A photoelectric module

Abstract

This application relates to a photovoltaic module comprising a light source board, the light source board comprising an insulating layer, a heat-conducting layer with high heat dissipation capability, and a base layer with high reflectivity, the base layer being disposed between the insulating layer and the heat-conducting layer, the insulating layer being provided with a mounting slot for securing an LED light source. This application has the effect of increasing the brightness of the finished LED light source.

Description

Technical Field

[0001] The present application relates to the technical field of LED light sources, and in particular to a photoelectric module. Background Art

[0002] LED light sources are widely used in various lighting applications, such as indoor lighting, flashlights, and other electronic products. Currently, LED light sources and the electronic components required to operate them are typically mounted on ceramic substrates. However, due to the inherent properties of ceramics, the brightness of the finished LED light source is low.

[0003] With respect to the above-mentioned related technologies, the inventors believe that there is a defect in that the finished LED light source has low brightness. Summary of the Invention

[0004] In order to improve the brightness of a finished LED light source, the present application provides a photoelectric module.

[0005] The optoelectronic module provided in this application adopts the following technical solution:

[0006] A photoelectric module includes a light source board, which includes an insulating layer, a heat-conducting layer with high heat dissipation capability, and a base layer with high reflectivity. The base layer is arranged between the insulating layer and the heat-conducting layer, and the insulating layer is provided with a mounting groove for fixing an LED light source.

[0007] By adopting the above technical solution, the LED light source is fixed to the insulating layer through the mounting groove, making it easier for the operator to find the corresponding installation position of the LED light source during installation. When the LED light source starts to work, the light emitted by the base layer is irradiated. Due to the high emissivity of the base layer, it does not absorb the light and radiates it, thereby improving the brightness of the finished LED light source. In addition, during the operation of the LED light source, a large amount of heat is generated on the light source board, causing certain wear and tear on both the LED light source and the light source board. The thermal conductive layer dissipates the large amount of heat, reducing the wear and tear caused by heat on the LED light source and the light source board.

[0008] Preferably, the base layer is a double-sided mirror-finished aluminum material.

[0009] By adopting the above technical solution, double-sided mirror aluminum can be soldered on both sides. One side of the double-sided mirror aluminum can be connected to the insulating layer, and the other side can be connected to the thermal conductive layer. Due to the properties of double-sided mirror aluminum, it has a high emissivity. Compared with ceramic, the reflectivity of double-sided mirror aluminum is much higher than that of ceramic. Therefore, double-sided mirror aluminum can better improve the brightness of the finished LED light source. In addition, because double-sided mirror aluminum is also a metal material, its thermal conductivity is also stronger than that of materials such as ceramic, which can reduce heat wear on the LED light source and light source board.

[0010] Preferably, it also includes a substrate with strong voltage resistance, the substrate is provided with a circuit module and a light source installation module, the light source installation module is provided with at least one group of positive and negative pads, and the light source board is electrically connected to the circuit module through the positive and negative pads.

[0011] By adopting the above technical solution, the voltage-bearing ability of double-sided mirror aluminum is relatively weak. By transferring all voltage components to the substrate, the substrate can withstand higher voltage, thereby solving the defect of weak voltage resistance of double-sided mirror aluminum.

[0012] Preferably, the insulating layer is provided with at least one pair of positive and negative pins, the positive and negative pins are located on the bottom surface of the insulating layer, the positive and negative pins face the positive and negative pads, and a measurement area is formed between the positive and negative pins and the positive and negative pads.

[0013] By adopting the above technical solution, since there are base layers and thermal conductive layers between the insulating layer and the substrate, the thickness of the base layers and thermal conductive layers allows a certain gap between the positive and negative pins of the insulating layer and the substrate, and a measurement area is formed between the positive and negative pins and the positive and negative pads. When the light source board is connected to the positive and negative pads through the positive and negative pins to achieve electrical connection with the substrate, the connection condition can be observed through the gap, and semi-finished products with connection problems can be initially screened out by visual inspection, which can reduce the rework of finished products due to connection problems in the later stage and greatly reduce the rework rate of finished products.

[0014] Preferably, the insulating layer has excellent flexibility, and is provided with at least two guide holes, which pass through the positive and negative pins respectively. The hole walls of the guide holes are provided with copper plating, and the top surface of the insulating layer is provided with positive and negative pins at corresponding positions of the guide holes.

[0015] By adopting the above technical solution, since the insulating layer has excellent flexibility, the insulating layer is not easy to break when holes are opened on the insulating layer. Compared with opening holes in materials such as ceramics, which are easy to break, and during the testing of semi-finished products or transportation to the next production process, ceramics and other materials are easily damaged by bumps, and the transportation conditions of the finished products will also be increased accordingly. Copper plating covers the hole walls of the guide holes, allowing the non-conductive hole walls to conduct electricity. When the light source board is connected to the substrate, multiple connection ports can be provided through the positive and negative pins on the bottom surface of the insulating layer and the positive and negative pins on the top surface of the insulating layer. It is also convenient to directly check the connection status from the top surface of the light source board. In addition, when the light source board needs to be connected to the substrate through a wire, the wire is passed through the guide hole to facilitate the management of the wire.

[0016] Preferably, the insulating layer is made of glass fiber board.

[0017] By adopting the above technical solution, when a hole is opened on the glass fiber board, the glass fiber board is not easily broken. In addition, the glass fiber board has excellent heat resistance.

[0018] Preferably, the light source mounting module is provided with a heat dissipation layer, and the heat dissipation layer is in contact with the heat conductive layer.

[0019] By adopting the above technical solution, the LED light source emits a large amount of heat when working. The heat dissipation layer increases the heat dissipation and enhances the heat dissipation effect, which can reduce the impact of heat on the connection point between the light source board and the substrate, as well as the impact on the LED light source.

[0020] Preferably, the substrate is provided with a limiting groove, and the heat dissipation layer is located on the bottom groove wall of the limiting groove.

[0021] By adopting the above technical solution, when the light source board is fixedly connected to the base plate, the limiting groove facilitates the operator to quickly find the corresponding installation position of the light source board on the base plate.

[0022] Preferably, the base layer and the insulating layer are fixed in a eutectic manner.

[0023] By adopting the above technical solution, the eutectic fixing method can improve heat dissipation and delay the impact of heat on the LED light source and the light source board.

[0024] Preferably, a protective ring is provided circumferentially on the side groove wall of the installation groove.

[0025] By adopting the above technical solution, the protective ring can help the operator find the installation position when installing the light source on the light source board. In addition, the light source can be made to protrude less from the top surface of the light source board, thereby increasing the radiation of the light source and making the light emitted by the light source more concentrated.

[0026] In summary, this application includes at least one of the following beneficial technical effects:

[0027] Improve the brightness of LED light source products;

[0028] The insulation layer can be opened;

[0029] It is convenient to detect the connection between the light source board and the substrate;

[0030] Transfer high voltage components to the substrate to effectively protect the light source board. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a structural diagram of the light source board;

[0032] Figure 2 is a schematic diagram of the structure of the substrate;

[0033] Figure 3 is a cross-sectional view of the light source board and the substrate;

[0034] Figure 4 It is a structural diagram of the insulation layer.

[0035] Explanation of the accompanying symbols: 1. Light source board; 11. Insulation layer; 111. Positive and negative pins; 112. Guide hole; 113. Adhesive layer; 114. Circuit layer; 115. Electroplated metal layer; 116. White oil layer; 12. Thermal conductive layer; 13. Base layer; 14. Mounting groove; 15. Guard ring; 2. Substrate; 21. Circuit module; 22. Light source mounting module; 221. Positive and negative pads; 23. Heat dissipation layer; 24. Limiting groove; 3. Measurement area. DETAILED DESCRIPTION

[0036] The following is combined with Figure 1-4 This application is described in further detail.

[0037] The present application discloses an optoelectronic module, referring to Figure 1 The optoelectronic module includes a light source board 1, which includes an insulating layer 11, a heat-conducting layer 12 and a base layer 13. The base layer 13 is located between the insulating layer 11 and the heat-conducting layer 12. The insulating layer 11 has high heat resistance, the base layer 13 has high reflectivity, and the heat-conducting layer 12 has high heat dissipation capacity. The insulating layer 11 is provided with a mounting groove 14 for placing the light source, and a protective ring 15 is circumferentially provided on the side groove wall of the mounting groove 14. The protective ring 15 is made of plastic material and surrounds the LED light source.

[0038] When the LED light source starts working, when the light emitted by the LED light source is irradiated on the base layer 13, since the base layer 13 has high reflectivity and low light absorption capacity, the light loss is reduced and the light continues to be radiated, thereby increasing the brightness of the finished LED light source; on the other hand, when the LED light source is installed, the mounting groove 14 makes it convenient for the operator to quickly find the installation position of the LED light source on the light source board 1. Due to the setting of the mounting groove 14 and the protective ring 15, the LED light source is embedded in the light source board 1, which can further make the light emitted by the LED light source more concentrated, thereby increasing the brightness of the finished LED light source; however, when the LED light source is working, it will emit a lot of heat, which will cause certain wear and tear on the LED chip and the light source board 1 inside the LED light source. Since the thermal conductive layer 12 has high heat dissipation, it can emit a lot of heat, thereby reducing the wear and tear on the light source board 1 and the LED chip, delaying the reduction of LED brightness, and improving the service life of the light source board 1.

[0039] Since the base layer 13 has a high reflectivity, the brightness of the finished LED light source can be improved. In this embodiment, the base layer 13 adopts double-sided mirror aluminum material. Compared with other materials such as ceramics, double-sided mirror aluminum has better reflectivity, which can increase the brightness of the finished LED light source. In addition, since double-sided mirror aluminum is a metal material, it has high thermal conductivity, which can increase the thermal conductivity of the light source board 1 and accelerate the dissipation of heat.

[0040] Double-sided mirror aluminum is a double-sided weldable circuit, and the insulating layer 11 and the thermal conductive layer 12 can be connected to the two sides of the double-sided mirror aluminum respectively. The double-sided mirror aluminum can be fixed to the insulating layer 11 by pressing or eutectic method. The eutectic fixing method can increase the heat dissipation and delay the wear of the LED chip and the light source board 1. In addition, the double-sided mirror aluminum is not prone to breakage during the production process. Compared with materials such as ceramics, ceramics are easy to break during testing and other links, and need to be placed carefully, which will reduce production efficiency. In addition, the transportation of finished products has relatively harsh requirements on the transportation method and transportation environment, which is inconvenient for the transportation of finished products. Double-sided mirror aluminum materials do not need to have corresponding requirements for this.

[0041] The use of double-sided mirror aluminum can improve the brightness of the finished LED light source and enhance the heat dissipation. However, compared with other materials such as ceramics, the voltage resistance of double-sided mirror aluminum is weaker. Based on the above problems, refer to Figure 1 and Figure 2 The optoelectronic module also includes a substrate 2, on which a circuit module 21 and a light source mounting module 22 are provided. The light source mounting module 22 is located in the middle of the substrate 2. When the light source board 1 is connected to the substrate 2 and works normally, the light emitted by the LED light source is emitted from the center of the substrate 2 relative to the substrate 2. When multiple substrates 2 are fixed together, the light emitted by each LED light source is relatively evenly distributed; the circuit module 21 includes a variety of electronic components, which are distributed around the light source mounting module 22.

[0042] The light source installation module 22 is provided with at least one set of positive and negative pads 221. In this embodiment, the light source installation module 22 is provided with two sets of positive and negative pads 221. The present application does not limit the number of positive and negative pads 221. Figure 1 and Figure 2 Two sets of positive and negative pins 111 are provided on the light source board 1, corresponding to the positive and negative pads 221. Soldering the positive and negative pins 111 to the positive and negative pads 221 establishes an electrical connection between the light source board 1 and the substrate 2. By transferring voltage components from the light source board 1 to the substrate 2, whose voltage resistance is much higher than that of the light source board 1, the electronic components are transferred to the substrate 2, allowing the substrate 2 to bear the voltage of the components, thus resolving the problem of double-sided mirror aluminum's inability to withstand high voltages.

[0043] The components are transferred to the substrate 2 to solve the defect of double-sided mirror aluminum not being able to withstand high voltage. The light source board 1 and the substrate 2 are electrically connected through solder paste, and the positive and negative pins 111 are connected to the positive and negative pads 221 through solder paste to achieve electrical connection between the light source board 1 and the substrate 2. The bottom surface of the insulating layer 11 is provided with at least one group of positive and negative pins 111. In this embodiment, the number of positive and negative pins 111 is one group. This application does not limit the number of positive and negative pins 111. Figure 3 The cross-sectional area of ​​the insulating layer 11 is larger than the cross-sectional area of ​​the base layer 13 and the thermal conductive layer 12. The gap between the insulating layer 11 and the substrate 2 forms a measurement area 3. Solder paste is applied between the positive and negative pins 111 and the positive and negative pads 221. The solder paste connects the positive and negative pins 111 with the positive and negative pads 221, thereby realizing electrical connection between the light source board 1 and the substrate 2.

[0044] Usually, due to insufficient amount of solder paste, cold solder joints will occur. The connection status can be checked through the measurement area 3, which can preliminarily screen out semi-finished products with connection problems between the light source board 1 and the substrate 2, thereby reducing the rework of finished products in the later stage. It is also possible to insert a blade into the measurement area 3 to determine whether there is a connection problem between the light source board 1 and the substrate 2. In addition, the AOL optical inspection equipment can be used to realize batch inspection between the light source board 1 and the substrate 2, which can efficiently screen out semi-finished products with connection problems.

[0045] There is a gap between the insulating layer 11 and the substrate 2, which makes it easy to observe the connection between the positive and negative pads 221 and the positive and negative pins 111. However, since a large amount of heat is generated when the LED light source is working, the heat will cause the solder paste to fall off or oxidize, causing the light source board 1 and the substrate 2 to be intermittently connected, and even the LED light source cannot work normally.

[0046] Based on the above problems, the insulating layer 11 has excellent flexibility. In this embodiment, the insulating layer 11 is made of glass fiber board material. Due to the characteristics of the glass fiber board material, the insulating layer 11 can be perforated. Compared with materials such as ceramics, the perforations are easy to break, and thus it is impossible to perforate them. The insulating layer 11 is provided with two or more guide holes 112, and the number of guide holes 112 is four. The guide holes 112 pass through the positive and negative pins 111. Each positive and negative pin 111 has two guide holes 112 respectively. Each positive and negative pin 111 is square in shape. The two guide holes 112 are respectively located on the diagonals of the positive and negative pins 111. A pair of positive and negative pins 111 are also provided on the top surface of the insulating layer 11 at the position of the guide holes 112, that is, a pair of positive and negative pins 111 are symmetrically provided on the top and bottom surfaces of the insulating layer 11, and the hole walls of the guide holes 112 are provided with copper plating.

[0047] Copper plating is low-cost and a relatively mature process, resulting in a higher yield rate than other materials such as silver plating. While the walls of the guide holes 112 were originally non-conductive, copper plating allows them to become conductive. This allows for electrical connection between the light source board 1 and the circuit module 21 via the positive and negative pins 111 on the top surface of the insulating layer 11, providing additional connection points between the light source board 1 and the substrate 2. Furthermore, when wires are required to connect the light source board 1 to the substrate 2, the wires can be passed through the guide holes 112, allowing for easier management of the wires.

[0048] Reference Figure 1 and Figure 3 When the positive and negative pins 111 on the top surface of the insulating layer 11 are connected to the positive and negative pads 221, the solder paste between the positive and negative pins 111 and the positive and negative pads 221 appears columnar. The columnar shape of the solder paste can increase the firmness of the connection between the light source board 1 and the substrate 2, and can also increase the amount of solder paste used, reducing the impact of the heat generated when the LED light source emits light on the solder paste. As the heat accumulates, the solder paste is easy to fall off. A sufficient amount of solder paste can reduce the impact of solder paste falling off on the connection between the light source board 1 and the substrate 2. At the same time, reducing the amount of a small part of the solder paste falling off can cause the light source board 1 and the substrate 2 to be unable to conduct. In addition, when the positive and negative pins 111 on the top surface of the light source board 1 are connected to the positive and negative pads 221, it is also convenient for the operator to observe the condition of the connection from the top surface of the light source board 1.

[0049] Reference Figure 4 The structure of the insulating layer 11 is divided into six layers. The insulating layer 11 includes an adhesive layer 113. The circuit layer 114 is adhered to both sides of the adhesive layer 113. That is, the circuit layer 114 is symmetrically arranged on both sides of the adhesive layer 113. The adhesive layer 113 is provided with a groove. The circuit layer 114 located on the top surface of the adhesive layer 113 is also provided with a groove. At the same time, the top surface of the circuit layer 114 is also provided with an electroplated metal layer 115. The electroplated metal layer 115 facilitates the insulation layer 11 and the base layer 13 to be bonded. Eutectic, at the same time, the electroplated metal layer 115 is also provided with grooves, and the top surface of the electroplated metal layer 115 is also provided with a white oil layer 116, which can block the redundant lines of the circuit layer 114, and the outer white oil layer 116 is also provided with grooves, and the grooves provided by the adhesive layer 113, the circuit layer 114, the electroplated metal layer 115 and the white oil layer 116 together form the installation groove 14, and the bottom surface of the circuit layer 114 without grooves is also provided with an electroplated metal layer 115 that blocks the lines.

[0050] Refer again Figure 3 The light source mounting module 22 is provided with a heat dissipation layer 23. The heat dissipation layer 23 is made of metal and can further dissipate heat from the light source board 1. It can reduce heat accumulation on the light source board 1, thereby reducing the impact on the LED light source and the light source board 1, as well as the impact on the solder paste. In addition, the base plate 2 has multiple small holes on the bottom surface of the heat dissipation layer 23. These small holes can enhance the heat dissipation capacity of the base plate 2.

[0051] The substrate 2 is provided with a heat dissipation layer 23 and a plurality of small holes, thereby increasing the heat dissipation capacity of the substrate 2 and reducing the wear of the light source board 1 and the LED light source caused by heat. When the light source board 1 is installed on the substrate 2, since the light source installation module 22 is a horizontal surface, it is difficult to find the installation position of the light source board 1 on the substrate 2. Based on the above problem, refer to Figure 3The light source installation module 22 is provided with a limiting groove 24 , and the heat dissipation layer 23 is located on the bottom wall of the limiting groove 24 . The setting of the limiting groove 24 facilitates the operator to quickly find the installation position of the light source board 1 .

[0052] In addition, one or more mounting holes are provided on the substrate 2. In this embodiment, there are two mounting holes, which are located on both sides of the light source mounting module 22. This application does not limit the number of mounting holes. The setting of the mounting holes facilitates the installation of the substrate 2 and external electrical appliances.

[0053] The implementation principle of an optoelectronic module in an embodiment of the present application is as follows: it includes a light source board 1, the light source board 1 includes an insulating layer 11, a base layer 13 and a thermal conductive layer 12, the base layer 13 is arranged between the insulating layer 11 and the heat dissipation layer 23, and the insulating layer 11 is provided with a mounting groove 14 for placing the light source. When the light source starts working, the base layer 13 has a high reflectivity, the base layer 13 has a weak light absorption capacity, and can re-emit the light more completely, thereby improving the brightness of the finished LED light source; and the thermal conductive layer 12 has a good heat dissipation capacity. Due to long-term light exposure, a large amount of heat will be generated, which will cause certain wear and tear on the light source and the light source board 1, and the thermal conductive layer 12 can guide most of the heat to dissipate, thereby reducing the impact of heat on the light source and the light source board 1, and the thermal conductive layer 12 and the base layer 13 cooperate with each other, so that the light source board 1 can work efficiently for a long time.

[0054] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A photoelectric module, characterized in that: The light source board (1) comprises an insulating layer (11), a heat-conducting layer (12) with high heat dissipation capability, and a base layer (13) with high reflectivity, wherein the base layer (13) is arranged between the insulating layer (11) and the heat-conducting layer (12), and the insulating layer (11) is provided with a mounting groove (14) for fixing an LED light source; The base layer (13) is a double-sided mirror aluminum material; It also includes a substrate (2) with a strong voltage resistance, the substrate (2) being provided with a circuit module (21) and a light source installation module (22), the light source installation module (22) being provided with at least one set of positive and negative pads (221), and the light source board (1) being electrically connected to the circuit module (21) via the positive and negative pads (221); The insulating layer (11) is provided with at least one pair of positive and negative pins (111), the positive and negative pins (111) are located on the bottom surface of the insulating layer (11), the positive and negative pins (111) face the positive and negative pads (221), and a measurement area (3) is formed between the positive and negative pins (111) and the positive and negative pads (221); The insulating layer (11) is flexible, and is provided with at least two guide holes (112), the guide holes (112) respectively passing through the positive and negative pins (111), the hole walls of the guide holes (112) are provided with copper plating, and the top surface of the insulating layer (11) is provided with positive and negative pins (111) at corresponding positions of the guide holes (112).

2. The optoelectronic module according to claim 1, characterized in that: The insulating layer (11) is made of glass fiber board.

3. The optoelectronic module according to claim 1, wherein: The light source mounting module (22) is provided with a heat dissipation layer (23), and the heat dissipation layer (23) and the heat conducting layer (12) are in contact with each other.

4. The optoelectronic module according to claim 3, wherein: The substrate (2) is provided with a limiting groove (24), and the heat dissipation layer (23) is located on the bottom groove wall of the limiting groove (24).

5. The optoelectronic module according to claim 1, characterized in that: The base layer (13) and the insulating layer (11) are fixed in a eutectic manner.

6. The optoelectronic module according to claim 1, characterized in that: A protective ring (15) is circumferentially provided on the side groove wall of the installation groove (14).

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