Radiators and electronics units

Abstract

The heat sink of the embodiment comprises a base plate, a protrusion, a first heat sink, a first protrusion, and a second protrusion. The protrusion protrudes from the base plate in a first direction intersecting the base plate, and can be thermally connected to a first heating element mounted on the first substrate. A plurality of first heat sinks protrude from the base plate in a direction opposite to the first direction, and are arranged in a second direction intersecting the first direction. The first protrusion protrudes from the base plate in a direction opposite to the first direction, and protrudes further in the direction opposite to the first direction than the first heat sink, and can be assembled with a coupling that combines the outer wall of the housing and the base plate. The second protrusion protrudes from the base plate in the first direction, and can be assembled with a coupling that combines the first substrate and the base plate.

Description

Technical Field

[0001] Embodiments of the present invention relate to a heat sink and an electronic equipment unit. Background Art

[0002] Conventionally, there is known a heat sink including a base plate thermally connected to a heat generating element mounted on a substrate, and a plurality of heat dissipation fins protruding from the base plate to a side opposite to the heat generating element.

[0003] Prior art literature:

[0004] Patent literature:

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-67888 Summary of the invention

[0006] Problems to be solved by the invention:

[0007] It would be very meaningful if a more appropriate new structure suitable for fanless electronic equipment could be obtained for this type of heat sink.

[0008] Means used to solve the problem:

[0009] The heat sink of the embodiment comprises a base plate, a protrusion, a first heat sink, a first protrusion, and a second protrusion. The protrusion protrudes from the base plate in a first direction intersecting the base plate, and can be thermally connected to a first heating element mounted on the first substrate. A plurality of first heat sinks protrude from the base plate in a direction opposite to the first direction, and are arranged in a second direction intersecting the first direction. The first protrusion protrudes from the base plate in a direction opposite to the first direction, and protrudes further in the direction opposite to the first direction than the first heat sink, and can be assembled with a coupling that combines the outer wall of the housing and the base plate. The second protrusion protrudes from the base plate in the first direction, and can be assembled with a coupling that combines the first substrate and the base plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is an exemplary perspective view of an electronic device equipped with an electronic device unit including the heat sink according to the embodiment.

[0011] Figure 2 This is an exemplary perspective view of an electronic device unit including the heat sink according to the embodiment.

[0012] Figure 3 This is an exemplary perspective view of the heat sink according to the embodiment as viewed from the rear side.

[0013] Figure 4 yes Figure 1 A schematic YZ cross-sectional view of an example of an electronic device.

[0014] Figure 5 yes Figure 1 Schematic XY cross-sectional view of an example of an electronic device. DETAILED DESCRIPTION

[0015] The following discloses an exemplary embodiment of the present invention. The structure of the embodiment shown below and the action and effect produced by the structure are an example. The present invention can also be implemented in a manner other than the structure disclosed in the following embodiment. In addition, according to the present invention, at least one of the various effects (including derivative effects) obtained by the structure can be obtained.

[0016] In this specification, ordinal numbers are used only to distinguish parts or components, locations, positions, directions, etc., and do not indicate order or priority.

[0017] [Implementation Method]

[0018] Figure 1 The electronic device unit 10 (see FIG. Figure 2 ) is a stereoscopic view of the electronic device 1. Furthermore, for convenience, three mutually orthogonal directions are defined in the following figures. The X direction is along the depth direction (front-to-back direction) of the electronic device 1 and along the lateral width direction of the heat sink 3. The Y direction is along the width direction (left-right direction) of the electronic device 1 and along the thickness direction of the heat sink 3. The Z direction is along the height direction (up-down direction) of the electronic device 1 and along the longitudinal width direction of the heat sink 3.

[0019] like Figure 1 As shown, the electronic device 1 is configured as a fanless industrial computer and includes a housing 2 and an electronic device unit 10 (see Figure 2 ) etc. The electronic device 1 is not limited to this example, and may be configured as various electronic devices 1 such as a desktop personal computer, an image display device, a television receiver, a game machine, an information storage device, etc.

[0020] The housing 2 is configured in a box-like shape that is short in the Y direction and is in a rectangular parallelepiped shape. The housing 2 has a plurality of wall portions, such as a bottom wall 2a, a top wall 2b, a front wall 2c, a left wall 2d, a rear wall 2e, and a right wall 2f. The bottom wall 2a is also referred to as a lower wall, etc., and the top wall 2b is also referred to as an upper wall, etc. In addition, the front wall 2c, the left wall 2d, the rear wall 2e, and the right wall 2f are also referred to as side walls or peripheral walls, etc.

[0021] The bottom wall 2a and the top wall 2b all extend in a direction orthogonal to the Z direction (XY plane), and are arranged parallel to each other with a gap in the Z direction. The bottom wall 2a constitutes the lower end of the housing 2, and the top wall 2b constitutes the upper end of the housing 2. A plurality of rubber feet 2h are provided on the bottom wall 2a, and the plurality of rubber feet 2h protrude in the opposite direction of the Z direction, and support the housing 2 in a state away from a setting surface such as a shelf, table, or platform not shown in the figure.

[0022] The left wall 2d and the right wall 2f both extend in a direction orthogonal to the Y direction (XZ plane), and are arranged parallel to each other with a gap in the Y direction. The left wall 2d spans between the ends of the bottom wall 2a and the top wall 2b in the Y direction, and the right wall 2f spans between the ends of the bottom wall 2a and the top wall 2b in the opposite direction of the Y direction. The left wall 2d constitutes the left end of the housing 2, and the right wall 2f constitutes the right end of the housing 2.

[0023] In addition, a plurality of rubber feet 2h protruding in the Y direction may be provided on the left wall 2d (see Figure 4 In this embodiment, the electronic device 1 is configured to be usable in a vertical position in which the rubber foot 2h of the bottom wall 2a contacts the installation surface and in a horizontal position in which the rubber foot 2h of the left wall 2d contacts the installation surface. In addition, the rubber foot 2h can be detachably mounted on the housing 2, and when used in one position, the rubber foot 2h used in the other position can be removed.

[0024] In addition, the right wall 2f is located opposite to the heat sink 3 to be described later, which is housed in the housing 2. In this embodiment, the right wall 2f is connected to the protrusion 3d of the heat sink 3 by using a plurality of connecting members 18 such as bolts or screws that penetrate in the Y direction. The right wall 2f is an example of an outer wall. Figure 1 As shown, in this embodiment, the right wall 2f and the heat sink 3 are fixed by the coupling members 18 at three locations, but the number of coupling members 18 (protrusions 3d) is not limited to this example, and may be one, two, or four or more.

[0025] The front wall 2c and the rear wall 2e both extend in a direction orthogonal to the X direction (YZ plane), and are arranged parallel to each other with a gap in the X direction. The front wall 2c spans between the ends of the bottom wall 2a and the top wall 2b in the X direction, and the rear wall 2e spans between the ends of the bottom wall 2a and the top wall 2b in the opposite direction of the X direction. The front wall 2c constitutes the front end of the housing 2, and the rear wall 2e constitutes the rear end of the housing 2. The front wall 2c is provided with an auxiliary storage device 13, a power button 14, various connectors 15, etc.

[0026] In addition, vents 2s are provided on the bottom wall 2a, the top wall 2b, the left wall 2d, and the right wall 2f, respectively. The vents 2s are formed as a portion where a plurality of small holes penetrating each wall portion are concentrated. In this embodiment, the vents 2s provided on the bottom wall 2a, the top wall 2b, the left wall 2d, and the right wall 2f can be used to cool the heat generating components in the housing 2 by air convection in each of the above-mentioned vertical posture and horizontal posture.

[0027] The housing 2 is composed of a base cover 21, a top cover 23, a right cover 24, a bottom cover 25, and a middle frame 22 (see Figure 2) and other components (divided bodies). The base cover 21, the top cover 23, the right cover 24, the bottom cover 25 and the middle frame 22 are made of metal materials such as aluminum.

[0028] The base cover 21 includes a part of the bottom wall 2a, the front wall 2c, the left wall 2d, etc. The top cover 23 includes a part (upper part) of the top wall 2b, the left wall 2d, the rear wall 2e, and the right wall 2f, etc. The right cover 24 includes a part (central part) of the right wall 2f or the rear wall 2e, etc. The bottom cover 25 includes a part (lower part) of the right wall 2f or a part of the bottom wall 2a, etc. The base cover 21, the top cover 23, the right cover 24, and the bottom cover 25 are connected to each other (integrated) by a connecting member 20 such as a screw.

[0029] Figure 2 is a perspective view of the electronic equipment unit 10. Figure 2 As shown, the electronic device unit 10 includes an intermediate frame 22 or a heat sink 3, a main substrate 4, a plurality of sub-substrates 5 to 9, a storage bracket 16, etc. The electronic device unit 10 is based on the intermediate frame 22, and the heat sink 3, the main substrate 4, a plurality of sub-substrates 5 to 9, and the storage bracket 16 are stacked into a block. The intermediate frame 22 is an example of an assembly base.

[0030] The intermediate frame 22 has a middle wall 22a or a plurality of studs 22d and 22e, and a protruding wall 22c (see Figure 4 ) etc. The middle wall 22a is located in the approximate center of the electronic device unit 10 in the Y direction, specifically between the main substrate 4 and the sub-substrate 6. The middle wall 22a extends in a direction (XZ plane) orthogonal to the Y direction, and is parallel to the left wall 2d and the right wall 2f of the housing 2 mentioned above. The middle wall 22a divides the housing 2 into a plurality of spaces in the Y direction. The middle wall 22a is also called a partition wall or a partition wall.

[0031] The stud 22d protrudes from the middle wall 22a in the opposite direction of the Y direction and is interposed between the middle wall 22a and the main substrate 4. In this embodiment, a plurality of studs 22d are provided on the middle wall 22a with spaces therebetween. The heads of the studs 22d are pressed into the middle wall 22a by riveting or the like. The stud 22d is an example of a first stud.

[0032] In addition, an internal threaded portion that meshes with an external threaded portion of a coupling member 19 is provided on the shaft portion of the stud 22d. The coupling member 19 is a screw or a bolt, etc., and is coupled to the stud 22d in a state of penetrating the heat sink 3 and the main substrate 4 in the Y direction. That is, in this embodiment, the heat sink 3 and the main substrate 4 are fastened together by the coupling member 19. The main substrate 4 is supported by a plurality of studs 22d so as to be parallel to the middle wall 22a in a state of being away from the middle wall 22a in the opposite direction of the Y direction.

[0033] The stud 22e protrudes from the middle wall 22a in the Y direction and is interposed between the middle wall 22a and the sub-base 6. In the present embodiment, a plurality of studs 22e are provided on the middle wall 22a at intervals. In addition, when viewed in the Y direction, the position of the stud 22e is offset from the stud 22d. The head of the stud 22e is pressed into the middle wall 22a by riveting or the like. The stud 22e is an example of a second stud.

[0034] In addition, the shaft portion of the stud 22e is provided with a connection member 19 (see Figure 4 ). The coupling member 19 is a screw or a bolt, etc., and is coupled to the stud 22e in a state where it penetrates the sub-base 6 at least in the Y direction. The sub-base 6 is supported by a plurality of studs 22e so as to be parallel to the middle wall 22a in a state where it is away from the middle wall 22a in the Y direction. In addition, the coupling member 19 is not limited to this example, and the sub-base 6 and the storage bracket 16 may be fastened together.

[0035] like Figure 2 As shown, the sub-base 5 is accommodated in the opening 22b of the middle frame 22. The sub-base 5 extends parallel to the middle frame 22 and is coupled to the middle frame 22 by coupling members such as screws or bolts. A plurality of electronic components or connectors 15 are provided on the sub-base 5. The sub-base 5 is also called a DIO base or an extension base.

[0036] The main substrate 4 is located in the opposite direction of the Y direction of the intermediate frame 22. The main substrate 4 extends parallel to the intermediate frame 22 and is mechanically connected to the intermediate frame 22 through the above-mentioned studs 22d and the coupling 19. In addition, in the present embodiment, by fastening the coupling 19 and the studs 22d, the ground pattern of the main substrate 4 is also electrically connected to the intermediate frame 22 and the heat sink 3.

[0037] In addition, a central processing unit 11 (see FIG. Figure 4 ) or the main storage device 12 (refer to Figure 4 ) and other multiple electronic components. The wiring in the main substrate 4 and these multiple electronic components constitute at least a part of the control circuit of the electronic device 1. The main substrate 4 is an example of a first substrate.

[0038] The sub-substrate 6 is located in the Y direction of the middle frame 22. The sub-substrate 6 extends parallel to the middle frame 22 and is mechanically connected to the middle frame 22 through the above-mentioned studs 22e and the coupling 19. In addition, in the present embodiment, by fastening the coupling 19 and the studs 22e, the ground pattern of the sub-substrate 6 is also electrically connected to the middle frame 22. A plurality of electronic components or connectors 15 are provided on the sub-substrate 6. The sub-substrate 6 is an example of a second substrate, and is also called an IO substrate or an extension substrate.

[0039] like Figure 2 As shown, the sub-baseboard 7 is located in the opposite direction of the X direction of the middle frame 22. The sub-baseboard 7 extends perpendicular to the middle frame 22 and is parallel to the rear wall 2e of the housing 2. The sub-baseboard 7 is mechanically connected to the middle frame 22 through the same structure as the studs 22d, 22e and the coupling member 19. That is, a vertical wall (not shown) extending along the Y direction is provided at the end of the middle frame 22 in the opposite direction of the X direction, and the studs protrude from the vertical wall toward the sub-baseboard 7.

[0040] In addition, in this embodiment, by fastening the above-mentioned joint and stud, the ground pattern of the sub-board 7 is also electrically connected to the middle frame 22. A plurality of electronic components or connectors 7a (see Figure 5 ) etc. The sub-substrate 6 and the main substrate 4 etc. are inserted into the connector 7a. The sub-substrate 7 is also called a backplane substrate, a rear substrate, an extension substrate etc.

[0041] like Figure 2 As shown, the sub-base 8 is located in the Y direction of the sub-base 6 and in the opposite direction of the Z direction of the auxiliary storage device 13. The sub-base 8 extends parallel to the sub-base 6 and the intermediate frame 22, and is supported on the bottom wall 16a of the storage bracket 16 described later. A plurality of electronic components or power supply circuits are provided on the sub-base 8. The sub-base 8 is also called a power supply base, etc.

[0042] The sub-board 9 is located in the opposite direction of the Z direction of the middle frame 22. The sub-board 9 extends perpendicular to the middle frame 22 and is parallel to the bottom wall 2a of the housing 2. A plurality of electronic components are mounted on the sub-board 9 and are inserted into the connector 6a of the sub-board 6 (see Figure 4 ) in the PCI bus, the sub-base 9 is also referred to as a PCI base or an extension base, etc.

[0043] The storage bracket 16 is located in the Y direction of the sub-board 6 and constitutes the Y direction end of the electronic device unit 10. The storage bracket 16 supports the above-mentioned sub-board 8 or auxiliary storage device 13. The auxiliary storage device 13 is an SSD (solid state drive) or HDD (hard disk drive) or the like.

[0044] The heat sink 3 is located in the opposite direction of the Y direction of the main substrate 4, and constitutes the end of the electronic device unit 10 in the opposite direction of the Y direction. The heat sink 3 has a base plate 3a or a plurality of heat sinks 3b, a plurality of protrusions 3d, etc. The plurality of heat sinks 3b protrude from the base plate 3a in the opposite direction of the Y direction, and are arranged with intervals between each other in the X direction. In this embodiment, the Y direction is an example of a first direction, and the X direction is an example of a second direction. The heat sink 3 is made of a metal material such as aluminum.

[0045] The base plate 3a extends parallel to the main substrate 4. In the present embodiment, the size of the base plate 3a is substantially the same as that of the main substrate 4. The base plate 3a has a back surface 3a2 (see FIG. 1 ) facing the main substrate 4 in the Y direction. Figure 3 ) and a surface 3a1 in the opposite direction of the Y direction facing the right wall 2f of the housing 2 (refer to Figure 2 ). On the surface 3a1, a heat sink 3b or a protrusion 3d is provided. The heat sink 3b is an example of a first heat sink, and is also called a heat sink.

[0046] The plurality of protrusions 3d protrude from the base plate 3a in the opposite direction of the Y direction, and protrude further in the opposite direction of the Y direction than the heat sink 3b. The protrusions 3d are provided with internal threads that mesh with the external threads of the coupling member 18. The coupling member 18 is a screw or a bolt, and is coupled to the protrusions 3d while penetrating the right wall 2f of the housing 2 in the Y direction. The protrusions 3d are an example of first protrusions.

[0047] Figure 3 This is a three-dimensional view from the back side 3a2 of the radiator 3. Figure 3 As shown, the heat sink 3 further has a protrusion 3c or a plurality of protrusions 3e, 3g, a plurality of heat sink fins 3f, and the like.

[0048] The protrusion 3c protrudes from the base plate 3a in the Y direction. The protrusion 3c has a front end surface 3c1 in the Y direction and a side surface 3c2 spanning between the front end surface 3c1 and the back surface 3a2. The front end surface 3c1 is connected to the central processing unit 11 (see Figure 4 In other words, the protrusion 3c protrudes from the base plate 3a toward the central processing unit 11. The size of the front end surface 3c1 is substantially the same as the size of the surface of the central processing unit 11.

[0049] Furthermore, in the present embodiment, the front end surface 3c1 and the central processing unit 11 are thermally connected via a thermally conductive grease or the like. The front end surface 3c1 is also referred to as a top surface or a heat transfer surface or the like. Furthermore, the front end surface 3c1 is not limited to this example, and may also be provided in a state of direct contact with the central processing unit 11. The central processing unit 11 is an example of a first heating element.

[0050] The side surface 3c2 faces the space between the main substrate 4 and the base plate 3a. In the present embodiment, the side surface 3c2 is inclined toward the center of the front end surface 3c1 as it moves away from the back surface 3a2 in the Y direction. In other words, the protrusion 3c has a substantially trapezoidal cross section. The protrusion 3c has improved moldability based on the draft angle of the mold and increased the surface area of ​​the protrusion 3c by such a side surface 3c2.

[0051] A plurality of protrusions 3g protrude from the base plate 3a in the Y direction. In the present embodiment, the protrusions 3g are disposed adjacent to two corners on the diagonal line of the protrusion 3c. Screws or bolts or other fasteners for fastening the heat sink 3 and the main substrate 4 are mounted on the protrusions 3g.

[0052] By screwing the heat sink 3 closer to the protrusion 3c using the protrusion 3g, it is possible to prevent the protrusion 3c from being separated from the central processing unit 11 in the Y direction and thus reducing the heat transfer performance. In addition, the height of the protrusion 3g in the Y direction is lower than the height of the protrusion 3c and the protrusion 3e in the Y direction.

[0053] The plurality of protrusions 3e protrude from the base plate 3a in the Y direction and are interposed between the base plate 3a and the main base plate 4. When viewed in the Y direction, the positions of the protrusions 3e are aligned with the studs 22d (see Figure 4 That is, the protrusion 3e is provided with a fastener 19 for fastening the heat sink 3 and the main substrate 4 together. The protrusions 3e and 3g are examples of second protrusions.

[0054] The plurality of heat sinks 3f protrude from the base plate 3a in the Y direction and are arranged at intervals in the X direction. The heat sinks 3f face the space between the main substrate 4 and the base plate 3a. The height of the heat sink 3f in the Y direction is lower than the height of the protrusion 3c in the Y direction.

[0055] In this embodiment, the surface area of ​​the heat sink 3 is increased by using such heat sink 3f, and the back surface 3a2 of the base plate 3a is reinforced. The heat sink 3b is an example of a second heat sink, and is also called a heat dissipation portion or a reinforcing rib.

[0056] Figure 4 yes Figure 1 The YZ cross-sectional view of the electronic device 1. Figure 4 As shown, the middle frame 22 has a protruding wall 22c. The protruding wall 22c protrudes from the middle wall 22a in the opposite direction to the Y direction, and is bent to extend along the main base plate 4 at a position separated from the middle wall 22a.

[0057] The protruding wall 22c faces the main storage device 12 mounted on the main substrate 4. In other words, the protruding wall 22c protrudes from the middle wall 22a toward the main storage device 12. The protruding wall 22c is coupled to the middle wall 22a by a coupling member 22f such as a screw or a bolt. The middle wall 22a is also referred to as a first metal plate, etc., and the protruding wall 22c is also referred to as a second metal plate, etc.

[0058] Furthermore, in the present embodiment, the protruding wall 22c is thermally connected to the main storage device 12 via the heat conduction member 30. Thus, the heat of the main storage device 12 can be released to the intermediate frame 22 by heat diffusion via the heat conduction member 30. The main storage device 12 is an example of a second heat generating body. Furthermore, the main storage device 12 is mounted on the surface of the main substrate 4 on the opposite side to the central processing unit 11, and its position is offset from the central processing unit 11 when viewed in the Y direction.

[0059] The heat conducting member 30 includes a paste 31 and a sheet 32. The paste 31 is applied to the end surface of the protruding wall 22c in the opposite direction to the Y direction. The paste 31 is a heat conducting paste containing a conductive material.

[0060] The sheet 32 ​​extends along the main substrate 4 and is interposed between the paste 31 and the main storage device 12. The sheet 32 ​​is a thermal sheet and has thermal conductivity and insulation. In the present embodiment, by sandwiching such a sheet 32 ​​between the main storage device 12 and the paste 31, the paste 31 is prevented from contacting and conducting with the terminals of the main storage device 12 or the terminals of the main substrate 4.

[0061] The storage tray 16 has a bottom wall 16a for supporting the auxiliary storage device 13 or the sub-base 8. The bottom wall 16a extends along the middle frame 22 and covers the side surface 13a of the auxiliary storage device 13 opposite to the Y direction or the surface of the sub-base 8 opposite to the Y direction.

[0062] In other words, the bottom wall 16a is located in the middle of the heat transfer path from the middle frame 22 or the main storage device 12, the central processing unit 11 and other heat generating bodies to the auxiliary storage device 13 and the sub-base 8. The storage bracket 16 is made of a heat insulating material such as synthetic resin. The bottom wall 16a is an example of a heat insulating wall, and the side surface 13a is an example of a second surface.

[0063] Figure 5 yes Figure 1 XY cross-sectional view of the electronic device 1. Figure 5 As shown, a recess 3h is provided on the heat sink 3 corresponding to the protrusion 3c. The recess 3h is recessed in the Y direction from a surface 3a1 on the opposite side of the protrusion 3c from the central processing unit 11, that is, in the opposite direction to the Y direction. The surface 3a1 is an example of a first surface.

[0064] In addition, the heat sink 3b has a plurality of heat sinks 3b1 and a plurality of heat sinks 3b2. The heat sink 3b1 extends from the surface 3a1 in the opposite direction of the Y direction, and the heat sink 3b2 extends from the bottom 3h1 of the recess 3h in the opposite direction of the Y direction. In this embodiment, the length of the heat sink 3b1 in the Y direction is substantially the same as the length of the heat sink 3b2 in the Y direction. Therefore, a recessed portion that is recessed from the heat sink 3b2 in the Y direction is provided at the front end of the heat sink 3b.

[0065] In the present embodiment, such a structure is adopted to arrange the heat sink 3b2 overlapping with the central processing unit 11 in the Y direction further away from the right wall 2f of the housing 2. Thus, it is possible to suppress the local temperature rise of the right wall 2f due to the heat radiation (radiation) from the heat sink 3b2 which is more likely to reach a high temperature than the heat sink 3b1 among the heat sink 3b.

[0066] In this embodiment, at least a portion of the heat sink 3b2 is formed by a portion of the right wall 2f where the vent 2s is not provided (see Figure 1 ) is covered from the opposite direction of the Y direction. This increases the flow rate of the air flowing near the heat sink 3b2. Therefore, according to this embodiment, the cooling effect (heat dissipation effect) generated by the use of air can be further improved near the heat sink 3b2 where the temperature is most likely to rise in the radiator 3.

[0067] Next, an example of an assembly method of the electronic device 1 is described. First, the sub-board 5, the main board 4, and the heat sink 3 are assembled in order on one side of the intermediate frame 22, that is, in the opposite direction of the Y direction (S1). S1 is an example of the first step.

[0068] Next, the middle frame 22 is turned over, and the sub-board 7 is assembled perpendicularly to the middle frame 22 (S2). S2 is an example of the second step.

[0069] Next, the sub-board 6 and the storage bracket 16 are assembled in order on the other side of the intermediate frame 22, that is, in the Y direction, and the sub-boards 8 and 9 are assembled to assemble the electronic device unit 10 (S3). S3 is an example of the third step.

[0070] Next, the electronic device unit 10 is assembled on the base cover 21 of the housing 2 (S4). Then, the top cover 23, the right cover 24 and the bottom cover 25 are assembled to assemble the electronic device 1 (S5). S4 is an example of the fourth step, and S5 is an example of the fifth step.

[0071] As described above, in the present embodiment, the heat sink 3 comprises: a base plate 3a; a protrusion 3c, which protrudes from the base plate 3a in the Y direction (first direction) and can be thermally connected to the central processing unit 11 (first heat generating body) mounted on the main substrate 4 (first substrate); a plurality of heat sinks 3b (first heat sinks), which protrude from the base plate 3a in the direction opposite to the Y direction and are arranged in the X direction (second direction); a raised portion 3d (first raised portion), which protrudes from the base plate 3a in the direction opposite to the Y direction and protrudes further in the direction opposite to the Y direction than the heat sink 3b, and can be assembled with a coupling 18 that combines the right wall 2f (outer wall) of the shell 2 and the base plate 3a; and a raised portion 3e (second raised portion), which protrudes from the base plate 3a in the Y direction and can be assembled with a coupling 19 that combines the main substrate 4 and the base plate 3a.

[0072] According to such a structure, since the interference between the components other than the central processing unit 11 mounted on the main substrate 4 and the base plate 3a can be avoided by the protrusion 3c, the base plate 3a and the heat sink 3 can be configured to be as large as the main substrate 4. As a result, the surface area of ​​the heat sink 3 can be increased, and the temperature rise of the central processing unit 11 can be more effectively suppressed in the fanless electronic device 1. In addition, since the heat sink 3 can be fixed to the housing 2 and the main substrate 4 by the protrusions 3d and 3e protruding from the base plate 3a and the couplings 18 and 19, even a relatively large heat sink 3 can be more reliably or more firmly held. In addition, by fastening the couplings 18 and 19 to the protrusions 3d and 3e, the ground pattern of the main substrate 4 can be electrically connected to the heat sink 3 and the housing 2. As a result, the housing 2 can function as a grounding member for the heat sink 3 and the main substrate 4, and EMI (Electro Magnetic Interference) can be dealt with.

[0073] In addition, in this embodiment, a recess 3h is provided on the protrusion 3c, which is recessed in the Y direction from the surface 3a1 (first surface) on the opposite side to the central processing unit 11, and the heat sink 3b2 which is a part of the heat sink 3b protrudes from the bottom 3h1 of the recess 3h in the direction opposite to the Y direction.

[0074] According to such a structure, when the heat sink 3b is formed in such a manner that the lengths of the plurality of heat sinks 3b in the Y direction are substantially the same, the heat sink 3b2 protruding from the bottom 3h1 of the recess 3h can be arranged further away from the right wall 2f of the housing 2. Thus, it is possible to suppress the local temperature rise of the right wall 2f due to the heat radiation (radiation) from the heat sink 3b2 which is more likely to become high temperature than the heat sink 3b1 among the heat sink 3b. In addition, assuming that the heat sink 3b is formed in such a manner that the front ends of the plurality of heat sinks 3b in the opposite direction of the Y direction are consistent, the length of the heat sink 3b2 can be made longer than the length of the heat sink 3b1. Thus, it is sometimes possible to further increase the surface area of ​​the heat sink 3, and thus it is possible to further improve the cooling effect (heat dissipation effect) of the central processing unit 11.

[0075] Furthermore, in the present embodiment, the heat sink 3 includes a plurality of heat dissipation fins 3f (second heat dissipation fins) that protrude from the base plate 3a in the Y direction and are arranged in the X direction.

[0076] According to such a structure, since the surface area of ​​the heat sink 3 can be increased by the heat sink 3f, the cooling effect (heat dissipation effect) of the central processing unit 11 can be further improved. In addition, the back surface 3a2 of the base plate 3a opposite to the heat sink 3b can be reinforced by the heat sink 3f, thereby suppressing the deformation of the base plate 3a toward the heat sink 3b due to thermal contraction.

[0077] In addition, in the present embodiment, the electronic device unit 10 is constructed such that the following parts can be assembled into the housing 2 in an integrated state, and the parts include: a heat sink 3; a main substrate 4, on which is mounted a central processing unit 11 which is arranged to be thermally connected to the protrusion 3c of the heat sink 3; an intermediate frame 22 (assembly base) located in the Y direction on the side of the main substrate 4 opposite to the heat sink 3; a sub-substrate 6 (second substrate) located in the Y direction of the intermediate frame 22; and a storage bracket 16 located in the Y direction of the sub-substrate 6 to hold the auxiliary storage device 13.

[0078] According to such a structure, compared with the case where the radiator 3, the main substrate 4, the intermediate frame 22, the sub-substrate 6 and the storage bracket 16 are individually assembled in the housing 2, the use of the block-type electronic device unit 10 can reduce the labor and time required for the manufacture (assembly operation) of the electronic device 1, or can construct the electronic device 1 more compactly.

[0079] In addition, in the present embodiment, the intermediate frame 22 has: a middle wall 22a, which is located between the main substrate 4 and the sub-substrate 6; a stud 22d (first stud), which protrudes from the middle wall 22a in the opposite direction of the Y direction and can be assembled with a coupling 19 that combines the main substrate 4 and the intermediate frame 22; and a stud 22e (second stud), which protrudes from the middle wall 22a in the Y direction and can be assembled with a coupling 19 that combines the sub-substrate 6 and the intermediate frame 22.

[0080] According to such a structure, the main substrate 4 and the sub-substrate 6 can be relatively easily fixed to the middle frame 22 by using the studs 22d and 22e protruding from the middle wall 22a and the coupling 19. In addition, by fastening the coupling 19 and the studs 22d and 22e, the ground pattern of the main substrate 4 and the ground pattern of the sub-substrate 6 can be electrically connected to the middle frame 22. Thus, the middle frame 22 can function as a grounding member for the main substrate 4 and the sub-substrate 6, and can further cope with EMI (ElectroMagneticInterference: electromagnetic radiation interference).

[0081] In addition, in this embodiment, there is also a main storage device 12 (second heating element), which is installed on the main substrate 4 and is configured to be thermally connected to the intermediate frame 22 via a heat conduction component 30. The heat conduction component 30 has a paste 31 applied to the intermediate frame 22, and a sheet 32 ​​between the paste 31 and the main storage device 12.

[0082] According to such a structure, since the heat of the main storage device 12 can be released to the intermediate frame 22 by heat diffusion through the heat conduction member 30, the temperature rise of the main storage device 12 can be more effectively suppressed. In addition, by using the sheet 32 ​​interposed between the paste 31 and the main storage device 12, it is possible to suppress the paste 31 from contacting and conducting with the terminals of the main storage device 12 or the terminals of the main substrate 4.

[0083] Furthermore, in the present embodiment, the storage bracket 16 has a portion 16 a (bottom wall) that covers at least the side surface 13 a (second surface) of the auxiliary storage device 13 in the opposite direction to the Y direction.

[0084] According to such a configuration, since heat transfer from the middle frame 22, the main storage device 12, the central processing unit 11, etc. to the auxiliary storage device 13 is suppressed by the bottom wall 16a, the temperature rise of the auxiliary storage device 13 can be suppressed.

[0085] The above examples illustrate the embodiments of the present invention, but the above embodiments are only examples and are not intended to limit the scope of the invention. The above embodiments can be implemented in various other ways, and various omissions, substitutions, combinations and changes can be made without departing from the scope of the invention. In addition, the specifications of various structures, shapes, etc. (structure or type, direction, form, size, length, width, thickness, height, quantity, configuration, position, material, etc.) can be appropriately changed before implementation.

Claims

1. An electronic equipment unit, wherein:

12. The heat dissipation device as described in claim 9, wherein the first heat dissipation device is a heat dissipation device and a heat dissipation device is used to dissipate heat from one end of the heat dissipation device to another end of the heat dissipation device. The heat dissipation device is a heat dissipation device in which a first heat dissipation device is installed. The heat dissipation device is a heat dissipation device in which a first heat dissipation device is installed. A coupling member for coupling the first substrate and the base plate; a second protrusion, which protrudes from the base plate toward the first direction and can be assembled with a coupling member for coupling the first substrate and the base plate, the assembly base is located in the first direction on the first substrate opposite to the heat sink, and has: a middle wall, which is located between the first substrate and the second substrate; a first stud, which protrudes from the middle wall in the direction opposite to the first direction and can be assembled with a coupling member for coupling the first substrate and the assembly base; and a second stud, which protrudes from the middle wall toward the first direction and can be assembled with a coupling member for coupling the second substrate and the assembly base, the second substrate is located in the first direction of the assembly base, and the storage bracket is located in the first direction of the second substrate to hold the auxiliary storage device.

2. The electronic equipment unit according to claim 1, wherein: A second heating element is provided, which is mounted on the first substrate or the second substrate and is arranged to be thermally connected to the assembly base via a heat conduction member, wherein the heat conduction member has: a paste applied on the assembly base; and a sheet plate interposed between the paste and the second heating element.

3. The electronic equipment unit according to claim 2, wherein: The storage rack has a heat insulating wall covering at least a second surface of the auxiliary storage device in a direction opposite to the first direction.

4. The electronic equipment unit according to claim 1, wherein: The protruding portion of the heat sink is provided with a recessed portion recessed from a first surface on the opposite side to the first heating element toward the first direction, and a portion of the first heat sink protrudes from a bottom of the recessed portion toward a direction opposite to the first direction.

5. The electronic equipment unit according to claim 1 or 4, wherein: A plurality of second heat sinks are provided, and the second heat sinks protrude from the base plate toward the first direction and are arranged in the second direction.

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