Electronic device, power module, and electronic apparatus

Abstract

The application provides an electronic device, a power module and an electronic equipment. The electronic device comprises a circuit board assembly, a first magnetic core, a second magnetic core, a first heat dissipation member and a first heat conduction member. The circuit board assembly comprises a first circuit board and a second circuit board, and the first circuit board and the second circuit board are arranged in a laminated mode and electrically connected. The first magnetic core comprises a first main body, the first magnetic core is arranged on the second circuit board, and the first main body is located on a side of the second circuit board away from the first circuit board. The second magnetic core comprises a second main body, the second magnetic core is arranged on the first circuit board, the second main body is located on a side of the first circuit board away from the second circuit board, and the second magnetic core is fixedly connected with the first magnetic core. The first heat dissipation member is located between the first main body and the second circuit board and in contact with the first main body and the second circuit board. The first heat conduction member is located between the second main body and the first circuit board and in contact with the second main body and the first circuit board. The circuit board assembly is cooled from both sides by the first heat dissipation member and the first heat conduction member.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electrical equipment, in particular to an electronic device, a power module and an electronic equipment. BACKGROUND

[0002] The planar transformer is a transformer with windings arranged on a circuit board to realize planarization of the windings. On the one hand, the planar transformer greatly reduces high-frequency parasitic parameters due to its special planar structure and the close coupling of the windings. On the other hand, the planar transformer eliminates the winding skeleton, increases the current density, and the highest current density can reach 20A / mm. The planar transformer has the advantages of small size, high frequency, and small height. With the development of electronic equipment towards small size, high power density and high efficiency, the planar transformer is widely used in electronic equipment. However, due to the aggregation of the windings on the circuit board, the heat dissipation density of the circuit board is large, and the circuit board has the problem of insufficient heat dissipation. SUMMARY

[0003] The present application provides an electronic device, a power module and an electronic equipment, which aims to solve the problem of insufficient heat dissipation of the circuit board caused by the aggregation of the windings on the circuit board.

[0004] In a first aspect, an electronic device is provided by the embodiments of the present application and is applied to a power module. The electronic device comprises a circuit board assembly, a first magnetic core, a second magnetic core, a first heat dissipation member and a first heat conduction member. The circuit board assembly comprises a first circuit board and a second circuit board, and the first circuit board and the second circuit board are arranged in a stack and are electrically connected. The first magnetic core comprises a first main body, the first magnetic core is mounted on the second circuit board, and the first main body is located on a side of the second circuit board facing away from the first circuit board. The second magnetic core comprises a second main body, the second magnetic core is mounted on the first circuit board, the second main body is located on a side of the first circuit board facing away from the second circuit board, and the second magnetic core is fixedly connected with the first magnetic core. The first heat dissipation member is located between the first main body and the second circuit board and is in contact with the first main body and the second circuit board. The first heat conduction member is located between the second main body and the first circuit board and is in contact with the second main body and the first circuit board.

[0005] The electronic device of the embodiments of the present application sets a heat dissipation member between the first main body of the first magnetic core and the second circuit board of the circuit board assembly, and sets a heat conduction member between the second main body of the second magnetic core and the first circuit board of the circuit board assembly. When the electronic device is working, a large amount of heat generated when the circuit board assembly and the first magnetic core are working can be absorbed by the first heat dissipation member and conducted to the outside; a large amount of heat generated when the circuit board assembly and the second magnetic core are working can be absorbed by the first heat conduction member and conducted to the outside, so as to ensure the rapid heat dissipation of the circuit board assembly, the first magnetic core and the second magnetic core, avoid the performance damage of the circuit board assembly, the first magnetic core and the second magnetic core due to heat aggregation, prolong the service life of the circuit board assembly, the first magnetic core and the second magnetic core, and further prolong the service life of the electronic device.

[0006] Compared with the prior art, the electronic device of the embodiment of the application can quickly dissipate heat through the first heat dissipation member and the first heat conduction member on both sides of the circuit board assembly, solve the problem that the circuit board assembly is not convenient to dissipate heat, effectively increase the heat dissipation area, and have better heat dissipation effect, which is conducive to the miniaturization design and high power density design of the electronic device, and further conducive to the miniaturization design and high power density design of the power module using the electronic device.

[0007] In an embodiment, the second main body comprises a first end face, the first end face is concavely provided with a first groove, the first groove has an opening on the first end face, and the first heat conduction member is located on the first end face.

[0008] Since the first heat conduction member will expand after being heated, when the electronic device works, the first heat conduction member will expand and partially extrude into the first groove, effectively dispersing the expansion stress generated when the first heat conduction member is heated, avoiding the first heat conduction member expanding and abutting against the second magnetic core to damage the second magnetic core; moreover, the design of the first groove can avoid leaving a gap between the second magnetic core and the first heat conduction member, which is conducive to the flattening of the electronic device and facilitates the miniaturization design of the electronic device.

[0009] In an embodiment, the first heat conduction members are spaced apart by the first grooves; or, the first heat conduction members cover the first grooves.

[0010] In an embodiment, the first heat conduction member bonds the first end face and the surface of the first circuit board.

[0011] Since the first heat conduction member has adhesion, the second magnetic core is fixedly connected to the first circuit board of the circuit board assembly through the adhesion of the first heat conduction member, and the structural stability of the electronic device is enhanced.

[0012] In an embodiment, the first heat conduction member is a colloid, and the first heat conduction member is filled between the first end face and the surface of the first circuit board.

[0013] Since the first heat conduction member is a colloid and is filled between the first end face and the surface of the first circuit board, it is ensured that the first heat conduction member is in complete contact with the first end face and the surface of the first circuit board, i.e., there is no gap between the first heat conduction member and the first end face and the surface of the first circuit board, and it is ensured that the first heat conduction member has a large contact area with the first end face and the surface of the first circuit board, which is conducive to improving the heat dissipation efficiency of the circuit board assembly and the second magnetic core.

[0014] In an embodiment, the first heat conduction member is a compression material, and the first heat conduction member is clamped between the first end face and the surface of the first circuit board.

[0015] Since the first heat-conducting member is a compressible material, it is easy to compress and deform, ensuring that the first heat-conducting member is in complete contact with the surface of the first end face and the first circuit board, i.e. there is no gap between the first heat-conducting member and the surface of the first end face and the first circuit board, and the first heat-conducting member has a large contact area with the surface of the first end face and the first circuit board, which is conducive to improving the heat dissipation efficiency of the circuit board assembly and the second magnetic core. In addition, the first heat-conducting member has a small elastic force after deformation, which avoids affecting the second magnetic core and the first circuit board.

[0016] In an embodiment, the first heat-conducting member has a thermal expansion coefficient between the thermal expansion coefficients of the first magnetic core and the first circuit board.

[0017] In this way, when the first heat-conducting member expands due to heat, the thermal stress between the first heat-conducting member and the second magnetic core is reduced, and the thermal stress between the first heat-conducting member and the first circuit board is reduced, avoiding damage to the second magnetic core and the first circuit board caused by the first heat-conducting member after being heated, and improving the strength of the fixed connection between the first heat-conducting member and the second magnetic core and the first circuit board.

[0018] In an embodiment, the first heat-conducting member has a thermal expansion coefficient between the thermal expansion coefficients of the first magnetic core and the first circuit board.

[0019] In an embodiment, the first heat-conducting member is spaced to form two first sub-heat-conducting members at the first recess, and the two first sub-heat-conducting members are arranged on the first end face on both sides of the first recess, respectively.

[0020] In an embodiment, the second magnetic core further comprises a first fixing body and a second fixing body, the first fixing body and the second fixing body are protrudingly arranged on the first end face and are spaced apart, and the first recess and the first heat-conducting member are arranged on the first end face between the first fixing body and the second fixing body.

[0021] The first heat-conducting member can be limited by the first fixing body and the second fixing body. When the first heat-conducting member is a gel, the limitation of the first heat-conducting member by the first fixing body and the second fixing body ensures that the first heat-conducting member can be formed and filled between the first end face and the first circuit board. When the first heat-conducting member is a compressible material, the limitation of the first heat-conducting member by the first fixing body and the second fixing body facilitates the installation of the first heat-conducting member between the first end face and the first circuit board, reduces the assembly difficulty, and reduces the assembly time.

[0022] In an embodiment, the first heat-conducting member completely covers the first end face between the first fixing body and the second fixing body.

[0023] Since the first heat-conducting member completely covers the first end surface between the first fixed body and the second fixed body, the first heat-conducting member and the first circuit board of the circuit board assembly each have a larger contact area, which is conducive to the rapid heat dissipation of the second magnetic core and the circuit board assembly, and further improves the heat dissipation efficiency.

[0024] In an embodiment, the first fixed body and the second fixed body have a height greater than the thickness of the first heat-conducting member, and the first circuit board is provided with a first through hole and a second through hole, the first fixed body is inserted into the first through hole, and the second fixed body is inserted into the second through hole.

[0025] Through the cooperation of the first fixed body and the first through hole and the cooperation of the second fixed body and the second through hole, the second magnetic core can be inserted into the first circuit board, so that the first heat-conducting member is laminated on the first end surface between the first fixed body and the second fixed body and is in contact with the first circuit board. Moreover, since the first fixed body and the second fixed body have a height greater than the thickness of the first heat-conducting member, the first heat-conducting member can be prevented from interfering with the insertion of the second magnetic core into the first circuit board.

[0026] In an embodiment, the first recess has a cross-sectional shape of a rectangle, a triangle, an arc-shaped protrusion, or a trapezoid.

[0027] In an embodiment, the electronic device further comprises a second heat-conducting member, which is located on the first end surface of the side of the first fixed body away from the second fixed body and is in contact with the first circuit board.

[0028] The second heat-conducting member can absorb a large amount of heat generated by the circuit board assembly and the second magnetic core during operation and conduct the heat to the outside, effectively increasing the heat dissipation area and improving the heat dissipation effect, further ensuring the rapid heat dissipation of the circuit board assembly and the second magnetic core, avoiding damage to the performance of the circuit board assembly and the second magnetic core due to heat accumulation, prolonging the service life of the circuit board assembly and the second magnetic core, and further prolonging the service life of the electronic device. This is conducive to the miniaturization design and high-power-density design of the electronic device, and further conducive to the miniaturization design and high-power-density design of the power module using the electronic device.

[0029] In an embodiment, the second heat-conducting member bonds the first end surface and the surface of the first circuit board.

[0030] Since the second heat-conducting member has adhesion, the second magnetic core is fixedly connected to the first circuit board of the circuit board assembly through the adhesion of the second heat-conducting member, and the structural stability of the electronic device is strengthened.

[0031] In an embodiment, the second heat-conducting member is a colloid, and the second heat-conducting member is filled between the first end surface and the surface of the first circuit board.

[0032] Since the second heat-conducting member is a colloid and is filled between the first end face and the surface of the first circuit board, the second heat-conducting member is guaranteed to be in complete contact with the first end face and the surface of the first circuit board, i.e. there is no gap between the second heat-conducting member and the first end face and the surface of the first circuit board, and the second heat-conducting member has a large contact area with the first end face and the surface of the first circuit board, which is conducive to improving the heat dissipation efficiency of the circuit board assembly and the second magnetic core.

[0033] In an embodiment, the second heat-conducting member is a compressed material, and the second heat-conducting member is clamped between the first end face and the surface of the first circuit board.

[0034] Since the second heat-conducting member is a compressed material and is easy to compress and deform, the second heat-conducting member is guaranteed to be in complete contact with the first end face and the surface of the first circuit board, i.e. there is no gap between the second heat-conducting member and the first end face and the surface of the first circuit board, and the second heat-conducting member has a large contact area with the first end face and the surface of the first circuit board, which is conducive to improving the heat dissipation efficiency of the circuit board assembly and the second magnetic core. In addition, the second heat-conducting member has a small elastic force after deformation, which avoids affecting the second magnetic core and the first circuit board.

[0035] In an embodiment, the second heat-conducting member has a thermal expansion coefficient between the thermal expansion coefficients of the first magnetic core and the first circuit board.

[0036] In this way, when the second heat-conducting member expands due to heat, the thermal stress between the second heat-conducting member and the second magnetic core is reduced, and the thermal stress between the second heat-conducting member and the first circuit board is reduced, which avoids damaging the second magnetic core and the first circuit board after the second heat-conducting member is heated, and improves the strength of the fixed connection between the second heat-conducting member and the second magnetic core and the first circuit board.

[0037] In an embodiment, the second main body of the second magnetic core further has a second recess, the second recess has an opening located at the first end face, and the second heat-conducting member is spaced apart by the second recess; or the second heat-conducting member covers the second recess.

[0038] Since the second heat-conducting member expands after being heated, when the electronic device is working, the second heat-conducting member expands and partially extrudes into the second recess, effectively dispersing the expansion stress generated when the second heat-conducting member is heated, avoiding the second heat-conducting member expanding and abutting against the second magnetic core to damage the second magnetic core. Moreover, the design of the second recess avoids leaving a gap between the second magnetic core and the first heat-conducting member, which is conducive to the flattening of the electronic device and facilitates the miniaturization design of the electronic device.

[0039] In one embodiment, the second magnetic core further comprises a third fixed body, the third fixed body protrudes from the first end surface and is spaced apart from the first fixed body, and is located on the side of the first fixed body away from the second fixed body, the first circuit board is provided with a third through hole, and the third fixed body is inserted into the third through hole, and the second heat-conducting member and the second groove are located on the first end surface between the first fixed body and the third fixed body.

[0040] The first fixed body and the third fixed body can limit the second heat-conducting member. When the second heat-conducting member is a gel, the limitation of the first fixed body and the third fixed body on the second heat-conducting member ensures that the second heat-conducting member can be formed and filled between the first end surface and the first circuit board. When the second heat-conducting member is a compression material, the limitation of the first fixed body and the third fixed body on the first heat-conducting member facilitates the installation of the second heat-conducting member between the first end surface and the first circuit board, reduces the assembly difficulty, and reduces the assembly time.

[0041] In one embodiment, the number of second grooves is a plurality, the plurality of second grooves are sequentially spaced apart, and the number of second heat-conducting members is a plurality, each second heat-conducting member is arranged on the first end surface between each adjacent two second grooves.

[0042] In one embodiment, the second heat-conducting member is spaced apart into two second sub-heat-conducting members at the second groove, and the two second sub-heat-conducting members are arranged on the first end surface on both sides of the second groove, respectively.

[0043] In one embodiment, the second heat-conducting member completely covers the first end surface between the first fixed body and the third fixed body.

[0044] Since the second heat-conducting member completely covers the first end surface between the first fixed body and the third fixed body, the second heat-conducting member has a larger contact area with the second magnetic core and the first circuit board of the circuit board assembly, which is beneficial to the rapid heat dissipation of the second magnetic core and the circuit board assembly, and further improves the heat dissipation efficiency.

[0045] In one embodiment, the cross-sectional shape of the second groove is rectangular, triangular, arc-shaped protrusion or trapezoidal.

[0046] In one embodiment, the first main body of the first magnetic core comprises a first surface, the first magnetic core further comprises a first connecting body and a second connecting body, the first connecting body and the second connecting body protrude from the first surface and are spaced apart, and the first heat-conducting member is located on the first surface between the first connecting body and the second connecting body.

[0047] The first connecting body and the second connecting body can limit the first heat-conducting member. When the first heat-conducting member is a gel, the limitation of the first connecting body and the second connecting body on the first heat-conducting member ensures that the first heat-conducting member can be formed and filled between the first surface and the first circuit board.

[0048] In one embodiment, the second circuit board is provided with a first docking hole and a second docking hole, the first docking hole corresponds to the first through hole, and the second docking hole corresponds to the second through hole; the first connecting body is fixedly connected with the first fixing body by being inserted into the first docking hole; and the second connecting body is fixedly connected with the second fixing body by being inserted into the second docking hole.

[0049] Since the first docking hole corresponds to the first through hole, and the second docking hole corresponds to the second through hole, the first docking hole is in communication with the first through hole, and the second docking hole is in communication with the second through hole, so that the first connecting body inserted into the first docking hole can be in contact with the first fixing body inserted into the first through hole to be fixedly connected, and the second connecting body inserted into the second docking hole can be in contact with the second fixing body inserted into the second through hole to be fixedly connected, thereby simplifying the structure and reducing the processing and design costs.

[0050] In one embodiment, the electronic device further comprises a first adhesive and a second adhesive, the first connecting body is fixedly connected with the first fixing body by the first adhesive, and the second connecting body is fixedly connected with the second fixing body by the second adhesive.

[0051] The first adhesive is located between the first connecting body and the first fixing body and is in contact with the surface of the first connecting body and the surface of the first fixing body, respectively. The second adhesive is located between the second connecting body and the second fixing body and is in contact with the surface of the second connecting body and the surface of the second fixing body, respectively. Since the first adhesive and the second adhesive have adhesion, the first connecting body is fixedly connected with the first fixing body by the first adhesive, and the second connecting body is fixedly connected with the second fixing body by the second adhesive, thereby stabilizing the connection, simplifying the structure, reducing the cost, and improving the overall structural stability of the electronic device.

[0052] In one embodiment, the first magnetic core further comprises a third connecting body, the third connecting body is protruded from the first surface and is spaced apart from the first connecting body and located on the side of the first connecting body away from the second connecting body, and the electronic device further comprises a second heat dissipation member, the second heat dissipation member is located on the first surface between the first connecting body and the third connecting body.

[0053] The second heat dissipation member can be limited by the first connecting body and the third connecting body. When the second heat dissipation member is a colloid, the limitation of the second heat dissipation member by the first connecting body and the third connecting body ensures that the second heat dissipation member can be formed and filled between the first surface and the first circuit board.

[0054] In one embodiment, the electronic device further comprises a third adhesive, the second circuit board is provided with a third docking hole, the third docking hole corresponds to the third through hole, the third connecting body is inserted into the third docking hole and fixedly connected with the third fixing body by the third adhesive.

[0055] The third adhesive is located between the third connecting body and the third fixed body, and is in contact with the surface of the third connecting body and the surface of the third fixed body respectively. Since the third adhesive has adhesion, the third connecting body is fixedly connected with the third fixed body through the third adhesive, the connection is stable, the structure is simple, the cost is low, and the overall structural stability of the electronic device is improved.

[0056] In an embodiment, the first heat dissipation member and / or the second heat dissipation member has adhesion.

[0057] Through the adhesion of the first heat dissipation member and / or the second heat dissipation member, the first magnetic core is fixedly connected with the second circuit board, the connection is stable, the structure is simple, the cost is low, and the overall structural stability of the electronic device is improved.

[0058] In an embodiment, the circuit board assembly further comprises a first winding and a second winding, the first winding is arranged on the first circuit board and electrically connected with the first circuit board, the second winding is arranged on the second circuit board and electrically connected with the second circuit board, and the first winding is coupled with the second winding; wherein the first winding surrounds the first through hole, and the second winding surrounds the first butt joint through hole.

[0059] The electronic device realizes the function of voltage transformation through the coupling of the first winding and the second winding.

[0060] In a second aspect, the embodiments of the present application provide a power supply module, comprising the electronic device of any one of the first aspect and the shell, the electronic device is accommodated in the interior of the shell, and the electronic device is used for voltage transformation processing of alternating current.

[0061] In a third aspect, the embodiments of the present application provide an electronic device, comprising the power supply module of the second aspect and the load module, the power supply module is electrically connected with the load module. BRIEF DESCRIPTION OF DRAWINGS

[0062] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the drawings needed to be used in the embodiments of the present application or the background art will be described below.

[0063] Figure 1 is a structural block diagram of an electronic device provided by the embodiments of the present application;

[0064] Figure 2 is a perspective structural schematic diagram of an electronic device provided by an embodiment of the present application;

[0065] Figure 3 is Figure 2 is a sectional view of the electronic device in along III-III line in

[0066] Figure 4 is Figure 2Structure exploded schematic view of the electronic device in FIG. 1 along the line III-III of the sectional view;

[0067] Figure 5 is Figure 2 Schematic view of the electronic device in FIG. 1;

[0068] Figure 6 is Figure 5 Schematic view of the electronic device in FIG. 1;

[0069] Figure 7 is Figure 5 Schematic view of the electronic device in FIG. 1;

[0070] Figure 8 is Figure 2 Schematic view of the electronic device in FIG. 1;

[0071] Figure 9 is Figure 2 Schematic view of the electronic device in FIG. 1;

[0072] Figure 10 is Figure 1 Schematic view of the electronic device in FIG. 1;

[0073] Figure 11 is Figure 10 Schematic view of the electronic device in FIG. 1;

[0074] Figure 12 is Figure 11 Schematic view of the electronic device in FIG. 1;

[0075] Figure 13 is Figure 11 Schematic view of the electronic device in FIG. 1;

[0076] Figure 14 is Figure 11 Schematic view of the electronic device in FIG. 1;

[0077] Figure 15 is Figure 11 Schematic view of the electronic device in FIG. 1;

[0078] Figure 16 is Figure 11 Schematic view of the electronic device in FIG. 1;

[0079] Figure 17 is Figure 11 is an enlarged view of another embodiment of the XII part of the second magnetic core in

[0080] Figure 18 is Figure 2 is a perspective structural schematic view of the electronic device in the second embodiment in

[0081] Figure 19 is Figure 18 is a sectional view of the electronic device along the line XX-XX in

[0082] Figure 20 is Figure 18 is a structural exploded schematic view of the sectional view of the electronic device along the line XX-XX in DETAILED DESCRIPTION

[0083] The electronic device provided by the embodiments of the present application is applied to a power module. The power module is applied to an electronic device. The electronic device can be a planar transformer, a planar inductor, or other electronic components with windings arranged on a circuit board. The planar transformer is a transformer with windings arranged on a circuit board to realize planar windings. In the present application, the connection between component A and component B means that component A is directly connected to component B, or component A is indirectly connected to component B through component C.

[0084] The embodiments of the present application will be described below with reference to the drawings.

[0085] Please refer to Figure 1 , Figure 1 is a structural block diagram of an electronic device 1000 provided by the embodiments of the present application.

[0086] The embodiments of the present application provide an electronic device 1000. The electronic device includes a power module 1000a and a load module 1000b, and the power module 1000a is electrically connected to the load module 1000b. In the present embodiment, the power module 1000a is an AC-AC power module, which is used to perform step-down conversion processing on alternating current. For example, the power module 1000a can convert the 380V alternating current output by an external power source 2000 into 220V alternating current, and output the 220V alternating current to the load module 1000b for the load module 1000b to work. In other embodiments, the power module 1000a can also perform step-up conversion processing on alternating current. The present application does not make any limitation on the external power source 2000 and the load module 1000b. The external power source 2000 can be any device or element capable of outputting alternating current, and the load module 1000b can be any functional module using alternating current, for example, the load module 1000b can be a radio frequency module.

[0087] In other embodiments, the power module 1000a can also be an AC-DC (Direct Current) power module, which is used to convert AC power into DC power; the power module 1000a can also be a DC-DC power module, which is used to transform the DC power; the power module 1000a can also be a DC-AC power module, which is used to convert the DC power into AC power, and the type of the power module 1000a is not limited in the present application. The electronic device can be any electrical device, such as a servo transformer, and the like, and the present application does not make any limitation thereto.

[0088] As shown in Figure 1 , the power module 1000a includes an electronic device 100 and a shell 200, the electronic device 100 is accommodated in the interior of the shell 200 and is electrically connected with an external power source 2000 and a load module 1000b. In the present embodiment, the electronic device 100 is specifically a planar transformer, which is used to perform step-down transformation on the AC power. The AC power output by the external power source 2000 is transmitted to the load module 1000b after being step-down transformed by the electronic device 100, so as to work for the load module 1000b. In addition, since the electronic device 100 is accommodated in the interior of the shell 200, the electronic device 100 is isolated from the outside by the shell 200, and the shell 200 plays a protective role for the electronic device 100, so as to avoid the electrical performance of the electronic device 100 being affected by the outside, to ensure the performance of the electronic device 100, and further ensure the performance of the power module 1000a. It should be noted that the structure of the shell 200 is not limited in the present application.

[0089] In other embodiments, the electronic device 100 can also be used to perform step-up transformation on the AC power, and the present application does not make any limitation thereto. That is, the electronic device 100 can be used to perform voltage transformation (step-up transformation and step-down transformation) on the AC power.

[0090] In other embodiments, the power module 1000a can also only include the electronic device 100, that is, the power module 1000a can also not include the shell 200. The power module 1000a can also include other electronic components electrically connected with the electronic device 100, such as a voltage stabilizing unit, a filter unit, and the like, and the present application does not make any limitation thereto.

[0091] The electronic device 100 of the present embodiment is specifically described as follows.

[0092] Please refer to Figure 2 and Figure 3 , Figure 2 is a perspective structural schematic view of the electronic device 100 provided by an embodiment of the present application;

[0093] Figure 3 is Figure 2A cross-sectional view of electronic device 100 along line III-III.

[0094] This embodiment uses a planar transformer as an example to illustrate the electronic device 100. The electronic device 100 includes a circuit board assembly 10, a first magnetic core 20, a second magnetic core 30, a heat sink 40, an adhesive 50, and a heat-conducting component 60. The first magnetic core 20 is mounted on one side of the circuit board assembly 10. The second magnetic core 30 is disposed opposite to the first magnetic core 20 and is mounted on the other side of the circuit board assembly 10, and is fixedly connected to the first magnetic core 20. The heat sink 40 is located between the first magnetic core 20 and the circuit board assembly 10. The adhesive 50 is located between the first magnetic core 20 and the second magnetic core 30. The heat-conducting component 60 is located between the second magnetic core 30 and the circuit board assembly 10. In this embodiment, the circuit board assembly 10 is used to convert alternating current, and the circuit board assembly 10 is connected to an external power supply 2000 (such as...). Figure 1 The circuit board assembly 10 (shown) is electrically connected to the load module 1000b. The AC power output from the external power supply 2000 is stepped down and converted by the circuit board assembly 10 before being output to the load module 1000b to power the load module 1000b.

[0095] Please refer to the following: Figure 4 , Figure 5 and Figure 6 , Figure 4 yes Figure 2 The exploded view of the electronic device 100 along line III-III. Figure 5 yes Figure 2 An exploded three-dimensional structural diagram of the electronic device 100 in the diagram; Figure 6 yes Figure 5 An exploded three-dimensional structural diagram of the circuit board assembly 10 of the electronic device 100.

[0096] like Figure 3 and Figure 4 The circuit board assembly 10 includes a first circuit board 11, a first winding 12, a second circuit board 13, and a second winding 14. The first winding 12 is disposed on and electrically connected to the first circuit board 11. The second winding 14 is disposed on and electrically connected to the second circuit board 13. The second circuit board 13 and the first circuit board 11 are stacked, and the second winding 14 is coupled to the first winding 12. In this embodiment, the first circuit board 11 and the second circuit board 13 are stacked along a first direction (the Z-axis direction shown in the figure). The first circuit board 11 is located on the side of the second circuit board 13 facing the positive Z-axis direction. A first magnetic core 20 is mounted on the circuit board assembly 10 from the side of the second circuit board 13 away from the first circuit board 11, and a second magnetic core 30 is mounted on the circuit board assembly 10 from the side of the first circuit board 11 away from the second circuit board 13.

[0097] The first winding 12 is connected to the external power supply 2000 (e.g., ...). Figure 1 As shown, the second winding 14 is electrically connected to the load module 1000b. The AC power output from the external power supply 2000 is supplied to the first winding 12. Through the coupling between the first winding 12 and the second winding 14, the second winding 14 outputs AC power that can power the load module 1000b.

[0098] In other embodiments, the circuit board assembly 10 may also include other electronic components, such as chips, inductors, power switching transistors, etc. The electronic components may be mounted on and electrically connected to the first circuit board 11; or they may be mounted on and electrically connected to the second circuit board 13; or other electronic components may be provided on both the first circuit board 11 and the second circuit board 13.

[0099] In this embodiment, the first circuit board 11 is a rectangular plate. The thickness direction of the first circuit board 11 is the first direction (Z-axis direction in the figure) as shown above, the length direction of the first circuit board 11 is the second direction (X-axis direction in the figure), and the width direction of the first circuit board 11 is the third direction (Y-axis direction in the figure).

[0100] The first circuit board 11 includes a first front side 111 and a first back side 112. The first front side 111 and the first back side 112 are disposed opposite to each other. The first circuit board 11 is provided with through holes 113, via holes 114, and through holes 115. The through holes 113, via holes 114, and through holes 115 penetrate the first front side 111 and the first back side 112 of the first circuit board 11. The through holes 113, via holes 114, and through holes 115 are spaced apart and the number is unlimited. The walls of the via holes 114 and through holes 115 are plated with a conductive material. For example, the conductive material is metallic copper. In other embodiments, the conductive material may also be other metals such as aluminum or other materials with conductivity.

[0101] In this embodiment, the number of the through holes 113 is three and they are located at the middle part of the first circuit board 11. The three through holes 113 are respectively a first through hole 1131, a second through hole 1132 and a third through hole 1133. The first through hole 1131, the second through hole 1132 and the third through hole 1133 are all rectangular holes. In the X-axis direction, the first through hole 1131, the second through hole 1132 and the third through hole 1133 are sequentially and evenly distributed, and the second through hole 1132 and the third through hole 1133 are respectively located at the opposite sides of the first through hole 1131. The second through hole 1132 is located at the side of the first through hole 1131 facing the positive direction of the X-axis, and the third through hole 1133 is located at the side of the first through hole 1131 facing the negative direction of the X-axis. Among them, the width dimension of the first through hole 1131 is greater than the width dimension of the second through hole 1132 and the width dimension of the third through hole 1133; the width dimension of the second through hole 1132 is equal to the width dimension of the third through hole 1133. The length dimension of the first through hole 1131, the length dimension of the second through hole 1132 and the length dimension of the third through hole 1133 are equal. In other words, the area of the first through hole 1131 is greater than the area of the second through hole 1132 and the area of the third through hole 1133; the area of the second through hole 1132 is equal to the area of the third through hole 1133. It should be noted that in this embodiment, the width direction of each through hole 113 is the X-axis direction shown above, and the length direction of each through hole 113 is the Y-axis direction shown above. The "area of component A" refers to the area of the projection of component A on the X-Y plane. The description of "area" hereinafter can be understood in the same way.

[0102] In other embodiments, the area of the first through hole 1131 can also be equal to or less than the area of the second through hole 1132 and the third through hole 1133; the area of the second through hole 1132 and the third through hole 1133 can also be unequal. The shapes of the first through hole 1131, the second through hole 1132 and the third through hole 1133 can also be different, and the shapes of the three can be circular holes, triangular holes or special-shaped holes, etc. This application does not limit this. The number of the through holes 113 can also be two or more, such as four, five, etc.

[0103] In this embodiment, the number of the through holes 113 is three and they are located at the middle part of the first circuit board 11. The three through holes 113 are respectively a first through hole 1131, a second through hole 1132 and a third through hole 1133. The first through hole 1131, the second through hole 1132 and the third through hole 1133 are all rectangular holes. In the X-axis direction, the first through hole 1131, the second through hole 1132 and the third through hole 1133 are sequentially and evenly distributed, and the second through hole 1132 and the third through hole 1133 are respectively located at the opposite sides of the first through hole 1131. The second through hole 1132 is located at the side of the first through hole 1131 facing the positive direction of the X-axis, and the third through hole 1133 is located at the side of the first through hole 1131 facing the negative direction of the X-axis. Among them, the width dimension of the first through hole 1131 is greater than the width dimension of the second through hole 1132 and the width dimension of the third through hole 1133; the width dimension of the second through hole 1132 is equal to the width dimension of the third through hole 1133. The length dimension of the first through hole 1131, the length dimension of the second through hole 1132 and the length dimension of the third through hole 1133 are equal. In other words, the area of the first through hole 1131 is greater than the area of the second through hole 1132 and the area of the third through hole 1133; the area of the second through hole 1132 is equal to the area of the third through hole 1133. It should be noted that in this embodiment, the width direction of each through hole 113 is the X-axis direction shown above, and the length direction of each through hole 113 is the Y-axis direction shown above. The "area of component A" refers to the area of the projection of component A on the X-Y plane. The description of "area" hereinafter can be understood in the same way.

[0104] In this embodiment, the number of the through holes 115 is two, and the two through holes 115 are respectively a first through hole 1151 and a second through hole 1152. The first through hole 1151 and the second through hole 1152 are located on a side of the third through hole 1133 away from the first through hole 1131. The first through hole 1151 is located at one end of the third through hole 1133 close to the first via hole 1141, and the second through hole 1152 is located at one end of the third through hole 1133 away from the first via hole 1141. In other embodiments, the number of the through holes 115 can also be more, for example, three, four, five, etc., which is not limited in the application.

[0105] Please refer to Figure 5 and Figure 6 In this embodiment, the first winding 12 includes a first coil 121 and a second coil (not shown in the figure). The first coil 121 is arranged on the first front surface 111 of the first circuit board 11 and is fixedly and electrically connected with the first circuit board 11. The second coil is arranged on the first back surface 112 of the first circuit board 11 and is fixedly and electrically connected with the first circuit board 11. The second coil is electrically connected with the first coil 121. Specifically, the second coil is electrically connected with the first coil 121 through the first via hole 1141. For example, the first coil 121 is a copper foil printed on the first front surface 111, and the second coil is a copper foil printed on the first back surface 112. In other embodiments, the first coil 121 can also be a copper wire printed on the first front surface 111; and / or, the second coil can also be a copper wire printed on the first back surface 112. The first coil 121 and the second coil can also be made of other metals or other conductive materials, which is not limited in the application.

[0106] In this embodiment, the first coil 121 is arranged around the first through hole 1131. Specifically, the first coil 121 is in a planar spiral shape around the first through hole 1131 and surrounds four turns. The first coil 121 includes opposite first connection ends 1211 and a first input end 1212. The first connection ends 1211 are located on the inner side of the turns surrounded by the first coil 121, and the first input end 1212 is located on the outer side of the turns surrounded by the first coil 121. The first connection ends 1211 are located in the first via hole 1141 and are electrically connected with the first via hole 1141. The first input end 1212 is located in the second via hole 1142 and is electrically connected with the second via hole 1142. In other embodiments, the first coil 121 can also be arranged around the first through hole 1131 for one turn, two turns, three turns or more turns. The first coil 121 can also be arranged around the second through hole 1132 or the third through hole 1133.

[0107] In this embodiment, the second coil is arranged around the first through hole 1131. Specifically, the second coil is arranged in a planar spiral around the first through hole 1131 and forms four turns. The second coil includes opposite second connection ends and a second input end. The second connection ends are located on the inner side of the turns formed by the second coil, and the second input end is located on the outer side of the turns formed by the second coil. The second connection ends are located in the first via hole 1141 and are electrically connected to the first via hole 1141. The second input end is located in the third via hole 1143 and is electrically connected to the third via hole 1143. In other embodiments, the second coil can also be arranged around the first through hole 1131 one turn, two turns, three turns, or more turns. The second coil can also be arranged around the second through hole 1132 or the third through hole 1133. In this embodiment, the second connection ends and the first connection ends 1211 are electrically connected through the first via hole 1141, that is, the second coil is electrically connected to the first coil 121 through the first via hole 1141, so that the first winding 12 surrounds the first through hole 1131 eight turns. That is, the number of turns of the first winding 12 is eight turns.

[0108] It should be noted that the first coil 121 and the second coil are provided with an insulating layer (not shown in the figure) on the surface away from the first circuit board 11, so as to ensure that the first coil 121 and the second coil are insulated from the outside, avoid the electrical performance of the first coil 121 and the second coil being affected, and ensure the performance of the electronic device 100. For example, the insulating layer is an insulating tape. In other embodiments, the insulating layer can also be made of an insulating material, and the insulating layer can also be an insulating circuit board, which is not limited in the present application.

[0109] In other embodiments, the first coil 121 and the second coil can also be arranged on different circuit boards, respectively. For example, the circuit board assembly 10 can further include a third circuit board, the third circuit board is located between the first circuit board 11 and the second circuit board 13, the first coil 121 is arranged on the first front surface 111 of the first circuit board 11, and the second coil is arranged on the surface of the third circuit board facing or away from the first circuit board 11. The first winding can further include a third coil, a fourth coil, and more coils, which are not limited in the present application.

[0110] In this embodiment, the second circuit board 13 is a rectangular plate. The thickness direction of the second circuit board 13 is the first direction (the Z-axis direction shown in the figure) shown above, the length direction of the second circuit board 13 is the second direction (the X-axis direction shown in the figure) shown above, and the width direction of the second circuit board 13 is the third direction (the Y-axis direction shown in the figure) shown above. The area of the second circuit board 13 is equal to the area of the first circuit board 11.

[0111] Since the length direction of the second circuit board 13 is parallel to the length direction of the first circuit board 11, and the width direction of the second circuit board 13 is parallel to the width direction of the first circuit board 11, the area of the circuit board assembly 10 can be reduced, and the electronic device 100 can be designed to be small in size. In addition, the area of the second circuit board 13 is equal to the area of the first circuit board 11, so that there is no unnecessary space between the second circuit board 13 and the first circuit board 11. The space utilization of the circuit board assembly 10 can be effectively improved, and the circuit board assembly 10 can be designed to be small in size, and the electronic device 100 can be designed to be small in size.

[0112] In other embodiments, the length direction of the second circuit board 13 can also be the third direction shown above, and the width direction of the second circuit board 13 can be the second direction shown above. The area of the second circuit board 13 can also be different from the area of the first circuit board 11, which is not limited in the present application.

[0113] In the present embodiment, the second circuit board 13 includes a second front surface 131 and a second back surface 132. The second front surface 131 is arranged opposite to the second back surface 132. The second front surface 131 faces the first circuit board 11, and the second back surface 132 faces away from the first circuit board 11. The second circuit board 13 is provided with a plurality of butt joint through holes 133 and a plurality of butt joint through holes 134. The butt joint through holes 133 and the butt joint through holes 134 pass through the second front surface 131 and the second back surface 132 of the second circuit board 13. The butt joint through holes 133 and the butt joint through holes 134 are spaced apart and are not limited in number. The butt joint through holes 133 correspond to the through holes 113, and the butt joint through holes 134 correspond to the through holes 115. The hole walls of the butt joint through holes 134 are plated with a conductive material. For example, the conductive material is copper. In other embodiments, the conductive material can also be aluminum or other metals or other materials with conductivity. In the present application, "component A corresponds to component B" means that the projections of component A and component B on the X-Y plane overlap. The description of "corresponding" hereinafter can be understood in the same way. It should be noted that the butt joint through holes 133 correspond to the through holes 113, and the butt joint through holes 134 correspond to the through holes 115. The butt joint through holes 133 of the second circuit board 13 and the through holes 113 of the first circuit board 11 are connected, so that the first magnetic core 20 and the second magnetic core 30 can be fixed. The butt joint through holes 134 of the second circuit board 13 correspond to the through holes 115 of the first circuit board 11, so that the load module 1000b (as shown) can be directly inserted from the first circuit board 11. Figure 1

[0114] ​In this embodiment, the number of the butt joint through holes 133 is three, and the three butt joint through holes 133 are respectively a first butt joint through hole 1331, a second butt joint through hole 1332, and a third butt joint through hole 1333. The first butt joint through hole 1331, the second butt joint through hole 1332, and the third butt joint through hole 1333 are all rectangular holes. In the X-axis direction, the first butt joint through hole 1331, the second butt joint through hole 1332, and the third butt joint through hole 1333 are sequentially and spacedly distributed, and the second butt joint through hole 1332 and the third butt joint through hole 1333 are respectively located on the opposite sides of the first butt joint through hole 1331. The second butt joint through hole 1332 is located on the side of the first butt joint through hole 1331 facing the positive direction of the X-axis, and the third butt joint through hole 1333 is located on the side of the first butt joint through hole 1332 facing the negative direction of the X-axis. Among them, the first butt joint through hole 1331 corresponds to the first through hole 1131, the second butt joint through hole 1332 corresponds to the second through hole 1132, and the third butt joint through hole 1333 corresponds to the third through hole 1133.

[0115] In this embodiment, the width size of the first butt joint through hole 1331 is greater than the width size of the second butt joint through hole 1332 and the width size of the third butt joint through hole 1333, and the width size of the second butt joint through hole 1332 is equal to the width size of the third butt joint through hole 1333. The length size of the first butt joint through hole 1331, the length size of the second butt joint through hole 1332, and the length size of the third butt joint through hole 1333 are equal. In other words, the area of the first butt joint through hole 1331 is greater than the area of the second butt joint through hole 1332 and the area of the third butt joint through hole 1333, and the area of the second butt joint through hole 1332 is equal to the area of the third butt joint through hole 1333. It should be noted that in this embodiment, the width direction of each butt joint through hole 133 is the X-axis direction shown above, and the length direction of each butt joint through hole 133 is the Y-axis direction shown above.

[0116] In other embodiments, the area of the first butt joint through hole 1331 can also be equal to or smaller than the area of the second butt joint through hole 1332 and the area of the third butt joint through hole 1333, and the area of the second butt joint through hole 1332 and the area of the third butt joint through hole 1333 can also be unequal. In other embodiments, the shapes of the first butt joint through hole 1331, the second butt joint through hole 1332, and the third butt joint through hole 1333 can also be different, and the shapes of the three can also be circular holes, triangular holes, or special-shaped holes, etc., which are not limited in the present application. The number of the butt joint through holes 133 can also be two or more, such as four, five, etc.

[0117] In this embodiment, the number of the butt contact holes 134 is three, and the three butt contact holes 134 are respectively a first butt contact hole 1341, a second butt contact hole 1342 and a third butt contact hole 1343. The first butt contact hole 1341 is located at one end of the third butt through hole 1333, the second butt contact hole 1342 and the third butt contact hole 1343 are located on the side of the third butt through hole 1333 away from the first butt through hole 1331, and the second butt contact hole 1342 and the third butt contact hole 1343 are respectively located at opposite ends of the third butt through hole 1333.

[0118] In this embodiment, the first butt contact hole 1341 does not correspond to the first via hole 1141, the second butt contact hole 1342 corresponds to and is electrically connected to the first through hole 1151, and the third butt contact hole 1343 corresponds to and is electrically connected to the second through hole 1152. In other embodiments, the first butt contact hole 1341 can also correspond to the first via hole 1141. The number of the butt contact holes 134 can also be more, for example, four, five, etc., which are not limited in the present application.

[0119] In this embodiment, the second winding 14 includes a first conductive loop 141 and a second conductive loop (not shown in the figure), the first conductive loop 141 is arranged on the second front surface 131 of the second circuit board 13 and is electrically connected to the second circuit board 13. The second conductive loop is arranged on the second back surface 132 of the second circuit board 13 and is electrically connected to the second circuit board 13. The second conductive loop is electrically connected to the first conductive loop 141. Specifically, the second conductive loop is electrically connected to the first conductive loop 141 through the first butt contact hole 1341. For example, the first conductive loop 141 is a copper foil printed on the second front surface 131, and the second conductive loop is a copper foil printed on the second back surface 132. In other embodiments, the first conductive loop 141 can also be a copper wire printed on the second front surface 131; and / or, the second conductive loop can also be a copper wire printed on the second back surface 132. The first conductive loop 141 and the second conductive loop can also be made of other metals or other conductive materials, which are not limited in the present application.

[0120] In this embodiment, the first conductive ring 141 is arranged around the first interface through hole 1331. Specifically, the first conductive ring 141 is arranged in a planar spiral shape around the first interface through hole 1331 and forms three turns. The first conductive ring 141 includes opposite first conductive ends 1411 and a first output end 1412. The first conductive ends 1411 are located on the inner side of the turns formed by the first conductive ring 141, and the first output end 1412 is located on the outer side of the turns formed by the first conductive ring 141. The first conductive ends 1411 are located in the first interface through hole 1341 and are electrically connected to the first interface through hole 1341. The first output end 1412 is located in the second interface through hole 1342 and is electrically connected to the second interface through hole 1342. In other embodiments, the first conductive ring 141 can also be arranged around the first interface through hole 1331 one turn, two turns or more turns. The first conductive ring 141 can also be arranged around the second interface through hole 1332 or the third interface through hole 1333.

[0121] In this embodiment, the second conductive ring is arranged around the first interface through hole 1331. Specifically, the second conductive ring is arranged in a planar spiral shape around the first interface through hole 1331 and forms three turns. The second conductive ring includes opposite second conductive ends and a second output end. The second conductive ends are located on the inner side of the turns formed by the second conductive ring, and the second output end is located on the outer side of the turns formed by the second conductive ring. The second conductive ends are located in the first interface through hole 1341 and are electrically connected to the first interface through hole 1341. The second output end is located in the third interface through hole 1343 and is electrically connected to the third interface through hole 1343. In other embodiments, the second conductive ring can also be arranged around the first interface through hole 1331 one turn, two turns or more turns. The second conductive ring can also be arranged around the second interface through hole 1332 or the third interface through hole 1333. In this embodiment, the second conductive ends are electrically connected to the first conductive ends 1411 through the first interface through hole 1341, that is, the second conductive ring is electrically connected to the first conductive ring 141 through the first interface through hole 1341, so that the second winding 14 surrounds the first interface through hole 1331 six turns. That is, the number of turns of the second winding 14 is six turns.

[0122] It should be noted that the first conductive ring 141 and the second conductive ring are provided with an insulating layer (not shown in the figure) on the surface away from the second circuit board 13, so as to ensure that the first conductive ring 141 and the second conductive ring are insulated from the outside, avoid the electrical properties of the first conductive ring 141 and the second conductive ring being affected, and ensure the performance of the electronic device 100. For example, the insulating layer is an insulating tape. In other embodiments, the insulating layer can also be made of insulating material, and the insulating layer can also be an insulating circuit board, which is not limited in the present application.

[0123] In other embodiments, the first conductive loop 141 and the second conductive loop can also be respectively arranged on different circuit boards. For example, the circuit board assembly 10 can further include a fourth circuit board, which is located between the first circuit board 11 and the second circuit board 13, the first conductive loop 141 is arranged on the second front surface 131 of the second circuit board 13, and the second conductive loop is arranged on a surface of the fourth circuit board facing or away from the second circuit board 13. The second winding can further include a third conductive loop, a fourth conductive loop, and the like, which are not limited in the present application.

[0124] In the present embodiment, two output terminals of the external power supply 2000 (as shown in Figure 1 ) are respectively electrically connected with the second via hole 1142 and the third via hole 1143, so that the external power supply 2000 is electrically connected with the first winding 12. Two input terminals of the load module 1000b are respectively electrically connected with the first through hole 1151 and the second through hole 1152, and through the electrical connection between the first through hole 1151 and the second butt joint via hole 1342 and the electrical connection between the second through hole 1152 and the third butt joint via hole 1343, the load module 1000b is electrically connected with the second winding 14. The alternating current output by the external power supply 2000 can be delivered to the first winding 12, and through the coupling between the first winding 12 and the second winding 14, the second winding 14 can output the alternating current after step-down conversion to the load module 1000b, so as to supply the load module 1000b to work.

[0125] Please refer to Figures 7 to 9 , Figure 7 is Figure 5 a perspective structural schematic view of the first magnetic core 20, the heat dissipation member 40 and the adhesive member 50 of the electronic device 100 in Figure 8 is Figure 2 a sectional view of the electronic device 100 (omitting the second magnetic core 30 and the heat conduction member 60 part) along the III-III line in Figure 9 is Figure 2 a structural exploded schematic view of the electronic device 100 (omitting the second magnetic core 30, the adhesive member 50 and the heat conduction member 60 part) along the III-III line in

[0126] The first magnetic core 20 is inserted into the circuit board assembly 10 and fixedly connected with the circuit board assembly 10. Specifically, the first magnetic core 20 is inserted into the second circuit board 13 through the butt joint via hole 133 and fixedly connected with the second circuit board 13. In the present embodiment, the first magnetic core 20 is made of ferrite material. In other embodiments, the first magnetic core 20 can also be made of other magnetic materials, which are not limited in the present application.

[0127] Please refer to Figure 7The first magnetic core 20 includes a first body 21 and a connector 22. The connector 22 protrudes from one side of the first body 21 and extends in the positive Z-axis direction. The first body 21 and the connector 22 can be integrally formed to simplify the manufacturing process of the first magnetic core 20 and ensure the overall strength of the first magnetic core 20.

[0128] In this embodiment, the first body 21 includes a first surface 211 and a second surface 212. The first surface 211 and the second surface 212 are disposed opposite to each other. Specifically, the first surface 211 faces the positive Z-axis direction, and the second surface 212 faces the negative Z-axis direction. In this embodiment, the first body 21 is a rectangular block. In other embodiments, the first body 21 may also be a cylinder or an irregular shape, etc.

[0129] In this embodiment, there are three connectors 22: a first connector 221, a second connector 222, and a third connector 223. All three connectors are block-shaped. Along the Z-axis, they protrude from the first surface 211 of the first body 21 and are spaced apart sequentially along the X-axis. The second connector 222 and the third connector 223 are located on opposite sides of the first connector 221. The first connector 221 is inserted into the first mating through hole 1331. The second connector 222 is inserted into the second mating through hole 1332. The third connector 223 is inserted into the third mating through hole 1333.

[0130] Specifically, along the X-axis, the first connector 221 protrudes from the middle of the first body 21, and the second connector 222 and the third connector 223 protrude from opposite ends of the first body 21 to ensure uniform force distribution on the first body 21 and improve the overall strength of the first magnetic core 20. In other words, the cross-sectional shape of the first magnetic core 20 is E-shaped, which is simple in structure, easy to process, and has low processing cost; moreover, its overall flat shape and small height dimension (i.e., dimension along the Z-axis) are beneficial to electronic devices 100 (such as... Figure 1 The miniaturized design is shown in the figure. In this application, "the cross-sectional shape of component A" refers to the shape of the projection of component A onto the XZ plane, and the following description of "cross-sectional shape" can be understood in the same way.

[0131] In other embodiments, the first connector 221, the second connector 222, and the third connector 223 may also be pillars or irregular shapes, etc., and this application does not limit this. The number of connectors 22 may also be two, four, or more.

[0132] In the embodiment, the height dimension of the first connecting body 221 is greater than the height dimension of the second connecting body 222 and the height dimension of the third connecting body 223; the height dimension of the second connecting body 222 is equal to the height dimension of the third connecting body 223. The width dimension of the first connecting body 221 is greater than the width dimension of the second connecting body 222 and the width dimension of the third connecting body 223; the width dimension of the second connecting body 222 is equal to the width dimension of the third connecting body 223. The length dimension of the first connecting body 221, the second connecting body 222 and the third connecting body 223 are equal to the width dimension of the first main body 21, which is conducive to reducing the size of the first magnetic core 20 and facilitating the miniaturization design of the first magnetic core 20. It should be noted that in the embodiment, the width direction of each connecting body 22 is the X-axis direction shown above, the length direction is the Y-axis direction shown above, and the height direction is the Z-axis direction shown above. The width direction of the first main body 21 is the Y-axis direction shown above.

[0133] In other embodiments, the height dimensions of the first connecting body 221, the second connecting body 222 and the third connecting body 223 can be equal or unequal. The width dimensions of the first connecting body 221, the second connecting body 222 and the third connecting body 223 can be equal or unequal. The length dimensions of the first connecting body 221, the second connecting body 222 and the third connecting body 223 can also be unequal to the width dimension of the first main body 21.

[0134] Please refer to Figure 7 and Figure 8 The heat dissipation member 40 is located between the first main body 21 of the first magnetic core 20 and the second circuit board 13 of the circuit board assembly 10, and is in contact with the first main body 21 and the second circuit board 13. Specifically, the heat dissipation member 40 is located between the first surface 211 of the first main body 21 and the second back surface 132 of the second circuit board 13, and is in contact with the first surface 211 and the second back surface 132. The first magnetic core 20 is fixedly connected with the second circuit board 13 through the heat dissipation member 40. Among them, the heat dissipation member 40 is arranged on the first surface 211 of the first main body 21.

[0135] In the embodiment, the heat dissipation member 40 is black glue, specifically an epoxy resin glue, which has good thermal conductivity and adhesion. The heat dissipation member 40 is formed on the first surface 211 in a molten state and solidifies after the first magnetic core 20 and the second circuit board 13 are assembled. The first magnetic core 20 and the second circuit board 13 are fixedly connected through the adhesion of the heat dissipation member 40.

[0136] Since the heat dissipation member 40 has good thermal conductivity, it can quickly absorb the heat generated by the circuit board assembly 10 during operation, ensuring the rapid heat dissipation of the circuit board assembly 10. Among them, the design of the heat dissipation member 40 reduces the contact thermal resistance between the first magnetic core 20 and the second circuit board 13. Part of the heat generated by the circuit board assembly 10 during operation can be conducted to the first magnetic core 20 through the heat dissipation member 40 and then to the outside through the first magnetic core 20; another part of the heat can be directly conducted to the outside through the absorption of the heat dissipation member 40. The heat dissipation member 40 can be formed on the first surface 211 of the first main body 21 by welding or fusion bonding and the like. In other embodiments, the heat dissipation member 40 can also be formed on the second back surface 132 of the second circuit board 13. The heat dissipation member 40 is formed on the second back surface 132 in a molten state and solidifies after the first magnetic core 20 and the second circuit board 13 are assembled. The first magnetic core 20 and the circuit board assembly 10 can also be fixedly connected through the adhesion of the heat dissipation member 40.

[0137] In other embodiments, the heat dissipation member 40 can also be other adhesives with adhesion, good thermal conductivity and reflow solder resistance; or it can also be a heat dissipation pad with good thermal conductivity. The heat dissipation pad is coated with adhesive on both sides, and the first magnetic core 20 is fixedly connected with the circuit board assembly 10 through the heat dissipation pad coated with adhesive on both sides. The present application does not limit this.

[0138] In this embodiment, the number of heat dissipation members 40 is two, and the two heat dissipation members 40 are respectively a first heat dissipation member 41 and a second heat dissipation member 42. The first heat dissipation member 41 and the second heat dissipation member 42 are both rectangular blocks. In other embodiments, the first heat dissipation member 41 and the second heat dissipation member 42 can also be cylindrical or shaped bodies, etc. It should be noted that in this embodiment, the width direction of each heat dissipation member 40 is the X-axis direction shown above, the length direction is the Y-axis direction shown above, and the height direction is the Z-axis direction shown above.

[0139] In this embodiment, the first heat dissipation member 41 is arranged on the first surface 211 and located between the first connecting body 221 and the second connecting body 222. Among them, the opposite ends of the first heat dissipation member 41 respectively abut against the first connecting body 221 and the second connecting body 222; the length dimension of the first heat dissipation member 41 is equal to the width dimension of the first main body 21. In this way, the first heat dissipation member 41 has a large contact area with the first main body 21 of the first magnetic core 20 and the second circuit board 13 of the circuit board assembly 10, which not only ensures the strength of the fixed connection between the first heat dissipation member 41 and the first magnetic core 20, but also ensures the strength of the fixed connection between the first magnetic core 20 and the circuit board assembly 10 through the first heat dissipation member 41. In addition, since the first heat dissipation member 41 has thermal conductivity, it is also conducive to the rapid heat dissipation of the first heat dissipation member 41 to the circuit board assembly 10 and the first magnetic core 20.

[0140] In other embodiments, the opposite ends of the first heat sink 41 can not abut against the first connecting body 221 and the second connecting body 222, i.e., there is a gap between the opposite ends of the first heat sink 41 and the first connecting body 221 and the second connecting body 222. The length of the first heat sink 41 can also be different from the width of the first main body 21.

[0141] In the present embodiment, the second heat sink 42 is arranged on the first surface 211 and located between the first connecting body 221 and the third connecting body 223. The opposite ends of the second heat sink 42 abut against the first connecting body 221 and the third connecting body 223, respectively. The length of the second heat sink 42 is equal to the width of the first main body 21. In this way, the second heat sink 42 has a large contact area with the first main body 21 of the first magnetic core 20 and the second circuit board 13 of the circuit board assembly 10, which not only ensures the strength of the fixed connection between the second heat sink 42 and the first magnetic core 20, but also ensures the strength of the fixed connection between the first magnetic core 20 and the circuit board assembly 10 through the second heat sink 42, and further ensures the strength of the fixed connection between the first magnetic core 20 and the circuit board assembly 10 through the heat sink 40. In addition, since the second heat sink 42 has heat conductivity, it is also conducive to the rapid heat dissipation of the circuit board assembly 10 and the first magnetic core 20 by the second heat sink 42.

[0142] In other embodiments, the opposite ends of the second heat sink 42 can not abut against the first connecting body 221 and the third connecting body 223, i.e., there is a gap between the opposite ends of the second heat sink 42 and the first connecting body 221 and the third connecting body 223. The length of the second heat sink 42 can also be different from the width of the first main body 21.

[0143] It should be noted that in the present embodiment, the height of the first heat sink 41 is equal to the height of the second heat sink 42. The height direction of the heat sink 40 refers to the Z-axis direction shown above. In the Z-axis direction, the difference between the height of the first connecting body 221 of the first magnetic core 20 and the height of the first heat sink 41 (or the second heat sink 42) is greater than the depth of the first through-hole 1331; the difference between the height of the second connecting body 222 and the height of the first heat sink 41 is less than the depth of the second through-hole 1332; and the difference between the height of the third connecting body 223 and the height of the second heat sink 42 is less than the thickness of the second circuit board 13, i.e., less than the depth of the third through-hole 1333.

[0144] In other embodiments, the difference between the height dimension of the first connecting body 221 and the height dimension of the first heat dissipation member 41 (or the second heat dissipation member 42) can also be equal to or less than the depth dimension of the first butt joint through hole 1331; the difference between the height dimension of the second connecting body 222 and the height dimension of the first heat dissipation member 41 can also be equal to or greater than the depth dimension of the second butt joint through hole 1332; and the difference between the height dimension of the third connecting body 223 and the height dimension of the second heat dissipation member 42 can also be equal to or greater than the depth dimension of the third butt joint through hole 1333.

[0145] Please refer to Figure 8 and Figure 9 In the embodiment, along the Z-axis direction, the first magnetic core 20 is mounted on the second circuit board 13 from the second back surface 132 of the second circuit board 13, specifically, the first connecting body 221 of the first magnetic core 20 is inserted into the first butt joint through hole 1331 of the second circuit board 13; at the same time, the second connecting body 222 of the first magnetic core 20 is inserted into the second butt joint through hole 1332 of the second circuit board 13, and the third connecting body 223 of the first magnetic core 20 is inserted into the third butt joint through hole 1333 of the second circuit board 13; until the first heat dissipation member 41 and the second heat dissipation member 42 arranged on the first main body 21 are in contact with and bonded to the second back surface 132 of the second circuit board 13. The first magnetic core 20 is fixedly connected with the second circuit board 13 through the heat dissipation member 40, that is, fixedly connected with the circuit board assembly 10. The first magnetic core 20 is fixedly connected with the second circuit board 13 through the heat dissipation member 40, that is, fixedly connected with the circuit board assembly 10, which is stable in connection, simple in structure, low in cost, and improves the overall structural stability of the electronic device 100 (as shown in Figure 1 ).

[0146] At this time, the first connecting body 221 passes through the first butt joint through hole 1331 and extends into the first through hole 1131 of the first circuit board 11; the second connecting body 222 is fixed in the second butt joint through hole 1332 and does not extend into the second through hole 1132 of the first circuit board 11; and the third connecting body 223 is fixed in the third butt joint through hole 1333 and does not extend into the third through hole 1133 of the first circuit board 11. The second winding 14 (as shown in Figure 5 ) surrounds the first connecting body 221 of the first magnetic core 20.

[0147] Since the heat dissipation member 40 has good thermal conductivity, and the opposite ends of each heat dissipation member 40 (i.e. the opposite parts of the heat dissipation member 40 along the Y-axis direction) are exposed to the outside, the heat dissipation member 40 can quickly absorb and conduct the large amount of heat generated by the circuit board assembly 10 and the first magnetic core 20 to the outside; wherein the design of the heat dissipation member 40 reduces the contact thermal resistance between the first magnetic core 20 and the second circuit board 13, part of the heat generated by the circuit board assembly 10 can be conducted to the first magnetic core 20 through the heat dissipation member 40, and then conducted to the outside through the first magnetic core 20; another part of the heat can be directly conducted to the outside through the heat dissipation member 40. The rapid heat dissipation of the circuit board assembly 10 and the first magnetic core 20 is ensured, the performance of the circuit board assembly 10 and the first magnetic core 20 is prevented from being damaged due to heat accumulation, the service life of the circuit board assembly 10 and the first magnetic core 20 is prolonged, and the service life of the electronic device 100 (such as Figure 1 ) is prolonged.

[0148] It should be noted that in the present embodiment, the first circuit board 11 and the second circuit board 13 are stacked, the through hole 113 of the first circuit board 11 is in communication with the butt joint through hole 133 of the second circuit board 13, then the first magnetic core 20 is mounted on the second circuit board 13, and finally the second magnetic core 30 (as shown in Figure 3 ) is mounted on the first circuit board 11. In addition, the adhesive member 50 is located in the through hole 113 of the first circuit board 11 or at the connection position of the butt joint through hole 133 and the through hole 113. In other embodiments, the adhesive member 50 can also be located in the butt joint through hole 133 of the second circuit board 13.

[0149] Please refer to Figure 4 and Figure 10 , Figure 10 is Figure 1 the second magnetic core 30 and the heat dissipation member 60 of the electronic device 100 in

[0150] The second magnetic core 30 is inserted into the circuit board assembly 10 and fixedly connected with the first magnetic core 20. Specifically, the second magnetic core 30 is inserted into the first circuit board 11 through the through hole 113 and fixedly connected with the first magnetic core 20. In the present embodiment, the second magnetic core 30 is made of ferrite material. In other embodiments, the second magnetic core 30 can also be made of other magnetic materials, which are not limited by the present application.

[0151] Please refer to Figure 10 and Figure 11 , Figure 11 is Figure 10 another angle structural schematic view of the second magnetic core 30 in

[0152] The second magnetic core 30 comprises a second main body 31 and a fixing body 32. The fixing body 32 protrudes from one side of the second main body 31 and extends towards the negative direction of the Z-axis. The second main body 31 and the fixing body 32 can be integrally formed to simplify the manufacturing process of the second magnetic core 30 and ensure the overall strength of the second magnetic core 30.

[0153] The second main body 31 comprises a first end face 311 and a second end face 312. The first end face 311 is arranged opposite to the second end face 312 along the Z-axis direction. Specifically, the first end face 311 faces the negative direction of the Z-axis, and the second end face 312 faces the positive direction of the Z-axis. That is, the first end face 311 faces the first circuit board 11 of the circuit board assembly 10 (as shown in Figure 3 In this embodiment, the second main body 31 is a rectangular block. In other embodiments, the second main body 31 can also be a column or a special-shaped body, etc.

[0154] In this embodiment, the number of the fixing bodies 32 is three, and the three fixing bodies 32 are respectively a first fixing body 321, a second fixing body 322 and a third fixing body 323. The first fixing body 321, the second fixing body 322 and the third fixing body 323 are all rectangular blocks. Along the Z-axis direction, the first fixing body 321, the second fixing body 322 and the third fixing body 323 protrude from the first end face 311 of the second main body 31 and are sequentially spaced apart along the X-axis direction. Among them, the second fixing body 322 and the third fixing body 323 are located on the opposite sides of the first fixing body 321. The first fixing body 321 is used to be inserted into the first through hole 1131 of the first circuit board 11 (as shown in Figure 4 The second fixing body 322 is used to be inserted into the second through hole 1132 of the first circuit board 11. The third fixing body 323 is used to be inserted into the third through hole 1133 of the first circuit board 11. Specifically, along the X-axis direction, the first fixing body 321 protrudes from the middle part of the second main body 31, and the second fixing body 322 and the third fixing body 323 protrude from the opposite end parts of the second main body 31, so as to ensure that the second main body 31 is uniformly stressed and improve the overall strength of the second magnetic core 30. In other words, the cross-sectional shape of the second magnetic core 30 is E-shaped, which is simple in structure, easy to process and low in processing cost. Moreover, the overall shape of the second magnetic core 30 is flat, and the height dimension (i.e. the dimension along the Z-axis direction) is small, which is conducive to the miniaturization design of the electronic device 100 (as shown in Figure 1

[0155] In other embodiments, the first fixing body 321, the second fixing body 322 and the third fixing body 323 can also be a column, a square column or a special-shaped body, etc., which are not limited in the present application. The number of the fixing bodies 32 can also be two, four or more.

[0156] ​In the embodiment, the height dimension of the first fixing body 321 is smaller than the height dimension of the second fixing body 322 and the height dimension of the third fixing body 323; the height dimension of the second fixing body 322 is equal to the height dimension of the third fixing body 323. The width dimension of the first fixing body 321 is greater than the width dimension of the second fixing body 322 and the width dimension of the third fixing body 323; the width dimension of the second fixing body 322 is equal to the width dimension of the third fixing body 323. The length dimension of the first fixing body 321, the second fixing body 322 and the third fixing body 323 are equal to the width dimension of the second main body 31, which is conducive to reducing the size of the second magnetic core 30 and facilitating the miniaturization design of the second magnetic core 30. It should be noted that in the embodiment, the width direction of each fixing body 32 is the X-axis direction shown above, the length direction is the Y-axis direction shown above, and the height direction is the Z-axis direction shown above. The width direction of the second main body 31 is the Y-axis direction shown above.

[0157] In other embodiments, the height dimensions of the first fixing body 321, the second fixing body 322 and the third fixing body 323 can be equal or not equal. The width dimensions of the first fixing body 321, the second fixing body 322 and the third fixing body 323 can be equal or not equal. The length dimensions of the first fixing body 321, the second fixing body 322 and the third fixing body 323 can also not be equal to the width dimension of the second main body 31.

[0158] In addition, the second magnetic core 30 is also provided with a groove 33. Specifically, the second main body 31 is provided with the groove 33 shown above. Among them, the groove 33 is recessed on the first end face 311, the groove 33 has an opening on the first end face 311, and along the Y-axis direction, the groove 33 penetrates the opposite two side faces of the second main body 31. In other embodiments, along the Y-axis direction, the groove 33 can also not penetrate the opposite two side faces of the second main body 31.

[0159] Please refer to Figure 11 and Figure 12 , Figure 12 is Figure 11 the enlarged view of the XII part of the second magnetic core 30 in

[0160] In the embodiment, the number of the grooves 33 is fourteen. The fourteen grooves 33 are seven first grooves 331 and seven second grooves 332. The seven first grooves 331 are located between the first fixed body 321 and the second fixed body 322 and are arranged at intervals along the X-axis direction. The cross-sectional shape of each first groove 331 is rectangular. Along the X-axis direction, the width dimension (A1 as shown in the figure) of the opening of each first groove 331 is smaller than the distance (A2 as shown in the figure) between the first groove 331 and the first groove 331 adjacent thereto. In other embodiments, along the X-axis direction, the width dimension A1 of the opening of each first groove 331 can also be greater than or equal to the distance A2 between the first groove 331 and the first groove 331 adjacent thereto.

[0161] In the embodiment, along the X-axis direction, the width dimension A1 of the opening of the seven first grooves 331 is equal, the distance A2 between each first groove 331 and the first groove 331 adjacent thereto is equal, and the seven first grooves 331 are uniformly distributed between the first fixed body 321 and the second fixed body 322, so that the stress is uniform, which is conducive to improving the overall strength of the second magnetic core 30. In other embodiments, along the X-axis direction, the width dimension A1 of the opening of the seven first grooves 331 can also be unequal, and the distance A2 between each first groove 331 and the first groove 331 adjacent thereto can also be unequal. The number of the first grooves 331 can also be two, three, four, five, six or more, for example, eight, nine, etc., which is not limited in the application.

[0162] In the embodiment, the seven second grooves 332 are located between the first fixed body 321 and the third fixed body 323 and are arranged at intervals along the X-axis direction. The cross-sectional shape of each second groove 332 is rectangular. Along the X-axis direction, the width dimension of the opening of each second groove 332 is smaller than the distance between the second groove 332 and the second groove 332 adjacent thereto. In other embodiments, along the X-axis direction, the width dimension of the opening of each second groove 332 can also be greater than or equal to the distance between the second groove 332 and the second groove 332 adjacent thereto.

[0163] In this embodiment, the width of the opening of each of the seven second grooves 332 is equal, the distance between each of the second grooves 332 and the second groove 332 adjacent thereto is equal, and the seven second grooves 332 are evenly distributed between the first fixed body 321 and the third fixed body 323, so that the stress is uniform, which is conducive to improving the overall strength of the second magnetic core 30. In other embodiments, the width of the opening of the second groove 332 can also be unequal, and the distance between each of the second grooves 332 and the second groove 332 adjacent thereto can also be unequal. The number of the second grooves 332 can also be two, three, four, five, six or more, for example, eight, nine, etc., which is not limited in the present application.

[0164] It should be noted that in this embodiment, the cross-sectional shape of each of the seven first grooves 331 and the seven second grooves 332 is rectangular, i.e., the cross-sectional shape of each groove 33 is rectangular. In other embodiments, the cross-sectional shape of the seven first grooves 331 and the seven second grooves 332 can also be different. The cross-sectional shape of the groove 33 can also be other shapes, which will be described in some embodiments provided by the present application.

[0165] Please refer to Figures 13 to 17 , Figure 13 is an enlarged view of another embodiment of the XII part of the second magnetic core 30 in Figure 11 , Figure 14 is an enlarged view of another embodiment of the XII part of the second magnetic core 30 in Figure 11 , Figure 15 is an enlarged view of another embodiment of the XII part of the second magnetic core 30 in Figure 11 , Figure 16 is an enlarged view of another embodiment of the XII part of the second magnetic core 30 in Figure 11 , Figure 17 is an enlarged view of another embodiment of the XII part of the second magnetic core 30 in Figure 11 .

[0166] As shown in Figure 13 , in the embodiment shown in Figure 13 , the cross-sectional shape of the groove 33 can also be triangular. As shown in Figure 14 and Figure 15 , the cross-sectional shape of the groove 33 can also be arc-shaped protrusions. Specifically, in the embodiment shown in Figure 14 , the cross-sectional shape of the groove 33 is semicircular; in the embodiment shown in Figure 15 , the cross-sectional shape of the groove 33 is semi-elliptical. As shown in Figure 16 and Figure 17As shown, the cross-sectional shape of the groove 33 can also be trapezoidal. In other embodiments, the cross-sectional shape of the groove 33 can also be other regular or irregular shapes, which are not limited in the present application.

[0167] In addition, referring to Figure 3 , Figure 4 and Figure 7 , the adhesive 50 is located between the first magnetic core 20 and the second magnetic core 30. Specifically, the adhesive 50 is located between the connecting body 22 of the first magnetic core 20 and the fixed body 32 of the second magnetic core 30. The fixed body 32 is fixedly connected with the connecting body 22 through the adhesive 50, that is, the second magnetic core 30 is fixedly connected with the first magnetic core 20 through the adhesive 50.

[0168] In the present embodiment, the adhesive 50 is specifically an epoxy resin glue, which has adhesion. The adhesive 50 is formed on the end face of the connecting body 22 away from the first main body 21 in a molten state and solidifies after the first magnetic core 20 and the second magnetic core 30 are assembled. The first magnetic core 20 and the second magnetic core 30 are fixedly connected through the adhesion of the adhesive 50. The adhesive 50 can be formed on the end face of the connecting body 22 away from the first main body 21 by welding or fusion bonding and the like.

[0169] In other embodiments, the adhesive 50 can also be formed on the end face of the fixed body 32 away from the second main body 31, for example, a double-sided adhesive tape is arranged on the end face of the fixed body 32 away from the second main body 31, and the fixed body 32 and the connecting body 22 are fixedly connected through the double-sided adhesive tape. In other embodiments, the adhesive 50 can also be other glues with adhesion and reflow soldering resistance, which are not limited in the present application.

[0170] In the present embodiment, the number of the adhesive 50 is three, which are the first adhesive 51, the second adhesive 52 and the third adhesive 53, and the first adhesive 51, the second adhesive 52 and the third adhesive 53 are arranged in sequence and at intervals. Among them, the first adhesive 51 is formed on the end face of the first connecting body 221 away from the first main body 21, and is specifically made by injecting the first adhesive 51 in a molten state into the first through hole 1131. The first adhesive 51 is used to realize the fixed connection of the first connecting body 221 and the first fixed body 321. The second adhesive 52 is formed on the end face of the second connecting body 222 away from the first main body 21, and is specifically made by injecting the second adhesive 52 in a molten state into the second through hole 1132. The second adhesive 52 is used to realize the fixed connection of the second connecting body 222 and the second fixed body 322. The third adhesive 53 is formed on the surface of the third connecting body 223 away from the first main body 21, and is specifically made by injecting the third adhesive 53 in a molten state into the third through hole 1133. The third adhesive 53 is used to realize the fixed connection of the third connecting body 223 and the third fixed body 323.

[0171] In the embodiment, the first adhesive 51, the second adhesive 52 and the third adhesive 53 are all rectangular blocks. The area of the first adhesive 51 is equal to the area of the end surface of the first connecting body 221 away from the first main body 21, the area of the second adhesive 52 is equal to the area of the end surface of the second connecting body 222 away from the first main body 21, and the area of the third adhesive 53 is equal to the area of the end surface of the third connecting body 223 away from the first main body 21. In this way, the first adhesive 51, the second adhesive 52 and the third adhesive 53 all have a large contact area with the first magnetic core 20 and the second magnetic core 30. In this way, not only the strength of the fixed connection between the first adhesive 51, the second adhesive 52 and the third adhesive 53 and the first magnetic core 20 is ensured, but also the strength of the fixed connection between the first magnetic core 20 and the circuit board assembly 10 through the adhesive 50 is ensured. In addition, since the adhesive 50 has heat conductivity, it is also beneficial to the quick heat dissipation of the first magnetic core 20 and the second magnetic core 30 by the adhesive 50.

[0172] In other embodiments, the area of the first adhesive 51 can also be not equal to the area of the end surface of the first connecting body 221 away from the first main body 21, the area of the second adhesive 52 can also be not equal to the area of the end surface of the second connecting body 222 away from the first main body 21, and the area of the third adhesive 53 can also be not equal to the area of the end surface of the third connecting body 223 away from the first main body 21. The first adhesive 51, the second adhesive 52 and the third adhesive 53 can also be a column or a special-shaped body, etc.

[0173] It should be noted that in the embodiment, the first magnetic core 20 is mounted on the first circuit board 11, and then the adhesive 50 is formed on the connecting body 22 of the first magnetic core 20. In other embodiments, the adhesive 50 can be formed on the connecting body 22 of the first magnetic core 20 first, and then the first magnetic core 20 is mounted on the first circuit board 11.

[0174] Please refer to Figure 3 and Figure 4In the embodiment, the second magnetic core 30 is mounted on the first circuit board 11 along the Z-axis direction from the first front surface 111 of the first circuit board 11. Specifically, the first fixed body 321 of the second magnetic core 30 is inserted into the first through hole 1131 of the first circuit board 11, and is bonded to the first bonding member 51 provided on the first connecting body 221 of the first magnetic core 20. The first fixed body 321 is fixedly connected to the first connecting body 221 through the first bonding member 51, and at this time, the first bonding member 51 is located in the first through hole 1131. Meanwhile, the second fixed body 322 of the second magnetic core 30 is inserted into the second through hole 1132 of the first circuit board 11, and is bonded to the second bonding member 52 provided on the second connecting body 222 of the first magnetic core 20. The second fixed body 322 is fixedly connected to the second connecting body 222 through the second bonding member 52, and at this time, the second bonding member 52 is located at the connecting position of the second through hole 1132 and the second butt joint through hole 1332. The third fixed body 323 of the second magnetic core 30 is inserted into the third through hole 1133 of the first circuit board 11, and is bonded to the third bonding member 53 provided on the third connecting body 223 of the first magnetic core 20. The third fixed body 323 is fixedly connected to the third connecting body 223 through the third bonding member 53, and at this time, the third bonding member 53 is located at the connecting position of the third through hole 1133 and the third butt joint through hole 1333. Thus, the second magnetic core 30 is fixedly connected to the first magnetic core 20 through the bonding member 50, and the connection is stable, the structure is simple, and the cost is low. The overall structural stability of the electronic device 100 is improved.

[0175] The second magnetic core 30 is fixedly connected to the circuit board assembly 10 through the first magnetic core 20. The first fixed body 321 is fixed in the first through hole 1131 and does not extend into the first butt joint through hole 1331 of the second circuit board 13. The second fixed body 322 is fixed in the second through hole 1132 and does not extend into the second butt joint through hole 1332 of the second circuit board 13. The third fixed body 323 is fixed in the third through hole 1133 and does not extend into the third butt joint through hole 1333 of the second circuit board 13. At this time, there is a gap between the second main body 31 and the first circuit board 11. The first winding 12 (as shown in Figure 5 The second winding 14 surrounds the first connecting body 221 of the first magnetic core 20.

[0176] Please refer to Figure 3 and Figure 5 When the external power supply 2000 (such as Figure 1When the alternating current output by the external power supply 2000 is transmitted to the first winding 12, according to the principle of electromagnetic induction, the first connecting body 221 of the first magnetic core 20 and the first fixed body 321 of the second magnetic core 30 generate alternating magnetic field; the second winding 14 around the first connecting body 221 of the first magnetic core 20 can output alternating current to the load module 1000b. In the embodiment, since the number of turns (six turns) of the second winding 14 is less than the number of turns (eight turns) of the first winding 12, the alternating current voltage output by the second winding 14 is less than the alternating current voltage (i.e. the alternating current voltage output by the external power supply 2000) received by the first winding 12, so that the alternating current output by the external power supply 2000 can be subjected to step-down conversion processing through the coupling of the first winding 12 and the second winding 14, so as to supply the load module 1000b to work. That is, the electronic device 100 can perform step-down conversion processing on the alternating current output by the external power supply 2000 and transmit it to the load module 1000b to work.

[0177] Please refer to Figure 3 and Figure 10 The heat-conducting member 60 is located between the second main body 31 of the second magnetic core 30 and the first circuit board 11 of the circuit board assembly 10, and is in contact with the second main body 31 and the first circuit board 11. Specifically, the heat-conducting member 60 is clamped between the first end face 311 of the second main body 31 and the first front face 111 of the first circuit board 11. The heat-conducting member 60 is arranged on the first end face 311 of the second main body 31.

[0178] In the embodiment, the heat-conducting member 60 is a compressed material with good heat conductivity, specifically a heat-conducting gasket, which has good heat conductivity, adhesion, and is easy to compress and deform. The heat-conducting member 60 is adhered to the first end face 311. After the first magnetic core 20 and the second magnetic core 30 are assembled, the heat-conducting member 60 is adhered to the first front face 111 of the first circuit board 11, and the heat-conducting member 60 is clamped between the first end face 311 and the first front face 111. Since the heat-conducting member 60 is easy to compress and deform, the second magnetic core 30 can press and deform the heat-conducting member 60, ensuring that the heat-conducting member 60 is in complete contact with the first end face 311 and the first front face 111, i.e. there is no gap between the heat-conducting member 60 and the first end face 311 and the first front face 111, and ensuring that the heat-conducting member 60 has a large contact area with the first end face 311 and the first front face 111. It should be noted that the heat-conducting member 60 is easy to compress and deform, and has small elastic force after deformation, which will not affect the second main body 31 of the second magnetic core 30 and the first circuit board 11. Moreover, the heat-conducting member 60 has a thermal expansion coefficient between the second main body 31 of the second magnetic core 30 and the first circuit board 11, and will not damage the second main body 31 of the second magnetic core 30 and the first circuit board 11 after being heated.

[0179] Since the heat-conducting member 60 has good heat conductivity, it can quickly absorb and quickly conduct to the outside the heat generated by the circuit board assembly 10 and the second magnetic core 30 when working, thereby ensuring the quick heat dissipation of the circuit board assembly 10 and the second magnetic core 30. In this embodiment, the design of the heat-conducting member 60 reduces the contact thermal resistance between the second magnetic core 30 and the first circuit board 11, and part of the heat generated by the circuit board assembly 10 when working can be quickly conducted to the second magnetic core 30 through the heat-conducting member 60 and then conducted to the outside through the second magnetic core 30; another part of the heat can be directly conducted to the outside through the absorption of the heat-conducting member 60. In addition, since the heat-conducting member 60 has adhesion, the second magnetic core 30 can be fixedly connected with the circuit board assembly 10 through the adhesion of the heat-conducting member 60, thereby enhancing the structural stability of the electronic device 100. In addition, since there is no gap between the heat-conducting member 60 and the first end face 311 and the first front face 111, the heat-conducting member 60 has a large contact area with the first end face 311 and the first front face 111, which is beneficial to improving the heat dissipation efficiency of the circuit board assembly 10 and the second magnetic core 30.

[0180] In other embodiments, the heat-conducting member 60 can also be a colloid having adhesion and good heat conductivity, such as a heat-conducting silica gel; or can also be another soft material or compressed material having good heat conductivity. The heat-conducting member 60 can also be filled between the first end face 311 of the second magnetic core 30 and the first front face 111 of the first circuit board 11 by injection or the like, which is not limited in the present application.

[0181] It should be noted that in this embodiment, the heat-conducting member 60 is arranged on the first end face 311 of the second magnetic core 30 first, and then the second magnetic core 30 is fixedly connected with the first magnetic core 20, so that the heat-conducting member 60 is clamped between the first end face 311 of the second magnetic core 30 and the first front face 111 of the first circuit board 11. In other embodiments, the heat-conducting member 60 can also be arranged on the first front face 111 of the first circuit board 11 first, and then the second magnetic core 30 is fixedly connected with the first magnetic core 20, so that the heat-conducting member 60 is clamped between the first end face 311 of the second magnetic core 30 and the first front face 111 of the first circuit board 11.

[0182] Please refer to Figure 4 and Figure 18 In this embodiment, the number of heat-conducting members 60 is twelve, and the twelve heat-conducting members 60 are six first heat-conducting members 61 and six second heat-conducting members 62. The first heat-conducting members 61 and the second heat-conducting members 62 are both rectangular blocks. In other embodiments, the first heat-conducting members 61 and the second heat-conducting members 62 can also be columns or special-shaped bodies, and the shapes of the six first heat-conducting members 61 and the six second heat-conducting members 62 can also be different, which is not limited in the present application. It should be noted that in this embodiment, the width direction of each heat-conducting member 60 is the X-axis direction shown above, the length direction is the Y-axis direction shown above, and the thickness direction is the Z-axis direction shown above.

[0183] In the embodiment, six first heat-conducting members 61 are arranged on the first end surface 311 of the second main body 31 in sequence and are located between the first fixing body 321 and the second fixing body 322. In the X-axis direction, each first heat-conducting member 61 is arranged on the first end surface 311 between every two adjacent first grooves 331. The thickness dimension of the first heat-conducting member 61 is smaller than the height dimension of the first fixing body 321 and the second fixing body 322, so as to avoid interference of the first heat-conducting member 61 with the first fixing body 321 and the second fixing body 322 when they are mounted on the first circuit board 11. In other embodiments, the six first heat-conducting members 61 can also be arranged without spacing, and the number of the first heat-conducting members 61 can be one, two, three, four, five or more.

[0184] In the embodiment, the distance A2 (as shown in FIG. 6) between the openings of every two adjacent first grooves 331 in the X-axis direction is equal to the width dimension of the first heat-conducting member 61 located between the two first grooves 331. Figure 12 The length dimension of each first heat-conducting member 61 is equal to the width dimension of the second main body 31. That is, the first end surface 311 between every two adjacent first grooves 331 is completely covered by each first heat-conducting member 61. In this way, the second main body 31 and the circuit board assembly 10 have a large contact area with each first heat-conducting member 61, which is conducive to rapid heat dissipation of the circuit board assembly 10 and the second magnetic core 30 by each first heat-conducting member 61. Moreover, the first heat-conducting member 61 has adhesion, which not only ensures the strength of the fixed connection between each first heat-conducting member 61 and the second main body 31, but also avoids falling of the first heat-conducting member 61 from the second main body 31, thereby improving the structural stability. In addition, the second magnetic core 30 can be fixedly connected to the first circuit board 11 of the circuit board assembly 10 through the adhesion of the first heat-conducting member 61, thereby strengthening the structural stability of the electronic device 100.

[0185] In other embodiments, the distance A2 between the openings of every two adjacent first grooves 331 in the X-axis direction can also be not equal to the width dimension of the first heat-conducting member 61 located between the two first grooves 331. The length dimension of each first heat-conducting member 61 can also be not equal to the width dimension of the second main body 31.

[0186] In other embodiments, the number of the first heat-conducting members 61 is one, and one first heat-conducting member 61 is spaced by seven first grooves 331 to form six first sub-heat-conducting members, each of which is similar to the first heat-conducting member 61. For example, the first heat-conducting member 61 can be cut at each first groove 331 by cutting or other methods, so that the six first sub-heat-conducting members are arranged on the first end surface 311 of every two adjacent first grooves 331.

[0187] In the embodiment, six second heat-conducting members 62 are arranged on the first end surface 311 of the second main body 31 in sequence and are located between the first fixing body 321 and the third fixing body 323. Each second heat-conducting member 62 is arranged on the first end surface 311 between every two adjacent second grooves 332. The thickness dimension of the second heat-conducting member 62 is smaller than the height dimension of the first fixing body 321 and the third fixing body 323, so as to avoid the second heat-conducting member 62 interfering with the first fixing body 321 and the third fixing body 323 being mounted on the first circuit board 11. In other embodiments, the six second heat-conducting members 62 can also be distributed without intervals. The number of the second heat-conducting members 62 can also be one, two, three, four, five or more.

[0188] In the embodiment, along the X-axis direction, the distance between the openings of every two adjacent second grooves 332 is equal to the width dimension of the second heat-conducting member 62 located between the two second grooves 332. The length dimension of each second heat-conducting member 62 is equal to the width dimension of the second main body 31. That is, the first end surface 311 between every two adjacent second grooves 332 is completely covered by each second heat-conducting member 62. In this way, it is ensured that each second heat-conducting member 62 has a large contact area with the second main body 31 and the circuit board assembly 10, which is beneficial to the second heat-conducting member 62 quickly dissipating heat of the circuit board assembly 10 and the second magnetic core 30. Moreover, since the second heat-conducting member 62 has adhesion, it not only ensures the strength of the fixed connection between each second heat-conducting member 62 and the second main body 31, but also avoids the second heat-conducting member 62 falling off from the second main body 31, thereby improving the structural stability. In addition, the second magnetic core 30 can also be fixedly connected with the first circuit board 11 of the circuit board assembly 10 through the adhesion of the second heat-conducting member 62, thereby strengthening the structural stability of the electronic device 100.

[0189] In other embodiments, along the X-axis direction, the distance between the openings of every two adjacent second grooves 332 can also be not equal to the width dimension of the second heat-conducting member 62 located between the two second grooves 332. The length dimension of each second heat-conducting member 62 can also be not equal to the width dimension of the second main body 31.

[0190] In other embodiments, the number of the second heat-conducting member 62 is one. One second heat-conducting member 62 is spaced by seven second grooves 332 to form six second sub-heat-conducting members, each of which is similar to the second heat-conducting member 62. For example, the second heat-conducting member 62 can be cut at each second groove 332 by cutting or other means, so as to make the six second sub-heat-conducting members arranged on the first end surface 311 of every two adjacent second grooves 332.

[0191] It should be noted that in this embodiment, each heat-conducting element 60 expands when heated. The coefficient of thermal expansion of each heat-conducting element 60 is between that of the second magnetic core 30 and the first circuit board 11. When the heat-conducting element 60 expands due to heat, it reduces the thermal stress between the heat-conducting element 60 and the second magnetic core 30, and also reduces the thermal stress between the heat-conducting element 60 and the first circuit board 11. This prevents the heated heat-conducting element 60 from damaging the second magnetic core 30 and the first circuit board 11, and also improves the strength of the fixed connection between the heat-conducting element 60 and the second magnetic core 30 and the first circuit board 11.

[0192] In this embodiment, when the electronic device 100 is operating, due to the excellent thermal conductivity of the heat-conducting components 60, each heat-conducting component 60 can quickly absorb and conduct the large amount of heat generated by the circuit board assembly 10 and the second magnetic core 30 during operation to the outside. Specifically, the design of the heat-conducting components 60 reduces the contact thermal resistance between the second magnetic core 30 and the first circuit board 11. Part of the heat generated by the circuit board assembly 10 during operation is quickly conducted to the second magnetic core 30 through the heat-conducting components 60, and then to the outside through the second magnetic core 30; another part of the heat is directly conducted to the outside through absorption by the heat-conducting components 60. The design of the heat-conducting components 60 ensures rapid heat dissipation of the circuit board assembly 10 and the second magnetic core 30, preventing performance damage due to heat accumulation in the circuit board assembly 10 and the second magnetic core 30, extending the service life of the circuit board assembly 10 and the second magnetic core 30, and thus extending the service life of the electronic device 100.

[0193] Furthermore, since the heat-conducting component 60 expands when heated, when the electronic device 100 is working, the first heat-conducting component 61 expands and partially squeezes into the first groove 331; the second heat-conducting component 62 expands and partially squeezes into the second groove 332. The design of the groove 33 effectively disperses the expansion stress generated by the heat-conducting component 60 when heated, preventing the heat-conducting component 60 from expanding and pressing against the second magnetic core 30 and damaging it; moreover, the design of the groove 33 can avoid leaving a gap between the second magnetic core 30 and the heat-conducting component 60, which is conducive to the flattening of the electronic device 100 and facilitates the miniaturization design of the electronic device 100.

[0194] In this embodiment, due to the width dimension of the opening of each first groove 331 along the X-axis direction (e.g., Figure 12 The distances shown in A1 are all less than the distance between the first groove 331 and its adjacent first groove 331 (e.g., ...). Figure 12 As shown in A2); the width of the opening of each second groove 332 is smaller than the distance between the second groove 332 and its adjacent second groove 332. In this way, the first heat-conducting element 61, which is conducive to expansion, is squeezed into the first groove 331, and the second heat-conducting element 62, which is conducive to expansion, is squeezed into the second groove 332, further enhancing the ability of the groove 33 to disperse expansion stress.

[0195] In other embodiments, the second magnetic core 30 can also not be provided with the recess 33. The plurality of first heat-conducting members 61 and the plurality of second heat-conducting members 62 are spaced apart, and the expansion stress generated when each first heat-conducting member 61 is heated is dispersed through the space between the plurality of first heat-conducting members 61, and the expansion stress generated when each second heat-conducting member 62 is heated is dispersed through the space between the plurality of second heat-conducting members 62, so that the first heat-conducting members 61 and the second heat-conducting members 62 that expand when heated can also avoid damaging the second magnetic core 30 by abutting against the second magnetic core 30.

[0196] As shown in Figure 3 and Figure 4 , the electronic device 100 of the embodiments of the present application is provided with the heat-dissipating member 40 between the first main body 21 of the first magnetic core 20 and the second circuit board 13 of the circuit board assembly 10, and is provided with the heat-conducting member 60 between the second main body 31 of the second magnetic core 30 and the first circuit board 11 of the circuit board assembly 10. When the electronic device 100 is working, a large amount of heat generated when the circuit board assembly 10 and the first magnetic core 20 are working can be absorbed by the heat-dissipating member 40 and conducted to the outside, and a large amount of heat generated when the circuit board assembly 10 and the second magnetic core 30 are working can be absorbed by the heat-conducting member 60 and conducted to the outside, so as to ensure the rapid heat dissipation of the circuit board assembly 10, the first magnetic core 20 and the second magnetic core 30, avoid the performance damage of the circuit board assembly 10, the first magnetic core 20 and the second magnetic core 30 due to heat accumulation, prolong the service life of the circuit board assembly 10, the first magnetic core 20 and the second magnetic core 30, and further prolong the service life of the electronic device 100.

[0197] Compared with the prior art, the electronic device 100 of the embodiments of the present application conducts rapid heat dissipation on both sides of the circuit board assembly 10 through the heat-dissipating member 40 and the heat-conducting member 60, solves the problem that the circuit board assembly 10 is not convenient to dissipate heat, effectively increases the heat dissipation area, and has better heat dissipation effect, which is conducive to the miniaturization design and high power density design of the electronic device 100, and further conducive to the miniaturization design and high power density design of the power module 1000a (as shown in Figure 1 ). In addition, through the design of the recess 33, the expansion stress of the heat-conducting member 60 can be effectively dispersed, and the heat-conducting member 60 is prevented from expanding and abutting against the second magnetic core 30 to damage the second magnetic core 30; moreover, the design of the recess 33 can avoid leaving a gap between the second magnetic core 30 and the heat-conducting member 60, which is conducive to the flattening of the electronic device 100 and facilitates the miniaturization design of the electronic device 100. In addition, the electronic device 100 of the embodiments of the present application has a simple structure, is easy to process, and has low processing cost.

[0198] Please refer to Figures 18 to 20 , Figure 18 is Figure 2 the perspective structural schematic diagram of the electronic device 100 in the second embodiment in Figure 19 ,Figure 18 a cross-sectional view of the electronic device 100 along the line XX-XX in Figure 20 is Figure 18 a structure exploded schematic view of the cross-sectional view of the electronic device 100 along the line XX-XX in

[0199] The electronic device 100 shown in the embodiment is different from the electronic device 100 shown in the first embodiment described above in that the number of the first heat-conducting member 61 and the second heat-conducting member 62 is one. The first heat-conducting member 61 is located between the first end surface 311 of the second main body 31 and the first circuit board 11 of the circuit board assembly 10. The opposite ends of the first heat-conducting member 61 abut against the first fixed body 321 and the second fixed body 322, respectively. The length dimension of the first heat-conducting member 61 is equal to the width dimension of the second main body 31. That is, the first heat-conducting member 61 completely covers the first end surface 311 between the first fixed body 321 and the second fixed body 322. In other embodiments, the length dimension of the first heat-conducting member 61 can not be equal to the width dimension of the second main body 31.

[0200] The second heat-conducting member 62 is located between the first end surface 311 of the second main body 31 and the first circuit board 11 of the circuit board assembly 10. The opposite ends of the second heat-conducting member 62 abut against the first fixed body 321 and the third fixed body 323, respectively. The length dimension of the second heat-conducting member 62 is equal to the width dimension of the second main body 31. That is, the second heat-conducting member 62 completely covers the first end surface 311 between the first fixed body 321 and the third fixed body 323. In other embodiments, the length dimension of the second heat-conducting member 62 can not be equal to the width dimension of the second main body 31.

[0201] Compared with the electronic device 100 shown in the first embodiment described above, the electronic device 100 shown in the embodiment has the first heat-conducting member 61 and the second heat-conducting member 62, each of which has a larger contact area with the second magnetic core 30 and the first circuit board 11 of the circuit board assembly 10, which is conducive to the rapid heat dissipation of the second magnetic core 30 and the first circuit board 11 of the circuit board assembly 10, and further improves the heat dissipation efficiency. Moreover, since the number of the first heat-conducting member 61 and the second heat-conducting member 62 is one, it is convenient to arrange the first heat-conducting member 61 and the second heat-conducting member 62 between the second magnetic core 30 and the first circuit board 11 of the circuit board assembly 10, which is easy to assemble and reduces the assembly time.

[0202] The above merely describes some embodiments and implementations of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which shall be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic device applied to a power module, characterized by, The electronic device includes: A circuit board assembly, the circuit board assembly including a first circuit board and a second circuit board, the first circuit board and the second circuit board being stacked and electrically connected; A first magnetic core, comprising a first body, is mounted on a second circuit board, the first body being located on the side of the second circuit board opposite to the first circuit board; The second magnetic core includes a second body, the second magnetic core is mounted on the first circuit board, the second body is located on the side of the first circuit board facing away from the second circuit board, and the second magnetic core is fixedly connected to the first magnetic core; A first heat sink is located between the first body and the second circuit board, and is in contact with both the first body and the second circuit board; and A first heat-conducting component is located between the second body and the first circuit board, and is in contact with the second body and the first circuit board. The second body includes a first end face, the first end face is recessed with a first groove, the first groove has an opening located on the first end face, and the first heat-conducting element is located on the first end face and outside the first groove.

2. Electronic device according to claim 1, characterized in that The number of the first heat-conducting elements is multiple, and the multiple first heat-conducting elements are spaced apart by the first groove; or, the first heat-conducting elements cover the first groove.

3. Electronic device according to claim 1, characterized in that The first thermal conductive element is bonded to the first end face and the surface of the first circuit board.

4. Electronic device according to any one of claims 1 to 3, characterized in that, The thermal expansion coefficient of the first heat-conducting component is between that of the first magnetic core and the first circuit board.

5. Electronic device according to any one of claims 1 to 4, characterized in that The number of the first grooves is multiple, and the multiple first grooves are spaced apart sequentially. The number of the first heat-conducting elements is multiple, and each first heat-conducting element is disposed on the first end face between two adjacent first grooves.

6. Electronic device according to any one of claims 1 to 5, characterized in that The second magnetic core also includes a first fixing body and a second fixing body, the first fixing body and the second fixing body protruding from the first end face and spaced apart, the first groove and the first heat-conducting element being located on the first end face between the first fixing body and the second fixing body.

7. Electronic device according to claim 6, characterized in that The first heat-conducting element completely covers the first end face between the first fixing body and the second fixing body.

8. Electronic device according to claim 6, characterized in that The height of the first fixing body and the second fixing body is greater than the thickness of the first heat-conducting component. The first circuit board is provided with a first through hole and a second through hole. The first fixing body is inserted into the first through hole, and the second fixing body is inserted into the second through hole.

9. Electronic device according to any of claims 1 to 3, characterized in that The cross-sectional shape of the first groove is rectangular, triangular, arc-shaped protrusion, or trapezoidal.

10. Electronic device according to claim 8, characterized in that The electronic device further includes a second heat-conducting element, which is located on a first end face of the first fixing body on the side away from the second fixing body, and the second heat-conducting element is in contact with the first circuit board.

11. Electronic device according to claim 10, characterized in that The second body of the second magnetic core is further recessed with a second groove, the second groove having an opening located on the first end face, and the second heat-conducting element is spaced through the second groove; or, the second heat-conducting element covers the second groove.

12. Electronic device according to claim 11, characterized in that The second magnetic core also includes a third fixing body, which protrudes from the first end face and is spaced apart from the first fixing body, and is located on the side of the first fixing body away from the second fixing body. The first circuit board is provided with a third through hole, and the third fixing body is inserted into the third through hole. The second heat-conducting element and the second groove are located on the first end face between the first fixing body and the third fixing body.

13. The electronic device of claim 11, wherein, The number of the second grooves is multiple, and the multiple second grooves are spaced apart sequentially. The number of the second heat-conducting elements is multiple, and each second heat-conducting element is disposed on the first end face between each two adjacent second grooves.

14. The electronic device of claim 12, wherein, The second heat-conducting element completely covers the first end face between the first fixing body and the third fixing body.

15. Electronic device according to any one of claims 11 to 14, characterized in that The cross-sectional shape of the second groove is rectangular, triangular, arc-shaped protrusion, or trapezoidal.

16. The electronic device of claim 12, wherein, The first body of the first magnetic core includes a first surface. The first magnetic core also includes a first connector and a second connector. The first connector and the second connector protrude from the first surface and are spaced apart. The first heat sink is located on the first surface between the first connector and the second connector.

17. Electronic device according to claim 16, characterized in that The second circuit board is provided with a first docking through hole and a second docking through hole. The first docking through hole corresponds to the first through hole, and the second docking through hole corresponds to the second through hole. The first connector is inserted into the first docking through hole and fixedly connected to the first fixing body, and the second connector is inserted into the second docking through hole and fixedly connected to the second fixing body.

18. Electronic device according to claim 17, characterized in that The electronic device further includes a first adhesive and a second adhesive, wherein the first connector is fixedly connected to the first fixing body through the first adhesive, and the second connector is fixedly connected to the second fixing body through the second adhesive.

19. The electronic device of claim 17, wherein, The first magnetic core further includes a third connector, which protrudes from the first surface and is spaced apart from the first connector, and is located on the side of the first connector away from the second connector. The electronic device further includes a second heat sink, which is located on the first surface between the first connector and the third connector.

20. Electronic device according to claim 19, characterized in that The electronic device further includes a third adhesive component. The second circuit board is provided with a third through hole, which corresponds to the third through hole. The third connector is inserted into the third through hole and is fixedly connected to the third fixing body through the third adhesive component.

21. The electronic device of claim 19, wherein, The circuit board assembly further includes a first winding and a second winding. The first winding is disposed on the first circuit board and electrically connected to the first circuit board, and the second winding is disposed on the second circuit board and electrically connected to the second circuit board. The first winding and the second winding are coupled. The first winding surrounds the first through hole, and the second winding surrounds the first mating through hole.

22. A power module, characterized by The invention includes the electronic device and housing as described in any one of claims 1 to 21, wherein the electronic device is housed inside the housing and is used for voltage conversion of alternating current.

23. An electronic device, comprising: The power module and the load module of claim 22 are electrically connected.

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