Capacitor and method for manufacturing the same, and method for mounting the capacitor

Abstract

The present invention greatly reduces the situation where the capacitor is poorly mounted on the circuit board during the reflow soldering process. The capacitor accommodates the capacitor element in a bottomed cylindrical outer shell and seals the open end of the outer shell through a sealing member, and the capacitor body formed by passing the lead terminal led out of the capacitor element through the sealing member is accommodated in a pedestal, and the pedestal has: a bottom portion, which has a through hole for the lead terminal to pass through; and a side wall, which is formed to surround the outer periphery of the capacitor body, and the capacitor has a convex portion protruding from the inner side of the side wall toward the capacitor body, wherein the convex portion is arranged in a chiseled portion formed by chiseling the side of the outer shell, and a gap portion is provided between the chiseled portion and the convex portion.

Description

Technical Field

[0001] The present invention relates to a capacitor mounted on a wiring board such as a circuit board, for example, a chip-type electrolytic capacitor having a pedestal arranged on the side of a sealing member that seals a metal outer case of the capacitor, a method for manufacturing the same, and a method for mounting the capacitor. Background Art

[0002] For example, there is a chip-type electrolytic capacitor as a type of capacitor constituting an electrical storage device, which constitutes a control circuit in an electric power conversion device. The chip-type electrolytic capacitor is constructed as follows: a capacitor element is housed together with a driving electrolyte in a bottomed cylindrical outer casing made of metal, the capacitor element is constructed by sandwiching a separator between an anode foil and a cathode foil connected to an anode lead and a cathode lead respectively and winding them, an insulating pedestal with a through hole is assembled in a structure formed by sealing the open end of the outer casing with a sealing member and sealing the outer casing, a pair of lead terminals derived from the capacitor body are passed through the through hole and bent along the lower surface of the pedestal, thereby being able to cope with surface mounting. In addition, there is also a method in which a pair of lead terminals derived from the through hole of the insulating plate are passed through a through hole provided on the circuit substrate in a non-bending manner and are soldered by a reflow process.

[0003] The following documents are known as documents related to a chip-type electrolytic capacitor having a pedestal having insulating properties as described above.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2001-102237 Summary of the invention

[0007] Problems to be solved by the invention

[0008] As mentioned above, the chip-type electrolytic capacitor has a driving electrolyte inside. When the driving electrolyte is exposed to the high temperature caused by the reflow soldering process, the solvent of the driving electrolyte vaporizes, thereby increasing the internal pressure of the electrolytic capacitor. In addition, as the internal pressure increases, the sealing member expands toward the insulating plate side. Therefore, when the insulating plate and the capacitor are separated and the welding is not properly completed, when the circuit substrate is connected, there are problems such as a decrease in connection strength and the electrolytic capacitor falling off from the substrate during actual use.

[0009] In view of the above problems, an object of the present invention is to provide a capacitor capable of significantly reducing the occurrence of poor mounting on a circuit board during a reflow process in view of the above problems.

[0010] Means used to solve problems

[0011] The capacitor of the present invention seals the open end of a bottomed cylindrical outer shell that accommodates a capacitor element by a sealing member, and houses a capacitor body formed by passing a lead terminal led out from the capacitor element through the sealing member on a pedestal, the pedestal having: a bottom portion having a through hole for passing the lead terminal; and a side wall formed to surround the outer circumference of the capacitor body, the capacitor having a convex portion protruding from the inner side surface of the side wall toward the capacitor body, and is characterized in that the convex portion is arranged on a chiseled portion formed by chiseling the side surface of the outer shell, and a gap portion is provided between the chiseled portion and the convex portion.

[0012] The capacitor of the present invention seals the open end of a bottomed cylindrical outer shell that accommodates a capacitor element by a sealing member, and accommodates a capacitor body formed by passing a lead terminal led out from the capacitor element through the sealing member on a pedestal, the pedestal having: a bottom portion having a through hole for passing the lead terminal; and a side wall formed to surround the outer circumference of the capacitor body, the capacitor having a convex portion protruding from the inner side surface of the side wall toward the capacitor body, and is characterized in that the manufacturing method of the capacitor includes the following steps: in a chiseled portion formed by chiseling the side surface of the outer shell, the convex portion is arranged in a manner such that a gap portion is provided between the chiseled portion and the convex portion.

[0013] The capacitor of the present invention is characterized in that the method for mounting the capacitor includes the steps of inserting a lead terminal of the capacitor into a through hole filled with solder paste provided in a circuit substrate; and connecting the lead terminal and the circuit substrate by reflow soldering.

[0014] Effects of the Invention

[0015] According to the present invention, any of the following effects can be obtained.

[0016] (1) Even if the capacitor is exposed to a high temperature state due to a reflow process and the sealing member expands, it is possible to prevent the capacitor body from being separated from the base.

[0017] (2) It is possible to suppress the occurrence of capacitor mounting defects during the reflow process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1A FIG. 1 is a diagram showing an example of a capacitor according to the present invention.

[0019] Figure 1B FIG. 1 is a diagram showing an example of a capacitor according to the present invention.

[0020] Figure 2 FIG. 1 is a diagram showing an example of a capacitor stand according to the present invention.

[0021] Figure 3 FIG. 1 is a diagram showing an example of a capacitor stand according to the present invention.

[0022] Figure 4 FIG. 1 is a diagram showing an example of a capacitor according to the present invention.

[0023] Figure 5A FIG. 1 is a diagram showing a cross section of a capacitor before a reflow process according to the present invention.

[0024] Figure 5B FIG. 1 is a diagram showing a cross section of a capacitor before a reflow process according to the present invention.

[0025] Fig. 6A FIG. 1 is a diagram showing a cross section of a capacitor during a reflow process of the capacitor according to the present invention.

[0026] Figure 6B FIG. 1 is a diagram showing a cross section of a capacitor during a reflow process of the capacitor according to the present invention.

[0027] Figure 7 FIG. 1 is a diagram showing a cross section of a capacitor after a reflow process according to the present invention.

[0028] Figure 8 FIG. 1 is a diagram showing an example of a capacitor stand according to another embodiment of the present invention. DETAILED DESCRIPTION

[0029] The capacitor of this embodiment has Figure 1A , Figure 1B The appearance shape shown is mainly composed of the following components: a capacitor body 4, which has a lead terminal 22 extending through a sealing member 26, and the sealing member 26 seals the opening side of an aluminum outer casing that accommodates the capacitor element inside; and a base 6, which is arranged on the sealing member 26 side of the capacitor body 4 where the lead terminal 22 is extended.

[0030] like Figure 1A , Figure 1BAs shown, the capacitor body 4 used in this embodiment accommodates the capacitor element inside the bottomed cylindrical aluminum outer casing, and after the sealing member 26 is inserted into the open end, the outer peripheral side surface in the outer casing and the open end are sealed to form a sealing portion 12, thereby sealing the capacitor body 4. The lead terminal 22 led out from the capacitor element is provided in a manner that the sealing member 26 is penetrated, and the end of the lead terminal 22 led out to the outside of the sealing member 26 is penetrated through the through hole (omitted from the figure) formed in the base 6. The sealing member 26 is formed with a hardness that exhibits flexibility and elasticity, for example, ethylene propylene rubber, butyl rubber, silicone rubber, etc. are used.

[0031] Among capacitor elements, there are types in which a separator is sandwiched between an anode foil and a cathode foil formed of a valve metal such as aluminum and wound and impregnated with an electrolyte, a type in which a conductive polymer such as polyethylenedioxythiophene is used as an electrolyte, and a hybrid type in which a capacitor element impregnated with a conductive polymer is impregnated with an electrolyte.

[0032] like Figure 1A , Figure 1B As shown, the pedestal 6 disposed on the side of the sealing member 26 of the capacitor body 4 is made of a resin having electrical insulation of a predetermined thickness, and is formed with a bottom portion 20 against which the sealing member 26 of the capacitor body 4 abuts, and a side wall 8 extending upward in a manner surrounding the outer peripheral side of the capacitor body 4. The pedestal 6 is substantially square in plan view, and a notch 10 is formed at a group of adjacent corners. In this way, the shape of the pedestal 6 in plan view is formed into a substantially square shape, which is preferred because the mounting area of ​​the obtained capacitor mounted on the substrate can be reduced, but the present invention is not limited thereto, and it can also be formed into a polygonal shape in plan view or a circular shape in plan view, as long as the shape of these pedestals 6 is appropriately selected. In addition, when the notch 10 is formed in the side wall 8 of the pedestal 6, it is preferred because the polarity of the lead terminal 22 can be easily determined by visual inspection when the capacitor is mounted on the substrate, but these notches 10 may not be provided.

[0033] In addition, in this embodiment, a discontinuity portion 14 is formed to interrupt the side wall 8 of the base 6. Since the external air efficiently flows from the discontinuity portion 14 into the gap between the inner surface of the side wall 8 and the outer peripheral side of the capacitor body 4, the reduction in the heat dissipation effect caused by the side wall 8 can be greatly suppressed. Therefore, it is preferred, but the present invention is not limited to this, and the discontinuity portion may not be specially formed.

[0034] like Figure 2 , Figure 3 As shown, a convex portion 16 is provided on the inner side surface of a side wall 8 of a pedestal 6 formed so as to surround the side surface of the capacitor case. The convex portion 16 protrudes toward the capacitor body 4 and is disposed in the caulked portion 12 of the outer case.

[0035] like Figure 1B As shown, when the capacitor body 4 is housed in the base 6 provided with the protrusion 16, the protrusion 16 is arranged in the chiseled portion 12 formed by chiseling the side of the outer casing, and a gap portion 34 is provided between the chiseled portion 12 and the protrusion 16. The gap portion 34 is provided in at least one of the upper and lower sides of the protrusion 16 and the chiseled portion 12 in the axial direction of the capacitor body 4, as shown in FIG. Figure 5B As shown, in the capacitor 2 of this embodiment, a gap portion 34a is provided on the upper side of the convex portion 16 between the chisel portion 12 and the convex portion 16, and a gap portion 34b is provided on the lower side of the convex portion 16, and the capacitor body 4 is housed in the base 6 in a manner that allows the capacitor body 4 to move in the axial direction with the aid of the gap portion 34.

[0036] In addition, it is preferred that a gap portion 34c is also provided between the end portion 21 of the protrusion 16 and the caulking portion 12 in the radial direction of the capacitor body 4. By providing the gap portion 34c between the end portion 21 of the protrusion 16 and the caulking portion 12, the end portion 21 of the protrusion 16 and the caulking portion 12 are placed in a non-contact state, thereby enabling the capacitor body 4 to move smoothly in the axial direction.

[0037] The capacitor 2 of the present embodiment is formed so that the caulking portion 12 of the capacitor body 4 moves in the up-down direction with the convex portion 16 of the base 6 as a base point, so that the capacitor body 4 and the base 6 are formed as a whole in a state that they can move in the up-down direction by means of the gap portion 34. Therefore, even if the capacitor body 4 is pushed upward from the base 6 due to the deformation of the sealing member 26 caused by the reflow process, the movement can be allowed by the gap portion 34, and the details will be described later. In other words, since the convex portion 16 and the caulking portion can be prevented from being separated, the reliability of the connection between the lead terminal 22 and the circuit substrate 28 can be improved.

[0038] In addition, if Figure 5A , Figure 5B As shown, it is preferably designed that after the sealing member 26 side of the capacitor body 4 is brought into contact with the bottom surface 20 of the pedestal 6 and housed in the pedestal 6, a gap portion 34a is provided above the convex portion 16 in the axial direction of the capacitor 2. By providing the gap portion 34a, the convex portion 16 and the caulking portion 12 are in a non-contact state, and excessive pressure is not applied to the caulking portion 12 that seals the capacitor body 4, which is preferred. On this basis, the gap portion 34a allows slight deviations in the size of the caulking portion 12 of each capacitor, and the capacitor body 4 can be reliably housed in the bottom surface 20 of the pedestal 6.

[0039] In addition, the convex portion 16 is formed on the tapered portion 15 which tapers from the opening side toward the bottom of the pedestal 6. This can assist the storage of the capacitor body 4 in the pedestal 6. In addition, the locking portion 19 that prevents the stored capacitor body 4 from coming out is formed on the convex portion 16. Thus, even if the capacitor body 4 is separated from the pedestal 6 due to the deformation of the sealing member 26 caused by the flow of solder, it is possible to prevent the caulking portion 12 from contacting the locking portion and moving in the direction of the capacitor body 4 coming out.

[0040] The convex portion 16 may be formed at least at one position of the inner side surface of the side wall 8. Figure 3 As shown, two protrusions 16 are formed at positions perpendicular to the central axis of the capacitor body 4 in a plan view. In this way, when multiple protrusions 16 are arranged, it is preferable not to form them at positions opposite to each other across the central axis of the capacitor body 4. In the case where the pedestal 6 is formed so that the protrusions 16 are opposite to each other across the central axis of the capacitor body 4, the diameter of the capacitor storage portion is narrowed by the amount of the two protrusions 16, so when the capacitor body 4 is to be stored in the pedestal 6 at this point, a load may be applied to the pedestal 6, causing cracks and damage.

[0041] In addition, if Figure 3 As shown in FIG. 1 , the bottom surface 20 of the pedestal 6 may be provided with an opening 18 at a position below the convex portion 16 provided on the side wall 8 in the axial direction of the capacitor. When the capacitor body 4 is inserted into the pedestal 6 and the capacitor body 4 contacts the convex portion 16, the convex portion 16 elastically deforms in the radial direction along the tapered portion 15 and applies stress to the pedestal 6. In contrast, by providing the bottom surface 20 of the pedestal 6 at a position below the convex portion 16 provided on the side wall 8 in the axial direction of the capacitor, the stress is diffused to the peripheral portion of the opening 18, so that the stress can be relieved, thereby suppressing cracking and damage of the pedestal 6.

[0042] In addition, if Figure 2 As shown, ribs 17 protruding inward in the vertical direction are provided at four locations at equal intervals on the inner side surface of side wall 8. The distance between the front ends of a pair of ribs 17 facing each other is formed to be slightly shorter than the diameter of capacitor body 4.

[0043] In addition, the rib 17 may be formed above the convex portion 16 in the axial direction of the capacitor body 4. Thus, when the capacitor body 4 is accommodated in the pedestal 6, the rib 17 plays a role in guiding the capacitor body 4, stably accommodating the capacitor body 4 in the pedestal 6, and the capacitor body 4 is continuously guided from the rib 17 to the convex portion 16 formed below the rib 17 in the axial direction of the capacitor body 4, and the convex portion 16 is arranged in a manner that the gap portion 34 is provided in the caulking portion 12 provided in the capacitor body 4.

[0044] Thus, in this embodiment, the rib 17 is formed in the up and down direction of the inner surface of the side wall 8, and the outer peripheral side surface of the capacitor body 4 is supported up and down throughout the side wall 8. This is preferred because it can more effectively suppress the swing of the capacitor body 42, but the present invention is not limited to this. It is sufficient to form the rib 17 on at least a portion of the inner surface of the side wall 8.

[0045] The rib 17 is preferably formed into a semicircular shape in a plan view, but the present invention is not limited thereto, and the rib 17 may have any shape as long as at least the tip thereof can abut against the outer peripheral side surface of the capacitor body 4 .

[0046] In addition, the ribs 17 are evenly spaced at four locations on the inner surface of the side wall 8 and formed to be opposite to each other. This is preferred because the capacitor body 4 is evenly clamped and thus more stably supported. However, the present invention is not limited to this. The capacitor body 4 can be formed to be clamped by the ribs 17 set on the side wall 8, and the number and formation position of the ribs can be appropriately selected.

[0047] In the capacitor 2 thus constructed, the capacitor body 4 is mounted on the inner side of the rib 17 provided on the inner side of the side wall 8, and the front end of the rib 17 is pressed against the outer peripheral side of the capacitor body 4, elastically deforming toward the side wall 8. With the elastic rebound force, the outer peripheral side of the capacitor body 4 is strongly clamped by the front end of the rib 17, so that the swing of the capacitor body 4 can be suppressed even during vibration, and the breakage of the lead terminal 22 caused by the swing of the capacitor body 4 can be prevented. In addition, since the rib 17 is integrally formed with the side wall 8, it is excellent in strength and the manufacturing cost of the side wall 8 can also be reduced.

[0048] Furthermore, capacitor body 4 is supported by ribs 17 , and a gap is formed between the outer peripheral side surface of capacitor body 4 and side wall 8 . This can greatly suppress a reduction in heat dissipation of capacitor body 4 due to provision of side wall 8 .

[0049] In addition, if Figure 4 As shown in the figure, the pair of lead terminals 22 led out from the capacitor body 4 can be inserted into the through hole 30 without being bent and connected by reflow treatment. In this way, it is possible to avoid the concentration of stress on the lead terminal 22 when the lead terminal 22 is bent. In addition, since the lead terminal 22 is fixed in the through hole 30, the capacitor and the circuit board 28 can be firmly connected compared with a normal surface mounting part in which the lead terminal 22 is not inserted into the through hole 30.

[0050] In the present embodiment, the auxiliary terminal 24 is preferably provided on the lower surface of the pedestal 6 to further strengthen the connection between the pedestal 6 and the circuit board 28 . However, the present invention is not limited thereto, and the auxiliary terminal 24 may not be particularly formed.

[0051] In addition, if Figure 8 As shown, according to other embodiments using auxiliary terminals, the auxiliary terminals can be configured so that the angles of the contact points of the imaginary line L1 connecting a pair of lead terminals derived from the capacitor body and the imaginary line L2 connecting a pair of auxiliary terminals arranged on the lower surface of the base 6 are approximately orthogonal. The direction of the imaginary line L1 is configured so that it is fixed to the substrate at two points through a pair of lead terminals, thereby ensuring high vibration resistance. Similarly, the direction of the imaginary line L2 is configured so that it is fixed to the substrate at two points through a pair of auxiliary terminals, thereby ensuring high vibration resistance. By configuring the auxiliary terminals so that each imaginary line is in a different direction (for example, an orthogonal direction), it is possible to ensure high vibration resistance against vibrations from multiple directions.

[0052] The capacitor 2 constructed as described above is connected to a predetermined position of the circuit substrate 28 by soldering. The through hole 30 provided in the circuit substrate 28 is filled with solder paste, and the lead terminal 22 of the capacitor is inserted into the through hole 30. At this time, when the sealing member 26 side of the capacitor body 4 is pressed sufficiently so as to contact the bottom portion 20 of the base 6, the height is determined by the contact between the capacitor body 4 and the bottom portion 20 of the base 6, thereby generating a gap portion 34a above the convex portion 16 in the axial direction of the capacitor body 4 and a gap portion 34b below. At this time, as Figure 5A , Figure 5B As shown, the protrusion 16 is arranged above the inner area of ​​the caulking portion generated between the base 6 and the caulking portion 12, and a gap portion 34b is provided below the inner area of ​​the caulking portion 12 as a space portion that allows the capacitor body 4 to move with the deformation of the sealing member 26.

[0053] When Figure 5A , Figure 5B When reflow soldering is performed in the state shown, there are slight individual differences between capacitors 2. Fig. 6A , Figure 6B As shown, as the internal pressure of the capacitor 2 increases, the sealing member 26 expands, and the capacitor body 4 is moved in a direction away from the bottom portion 20 of the base 6 ( Fig. 6A However, the gap 34b disposed below the convex portion 16 in the axial direction of the capacitor body 4 enables the capacitor to move upward toward the dense portion 12, and the convex portion 16 is controlled within the dense portion 12 of the capacitor body 4, thereby preventing the capacitor from being separated from the seat 6. In this way, when the capacitor body 4 is pushed upward, as shown in FIG. Fig. 6A , Figure 6BThe convex portion 16 is located below the area within the chiseled portion. In addition, a gap portion 34a is generated above the convex portion 16 by the height of the capacitor being pushed up. It should be noted that due to individual differences in the capacitors 2, the height of the capacitor body 4 being pushed up due to the expansion of the sealing member 26 is slightly different, but the positions of the convex portion 16 and the chiseled portion can be designed as follows: Figure 6B As shown in FIG. 1 , when the capacitor body 4 is placed in contact with the bottom portion 20 of the pedestal 6 and housed in the pedestal 6, the length by which the capacitor body 4 is separated from the bottom portion 20 of the pedestal 6 due to the deformation of the sealing member 26 accompanying the reflow process is set as a. Figure 5B When the capacitor body 4 shown in the figure contacts the bottom surface 20 of the pedestal 6 and is housed in the pedestal 6, the length of the gap 34b provided below the convex portion 16 in the axial direction of the capacitor is set to b, and the magnitude relationship between a and b at this time is a≤b. Thus, the movement of the capacitor body 4 accompanying the reflow process can be reliably allowed by the caulking portion 12.

[0054] In addition, in using Figure 5B When the capacitor body 4 shown is in contact with the bottom portion 20 of the base 6 and is housed in the base 6, the length b of the gap portion 34b provided below the convex portion 16 in the axial direction of the capacitor 2 is preferably about 0.2 mm to 3.0 mm, more preferably about 0.5 mm to 2.0 mm, and can be appropriately designed in accordance with the size of the capacitor body 4 and the depth of the chiseled portion 12.

[0055] When the capacitor 2 is cooled in the cooling process of the reflow process, although there are slight individual differences between the capacitors 2, Figure 7 As shown in the figure, the expanded sealing member 26 contracts, and the capacitor body 4 descends by the amount of the contraction of the sealing member 26 due to its own weight. Then, the solder solidifies, thereby achieving mechanical and electrical connection with each other. At this time, there is a situation as follows: depending on the degree of close contact between the capacitor body 4 and the ribs 17 provided on the side wall 8, the capacitor body 4 does not descend to the bottom portion 20 of the base 6, and the lead terminal 22 and the circuit substrate 28 are connected in a state with a slight gap, but this does not affect the installation on the circuit substrate 28.

[0056] As mentioned above, although the embodiment of the present invention is described based on the drawings, the specific structure is not limited to these embodiments, and the change and addition within the range which does not deviate from the summary of the present invention are also included in the present invention.

[0057] For example, in this embodiment, as a method of mounting the capacitor 2 on the circuit board 28, a mounting method is described in which the lead terminal 22 of the capacitor body 4 is inserted into the through hole 30 provided in the circuit board 28, and then the capacitor body 4 is sufficiently pressed to contact the bottom surface 20 of the base 6, and then the sealing member 26 side is reflowed. However, the present invention is not limited to this. As another mounting method, the lead terminal 22 of the capacitor body 4 may be inserted into the through hole 30 provided in the circuit board 28, and then the sealing member 26 side of the capacitor body 4 and the bottom surface 20 of the base 6 are separated in advance and then the reflow is performed. Specifically, the convex portion 16 provided on the base 6 may be arranged within the range of the crimping portion 12 provided on the capacitor body 4, and the capacitor body may be lifted upward, and the convex portion 16 may be arranged below the area inside the crimping portion 12.

[0058] In this way, by pre-separating the sealing member 26 side of the capacitor body 4 from the base 6, a gap or an expanded gap is set between the sealing member 26 and the base 6, so that the deformation of the sealing member 26 caused by the reflow process can be absorbed by the gap, so that the upward movement distance of the capacitor body can be eliminated or reduced compared with the reflow process in a state where the sealing member 26 and the bottom surface 20 of the base 6 are in contact. The shorter the upward movement distance of the capacitor body 4 caused by the reflow process, the more the load applied to the lead terminal 22 can be reduced. In other words, the movement of the capacitor body 4 in the vertical direction is achieved by the gap portion 34 provided between the chiseled portion 12 of the capacitor body 4 and the convex portion 16 of the base 6, so the separation distance between the capacitor body 4 and the base 6 during the reflow process can be appropriately selected according to the size of the capacitor 2, the material of the sealing member 26, the installation equipment, etc.

[0059] Industrial Applicability

[0060] According to the present invention, it is possible to significantly reduce the occurrence of mounting defects on the circuit board 28 during reflow soldering.

[0061] Description of reference numerals:

[0062] 2: Capacitor;

[0063] 4: Capacitor body;

[0064] 6: Pedestal;

[0065] 8: side wall;

[0066] 10: incision;

[0067] 12: Chiseling Department;

[0068] 14: discontinuity;

[0069] 15: cone;

[0070] 16: convex part;

[0071] 17: ribs;

[0072] 18: opening;

[0073] 19: stopper;

[0074] 20: bottom part;

[0075] 22: Lead terminal;

[0076] 24: Auxiliary terminal;

[0077] 26: Sealing member;

[0078] 28: Circuit board;

[0079] 30: through hole;

[0080] 32: solder paste;

[0081] 34: Gap part.

Claims

1. A capacitor, wherein an open end of a bottomed cylindrical outer casing accommodating a capacitor element is sealed by a sealing member, and a capacitor body formed by passing a lead terminal led out of the capacitor element through the sealing member is accommodated in a pedestal, the pedestal having a bottom portion and a side wall, the bottom portion having a through hole for passing the lead terminal, the side wall being formed to surround the outer periphery of the capacitor body, the capacitor having a convex portion protruding from the inner side surface of the side wall toward the capacitor body, It is characterized in that The convex portion is disposed on a caulked portion formed by caulked a side surface of the outer casing, and a gap portion is provided between the caulked portion and the convex portion. The gap is provided at least one of the upper and lower portions of the convex portion and the caulking portion in the axial direction of the capacitor body, and the capacitor body is accommodated in the pedestal so as to be movable in the axial direction of the capacitor via the gap.

2. The capacitor according to claim 1, characterized in that When the capacitor body is brought into contact with the bottom surface portion of the pedestal, a gap is provided below the convex portion in the axial direction of the capacitor.

3. The capacitor according to claim 2, characterized in that The length of the gap provided below the protrusion is 0.2 to 3.0 mm.

4. The capacitor according to claim 1 or 2, characterized in that: When the capacitor body is placed in the pedestal by being brought into contact with the bottom surface of the pedestal, a gap portion is provided above the convex portion in the axial direction of the capacitor.

5. The capacitor according to claim 1 or 2, characterized in that: The length of the capacitor body separated from the bottom portion of the base due to deformation of the sealing member caused by reflow soldering when the capacitor body is brought into contact with the bottom portion of the base and housed in the base is set to a, and the length of the gap portion provided below the axial protrusion of the capacitor when the capacitor body is brought into contact with the bottom portion of the base and housed in the base is set to b, and the size relationship between a and b is a≤b.

6. The capacitor according to claim 1 or 2, characterized in that: The convex portion includes a tapered portion provided at an upper portion in an axial direction of the capacitor and a locking portion provided at a lower portion in an axial direction of the capacitor to prevent the accommodated capacitor body from falling out.

7. The capacitor according to claim 1 or 2, characterized in that: The capacitor includes a rib protruding inwardly over an axial direction of the capacitor body on an inner side surface of the side wall, wherein the rib is formed above the convex portion in the axial direction of the capacitor body.

8. The capacitor according to claim 1 or 2, characterized in that: The capacitor includes an opening on a bottom surface portion of a base located below the convex portion provided on the side wall in the axial direction of the capacitor.

9. The capacitor according to claim 1 or 2, characterized in that: The lead terminal of the capacitor body passes through the through hole provided in the base and is led out in a straight line.

10. A method for manufacturing a capacitor, wherein an open end of a bottomed cylindrical outer casing accommodating a capacitor element is sealed by a sealing member, and a capacitor body formed by passing a lead terminal led out of the capacitor element through the sealing member is accommodated in a pedestal, the pedestal having a bottom portion and a side wall, the bottom portion having a through hole for passing the lead terminal, the side wall being formed to surround the outer periphery of the capacitor body, the capacitor having a convex portion protruding from the inner side surface of the side wall toward the capacitor body, It is characterized in that The manufacturing method of the capacitor comprises the following steps: The convex portion is arranged in a caulked portion formed by caulked the side surface of the outer case so as to provide a gap portion between the caulked portion and the convex portion. The gap is provided at least one of the upper and lower portions of the convex portion and the caulking portion in the axial direction of the capacitor body, and the capacitor body is accommodated in the seat so as to be movable in the axial direction of the capacitor via the gap.

11. A method for installing a capacitor, characterized in that: The method for mounting a capacitor includes the steps of: inserting a lead terminal of the capacitor according to any one of claims 1 to 9 into a through hole filled with solder paste provided in a circuit board; and performing reflow soldering to connect the lead terminal and the circuit board.

12. The method for mounting a capacitor according to claim 11, characterized in that: After the step of inserting the lead terminal of the capacitor into the through hole, the method further includes the step of bending the inserted lead terminal to temporarily fix the lead terminal.

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