Electronic detector

Abstract

An electron detector includes: a sensor module (1), the sensor module including a sensor (11) for detecting electrons; and an electronic module (2), the electronic module including a circuit (21, 22) for processing a signal received from the sensor module (1). A wiring (4) is provided for electrically connecting the sensor module (1) to the electronic module (2). An adapter (3) is provided between the sensor module (1) and the electronic module (2). The adapter (3) includes a channel (321) for the wiring (4) and a shielding element (35) for shielding radiation.

Description

Technical Field

[0001] The present invention provides an electronic detector. Background Art

[0002] Advances in electron optics and automation are among the key factors that have enabled transmission electron microscopy (TEM) to achieve near-atomic and subatomic resolution in structural biology and materials science, respectively. However, the most demanding applications always push the technology further. While electron sources are brighter and electromagnetic lenses more stable, aberration-corrected detectors still have room for improvement.

[0003] Hybrid pixel sensors are known for photon detection. However, hybrid pixel sensors can also be used for electron counting, see “Electronic detectors for electron microscopy”, AR Faruqi and R. Henderson, Quarterly Review Biophysics, August 2011, 44(3): 357-90. Summary of the Invention

[0004] A general object of the present invention is to provide a detector suitable for use in an electron microscope.

[0005] The electron detector according to the present invention includes a sensor module including a sensor for detecting electrons and an electronics module including circuitry for processing signals received from the sensor module. Wiring electrically connects the sensor module to the electronics module. An adapter is positioned between the sensor module and the electronics module. The adapter includes a channel for the wiring and a shielding element for shielding against radiation.

[0006] By using the proposed adapter, it is possible to construct a detector that can use many components used in non-electronic detector applications (e.g., in photon detection). The present electronic detector setup allows multiple components of different detectors that detect or count photons to be reused or manufactured as multi-purpose components for various classes or types of detectors.

[0007] The sensor for detecting electrons is preferably a sensor suitable for use in electron microscopy applications, and preferably suitable for use in transmission electron microscopy (TEM) applications or scanning TEM applications. Thus, in one embodiment, the electron detector may be arranged in combination with the electron source, electron optics and vacuum system.

[0008] In one embodiment, the sensor for detecting electrons is a semiconductor-based sensor that relies on semiconductor materials such as silicon or high atomic number (high-Z) materials such as CdTe, GaAs, diamond, Ge or CdZnTe to measure the impact of incident electrons. In such semiconductor-based sensors, the semiconductor detection material is typically arranged between two electrodes. Incident electrons can be sensed directly without converting charge carriers generally released by impacting electrons into photons. In a preferred embodiment of a semiconductor electronic sensor, the sensor is a hybrid pixel sensor comprising a sensor and a readout chip, wherein the electrodes of the sensor are patterned to match the pixel array of the readout electronics connected via a contact array (e.g., bump bonding). Different technologies can be used for semiconductor sensors and readout chips, allowing for individual optimization. The sensor can be used for diffraction as well as imaging modes.

[0009] Considering that semiconductor-based sensors (e.g., hybrid pixel sensors) can also be used for different applications, such as radiation detection, particularly X-ray detection, it is desirable to create such sensors that, once developed, can be multi-purpose sensors that can also be used as electronic detectors for electronic sensing. For both radiation sensing and electronic sensing, the detectors include not only sensors but also further electronics, mechanics, and the like. It is desirable to enable these components, once developed, to be multi-purpose or redesigned, with minimal modification or adjustment, particularly with respect to the design and mechanical function of the components.

[0010] Given that electrons scatter minimally in a vacuum, sensing in electron microscopy requires a vacuum for the sensors to be placed in. Furthermore, it is desirable for the electronics module to be located outside the vacuum in order to improve vacuum conditions by preventing outgassing from the electronics module from contaminating the vacuum.

[0011] On the other hand, the electron beam as primary radiation may generate secondary radiation, such as X-rays or low-energy electrons, which it is desirable to prevent from irradiating the user and / or striking the electronic module. It is desirable to meet the safety requirements of the European Atomic Energy Community.

[0012] Therefore, the electronic detection specific elements are preferably embodied in the adapter and / or can be assembled to the adapter. Of course, other components such as electronic modules may include different functions in electronic sensing compared to photon sensing. However, such different functions may be embodied in different logic or software or electrical components on the printed circuit board, which does not necessarily require a change in the design of the component. In particular, the footprint and / or size (e.g. the footprint and / or size of the electronic module and / or other electronic devices), the optional housing, and / or other mechanical components of the detector can remain the same as for other types of detectors. Therefore, various detectors for detecting different parameters (e.g. radiation and electrons) can be manufactured in a modular manner, which includes multi-purpose components that can be applied to different detectors.

[0013] The adapter is not only arranged between the sensor module and the electronic module, but preferably also mechanically connects the sensor module and the electronic module. Therefore, the adapter supports the sensor module. To this end, the adapter preferably includes a support portion, while the sensor module preferably includes a support portion for the actual sensor, so that the support portion of the adapter and the support portion of the sensor module are mechanically connected, for example by means of gluing, threading or other means. The same can also be done for the electronic module and the adapter. The adapter can support the electronic module. For this purpose, the adapter can include a mechanical interface, such as a nose piece that is connected to the platform of the electronic module by means of gluing, threading or other means of connection. Preferably, the electronic module includes an electrical circuit, preferably arranged on a printed circuit board, the circuit including but not limited to an integrated circuit (IC), a capacitor or a resistor. In one example, the platform has the shape of a frame, and the two printed circuit boards supporting the circuit are mounted on different sides of the platform. In different embodiments, the platform supporting the circuit can be formed integrally with the adapter.

[0014] The electronic module may preferably take the form of a plate having a main extension in a horizontal plane and a relatively low thickness.In one example, the sensor module may show a main extension in a vertical plane, ie orthogonal to the extension of the electronic module.

[0015] The combination of the electronics module, adapter, and sensor module is also referred to as a unit. This unit can be preassembled from the individual sensor modules, electronics modules, and adapters, and can be introduced into the housing or chassis of the electronic detector, for example, by sliding. To this end, the electronics module, and in particular its platform, can include guides that mate with rails or other guides on the inner surface of the housing.

[0016] Wiring is provided for electrically connecting the sensor module to the electronics module. Preferably, the wiring is supported by a flexible carrier, such as a flexible printed circuit board (FPC). In one embodiment, the FPC may additionally support additional components such as an integrated circuit (IC). In various embodiments, the wiring is embodied as one of a ribbon cable, a flexible flat cable, a flat connector, or similar connectors.

[0017] The adapter shows: a first mechanical interface for mechanical connection to the electronic module, for example in the form of a nose; and a second mechanical interface for connection to the sensor module. However, considering that the body of the adapter extends between the electronic module and the sensor module, the wiring needs to overcome a specific path when connecting the sensor module to the electronic module. Moreover, the wiring needs to overcome a sealing part of the adapter, which will be described in more detail later. To this end, the adapter has one or more channels for wiring for the wiring from the sensor module to the electronic module. In a first embodiment, such a channel can be represented as a through hole in the body of the adapter, and in particular a through hole in the sealing part. In a different embodiment, the channel can be a recess in the body of the adapter, which is open in one direction.

[0018] In one embodiment of the present invention, the adapter includes a beam portion positioned between the sealing portion and the support portion. The cross-section of the beam portion preferably exhibits a smaller cross-section than that of the sealing portion, and the wiring or its carrier can be placed on the surface of the beam portion, for example by gluing. Given that the sealing portion in this case extends higher than the beam portion, it is preferred that one or more channels are arranged in the sealing portion such that the bottom of the channel is coplanar with, for example, the top surface of the beam portion and / or with one or more printed circuit boards of the electronic module. In such an embodiment, the wiring and its carrier(s) can pass through the channel without excessive bending. In one embodiment, an offset of up to + / - 0.5 mm between the bottom of the channel and the top of the beam portion and / or the top of the circuit is acceptable. The wiring can be soldered to the electronic module's circuitry or connected to it via a connector, and can also be soldered to the upstream sensor circuitry or connected to it via a connector.

[0019] The sealing portion of the adapter preferably has a main plane extension that is orthogonal to the main extension of the electronic module. This is because the sealing portion is preferably responsible, together with other components (e.g., a sealing plate described below), for sealing one or more openings of the housing through which the one or more units are inserted and extend into the housing. Therefore, the sealing portion of the adapter preferably includes a mechanical interface that faces the housing when mounted to / installed in the housing. This interface preferably includes a recess for an O-ring seal or for any other sealing means, and / or the interface preferably includes means for mounting the sealing portion to a flange and / or a sealing plate of the housing.

[0020] Considering that the sensor module is configured to detect electrons, the sensor module preferably operates under vacuum conditions. Therefore, the sensor module area (i.e., the space surrounding the sensor module) is preferably under vacuum, at least when operating the detector. To provide a space that can be evacuated, components of the detector (such as the flange described later) and components outside the detector (such as the electron source of an electron microscope) can help encapsulate this space, which is also referred to as the sensor module area. In contrast, the interior of the detector housing does not need to operate under vacuum. For this reason, the vacuum in the sensor module area will be sealed from the electronics module, that is, isolated from the interior of the detector housing, which is also referred to as the electronics module area. Therefore, the opening in the housing is preferably vacuum-tight relative to the sensor module area. In one embodiment, the vacuum seal can include a separate sealing plate to be mounted to the housing (e.g., mounted to a housing flange surrounding the opening in the housing). This sealing plate is preferably made of an airtight material and is sealingly mounted to the housing. Preferably, the sealing plate has an opening for each unit for introducing the corresponding unit into the housing of the detector. The sealing portion of the adapter then seals the opening in the sealing plate. To this end, the adapter seals the opening, for example by means of a sealing ring attached to an interface of the sealing portion of the adapter.Thus, the sealing portion of the adapter, preferably in combination with the sealing plate, separates the sensor module area from the electronics module area.

[0021] Preferably, the or each channel in the adapter is sealed with a sealing compound, preferably an epoxy resin. However, the sealing compound may be applied before the unit is installed in the housing, but after the wiring has been installed. The sealing compound is airtight, so that no gas can enter the sensor module area from the non-vacuumed electronics module area.

[0022] The adapter preferably comprises a shielding element for supporting the shielding. Preferably, secondary radiation, in particular X-rays present in the sensor module area should remain confined to said sensor area so as not to expose the user and to ensure the user's safety. On the other hand, it may also be beneficial to shield the electronics module from the radiation present in the sensor module area. "Supporting the shielding" may mean that additional means (such as a shielding plate to be described later) may be combined with the adapter to provide shielding. "Shielding" may include not only a comprehensive barrier against the radiation in question, but also a reduction of the emitted radiation to an permitted, certified level. In the sensor module area, X-ray radiation may occur during the measurement in response to the bremsstrahlung generated by the electrons.

[0023] Considering that the adapter can be made of a material designed to absorb primary or secondary radiation, a certain path length is required in this material, which will result in an adapter with extended dimensions. For this purpose, a shielding element is introduced into the body of the adapter, the shielding device reducing the range of the primary or secondary radiation entering from the sensor module area. The shielding element is preferably highly absorbent for the primary or secondary radiation and is preferably made of one of tungsten, lead, tantalum, molybdenum. In different embodiments, these materials can be included in the shielding element together with other materials. In one example, a shielding element can be used. It is a tungsten, copper-zinc alloy. For reasons of effort and cost, the entire body or shielding portion of the adapter is not envisioned to be made of primary or secondary radiation-absorbing material, but rather only a separate shielding element disposed within the sealing portion. While the shielding element can generally take any shape, it is preferably a prefabricated insert that is inserted into a hole drilled in the body. Preferably, the insert exhibits a straight longitudinal extension and preferably has a circular cross-section.

[0024] In order to reduce the path for primary or secondary radiation in the adapter body and at the same time keep the width of the sealing portion of the adapter small, the inserts are preferably arranged at different positions along the width of the sealing portion. Preferably, the width of the sealing portion is less than 3 cm.

[0025] To further reduce the formation of regular structures that could lead to radiation leakage paths and thereby enhance the absorption of primary or secondary radiation by the main body material, the rods preferably have two or more different diameters: for example, a first diameter and a second diameter, where the first diameter exceeds the second diameter. This allows the rods to be arranged close together, particularly at different width locations of the sealing plate, thereby improving shielding. Furthermore, the thickness of the sealing portion of the adapter can be minimized. Preferably, the rods are arranged within the sealing portion so as to prevent line of sight through the sealing portion. Preferably, the rods support the absorption of primary or secondary radiation.

[0026] Considering that the sealing part of the adapter is penetrated by one or more channels, at least one and preferably a plurality of inserts extend into the channels and preferably bridge the channels. This is preferred because outside the body of the sealing part (i.e. in the one or more channels), primary or secondary radiation needs to be shielded as it is inside the body. In such an embodiment, the wiring can pass through the channel between two or more of the inserts, or between an insert and a wall defining the channel. In this arrangement of the wiring, its carrier is preferably flexible. Preferably, when the rod is made to meander in the channel, the carrier is S-shaped. The rod exposed in the channel can prevent the sealing compound from escaping.

[0027] Thus, the adapter, and in particular its sealing portion, not only contributes to the vacuum seal but also supports the absorption of primary or secondary radiation generated during electron interaction in the vacuum sensor module region. Absorption of primary or secondary radiation can also be achieved by incorporating one or more shielding plates arranged in the sensor module region. For example, a shielding plate can be arranged in the sensor module region between the adapter's sealing portion and its supporting portion. The shielding plate thus includes an opening for the adapter to pass through, preferably one opening per adapter, and in particular, an opening for the beam portion of each adapter to pass through.

[0028] In an embodiment, a flange is integrated into the sealing plate, said flange being used to attach the detector to other components, for example an electron source can be attached to said flange, which together define the vacuum sensor module area. A shield can be inserted into the sealing plate to support the shielding in combination with the sealing portion of the adapter and the shield plate. The shield and the shield plate (if any) are preferably strongly absorbent of the primary or secondary radiation and are preferably made of one of tungsten, lead, tantalum, molybdenum. In different embodiments, these materials can be included in the shielding element together with other materials, for example using

[0029] In another embodiment, shielding elements such as rods may also include boron-containing alloys to shield against neutron radiation in additional applications.

[0030] The third function of the adapter is preferably cooling. Heat generated in the sensor module or in the sensor module area, or in the electronics module or in the electronics module area, can be transferred via the adapter to the housing of the electronic detector or to the platform of the electronics module. To this end, the adapter is preferably made of or includes a thermally conductive material, such as metal. Furthermore, the platform of the electronics module is preferably made of or includes a thermally conductive material (e.g., metal) and serves as a support for the sensor module.

[0031] The number of units per detector is not limited to one. Instead, any other number of units may be arranged in a common housing. The housing preferably includes a separate opening for each unit in a common surface of the housing. In a preferred embodiment, the shape of the sensor module, and possibly also the adapter, is shaped so that another sensor module and adapter can be arranged on each side thereof, in order to build a larger sensor array from a single unit. To this end, preferably, the sealing plates of the sensor module and at least the adapter have a rectangular cross-section so that they abut when arranged adjacent to each other to facilitate a larger sensor array.

[0032] After the units are mounted to the housing, all electronic modules are arranged inside the housing, while all sensor modules are located outside and preferably arranged in a shared sensor module area. In the case of providing a single sealing plate for all units, the sealing plate preferably includes an opening for each adapter. In this way, a single unit can be easily inserted into a designated opening and mounted to the sealing plate. The assembly including the units mounted to the sealing plate can then be mounted to the housing of the detector. Similarly, in the case of one or more shielding plates, each shielding plate is preferably a single shielding plate that shields all electronic modules, and each shielding plate preferably includes an opening for each adapter.

[0033] According to another aspect of the present invention, an adapter is provided with a first mechanical interface for connecting to a sensor module including a sensor for detecting electrons; and a second mechanical interface for connecting to an electronics module including circuitry for processing signals received from the sensor module. A shielding element is configured to shield an area defined by the second mechanical interface from radiation incident from an area defined by the first mechanical interface. A passageway is provided and configured to allow wiring used to electrically connect the sensor module to the electronics module to pass through the adapter.

[0034] All of the above-described embodiments of the electronic detector will also be disclosed in conjunction with the bare adapter claimed in this aspect of the invention.

[0035] According to another aspect of the invention, the detector comprising shielding and sealing means between the sensor module area and the electronics module area and comprising an adapter located between the sensor module and the electronics module may also be used in one of the following projects:

[0036] X-ray inspection;

[0037] Gamma radiation shielding;

[0038] Neutron detection;

[0039] Neutron secondary radiation protection;

[0040] Proton detection, alpha particle detection.

[0041] According to the aforementioned aspect of the invention, a sensor sensitive to the type of radiation to be detected is used in the corresponding sensor module instead of the electronic sensor used in the electronic detector, and the shielding material is replaced by a material that absorbs the corresponding primary or secondary radiation. All other components can remain as described in conjunction with the electronic detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The present invention will be better understood and objects other than those mentioned above will become apparent when considering the following detailed description of the invention. This description makes reference to the accompanying drawings, in which:

[0043] Figure 1 is a perspective side view of an electronic detector according to an embodiment of the present invention,

[0044] Figure 2 yes Figure 1 Exploded view of the electronic detector,

[0045] Figure 3 is a first perspective view of a unit cell of an electron detector according to an embodiment of the present invention,

[0046] Figure 4 yes Figure 3 A second perspective view of the unit,

[0047] Figure 5 yes Figure 3 A third perspective view of the unit,

[0048] Figure 6 yes Figure 3 A perspective cutaway view of a unit,

[0049] Figure 7 is an exploded perspective view of an electronic detector according to an embodiment of the present invention,

[0050] Figure 8 is an exploded perspective view of an electronic detector according to an embodiment of the present invention,

[0051] Figure 9 is an exploded perspective view of an electronic detector according to an embodiment of the present invention,

[0052] Figure 10 yes Figure 1 or Figure 8 A side perspective view of the electronic detector,

[0053] Figure 11 is a perspective cross-sectional view of an electron detector according to an embodiment of the present invention. DETAILED DESCRIPTION

[0054] Figure 1A perspective side view of an electronic detector according to an embodiment of the present invention is shown. The electronic detector comprises a housing 6 and one or more connectors 10 for powering the detector and / or for data transmission. One of the front ends of the housing 6 is covered by a vacuum sealing plate 5. A shielding plate 9 is attached to the sealing plate 5.

[0055] The two units are largely arranged inside the housing 6. Each unit consists of Figure 1 , and passes through an opening 91 in the shielding plate 9 and an opening (not visible) in the sealing plate 5. Next to the sensor module 1, each unit includes an adapter 3 that mechanically and electrically connects the sensor module 1 to an electronic module (not visible) arranged inside the housing 6.

[0056] The sensor module 1 is configured to detect electrons. Therefore, the detector is an electron detector, such as used in electron microscopy applications. Considering that electrons approaching the sensor module 1 may generate secondary radiation, it is desirable to prevent such radiation from escaping from the sensor module area SMD, thereby preventing the user of the detector from being exposed to radiation, and preferably shielding the electronic module in the housing 6 from such radiation. The shielding plate 9 is arranged and configured to facilitate this shielding function. The shielding plate 9 is arranged in the sensor module area SMD. In contrast, the area inside the housing 6 is also referred to as the electronic module area EMD. With regard to materials, it is preferred that the shielding plate 9 comprises or consists of an X-ray and electron shielding material (e.g., tungsten).

[0057] In addition, in order for the sensor module 1 to work properly, the sensor module is preferably arranged in a vacuum. Figure 1 The electronic detector shown can be connected to the electron source, for example, by means of a flange in a sealing plate 5. The resulting enclosed space is evacuated so that the sensor module area SMD is under vacuum, at least during operation of the electronic detector. On the other hand, the interior of the housing 6 of the electronic detector does not need to be evacuated, but typically operates under atmospheric conditions. To this end, the electronic detector includes a vacuum seal for separating the vacuum sensor module area SMD from the non-vacuum electronics module area EMD. The sealing plate 5 facilitates this vacuum seal and serves as a vacuum barrier. The sealing plate 5 is preferably mounted to the housing 6. The unit is preferably mounted to the sealing plate 5.

[0058] Figure 2 Shown in exploded view Figure 1electronic detector. The sealing plate 5 is pulled out of the housing 6, which enables the two units U1 and U2 inserted into the housing 6 to be seen. For illustrative purposes, the lower unit U1 is pulled out of the housing 6 to a lesser extent than the upper unit U2. Each unit U1, U2 includes a sensor module 1 and an electronic module 2. The adapter 3 mechanically and electrically connects the sensor module 1 to the corresponding electronic module 2. Each unit U1, U2 is inserted into a dedicated opening 51 in the sealing plate and mounted on the sealing plate 5. The assembly including the modules U1 and U2 and the sealing plate 5 is then mounted to the flange 61 of the housing 6.

[0059] Figure 3 A unit of an electron detector according to an embodiment of the invention is shown in a first perspective view. Such a unit may be, for example Figure 2 One of the units U1 or U2 shown.

[0060] The unit comprises a sensor module 1 connected to an electronic module 2 via an adapter 3. The electronic module 2 currently comprises a platform 23, for example in the form of a frame, which currently supports two printed circuit boards 21 and 22. Considering that the printed circuit boards 21 and 22 each carry electrical and / or electronic devices, collectively referred to as circuits, the reference numerals 21 and 22 are also used to generally indicate the circuits of the electronic module 2. The rear end of the electronic module 2 carries sockets and / or other electrical connectors 24, for example for connection to further circuits or wiring in the housing of the electronic detector and / or for receiving power (for example via connector / connectors 10, see Figure 1 ).

[0061] The platform 23 of the electronic module 2 is attached to the adapter 3, for example, to the nose 31 of the adapter 3, and is thus mechanically connected, for example, by welding, screwing, or gluing. The adapter 3 also includes a sealing portion 32 similar to a box, and a beam portion 33 extending from the sealing portion 32. At the end of the beam portion 33, a support portion 34 is provided in the form of a plate for attaching the sealing portion 32. The sensor module 1 includes a support 12 attached to the support portion 34 of the adapter 3, and a sensor 11 attached to the support 12.

[0062] Thus, in this embodiment, the unit comprises an electronics module 2 extending primarily in a horizontal plane x, y, and a sensor module 1 extending primarily in a plane orthogonal to said horizontal plane x, y (i.e., in a vertical plane y, z). However, the sensor module 1 can be oriented in a different plane if desired. With respect to the adapter 3, it is preferred that the sealing portion 32 of the adapter 3 covers the opening in the housing 6 or the opening of a sealing plate to be introduced. Therefore, the cross-section of the sealing portion 32 preferably matches or exceeds the opening in the housing 6 or the opening in the sealing plate. Furthermore, the cross-section of the sealing portion 32 preferably exceeds the cross-section of the beam portion 33.

[0063] The adapter 3, in particular its sealing portion 32, comprises channels 321, and currently comprises four channels 321, Figure 2 Three of the four channels are visible in FIG. Channel 321 is provided for connection 4, which electrically connects sensor module 1 to electronics module 2. Connection 4 is currently embodied on a flexible carrier, such as a flexible printed circuit board, with or without components arranged thereon. In various embodiments, connection 4 is implemented as a ribbon cable or similar connection.

[0064] from Figure 3 As can be seen, each of the channels 321 is constructed as a cutout in the sealing portion 32, with the bottom of each cutout lying in the same plane as the top of the beam portion 33 and the top of the circuits 21, 22. In various embodiments, the step between the bottom of the channel 321 and the top of the corresponding alignment feature is at most + / - 0.5 mm. This facilitates the feeding of the wires 4 and their respective carriers, as well as the electrical contact with the circuits 21, 22, to the same level. In this example, the wire carriers are sealed and retained in the channels 321, for example, by a sealing compound such as epoxy. The sealing compound is configured to prevent the passage of gases, particularly air, through the channels 321. Preferably, the dimension of the width of the sealing portion 32 in the x-direction is determined by the x-direction width of the rod arrangement (see below) required for effective primary or secondary shielding and by the x-direction extension of the sealing compound required for effective sealing.

[0065] At the end of sensor module 1, Figure 3 It follows that the wiring 4 is fed through further channels in the support portion 34 of the adapter 3 and connected to the sensor 11 or to other electronics residing in the sensor module 1 .

[0066] The sealing portion 32 comprises a shielding element in the form of a rod-shaped insert 35. Figure 3 In the perspective view, only its diameter is visible. Figure 3 It can be seen that there are different types of rods used: a first number 351 of rods having a first diameter; and a second number 352 of rods having a second diameter, the second diameter being smaller than the first diameter. The rods are currently arranged only in the y direction and all the rods are arranged parallel to each other. The rods are arranged in the y direction from Figure 3 The sidewalls shown in FIG extend to Figure 3 The rods extend through the entire body of the sealing portion 32 without seeing the opposite side walls. The rods are arranged in different planes in the x-direction.

[0067] The rods are arranged and configured to prevent or reduce the effects of primary or secondary radiation on the electronics module 2. In particular, in electron microscopy applications, electrons may generate x-ray bremsstrahlung or low-energy electrons that could potentially damage the electronics module 2. The rods are made of a material that absorbs primary or secondary radiation. Combined with appropriate design of the width of the sealing portion 32, the rods are arranged so that primary or secondary radiation incident from the sensor module region SMD is absorbed and / or scattered, thereby reducing the range of the radiation.

[0068] Therefore, in Figure 3 In the illustrated unit, the adapter 3, and in particular its sealing portion 32, separates the sensor module area SMD from the electronics module area EMD, which operate under different conditions. When operating the electronic detector, the sensor module area SMD is assumed to be a vacuum region, while the electronics module area EMD is assumed to operate under non-vacuum conditions. Therefore, on the one hand, the sealing portion 32 of the adapter 3 facilitates vacuum sealing, i.e., the material of the body of the adapter 3 is preferably airtight. One or more channels 321 arranged in the sealing portion 32 are preferably sealed by a seal, which can be applied, for example, in liquid or viscous form and can be hardened. Thus, the adapter 3, and in particular its sealing portion 32, not only shields the interior of the housing 6, and in particular the electronics module 2, from primary or secondary radiation, but also hermetically separates the vacuum sensor module area SMD from the electronics module area EMD.

[0069] Given the potential heat generation within sensor module 1, it is preferred that adapter 3 also perform a third function, namely, heat dissipation, in addition to primary or secondary radiation shielding and vacuum sealing. To this end, the body of adapter 3 is preferably made of a thermally conductive material, such as metal, and is preferably formed into platform 23 of electronic module 2 and preferably into support portion 34 of sensor module 1. Given that all of these components are mechanically and thermally connected, heat can be transferred from sensor module 1 to platform 23 of electronic module 2 via adapter 3 and dissipated there, acting as a heat sink, or can be further directed, for example, to a heat sink within housing 6.

[0070] Preferably, the platform 23 of the electronic module 2 includes a guide 231. The guide 231 can cooperate with a guide rail on the inner surface of the housing 6, so that Figure 3 The unit shown in FIG can be slid into the housing.

[0071] The face of the sealing portion 32 of the adapter 3 facing the electronic module 2 comprises an interface 322. Preferably, and as will be explained later, the adapter 3 is attached to the sealing plate by means of this interface 322. The interface 322 currently comprises a recess for receiving, for example, an O-ring as a seal.

[0072] Figure 4and Figure 5 Shown in different perspectives Figure 3 unit.

[0073] Figure 6 Shown in perspective cutaway view Figure 3 This view particularly shows the arrangement of the insert 35 in the adapter 3, in particular in the sealing portion 32 of the adapter 3. As can be seen from this sectional view, the insert 35 also extends into the one or more channels 321 and in particular bridges the one or more channels 321. Thus, in the one or more channels 321, the insert 35 passes through in the y-direction, while the connection 4 passes through the channel 321 in the x-direction and passes between two or more rods, as shown in FIG. Figure 6 For this reason, the flexible carrier for the wiring 4 can also be bent to pass between the rods or between the rods and the wall defining the channel 321 .

[0074] Figure 7 A perspective exploded view of an electronic detector according to an embodiment of the present invention is shown. The detector is similar to Figure 2 The detector is shown from a different angle. Units U1 and U2 extend through openings 51 in sealing plate 5. In this embodiment, sealing plate 5 and adapter 3, and in particular the sealing portion of the adapter including the rod, help create a vacuum seal. Sensor module 1, on the other hand, remains exposed to sealing plate 5 for sensing purposes.

[0075] Figure 8 A perspective view of an electronic detector according to an embodiment of the present invention is shown. Figure 7 The detector differs from the in that a shielding plate 9 is additionally provided, preferably inserted into the sealing plate 5. Shielding plate 9 is preferably made of a material that shields X-ray radiation, such as tungsten. Only half of shielding plate 9 is shown, with the second half omitted for illustrative purposes. Shielding plate 9 has an opening 91 through which units U1 and U2 enter the housing 6.

[0076] Figure 9 An electron detector according to an embodiment of the present invention is shown in an exploded perspective view. Figure 9 The electronic detector of this embodiment differs from other embodiments in that, in addition to shielding plate 9, a shield 7 is provided to shield primary or secondary radiation. Shield 7 and shielding plate 9 are arranged in the sensor module area, that is, behind or in front of sealing portion 32 of adapter 3, where the viewing angle is affected. Shield 7 is inserted into sealing plate 5. Shielding plate 9 is mounted on sealing plate 5. An opening 91 in shielding plate 9 provides exposure to sensor module 1.

[0077] In this embodiment, the housing 6 also includes a flange 61 at its front end for mounting the sealing plate 5. Currently, the flange 61 of the housing 6 includes two openings, one for each unit U1 and U2. During the pre-assembly step, the shielding element is inserted into the sealing plate 5, and then the units U1 and U2 are mounted onto the sealing plate 5. This assembly, including the sealing plate 5, is then mounted onto the flange 61 of the housing 6. Finally, the shielding plate 9 is mounted onto the sealing plate 5.

[0078] Figure 10 Shown in perspective side view Figure 1 or Figure 8 electronic detector.

[0079] Figure 11 The electronic detector according to an embodiment of the present invention is shown in a perspective cutaway view and an exploded view. The detector comprises only one unit. The sealing plate 5 is mounted to the flange 61 of the housing 6. Furthermore, the sealing plate 5 shows a collar 52 surrounding the sensor module 1. One or more shielding plates may be mounted in the sensor module area, however, Figure 11 None of these shielding plates are shown in FIG.

[0080] While there are shown and described presently preferred embodiments of the invention, it is to be distinctly understood that the invention is not limited thereto but may be otherwise variously embodied and practiced within the scope of the following claims.

[0081] In particular, for each embodiment, the number of cells included in the corresponding detector can vary. Thus, each embodiment should be considered to disclose any number of cells for installation in a common housing. However, for all embodiments, the preferred number of cells is 1, 2, 8, 18, or 32.

Claims

1. An electronic detector, comprising: A sensor module (1) comprising a sensor (11) for detecting electrons, an electronic module (2) comprising circuits (21, 22) for processing signals received from said sensor module (1), wiring (4) for electrically connecting the sensor module (1) to the electronic module (2), An adapter (3) is arranged between the sensor module (1) and the electronic module (2), the adapter (3) comprising: -main body; - a channel (321) for the wiring (4); - an insert (35) in the body serving as a shielding element, the insert being used to support shielding of the electronic module (2) from primary or secondary radiation, wherein the insert (35) comprises a material that absorbs X-rays and electrons.

2. The electron detector according to claim 1, wherein the insert (35) consists of a material that absorbs X-rays and electrons.

3. The electron detector according to claim 1 or 2, The material is tungsten.

4. The electron detector according to claim 3, wherein at least one of the inserts (35) extends into the channel (321).

5. The electron detector according to claim 4, wherein at least one of said inserts (35) bridges said channel (321), The channel (321) is embodied in the form of one or more passages in the adapter (3).

6. The electron detector according to claim 5, wherein the wiring (4) passes through the channel (321) between two or more of the inserts (35), or passes through the channel (321) between one or more of the inserts (35) and a wall of the body defining the channel (321), The wiring (4) is supported by a flexible carrier.

7. The electron detector according to claim 3, wherein at least a portion of the insert (35) is formed as a longitudinal rod, wherein the rods are aligned parallel to each other, The rods include a first number (351) of rods having a first diameter.

8. The electron detector of claim 7, wherein the rods include a second number (352) of rods having other diameters smaller than the first diameter.

9. The electron detector according to claim 7 or 8, The rods are arranged in a plurality of planes parallel to each other in the main body.

10. The electron detector according to claim 1, comprising: a vacuum seal for sealingly separating the area of the sensor module (SMD) from the area of the electronic module (EMD), wherein the adapter (3) is configured to facilitate a vacuum seal, The channel (321) of the adapter (3) is sealed by a sealing compound.

11. The electron detector according to claim 10, wherein the sealing compound is an epoxy resin, Wherein the sealing compound is arranged in the channel (321).

12. The electron detector according to claim 10, The vacuum seal comprises a sealing plate (5) comprising an opening (51) covered by the adapter (3).

13. The electron detector according to claim 12, wherein the sealing plate (5) comprises a mechanical interface for mounting the adapter (3), The mechanical interface comprises a sealing ring between the adapter (3) and the sealing plate (5).

14. The electron detector according to claim 12, comprising: a housing (6) defining a non-vacuum region, wherein the electronic module (2) is arranged in the housing (6), wherein the vacuum seal is attached to the housing (6).

15. The electron detector according to claim 3, comprising: a vacuum seal for sealingly separating the area of the sensor module (SMD) from the area of the electronic module (EMD), wherein the adapter (3) is configured to facilitate a vacuum seal, wherein the vacuum seal comprises a sealing plate (5) comprising an opening (51) covered by the adapter (3), wherein the adapter (3) comprises a sealing portion (32) covering the opening (51) in the sealing plate (5), wherein the insert (35) is arranged in the sealing portion (32) of the adapter (3) in a plane parallel to the plane of the opening (51) in the sealing plate (5), The channel (321) of the adapter (3) is sealed by a sealing compound.

16. The electron detector according to claim 15, wherein the insert (35) passes through the entire sealing portion (32) in the corresponding plane, wherein the cross section of the sealing portion (32) is at least as large as the opening (51) in the sealing plate (5) and exceeds the cross section of an adjacent beam portion (33) of the adapter (3) that mechanically supports the sensor module (1), The bottom edge of the channel (321) is arranged to be coplanar with the top horizontal surface of the beam portion (33).

17. The electron detector according to claim 14, comprising: a shielding plate (9) which helps shield radiation originating from the area of the sensor module (SMD), The shielding plate (9) comprises an opening (91) for the adapter (3) to pass through.

18. The electron detector according to claim 17, wherein the shielding plate (9) comprises a material that absorbs X-rays and electrons, The shielding plate (9) is arranged in the region of the sensor module (SMD).

19. The electron detector according to claim 3, wherein the adapter (3) mechanically connects the sensor module (1) and the electronic module (2), wherein the adapter (3) supports the sensor module (1), wherein the electronic module (2) comprises a platform (23) supporting the circuit (21, 22), wherein said platform (23) is connected to said adapter (3), The face of the sensor (11) is arranged in a plane orthogonal to the longitudinal extension of the platform (23).

20. The electron detector according to claim 19, wherein the body of the adapter (3) comprises a heat-conducting material, wherein the platform (23) comprises a thermally conductive material, wherein the platform (23) is thermally connected to the body of the adapter (3) to act as a heat sink for heat transferred from the sensor module via the adapter (3) to the platform (23), The sensor module (1) comprises a heat-conducting support (12) for the sensor (11), The support (12) is thermally connected to the adapter (3).

21. The electron detector according to claim 17, comprising: A plurality of sensor modules (1) according to claim 1, a corresponding number of electronic modules (2) according to claim 1, wiring (4) / electrical conductors for electrically connecting each sensor module (1) to the corresponding electronic module (2), a corresponding number of adapters (3) according to claim 1, each adapter (3) being arranged between one of the sensor modules (1) and the corresponding electronic module (2), wherein the electronic module (2) is arranged in the housing (6), wherein the sealing plate (5) comprises an opening (51) for each adapter (3), The shielding plate (9) comprises an opening (91) for each adapter (3).

22. The electron detector according to claim 7 or 8, All inserts (35) are designed as longitudinal bars.

23. The electron detector according to claim 14, wherein the sealing plate (5) is attached to the housing (6).

24. The electron detector according to claim 18, The shielding plate (9) is made of a material that absorbs X-rays and electrons.

25. The electron detector according to claim 18 or 24, The material is tungsten.

26. An adapter, comprising: main body, a first mechanical interface for connecting to a sensor module (1), said sensor module comprising a sensor (11) for detecting electrons, a second mechanical interface for connecting to an electronic module (2), said electronic module comprising circuits (21, 22) for processing signals received from said sensor module (1), an insert (35) in the body serving as a shielding element, the insert being configured to shield radiation originating from an area defined by the first mechanical interface, a channel (321) configured to allow wiring (4) for electrically connecting the sensor module (1) to the electronic module (2) to pass through the adapter (3), The insert (35) comprises a material that absorbs X-rays and electrons.

27. The adapter according to claim 26, wherein the insert (35) consists of a material that absorbs X-rays and electrons.

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