3025 is connected to the drain of the power device 40 and the second operational amplifier 3024 respectively, and is used to collect the drain current of the power device 40 and convert the drain current into a voltage signal and transmit it to the second operational amplifier 3024;

[0059] The second operational amplifier 3024 is also connected to the analog-to-digital converter, and is used to invert the received voltage signal and send the obtained second analog signal to the AD chip 3026;

[0060] The analog-to-digital converter 3026 is also connected to the single-chip microcomputer 3021 and is used to convert the second analog signal into a second digital signal and transmit the second digital signal to the single-chip microcomputer 3021;

[0061] The microcontroller 3021 is further configured to calibrate the second digital signal and, if the calibration fails, continue to issue a digital signal for adjusting the gate voltage. The microcontroller 3021 checks whether the drain current has reached a target drain current value. If not, the calibration fails and the microcontroller issues a digital signal for further adjusting the gate voltage. If the drain current has reached the target drain current value, the calibration succeeds and the microcontroller discontinues adjusting the gate voltage and waits for the temperature signaled by the temperature monitoring device.

[0062] Optionally, the target heat dissipation is the drain current multiplied by the drain voltage.

[0063] It should be noted that the gate voltage control unit 302 can provide a single gate voltage control circuit to accurately control the junction temperature, and can also implement a matrix-type single gate voltage control circuit to accurately control the junction temperature, that is, a multi-gate voltage control circuit to control the junction temperature, specifically as follows: the number of the digital-to-analog converter 3022, the first operational amplifier 3023, the second operational amplifier 3024, the current sampling chip 3025 and the power device 40 is at least one;

[0064] The gate voltage control unit 302 further includes: at least one analog switch 3027;

[0065] One end of at least one analog switch 3027 is connected to at least one output end of the microcontroller 3021, and the other end is connected to at least one digital-to-analog converter 3022. Each digital-to-analog converter 3022 is connected in sequence to the first operational amplifier 3023, the power device 40, the current sampling chip 3025, and the second operational amplifier 3024. Each second operational amplifier 3024 is jointly connected to at least one input pin of the analog-to-digital converter 3026. At least one output pin of the analog-to-digital converter 3026 is connected to at least one analog switch 3027. The at least one analog switch 3027 is used to open or close according to the instruction of the microcontroller 3021.

[0066] It should be noted that there is only one output pin on the analog-to-digital converter 3026. Here we define other undefined idle pins as output pins, and the same applies to input pins.

[0067] It will be appreciated that when there is only one analog switch 3027, the analog switch 3027 is disposed between the single-chip microcomputer 3021 and the digital-to-analog converter 3022 and is connected to the analog-to-digital converter 3026. When there are two or more analog switches 3027, except for the single-chip microcomputer 3021 and the digital-to-analog converter 3022, the number of other devices is the same as the number of analog switches 3027, forming at least two gate voltage control circuits to precisely control the junction temperature of at least two power devices 40.

[0068] Optional, see Figure 2The heat dissipation control module 30 may also include a power supply control subunit. This subunit includes a power supply 3028, a buck-regulator chip 3029, and an inverter chip 3030. Power supply 3028 provides operating voltage for the various components in the gate voltage control unit 302 and also provides front-end gate voltage for the power devices. Power supply 3028 is connected to buck-regulator chip 3029, which is further connected to voltage inverter chip 3030 and microcontroller 3021. Voltage inverter chip 3030 is connected to the output of the analog-to-digital converter.

[0069] In addition, the gate voltage control unit 302 also includes a crystal oscillator 3031 and a reset button 3032; the crystal oscillator 3031 and the reset button 3032 are also connected to the microcontroller 3021. The crystal oscillator is used to cooperate with the clock circuit to ensure the stable operation of the microcontroller; the reset button is used for manual triggering when a reset is required. For example, when a new power device needs to be aged at a constant junction temperature, the microcontroller needs to be reset after the power device is reconnected.

[0070] Optional, see Figure 3 , the temperature monitoring module 20, comprises: a temperature monitoring device 201 and a temperature control device 202;

[0071] The temperature monitoring device 201 is set at the bottom of the power device 40 and connected to the microcontroller 3021. It is used to monitor the bottom temperature of the power device 40 and send the bottom temperature to the microcontroller 3021. After receiving the bottom temperature monitored by the temperature monitoring device 201, the microcontroller 3021 compares it with the saved preset temperature threshold. When the bottom temperature reaches the upper limit of the preset temperature threshold, an instruction is sent to the temperature control device 202, which is a cooling instruction.

[0072] Optionally, the preset temperature threshold may be a temperature range including a preset lower temperature threshold and a preset upper temperature threshold. When the bottom temperature is within the preset temperature threshold, the power device 40 may be aged normally at a constant junction temperature. When the bottom temperature exceeds the preset upper temperature threshold, a temperature reduction instruction is sent to the temperature control device 202.

[0073] The temperature control device 202 is connected to the single chip microcomputer 3021 and is used to reduce the temperature of the power device 40 after receiving a temperature reduction instruction sent by the single chip microcomputer 3021 .

[0074] Optionally, the temperature control device 202 is a fan. It should be noted that in this embodiment, different temperature controls can also be implemented based on the cooling command from the single-chip microcomputer. The cooling command may also include a fan gear. When the difference between the base temperature monitored by the temperature monitoring device 201 and the upper limit of the preset temperature threshold value received by the single-chip microcomputer 3021 is greater than a preset value, that is, the base temperature is much higher than the upper limit of the preset temperature threshold value, the gear included in the generated cooling command is a higher gear. For example, the fan can be adjusted to five gears. The higher the gear, the faster the fan speed, which reduces the temperature of the power device 40 faster. In this case, the gear included in the cooling command may be any gear from 3 to 5. When the difference between the base temperature monitored by the temperature monitoring device 201 and the upper limit of the preset temperature threshold value received by the single-chip microcomputer 3021 is less than a preset value, that is, the difference between the base temperature and the upper limit of the preset temperature threshold value is smaller, the cooling command generated includes a lower gear, for example, any gear from 1 to 3.

[0075] Optionally, the temperature monitoring module 20 further includes: a temperature stabilizing plate 203;

[0076] The temperature stabilizing plate 203 is provided at the bottom of the temperature monitoring device to maintain the bottom temperature of the power device stable.

[0077] See also Figure 4 The temperature stabilizing plate 203 is a hollow structure with at least one through-hole disposed on its upper surface. This through-hole is used to place a liquid with a specific heat capacity greater than a predetermined value into the cavity. The structure of the temperature stabilizing plate 203 maintains stable heat dissipation, minimizing surface temperature differences, and prevents the power device 40 from heating up too quickly and burning out. The liquid placed in the cavity can be any of water, liquid hydrogen, and modified graphene.

[0078] Optionally, the temperature stabilizing plate 203 may be a cubic cavity structure.

[0079] Any two corresponding side surfaces of the cavity structure of the temperature stabilizing plate 203 are set as an X-shaped structure, which increases the heat dissipation area of the temperature stabilizing plate 203 and facilitates the heat dissipation of the power device 40.

[0080] Optionally, the temperature stabilizing plate is made of copper and / or aluminum.

[0081] When using the above-mentioned power device constant junction temperature aging device to perform constant junction temperature aging of power devices, first power on the power device constant junction temperature aging device, the temperature monitoring device monitors the temperature of the power device and sends the monitored temperature to the microcontroller in real time. The microcontroller compares the monitored temperature with the preset temperature threshold. When the upper limit of the preset temperature threshold is reached, a cooling instruction is sent to the temperature control device. The temperature control device cools the power device to maintain the bottom temperature of the power device to the target bottom temperature. When the monitored temperature exceeds the preset upper temperature threshold and cannot be further adjusted, the microcontroller sends a first digital signal to adjust the gate voltage. The digital-to-analog converter converts the first digital signal into a first analog signal. The first operational amplifier inverts the received first analog signal and inputs the inverted signal into the gate of the power device, forming a drain current in the power device. The current sampling chip collects the drain current of the power device and converts the drain current into a voltage signal, which is transmitted to the second operational amplifier. The second operational amplifier inverts the received voltage signal and sends the resulting second analog signal to the analog-to-digital converter. The analog-to-digital converter converts the second analog signal into a second digital signal and transmits the second digital signal to the microcontroller. The microcontroller verifies the second digital signal. If the verification fails, it continues to send digital signals to adjust the gate voltage until the drain current reaches the target drain current value. The leakage voltage control module controls the drain voltage of the power device to maintain it within the target drain voltage range. At this point, the heat dissipation of the power device is the product of the drain voltage and the drain current, which is then added to the target bottom temperature to obtain the junction temperature of the power device, which is used for aging. That is, the present invention adopts the temperature monitoring module and the heat consumption control module to jointly regulate the power device, thereby achieving the effect of accurately controlling the heat consumption and the bottom temperature of the power device.

[0082] The above-mentioned constant junction temperature aging device for power devices monitors the temperature of the power device through a temperature monitoring module. When the temperature is not within the preset temperature threshold range, the temperature of the power device is controlled to maintain the temperature at the target bottom temperature. When the temperature is not within the preset temperature threshold range and cannot be further controlled, the heat consumption control module generates a temperature warning message and adjusts the heat consumption of the power device according to the temperature warning message, so that the power device is subjected to constant junction temperature aging based on the target bottom temperature and the target heat consumption, thereby achieving precise control of the bottom temperature and heat consumption of the power device and achieving constant junction temperature aging. In the present invention, since the bottom temperature of the power device comes from the self-heating and mutual heating of the power device, the experimental cost can be reduced, and the temperature stabilization plate using liquid cooling can ensure the uniform temperature of the temperature stabilization plate, preventing the power device from heating too quickly and causing the product to burn. The present invention can also realize batch power-on and perform constant junction temperature aging on multiple power devices.

[0083] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0084] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A constant junction temperature aging device for power devices, characterized in that: include: Heat source module, temperature monitoring module and heat consumption control module; The heat source module includes the power device itself or the power device itself and adjacent power devices, and is used to generate heat by self-heating or mutual heating based on applied heat consumption to provide a base temperature for constant junction temperature aging; The temperature monitoring module is connected to the power device and the heat consumption control module respectively, and is used to monitor and control the temperature of the power device so that the temperature of the power device is maintained at the target bottom temperature, and send the monitored temperature to the heat consumption control module; The heat consumption control module is also connected to the heat source module and is configured to generate a temperature warning message when the temperature of the power device exceeds a preset temperature threshold and cannot be adjusted to fall within the preset temperature threshold range, and adjust the heat consumption of the power device according to the temperature warning message, so that the power device is subjected to constant junction temperature aging based on the target base temperature and the target heat consumption; Wherein, the heat consumption control module includes: a leakage voltage control unit and a gate voltage control unit; The leakage voltage control unit is connected to the drain voltage input terminal of the power device and is used to control the drain voltage of the power device; The gate voltage control unit is connected to the gate of the power device and is used to adjust the gate voltage of the power device based on the drain current of the power device.

2. The power device constant junction temperature aging device according to claim 1, characterized in that: The gate voltage control unit includes: a single chip microcomputer, a digital-to-analog converter, a first operational amplifier, a second operational amplifier, a current sampling chip and an analog-to-digital converter; The single-chip microcomputer is respectively connected to the temperature monitoring module and the digital-to-analog converter, and is used to compare the received temperature information sent by the temperature monitoring module with a preset temperature threshold, and control the temperature monitoring module to control the temperature of the power device according to the comparison result, or send a first digital signal for adjusting the gate voltage to the digital-to-analog converter; The digital-to-analog converter is further connected to the first operational amplifier, and is configured to convert the received first digital signal into a first analog signal and send it to the first operational amplifier; The first operational amplifier is further connected to the gate of the power device, and is used to process the received first analog signal and output a reverse voltage, and input the reverse voltage into the gate of the power device to form a drain current in the power device; The current sampling chip is connected to the drain of the power device and the second operational amplifier, respectively, for collecting the drain current of the power device and converting the drain current into a voltage signal to transmit to the second operational amplifier; The second operational amplifier is further connected to the analog-to-digital converter, and is configured to invert the received voltage signal and send the obtained second analog signal to the analog-to-digital converter; The analog-to-digital converter is also connected to the single-chip microcomputer, and is used to convert the second analog signal into a second digital signal, and transmit the second digital signal to the single-chip microcomputer; The single chip microcomputer is further used to calibrate the second digital signal, and when the calibration fails, continue to send the digital signal for regulating the gate voltage.

3. The constant junction temperature aging device for power devices according to claim 2, characterized in that: The number of the digital-to-analog converter, the first operational amplifier, the second operational amplifier, the current sampling chip, and the power device is at least one; The gate voltage control unit further includes: at least one analog switch; One end of the at least one analog switch is correspondingly connected to at least one output end of the single-chip microcomputer, and the other end is correspondingly connected to at least one digital-to-analog converter. Each digital-to-analog converter is correspondingly connected to the first operational amplifier, the power device, the current sampling chip and the second operational amplifier in sequence. Each second operational amplifier is respectively connected to at least one input pin of the analog-to-digital converter. At least one output pin of the analog-to-digital converter is correspondingly connected to the at least one analog switch. The at least one analog switch is used to be opened or closed according to the instruction of the single-chip microcomputer.

4. The constant junction temperature aging device for power devices according to claim 1, characterized in that: The heat consumption control module further includes: a relay; One end of the relay is connected to the leakage voltage control unit, and the other end is connected to the drain voltage input end of the power device.

5. The power device constant junction temperature aging device according to claim 2 or 3, characterized in that: The temperature monitoring module includes: a temperature monitoring device and a temperature control device; The temperature monitoring device is arranged at the bottom of the power device and connected to the single chip microcomputer, and is used to monitor the bottom temperature of the power device and send the bottom temperature to the single chip microcomputer; The temperature control device is connected to the single chip microcomputer and is used to reduce the temperature of the power device after receiving a temperature reduction instruction sent by the single chip microcomputer.

6. The constant junction temperature aging device for power devices according to claim 5, characterized in that: The temperature control device is a fan.

7. The constant junction temperature aging device for power devices according to claim 5, characterized in that: The temperature monitoring module further includes: a temperature stabilizing plate; The temperature stabilizing plate is arranged at the bottom of the temperature monitoring device and is used to stabilize the bottom temperature of the power device.

8. The power device constant junction temperature aging device according to claim 7, characterized in that: The temperature stabilizing plate is a cavity structure, and at least one through hole communicating with the cavity structure is provided on the upper surface of the cavity structure, and the through hole is used to place a liquid with a specific heat capacity greater than a preset value into the cavity structure; Any two corresponding side surfaces of the cavity structure of the temperature stabilizing plate are arranged as an X-shaped structure.

9. The constant junction temperature aging device for power devices according to claim 7, characterized in that: The temperature stabilizing plate is made of copper and / or aluminum.

Images