Semiconductor structure compression assembly and semiconductor structure fixture

Abstract

The application relates to a semiconductor structure pressing assembly and a semiconductor structure fixing device. The semiconductor structure pressing assembly comprises a cushion block, a carrier, a heat expansion piece, a connecting rod and an elastic piece. The bottom surface of the cushion block is used for abutting against the top surface of a chip. The carrier is arranged above the cushion block, and the carrier is provided with a channel with a gradually increased diameter in a direction away from the cushion block. The chip is positioned in the vertical direction by being pressed against the top surface of the chip. Therefore, the test efficiency can be greatly improved without frequently adjusting the thickness or quantity of the gaskets due to the change of the test temperature. When the thickness size of the chip changes, the compression amount of the elastic piece is changed through the cushion block, the connecting rod and the heat expansion piece, the cushion block can still tightly press the chip, the positioning of the chip in the direction along the surface thereof is ensured, and therefore, the test efficiency can be greatly improved without adjusting the thickness or quantity of the gaskets.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor products, in particular to a semiconductor structure pressing assembly and a semiconductor structure fixing device. BACKGROUND

[0002] The semiconductor structure, specifically including but not limited to a packaged chip and a PCB board, taking the packaged chip as an example, the packaged chip refers to a chip that has completed packaging, which is referred to as a chip hereinafter. During functional testing, the solder balls of the chip need to be connected with the pogo pins on the test board card to send various signals for functional testing. Among them, the pogo pins on the test board card with the same number of solder balls have fixed positions, in order to ensure that the solder balls of the chip and the pogo pins on the test board card are in good one-to-one correspondence during testing, the semiconductor structure fixing device is used to fix and align the chip in the horizontal direction and fix and align the chip in the vertical direction.

[0003] Traditionally, in order to stably fix the chip and make the solder balls of the chip in good one-to-one correspondence with the pogo pins on the test board card, a semiconductor structure pressing assembly including a cover and a gasket is usually used to press on the chip, when the thickness of the chip is different, the thickness or the number of the gasket is adjusted to fix the chip, which is relatively complex and low in work efficiency; in addition, under different test temperatures, the solder balls of the chip expand and deform under different test temperatures, which can easily cause the gasket to be pressed to cause irreversible damage to the solder balls, that is, the thickness or the number of the gasket also needs to be adjusted in time according to different test temperatures, which is also relatively complex and low in work efficiency. SUMMARY

[0004] Therefore, it is necessary to overcome the defects of the prior art and provide a semiconductor structure pressing assembly and a semiconductor structure fixing device, which can improve work efficiency and will not cause damage to the solder balls of the chip when working under different test temperatures.

[0005] The technical scheme is as follows: a semiconductor structure pressing assembly, the semiconductor structure pressing assembly comprising: a pad block;

[0006] a carrier located above the pad block, the carrier being provided with a channel with a gradually increasing diameter in a direction away from the pad block;

[0007] a heat-expandable member arranged inside the channel, the heat-expandable member changing in volume when the ambient temperature changes and moving along the channel;

[0008] a connecting rod arranged inside the channel, the heat-expandable member being connected to the pad block through the connecting rod;

[0009] An elastic member is arranged inside the channel, and the heat-expandable member is connected to the carrier through the elastic member.

[0010] In one embodiment, the heat-expandable member is a tin ball or a phase-change material.

[0011] In one embodiment, the end of the connecting rod is provided with a pad, and the heat-expandable member is connected to the pad.

[0012] In one embodiment, the pad is adapted to the bottom surface of the heat-expandable member and is fixedly connected to the bottom surface of the heat-expandable member.

[0013] In one embodiment, the channel is a blind groove, one end of the elastic member is in contact with or connected to the wall of the blind groove, and the other end of the elastic member is in contact with or connected to the heat-expandable member.

[0014] In one embodiment, the channel is located on the bottom surface of the carrier, and there are at least two channels arranged at intervals; the heat-expandable member, the connecting rod, and the elastic member are all at least two, and are all arranged corresponding to the at least two channels.

[0015] In one embodiment, the semiconductor structure pressing assembly further comprises a first guide member, and the pad is connected to the carrier through the first guide member.

[0016] In one embodiment, the first guide member is at least two; the first guide member is connected to one of the pad and the carrier, and the other of the pad and the carrier is provided with a first guide hole corresponding to the first guide member.

[0017] In one embodiment, the semiconductor structure pressing assembly further comprises a top cover; the carrier is at least two, and the top cover is connected to the at least two carriers respectively.

[0018] In one embodiment, the heat-expandable member is spherical, hemispherical, ellipsoidal, semi-ellipsoidal, or conical frustum; and the channel is conical frustum.

[0019] A semiconductor structure fixing device comprises:

[0020] A semiconductor structure clamping assembly;

[0021] A semiconductor structure pressing assembly is located in the semiconductor structure clamping assembly, and the semiconductor structure pressing assembly comprises:

[0022] A pad;

[0023] A carrier is arranged above the cushion block, and the carrier is provided with a channel with a gradually increasing diameter in a direction away from the cushion block;

[0024] A thermal expansion element is arranged inside the channel, and the thermal expansion element changes in volume when the ambient temperature changes and can move along the channel;

[0025] A connecting rod is arranged inside the channel, and the thermal expansion element is connected to the cushion block through the connecting rod;

[0026] An elastic element is arranged inside the channel, and the thermal expansion element is connected to the carrier through the elastic element.

[0027] In one embodiment, the semiconductor structure clamping assembly comprises:

[0028] A plurality of frame edges are sequentially connected to form a positioning frame capable of being positioned at the periphery of a chip, each frame edge comprises a first reference block and a second reference block arranged along the length direction thereof, the first reference block is provided with an insert, the second reference block is provided with an insertion hole corresponding to the position of the insert, the insert is inserted into the insertion hole and can be fixed on the second reference block, and the fixed position of the insert on the second reference block along the insertion direction thereof is adjustable.

[0029] In one embodiment, the surface of the insert is provided with a first tooth, and the insertion hole wall is provided with a second tooth engaged with the first tooth; after the insert is inserted into the insertion hole, the first tooth and the second tooth are engaged with each other, and the insert can move in the radial direction of the insertion hole under the driving of an external force so that the first tooth and the second tooth are separated from each other.

[0030] In one embodiment, each frame edge further comprises a second guide, and the first reference block is connected to the second reference block through the second guide, and the guide direction of the second guide is the same as the insertion direction of the insert.

[0031] In one embodiment, the insert is provided with a natural state and a compressed state; when the insert is inserted into the insertion hole and the first tooth and the second tooth are engaged with each other, the insert is in the compressed state; when the insert is pulled out of the insertion hole, the insert is in the natural state; when the insert is in the natural state, the extension direction of the insert is arranged at an angle with the guide direction of the second guide.

[0032] The semiconductor structure pressing assembly and the semiconductor structure fixing device can position the chip in the vertical direction by pressing the top surface of the chip. When the test temperature changes, for example, the test temperature increases, the volume of the thermal expansion member increases accordingly. Since the diameter of the channel gradually increases in the direction away from the chip, the thermal expansion member can move along the channel in the direction away from the chip. When the thermal expansion member moves, the spacer is synchronously moved in the direction away from the chip through the connecting rod. Therefore, space is provided for the solder balls on the chip that expand and deform due to the temperature increase, so that the solder balls on the chip that expand and deform are prevented from being pressed by the spacer and being irreversibly damaged. Therefore, the thickness or the number of the spacers does not need to be frequently adjusted due to the change of the test temperature, so that the test efficiency is greatly improved. When the thickness of the chip changes, the compression amount of the elastic member changes through the spacer, the connecting rod and the thermal expansion member. The spacer can still press the chip tightly, so that the chip is positioned in the direction perpendicular to the surface of the chip. Therefore, the thickness or the number of the spacers does not need to be adjusted, so that the test efficiency is greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0033] The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the application, and are incorporated herein for purposes of illustrating the illustrative embodiments of the present application and the explanations provided herein. However, it is expressly noted that the drawings are included solely for purposes of illustrating the illustrative embodiments of the present application and should not be construed as posing limitations to the present application.

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the accompanying drawings needed to be used in the embodiments will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0035] Figure 1 A structure schematic diagram of the semiconductor structure pressing assembly of an embodiment of the present application;

[0036] Figure 2 A structure schematic diagram in which the elastic member, the thermal expansion member and the connecting rod in the semiconductor structure pressing assembly of an embodiment of the present application are arranged in the channel;

[0037] Figure 3 A structure schematic diagram in which the connecting rod is additionally provided with a spacer; Figure 2

[0038] Figure 4 A structure schematic diagram in which the spacer in the semiconductor structure pressing assembly of an embodiment of the present application is provided with at least two first guide members.​

[0039] Figure 5 exploded view of a semiconductor structure pressing assembly according to an embodiment of the present application;

[0040] Figure 6 view of a semiconductor structure fixing device clamping and positioning a chip according to an embodiment of the present application;

[0041] Figure 7 view of a semiconductor structure fixing device clamping and positioning a chip according to another embodiment of the present application;

[0042] Figure 8 view of a semiconductor structure fixing device clamping and positioning a chip and allowing a solder ball on the chip to be connected with a contact pin on a test board according to an embodiment of the present application;

[0043] Figure 9 view of a semiconductor structure clamping assembly according to an embodiment of the present application;

[0044] Figure 10 view of two adjacent frame edges of a semiconductor structure clamping assembly according to an embodiment of the present application;

[0045] Figure 11 view of a semiconductor structure clamping assembly according to another embodiment of the present application.

[0046] 10, semiconductor structure pressing assembly; 11, pad; 12, carrier; 121, channel; 122, first guide hole; 123, second mounting hole; 13, thermal expansion member; 14, connecting rod; 141, pad plate; 15, elastic member; 16, first guide member; 17, top cover; 171, first mounting member; 172, first mounting hole; 173, second mounting member; 174, third mounting hole; 20, chip; 21, solder ball; 30, semiconductor structure clamping assembly; 31, frame edge; 311, first reference block; 3111, plug-in member; 3112, first tooth; 3113, pushing portion; 312, second reference block; 3121, plug-in hole; 313, second guide member; 314, second guide hole; 40, test board; 41, contact pin. DETAILED DESCRIPTION

[0047] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in other ways different from those described herein without departing from the scope of the present application, and those skilled in the art can make similar improvements without departing from the scope of the present application, and therefore the present application is not limited to the specific embodiments disclosed below.

[0048] In traditional technology, when the chip thickness varies, the chip is fixed by adjusting the thickness or number of shims. This process is complex and inefficient. Furthermore, at different test temperatures, the solder balls on the chip can expand and deform, potentially causing irreversible damage to the solder balls due to the pressure of the shims. This also requires timely adjustment of the shim thickness or number for different test temperatures, which is also complex and inefficient.

[0049] Based on this, see Figure 1 , Figure 2 and Figure 6 , Figure 1 It shows Figure 1 This is a schematic diagram of the structure of a semiconductor structure clamping assembly 10 according to an embodiment of the present invention. Figure 2 This diagram illustrates the structure of a semiconductor structure clamping assembly 10 according to an embodiment of the present invention, in which the elastic element 15, the thermal expansion element 13, and the connecting rod 14 are disposed within the channel 121. Figure 6 This diagram illustrates the structure of a packaged chip 20 fixing device according to an embodiment of the present invention, showing the chip 20 being clamped and positioned. The semiconductor structure fixing device provided in this embodiment includes a semiconductor structure clamping assembly 10 and a semiconductor structure clamping assembly 30. The semiconductor structure clamping assembly 30 is located on the semiconductor structure clamping assembly 10. The semiconductor structure clamping assembly 30 clamps and positions the edge contour of the chip 20, achieving horizontal positioning of the chip 20; and the semiconductor clamping assembly 10 clamps the top surface of the chip 20, achieving vertical positioning of the chip 20. This ensures that during testing, the solder balls 21 of the chip 20 and the pins 41 on the test board 40 make good one-to-one contact, thereby guaranteeing the accuracy of the test.

[0050] Specifically, the semiconductor structure clamping assembly 10 includes: a pad 11, a carrier 12, a thermally expandable member 13, a connecting rod 14, and an elastic member 15. The bottom surface of the pad 11 is used to abut against the top surface of the chip 20. The carrier 12 is located above the pad 11 and has a channel 121 whose diameter gradually increases in the direction away from the pad 11. The thermally expandable member 13 is disposed inside the channel 121, and its volume changes accordingly when the ambient temperature changes, allowing it to move along the channel 121. The thermally expandable member 13 is connected to the pad 11 via the connecting rod 14. The thermally expandable member 13 is connected to the carrier 12 via the elastic member 15.

[0051] The semiconductor structure compression assembly 10 can position the chip 20 in the vertical direction by compressing the top surface of the chip 20. On one hand, when the test temperature changes, for example, when the test temperature rises, the volume of the thermal expansion member 13 increases accordingly. Since the diameter of the passage 121 gradually increases in the direction away from the chip 20, the thermal expansion member 13 can move along the passage 121 in the direction away from the chip 20. When the thermal expansion member 13 moves, the cushion block 11 is synchronously driven by the connecting rod 14 in the direction away from the chip 20, thereby providing space for the solder balls 21 on the chip 20 to expand and deform due to the temperature rise, avoiding irreversible damage caused by the expansion and deformation of the solder balls 21 on the chip 20 pressing against the cushion block 11. Therefore, it is not necessary to frequently adjust the thickness or the number of the gaskets when the test temperature changes, thereby greatly improving the test efficiency. On the other hand, since the thermal expansion member 13 is connected to the carrier 12 by the elastic member 15, the elastic member 15 is in a compressed state, and the thermal expansion member 13 acts on the cushion block 11 through the connecting rod 14, and the chip 20 is positioned by the cushion block 11 compressing and abutting against the chip 20. When the thickness of the chip 20 changes, the compression amount of the elastic member 15 changes through the cushion block 11, the connecting rod 14, and the thermal expansion member 13. The cushion block 11 can still compress the chip 20 tightly, ensuring the positioning of the chip 20 in the direction perpendicular to the surface of the chip 20, thereby eliminating the need to adjust the thickness or the number of the gaskets, and greatly improving the test efficiency.

[0052] It should be noted that the test temperature usually changes between -40°C and 125°C. Generally, the solder balls 21 on the chip 20 (made of tin) will change in volume with the change in test temperature. The thermal expansion or thermal contraction of the solder balls 21 on the chip 20 will cause poor contact and affect the accuracy of the test results.

[0053] In one embodiment, the thermal expansion member 13 includes but is not limited to a tin ball or a phase change material.

[0054] When the thermal expansion member 13 is a tin ball, the tin ball will change in volume with the change in test temperature. For example, when the test temperature rises, both the tin ball and the solder balls 21 on the chip 20 will expand due to the heat. When the tin ball expands due to the heat, it will move along the passage 121 in the direction away from the chip 20, thereby synchronously driving the cushion block 11 in the direction away from the chip 20. Conversely, when the test temperature decreases, both the tin ball and the solder balls 21 on the chip 20 will contract due to the cold. When the tin ball contracts due to the cold, it will move along the passage 121 in the direction close to the chip 20 under the action of its own gravity and the elastic force of the elastic member 15.

[0055] Of course, the thermal expansion component 13 is not limited to the solder balls in the above embodiments, but may also include, but is not limited to, phase change materials. Specifically, phase change materials include, but are not limited to, SbxSbyTez, CrxSbyTez, etc. These phase change materials are resistant to high temperatures and have low thermal weight. Their volume does not change significantly with temperature, but when the test temperature of the environment changes, the phase change material will change its volume with the test temperature, which is consistent with the change of the solder balls 21 on the chip 20, so as to avoid the phenomenon of extrusion damage and poor contact of the solder balls 21 on the chip 20 under different test temperatures.

[0056] See Figure 2 In one embodiment, the thermal expansion member 13 may be, but is not limited to, spherical, hemispherical, ellipsoidal, semi-ellipsoidal, or frustum-shaped. Thus, when the thermal expansion member 13 is specifically, for example, spherical, hemispherical, ellipsoidal, semi-ellipsoidal, or frustum-shaped, and its volume changes with temperature, the thermal expansion member 13 can move up and down along the channel 121 more smoothly, preventing it from becoming stuck and fixed to the inner wall of the channel 121 when its volume changes.

[0057] As an example, when the thermal expansion member 13 is spherical or ellipsoidal, whether it moves upward or downward along the channel 121, the entire outer wall of the thermal expansion member 13 is arc-shaped, which makes the movement along the inner wall of the channel 121 relatively smooth and less likely to get stuck on the inner wall of the channel 121.

[0058] Furthermore, the channel 121 may be, but is not limited to, a frustum-shaped structure. Specifically, the frustum-shaped structure includes, but is not limited to, a truncated cone, a trapezoidal frustum, or a pentagonal frustum. Thus, based on the characteristic of the gradually decreasing diameter of the frustum-shaped structure, the inner wall of the channel 121 is an inclined surface set relative to its central axis. Under the guiding effect of the inclined surface, the thermal expansion member 13 moves smoothly and stably up and down within the channel 121. During the movement of the thermal expansion member 13, the force on each position of its bottom surface is relatively uniform, preventing swaying.

[0059] Please see Figure 3 , Figure 3 It shows in Figure 2 The diagram shows a structure with a pad 141 added to the connecting rod 14. In one embodiment, the end of the connecting rod 14 is provided with a pad 141, and is connected to the thermal expansion member 13 through the pad 141. In this way, the pad 141 can increase the contact area between the end of the connecting rod 14 and the thermal expansion member 13, and can prevent, for example, when in a heated state, the end of the connecting rod 14 from piercing the thermal expansion member 13 and thus failing to maintain synchronous up-and-down movement with the thermal expansion member 13 along the channel 121.

[0060] It should be noted that in order to move up and down along the passage 121 together with the thermal expansion piece 13, the length and width of the pad plate 141 is smaller than the caliber size of the passage 121, so that the pad plate 141 can move up and down freely in the passage 121, and when the thermal expansion piece 13 moves in the passage 121 due to volume change, the pad plate 141 is driven to move in the passage 121 synchronously, and the connecting rod 14 is driven to move synchronously when the pad plate 141 moves.

[0061] Please refer to Figure 3 In an embodiment, the pad plate 141 is adapted to the bottom surface of the thermal expansion piece 13 and is fixedly connected to the bottom surface of the thermal expansion piece 13. For example, when the thermal expansion piece 13 is spherical, the pad plate 141 is correspondingly provided as an arc-shaped plate; when the thermal expansion piece 13 is, for example, a circular truncated cone, the pad plate 141 is correspondingly provided as a flat plate and is attached to the bottom surface of the circular truncated cone.

[0062] It should be noted that as an optional solution, the end of the connecting rod 14 is directly connected to the thermal expansion piece 13, or is connected to the thermal expansion piece 13 through a structure not limited to the pad plate 141.

[0063] When the connecting rod 14 is directly connected to the thermal expansion piece 13, the "connecting rod 14" can be "part of the thermal expansion piece 13", that is, the "connecting rod 14" is integrally formed with "other parts of the thermal expansion piece 13"; or can be a separate component separable from "other parts of the thermal expansion piece 13", that is, the "connecting rod 14" can be independently manufactured and then combined with "other parts of the thermal expansion piece 13" to form an integral whole.

[0064] Please refer to Figure 1 With Figure 2 As an example, when one end of the elastic member 15 is fixedly connected to the top wall of the blind groove, the other end of the elastic member 15 is connected to the thermal expansion piece 13, for example, in a form of abutting fit, so that during the movement of the thermal expansion piece 13 up and down along the passage 121, the other end of the elastic member 15 can move and adjust position relative to the surface of the thermal expansion piece 13, thereby avoiding the distortion of the elastic member 15, and ensuring that the pad 11 is stressed more uniformly and moves up and down with the thermal expansion piece 13 stably and reliably.

[0065] Of course, when one end of the elastic member 15 abuts against the wall of the blind groove and the other end of the elastic member 15 abuts against or is connected to the thermal expansion piece 13, the elastic member 15 can also exert its elastic supporting force to cooperate with the up and down movement of the thermal expansion piece 13 in the passage 121, which is also a feasible solution.

[0066] Please refer to Figure 1 With Figure 2In one embodiment, the elastic member 15 includes, but is not limited to, a spring or an elastic block, as long as it is a structure capable of providing elastic force support, which is not limited here and can be flexibly set according to actual needs.

[0067] Referring to Figure 1 With Figure 2 In one embodiment, the channel 121 is a blind groove. Of course, the channel 121 can also be a through groove penetrating through two opposite surfaces of the carrier 12, in which case the end of the elastic member 15 away from the heat-expandable member 13 is fixedly connected to the wall of the through groove, so that the elastic member 15 is arranged inside the through groove and cannot come out, or the inner diameter of the through groove at the end away from the heat-expandable member 13 is small enough to tightly abut against the end of the elastic member 15 away from the heat-expandable member 13, so as to prevent the elastic member 15 from coming out of the through groove.

[0068] Specifically, the blind groove is a conical frustum-shaped groove. The aperture of the blind groove is, for example, 0.4±0.02 mm, and the inner diameter of the bottom wall of the blind groove is, for example, 1±0.02 mm. The heat-expandable member 13 is, for example, a sphere, and the diameter of the sphere is, for example, 0.5±0.05 mm. In addition, the connecting rod 14 is, for example, a metal rod, and the diameter of the metal rod is, for example, 0.1±0.02 mm. In addition, the elastic member 15 is, for example, a spring, and the length of the spring in a natural state is 1.5 mm.

[0069] Referring to Figure 1 With Figure 2 In one embodiment, the channel 121 is located on the bottom surface of the carrier 12, that is, the channel 121 is located on the bottom surface of each side wall, and the channel 121 is arranged in at least two and spaced apart from each other, that is, at least two channels 121 are arranged on each side wall. Of course, the channel 121 can also be arranged as one and as close as possible to the center position of the bottom surface of the carrier 12, so that the cushion block 11 is more uniformly stressed and moves up and down stably and reliably. Correspondingly, the heat-expandable member 13, the connecting rod 14, and the elastic member 15 are at least two and correspondingly arranged with the at least two channels 121. In this way, the semiconductor structure compression assembly 10 can be connected to the cushion block 11 through the at least two connecting rods 14 on the carrier 12 and synchronously drive the cushion block 11 to move up and down through the at least two connecting rods 14, so as to ensure the stability and reliability of the operation of the cushion block 11 and enable the cushion block 11 to be compressed to the top surface of the chip 20, so that the chip 20 is stably positioned in the direction perpendicular to the surface thereof.

[0070] As an example, the channel 121 is at least three, and the channels 121 are arranged at equal intervals on the bottom surface of the carrier 12, so as to ensure the stability and reliability of the operation of the cushion block 11 and enable the cushion block 11 to be compressed to the top surface of the chip 20, so that the chip 20 is stably positioned in the direction perpendicular to the surface thereof.

[0071] As an example, since the chip 20 is square, two opposite surfaces (bottom and top) of the cushion block 11 are correspondingly square, two opposite surfaces (bottom and top) of the carrier 12 are correspondingly square, and the channels 121 are for example eight, with two channels 121 at each end of each edge of the bottom of the carrier 12, so that the connecting rods 14 in the two channels 121 of each edge of the bottom of the carrier 12 act on the two ends of each edge of the surface of the cushion block 11, thereby ensuring the stability and reliability of the operation of the cushion block 11, and enabling the cushion block 11 to be pressed against the top of the chip 20, so that the chip 20 is stably positioned in the direction perpendicular to the surface thereof.

[0072] Please refer to Figure 1 、 Figures 5 to 7 , Figure 5 Fig. 1 shows a schematic diagram of an exploded structure of a semiconductor structure pressing assembly 10 according to an embodiment of the present application, Figure 6 Fig. 2 shows a schematic diagram of a structure of a semiconductor structure fixing device clamping and positioning a chip 20 according to an embodiment of the present application, Figure 7 Fig. 3 shows a schematic diagram of a structure of a semiconductor structure fixing device clamping and positioning a chip 20 according to another embodiment of the present application. In an embodiment, the semiconductor structure pressing assembly 10 further comprises a first guide 16, and the cushion block 11 is connected to the carrier 12 through the first guide 16. In this way, during the up-and-down movement of the cushion block 11, the first guide 16 guides the up-and-down movement of the cushion block 11, so that the cushion block 11 is always in a horizontal state during the up-and-down movement, and the cushion block 11 does not tilt.

[0073] Please refer to Figure 1 、 Figures 5 to 7 In an embodiment, the first guide 16 is at least two. The first guide 16 is connected to one of the cushion block 11 and the carrier 12, and the other of the cushion block 11 and the carrier 12 is provided with a first guide hole 122 corresponding to the first guide 16. In this way, the at least two first guides 16 guide the movement of the cushion block 11, so that the cushion block 11 has better stability and is always in a horizontal state during the up-and-down movement, and the cushion block 11 does not tilt.

[0074] It should be noted that the first guide 16 and the first guide hole 122 can be flexibly arranged on the cushion block 11 and the carrier 12, respectively, and the specific arrangement position and length of each can be flexibly adjusted according to actual needs, which are not limited herein, as long as the first guide 16 and the first guide hole 122 can guide the up-and-down movement of the cushion block 11 when the heat expansion member 13 drives the cushion block 11 to move up and down through the connecting rod 14, so as to ensure the better stability of the operation of the cushion block 11.

[0075] As an example, the first guide members 16 are at least three, and the at least three first guide members 16 are arranged on the cushion block 11 at equal intervals. For example, the first guide members 16 are eight, and the first guide members 16 are arranged at both ends of each side of the cushion block 11.

[0076] Referring to Figures 5 to 8 , Figure 8 Fig. 6 shows a schematic view of the structure of the packaging chip 20 fixing device clamping and positioning the chip 20 and making the solder balls 21 on the chip 20 butt against the pogo pins 41 on the test board 40. In an embodiment, the semiconductor structure pressing assembly 10 further comprises a top cover 17. The carriers 12 are at least two, and the top cover 17 is connected with the at least two carriers 12 respectively. The heat expansion members 13, the connecting rods 14, and the elastic members 15 are at least two, and are arranged correspondingly with the carriers 12. Thus, the at least two carriers 12 are arranged on the top cover 17, the top cover 17 is arranged on a machine table (not shown in the figure), and the connecting rods 14 of the at least two carriers 12 are connected with the cushion block 11 respectively, so as to ensure the stability and reliability of the operation of the cushion block 11, and to realize the pressing of the cushion block 11 to the top surface of the chip 20, so as to stably position the chip 20 in the direction perpendicular to the surface of the chip 20.

[0077] Referring to Figures 5 to 7 In an embodiment, the top cover 17 is detachably connected with the carrier 12 through a first mounting member 171, for example, a screw, a bolt, a screw, a pin, a rivet, etc., the top cover 17 is provided with a first mounting hole 172 corresponding to the first mounting member 171, and the carrier 12 is provided with a second mounting hole 123 corresponding to the first mounting member 171. As an optional solution, the top cover 17 can also be connected with the carrier 12 in other ways, including but not limited to clamping, welding, and bonding.

[0078] Referring to Figures 5 to 7 In an embodiment, the top cover 17 is detachably arranged on the machine table through a second mounting member 173, for example, a screw, a bolt, a screw, a pin, a rivet, etc., and the top cover 17 is provided with a third mounting hole 174 corresponding to the second mounting member 173. It should be noted that the top cover 17 can also be arranged on the machine table in other ways, which are not limited here and can be selected according to actual conditions.

[0079] Referring to Figures 8 to 10In one embodiment, the packaged chip 20 fixing device further comprises a semiconductor structure clamping assembly 30. The semiconductor structure clamping assembly 30 comprises a plurality of frame edges 31. The plurality of frame edges 31 are connected in sequence to form a positioning frame capable of being positioned at the periphery of the chip 20. Each frame edge 31 comprises a first reference block 311 and a second reference block 312 arranged along the length direction thereof. The first reference block 311 is provided with a plug 3111, and the second reference block 312 is provided with a socket 3121 corresponding to the position of the plug 3111. The plug 3111 is inserted into the socket 3121 and can be fixed on the second reference block 312, and the fixed position of the plug 3111 on the second reference block 312 along the insertion direction thereof is adjustable.

[0080] It should be noted that the length direction of the frame edge 31 refers to the direction from one end of the frame edge 31 to the other end, i.e. the x direction or the y direction as shown in the figure.

[0081] The semiconductor structure clamping assembly 30 described above, since the plug 3111 is inserted into the socket 3121 and can be fixed on the second reference block 312, and the fixed position of the plug 3111 on the second reference block 312 along the insertion direction thereof is adjustable, so by adjusting the fixed position of the plug 3111 on the second reference block 312 along the insertion direction, the length of the frame edge 31 can be adjusted accordingly, and by adjusting the length of the frame edge 31, the size of the positioning frame can be adjusted, thereby realizing the clamping of chips 20 of different sizes. In addition, the plug 3111 is fixed on the second reference block 312 by being inserted into the socket 3121, and the socket 3121 plays a positioning role on the plug 3111, which is conducive to the stable and reliable structure of the frame edge 31 formed by the combination of the first reference block 311 and the second reference block 312, and the structure design is relatively compact.

[0082] It should be noted that the specific shape of the chip 20 is, for example, quadrilateral, pentagon, hexagon, octagon, etc., which is set according to actual conditions. Specifically, when the chip 20 is, for example, a square chip 20, the positioning frame is designed as a square frame body, i.e. the positioning frame comprises four frame edges 31 connected in sequence. In this way, the positioning frame adjusts the length of the frame edge 31 to adapt to the length and width of the chip 20, so as to be positioned at the periphery of the chip 20 and play a clamping and fixing role on the chip 20. Similarly, when the chip 20 is, for example, a hexagonal chip 20, the positioning frame is designed as a hexagonal frame body.

[0083] Please refer to Figures 8 to 10In one embodiment, the surface of the plug 3111 is provided with a first tooth 3112, and the wall of the socket 3121 is provided with a second tooth (not shown in the figure) which engages with the first tooth 3112. After the plug 3111 is inserted into the socket 3121, the first tooth 3112 engages with the second tooth, and the plug 3111 can move in the radial direction of the socket 3121 under the driving force to disengage the first tooth 3112 from the second tooth. Thus, when the length of the frame edge 31 is not required to be adjusted, i.e. no driving force is applied to the plug 3111, the plug 3111 is fixed to the second reference block 312 due to the engagement between the first tooth 3112 and the second tooth, so that the overall size of the positioning frame is stable and unchangeable. Conversely, when the length of the frame edge 31 is required to be adjusted, for example, the plug 3111 is driven to move in the radial direction of the socket 3121 (as indicated by the arrow f in the figure) to disengage the first tooth 3112 from the second tooth, so that the plug 3111 is not fixed to the second reference block 312, i.e. the position of the plug 3111 on the second reference block 312 can be adjusted to change the length of the frame edge 31, so that the size of the positioning frame can be adjusted. Figure 9

[0084] Please refer to Figures 8 to 10 In one embodiment, the first tooth 3112 and the second tooth are both one-way teeth. Thus, when the one-way teeth are arranged in the direction in which the first reference block 311 and the second reference block 312 are away from each other, i.e. the length of the frame edge 31 can be directly increased at will under the driving force, but when the length needs to be decreased, the first tooth 3112 needs to be disengaged from the second tooth by an external force first, and then the plug 3111 can be driven to move relative to the second reference block 312 to decrease the length. Conversely, when the one-way teeth are arranged in the direction in which the first reference block 311 and the second reference block 312 are close to each other, i.e. the length of the frame edge 31 can be directly decreased at will under the driving force, but when the length needs to be increased, the first tooth 3112 needs to be disengaged from the second tooth by an external force first, and then the plug 3111 can be driven to move relative to the second reference block 312 to increase the length of the frame edge 31.

[0085] Please refer to Figures 8 to 10 In one embodiment, the first tooth 3112 and / or the second tooth is / are multiple and arranged in sequence along the insertion direction of the plug 3111. Thus, the first tooth 3112 can be multiple, and the second tooth can be one, two or more than three, so that when the plug 3111 is moved to different positions along the insertion direction, the plug 3111 can be fixed by the engagement between the first tooth 3112 and the second tooth. Similarly, the second tooth can be multiple, and the first tooth 3112 can be one, two or more than three, and the principle is similar and will not be described in detail.

[0086] Please refer to Figures 8 to 10 ​In one embodiment, each frame edge 31 further comprises a second guide 313, the first reference block 311 is connected with the second reference block 312 through the second guide 313, and the guiding direction of the second guide 313 is the same as the inserting direction of the insert 3111. Figure 9 As can be seen, each frame edge 31 comprises two second guides 313, and the insert 3111 is located between the two second guides 313. Since the second guides 313 are arranged in an up-down manner, the phenomenon of twisting of the semiconductor structure clamping assembly can be prevented, and the stability of the semiconductor structure clamping assembly can be improved.

[0087] Thus, after the first tooth 3112 is separated from the second tooth under the driving of the external force, and the insert 3111 is pulled out or inserted in the process of being pulled out or inserted in the insertion hole 3121, since the second guide 313 plays a guiding role in the inserting direction of the insert 3111 for the first reference block 311 and the second reference block 312, the movement of the insert 3111 in the insertion hole 3121 along the inserting direction is relatively stable, and the phenomenon of shaking can be prevented, so that the size of the positioning frame can be quickly and accurately adjusted, and in addition, the deformation such as twisting of the semiconductor clamping assembly 30 under stress can be prevented. In addition, the first reference block 311 is connected with the second reference block 312 through the second guide 313, and the structural strength is increased, so that the first reference block 311 is not easy to be damaged under the external force.

[0088] Please refer to Figures 8 to 10 In one embodiment, the insert 3111 is provided with a natural state and a compressed state. When the insert 3111 is inserted into the insertion hole 3121 and the first tooth 3112 is engaged with the second tooth, the insert 3111 is in the compressed state. When the insert 3111 is pulled out of the insertion hole 3121, the insert 3111 is in the natural state. When the insert 3111 is in the natural state, the extending direction of the insert 3111 is arranged at an angle with the guiding direction of the second guide 313. Specifically, the extending direction of the insert 3111 is, for example, upward, downward, leftward, rightward, and the like, and the angle between the extending direction of the insert 3111 and the guiding direction of the second guide 313 is a (for example, a is 90°, 45°, 30°, 15°, or the like). Figure 10The angle a is 0° to 15°. More specifically, the angle a is 4° to 10°. Of course, the angle a can also be a value other than 0° to 15°, which is not limited herein, as long as the elastic force can be provided to clamp the hole wall of the insertion hole 3121 when the insert 3111 is inserted into the insertion hole 3121. Thus, since the extension direction of the insert 3111 in the natural state is arranged at the angle a with the guide direction of the second guide 313, that is, after the insert 3111 is inserted into the insertion hole 3121, the elastic force will be applied to the hole wall of the insertion hole 3121, so that the first teeth 3112 and the second teeth are closely engaged with each other, thereby achieving the relative fixation of the insert 3111 and the second reference block 312. When an external force is applied to the insert 3111 to make the insert 3111 parallel to the guide direction of the second guide 313, the first teeth 3112 and the second teeth are separated from each other, so that the insert 3111 and the second reference block 312 can be driven to move along the guide direction of the second guide 313.

[0089] It should be noted that the first teeth 3112 can be arranged on the upper surface, the lower surface, the left side surface, the right side surface, etc. of the insert 3111, and can be flexibly adjusted according to actual needs. When the position of the first teeth 3112 on the outer wall surface of the insert 3111 is adjusted, the position of the second teeth on the hole wall of the insertion hole 3121 is correspondingly adjusted to ensure correspondence with the first teeth 3112, so that the first teeth 3112 are engaged with the first teeth 3112 after being inserted into the insertion hole 3121.

[0090] Further, the insert 3111 is bent towards the position of the second teeth on the hole wall of the insertion hole 3121, that is, the extension direction of the insert 3111 forms an angle with the position of the second teeth on the hole wall of the insertion hole 3121. In this way, after the insert 3111 is inserted into the insertion hole 3121, the first teeth 3112 on the insert 3111 are closely pressed and fitted to the second teeth. For example, please refer to Figure 9 When the first teeth 3112 are arranged on the upper surface of the insert 3111, the second teeth are correspondingly arranged on the top wall position of the hole wall of the insertion hole 3121, and the end of the insert 3111 away from the first reference block 31 is bent upwards, that is, the extension direction of the first reference block 31 is upwards.

[0091] In addition, the first teeth 3112 can also be arranged on the lower surface of the insert 3111. When the first teeth 3112 are arranged on the lower surface, the second teeth are correspondingly arranged on the bottom wall position of the hole wall of the insertion hole 3121, and the end of the insert 3111 away from the first reference block 31 is bent downwards, that is, the extension direction of the first reference block 31 is downwards. In addition, the first teeth 3112 can also be arranged on the left side or the right side of the insert 3111, which is flexibly adjusted according to actual needs, and will not be described herein.

[0092] Of course, as some optional solutions, the extending direction of the plug-in 3111 and the guiding direction of the second guiding member 313 are not limited to the above-mentioned embodiment of being arranged at an angle, and the two can also be arranged in parallel with each other, and after the plug-in 3111 is inserted into the plug hole 3121, for example, by inserting a pressing block in the hole wall of the plug hole 3121, the plug-in 3111 is pressed by the pressing block, and the first tooth 3112 and the second tooth are also fixed together by mutual engagement; for example, by providing a locking member on the second reference block 312, the first tooth 3112 and the second tooth are fixed by mutual engagement, and the position of the plug-in 3111 on the second reference block 312 is locked and fixed by the locking member, and the locking member is loosened when the length of the frame edge 31 needs to be adjusted.

[0093] As some optional solutions, the first tooth 3112 and the second tooth in the above-mentioned embodiment can be omitted, and the position of the plug-in 3111 on the second reference block 312 is locked and fixed by a locking member provided on the second reference block 312, and the locking member is loosened when the length of the frame edge 31 needs to be adjusted. It should be noted that the locking member includes but is not limited to bolts, screws, clamps, pins, and can be set according to actual needs.

[0094] In one embodiment, the plug-in 3111 and the first reference block 311 are integrated; or the plug-in 3111 is clamped, fixed, or fixed by a fastener on the first reference block 311; or the plug-in 3111 and the first reference block 311 are metal, hard rubber or wood; or the plug-in 3111 is a plug-in plate or a plug-in rod.

[0095] Please refer to Figures 8 to 10 In one embodiment, the plug hole 3121 is a through hole penetrating the second reference block 312, and the end of the plug-in 3111 away from the first reference block 311 is a pushing portion 3113, which extends to the outside of the plug hole 3121. In this way, by pressing the pushing portion 3113 downward, the first tooth 3112 and the second tooth can be separated from each other, which is relatively convenient to operate.

[0096] Please refer to Figures 8 to 10 In one embodiment, one of the first reference block 311 and the second reference block 312 is provided with the second guiding member 313, and the other of the first reference block 311 and the second reference block 312 is provided with the second guiding hole 314 adapted to the second guiding member 313. In this way, the second guiding member 313 is inserted into the second guiding hole 314, and moves back and forth along the second guiding hole 314 to guide the first reference block 311 and the second reference block 312.

[0097] Of course, in another embodiment, both the first reference block 311 and the second reference block 312 are provided with a second guide member 313, and both the first reference block 311 and the second reference block 312 are also provided with a second guide hole 314 adapted to the second guide member 313.

[0098] Please see Figure 9 and Figure 11 , Figure 11 A schematic diagram of a semiconductor structure clamping assembly according to another embodiment of the present invention is shown. In one embodiment, for any two adjacent frame edges 31, a first reference block 311 of one frame edge 31 is connected to a first reference block 311 or a second reference block 312 of the other frame edge 31. Thus, the connection between the first reference block 311 of one frame edge 31 and the first reference block 311 or the second reference block 312 of the other frame edge 31 forms a corner of the positioning frame, which provides better positioning for the chip 20 when it contacts the chip 20.

[0099] Please see Figure 9 and Figure 10 , Figure 10 The structure shown is Figure 9 The structure is located at one of the top corners. As an example, the first reference block 311 of one frame edge 31 is integrated with the first reference block 311 of the other frame edge 31, or they are connected together by snap-fit, adhesive bonding, or fasteners. Furthermore, the second reference block 312 of one frame edge 31 is integrated with the second reference block 312 of the other frame edge 31, or they are connected together by snap-fit, adhesive bonding, or fasteners. Thus, during the manufacturing process, two structural combinations are produced in batches: one is a structure formed by connecting two first reference blocks 311, and the other is a structure formed by connecting two second reference blocks 312. Figure 10 As can be seen, the positions of the second guides 313 on the two adjacent first reference blocks 311 are different, with one located above the plug-in 3111 and the other located below the plug-in 3111, which can improve the twisting phenomenon of the semiconductor structure clamping assembly 30.

[0100] Please see Figure 11 In one embodiment, the first reference block 311 of one frame edge 31 and the second reference block 312 of the other frame edge 31 are an integrated structure, or are fixed together by snap-fit, adhesive, or fasteners. Thus, during the manufacturing process, structures formed by the interconnection and combination of the first reference block 311 and the second reference block 312 are mass-produced.

[0101] In summary, the aforementioned semiconductor structure clamping assembly 10 and semiconductor structure fixing device have at least the following beneficial effects:

[0102] 1. A semiconductor structure pressing assembly 10, which is used to position a chip 20 in a vertical direction by pressing on the top surface of the chip 20. On one hand, when the test temperature changes, for example, the test temperature rises, the volume of the thermal expansion member 13 increases accordingly. Since the diameter of the passage 121 gradually increases in a direction away from the chip 20, the thermal expansion member 13 can move along the passage 121 in a direction away from the chip 20. When the thermal expansion member 13 moves, the cushion block 11 is synchronously moved in a direction away from the chip 20 by the connecting rod 14, thereby providing space for the solder balls 21 on the chip 20 to expand and deform due to the temperature rise, avoiding irreversible damage caused by the expansion and deformation of the solder balls 21 on the chip 20 pressing against the cushion block 11. Therefore, it is not necessary to frequently adjust the thickness or the number of the shims when the test temperature changes, thereby greatly improving the test efficiency. On the other hand, since the thermal expansion member 13 is connected to the carrier 12 by the elastic member 15, the elastic member 15 is in a compressed state, and the thermal expansion member 13 acts on the cushion block 11 through the connecting rod 14, and the positioning of the chip 20 is achieved by the cushion block 11 pressing against the chip 20. When the thickness of the chip 20 changes, the compression amount of the elastic member 15 will change through the cushion block 11, the connecting rod 14, and the thermal expansion member 13. The cushion block 11 can still press the chip 20 tightly, ensuring the positioning of the chip 20 in a direction perpendicular to its surface, thereby eliminating the need to adjust the thickness or the number of the shims, and greatly improving the test efficiency.

[0103] 2. A semiconductor structure clamping assembly 30. Since the insert 3111 is inserted into the insertion hole 3121 and can be fixed to the second reference block 312, and the fixed position of the insert 3111 on the second reference block 312 along the insertion direction is adjustable, the length of the frame edge 31 can be adjusted by adjusting the fixed position of the insert 3111 on the second reference block 312 along the insertion direction, and the size of the positioning frame can be adjusted after adjusting the length of the frame edge 31, thereby realizing the clamping of chips 20 of different sizes. In addition, the insert 3111 is fixed to the second reference block 312 by being inserted into the insertion hole 3121, and the insertion hole 3121 plays a positioning role on the insert 3111, which is conducive to the stability and reliability of the frame edge 31 structure formed by the combination of the first reference block 311 and the second reference block 312, and the structure design is relatively compact.

[0104] The technical features of the above embodiments can be combined in any manner. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described, but as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present disclosure.

[0105] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

[0106] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0107] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0108] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0109] In the present application, unless otherwise specifically defined and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0110] It is to be understood that when an element such as a layer, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. It will be understood that, although the terms "first", "second", etc. can be used herein to describe various elements, these elements should not be limited by these terms since such elements are commonly known with other elements except that they are not explicitly mentioned. The terms "comprises", "comprising", "includes", "including" and the like can be used herein, and these terms are intended to be interpreted expansively and be taken to include the possibility that elements, components, or steps therebetween can be additional elements, components or steps. The terms "a", "an", and "the" and similar referents in the context of an embodiment described herein are to be construed to be open-ended, allowing for the possibility that there are alternatives in use, the same as the

Claims

1. A semiconductor structure compression assembly, comprising: The semiconductor structure pressing assembly comprises: a cushion block, a bottom surface of the cushion block being used to abut against a top surface of the chip; a carrier, the carrier being located above the cushion block, the carrier being provided with a channel gradually increasing in caliber in a direction away from the cushion block; a thermal expansion element, the thermal expansion element being arranged inside the channel, the thermal expansion element being capable of moving along the channel when the volume of the thermal expansion element changes with the change of the ambient temperature; a connecting rod, the connecting rod being arranged inside the channel, the thermal expansion element being connected with the cushion block through the connecting rod; a resilient element, the resilient element being arranged inside the channel, the thermal expansion element being connected with the carrier through the resilient element; wherein the channel is a blind groove, one end of the resilient element abutting against or being connected with a wall of the blind groove, the other end of the resilient element abutting against or being connected with the thermal expansion element.

2. The semiconductor structure hold-down assembly of claim 1, wherein, The thermal expansion element is a tin ball or a phase change material.

3. The semiconductor structure hold-down assembly of claim 1, wherein, An end of the connecting rod is provided with a cushion plate, and the thermal expansion element is connected with the connecting rod through the cushion plate.

4. The semiconductor structure hold-down assembly of claim 3, wherein, The cushion plate is adapted to and fixedly connected with a bottom surface of the thermal expansion element.

5. The semiconductor structure hold-down assembly of claim 1, wherein, The channel is located on a bottom surface of the carrier, the channel is at least two and arranged in a spaced manner, the thermal expansion element, the connecting rod and the resilient element are all at least two and correspondingly arranged with the at least two channels.

6. The semiconductor structure hold-down assembly of claim 1, wherein, The semiconductor structure pressing assembly further comprises a first guide element, the cushion block is connected with the carrier through the first guide element.

7. The semiconductor structure hold-down assembly of claim 6, wherein, The first guide element is at least two, the first guide element is connected to one of the cushion block and the carrier, the other of the cushion block and the carrier is provided with a first guide hole corresponding to the first guide element.

8. The semiconductor structure hold-down assembly of claim 1, wherein, The semiconductor structure pressing assembly further comprises a top cover, the carrier is at least two, and the top cover is connected with the at least two carriers respectively.

9. The semiconductor structure hold-down assembly of claim 1, wherein, The thermal expansion element is spherical, hemispherical, ellipsoidal, semi-ellipsoidal or conical frustum, and the channel is conical frustum.

10. A semiconductor structure holding device characterized by comprising: Comprise: a semiconductor structure clamping assembly; a semiconductor structure pressing assembly, located at the semiconductor structure clamping assembly, the semiconductor structure pressing assembly comprising: a cushion block, a bottom surface of the cushion block being used to abut against a top surface of the chip; a carrier, the carrier being located above the cushion block, the carrier being provided with a channel gradually increasing in caliber in a direction away from the cushion block; a thermal expansion element, the thermal expansion element being arranged inside the channel, the thermal expansion element being capable of moving along the channel when the volume of the thermal expansion element changes with the change of the ambient temperature; a connecting rod, the connecting rod being arranged inside the channel, the thermal expansion element being connected with the cushion block through the connecting rod; a resilient element, the resilient element being arranged inside the channel, the thermal expansion element being connected with the carrier through the resilient element, the channel being a blind groove, one end of the resilient element abutting against or being connected with a wall of the blind groove, the other end of the resilient element abutting against or being connected with the thermal expansion element.

11. The semiconductor structure fixture of claim 10, wherein, The semiconductor structure clamping assembly comprises: A plurality of frame edges are connected in sequence to form a positioning frame capable of positioning a chip periphery, each frame edge comprises a first reference block and a second reference block arranged along the length direction of the frame edge, the first reference block is provided with a plug, the second reference block is provided with a socket corresponding to the position of the plug, the plug is inserted into the socket and can be fixed on the second reference block, and the fixed position of the plug on the second reference block along the insertion direction of the plug is adjustable.

12. The semiconductor structure fixture of claim 11, wherein, A first tooth is arranged on the surface of the plug, and a second tooth is arranged on the socket wall and engaged with the first tooth; after the plug is inserted into the socket, the first tooth and the second tooth are engaged with each other, and the plug can move in the radial direction of the socket under the driving of external force so that the first tooth and the second tooth are separated from each other.

13. The semiconductor structure fixture of claim 12, wherein, Each frame edge further comprises a second guide, the first reference block is connected with the second reference block through the second guide, and the guide direction of the second guide is the same as the insertion direction of the plug.

14. The semiconductor structure fixture of claim 13, wherein, The plug has a natural state and a compressed state; when the plug is inserted into the socket and the first tooth and the second tooth are engaged, the plug is in the compressed state; when the plug is pulled out of the socket, the plug is in the natural state; when the plug is in the natural state, the extension direction of the plug forms an angle with the guide direction of the second guide.

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