Electronic component and mounting board on which the electronic component is mounted

Abstract

An electronic component and a mounting board on which the electronic component is mounted are provided. The electronic component includes: a capacitor array in which a plurality of multilayer capacitors are stacked in a second direction perpendicular to a first direction, each of the plurality of multilayer capacitors including a capacitor body and a pair of external electrodes respectively disposed at both ends of the capacitor body in the first direction, wherein the multilayer capacitor disposed at the lower end in the second direction has a length in the first direction shorter than a length in the first direction of at least one multilayer capacitor disposed above it; and a pair of metal frames respectively disposed so as to be connected to the pair of external electrodes of the multilayer capacitor disposed at the lower end.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0115241 filed on September 9, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to an electronic component and a mounting board on which the electronic component is mounted. Background Art

[0003] Multilayer capacitors are used in various electronic devices due to their small size and high capacitance.

[0004] Recently, due to a rapid growth in interest in environmentally friendly vehicles and electric vehicles, the importance of power drive systems in vehicles is increasing, and thus, the demand for multilayer capacitors required for the power drive systems is also increasing.

[0005] Multilayer capacitors are required to have high levels of thermal, electrical, and mechanical reliability in order to be used as components of vehicles.

[0006] As component mounting density in vehicles increases, there is a need for a multilayer capacitor that can be easily mounted in a limited space while achieving high capacitance and is highly resistant to vibration and deformation.

[0007] To improve durability against such vibration and deformation, the multilayer capacitor may be mounted on the board while being spaced apart from the board using a metal frame.

[0008] Additionally, multiple multilayer capacitors can be stacked to achieve high capacitance in a similar area.

[0009] However, in the case of electronic assemblies with a multi-stack structure using a metal frame, the length of the electronic assembly increases due to the thickness of the metal frame and the thickness of the conductive bonding layer. Therefore, during board installation, the mounting area increases due to the increase in the length of the electronic assembly. Therefore, the design of the electrode pads of the board should be changed. Summary of the Invention

[0010] One aspect of the present disclosure is to provide an electronic component and a mounting board on which the electronic component is mounted, wherein the electronic component can achieve high capacitance and improve durability against vibration and deformation, and the electronic component can be used without increasing the mounting area and without changing the design of the electrode pad of the board when mounted on the board.

[0011] According to one aspect of the present disclosure, an electronic component includes: a capacitor array, in which a plurality of multilayer capacitors are stacked in a second direction perpendicular to a first direction, each of the plurality of multilayer capacitors includes a capacitor body and a pair of external electrodes respectively arranged at two ends of the capacitor body in the first direction, and the length of the multilayer capacitor arranged at the lower end in the second direction is smaller than the length of at least one multilayer capacitor arranged above it in the first direction; and a pair of metal frames, respectively arranged to be connected to a pair of external electrodes of the multilayer capacitor arranged at the lower end.

[0012] The capacitor body may include a dielectric layer and a plurality of inner electrodes alternately arranged with the dielectric layer interposed between the plurality of inner electrodes.

[0013] The external electrode may include a head portion provided on one surface of the capacitor body in the first direction, and a band portion extending from the head portion to a portion of an upper surface and a portion of a lower surface of the capacitor body.

[0014] For the multilayer capacitors adjacent to each other in the second direction, a conductive bonding layer may be provided between the tape portions facing each other.

[0015] The metal frame may include a connection portion connected to a head portion of an external electrode of the multilayer capacitor disposed on the lower end; and a mounting portion extending from a lower end of the connection portion in the first direction.

[0016] The mounting portion may be spaced apart from a lower end of the capacitor array.

[0017] The electronic component may further include a conductive bonding layer disposed between the connection portion and the head.

[0018] Parts of the tape portions of two adjacent multilayer capacitors that face each other may overlap each other in the second direction.

[0019] In addition, 2 / 3≤B / A, where A is the length of the band portion of the multilayer capacitor arranged on the lower end in the first direction, and B is the length of the portion of the band portions of the two adjacent multilayer capacitors overlapping each other in the second direction in the first direction.

[0020] A length in the first direction of a portion of the tape portions of the two adjacent multilayer capacitors overlapping each other in the second direction may be greater than or equal to 0.4 mm.

[0021] The metal frame may include a coupling portion extending from an upper end of the connection portion along the first direction such that the metal frame is coupled to a strip portion of a multilayer capacitor disposed at an upper side in the capacitor array.

[0022] The electronic component may further include a conductive bonding layer disposed between the bonding portion and the tape portion of the multilayer capacitor disposed on the upper side in the capacitor array.

[0023] The metal frame may include an extension portion extending from an upper end of the connection portion along the first direction; and an auxiliary connection portion extending from the extension portion along the second direction to be coupled to a head portion of a multilayer capacitor disposed at an upper side in the capacitor array.

[0024] The electronic component may further include a conductive bonding layer disposed between the auxiliary connection portion and the head portion of the multilayer capacitor disposed on the upper side in the capacitor array.

[0025] The auxiliary connection portion may be formed to expose a portion of the head portion of the multilayer capacitor disposed on the upper side in the capacitor array.

[0026] According to one aspect of the present disclosure, an electronic component includes: a first capacitor having a first capacitor body, a first external electrode arranged on a first surface of the first capacitor body, and a second external electrode arranged on a second surface of the first capacitor body opposite to the first surface in the length direction, the first capacitor having a first length in the length direction; a first metal frame and a second metal frame, the first metal frame being combined with the first external electrode, the second metal frame being combined with the second external electrode, the first metal frame and the second metal frame extending downward along the thickness direction; and a second capacitor arranged above the first capacitor in the thickness direction, the second capacitor having a second capacitor body, a third external electrode arranged on the first surface of the second capacitor body, and a fourth external electrode arranged on the second surface of the second capacitor body opposite to the first surface in the length direction, the second capacitor having a second length in the length direction, the second length being greater than the first length.

[0027] According to another aspect of the present disclosure, a mounting board on which an electronic component is mounted includes a board on which the above-mentioned electronic component is mounted.

[0028] According to another aspect of the present disclosure, a mounting board on which an electronic component is mounted includes: a board having a first electrode pad and a second electrode pad provided on an upper surface; and an electronic component mounted in such a manner that a single mounting portion is connected to each of the first electrode pad and the second electrode pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings.

[0030] Figure 1 is a schematic perspective view of a multilayer capacitor applied to an exemplary embodiment of the present disclosure.

[0031] Figure 2A and Figure 2B are shown for Figure 1 1. A plan view of a first inner electrode and a second inner electrode of a multilayer capacitor.

[0032] Figure 3 It is along Figure 1 A cross-sectional view taken along line II'.

[0033] Figure 4 is a perspective view illustrating a schematic structure of an electronic component according to an exemplary embodiment of the present disclosure.

[0034] Figure 5 It is along Figure 4 A cross-sectional view taken along line II-II'.

[0035] Figure 6 is a graph showing changes in detachment rate and relative ESR of a multilayer capacitor disposed above according to overlapping lengths of strip portions vertically facing each other in a capacitor array of an electronic component according to an exemplary embodiment of the present disclosure.

[0036] Figure 7 is a cross-sectional view of an electronic component according to another exemplary embodiment of the present disclosure.

[0037] Figure 8 is a perspective view illustrating a schematic structure of an electronic component according to another exemplary embodiment of the present disclosure.

[0038] Figure 9 It is along Figure 8 A cross-sectional view taken along line III-III'.

[0039] Figure 10 It shows Figure 5 A cross-sectional view of a state where electronic components are mounted on a board. DETAILED DESCRIPTION

[0040] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings as follows.

[0041] However, the present disclosure may be exemplified in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0042] Throughout this specification, it will be understood that when an element (such as a layer, region, or wafer (plate)) is referred to as being "on" another element, "connected to" another element, or "bonded to" another element, it may be directly "on" the other element, directly "connected to" the other element, or directly "bonded to" the other element, or there may be other elements between the two elements. In contrast, when an element is referred to as being "directly on" another element, "directly connected to" another element, or "directly bonded to" another element, there are no elements or layers between the two elements. Like reference numerals refer to similar elements throughout. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0043] It will be apparent that although terms such as "first," "second," "third," etc. may be used herein to describe various members, components, regions, layers, and / or portions, these members, components, regions, layers, and / or portions should not be limited by these terms. These terms are merely used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Thus, a first member, first component, first region, first layer, or first portion discussed below may be referred to as a second member, second component, second region, second layer, or second portion without departing from the teachings of the exemplary embodiments.

[0044] For ease of description, spatially relative terms such as "above," "up," "below," and "below" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, elements described as being "above" or "up" other elements or features would then be "below" or "below" the other elements or features. Thus, the term "above" may encompass both the orientations of "above" and "below," depending on the specific orientation of the drawing. The device may be positioned in other ways (rotated 90 degrees or in other orientations), and the spatially relative terms used herein may be interpreted accordingly.

[0045] The terms used herein describe specific embodiments only, and the present disclosure is not limited thereby. Unless the context clearly indicates otherwise, as used herein, the singular is intended to include the plural. It will be further understood that when the terms "comprise" and / or "comprising" are used in this specification, the presence of the stated features, integers, steps, operations, components, elements and / or groups thereof is enumerated, but the presence or addition of one or more other features, integers, steps, operations, components, elements and / or groups thereof is not excluded.

[0046] Hereinafter, embodiments of the present disclosure will be described with reference to schematic diagrams illustrating embodiments of the present disclosure. In the accompanying drawings, variations in the shapes shown may be expected, for example, due to manufacturing techniques and / or tolerances. Therefore, the embodiments of the present disclosure should not be interpreted as being limited to the specific shapes of the regions shown herein, and should be interpreted as including variations in shape resulting from manufacturing, for example. The following embodiments may also be composed of one or a combination of these.

[0047] The contents of the present disclosure described below may have various configurations, and only required configurations are presented here, but are not limited thereto.

[0048] When defining directions to clearly describe the embodiments in the present disclosure, X, Y, and Z in the drawings represent a length direction, a width direction, and a thickness direction of the multilayer capacitor and the electronic component, respectively.

[0049] Here, in an embodiment, the Z direction may be used as a direction having the same direction as a stacking direction in which dielectric layers are stacked on each other.

[0050] Figure 1 is a schematic perspective view of a multilayer capacitor applied to an exemplary embodiment, Figure 2A and Figure 2B are shown for Figure 1 a plan view of a first inner electrode and a second inner electrode of a multilayer capacitor, Figure 3 It is along Figure 1 A cross-sectional view taken along line II'.

[0051] In the following, reference will be made to Figures 1 to 3 The structure of the first multilayer capacitor 100 applied to the electronic component of the present embodiment is described.

[0052] In addition, the second multilayer capacitor to be described later has a structure similar to that of the first multilayer capacitor 100 (a structure having a capacitor body and first and second external electrodes). Therefore, the description of the structure of the second multilayer capacitor will be omitted to avoid redundancy.

[0053] The first multilayer capacitor 100 may include a capacitor body 110 ; and first and second external electrodes 131 and 132 respectively disposed on both end portions of the capacitor body 110 in an X direction defined as a first direction.

[0054] The capacitor body 110 may be formed by laminating a plurality of dielectric layers 111 in the Z direction and sintering the laminated dielectric layers 111. Adjacent dielectric layers 111 of the capacitor body 110 are integrated so that a boundary therebetween is not apparent without a scanning electron microscope (SEM).

[0055] The capacitor body 110 may include a plurality of dielectric layers 111 and first and second internal electrodes 121 and 122 alternately arranged in the Z direction with the respective dielectric layers 111 interposed therebetween. The first and second internal electrodes 121 and 122 may have opposite polarities.

[0056] The capacitor body 110 may include an active area and cover areas 112 and 113 .

[0057] The effective region is a portion that contributes to the capacitance of the multilayer capacitor.

[0058] Cover regions 112 and 113 may be provided as edge portions on the upper and lower portions of the active region in the Z direction, respectively. Cover regions 112 and 113 may be provided by laminating a single dielectric layer or at least two dielectric layers on the upper and lower surfaces of the active region, respectively.

[0059] The cover regions 112 and 113 may serve to prevent damage to the first and second internal electrodes 121 and 122 due to physical stress or chemical stress.

[0060] The shape of the capacitor body 110 is not limited and may have a hexahedral shape as a whole.

[0061] In this embodiment, the capacitor body 110 may have a first surface 1 and a second surface 2 opposite to each other in the Z direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the X direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and opposite to each other in the Y direction. The first surface 1 may be a mounting surface.

[0062] The shape and size of the capacitor body 110 and the number of laminated dielectric layers 111 are not limited to those shown in the drawings of this embodiment.

[0063] The dielectric layer 111 may include ceramic powder, for example, BaTiO 3 -based ceramic powder, etc.

[0064] BaTiO3 based ceramic powder can be calcium (Ca), zirconium (Zr) and other partially dissolved in BaTiO3 (Ba 1-x Ca x )TiO3、Ba(Ti 1-y Ca y )O3、(Ba 1-x Ca x )(Ti 1-y Zr y )O3、Ba(Ti 1-y Zr y )O3, etc., but not limited to these.

[0065] Ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may also be added to the dielectric layer 111 .

[0066] The ceramic additive may include, for example, transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), aluminum (Al), and the like.

[0067] The first and second internal electrodes 121 and 122 may be electrodes to which voltages having opposite polarities are applied. Each of the first and second internal electrodes 121 and 122 may be formed on the dielectric layer 111 and may be laminated in the Z direction.

[0068] The first and second internal electrodes 121 and 122 may be alternately disposed inside the capacitor body 110 and opposed to each other in the Z direction with a single dielectric layer 111 interposed therebetween. In this case, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the dielectric layer 111 disposed therebetween.

[0069] In the present embodiment, a plurality of internal electrodes are shown and described as being laminated in the Z direction. However, the present disclosure is not limited thereto, and a structure in which the internal electrodes are laminated in the Y direction may be applied as needed.

[0070] One end portion of the first inner electrode 121 may be exposed through the third surface 3 of the capacitor body 110. The end portion of the first inner electrode 121 exposed through the third surface 3 of the capacitor body 110 may be connected to the first outer electrode 131 disposed on one end portion of the capacitor body 110 in the X direction to be electrically connected thereto.

[0071] One end portion of the second inner electrode 122 may be exposed through the fourth surface 4 of the capacitor body 110. The end portion of the second inner electrode 122 exposed through the fourth surface 4 of the capacitor body 110 may be connected to a second outer electrode 132 disposed on the other end portion of the capacitor body 110 in the X direction to be electrically connected thereto.

[0072] According to the above configuration, when a predetermined voltage is applied to the first and second external electrodes 131 and 132 , charges are accumulated between the first and second internal electrodes 121 and 122 .

[0073] In this case, the capacitance of the multilayer capacitor 100 may be proportional to an overlapping area between the first and second internal electrodes 121 and 122 stacked in the Z direction in the active region.

[0074] The material forming the first and second internal electrodes 121 and 122 is not necessarily limited.

[0075] For example, the first and second internal electrodes 121 and 122 may be formed using a conductive paste formed using a noble metal material or at least one of nickel (Ni) and copper (Cu). The noble metal material may be platinum (Pt), palladium (Pd), palladium-silver (Pd-Ag) alloy, or the like.

[0076] In this case, a method of printing the conductive paste, such as screen printing or gravure printing, may be used, but the present disclosure is not limited thereto.

[0077] Voltages having opposite polarities may be supplied to the first and second external electrodes 131 and 132. The first and second external electrodes 131 and 132 may be provided on both ends of the capacitor body 110 in the X direction and may be connected to exposed portions of the first and second internal electrodes 121 and 122, respectively, to be electrically connected to the first and second internal electrodes 121 and 122, respectively.

[0078] The first external electrode 131 may include a first head portion 131 a and a first band portion 131 b .

[0079] The first head portion 131a may be provided on the third surface 3 of the capacitor body 110. The first head portion 131a may contact an end portion of the first inner electrode 121 exposed to the outside through the third surface 3 of the capacitor body 110 to electrically connect the first inner electrode 121 and the first outer electrode 131 to each other.

[0080] First tape portion 131b extends from first head portion 131a to a portion of first surface 1 and second surface 2 of capacitor body 110. The first tape portion can be used to improve bonding strength. To further improve bonding strength, first tape portion 131b can also extend to a portion of fifth surface 5 and sixth surface 6 of capacitor body 110.

[0081] The second external electrode 132 may include a second head portion 132 a and a second band portion 132 b .

[0082] The second head portion 132a may be disposed on the fourth surface 4 of the capacitor body 110. The second head portion 132a may contact an end portion of the second inner electrode 122 exposed to the outside through the fourth surface 4 of the capacitor body 110 to electrically connect the second inner electrode 122 and the second outer electrode 132 to each other.

[0083] The second strip portion 132 b is a portion extending from the second head portion 132 a to a portion of the first surface 1 and the second surface 2 of the capacitor body 110 .

[0084] The second tape portion 132b may be used to improve adhesive strength, etc.

[0085] If necessary to further improve the adhesive strength, the second tape portion 132 b may further extend to a portion of the fifth surface 5 and the sixth surface 6 of the capacitor body 110 .

[0086] The first and second external electrodes 131 and 132 may further include a plating layer.

[0087] The plating layers include first and second nickel (Ni) plating layers disposed on the capacitor body 110 , and first and second tin (Sn) plating layers covering the first and second nickel (Ni) plating layers, respectively.

[0088] Figure 4 is a perspective view showing a schematic structure of an electronic component according to an exemplary embodiment, Figure 5 It is along Figure 4 A cross-sectional view taken along line II-II'.

[0089] According to the electronic component disclosed herein, the electronic component includes: a capacitor array, in which a plurality of multilayer capacitors are stacked in a second direction perpendicular to a first direction, the plurality of multilayer capacitors include a capacitor body and a pair of external electrodes respectively arranged on two ends of the capacitor body in the first direction, and the length of the multilayer capacitor arranged on the lower end in the second direction in the first direction is smaller than the length of another multilayer capacitor (for example, the multilayer capacitor arranged above the multilayer capacitor arranged on the lower end) in the first direction; and a pair of metal frames, respectively arranged to be connected to the pair of external electrodes of the multilayer capacitor arranged on the lower end.

[0090] In the present disclosure, the capacitor array is shown and described as including two multilayer capacitors stacked in the Z direction. However, the present disclosure is not limited thereto, and the capacitor array according to the present disclosure may be constructed in such a manner that three or more multilayer capacitors are stacked in the Z direction. For example, in the case where the capacitor array is constructed as three or more multilayer capacitors are stacked in the Z direction, the length of the multilayer capacitor arranged at the lower end in the second direction in the first direction may be smaller than the length of the multilayer capacitor arranged above it in the first direction, or, at least, smaller than the length of the multilayer capacitor arranged adjacent to it in the first direction. That is, the length of the multilayer capacitor arranged at the lower end in the second direction in the first direction may be smaller than the length of at least one multilayer capacitor arranged above it in the first direction.

[0091] Reference Figure 4 and Figure 5 The electronic component according to the present embodiment may include a capacitor array including a plurality of multilayer capacitors, and a first metal frame 140 and a second metal frame 150 .

[0092] In the present disclosure, the capacitor array may include a first multilayer capacitor 100 disposed below and a second multilayer capacitor 101 disposed above. The first multilayer capacitor 100 and the second multilayer capacitor 101 are stacked in the Z direction.

[0093] In this case, the length of the first multilayer capacitor 100 in the X direction may be smaller than the length of the second multilayer capacitor 101 in the X direction.

[0094] As needed, the length of the first multilayer capacitor 100 in the Y direction may also be smaller than the length of the second multilayer capacitor 101 in the Y direction.

[0095] The second multilayer capacitor 101 may include a third external electrode 131 ′ having a third head portion 131 a ′ and a third tape portion 131 b ′, and a fourth external electrode 132 ′ having a fourth head portion 132 a ′ and a fourth tape portion 132 b ′.

[0096] For the first multilayer capacitor 100 and the second multilayer capacitor 101 adjacent to each other along the Z direction, the conductive bonding layer 161 can be arranged between the first band portion 131b and the third band portion 131b' facing each other along the Z direction, and the conductive bonding layer 162 can be arranged between the second band portion 132b and the fourth band portion 132b' facing each other along the Z direction.

[0097] In the capacitor array, the first and second metal frames 140 and 150 may be provided to be connected to the first and second external electrodes 131 and 132 of the first multilayer capacitor 100 , respectively.

[0098] The first metal frame 140 may include a first connection portion 141 and a first mounting portion 142 .

[0099] The first connection portion 141 may be coupled to the first head portion 131 a of the first external electrode 131 of the first multilayer capacitor 100 to be physically connected thereto, and may be electrically connected to the first head portion 131 a of the first external electrode 131 .

[0100] In this case, the first connection portion 141 may be formed such that an upper end of the first connection portion 141 is in physical contact with the third band portion 131 b ′ of the third external electrode 131 ′.

[0101] The conductive bonding layer 163 may be disposed between the first head portion 131 a of the first external electrode 131 and the first connection portion 141 .

[0102] The conductive bonding layer 163 may be connected to the conductive bonding layer 161 disposed between the first band portion 131 b and the third band portion 131 b ′ to be integrally provided.

[0103] The conductive bonding layer 163 may be formed using high temperature solder, a conductive bonding material, etc., but the present disclosure is not limited thereto.

[0104] The first mounting portion 142 may extend from a lower end of the first connection portion 141 toward the inside of the first connection portion 141 along a horizontal direction with respect to the mounting surface.

[0105] The first mounting portion 142 may function as a connection terminal when the electronic component is mounted on the board.

[0106] In this case, the first mounting portion 142 may be disposed to be spaced apart from the lower end of the first multilayer capacitor 100 .

[0107] The second metal frame 150 may include a second connection portion 151 and a second mounting portion 152 .

[0108] The second connection part 151 may be coupled to the second head portion 132 a of the second external electrode 132 to be physically connected thereto, and may be electrically connected to the second head portion 132 a of the second external electrode 132 .

[0109] In this case, the second connection portion 151 may be formed in such a manner that an upper end of the second connection portion 151 physically contacts the fourth tape portion 132 b ′ of the fourth external electrode 132 ′ of the second multilayer capacitor 101 .

[0110] The conductive bonding layer 164 may be disposed between the second head portion 132 a of the second external electrode 132 and the second connection portion 151 .

[0111] The conductive bonding layer 164 may be connected to the conductive bonding layer 162 disposed between the second band portion 132 b and the fourth band portion 132 b ′ to be integrally provided.

[0112] The conductive bonding layer 164 may be formed using high temperature solder, a conductive bonding material, etc., but the present disclosure is not limited thereto.

[0113] The second mounting portion 152 may extend from a lower end of the second connection portion 151 toward the inside of the second connection portion 151 along a horizontal direction with respect to the mounting surface.

[0114] The second mounting portion 152 may function as a connection terminal when the electronic component is mounted on the board.

[0115] In this case, the second mounting portion 152 may be disposed to be spaced apart from the lower end of the first multilayer capacitor 100 .

[0116] According to the present embodiment, the first multilayer capacitor 100 and the second multilayer capacitor 101 may be stacked in the Z direction to increase capacitance of the electronic component.

[0117] The first metal frame 140 and the second metal frame 150 may be respectively bonded to the first and second external electrodes 131 and 132. In this case, the length of the first multilayer capacitor 100 near the mounting surface of the board in the X direction may be smaller than the length of the second multilayer capacitor 101 disposed thereover in the X direction.

[0118] Compared to the case where the second multilayer capacitor is directly mounted on the board without a metal frame when the electronic component is mounted on the board, in this embodiment, the mounting area of ​​the electronic component can be kept unchanged, and the electrode pads of the board can be used as is without changing the existing design of the size and position of the electrode pads.

[0119] In this case, when adjusting the length of the first multilayer capacitor 100 in the X direction, the thickness of the conductive bonding layers 163 and 164, and the first connection part 141 of the first metal frame 140 and the second connection part 151 of the second metal frame 150, etc., the length from the outer end surface of the first connection part 141 in the X direction to the outer end surface of the second connection part 151 in the X direction may be approximately equal to or less than the length of the second multilayer capacitor 101 in the X direction.

[0120] The conductive bonding layer 163 may be provided between the first head portion 131a of the first external electrode 131 of the first multilayer capacitor 100 and the first connection portion 141 of the first metal frame 140, and the conductive bonding layer 161 may be provided between the first band portion 131b of the first external electrode 131 and the third band portion 131b' of the third external electrode 131', which face each other in the Z direction. Therefore, the bonding strength between the first multilayer capacitor 100 and the second multilayer capacitor 101, as well as the bonding strength between the first multilayer capacitor 100 and the first metal frame 140, can be improved.

[0121] In addition, the conductive bonding layer 164 may be provided between the second head portion 132a of the second external electrode 132 of the first multilayer capacitor 100 and the second connection portion 151 of the second metal frame 150, and the conductive bonding layer 162 may be provided between the second band portion 132b of the second external electrode 132 and the fourth band portion 132b' of the fourth external electrode 132' facing each other in the Z direction. Therefore, the bonding strength between the first multilayer capacitor 100 and the second multilayer capacitor 101 and the bonding strength between the first multilayer capacitor 100 and the second metal frame 150 can be improved.

[0122] In the capacitor array, two multilayer capacitors may be stacked from a lower end in the Z direction in such a manner that portions of the tape portions facing each other may overlap each other in the Z direction.

[0123] In this embodiment, a portion of the first stripe portion 131b of the first external electrode 131 of the first multilayer capacitor 100 and a portion of the third stripe portion 131b' of the third external electrode 131' of the second multilayer capacitor 101 may overlap each other in the Z direction.

[0124] In addition, a portion of the second stripe portion 132 b of the second external electrode 132 of the first multilayer capacitor 100 and a portion of the fourth stripe portion 132 b ′ of the fourth external electrode 132 ′ of the second multilayer capacitor 101 may overlap each other in the Z direction.

[0125] In this embodiment, 2 / 3≤B / A, where "A" is the length of the first tape portion 131b of the first multilayer capacitor 100 in the X direction, and "B" is the length of the portion of the third tape portion 131b' overlapping the first tape portion 131b in the Z direction in the X direction.

[0126] In detail, a length B in the X direction of a portion of the third tape portion 131 b ′ overlapping the first tape portion 131 b in the Z direction may be greater than or equal to 0.4 mm.

[0127] In the present disclosure, 2 / 3≤B / A, where "A" is the length of the second tape portion 132b of the first multilayer capacitor 100 in the X direction, and "B" is the length of the portion of the fourth tape portion 132b' overlapping the second tape portion 132b in the Z direction in the X direction.

[0128] In detail, a length B in the X direction of a portion of the fourth tape portion 132 b ′ overlapping the second tape portion 132 b in the Z direction may be greater than or equal to 0.4 mm.

[0129] Figure 7 is a cross-sectional view of an electronic component according to another exemplary embodiment of the present disclosure.

[0130] Reference Figure 7 , the first metal frame 140 ′ may further include a first combining portion 143 .

[0131] The first coupling portion 143 may extend from an upper end of the first connection portion 141 toward the outside of the first connection portion 141 along the X-direction.

[0132] The first coupling portion 143 may be coupled to the third tape portion 131 b ′ of the second multilayer capacitor 101 disposed above in the capacitor array to support the third tape portion 131 b ′.

[0133] In this case, the conductive bonding layer 166 may be disposed between the first bonding portion 143 and the third tape portion 131 b ′ of the second multilayer capacitor 101 .

[0134] The conductive bonding layer 166 may be integrally connected to the conductive bonding layer 163 disposed between the first connection portion 141 and the first head portion 131 a .

[0135] The second metal frame 150 ′ may further include a second coupling portion 153 .

[0136] The second coupling portion 153 may extend from an upper end of the second connection portion 151 toward the outside of the second connection portion 151 along the X-direction.

[0137] The second coupling portion 153 may be coupled to the fourth tape portion 132 b ′ of the second multilayer capacitor 101 disposed above in the capacitor array to support the fourth tape portion 132 b ′.

[0138] In this case, the conductive bonding layer 167 may be disposed between the second bonding portion 153 and the fourth tape portion 132 b ′ of the second multilayer capacitor 101 .

[0139] The conductive bonding layer 167 may be integrally connected to the conductive bonding layer 164 disposed between the second connection portion 151 and the second head portion 132 a .

[0140] In this embodiment, the first multilayer capacitor 100' may be formed to have a size smaller than Figure 5 The dimensions in the exemplary embodiment of are such that the first metal frame 140 ′ and the second metal frame 150 ′ include the first coupling portion 143 and the second coupling portion 153 , respectively.

[0141] Therefore, the portion where the first and third belt portions 131b and 131b' overlap each other in the Z direction may be significantly small or may not exist. In addition, the portion where the second and fourth belt portions 132b and 132b' overlap each other in the Z direction may be significantly small or may not exist.

[0142] and Figure 5 Compared to the exemplary embodiment, in the present embodiment, with the above-described structure, the adhesive strength between the first multilayer capacitor 100 ′ and the second multilayer capacitor 101 may be reduced.

[0143] Therefore, the non-conductive bonding layer 165 may be disposed in an empty space between the upper surface of the capacitor body of the first multilayer capacitor 100 ′ and the lower surface of the capacitor body of the second multilayer capacitor 101 .

[0144] The non-conductive bonding layer 165 may compensate for the reduced adhesive strength between the first multilayer capacitor 100 ′ and the second multilayer capacitor 101 .

[0145] The non-conductive bonding layer 165 may include epoxy resin or the like, but the present disclosure does not limit the material of the non-conductive bonding layer 165 .

[0146] Figure 8 is a perspective view showing a schematic structure of an electronic component according to another exemplary embodiment, Figure 9 It is along Figure 8 A cross-sectional view taken along line III-III'.

[0147] Reference Figure 8 and Figure 9 The first metal frame 140 ″ may include a first extending portion 144 and a first auxiliary connecting portion 145 .

[0148] The first auxiliary connection portion 145 may be coupled to the third head portion 131 a ′ of the second multilayer capacitor 101 disposed above in the capacitor array. To this end, the first auxiliary connection portion 145 may extend upward along the Z direction from an end portion of the first extension portion 144 .

[0149] In this case, the conductive bonding layer 168 may be disposed between the first auxiliary connection part 145 and the third head portion 131 a ′ of the second multilayer capacitor 101 disposed above in the capacitor array.

[0150] The conductive bonding layer 168 may be integrally connected to the conductive bonding layer 163 disposed between the first connection portion 141 and the first head portion 131 a and the conductive bonding layer 161 disposed between the first band portion 131 b and the third band portion 131 b ′.

[0151] The first auxiliary connection portion 145 may be formed to expose a portion of the third head portion 131 a ′ of the second multilayer capacitor 101 .

[0152] For example, the length of the first auxiliary connection portion 145 in the Z direction may be smaller than the length of the third head portion 131 a ′ in the Z direction.

[0153] The second metal frame 150 ″ may include a second extending portion 154 and a second auxiliary connecting portion 155 .

[0154] The second auxiliary connection portion 155 may be coupled to the fourth head portion 132a' of the second multilayer capacitor 101 disposed above in the capacitor array. To this end, the second auxiliary connection portion 155 may extend upward along the Z direction from an end portion of the second extension portion 154.

[0155] In this case, the conductive bonding layer 169 may be disposed between the second auxiliary connection part 155 and the fourth head portion 132 a ′ of the second multilayer capacitor 101 disposed above in the capacitor array.

[0156] The conductive bonding layer 169 may be integrally connected to the conductive bonding layer 164 disposed between the second connection portion 151 and the second head portion 132 a and the conductive bonding layer 162 disposed between the second band portion 132 b and the fourth band portion 132 b ′.

[0157] The second auxiliary connection portion 155 may be formed to expose the fourth head portion 132 a ′ of the second multilayer capacitor 101 .

[0158] For example, the length of the second auxiliary connection portion 155 in the Z direction may be smaller than the length of the fourth head portion 132 a ′ in the Z direction.

[0159] Figure 10 It shows Figure 5 A cross-sectional view of a state where electronic components are mounted on a board.

[0160] Reference Figure 10 , a mounting board according to the present disclosure may include a board 210 and first and second electrode pads 221 and 222 disposed to be spaced apart from each other on an upper surface of the board 210 .

[0161] In this embodiment, the electronic component may be connected while first mounting portion 142 of first metal frame 140 and second mounting portion 152 of second metal frame 150 are in contact with first electrode pad 221 and second electrode pad 222 , respectively, to be mounted on board 210 .

[0162] In this case, the first mounting portion 142 may be coupled to the first electrode pad 221 by solder 231 to be electrically and physically connected to the first electrode pad 221 , and the second mounting portion 152 may be coupled to the second electrode pad 222 by solder 232 to be electrically and physically connected to the second electrode pad 222 .

[0163] A multilayer capacitor according to the related art has a structure in which external electrodes and plates of the multilayer capacitor are in direct contact with each other through solder.

[0164] Therefore, since thermal deformation or mechanical deformation occurring in the board is directly transferred to the multilayer capacitor, it may be difficult for the multilayer capacitor to ensure a high level of reliability.

[0165] In the electronic assembly according to the present embodiment, the first metal frame 140 and the second metal frame 150 may be respectively coupled to both end portions of the first multilayer capacitor 100 to secure a space between the first multilayer capacitor 100 and the board 210 .

[0166] Therefore, when the electronic component according to the present embodiment is mounted on the board 210, stress from the board 210 is not directly transferred to the first multilayer capacitor 100. Therefore, thermal reliability, electrical reliability, mechanical reliability, etc. of the electronic component can be improved.

[0167] In addition, in the electronic component according to the present embodiment, the second multilayer capacitor may be stacked on the first multilayer capacitor to ensure high capacitance.

[0168] In the case of stacked electronic components according to the prior art, the total length of the electronic component increases due to the thickness of the metal frame and the thickness of the conductive bonding layer. Therefore, when the electronic component is mounted on a board, the mounting area increases due to the increase in the length of the electronic component, and the design of the electrode pads of the board should be changed.

[0169] In the present embodiment, the length of the first multilayer capacitor 100 close to the mounting surface of the board in the X direction is smaller than the length of the second multilayer capacitor 101 in the X direction.

[0170] Therefore, the total length of the portion of the electronic component connected to the board in the X direction is similar to or less than the length of the second multilayer capacitor in the X direction. Therefore, when the electronic component is mounted on the board, the mounting area is not increased, and the electrode pads of the board can be used as they are without changing the design of the electrode pads.

[0171] Figure 6 is a graph showing variations in the detachment rate and relative equivalent series resistance (ESR) of a multilayer capacitor disposed above according to overlapping lengths of strip portions vertically facing each other in a capacitor array of an electronic component according to an exemplary embodiment of the present disclosure.

[0172] The following test will be described based on the length of the first and third belt portions overlapping each other. However, the description of the following test is equally applicable to the length of the second and fourth belt portions overlapping each other.

[0173] After 20 electronic components were mounted on a printed circuit board (PCB) so that each overlapping length B of the first band portion and the third band portion overlapping each other in the Z direction had a difference of 0.1 mm, the ESR of the electronic component including a first multilayer capacitor and a second multilayer capacitor stacked vertically and the bonding strength between the first multilayer capacitor and the second multilayer capacitor of the electronic component were tested.

[0174] In this case, an overlapping length B of the first and third tape portions over each other may be measured in a direction perpendicular to the mounting surface of the board using an optical microscope.

[0175] The ESR of the electronic component according to the overlapping length B of the first tape portion and the third tape portion is measured as a relative ESR according to the reduction of the overlapping length B based on the ESR when the overlapping length B is 0.6 mm, and Figure 6 Shown in.

[0176] The minimum size of the multilayer capacitor capable of performing the multi-stack process is about 1.6 mm in length and about 0.8 mm in width.

[0177] In this case, the tape portion of the outer electrode of the multilayer capacitor has a length greater than or equal to 0.6 mm. For this purpose, 0.6 mm when the first tape portion and the third tape portion are completely overlapped with each other is set as a reference value of the length B.

[0178] In the test of the adhesive strength between the first multilayer capacitor and the second multilayer capacitor, a force of 15N was applied to the second multilayer capacitor at a rate of 1mm / min for 10 seconds in an electronic component mounted on a PCB. The case where the second multilayer capacitor was detached from the first multilayer capacitor was evaluated as detachment, and its separation rate was Figure 6 Shown in.

[0179] from Figure 6It can be seen that when the overlapping length B of the first and third tape portions is greater than or equal to 0.4 mm, the second multilayer capacitor does not detach from the first multilayer capacitor and remains in a stable bonded state. When the overlapping length B of the first and third tape portions is less than 0.3 mm, the detachment rate of the second multilayer capacitor increases rapidly.

[0180] In this embodiment, the electrical and physical connectivity between the first and second external electrodes of the first multilayer capacitor and the third and fourth external electrodes of the second multilayer capacitor may be degraded due to the size difference between the first and second multilayer capacitors. Consequently, the ESR of the electronic component may increase, and the chip detachment rate may also increase.

[0181] For example, since the bonding area between the conductive first strip portion and the conductive third strip portion decreases as the overlap length B decreases, the ESR increases.

[0182] When the relative ESR is 100% when the overlapping length B of the first and third tape portions completely overlap each other is 0.6 mm, the ESR increases to more than twice the reference value when the overlapping length B is less than or equal to 0.2 mm.

[0183] In addition, when the overlap length B is greater than or equal to 0.4 mm, the ESR is less than 1.5 times the reference value.

[0184] Therefore, if the level that results in undesirable ESR-related heat generation characteristics of the multilayer capacitor is set to a level where the ESR is greater than or equal to 1.5 times the baseline value, in order to ensure that the stability of the electronic component reaches a certain level or higher, the overlap length B may preferably be greater than or equal to 0.4 mm.

[0185] As described above, the durability of the multilayer capacitor against vibration and deformation can be improved, and a plurality of multilayer capacitors can be stacked to increase the capacitance of the electronic component. In addition, the electronic component can be used without increasing the mounting area when the electronic component is mounted on a board and without changing the design of the electrode pads of the board.

[0186] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. An electronic component comprising: a capacitor array in which a plurality of multilayer capacitors are stacked in a second direction perpendicular to a first direction, each of the plurality of multilayer capacitors including a capacitor body and a pair of external electrodes respectively provided at opposite ends of the capacitor body in the first direction, and wherein a length in the first direction of the multilayer capacitor provided at a lower end in the second direction is shorter than a length in the first direction of at least one multilayer capacitor provided thereover; and a pair of metal frames respectively provided to be connected to a pair of external electrodes of the multilayer capacitor provided on the lower end, and Parts of the pair of metal frames connected to the pair of external electrodes in the first direction overlap with the at least one multilayer capacitor in the second direction.

2. The electronic component according to claim 1, wherein The outer electrode comprises: a head portion provided on one surface of the capacitor body in the first direction; and A band portion extends from the head portion to a portion of the upper surface and a portion of the lower surface of the capacitor body.

3. The electronic component according to claim 2, wherein For the multilayer capacitors adjacent to each other in the second direction, a conductive bonding layer is provided between the tape portions facing each other.

4. The electronic component according to claim 2, wherein The metal frame comprises: a connecting portion connected to a head portion of an external electrode of the multilayer capacitor provided on the lower end; and The mounting portion extends from the lower end of the connecting portion along the first direction.

5. The electronic component according to claim 4, wherein The mounting portion is spaced apart from a lower end of the capacitor array.

6. The electronic assembly according to claim 4, further comprising: The conductive bonding layer is arranged between the connecting portion and the head.

7. The electronic component according to claim 2, wherein Parts of the tape portions of two adjacent multilayer capacitors that face each other overlap each other in the second direction.

8. The electronic component according to claim 7, wherein 2 / 3≤B / A, wherein A is the length of the band portion of the multilayer capacitor arranged on the lower end in the first direction, and B is the length of the portion of the band portions of the two adjacent multilayer capacitors overlapping each other in the second direction in the first direction.

9. The electronic component according to claim 7, wherein A length in the first direction of a portion of the tape portions of the two adjacent multilayer capacitors that overlap each other in the second direction is greater than or equal to 0.4 mm.

10. The electronic component according to claim 4, wherein The metal frame includes a coupling portion extending from an upper end of the connection portion along the first direction such that the metal frame is coupled to a strip portion of a multilayer capacitor disposed on an upper side in the capacitor array.

11. The electronic assembly according to claim 10, further comprising: A conductive bonding layer is provided between the bonding portion and the strip portion of the multilayer capacitor provided on the upper side in the capacitor array.

12. The electronic assembly according to claim 10, further comprising: A non-conductive bonding layer is provided between the plurality of capacitor bodies.

13. The electronic component according to claim 4, wherein The metal frame comprises: an extending portion extending from an upper end of the connecting portion along the first direction; and An auxiliary connection portion extends from the extension portion along the second direction to be coupled to a head portion of a multilayer capacitor disposed on an upper side in the capacitor array.

14. The electronic assembly according to claim 13, further comprising: A conductive bonding layer is provided between the auxiliary connection portion and the head portion of the multilayer capacitor provided on the upper side in the capacitor array.

15. The electronic component according to claim 13, wherein The auxiliary connection portion is formed to expose a portion of the head portion of the multilayer capacitor disposed on the upper side in the capacitor array.

16. An electronic assembly comprising: a first capacitor having a first capacitor body, a first external electrode disposed on a first surface of the first capacitor body, and a second external electrode disposed on a second surface of the first capacitor body opposite to the first surface in a length direction, the first capacitor having a first length in the length direction; a first metal frame and a second metal frame, the first metal frame being coupled to the first external electrode, the second metal frame being coupled to the second external electrode, the first metal frame and the second metal frame extending downward in a thickness direction; as well as a second capacitor disposed above the first capacitor in the thickness direction, the second capacitor having a second capacitor body, a third external electrode disposed on a first surface of the second capacitor body, and a fourth external electrode disposed on a second surface of the second capacitor body opposite to the first surface in the length direction, the second capacitor having a second length in the length direction, the second length being greater than the first length, and Parts of the first metal frame and the second metal frame extending downward along the thickness direction are respectively overlapped with the second capacitor in the thickness direction.

17. The electronic component according to claim 16, wherein The first external electrode and the second external electrode extend on a portion of a pair of surfaces of the first capacitor body that are opposed to each other in the thickness direction to form a first band portion and a second band portion, The third and fourth external electrodes extend on a portion of a pair of surfaces of the second capacitor body that are opposed to each other in the thickness direction to form a third band portion and a fourth band portion.

18. The electronic component according to claim 17, wherein The second capacitor is disposed above the first capacitor such that a portion of the first belt portion and a portion of the third belt portion overlap in the thickness direction, and a portion of the second belt portion and a portion of the fourth belt portion overlap in the thickness direction.

19. The electronic component according to claim 18, wherein 2 / 3≤B / A, where A is the length of the first belt portion or the second belt portion in the length direction, and B is the length of the overlapping portion of the first belt portion and the third belt portion or the overlapping portion of the second belt portion and the fourth belt portion in the length direction.

20. The electronic assembly according to claim 17, wherein A conductive bonding layer is provided between the first and third belt portions and between the second and fourth belt portions to form an electrical connection between the first and second capacitors.

21. The electronic assembly according to claim 16, wherein The second capacitor includes a plurality of multilayer capacitors stacked in the thickness direction.

22. A mounting board having an electronic component mounted thereon, comprising a board on which the electronic component according to any one of claims 1 to 21 is mounted.

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