Wafer lifting device and process chamber

Abstract

The present invention provides a wafer lifting device and a process chamber, wherein the wafer lifting device is used in the process chamber, and includes a support assembly, a first driving component and a second driving component, wherein the support assembly is used to be lifted and lowered in a base of the process chamber, and lifts and lowers the wafer on the base; the driving end of the first driving component is connected to the support assembly, and is used to directly drive the support assembly to be lifted and lowered, and the driving end of the second driving component is connected to the fixed end of the first driving component, and is used to drive the first driving component to be lifted and lowered to drive the support assembly to be lifted and lowered, and the driving speed and driving pressure of the first driving component and the second driving component are different. The wafer lifting device, base and process chamber provided by the present invention can improve the stability and flexibility of wafer lifting and lowering, thereby improving the stability and flexibility of semiconductor processes.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a wafer lifting device and a process chamber. Background Art

[0002] In the semiconductor process, in order to carry the wafer, make the wafer have a high utilization rate, and avoid the wafer from moving or misaligning during the process, an electrostatic chuck that can adsorb and carry the wafer through Coulomb force (also known as electrostatic force) is often used. Before and after the semiconductor process, the robot needs to cooperate with the lifting device to support the lifting of the wafer, remove the wafer from the robot and place it on the electrostatic chuck, or lift it from the electrostatic chuck and place it on the robot to complete the wafer transfer.

[0003] An existing lifting device includes a support assembly and a cylinder. The support assembly is used to contact and support the wafer. The cylinder is connected to the support assembly. The cylinder drives the support assembly to rise and fall to drive the wafer to rise and fall. In order to meet the rhythm of semiconductor process, the cylinder needs to drive the support assembly to rise and fall at a certain speed and pressure.

[0004] However, the speed and pressure of the cylinder need to be manually adjusted by the pressure regulating valve and speed regulating valve connected to it. Therefore, the speed and pressure of the cylinder cannot be changed during the process of the lifting device lifting the wafer. At the moment when the cylinder drives the support assembly to lift and lower the wafer, if the speed of the cylinder driving the support assembly is too fast, it may cause the wafer to shake and shift, affecting the subsequent semiconductor process results, and even causing the wafer to fall and break.

[0005] Moreover, after the semiconductor process is completed, there may be uneliminated charges between the wafer and the electrostatic chuck, and the Coulomb force between the electrostatic chuck and the wafer may still exist. At this time, if the pressure of the cylinder-driven support assembly is too high, the wafer may be directly crushed, causing great economic losses. Summary of the invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a wafer lifting device and a process chamber, which can improve the stability and flexibility of wafer lifting, thereby improving the stability and flexibility of semiconductor processes.

[0007] To achieve the purpose of the present invention, a wafer lifting device is provided, which is used in a process chamber, and includes a support assembly, a first driving component, and a second driving component. The support assembly is used to be lifted and lowered in a base of the process chamber to lift and lower a wafer on the base.

[0008] The driving end of the first driving component is connected to the supporting assembly for directly driving the supporting assembly to rise and fall. The driving end of the second driving component is connected to the fixed end of the first driving component for driving the supporting assembly to rise and fall by driving the first driving component to rise and fall. The driving speeds and driving pressures of the first driving component and the second driving component are different.

[0009] Optionally, the first driving component includes a first cylinder, the second driving component includes a second cylinder, and the driving speed and driving pressure of the first cylinder are respectively smaller than the driving speed and driving pressure of the second cylinder.

[0010] Optionally, the wafer lifting device further includes a first speed regulating component and a first pressure regulating component, wherein the first speed regulating component is used to be arranged on the air intake pipeline and the exhaust pipeline of the first cylinder to respectively adjust the driving speed of the first cylinder driving the support component to be lifted and lowered, and the first pressure regulating component is used to be arranged on the air intake pipeline and the exhaust pipeline of the first cylinder to respectively adjust the driving pressure of the first cylinder driving the support component to be lifted and lowered; and / or,

[0011] The wafer lifting device also includes a second speed regulating component and a second pressure regulating component. The second speed regulating component is used to be arranged on the intake pipe and the exhaust pipe of the second cylinder to respectively adjust the driving speed of the second cylinder driving the support component to rise and fall. The second pressure regulating component is used to be arranged on the intake pipe and the exhaust pipe of the second cylinder to respectively adjust the driving pressure of the second cylinder driving the support component to rise and fall.

[0012] Optionally, the driving speed of the first cylinder is 0.5m / s-1m / s, and the driving pressure is 0.1MPa-0.2MPa; the driving speed of the second cylinder is 3.5m / s-4m / s, and the driving pressure is 0.3MPa-0.4MPa.

[0013] Optionally, the first cylinder is provided with a first positioning component for detecting the position of the support component driven by the first cylinder to rise and fall; and / or,

[0014] The second cylinder is provided with a second positioning component for detecting the position of the first cylinder driven by the second cylinder to rise and fall.

[0015] Optionally, the first positioning assembly includes: a first magnetic member, a first electromagnetic sensing component and a second electromagnetic sensing component, the first magnetic member is arranged in the cylinder body of the first cylinder, and can be raised and lowered synchronously with the first cylinder driving the supporting assembly to be raised and lowered, the first electromagnetic sensing component and the second electromagnetic sensing component are both arranged on the cylinder body of the first cylinder, and are spaced apart in the direction in which the first cylinder drives the supporting assembly to be raised and lowered; and / or,

[0016] The second positioning component includes: a second magnetic part, a third electromagnetic sensing component and a fourth electromagnetic sensing component. The second magnetic part is arranged in the cylinder body of the second cylinder and can be raised and lowered synchronously with the second cylinder driving the first cylinder to rise and fall. The second electromagnetic sensing component and the fourth electromagnetic sensing component are both arranged on the cylinder body of the second cylinder and are spaced apart in the direction in which the second cylinder drives the first cylinder to rise and fall.

[0017] Optionally, the wafer lifting device also includes a first flange and a first screw, and a first threaded hole is provided at the end of the output shaft of the second cylinder, wherein the first flange is connected to the bottom of the cylinder body of the first cylinder, and a first fixing hole is provided in the first flange, and the first screw is fixed in the first fixing hole and threadedly connected to the first threaded hole.

[0018] Optionally, the wafer lifting device further comprises a connecting frame, the top of the connecting frame is fixedly arranged on the bottom of the base, and the bottom of the connecting frame is fixedly connected to the cylinder body of the second cylinder;

[0019] The connecting frame is sleeved on the outside of the first cylinder, and the first cylinder is slidably matched with the connecting frame.

[0020] Optionally, a limit plate is provided in the connection frame, and the limit plate is arranged in the connection frame in a position-adjustable manner;

[0021] The support assembly includes a transmission rod and an ejector assembly, the transmission rod is inserted into the limiting plate, the top end of the transmission rod is connected to the ejector assembly, the bottom end of the transmission rod is connected to the output shaft of the first cylinder, a limiting boss is provided on the transmission rod, the limiting boss is located between the limiting plate and the bottom end of the transmission rod, and the limiting boss is used to limit the top limit position of the ejector assembly.

[0022] The present invention also provides a process chamber, comprising a cavity, a base and the wafer lifting device provided by the present invention, wherein the base is arranged in the cavity for carrying a wafer, and the wafer lifting device is arranged at the bottom of the base for lifting the wafer.

[0023] The present invention has the following beneficial effects:

[0024] The wafer lifting device provided by the present invention directly drives the support assembly to be lifted or lowered by arranging a driving end of a first driving component to be connected with the support assembly, and arranging a driving end of a second driving component to be connected with the fixed end of the first driving component, and by driving the first driving component to be lifted or lowered, the support assembly is driven to be lifted or lowered, and the driving speeds and driving pressures of the first driving component and the second driving component are designed to be different. At the moment when the wafer lifting device lifts or lowers the wafer, the support assembly can be driven to be lifted or lowered by first using the driving component with a smaller driving speed among the first driving component and the second driving component, so as to reduce the probability of the wafer shaking, deflecting or even falling and breaking due to excessive driving speed, and then by using the driving component with a larger driving speed to drive the support assembly to be lifted or lowered. A driving component drives the support assembly to rise and fall to meet the rhythm of the semiconductor process. After the semiconductor process is completed, when there may still be Coulomb force between the wafer and the electrostatic chuck, the support assembly can be driven to rise and fall with the help of the driving component with smaller driving pressure among the first driving component and the second driving component to reduce the probability of wafer breakage due to excessive driving pressure. If the wafer can be lifted from the electrostatic chuck and separated from the electrostatic chuck, the support assembly can be driven to rise with the help of the driving component with larger driving pressure to meet the rhythm of the semiconductor process, thereby improving the stability and flexibility of wafer lifting and lowering, and further improving the stability and flexibility of the semiconductor process.

[0025] The process chamber provided by the present invention can improve the stability and flexibility of wafer lifting by lifting the wafer with the help of the wafer lifting device provided by the present invention, thereby improving the stability and flexibility of the semiconductor process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic cross-sectional structural diagram of the wafer lifting device and the base when assembled according to an embodiment of the present invention;

[0027] Figure 2 A schematic diagram of the front view of the structure of the wafer lifting device and the base when they are assembled according to an embodiment of the present invention;

[0028] Figure 3 A schematic diagram of the three-dimensional structure of the wafer lifting device and the base when assembled according to an embodiment of the present invention;

[0029] Figure 4 A partially enlarged cross-sectional structural schematic diagram of the wafer lifting device and the base when they are assembled according to an embodiment of the present invention;

[0030] Figure 5 Another partially enlarged cross-sectional structural schematic diagram of the wafer lifting device and the base when assembled according to an embodiment of the present invention;

[0031] Figure 6 A schematic diagram of the structure of a process chamber provided by an embodiment of the present invention;

[0032] Description of reference numerals:

[0033] 1-support assembly; 11-thrust needle assembly; 111-connecting piece; 112-bellows; 113-guide piece; 114-support rod; 115-thrust needle; 12-transmission rod; 121-limiting boss; 2-first driving component; 21-output shaft of the first cylinder; 3-second driving component; 31-output shaft of the second cylinder; 41-first positioning assembly; 411-first electromagnetic sensing component; 412-second electromagnetic sensing component; 42-second positioning assembly; 421-third electromagnetic sensing component; 422-fourth electromagnetic sensing component; 51-first flange; 52-first screw; 6-connecting frame; 7-limiting plate; 8-adapter; 10-base; 101-seat body; 102-electrostatic chuck; 20-process chamber; 201-cavity body. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solution of the present invention, the wafer lifting device and the process chamber provided by the present invention are described in detail below with reference to the accompanying drawings.

[0035] like Figure 1-Figure 3 As shown, an embodiment of the present invention provides a wafer lifting device for a process chamber, comprising a support assembly 1, a first driving component 2 and a second driving component 3. The support assembly 1 is used to be liftably arranged in a base 10 of the process chamber to lift and lower the wafer on the base 10; the driving end of the first driving component 2 is connected to the support assembly 1, and is used to directly drive the support assembly 1 to rise and fall; the driving end of the second driving component 3 is connected to the fixed end of the first driving component 2, and is used to drive the support assembly 1 to rise and fall by driving the first driving component 2 to rise and fall, and the driving speeds and driving pressures of the first driving component 2 and the second driving component 3 are different.

[0036] The wafer lifting device provided in the embodiment of the present invention directly drives the support assembly 1 to rise and fall by setting the driving end of the first driving component 2 to be connected with the support assembly 1, and sets the driving end of the second driving component 3 to be connected with the fixed end of the first driving component 2, and drives the first driving component 2 to rise and fall to drive the support assembly 1 to rise and fall, and the driving speeds and driving pressures of the first driving component 2 and the second driving component 3 are designed to be different. At the moment when the wafer lifting device lifts the wafer, the support assembly 1 can be driven to rise and fall by using the driving component with a smaller driving speed among the first driving component 2 and the second driving component 3, so as to reduce the probability of the wafer shaking, deflecting or even falling and breaking due to excessive driving speed, and then the support assembly 1 can be driven to rise and fall by using the driving component with a larger driving speed. A driving component drives the support assembly 1 to rise and fall to meet the rhythm of the semiconductor process. After the semiconductor process is completed, when there may still be Coulomb force between the wafer and the electrostatic chuck 102, the support assembly 1 can be driven to rise and fall with the help of the driving component with smaller driving pressure among the first driving component 2 and the second driving component 3 to reduce the probability of wafer breakage due to excessive driving pressure. If the wafer can be lifted from the electrostatic chuck 102 and separated from the electrostatic chuck 102, the support assembly 1 can be driven to rise with the help of a driving component with larger driving pressure to meet the rhythm of the semiconductor process, thereby improving the stability and flexibility of wafer lifting and lowering, and further improving the stability and flexibility of the semiconductor process.

[0037] like Figure 1-Figure 3As shown, optionally, the base 10 may include a base body 101 and an electrostatic chuck 102, wherein the electrostatic chuck 102 is disposed on the base body 101, the base body 101 is used to support the electrostatic chuck 102, and the electrostatic chuck 102 is used to adsorb and carry the wafer. In a preferred embodiment of the present invention, the support assembly 1 may include an ejector assembly 11 and a transmission rod 12. Optionally, the ejector assembly 11 may include a connector 111, a bellows 112, a guide 113, three support rods 114 and three ejector pins 115, wherein the connector 111 is connected to the bottom of the base 10, the bellows 112 is arranged on the connector 111 and penetrates the seat body 101, the top end of the transmission rod 12 penetrates the connector 111 and the bellows 112, the guide 113 is arranged in the connector 111 and sleeved on the outside of the guide 113 to guide the movement of the transmission rod 12, and the three support rods 114 are located in the seat body 101 and are arranged at intervals on the transmission rod 12 along the circumference of the transmission rod 12. 2, three ejector pins 115 are inserted into the base body 101 and the electrostatic chuck 102, and are arranged on the three support rods 114 in a one-to-one manner, that is, the top end of the transmission rod 12 is connected to the ejector pin assembly 11, and the bottom end of the transmission rod 12 is located outside the base body 101 and is connected to the driving end of the first driving component 2, that is, the driving end of the first driving component 2 is connected to the support assembly 1 through the transmission rod 12, the bellows 112 is used to seal the gap caused by the support assembly 1 being inserted into the base body 101, thereby avoiding sealing the process chamber 20, and the connecting piece 111 is used to connect the support assembly 1 to the base body 101.

[0038] When the first driving component 2 or the second driving component 3 drives the supporting assembly 1 to rise, the first driving component 2 or the second driving component 3 drives the transmission rod 12 to rise, the transmission rod 12 rises and drives the three supporting rods 114 to rise, and the three supporting rods 114 rise and drive the three ejector pins 115 to rise. When the three ejector pins 115 rise to a position higher than the upper surface of the electrostatic chuck 102 (such as Figure 1 As shown in FIG. 1 ), the three ejector pins 115 can lift the wafer carried on the electrostatic chuck 102. When the first driving component 2 or the second driving component 3 drives the support assembly 1 to descend, the first driving component 2 or the second driving component 3 drives the transmission rod 12 to descend, and the descent of the transmission rod 12 drives the three support rods 114 to descend, and the descent of the three support rods 114 drives the three ejector pins 115 to descend. When the three ejector pins 115 descend to a position lower than the upper surface of the electrostatic chuck 102 (as shown in FIG. 1 ), the three ejector pins 115 can lift the wafer carried on the electrostatic chuck 102. Figure 4 As shown), three ejector pins 115 can allow the supported wafer to fall onto the electrostatic chuck 102.

[0039] However, the structure of the supporting assembly 1 of the wafer lifting device provided in the embodiment of the present invention is not limited thereto.

[0040] In a preferred embodiment of the present invention, the driving speed and driving pressure of the first driving component 2 may be respectively lower than the driving speed and driving pressure of the second driving component 3. However, this is not limited thereto, and the driving speed and driving pressure of the first driving component 2 may also be respectively higher than the driving speed and driving pressure of the second driving component 3.

[0041] Taking the example that the driving speed and driving pressure of the first driving component 2 are less than the driving speed and driving pressure of the second driving component 3, the wafer lifting device provided in the embodiment of the present invention can firstly drive the first driving component 2 to rise with the help of the second driving component 3 in the process of transferring the wafer from the robot to the electrostatic chuck 102, so as to drive the three ejector pins 115 of the support component 1 to rise at a higher speed to meet the semiconductor process rhythm, and then directly drive the support component 1 to rise with the help of the first driving component 2, so that the three ejector pins 115 of the support component 1 contact with the wafer carried on the robot at a lower speed to support the wafer, so that the wafer The robot is separated from the manipulator to reduce the probability of the wafer shaking, deviating, or even falling and breaking due to excessive speed. The robot then exits the process chamber 20. Thereafter, the support assembly 1 can be directly driven down by the first driving component 2 to make the three ejector pins 115 of the support assembly 1 descend at a lower speed to reduce the probability of the wafer shaking, deviating, or even falling and breaking due to excessive speed. Then, the second driving component 3 can be used to drive the first driving component 2 to descend, so as to drive the three ejector pins 115 of the support assembly 1 to descend at a higher speed to a surface below the electrostatic chuck 102, so that the wafer falls on the electrostatic chuck 102 to meet the semiconductor process rhythm.

[0042] In the process of transferring the wafer adsorbed and carried on the electrostatic chuck 102 to the robot, the wafer lifting device provided in the embodiment of the present invention can first directly drive the support component 1 to rise with the help of the first driving component 2, so that the three ejector pins 115 of the support component 1 can contact the wafer adsorbed and carried on the electrostatic chuck 102 with a small pressure to support the wafer, so that the wafer and the electrostatic chuck 102 are separated by a preset distance (for example, the preset distance can be 1mm) to reduce the probability of wafer breakage due to excessive pressure, and then drive the first driving component 2 to rise with the help of the second driving component 3 to bring the wafer to the robot. The three ejector pins 115 of the mobile support assembly 1 rise at a relatively high speed to meet the rhythm of the semiconductor process. Then, the robot enters the process chamber 20 and is located under the wafer. After that, the first driving component 2 can be used to directly drive the support assembly 1 to descend, so that the three ejector pins 115 of the support assembly 1 descend at a relatively low speed, and the wafer is dropped onto the robot to reduce the probability of the wafer shaking, deviating, or even falling and breaking due to excessive speed. Then, the second driving component 3 can be used to drive the first driving component 2 to descend, so as to drive the three ejector pins 115 of the support assembly 1 to descend at a relatively high speed to meet the rhythm of the semiconductor process.

[0043] When the first driving component 2 directly drives the support assembly 1 to rise, so that the three ejector pins 115 of the support assembly 1 contact with the wafer adsorbed and carried on the electrostatic chuck 102 with a small pressure, and the wafer is supported, if the three ejector pins 115 of the support assembly 1 cannot separate the wafer from the electrostatic chuck 102, the first driving component 2 or the second driving component 3 can be used to drive the support assembly 1 to fall, so that the three ejector pins 115 of the support assembly 1 are separated from the wafer adsorbed and carried on the electrostatic chuck 102, and the Coulomb force between the wafer and the electrostatic chuck 102 is eliminated again, and then the first driving component 2 is used to directly drive the support assembly 1 to rise again, so that the three ejector pins 115 of the support assembly 1 contact with the wafer adsorbed and carried on the electrostatic chuck 102 with a small pressure. The three ejector pins 115 of the support assembly 1 are in contact with the wafer on the electrostatic chuck 102 to support the wafer. If the three ejector pins 115 of the support assembly 1 still cannot separate the wafer from the electrostatic chuck 102, the first drive component 2 or the second drive component 3 can be used to drive the support assembly 1 to descend, so that the three ejector pins 115 of the support assembly 1 are separated from the wafer adsorbed and carried on the electrostatic chuck 102, and the wafer and the electrostatic chuck 102 are manually inspected, and the Coulomb force between the wafer and the electrostatic chuck 102 is eliminated. Thereafter, the first drive component 2 is used to directly drive the support assembly 1 to rise again, so that the three ejector pins 115 of the support assembly 1 are in contact with the wafer adsorbed and carried on the electrostatic chuck 102 with a smaller pressure, to support the wafer, and separate the wafer from the electrostatic chuck 102.

[0044] In a preferred embodiment of the present invention, the first driving component 2 may include a first cylinder, and the second driving component 3 may include a second cylinder, and the driving speed and driving pressure of the first cylinder are respectively smaller than the driving speed and driving pressure of the second cylinder.

[0045] In a preferred embodiment of the present invention, the driving speed of the first cylinder can be 0.5m / s-1m / s, the driving pressure can be 0.1MPa-0.2MPa, and the driving speed of the second cylinder can be 3.5m / s-4m / s, and the driving pressure can be 0.3MPa-0.4MPa. This can reduce the probability of wafer breakage due to excessive driving pressure and meet the efficiency of semiconductor process, thereby improving the stability and flexibility of wafer lifting, and further improving the stability and flexibility of semiconductor process.

[0046] In a preferred embodiment of the present invention, the wafer lifting device may also include a first speed regulating component and a first pressure regulating component, the first speed regulating component is used to be arranged on the intake pipe and the exhaust pipe of the first cylinder, and respectively adjust the driving speed of the first cylinder driving the support component 1 to be lifted and lowered, and the first pressure regulating component is used to be arranged on the intake pipe and the exhaust pipe of the first cylinder, and respectively adjust the driving pressure of the first cylinder driving the support component 1 to be lifted and lowered; and / or, the wafer lifting device may also include a second speed regulating component and a second pressure regulating component, the second speed regulating component is used to be arranged on the intake pipe and the exhaust pipe of the second cylinder, and respectively adjust the driving speed of the second cylinder driving the support component 1 to be lifted and lowered, and the second pressure regulating component is used to be arranged on the intake pipe and the exhaust pipe of the second cylinder, and respectively adjust the driving pressure of the second cylinder driving the support component 1 to be lifted and lowered.

[0047] Specifically, an air inlet and an exhaust port are provided on the cylinder body of the first cylinder. The air inlet is connected to an air inlet pipeline for introducing gas into the cylinder body. The exhaust port is connected to an exhaust pipeline for exhausting gas from the cylinder body. By introducing gas into the cylinder body through the air inlet pipeline or exhausting gas from the cylinder body through the exhaust pipeline, the piston in the cylinder body can be driven to reciprocate, thereby realizing the lifting and lowering drive of the first cylinder. By providing a first speed regulating component on the air inlet pipeline and the exhaust pipeline of the first cylinder, the flow rate of the gas flowing through the air inlet pipeline and the exhaust pipeline of the first cylinder can be adjusted respectively with the help of the first speed regulating component, thereby adjusting the driving speed of the lifting and lowering of the first cylinder driving support component 1. By providing a first pressure regulating component on the air inlet pipeline and the exhaust pipeline of the first cylinder, the pressure of the gas flowing through the air inlet pipeline and the exhaust pipeline of the first cylinder can be adjusted respectively with the help of the first pressure regulating component, thereby adjusting the driving pressure of the lifting and lowering of the first cylinder driving support component 1.

[0048] Similarly, an air inlet and an exhaust port are provided on the cylinder body of the second cylinder. The air inlet is connected to an air inlet pipeline for introducing gas into the cylinder body, and the exhaust port is connected to an exhaust pipeline for exhausting gas from the cylinder body. By introducing gas into the cylinder body through the air inlet pipeline, or exhausting gas from the cylinder body through the exhaust pipeline, the piston in the cylinder body can be driven to reciprocate, thereby realizing the lifting and lowering drive of the second cylinder. By providing a second speed regulating component on the air inlet pipeline and the exhaust pipeline of the second cylinder, the flow rate of the gas flowing through the air inlet pipeline and the exhaust pipeline of the second cylinder can be adjusted respectively with the help of the second speed regulating component, thereby adjusting the driving speed of the second cylinder driving the support assembly 1 to rise and fall. By providing a second pressure regulating component on the air inlet pipeline and the exhaust pipeline of the second cylinder, the pressure of the gas flowing through the air inlet pipeline and the exhaust pipeline of the second cylinder can be adjusted respectively with the help of the second pressure regulating component, thereby adjusting the driving pressure of the second cylinder driving the support assembly 1 to rise and fall.

[0049] In a preferred embodiment of the present invention, the first speed regulating component may include a first speed regulating component and a second speed regulating component, the first speed regulating component and the second speed regulating component are used to be respectively arranged on the intake pipe and the exhaust pipe of the first cylinder, respectively adjusting the driving speed of the first cylinder driving the support component 1 to rise and fall; and / or, the first pressure regulating component may include a first pressure regulating component and a second pressure regulating component, the first pressure regulating component and the second pressure regulating component are used to be respectively arranged on the intake pipe and the exhaust pipe of the first cylinder, respectively adjusting the driving pressure of the first cylinder driving the support component 1 to rise and fall; and / or, the second speed regulating component may include a third speed regulating component and a fourth speed regulating component, the third speed regulating component and the fourth speed regulating component are used to be respectively arranged on the intake pipe and the exhaust pipe of the second cylinder, respectively adjusting the driving speed of the second cylinder driving the support component 1 to rise and fall; and / or, the second pressure regulating component may include a third pressure regulating component and a fourth pressure regulating component, the third pressure regulating component and the fourth pressure regulating component are used to be respectively arranged on the intake pipe and the exhaust pipe of the second cylinder, respectively adjusting the driving pressure of the second cylinder driving the support component 1 to rise and fall.

[0050] Optionally, the first speed regulating component may include a first speed regulating valve; and / or, the second speed regulating component may include a second speed regulating valve; and / or, the third speed regulating component may include a third speed regulating valve; and / or, the fourth speed regulating component may include a fourth speed regulating valve; and / or, the first pressure regulating component may include a first pressure regulating valve; and / or, the second pressure regulating component may include a second pressure regulating valve; and / or, the third pressure regulating component may include a third pressure regulating valve; and / or, the fourth pressure regulating component may include a fourth pressure regulating valve.

[0051] like Figure 2 and Figure 3 As shown, in a preferred embodiment of the present invention, a first positioning component 41 is provided on the first cylinder for detecting the position of the first cylinder driving the support component 1 to rise and fall; and / or, a second positioning component 42 is provided on the second cylinder for detecting the position of the second cylinder driving the first cylinder to rise and fall.

[0052] By means of the first positioning component 41 and the second positioning component 42, the position of the first cylinder driving the support component 1 to rise and fall and the position of the second cylinder driving the first cylinder to rise and fall are detected respectively, so as to determine whether the first cylinder driving the support component 1 and the second cylinder driving the first cylinder to rise and fall have reached the preset position, thereby improving the stability of wafer lifting. In addition, by means of the first positioning component 41, the position of the first cylinder driving the support component 1 to rise and fall is detected, and it is also possible to determine whether the first drive component can drive the support component 1 to separate the wafer adsorbed and carried on the electrostatic chuck 102 from the electrostatic chuck 102. For example, the separation time can be preset, that is, the position where the first drive component 2 drives the support component 1 to rise to support the wafer and separate the wafer from the electrostatic chuck 102 can be used as the preset position, and the time for the first drive component 2 to drive the support component 1 to rise to the preset position can be pre-set. If within the preset separation time, the first positioning component 41 has not detected that the first cylinder driving the support component 1 to rise to the preset position, it can be determined that the first drive component cannot drive the support component 1 to adsorb the wafer. When the wafer attached to the electrostatic chuck 102 is separated from the electrostatic chuck 102, the Coulomb force between the wafer and the electrostatic chuck 102 can be eliminated again, or the wafer and the electrostatic chuck 102 can be manually inspected and the Coulomb force between the wafer and the electrostatic chuck 102 can be eliminated. If within the preset separation time, the first positioning component 41 detects that the first cylinder drives the support component 1 to rise to the preset position, it can be determined that the first driving component is able to drive the support component 1 to separate the wafer adsorbed on the electrostatic chuck 102 from the electrostatic chuck 102, and the second driving component 3 can be controlled to drive the first driving component 2 to rise, so as to drive the support component 1 to rise, thereby further improving the stability of the wafer lifting and lowering, and further improving the stability of the semiconductor process.

[0053] Optionally, if the first positioning component 41 has not detected that the first cylinder drives the support component 1 to rise to the preset position within the preset separation time, the first positioning component 41 can send a wafer sticking alarm to the machine system. After receiving the wafer sticking alarm, the machine system can control the first cylinder or the second cylinder to drive the support component 1 to descend, so that the three ejector pins 115 of the support component 1 are separated from the wafer adsorbed and carried on the electrostatic chuck 102, and the Coulomb force between the wafer and the electrostatic chuck 102 is eliminated again, and then the first cylinder is controlled again to directly drive the support component 1 to rise, so that the three ejector pins 115 of the support component 1 contact with the wafer adsorbed and carried on the electrostatic chuck 102 with a smaller pressure, and the wafer is The circle is supported. If within the preset separation time, the first positioning component 41 still fails to detect that the first cylinder drives the supporting component 1 to rise to the preset position, the first positioning component 41 may send a wafer sticking alarm to the machine system again. After receiving the wafer sticking alarm again, the machine system may prompt a wafer sticking alarm. At this time, the wafer and the electrostatic chuck 102 may be manually checked, and the Coulomb force between the wafer and the electrostatic chuck 102 may be eliminated. Then, the first cylinder may be controlled again to directly drive the supporting component 1 to rise, so that the three ejector pins 115 of the supporting component 1 contact the wafer adsorbed and carried on the electrostatic chuck 102 with a small pressure, support the wafer, and separate the wafer from the electrostatic chuck 102.

[0054] like Figure 2 and Figure 3 As shown, in a preferred embodiment of the present invention, the first positioning component 41 may include: a first magnetic component, a first electromagnetic sensing component 411 and a second electromagnetic sensing component 412, the first magnetic component is arranged in the cylinder body of the first cylinder, and can be raised and lowered synchronously with the first cylinder driving the support component 1 to rise and fall, the first electromagnetic sensing component 411 and the second electromagnetic sensing component 412 are both arranged on the cylinder body of the first cylinder, and are spaced apart in the direction in which the first cylinder drives the support component 1 to rise and fall; and / or, the second positioning component 42 may include: a second magnetic component, a third electromagnetic sensing component 421 and a fourth electromagnetic sensing component 422, the second magnetic component is arranged in the cylinder body of the second cylinder, and can be raised and lowered synchronously with the second cylinder driving the first cylinder to rise and fall, the third electromagnetic sensing component 421 and the fourth electromagnetic sensing component 422 are both arranged on the cylinder body of the second cylinder, and are spaced apart in the direction in which the second cylinder drives the first cylinder to rise and fall.

[0055] For example, the first magnetic component can be arranged on the piston in the cylinder body of the first cylinder, so that it can be raised and lowered synchronously with the first cylinder driving the support assembly 1 to rise and fall. When the first magnetic component is lifted to the position of the first electromagnetic sensing component 411 or the second electromagnetic sensing component 412, the first electromagnetic sensing component 411 or the second electromagnetic sensing component 412 can detect the position of the first cylinder driving the support assembly 1 to rise and fall through the first magnetic component. Similarly, the second magnetic component can be arranged on the piston in the cylinder body of the second cylinder, so that it can be raised and lowered synchronously with the second cylinder driving the support assembly 1 to rise and fall. When the second magnetic component is lifted to the position of the third electromagnetic sensing component 421 or the fourth electromagnetic sensing component 422, the third electromagnetic sensing component 421 or the fourth electromagnetic sensing component 422 can detect the position of the second cylinder driving the support assembly 1 to rise and fall through the second magnetic component.

[0056] Optionally, the first magnetic member may include a first magnetic ring, and the second magnetic member may include a second magnetic ring.

[0057] Optionally, the first electromagnetic sensing component 411 may include a first electromagnetic sensor, the second electromagnetic sensing component 412 may include a second electromagnetic sensor, the third electromagnetic sensing component 421 may include a third electromagnetic sensor, and the fourth electromagnetic sensing component 422 may include a fourth electromagnetic sensor.

[0058] like Figure 1 As shown, in a preferred embodiment of the present invention, the wafer lifting device may also include a first flange 51 and a first screw 52, ​​and a first threaded hole may be provided at the end of the output shaft 31 of the second cylinder, wherein the first flange 51 is connected to the bottom of the cylinder body of the first cylinder, and a first fixing hole is provided in the first flange 51, and the first screw 52 is fixed in the first fixing hole and threadedly connected to the first threaded hole.

[0059] The first screw 52 is fixed in the first fixing hole so that the first screw 52 is connected to the first flange 51, and thus connected to the first cylinder through the first flange 51; the first screw 52 is threadedly connected to the first threaded hole at the end of the output shaft 31 of the second cylinder so that the first screw 52 is connected to the second cylinder, and then the second cylinder is connected to the first cylinder through the first flange 51 and the first screw 52, ​​and a detachable connection is achieved between the second cylinder and the first cylinder, thereby improving the use flexibility of the wafer lifting device.

[0060] Optionally, the wafer lifting device may also include multiple second screws, a plurality of through holes may be arranged on the circumference of the first flange 51, a plurality of second threaded holes may be arranged on the bottom of the cylinder body of the first cylinder, and the multiple second screws pass through the multiple through holes one by one and are threadably connected with the multiple second threaded holes one by one, thereby realizing a detachable connection between the first flange 51 and the first cylinder, thereby improving the use flexibility of the wafer lifting device.

[0061] In a preferred embodiment of the present invention, the wafer lifting device may also include a connecting frame 6, the top of the connecting frame 6 is fixedly arranged on the bottom of the base 10, and the bottom of the connecting frame 6 is fixedly connected to the cylinder body of the second cylinder; the connecting frame 6 is sleeved on the outside of the first cylinder, and the first cylinder and the connecting frame 6 are slidably matched.

[0062] Optionally, the bottom of the connecting frame 6 can be fixedly connected to the cylinder body of the second cylinder by screws, and the top can be fixedly set on the bottom of the seat body 101 by screws, so that the connecting frame 6 can be detachably connected to the second cylinder and the base 10 respectively, and then the second cylinder can be detachably connected to the base 10, thereby improving the flexibility of use of the wafer lifting device.

[0063] like Figure 1-Figure 3 and Figure 5 As shown, in a preferred embodiment of the present invention, a limit plate 7 is provided in the connecting frame 6, and the limit plate 7 is arranged in the connecting frame 6 in a position-adjustable manner; the support assembly 1 may include a pin assembly 11 and a transmission rod 12, the transmission rod 12 is passed through the limit plate 7, the top end of the transmission rod 12 is connected to the pin assembly 11, and the bottom end of the transmission rod 12 is connected to the output shaft 21 of the first cylinder, and a limit boss 121 is provided on the transmission rod 12, and the limit boss 121 is located between the limit plate 7 and the bottom end of the transmission rod 12, and the limit boss 121 is used to limit the top limit position of the pin assembly 11.

[0064] That is to say, the first cylinder or the second cylinder can drive the transmission rod 12 to rise and fall, thereby driving the ejector assembly 11 to rise and fall, so as to support the wafer by means of the ejector assembly 11 contacting with the wafer. In the process of the first cylinder or the second cylinder driving the transmission rod 12 to rise and fall, when the first cylinder or the second cylinder drives the support assembly 1 to rise to a position exceeding the preset position, the limiting boss 121 on the transmission rod 12 will abut against the limiting plate 7 provided in the connecting frame 6, thereby limiting the transmission rod 12 from continuing to rise by means of the limiting plate 7, and then limiting the ejector assembly 1 from continuing to rise, thereby preventing the first cylinder or the second cylinder from driving the support assembly 1 to rise to a position exceeding the preset position. By adjusting the position of the limiting plate 7 in the connecting frame 6 in the direction in which the first cylinder and the second cylinder drive the support assembly 1 to rise and fall, the position in which the limiting boss 121 abuts against the limiting plate 7 can be changed, thereby changing the position in which the limiting plate 7 limits the rise of the first cylinder and the second cylinder drive the support assembly 1, thereby improving the use flexibility of the wafer lifting device.

[0065] like Figure 1-Figure 3As shown, in a preferred embodiment of the present invention, the wafer lifting device may also include an adapter 8, the bottom end of the transmission rod 12 is provided with an external thread, the output shaft 21 of the first cylinder is provided with an external thread, and threaded holes are provided at both ends of the adapter 8. The threaded hole at one end of the adapter 8 is threadedly connected to the external thread at the bottom end of the transmission rod 12, and the threaded hole at the other end is threadedly connected to the external thread of the output shaft 21 of the first cylinder, thereby realizing a detachable connection between the first cylinder and the support assembly 1, thereby improving the use flexibility of the wafer lifting device.

[0066] like Figure 6 As shown, an embodiment of the present invention further provides a process chamber 20, including a cavity 201, a base 10 and a wafer lifting device as provided in an embodiment of the present invention. The base 10 is arranged in the cavity 201 for carrying a wafer, and the wafer lifting device is arranged at the bottom of the base 10 to lift the wafer.

[0067] The process chamber 20 provided in the embodiment of the present invention can improve the stability and flexibility of wafer lifting by lifting the wafer with the help of the wafer lifting device provided in the embodiment of the present invention, thereby improving the stability and flexibility of the semiconductor process.

[0068] In summary, the wafer lifting device and the process chamber 20 provided in the embodiment of the present invention can improve the stability and flexibility of wafer lifting, thereby improving the stability and flexibility of semiconductor processes.

[0069] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A wafer lifting device, used in a process chamber, characterized in that: It comprises a supporting assembly, a first driving component and a second driving component, wherein the supporting assembly is used to be lifted and lowered in a base of the process chamber to lift and lower a wafer on the base; The driving end of the first driving component is connected to the supporting assembly, and is used to directly drive the supporting assembly to rise and fall. The driving end of the second driving component is connected to the fixed end of the first driving component, and is used to drive the supporting assembly to rise and fall by driving the first driving component to rise and fall. The driving speed and driving pressure of the first driving component and the second driving component are different. The first driving component includes a first cylinder, the second driving component includes a second cylinder, and the driving speed and driving pressure of the first cylinder are respectively smaller than the driving speed and driving pressure of the second cylinder; The wafer lifting device further includes a first speed regulating component and a first pressure regulating component, wherein the first speed regulating component is arranged on the air intake pipeline and the exhaust pipeline of the first cylinder to respectively regulate the driving speed of the first cylinder driving the support component to rise and fall, and the first pressure regulating component is arranged on the air intake pipeline and the exhaust pipeline of the first cylinder to respectively regulate the driving pressure of the first cylinder driving the support component to rise and fall; and / or, The wafer lifting device also includes a second speed regulating component and a second pressure regulating component. The second speed regulating component is used to be arranged on the intake pipe and the exhaust pipe of the second cylinder to respectively adjust the driving speed of the second cylinder driving the support component to rise and fall. The second pressure regulating component is used to be arranged on the intake pipe and the exhaust pipe of the second cylinder to respectively adjust the driving pressure of the second cylinder driving the support component to rise and fall.

2. The wafer lifting device according to claim 1, characterized in that: The driving speed of the first cylinder is 0.5m / s-1m / s, and the driving pressure is 0.1MPa-0.2MPa. The driving speed of the second cylinder is 3.5m / s-4m / s, and the driving pressure is 0.3MPa-0.4MPa.

3. The wafer lifting device according to claim 1, characterized in that: The first cylinder is provided with a first positioning component for detecting the position of the support component driven by the first cylinder to rise and fall; and / or, The second cylinder is provided with a second positioning component for detecting the position of the first cylinder driven by the second cylinder to rise and fall.

4. The wafer lifting device according to claim 3, characterized in that: The first positioning assembly comprises: a first magnetic member, a first electromagnetic sensing component and a second electromagnetic sensing component, the first magnetic member is arranged in the cylinder body of the first cylinder, and can be raised and lowered synchronously with the first cylinder driving the supporting assembly to be raised and lowered, the first electromagnetic sensing component and the second electromagnetic sensing component are both arranged on the cylinder body of the first cylinder, and are spaced apart in the direction in which the first cylinder drives the supporting assembly to be raised and lowered; and / or, The second positioning component includes: a second magnetic part, a third electromagnetic sensing component and a fourth electromagnetic sensing component. The second magnetic part is arranged in the cylinder body of the second cylinder and can be raised and lowered synchronously with the second cylinder driving the first cylinder to rise and fall. The second electromagnetic sensing component and the fourth electromagnetic sensing component are both arranged on the cylinder body of the second cylinder and are spaced apart in the direction in which the second cylinder drives the first cylinder to rise and fall.

5. The wafer lifting device according to claim 1, characterized in that: The wafer lifting device also includes a first flange and a first screw. A first threaded hole is provided at the end of the output shaft of the second cylinder, wherein the first flange is connected to the bottom of the cylinder body of the first cylinder, a first fixing hole is provided in the first flange, and the first screw is fixed in the first fixing hole and threadedly connected to the first threaded hole.

6. The wafer lifting device according to claim 1, characterized in that: The wafer lifting device further comprises a connecting frame, the top of which is fixedly arranged on the bottom of the base, and the bottom of which is fixedly connected to the cylinder body of the second cylinder; The connecting frame is sleeved on the outside of the first cylinder, and the first cylinder is slidably matched with the connecting frame.

7. The wafer lifting device according to claim 6, characterized in that: A limit plate is provided in the connection frame, and the limit plate is arranged in the connection frame in a position-adjustable manner; The support assembly includes a transmission rod and an ejector assembly, the transmission rod is inserted into the limiting plate, the top end of the transmission rod is connected to the ejector assembly, the bottom end of the transmission rod is connected to the output shaft of the first cylinder, a limiting boss is provided on the transmission rod, the limiting boss is located between the limiting plate and the bottom end of the transmission rod, and the limiting boss is used to limit the top limit position of the ejector assembly.

8. A process chamber, characterized in that: It comprises a cavity, a base and a wafer lifting device as described in any one of claims 1 to 7, wherein the base is arranged in the cavity for carrying a wafer, and the wafer lifting device is arranged at the bottom of the base for lifting the wafer.

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