Rotating heating stage and two-dimensional material transfer device

Abstract

The present application provides a rotating heating table and a two-dimensional material transfer device, which belong to the field of two-dimensional material preparation. The rotating heating table includes a mounting base, a rotating table and a heating table. A mounting cavity is provided in the mounting base, and a conductive slip ring is fixed in the mounting cavity; a mounting channel connected to the mounting cavity is provided through the top of the mounting base. The rotating table is fixed to the top of the mounting base; a rotating channel connected to the mounting channel is provided through the rotation center of the rotating table. The heating table is fixed to the rotating table surface of the rotating table; a negative pressure cavity is provided in the heating table; a heating component is provided on the top of the heating table, and a negative pressure channel is provided in the heating component; an air duct connected to the negative pressure cavity is provided at the bottom of the heating table, and the air duct is rotatably passed through the rotating channel and rotatably connected to the mounting channel; the wires of the heating component pass through the air duct and are electrically connected to the conductive slip ring. It can solve the problem that the rotation is constrained by the wiring harness and the vacuum tube and alleviate the damage to the wiring harness and the vacuum tube caused by the rotation of the heating table.

Description

Technical Field

[0001] The present application relates to the field of two-dimensional material preparation, and more specifically, to a rotary heating table and a two-dimensional material transfer device. Background Art

[0002] A heating stage is a commonly used component for preparing two-dimensional materials. It is equipped with an electric heating structure for heating the sample. Before heating the bottom, the sample needs to be fixed on the top of the electric heating structure. In some cases, vacuum adsorption is used to fix the sample. A small hole that can be connected to an exhaust structure is opened on the top of the electric heating structure. After the sample is placed on the top of the electric heating structure, the small hole is evacuated through the exhaust structure, and the sample can be fixed on the top of the electric heating structure through the negative pressure.

[0003] At present, when using a negative pressure adsorption heating table, on the one hand, it is constrained by the wiring harness and vacuum tube, and the rotation range is small. Tweezers or other tools are needed to manually move the sample to the appropriate angle, which increases the workload. When operating with the gloves facing inward, the sample may be accidentally damaged. On the other hand, the wiring harness and vacuum tube twist back and forth with the rotation of the heating table, which will reduce the service life of the heating table. Summary of the Invention

[0004] The purpose of this application is to provide a rotating heating table and a two-dimensional material transfer device, which can solve the problem that the rotation is constrained by the wire harness and the vacuum tube. The heating table can be rotated to any angle without the need to manually adjust the sample angle; it can alleviate the damage to the wire harness and the vacuum tube caused by the rotation of the heating table, and can increase the service life of the heating table.

[0005] The embodiment of the present application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a rotating heating table, comprising a mounting base, a rotating table, and a heating table. A mounting cavity is provided in the mounting base, in which a conductive slip ring is fixed; the mounting base is provided with a plug electrically connected to the conductive slip ring and a vacuum tube joint connected to the mounting cavity; a mounting channel connected to the mounting cavity is provided through the top of the mounting base. The rotating table is fixed to the top of the mounting base; a rotating channel connected to the mounting channel is provided through the rotation center of the rotating table. The heating table is fixed to the rotating table surface of the rotating table; a negative pressure cavity is provided in the heating table; a heating component is provided at the top of the heating table, and a negative pressure channel connected to the negative pressure cavity is provided in the heating component, and the negative pressure channel has a negative pressure adsorption hole opened on the top end face of the heating component; an air duct connected to the negative pressure cavity is provided at the bottom of the heating table, and the air duct is rotatably provided in the rotating channel and rotatably connected to the mounting channel; the wire of the heating component passes through the air duct and is electrically connected to the conductive slip ring.

[0007] In the above technical solution, an air duct is installed at the bottom of the heating table. The air duct connects between the negative pressure chamber and the mounting chamber, facilitating connection to a negative pressure device at the vacuum pipe joint of the mounting base for air extraction. The air duct is rotatably arranged through a rotating channel at the rotation center of the rotating table. When the rotating table drives the heating table to rotate, the air duct rotates around the rotation center of the rotating table. Therefore, the exhaust pipe of the rotating heating table does not restrict the rotation of the heating table, and the rotation of the heating table does not damage the exhaust pipe.

[0008] The wire is passed through the air duct and electrically connected to the conductive slip ring. The wire is then connected to the external circuit through a plug electrically connected to the conductive slip ring. When the heating table rotates, the wire slides around the conductive slip ring. The wire does not restrict the rotation of the heating table, and the rotation of the heating table will not damage the wire.

[0009] In some optional embodiments, the conductive slip ring is coaxially arranged with the mounting channel.

[0010] In the above technical solution, the conductive slip ring is coaxial with the installation channel. At this time, the conductive slip ring is coaxial with the air duct, so that the guide extending from the air duct can better cooperate with the conductive slip ring.

[0011] In some optional embodiments, the rotating table is provided with a rotation angle measurement component for measuring the rotation angle of the rotating table surface.

[0012] In the above technical solution, the rotation angle measurement component can measure the rotation angle of the rotating table. Compared with manual reading, it can obtain a more accurate rotation angle, which is convenient for preparing samples with high phase angle accuracy requirements.

[0013] In some optional embodiments, the turntable includes a turntable base and a turntable table top, the turntable base is fixed to the top of the mounting base, the turntable table top is rotatably connected to the turntable base, and the turntable table top is located on the top of the turntable table top; the rotation angle measurement assembly includes a code disk and a position sensor probe arranged opposite to each other; the code disk is fixed to one of the turntable base and the turntable table top, and the position sensor probe is fixed to the other of the turntable base and the turntable table top.

[0014] In this technical solution, a code disk and position sensor probe are respectively installed on the turntable base and the turntable surface. The relative position of the code disk and position sensor probe is used to determine the rotation angle. Compared with the installation of a single encoder, this can eliminate the influence of the return gap on the measurement results, and achieve higher measurement accuracy. The rotation angle measurement accuracy can even reach 0.01°, which is suitable for preparing samples such as magic-angle graphene, which have high phase angle requirements.

[0015] In some optional embodiments, the turntable table is rotatably arranged on the top of the turntable base; the code disk is fixed to the bottom of the turntable table, and the position sensor probe is located at the bottom of the code disk and fixed to the top of the turntable base.

[0016] In the above technical solution, the code disc and the position sensor probe are fixed to the bottom of the turntable table and the top of the turntable base respectively, which facilitates the fixation and relative arrangement of the code disc and the position sensor probe.

[0017] In some optional embodiments, the negative pressure adsorption holes are filled with porous thermally conductive materials.

[0018] In the above technical solution, porous thermal conductive material is filled in the negative pressure adsorption hole, which can provide better thermal conductivity inside the negative pressure adsorption hole while being able to evacuate air. This can reduce the temperature difference inside and outside the negative pressure adsorption hole, ensure more uniform heating of the sample, and facilitate more accurate temperature measurement and control.

[0019] In some optional embodiments, the negative pressure channel has at least one negative pressure exhaust section connected to the negative pressure chamber; the negative pressure exhaust section is opened on the side wall of the heating component and connected to the bottom of the negative pressure adsorption hole.

[0020] In the above technical solution, the negative pressure exhaust section is opened on the side wall of the heating component and connected to the bottom of the negative pressure adsorption hole, so that the negative pressure exhaust section is connected to the bottom side of the negative pressure adsorption hole, which can facilitate the filling and fixing of porous thermal conductive material in the negative pressure adsorption hole.

[0021] In some optional embodiments, the porous thermally conductive material is copper foam.

[0022] In the above technical solution, the foam copper has a high thermal conductivity and can more reliably reduce the temperature difference inside and outside the negative pressure adsorption hole.

[0023] In some optional embodiments, the inner wall of the heating platform is provided with a reflective layer, and the reflective layer is arranged around the negative pressure cavity.

[0024] In the above technical solution, a reflective layer is provided around the negative pressure cavity, which can reflect the heat radiated outward from the negative pressure cavity, thereby improving the heating efficiency.

[0025] In a second aspect, an embodiment of the present application provides a two-dimensional material transfer device, comprising a rotating heating platform and a glass slide adsorption seat as provided in the embodiment of the first aspect, wherein the glass slide adsorption seat and the heating platform are arranged side by side. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 A cross-sectional view of a rotary heating table provided in an embodiment of the present application;

[0028] Figure 2 A schematic structural diagram of a two-dimensional material transfer device provided in an embodiment of the present application;

[0029] Figure 3 A schematic structural diagram of a glass slide adsorption seat provided in an embodiment of the present application;

[0030] Figure 4 A schematic diagram of the structure of an equipment installation platform provided in an embodiment of the present application;

[0031] Figure 5 A schematic diagram of the partial structure of a two-dimensional material transfer device provided in an embodiment of the present application;

[0032] Figure 6 A schematic structural diagram of an electric focusing microscope provided in an embodiment of the present application;

[0033] Figure 7 A schematic diagram of the structure of a controller provided in an embodiment of the present application.

[0034] Icons: 10-2D material transfer device; 100-rotating heating table; 110-mounting base; 111-mounting cavity; 112-conductive slip ring; 113-plug; 114-vacuum tube connector; 115-mounting channel; 116-conductive slip ring base; 117-base sealing plate; 120-rotating table; 121-rotating table base; 122-rotating table top; 123-worm seat; 124-worm; 125-turbine Seat; 126-turbine; 127-rotating bearing; 128-rotation angle measurement assembly; 1281-code disk; 1282-position sensor probe; 130-heating table; 131-heat conductive block fixing seat; 132-insulating base; 133-negative pressure chamber; 134-heating assembly; 1341-heat conductive block; 1341a-thermal conductive silica gel; 1341b-negative pressure channel; 1341c-porous thermal conductive material; 1342-heating element ;1343-temperature probe;135-air guide tube;136-PCB terminal block;200-glass slide adsorption seat;210-glass slide adsorption base;220-glass slide sealing ring;230-glass slide baffle;240-baffle limiter;250-glass slide adsorption seat vacuum pipe connector;260-air release valve;300-equipment installation platform;310-honeycomb board;320-air floating support seat;400-translation stage;41 0-first displacement mechanism; 420-second displacement mechanism; 430-lifting mechanism; 440-pitching mechanism; 500-electric focusing microscope; 510-electric linear module; 520-coaxial light microscope; 600-controller; 610-axis selection knob; 620-speed control knob; 630-function switching button; 640-display screen; 650-function button; 660-electronic pulse generator; 670-LED light group. DETAILED DESCRIPTION

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0037] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0038] In the description of this application, it should be noted that the terms "center", "up", "down", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.

[0039] Furthermore, the terms “first”, “second”, etc. are merely used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0040] Furthermore, the terms “vertical”, “parallel” and the like do not imply that the components are required to be absolutely vertical or parallel, but rather may be slightly tilted.

[0041] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0042] Reference Figure 1 In a first aspect, an embodiment of the present application provides a rotating heating platform 100 , comprising a mounting base 110 , a rotating platform 120 , and a heating platform 130 .

[0043] An installation cavity 111 is provided in the installation base 110, and a conductive slip ring 112 is fixed in the installation cavity 111; the installation base 110 is provided with a plug 113 electrically connected to the conductive slip ring 112 and a vacuum tube joint 114 connected to the installation cavity 111; and an installation channel 115 connected to the installation cavity 111 is penetrated through the top of the installation base 110.

[0044] The mounting base 110 includes a housing structure that encloses a mounting cavity 111. As an example, the housing structure of the mounting base 110 includes a conductive ring base 116 and a base sealing plate 117. The conductive ring base 116 defines the mounting cavity 111, which has an opening located at the bottom end surface of the conductive ring base 116. The base sealing plate 117 is located at the bottom of the conductive ring base 116 and seals the opening of the mounting cavity 111. A mounting channel 115 extends through the top of the conductive ring base 116 and is illustratively arranged coaxially with the mounting cavity 111.

[0045] Optionally, an annular groove is formed on the bottom end surface of the conductive ring base 116 , and a sealing ring is provided in the annular groove. The sealing ring abuts against the upper end edge of the base sealing plate 117 .

[0046] Optionally, the plug 113 and the vacuum pipe joint 114 are both disposed on the conductive ring base 116, for example, at the bottom end of the side wall of the conductive ring base 116. The installation of the plug 113 and the vacuum pipe joint 114 can be sealed by epoxy resin glue.

[0047] Optionally, the mounting cavity 111 includes a first cavity and a second cavity that are interconnected. The first cavity is located on top of the second cavity, and the inner diameter of the first cavity is smaller than the inner diameter of the second cavity, so that the mounting cavity 111 has a stepped cavity. A conductive ring mounting hole is defined in the bottom wall of the second cavity at one end near the first cavity. The side wall of the conductive slip ring 112 is provided with a connecting ear, which is secured to the conductive ring mounting hole by a fastener.

[0048] The conductive slip ring 112 has 4 to 6 conductors in the embodiment. The conductors at the upper end of the slip ring can rotate around the central axis at an infinite angle; the conductors at the lower end of the slip ring are connected to the plug 113 to achieve electrical connection.

[0049] The rotating platform 120 is fixed to the top of the mounting base 110 ; a rotating channel communicating with the mounting channel is provided through the rotation center of the rotating platform 120 .

[0050] The turntable 120 includes a turntable base 121 and a turntable top 122. The turntable top 122 is rotatably connected to the turntable base 121, and the turntable 120 is located on top of the turntable top 122. As an example, the turntable base 121 is fixed to the top of the mounting base 110. Both the turntable top 122 and the turntable base 121 are configured as an annular structure, and the rotation channel sequentially passes through the turntable top 122 and the turntable base 121 of the turntable 120.

[0051] The driving mode of the rotating platform 120 is not limited, and it can optionally be in the form of a turbine 126 and a worm 124 transmission, and its driving mode can optionally be a stepping motor. As an example, the rotating platform 120 also includes a worm seat 123, a worm 124, a turbine seat 125, a turbine 126 and a rotating bearing 127. The worm seat 123 is connected to the rotating platform base 121, and is provided with bearings, couplings, motors and other accessories required for the worm 124. The worm 124 is rotatably mounted on the worm seat 123. The turbine seat 125 is located on the inner side of the worm seat 123, and its rotation axis is the rotation axis of the rotating platform 120. The turbine 126 is fixed to the bottom end face of the turbine seat 125 by bolts or the like, and the turbine 126 is connected to the worm 124 in a transmission manner. The rotating bearing 127 is exemplarily a cross roller bearing, and the inner ring of the rotating bearing 127 is clamped between the top of the turbine seat 125 and the turntable table 122, and the inner ring of the rotating bearing 127 is exemplarily locked between the top of the turbine seat 125 and the turntable table 122 by bolts, so that the turntable table 122 is not easy to shake, and its parallelism during movement is better; the outer ring of the rotating bearing 127 is clamped between the turntable table 122 and the turntable base 121, and the outer ring of the rotating bearing 127 is fixed to the turntable base 121 by epoxy resin glue.

[0052] The heating platform 130 is fixed to the rotating platform 120 surface of the rotating platform 120; a negative pressure chamber 133 is provided in the heating platform 130; a heating component 134 is provided on the top of the heating platform 130, and a negative pressure channel 1341b communicating with the negative pressure chamber 133 is provided in the heating component 134, and the negative pressure channel 1341b has a negative pressure adsorption hole opened on the top end surface of the heating component 134; an air duct 135 communicating with the negative pressure chamber 133 is provided at the bottom of the heating platform 130, and the air duct 135 is rotatably passed through the rotating channel and rotatably connected to the mounting channel 115; the wires of the heating component 134 pass through the air duct 135 and are electrically connected to the conductive slip ring 112.

[0053] The heating platform 130 has a shell structure that encloses a negative pressure chamber 133. As an example, the shell structure of the heating platform 130 includes a heat conductive block fixing seat 131 and a heat insulating base 132. The heat conductive block fixing seat 131 is disposed on top of the heat insulating base 132, and the heat conductive block fixing seat 131 and the heat insulating base 132 are detachably connected. The bottom of the heat conductive block fixing seat 131 has a first groove, and the top of the heat insulating base 132 has a second groove. When the heat conductive block fixing seat 131 and the heat insulating base 132 are connected, the first groove and the second groove are connected to form the negative pressure chamber 133.

[0054] The top of the heat conducting block holder 131 has a mounting hole connected to the negative pressure chamber 133 for mounting the heating assembly 134; this mounting hole can be circular and located at the top center of the heat conducting block holder 131. The bottom of the heat insulating base 132 has a thickness sufficient to withstand one atmosphere of pressure without significant deformation; the bottom of the heat insulating base 132 has an air conduction hole connected to the negative pressure chamber 133 for mounting the air conduction tube 135; this air conduction hole can be circular and located at the bottom center of the heat insulating base 132.

[0055] Optionally, a convex edge is provided on the outer side of the bottom of the heat conductive block fixing seat 131, and a plurality of threaded through holes are opened on the convex edge. The top of the heat insulating base 132 is provided with threaded holes corresponding to the threaded through holes. The heat conductive block fixing seat 131 and the heat insulating base 132 are threadedly connected by installing screws that are sequentially passed through the threaded through holes and the threaded holes.

[0056] Optionally, a terminal block mounting groove is recessed into the bottom end surface of the heat conducting block fixing base 131. The inner diameter of the terminal block mounting groove is larger than the inner diameter of the first groove, so that the terminal block mounting groove and the first groove are arranged in a stepped manner. Correspondingly, a PCB terminal block 136 is provided within the heating table 130. The PCB terminal block 136 is mounted within the terminal block mounting groove and is clamped by both the heat conducting block fixing base 131 and the heat insulating base 132. Furthermore, an annular groove is formed on the bottom end surface of the heat conducting block fixing base 131 and the top end surface of the heat insulating base 132. In the heat conducting block fixing base 131, the annular groove is formed at the bottom of the terminal block mounting groove, so that the sealing ring provided in the annular groove abuts against the top edge of the PCB terminal block 136. In the heat insulating base 132, the annular groove corresponds to the terminal block mounting groove, so that the sealing ring provided in the annular groove abuts against the bottom edge of the PCB terminal block 136.

[0057] PCB terminal block 136 is positioned between the first and second grooves and has at least one through-hole extending therethrough, connecting the first and second grooves. PCB terminal block 136 illustratively includes four to six groups of terminals, each interconnected. One end of each terminal is connected to a wire from heating assembly 134, while the other end is connected to the upper end of conductive slip ring 112 via a wire running through air duct 135.

[0058] The heating assembly 134 illustratively includes a heat conductive block 1341 , a heating element 1342 and a temperature probe 1343 .

[0059] The heat-conducting block 1341 is installed in the mounting hole at the top of the heat-conducting block fixing seat 131; a convex edge is provided on the outer side of its top so that the top of the heat-conducting block 1341 is similar to a mushroom shape; its side wall is recessed with at least one annular groove, and a sealing ring is provided in the annular groove to abut against the inner wall of the mounting hole; its bottom extends into the negative pressure chamber 133.

[0060] The negative pressure channel 1341b is provided in the heat conducting block 1341 and has an opening communicating with the negative pressure chamber 133, thereby connecting the negative pressure channel 1341b with the negative pressure chamber 133. The negative pressure adsorption hole of the negative pressure channel 1341b is provided on the top end surface of the heat conducting block 1341, thereby connecting the negative pressure channel 1341b with the outside. The heating element 1342 is located in the negative pressure chamber 133 and is connected to the heat conducting block 1341 for transferring heat to the heat conducting block 1341. As an example, the heating element 1342 is an annular ceramic heating plate that is bonded to the end surface of the heat conducting block 1341 at the bottom. The temperature probe 1343 is a screw-type thermal resistor or thermocouple. The bottom of the heat conducting block 1341 is provided with a threaded hole that matches the temperature probe 1343. The temperature probe 1343 passes through the annular ceramic heating plate and is connected to the threaded hole to achieve the installation of the temperature probe 1343 and fix the annular ceramic heating plate.

[0061] The air duct 135 is illustratively a pipe with a flange at the top. A flange mounting groove for accommodating the flange is defined at the bottom of the thermally insulating base 132. The air duct 135 is secured within the flange mounting groove via the flange. Optionally, an annular groove is defined in the bottom wall of the flange mounting groove, within which a sealing ring is mounted to abut against the bottom of the flange.

[0062] The air duct 135 illustratively has at least one annular groove on its bottom outer wall. If multiple annular grooves are provided, they are arranged axially side by side. A sealing ring is positioned within each annular groove to seal the bottom of the air duct 135 with the mounting channel 115. Optionally, the contact surface between the sealing ring and the mounting channel 115 is coated with vacuum grease.

[0063] The rotating heating table 100 provided in this application has the following working principle: the sample is placed above the negative pressure adsorption hole of the heating component 134. Since the negative pressure channel 1341b, the negative pressure chamber 133, the air guide tube 135 and the mounting chamber 111 are connected in sequence, the air is directly pumped out at the vacuum tube joint 114 of the mounting base 110, so that the sample can be fixed above the negative pressure adsorption hole of the heating component 134 under the action of negative pressure. The rotating table 120 is started to rotate, and the heating table 130 rotates along the rotating table 120 surface of the rotating table 120. At this time, the air guide tube 135 rotates around the rotation center of the rotating table 120, and the wire slides around the conductive slip ring 112.

[0064] The rotary heating table 100 provided in this application has an air duct 135 disposed at the bottom of the heating table 130. The air duct 135 connects between the negative pressure chamber 133 and the mounting chamber 111, facilitating connection of a negative pressure device at the vacuum pipe joint 114 of the mounting base 110 for air extraction. The air duct 135 is rotatably disposed through a rotating channel at the rotation center of the rotating table 120. When the rotating table 120 drives the heating table 130 to rotate, the air duct 135 rotates around the rotation center of the rotating table 120. Therefore, the overall air extraction pipeline of the rotary heating table 100 does not restrict the rotation of the heating table 130, and the rotation of the heating table 130 does not damage the air extraction pipeline.

[0065] The wire is passed through the air duct 135 and electrically connected to the conductive slip ring 112. The wire is then connected to an external circuit through a plug 113 electrically connected to the conductive slip ring 112. As the heating platform 130 rotates, the wire slides around the conductive slip ring 112. The wire does not restrict the rotation of the heating platform 130, nor does the rotation of the heating platform 130 damage the wire.

[0066] With respect to the mounting base 110 , in some exemplary embodiments, the conductive slip ring 112 is coaxially disposed with the mounting channel 115 .

[0067] In this design, the conductive slip ring 112 is coaxial with the mounting channel 115. In this case, the conductive slip ring 112 is coaxial with the air duct 135, allowing the guide extending from the air duct 135 to better cooperate with the conductive slip ring 112. Of course, in other embodiments, the central axes of the conductive slip ring 112 and the mounting channel 115 may be at a certain angle, or may be parallel to each other but at a certain distance.

[0068] Regarding the rotating stage 120 , in some exemplary embodiments, the rotating stage 120 is provided with a rotation angle measurement component 128 for measuring the rotation angle of the surface of the rotating stage 120 .

[0069] The rotation angle measurement assembly 128 can be installed in any position and can be connected to either or both of the turntable base 121 and the turntable surface 122. Furthermore, the rotation angle measurement assembly 128 can be installed in any form and can be a single rotation angle sensor or multiple and / or a variety of sensors.

[0070] In this design, the rotation angle measurement component 128 can measure the rotation angle of the rotating table 120 surface. Compared with manual readings, it can obtain a more accurate rotation angle, which is convenient for preparing samples with high phase angle accuracy requirements.

[0071] As an example, the rotation angle measurement component 128 includes a code disk 1281 and a position sensor probe 1282 that are arranged opposite to each other; the code disk 1281 is fixed to one of the turntable base 121 and the turntable table top 122, and the position sensor probe 1282 is fixed to the other of the turntable base 121 and the turntable table top 122.

[0072] In this design, a code disk 1281 and a position sensor probe 1282 are respectively provided on the turntable base 121 and the turntable table surface 122. The rotation angle is determined by the relative positions of the code disk 1281 and the position sensor probe 1282. Compared with setting up a single encoder, the influence of the return gap on the measurement result can be eliminated, and the measurement accuracy is higher.

[0073] Position sensor probe 1282 is, for example, a grating sensor with a resolution of 0.004°. Code disk 1281 and position sensor probe 1282 can optionally use the Posic-TPCD07-180 product, which can measure rotation angles with an accuracy of even 0.01°, making it suitable for preparing magic-angle graphene samples, which have high phase angle requirements.

[0074] Furthermore, the turntable table 122 is rotatably arranged on the top of the turntable base 121; the code disk 1281 is fixed to the bottom of the turntable table 122, and the position sensor probe 1282 is located at the bottom of the code disk 1281 and fixed to the top of the turntable base 121.

[0075] In this design, the code disk 1281 and the position sensor probe 1282 are fixed to the bottom of the turntable table 122 and the top of the turntable base 121 respectively, which facilitates the fixation and relative arrangement of the code disk 1281 and the position sensor probe 1282.

[0076] Regarding the heating stage 130 , in some exemplary embodiments, the negative pressure adsorption holes are filled with a porous thermally conductive material 1341 c .

[0077] The porous thermally conductive material 1341c is made of a thermally conductive material, such as, but not limited to, copper, aluminum, or silicon carbide ceramic. The porous thermally conductive material 1341c is porous and has numerous air-permeable micropores. The porous thermally conductive material 1341c may be in the form of a sheet, block, or rod, and may have numerous air-permeable micropores. The cross-sectional shape and size are illustratively consistent with the negative pressure adsorption holes.

[0078] In this design, porous thermal conductive material 1341c is filled in the negative pressure adsorption hole, which enables the vacuum to be evacuated while having a better thermal conductivity in the negative pressure adsorption hole, thereby reducing the temperature difference inside and outside the negative pressure adsorption hole, ensuring more uniform heating of the sample, and facilitating more accurate temperature measurement and control.

[0079] As an example, the porous thermally conductive material 1341c is foam copper.

[0080] Foam copper is made of sintered copper powder and has a porous structure with a large number of breathable micropores inside.

[0081] In this design, foam copper has a high thermal conductivity and can more reliably reduce the temperature difference inside and outside the negative pressure adsorption hole.

[0082] Furthermore, the negative pressure channel 1341b has at least one negative pressure exhaust section connected to the negative pressure chamber 133; the negative pressure exhaust section is opened on the side wall of the heating component 134 and connected to the bottom of the negative pressure adsorption hole.

[0083] As an example, the negative pressure adsorption holes extend axially along the heat conductive block 1341. The negative pressure exhaust section is provided on the side wall of the heat conductive block 1341, and each negative pressure exhaust section extends radially along the heat conductive block 1341. When there are multiple negative pressure channels 1341b, the multiple negative pressure channels 1341b are distributed circumferentially around the heat conductive block 1341.

[0084] It should be noted that in other embodiments of the present application, the negative pressure adsorption hole and the negative pressure exhaust section may also be coaxially arranged. The extension path of the negative pressure adsorption hole and the negative pressure exhaust section is not limited to a straight line, and may also be a curve or a multi-segment line; wherein, when the extension path is a straight line, the extension path of the negative pressure adsorption hole may form a certain angle other than 0° with the axial direction of the heat conductive block 1341, and the extension path of the negative pressure exhaust section may also form a certain angle other than 0° with the radial direction of the heat conductive block 1341.

[0085] In this design, the negative pressure exhaust section is opened on the side wall of the heating component 134 and connected to the bottom of the negative pressure adsorption hole, so that the negative pressure exhaust section is connected to the bottom side of the negative pressure adsorption hole, which can facilitate the filling and fixing of the porous thermal conductive material 1341c in the negative pressure adsorption hole.

[0086] To further improve heating uniformity and temperature measurement accuracy, an annular groove is further formed on the top end surface of heat conductive block 1341, surrounding the negative pressure adsorption hole. The annular groove is filled with thermally conductive silicone 1341a, the top of which is flush with the top end surface of heat conductive block 1341.

[0087] Considering that the heat in the negative pressure chamber 133 will radiate outward during the operation of the heating platform 130, the time it takes for the heating platform 130 to reach the budgeted temperature will be prolonged under limited power. If the power of the heating platform 130 is increased, the temperature of the heating platform 130 will overshoot seriously.

[0088] Optionally, the shell structure of the heating platform 130 is made of a material with low thermal conductivity, good heat resistance and easy processing and molding; in an exemplary embodiment, the heat conductive block fixing seat 131 and the heat insulating base 132 are both made of a material with low thermal conductivity, good heat resistance and easy processing and molding, such as PEEK or polytetrafluoroethylene.

[0089] Furthermore, a reflective layer is provided on the inner wall of the heating platform 130 , and the reflective layer is arranged around the negative pressure cavity 133 .

[0090] In the embodiment where the housing structure of the heating platform 130 includes a heat conducting block fixing seat 131 and a heat insulating base 132 , as an example, the inner walls of the heat conducting block fixing seat 131 and the heat insulating base 132 are both provided with a reflective layer.

[0091] In this design, a reflective layer is provided around the negative pressure cavity 133 to reflect the heat radiated outward from the negative pressure cavity 133, which is beneficial to improving the heating efficiency.

[0092] Reference Figure 2 In the second aspect, an embodiment of the present application provides a two-dimensional material transfer device 10, comprising a rotating heating table 100 and a glass slide adsorption seat 200 as provided in the embodiment of the first aspect, and the glass slide adsorption seat 200 is arranged side by side with the heating table 130.

[0093] Reference Figure 3 As an example, the slide adsorption seat 200 includes a slide adsorption base 210, a slide sealing ring 220, a slide baffle 230, a baffle limiter 240, a slide adsorption seat vacuum pipe joint 250 and an air release valve 260.

[0094] The slide adsorption base 210 has a notch at the front end, a square groove within the notch, and an annular groove around the outer edge of the notch. The notch accommodates a standard slide, while the annular groove accommodates a slide seal ring 220. The diameter of the slide seal ring 220 is approximately 0.1 mm greater than the depth of the annular groove. Installed within the annular groove, it seals the surface between the slide and the slide adsorption base 210.

[0095] The rear end of the slide adsorption base 210 has a through hole connected to the square groove at the front end, and the rear end of the through hole can be installed with an air release valve 260. The side of the slide adsorption base 210 has a hole connected to the square groove at the front end, and the hole on the side can be installed with a slide adsorption base vacuum pipe connector 250.

[0096] The slide block 230 includes a sliding plate and a baffle. The baffle protrudes from the top of the slide, forming a stepped structure between the front end of the baffle and the slide. A baffle stopper 240 is fixed to the slide adsorption base 210, for example, using bolts. The baffle stopper 240 has a groove on its upper and lower surfaces, each perpendicular to each other. The groove on the lower surface and the slide adsorption base 210 form a sliding channel. The depth of the sliding channel is slightly greater than the thickness of the slide and the width is slightly greater than the width of the slide. The slide of the slide block 230 is slidably accommodated within the sliding channel, allowing the front end of the slide to move toward and away from the square groove at the front end of the slide adsorption base 210. A grease lubricant is applied to the contact surface between the slide of the slide block 230 and the slide adsorption base 210. This grease lubricant reduces wear on both surfaces and provides a certain degree of adhesion, preventing the slide of the slide block 230 from shaking during sliding. The baffle of the slide block 230 extends from the groove on the upper surface of the baffle limiting frame 240, and the groove on the upper surface of the baffle limiting frame 240 stops the baffle of the slide block 230 to limit the sliding stroke of the slide in the sliding channel.

[0097] After placing the slide, slide stopper 230 is pushed forward so that the front end of the slide is positioned above the slide. After the vacuum pump is turned off and the vent valve 260 is opened, the slide, without the compressive force of atmospheric pressure, is easily dislodged. However, the slide stopper 230 prevents the slide from falling due to its blocking action. Optionally, a rubber sheet is attached to the front end of the slide, facing the slide, to further prevent it from slipping.

[0098] It should be noted that, in the present application, the two-dimensional material transfer device 10 may also be provided with other structures as needed.

[0099] Reference Figure 2 and Figure 4 As an example, the two-dimensional material transfer device 10 further includes a device mounting platform 300 , and the mounting base 110 and the glass slide adsorption seat 200 are both connected to the device mounting platform 300 .

[0100] Optionally, the equipment installation platform 300 is an air-floating vibration isolation platform, which includes a honeycomb panel 310 and an air-floating support base 320 supported on the bottom of the honeycomb panel 310 .

[0101] Reference Figure 2 and Figure 5 As an example, the two-dimensional material transfer device 10 further includes a displacement stage 400 , which optionally includes one or more of a first displacement mechanism 410 , a second displacement mechanism 420 , a lifting mechanism 430 and a pitch mechanism 440 .

[0102] The first displacement mechanism 410 is connected between the device mounting platform 300 and the mounting base 110 and is used to drive the mounting base 110 to move relative to the device mounting platform 300 in a first direction. The second displacement mechanism 420 is connected between the device mounting platform 300 and the mounting base 110 and is used to drive the mounting base 110 to move relative to the device mounting platform 300 in a second direction. The slide adsorption base 200 and the heating stage 130 are arranged side by side along the first direction, which is perpendicular to the second direction.

[0103] Optionally, the first displacement mechanism 410 and the second displacement mechanism 420 are both driven by a stepping motor actuator, the actuator lead screw is 0.25 mm, and the stroke is ±12.5 mm.

[0104] A lifting mechanism 430 and / or a pitching mechanism 440 are connected between the equipment mounting platform 300 and the glass slide adsorption seat 200;

[0105] The lifting mechanism 430 is connected between the equipment mounting platform 300 and the slide adsorption base 210 of the slide adsorption seat 200, and is used to drive the slide adsorption seat 200 to rise and fall relative to the equipment mounting platform 300; the pitching mechanism 440 is connected between the equipment mounting platform 300 and the slide adsorption base 210 of the slide adsorption seat 200, and is used to drive the slide table of the slide adsorption seat 200 to pitch relative to the equipment mounting platform 300.

[0106] Optionally, the lifting mechanism 430 is driven by a stepper motor actuator, the actuator lead is 0.25mm, and the travel is ±5mm. The pitch mechanism 440 is a pitch table, driven by a stepper motor actuator, the actuator lead is 0.25mm, and the travel is ±6°.

[0107] Reference Figure 2 and Figure 6 As an example, the two-dimensional material transfer device 10 further includes a motorized focusing microscope 500, which includes a motorized linear module 510 and a coaxial light microscope 520 with a CCD. The motorized linear module 510 is mounted on the device mounting platform 300, and the coaxial light microscope 520 with a CCD is mounted on a slider of the motorized linear module 510. The coaxial light microscope with a CCD can optionally be equipped with 5x, 10x, 20x, and 50x telephoto objective lenses.

[0108] Reference Figure 2 and Figure 7 As an example, the two-dimensional material transfer device 10 also includes a controller 600, which includes an axis selection knob 610, a speed adjustment knob 620, a function switching button 630, a display screen 640, a function button 650, an electronic pulse generator 660 and an LED light group 670.

[0109] The number of stepper motors in the two-dimensional material transfer device 10 is n, and the axis selection knob 610 can optionally have n+1 gears, corresponding to selecting n stepper motors and being suspended.

[0110] The speed knob 620 has multiple gears, and each gear corresponds to a speed.

[0111] The function switch button 630 can switch the function of the function button 650 and can also clear the rotation angle of the rotating table 120. Short pressing the function switch button 630 can clear the displayed angle, and long pressing the function switch button 630 can switch the function of the function button 650.

[0112] Display screen 640 can display the working status of function button 650, the temperature of heating platform 130, and the rotation angle of rotating platform 120. The function of function button 650 is determined by function switch button 630, which can be switched to control the forward and reverse rotation of stepper motor and control the heating platform 130 to increase or decrease the temperature.

[0113] The electronic pulse generator 660 can rotate forward and reverse to control the forward and reverse rotation of the selected stepper motor, and the angle ratio between the two is controlled by the speed control knob 620.

[0114] There is a text label below the LED light group 670. The n LED lights above the axis selection knob 610 correspond to n stepper motors respectively. When the LED lights up, it means the corresponding stepper motor is selected. The corresponding LED lights above the speed control knob 620 correspond to the speed status of the stepper motor.

[0115] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A rotary heating table, characterized in that: include: A mounting base, wherein a mounting cavity is defined within the mounting base, and a conductive slip ring is fixed within the mounting cavity; the mounting base is provided with a plug electrically connected to the conductive slip ring and a vacuum tube joint communicating with the mounting cavity; a mounting channel communicating with the mounting cavity is defined through the top of the mounting base; the mounting cavity includes a first cavity and a second cavity communicating with each other, the first cavity being located at the top of the second cavity, the inner diameter of the first cavity being smaller than the inner diameter of the second cavity, so that the mounting cavity has a stepped shape; A rotating platform is fixed to the top of the mounting base; a rotating channel connected to the mounting channel is provided through the rotation center of the rotating platform; as well as A heating platform, the heating platform is fixed to the rotating table surface of the rotating platform; a negative pressure chamber is provided in the heating platform; a heating component is provided on the top of the heating platform, a negative pressure channel is provided in the heating component and is connected to the negative pressure chamber, and the negative pressure channel has a negative pressure adsorption hole opened on the top end surface of the heating component; an air duct is provided at the bottom of the heating platform and is connected to the negative pressure chamber, the air duct is rotatably passed through the rotating channel and is rotatably connected to the mounting channel; the wire of the heating component passes through the air duct and is electrically connected to the conductive slip ring.

2. The rotary heating table according to claim 1, characterized in that The conductive slip ring is coaxially arranged with the installation channel.

3. The rotary heating table according to claim 1, characterized in that The rotating table is provided with a rotation angle measuring component for measuring the rotation angle of the rotating table surface.

4. The rotary heating table according to claim 3, characterized in that The rotating table includes a rotating table base and a rotating table top, wherein the rotating table base is fixed to the top of the mounting base, and the rotating table top is rotatably connected to the rotating table base, and the rotating table top is located on the top of the rotating table top; The rotation angle measurement assembly includes a code disk and a position sensor probe arranged opposite to each other; the code disk is fixed to one of the turntable base and the turntable table, and the position sensor probe is fixed to the other of the turntable base and the turntable table.

5. The rotary heating table according to claim 4, characterized in that The rotating table top is rotatably arranged on the top of the rotating table base; The code disc is fixed to the bottom of the rotating table surface, and the position sensor probe is located at the bottom of the code disc and fixed to the top of the rotating table base.

6. The rotary heating table according to claim 1, characterized in that The negative pressure adsorption holes are filled with porous heat-conducting material.

7. The rotary heating table according to claim 6, characterized in that The negative pressure channel has at least one negative pressure exhaust section connected to the negative pressure chamber; the negative pressure exhaust section is opened on the side wall of the heating component and connected to the bottom of the negative pressure adsorption hole.

8. The rotary heating table according to claim 6, characterized in that The porous heat-conducting material is foam copper.

9. The rotary heating stage according to any one of claims 1 to 8, wherein: The inner wall of the heating platform is provided with a reflective layer, and the reflective layer is arranged around the negative pressure cavity.

10. A two-dimensional material transfer device, characterized in that: include: The rotary heating table according to any one of claims 1 to 9; as well as A glass slide adsorption seat is arranged side by side with the heating platform.

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