Electronic component modules

Abstract

The present invention relates to an electronic component module, comprising a module substrate (110), a sealing resin portion (120), and a shielding member (170). The shielding member (170) is provided to cover the sealing resin portion (120) and each of the peripheral side surfaces (113) of the module substrate (110). The shielding member (170) is connected to a ground electrode (GND). At least one recess (114) is provided on the peripheral side surface (113). The shielding member (170) is separated into a first surface (111) side and a second surface (112) side on the peripheral side surface (113) by the at least one recess (114).

Description

Technical Field

[0001] The present invention relates to an electronic component module. Background Art

[0002] Electronic devices (modules) having electronic components mounted on both sides of a substrate are known. In such modules, electromagnetic waves are sometimes radiated from the mounted electronic components to the outside, or electromagnetic waves arrive from the outside, affecting the operation of the module.

[0003] As a method of suppressing the influence of such electromagnetic waves, a technology is used in which the periphery of an electronic device is covered with a shield to thereby suppress electromagnetic waves generated by electronic components from leaking to the outside of the electronic device or from reaching the outside.

[0004] U.S. Patent No. 9,935,083 (Patent Document 1) discloses a structure in which, in an electronic device having electronic components such as semiconductors mounted on both sides of a substrate, the electronic components on the substrate are molded with resin, and a shield is formed around the molded substrate to suppress EMI (Electromagnetic Interference).

[0005] In the structure disclosed in US Pat. No. 9,935,083 (Patent Document 1), a shield can prevent electromagnetic waves generated in electronic components within an electronic device from being radiated to the outside, and can reduce the effects of external electromagnetic waves on mounted electronic components.

[0006] Patent Document 1: U.S. Patent No. 9,935,083

[0007] On the other hand, as in U.S. Patent Gazette No. 9,935,083 (Patent Document 1), in a structure in which electronic components are mounted on both sides of a substrate, and the entire substrate, including any one of the two sides and multiple side surfaces connecting the two sides, is covered by a continuous shielding member, electromagnetic waves radiated from electronic components mounted on one side of the substrate propagate to the other side of the substrate via the shielding member arranged around the substrate, and there is a possibility of affecting the electronic components on the other side. Summary of the Invention

[0008] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an electronic component module that can effectively suppress the influence of electromagnetic waves.

[0009] The electronic component module according to the present invention comprises a module substrate, a sealing resin portion, and a shielding member. The module substrate comprises a first surface, a second surface located on the opposite side of the first surface, and a peripheral side surface connecting the first surface and the second surface to each other, and an electronic component is mounted on at least one of the first surface and the second surface. The sealing resin portion is provided on at least one of the first surface and the second surface to seal the electronic component. The shielding member is provided to cover the sealing resin portion and each of the above-mentioned peripheral side surfaces. A ground electrode is provided on the module substrate. The shielding member is connected to the ground electrode. At least one recess is provided on the above-mentioned peripheral side surface. The shielding member is separated into a first surface side and a second surface side by at least one recess on the above-mentioned peripheral side surface.

[0010] According to the present invention, the influence of electromagnetic waves can be effectively suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a cross-sectional view showing the structure of the electronic component module according to the first embodiment of the present invention.

[0012] Figure 2 It is enlarged to show Figure 1 A partial cross-sectional view of part II.

[0013] Figure 3 This is a flowchart for explaining the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0014] Figure 4 This is a cross-sectional view showing the structure of a multilayer substrate formed in the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0015] Figure 5 This is a diagram showing a state where electronic components and columnar conductors are mounted on a multilayer substrate in the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0016] Figure 6 This is a diagram showing a state where a multilayer substrate is molded with a sealing resin in the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0017] Figure 7 This is a diagram showing a state where connection terminals are formed in the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0018] Figure 8 This is a diagram showing a state where a multilayer substrate is cut along cutting lines in the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0019] Figure 9This is a diagram showing a state where a shield is formed by sputtering in the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0020] Figure 10 This is a cross-sectional view showing the structure of a multilayer substrate formed in a method for manufacturing an electronic component module according to a modification of the first embodiment of the present invention.

[0021] Figure 11 It is a cross-sectional view showing the structure of an electronic component module according to Embodiment 2 of the present invention.

[0022] Figure 12 It is a plan view showing the structure of an electronic component module according to a third embodiment of the present invention.

[0023] Figure 13 Observed from the XIII direction Figure 12 Diagram of the electronic component module.

[0024] Figure 14 It is enlarged to show Figure 13 Figure of Part XIV.

[0025] Figure 15 Observed from the XV direction Figure 12 Diagram of the electronic component module.

[0026] Figure 16 Observed from the direction of the arrow on line XVI-XVI Figure 12 A cross-sectional view of an electronic component module.

[0027] Figure 17 This is an enlarged view showing a portion of the peripheral side surface of a module substrate of an electronic component module according to a first modified example of Embodiment 3 of the present invention.

[0028] Figure 18 This is an enlarged view showing a portion of the peripheral side surface of a module substrate of an electronic component module according to a second modified example of the third embodiment of the present invention.

[0029] Figure 19 It is a plan view showing the structure of an electronic component module according to a fourth embodiment of the present invention.

[0030] Figure 20 Observed from the direction of XX Figure 19 Diagram of the electronic component module.

[0031] Figure 21 Observed from the XXI direction Figure 19 Diagram of the electronic component module.

[0032] Figure 22This is an enlarged view showing a portion of the peripheral side surface of a module substrate of an electronic component module according to a fifth embodiment of the present invention.

[0033] Figure 23 This is an enlarged view showing a portion of the peripheral side surface of a module substrate of an electronic component module according to a modified example of the fifth embodiment of the present invention.

[0034] Figure 24 It is a cross-sectional view showing the structure of an electronic component module according to Embodiment 6 of the present invention.

[0035] Figure 25 It is a cross-sectional view showing the structure of an electronic component module according to a modification of the sixth embodiment of the present invention.

[0036] Figure 26 It is a cross-sectional view showing the structure of an electronic component module according to Embodiment 7 of the present invention.

[0037] Figure 27 It is a cross-sectional view showing the structure of an electronic component module according to a modification of the seventh embodiment of the present invention. DETAILED DESCRIPTION

[0038] Hereinafter, electronic component modules according to various embodiments of the present invention will be described with reference to the accompanying drawings. In the following description of the embodiments, identical or corresponding parts in the drawings are denoted by identical reference numerals and their description will not be repeated.

[0039] (Implementation 1)

[0040] Figure 1 It is a cross-sectional view showing the structure of the electronic component module according to the first embodiment of the present invention. Figure 2 It is enlarged to show Figure 1 Partial cross-sectional view of part II. Figure 1 In the diagram, a direction along the main surface of the module substrate 110 is described as the X-axis direction, a direction perpendicular to the X-axis direction within the main surface is described as the Y-axis direction, and a direction perpendicular to the main surface is described as the Z-axis direction.

[0041] like Figure 1 As shown, the electronic component module 100 according to the first embodiment of the present invention includes a module substrate 110 , sealing resin portions 120 and 130 , a shield 170 , and connection terminals 160 .

[0042] The module substrate 110 has a multi-layer structure and is a resin substrate made of resin such as glass epoxy resin or liquid crystal polymer, or a ceramic substrate made of ceramic such as low temperature co-fired ceramics (LTCC).

[0043] A ground electrode GND is provided inside the module substrate 110. At least one of a wiring pattern, an inductor, and a capacitor may also be provided inside the module substrate 110. Specifically, a conductor pattern constituting the ground electrode GND, wiring pattern, inductor, and capacitor is formed inside the module substrate 110.

[0044] The conductor pattern is made of a conductive material such as copper (Cu), silver (Ag), or gold (Au), or a compound of these metals. The conductor patterns are electrically connected to each other via vias (not shown) as needed. Furthermore, the conductor pattern is electrically connected to the electronic components 140 mounted on the module substrate 110 via vias (not shown).

[0045] Module substrate 110 has a first surface 111 serving as a principal surface, a second surface 112 serving as a principal surface located opposite first surface 111, and a peripheral side surface 113 connecting first surface 111 and second surface 112. Electronic components 140 are mounted on at least one of first surface 111 and second surface 112. In the electronic component module 100 of this embodiment, a plurality of electronic components 140 are mounted on each of first surface 111 and second surface 112.

[0046] Specifically, electrode terminals 117 are provided on first surface 111 of module substrate 110. Electronic components 140 are connected to electrode terminals 117 by solder. Electrode terminals 118 are provided on second surface 112 of module substrate 110. Electronic components 140 are connected to electrode terminals 118 by solder.

[0047] The electronic component 140 is, for example, a semiconductor element, a ceramic multilayer chip component, a resistor component, or a transformer. By mounting these electronic components 140 , the electronic component module 100 can function as a high-frequency module such as a Bluetooth (registered trademark) module, a wireless LAN module, or an antenna module.

[0048] The sealing resin portion 120 is provided on the first surface 111. The sealing resin portion 130 is provided on the second surface 112. That is, in the electronic component module 100 according to this embodiment, the sealing resin portions 120 and 130 are provided on both the first surface 111 and the second surface 112. Furthermore, the sealing resin portion need not necessarily be provided on both the first surface 111 and the second surface 112; it only needs to be provided on at least one of the first surface 111 and the second surface 112. In other words, it is sufficient that at least one of the sealing resin portion 120 and the sealing resin portion 130 is provided.

[0049] Sealing resin portion 120 seals electronic components 140 mounted on first surface 111. Sealing resin portion 130 seals electronic components 140 mounted on second surface 112. Sealing resin portions 120 and 130 are made of a sealing resin such as epoxy resin containing a silicone filler. Alumina may also be used as a filler to improve the thermal conductivity of sealing resin portions 120 and 130.

[0050] Sealing resin portion 120 has a main surface 121 opposite to the module substrate 110 side surface and a peripheral side surface 122 adjacent to main surface 121. Peripheral side surface 122 of sealing resin portion 120 is continuous with peripheral side surface 113 of module substrate 110.

[0051] Sealing resin portion 130 has a main surface 131 opposite to the module substrate 110 side surface and a peripheral side surface 132 adjacent to main surface 131 . Peripheral side surface 132 of sealing resin portion 130 is continuous with peripheral side surface 113 of module substrate 110 .

[0052] Furthermore, connection terminals 160 are provided on the main surface 131 of the sealing resin portion 130. That is, the connection terminals 160 are exposed from the sealing resin portion 130. The electronic component module 100 is connected to a mounting substrate (not shown) via the connection terminals 160.

[0053] Connecting terminals 160 are electrically connected to module substrate 110 via columnar conductors 150 formed from a conductive member such as copper. Power is supplied from the mounting substrate to electronic components 140 mounted on module substrate 110, or signals are transmitted, via columnar conductors 150. Furthermore, electronic components 140 mounted on module substrate 110 are electrically connected to a ground electrode on the mounting substrate via columnar conductors 150. Columnar conductors may also be formed from protruding electrodes, metal pins, or plating. Alternatively, solder bumps may be used as columnar conductors.

[0054] Shield 170 is provided to cover each of sealing resin sections 120 and 130, and peripheral side surface 113 of module substrate 110. Specifically, shield 170 covers main surface 121 and peripheral side surface 122 of sealing resin section 120. Shield 170 covers peripheral side surface 132 of sealing resin section 130. Shield 170 covers portions of peripheral side surface 113 of module substrate 110 other than recessed portions, described later. In electronic component module 100 according to this embodiment, shield 170 does not cover main surface 131 of sealing resin section 130.

[0055] The shield 170 is connected to the ground electrode GND on the peripheral side surface 113 of the module substrate 110. Specifically, the portion of the shield 170 that covers the main surface 121 and the peripheral side surface 122 of the sealing resin portion 120 is electrically connected to the ground electrode GND located on the first surface 111 side. The portion of the shield 170 that covers the peripheral side surface 132 of the sealing resin portion 130 is electrically connected to the ground electrode GND located on the second surface 112 side.

[0056] Shield 170 is made of a conductive material. Shield 170 prevents electromagnetic waves radiated from electronic components 140 mounted on module substrate 110 from leaking outside electronic component module 100, and also prevents electromagnetic waves from outside electronic component module 100 from reaching the module. Specifically, shield 170 surrounds at least a portion of electronic components 140 in electronic component module 100, thereby suppressing EMI.

[0057] At least one recess 114 is provided on the peripheral side surface 113 of the module substrate 110, positioned along the first surface 111 or the second surface 112. In the electronic component module 100 of this embodiment, an annular groove extending around the peripheral side surface 113 is provided on the peripheral side surface 113, serving as the at least one recess 114. However, the recess 114 is not limited to an annular groove. As described later, the recess 114 may be provided discontinuously along the first surface 111 or the second surface 112, may be a groove extending less than one circumference of the peripheral side surface 113, or may be a serrated groove.

[0058] like Figure 1 and Figure 2 As shown, the shield 170 is separated into the first surface 111 side and the second surface 112 side by an annular groove serving as a recess 114 on the peripheral side surface 113. In the electronic component module 100 according to this embodiment, the shield 170 is divided into two parts by the first separating portion 171. That is, in the shield 170, the portion covering the main surface 121 and the peripheral side surface 122 of the sealing resin portion 120 is separated from the portion covering the peripheral side surface 132 of the sealing resin portion 130. In addition, the shield 170 is not limited to being divided into two parts by the first separating portion 171. As described later, it is sufficient as long as the shield 170 is partially separated into the first surface 111 side and the second surface 112 side by the first separating portion 171.

[0059] From the perspective of reliably separating the shielding member 170 by the first separating portion 171, as shown in FIG. Figure 2 As shown, when the thickness of the shield 170 is set to a and the width of the recess 114 is set to b, the relationship of b>2a is preferably satisfied.

[0060] Hereinafter, a method for manufacturing the electronic component module 100 according to this embodiment will be described. Figure 3This is a flowchart for explaining the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0061] like Figure 3 As shown, first, a multi-layer substrate is formed (S10). Figure 4 1 is a cross-sectional view showing the structure of a multilayer substrate formed in the method for manufacturing an electronic component module according to the first embodiment of the present invention. Figure 4 As shown, the multilayer substrate 110m is an aggregate substrate of the plurality of module substrates 110 before being divided into pieces.

[0062] The multilayer substrate 110m is a resin substrate made of a resin such as epoxy resin or liquid crystal polymer, or a ceramic substrate made of a ceramic such as LTCC. In the case of a resin substrate, the multilayer substrate 110m is formed by laminating multiple resin layers with conductor patterns formed on one side and then heat-compression bonding them. In the case of a ceramic substrate, the multilayer substrate 110m is formed by laminating multiple ceramic layers with conductor patterns formed on one side and then firing them.

[0063] like Figure 4 As shown, multilayer substrate 110m is provided with gaps 114v located along cutting lines CL, which are cut when multilayer substrate 110m is divided into multiple module substrates 110. Cutting lines CL are arranged in a grid pattern when viewed from a direction perpendicular to first surface 111.

[0064] When the multilayer substrate 110m is a resin substrate, the gap 114v can be formed by providing an opening in each of the first resin layer and the second resin layer included in the plurality of resin layers. Specifically, when viewed from a direction perpendicular to the first surface 111, the second resin layer is laminated on the first resin layer having the first openings intermittently provided along the cut line CL. The second resin layer has second openings intermittently provided along the cut line CL so as to partially overlap the first openings. This allows the first openings to communicate with the second openings, thereby forming a continuous gap 114v along the cut line CL.

[0065] When the multilayer substrate 110m is a ceramic substrate, a resin pattern is provided along the cut line CL between the first and second ceramic layers included in the plurality of ceramic layers to form the cavity 114v. The portion of the resin pattern burned away during firing forms the cavity 114v.

[0066] In addition, in order to discharge the gas generated when the resin pattern is burned off, the resin pattern is preferably set to be continuous to the peripheral side surface of the multilayer substrate 110m. In this case, the resin pattern exposed on the peripheral side surface of the multilayer substrate 110m is burned off, thereby forming an exhaust port for the above-mentioned gas, so that the above-mentioned gas can be discharged to the outside of the multilayer substrate 110m from the exhaust port. If the above-mentioned gas is enclosed in the closed space within the multilayer substrate 110m, the above-mentioned gas expands during firing and may damage the multilayer substrate 110m. Therefore, it is preferable to discharge the above-mentioned gas to the outside of the multilayer substrate 110m. In addition, as described above, by setting the above-mentioned gas exhaust port on the peripheral side surface of the multilayer substrate 110m, it is possible to suppress the sealing resin from flowing into the gap portion 114v and causing the gap portion 114v to disappear. If the above-mentioned gas exhaust port is open on the first surface 111 or the second surface 112, the sealing resin flows into the gap portion 114v from the exhaust port, and at least a portion of the gap portion 114v disappears.

[0067] Next, if Figure 3 As shown, electronic components 140 are mounted on both first surface 111 and second surface 112 of multilayer substrate 110 m , and columnar conductors 150 are mounted on second surface 112 ( S20 ). Figure 5 This is a diagram showing a state where electronic components and columnar conductors are mounted on a multilayer substrate in the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0068] like Figure 5 As shown, electronic component 140 is mounted via solder to electrode terminals 117 provided on first surface 111 of multilayer substrate 110m. Similarly, electronic component 140 and columnar conductor 150 are mounted via solder to electrode terminals 118 provided on second surface 112 of multilayer substrate 110m. Then, during a reflow process, heating is performed to melt the solder, thereby bonding electronic component 140 to electrode terminals 117 and 118. Furthermore, multilayer substrate 110m may be cleaned after reflow, as needed.

[0069] Furthermore, in the mounting step (S20) of electronic component 140, mounting can be performed simultaneously on both first and second surfaces 111, 112 of multilayer substrate 110m, or mounting can be performed on one surface before proceeding to the other surface. Columnar conductors 150 can be formed by plating or the like during the forming step (S10) of multilayer substrate 110m, or by providing a conductor within an opening formed in the sealing resin after the molding step (S30) described later.

[0070] Next, if Figure 3 As shown, the multi-layer substrate is molded with a sealing resin (S30). Figure 6This is a diagram showing a state where a multilayer substrate is molded with a sealing resin in the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0071] like Figure 6 As shown, the sealing resin portion 120 is provided on the first surface 111 of the multilayer substrate 110 m so as to cover the electronic component 140 , and the sealing resin portion 130 is provided on the second surface 112 of the multilayer substrate 110 m so as to cover the electronic component 140 .

[0072] As a molding method, for example, a known method such as compression molding, transfer molding, liquid resin molding, or sheet resin molding can be used.

[0073] In the molding step (S30), the first surface 111 and the second surface 112 of the multilayer substrate 110m may be molded together or individually. Furthermore, the multilayer substrate 110m may be plasma cleaned before the molding step (S30) as needed.

[0074] Next, if Figure 3 As shown, connection terminals are formed (S40). Figure 7 This is a diagram showing a state where connection terminals are formed in the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0075] The end faces of columnar conductors 150 are exposed from sealing resin portion 130, and connection terminals 160 are formed on these end faces. Exposing the end faces of columnar conductors 150 is performed by grinding main surface 131 of sealing resin portion 130. Alternatively, this can be performed by using a drill or laser to create an opening in sealing resin portion 130 covering the portion of columnar conductors 150. Connection terminals 160 are, for example, solder bumps. Solder bumps can be formed by melting solder paste printed using a mask in a reflow process.

[0076] Next, if Figure 3 As shown, the multi-layer substrate is cut along cutting lines CL ( S50 ). Figure 8 This is a diagram showing a state where a multilayer substrate is cut along cutting lines in the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0077] The multilayer substrate 110m is cut along the cutting line CL by a slicer or a laser cutter, as shown in FIG. Figure 8 As shown, it is sliced ​​into a plurality of module substrates 110 .

[0078] The end surface of the ground electrode GND is exposed on the peripheral side surface 113 of each of the plurality of module substrates 110 . In addition, the cavity 114 v is exposed as the recessed portion 114 on the peripheral side surface 113 of each of the plurality of module substrates 110 .

[0079] Next, if Figure 3 As shown, a shield is formed by sputtering (S60). Figure 9 This is a diagram showing a state where a shield is formed by sputtering in the method for manufacturing the electronic component module according to the first embodiment of the present invention.

[0080] By performing sputtering while the main surface 131 of the sealing resin portion 130 is covered and held by, for example, an adhesive sheet, etc., Figure 9 As shown, the shield 170 is formed to cover the main surface 121 and the peripheral side surface 122 of the sealing resin portion 120 , and the peripheral side surface 132 of the sealing resin portion 130 .

[0081] The shield 170 is connected to the ground electrode GND on the peripheral side surface 113 of the module substrate 110. The shield 170 is separated into a first surface 111 side and a second surface 112 side by a recess 114 on the peripheral side surface 113 of the module substrate 110. Specifically, during sputtering, the conductive material constituting the shield 170 hardly enters the interior of the recess 114. Therefore, the portion of the recess 114 where the shield 170 is not formed becomes a first separation portion 171.

[0082] Furthermore, as described above, from the viewpoint of reliably separating the shielding member 170 by the first separating portion 171, as shown in FIG. Figure 2 As shown in FIG. 1 , when the thickness of shield 170 is represented by a and the width of recess 114 is represented by b, the relationship b>2a is preferably satisfied. This prevents the portion of shield 170 located on the first surface 111 side and the portion of shield 170 located on the second surface 112 side from connecting to each other on the peripheral side surface 113 of module substrate 110, thereby blocking recess 114.

[0083] The thickness a of the shield 170 can be, for example, 2 μm or greater. The shield 170 can also be composed of multiple layers, for example, three layers including an adhesion layer, a conductive layer, and a corrosion-resistant layer.

[0084] The method of forming the shield 170 is not limited to sputtering, and other physical film forming methods such as vapor deposition may also be used.

[0085] Through the above-described series of steps, the electronic component module 100 can be manufactured.

[0086] In the electronic component module 100 according to this embodiment, the shield 170 is separated into a first surface 111 side and a second surface 112 side by at least one recess 114 on the peripheral side surface 113. This prevents electromagnetic waves generated by the electronic components 140 mounted on the first surface 111 of the module substrate 110 from being transmitted through the shield 170 to the electronic components 140 mounted on the second surface 112. Similarly, electromagnetic waves generated by the electronic components 140 mounted on the second surface 112 of the module substrate 110 are prevented from being transmitted through the shield 170 to the electronic components 140 mounted on the first surface 111. Consequently, EMI can be effectively suppressed.

[0087] In the electronic component module 100 according to this embodiment, the shield 170 is connected to the ground electrode GND on the peripheral side surface 113 of the module substrate 110. This prevents electromagnetic waves captured by the shield 170 from being re-emitted from the shield 170. Furthermore, since wiring, etc., for connecting the ground electrode GND to the shield 170 does not need to be arranged on the first surface 111 or the second surface 112 of the module substrate 110, the space occupied by the wiring on each of the first surface 111 and the second surface 112 of the module substrate 110 can be reduced, and the shield 170 can be easily set to the ground potential without connecting any wiring.

[0088] In the electronic component module 100 according to this embodiment, an annular groove is provided on the peripheral side surface 113, which extends around the peripheral side surface 113 and serves as at least one recess 114. As a result, the portion of the shield 170 covering the main surface 121 and peripheral side surface 122 of the sealing resin portion 120 can be completely separated from the portion covering the peripheral side surface 132 of the sealing resin portion 130.

[0089] Therefore, electromagnetic waves generated in electronic components 140 mounted on first surface 111 of module substrate 110 can be effectively prevented from being transmitted to electronic components 140 mounted on second surface 112 via shield 170. Similarly, electromagnetic waves generated in electronic components 140 mounted on second surface 112 of module substrate 110 can be effectively prevented from being transmitted to electronic components 140 mounted on first surface 111 via shield 170. Consequently, EMI can be more effectively suppressed.

[0090] In the electronic component module 100 according to this embodiment, a plurality of electronic components 140 are mounted on each of the first surface 111 and the second surface 112, and the sealing resin portions 120 and 130 are provided on both the first surface 111 and the second surface 112. This prevents the electronic components 140 mounted on both surfaces of the module substrate 110 from being affected by mutually radiated electromagnetic waves.

[0091] Here, a modification of the first embodiment of the present invention will be described in which a sacrificial layer portion is provided instead of the cavity portion 114 v when the multilayer substrate 110 m is a resin substrate.

[0092] Figure 10 1 is a cross-sectional view showing the structure of a multilayer substrate formed in a method for manufacturing an electronic component module according to a modification of the first embodiment of the present invention. Figure 10 In, with Figure 4 The same cross-sectional view is shown.

[0093] like Figure 10 As shown, in a multilayer substrate 110ma according to a modified example of Embodiment 1 of the present invention, a sacrificial layer portion 119 is provided in place of the void portion 114v. Sacrificial layer portion 119 is formed of a photosensitive resist or a water-soluble resin. Sacrificial layer portion 119 is exposed on the peripheral side surface 113 of the module substrate 110 when the multilayer substrate 110ma is separated into pieces.

[0094] The module substrate 110 can be cleaned with a solvent or the like to dissolve and remove the sacrificial layer portion 119, thereby forming the recessed portion 114. Furthermore, if the sacrificial layer portion 119 is made of a water-soluble resin, the sacrificial layer portion 119 can be dissolved by cutting water used when separating the multilayer substrate 110ma. Therefore, the recessed portion 114 can be formed in the module substrate 110 without cleaning the module substrate 110 with a solvent or the like.

[0095] (Implementation Method 2)

[0096] The following describes an electronic component module according to a second embodiment of the present invention with reference to the accompanying drawings. The electronic component module according to the second embodiment of the present invention differs from the electronic component module 100 according to the first embodiment of the present invention primarily in that the shield also covers a portion of the main surface 131 of the sealing resin portion 130. Therefore, description of the same structures as those of the electronic component module 100 according to the first embodiment of the present invention will not be repeated.

[0097] Figure 11 : is a cross-sectional view showing the structure of an electronic component module according to Embodiment 2 of the present invention. Figure 11 In, with Figure 1 The same cross-sectional view is shown.

[0098] like Figure 11 As shown, in electronic component module 200 according to Embodiment 2 of the present invention, shield 270 also covers a portion of main surface 131 of sealing resin portion 130 . Connection terminals 160 and ground terminals 260 are provided on main surface 131 of sealing resin portion 130 .

[0099] A portion of the shield 270 located on the main surface 131 of the sealing resin portion 130 is separated from the connection terminal 160 and is connected to the ground terminal 260 .

[0100] In the electronic component module 200 involved in embodiment 2 of the present invention, since the shielding member 270 also covers a portion of the main surface 131 of the sealing resin portion 130, when the electronic component module 200 is mounted on the mounting substrate through the connecting terminal 160, the influence of the electromagnetic waves generated in the mounting substrate on the electronic component 140 mounted on the second surface 112 can be reduced.

[0101] (Implementation 3)

[0102] An electronic component module according to a third embodiment of the present invention will be described below with reference to the accompanying drawings. The electronic component module according to the third embodiment of the present invention differs from the electronic component module 100 according to the first embodiment of the present invention primarily in that the shielding member is also separated from the sealing resin portion. Therefore, description of the same structures as those of the electronic component module 100 according to the first embodiment of the present invention will not be repeated.

[0103] Figure 12 It is a plan view showing the structure of an electronic component module according to a third embodiment of the present invention. Figure 13 Observed from the XIII direction Figure 12 Diagram of the electronic component module. Figure 14 It is enlarged to show Figure 13 Figure of Part XIV. Figure 15 Observed from the XV direction Figure 12 Diagram of the electronic component module. Figure 16 Observed from the direction of the arrow on line XVI-XVI Figure 12 A cross-sectional view of an electronic component module.

[0104] like Figures 12 to 16 As shown, in electronic component module 300 according to Embodiment 3 of the present invention, at least one groove 324 is provided in sealing resin portion 120 . Shields 370 are separated from each other by at least one groove 324 in sealing resin portion 120 .

[0105] like Figures 13 to 16 As shown, a groove extending less than one circumference of the peripheral side surface 113 along the first surface 111 or the second surface 112 is provided on the peripheral side surface 113 of the module substrate 310 , serving as a recess 314 .

[0106] like Figures 13 to 15As shown, a connection groove, serving as recess 314a, is further provided on peripheral side surface 113 of module substrate 310, extending from each end of recess 314 to first surface 111. In electronic component module 300 according to Embodiment 3 of the present invention, recess 314a extends in a direction perpendicular to first surface 111, but may alternatively extend in a direction obliquely intersecting first surface 111.

[0107] like Figures 12 to 16 As shown, the sealing resin portion 120 is provided with a groove 324 so as to be continuous with the two recessed portions 314 a .

[0108] The shield 370 is separated into two parts, one on the first surface 111 side and the other on the second surface 112 side, by the recess 314 on the peripheral side surface 113 of the module substrate 310 .

[0109] The shields 370 are separated from each other in the direction along the first surface 111 by the grooves 324 on the sealing resin portion 120 .

[0110] Shield 370 is separated from each other along first surface 111 by recess 314a on peripheral side surface 113 of module substrate 310. Specifically, shield 370 is divided into two parts by first separation portion 371 and second separation portion 372. First separation portion 371 is located where shield 370 is not formed in recess 314, while second separation portion 372 is located where shield 370 is not formed in recess 314a and groove 324.

[0111] Known methods such as dicing or laser cutting can be used to form the groove 324 in the sealing resin portion 120. When the shield 370 is formed to cover the groove 324, the portion of the shield 370 located above the groove 324 is removed using a laser or the like.

[0112] In the electronic component module 300 according to the third embodiment of the present invention, at least one groove 324 is provided in the sealing resin portion 120 , and the shields 370 are separated from each other on the sealing resin portion 120 by the at least one groove 324 .

[0113] Thus, electromagnetic waves generated in electronic components 140 mounted on first surface 111 of module substrate 310 can be prevented from being transmitted to electronic components 140 mounted on second surface 112 via shield 370. Similarly, electromagnetic waves generated in electronic components 140 mounted on second surface 112 of module substrate 310 can be prevented from being transmitted to electronic components 140 mounted on first surface 111 via shield 370.

[0114] Furthermore, electromagnetic waves generated in electronic component 140 mounted on one side of first surface 111 with slot 324 interposed therebetween can be suppressed from being transmitted to electronic component 140 mounted on the other side of first surface 111 via shield 370. Similarly, electromagnetic waves generated in electronic component 140 mounted on the other side of first surface 111 with slot 324 interposed therebetween can be suppressed from being transmitted to electronic component 140 mounted on one side of first surface 111 via shield 370.

[0115] Therefore, also in the electronic component module 300 according to the third embodiment of the present invention, EMI can be effectively suppressed.

[0116] Furthermore, the recessed portion extending in the direction intersecting the first surface 111 is not limited to extending in a straight line, and is not limited to reaching the first surface 111 .

[0117] Figure 17 FIG. 1 is an enlarged view showing a portion of the peripheral side surface of the module substrate of the electronic component module according to the first modified example of the third embodiment of the present invention. Figure 17 As shown, a stepped recess 314b may be provided from the end of the recess 314 to the first surface 111. In this way, at least one recess may have a portion extending along the surface direction of the module substrate 310 and a portion extending along the thickness direction of the module substrate 310.

[0118] Figure 18 FIG. 1 is an enlarged view showing a portion of the peripheral side surface of the module substrate of the electronic component module according to the second modified example of the third embodiment of the present invention. Figure 18 As shown, the recess 314 c may be provided so as to connect two recesses 314 located at different positions in a direction perpendicular to the first surface 111 .

[0119] (Implementation 4)

[0120] An electronic component module according to a fourth embodiment of the present invention will be described below with reference to the accompanying drawings. The electronic component module according to the fourth embodiment of the present invention differs from the electronic component module 300 according to the third embodiment of the present invention primarily in that the shielding member is partially separated. Therefore, description of the same structures as those of the electronic component module 300 according to the third embodiment of the present invention will not be repeated.

[0121] Figure 19 It is a plan view showing the structure of an electronic component module according to a fourth embodiment of the present invention. Figure 20 Observed from the direction of XX Figure 19 Diagram of the electronic component module. Figure 21 Observed from the XXI direction Figure 19 Diagram of the electronic component module.

[0122] like Figures 19 to 21 As shown, in electronic component module 400 according to Embodiment 4 of the present invention, at least one groove 424 is provided in sealing resin portion 120 . Shields 470 are separated from each other by at least one groove 424 in sealing resin portion 120 .

[0123] The recess 314a is provided only on one end side of the recess 314 and not on the other end side of the recess 314. One end of the groove 424 reaches the peripheral side surface 122 of the sealing resin portion 120, while the other end does not reach the peripheral side surface 122 of the sealing resin portion 120.

[0124] In electronic component module 400 according to Embodiment 4 of the present invention, shield 470 is partially separated by first separating portion 371 and second separating portion 472, and is not completely separated. However, this arrangement reduces the propagation path of electromagnetic waves within shield 470, effectively suppressing EMI. Furthermore, second separating portion 472 is located at a position within slot 424 where shield 470 is not formed.

[0125] (Implementation 5)

[0126] An electronic component module according to a fifth embodiment of the present invention will be described below with reference to the accompanying drawings. The electronic component module according to the fifth embodiment of the present invention differs from the electronic component module 100 according to the first embodiment of the present invention primarily in that the recessed portion is provided discontinuously. Therefore, description of the same structures as those of the electronic component module 100 according to the first embodiment of the present invention will not be repeated.

[0127] Figure 22 FIG is an enlarged view showing a portion of the peripheral side surface of the module substrate of the electronic component module according to the fifth embodiment of the present invention. Figure 22 As shown, in the electronic component module according to the fifth embodiment of the present invention, a plurality of recesses 514 are arranged at intervals to form a row along the first surface 111 or the second surface 112. Therefore, in the shield, a plurality of first separation portions, separated from each other by the recesses 514 into the first surface 111 side and the second surface 112 side, are formed at intervals to form a row.

[0128] In the electronic component module according to the fifth embodiment of the present invention, the shield is partially separated, not completely separated. However, even in this manner, the propagation path of electromagnetic waves in the shield can be reduced, thereby effectively suppressing EMI.

[0129] In addition, the arrangement of the recessed portion 514 is not limited to the above. Figure 23FIG. 1 is an enlarged view showing a portion of the peripheral side surface of a module substrate of an electronic component module according to a modified example of the fifth embodiment of the present invention. Figure 23 As shown, in the electronic component module according to the modified example of the fifth embodiment of the present invention, a plurality of recesses 514a are arranged alternately in two rows along the first surface 111 or the second surface 112. The recesses 514a in the first row and the recesses 514a in the second row only partially overlap in the circumferential direction of the module substrate 510.

[0130] Thus, in the shield, a plurality of first separation portions, separated by recesses 514a into the first surface 111 side and the second surface 112 side, are arranged alternately in two rows at intervals. In this case, the electromagnetic wave propagation path connecting the first surface 111 side and the second surface 112 side in the shield can be shortened and lengthened, thereby effectively suppressing EMI.

[0131] (Implementation 6)

[0132] An electronic component module according to a sixth embodiment of the present invention will be described below with reference to the accompanying drawings. The electronic component module according to the sixth embodiment of the present invention differs from the electronic component module 100 according to the first embodiment of the present invention primarily in the provision of an antenna circuit. Therefore, description of the same structures as those of the electronic component module 100 according to the first embodiment of the present invention will not be repeated.

[0133] Figure 24 : is a cross-sectional view showing the structure of an electronic component module according to Embodiment 6 of the present invention. Figure 24 In, with Figure 1 The same cross-sectional view is shown.

[0134] like Figure 24 As shown, in electronic component module 600 according to Embodiment 6 of the present invention, antenna circuit 617 is provided on first surface 111. Furthermore, no sealing resin portion is provided on first surface 111, and antenna circuit 617 is not covered by the sealing resin portion. However, antenna circuit 617 may be covered by the sealing resin portion.

[0135] In electronic component module 600 according to the sixth embodiment of the present invention, electromagnetic waves generated by antenna circuit 617 can be prevented from being transmitted to electronic component 140 mounted on second surface 112 via shield 170. Therefore, EMI can be effectively suppressed.

[0136] Alternatively, the antenna circuit 617 may be provided on the first surface 111 , and the electronic component 140 may be mounted thereon. Figure 25 : is a cross-sectional view showing the structure of an electronic component module according to a modification of the sixth embodiment of the present invention. Figure 25In, with Figure 24 The same cross-sectional view is shown.

[0137] like Figure 25 As shown, in electronic component module 600a according to a modification of Embodiment 6 of the present invention, antenna circuit 617 is provided on first surface 111 and electronic component 140 is mounted thereon. Sealing resin portion 120 does not cover antenna circuit 617 but covers electronic component 140 .

[0138] In the electronic component module 600a involved in the modified example of embodiment 6 of the present invention, it is possible to suppress the electromagnetic waves generated by the antenna circuit 617 from being transmitted to the electronic component 140 installed on the second surface 112 via the shielding member 170, and it is possible to suppress the above-mentioned electromagnetic waves from being transmitted to the electronic component 140 installed on the first surface 111 via the shielding member 170, thereby effectively suppressing EMI.

[0139] Furthermore, antenna circuit 617 only needs to be provided on at least one of first surface 111 and second surface 112 . When antenna circuit 617 is provided on second surface 112 , sealing resin portion 130 does not cover antenna circuit 617 .

[0140] (Implementation 7)

[0141] An electronic component module according to a seventh embodiment of the present invention will be described below with reference to the accompanying drawings. The electronic component module according to the seventh embodiment of the present invention differs from the electronic component module 600 according to the sixth embodiment of the present invention primarily in that a connector is provided as a connection terminal. Therefore, description of the same structures as those of the electronic component module 600 according to the sixth embodiment of the present invention will not be repeated.

[0142] Figure 26 : is a cross-sectional view showing the structure of an electronic component module according to Embodiment 7 of the present invention. Figure 26 In, with Figure 24 The same cross-sectional view is shown.

[0143] like Figure 26 As shown, in electronic component module 700 according to Embodiment 7 of the present invention, connector 740 is provided as a connection terminal on second surface 112. Connector 740 is connected to a corresponding member provided on the mounting substrate. Sealing resin portion 130 does not cover connector 740 but covers electronic component 140.

[0144] In electronic component module 700 according to Embodiment 7 of the present invention, electromagnetic waves generated by antenna circuit 617 can be prevented from being transmitted to electronic component 140 mounted on second surface 112 via shield 170. Consequently, EMI can be effectively suppressed. Furthermore, electronic component module 700 can be easily mounted on a mounting substrate using connector 740.

[0145] Alternatively, the antenna circuit 617 may be provided on the first surface 111 , and the electronic component 140 may be mounted thereon. Figure 27 : is a cross-sectional view showing the structure of an electronic component module according to a modification of the seventh embodiment of the present invention. Figure 27 In, with Figure 26 The same cross-sectional view is shown.

[0146] like Figure 27 As shown, in electronic component module 700a according to a modification of Embodiment 7 of the present invention, antenna circuit 617 is provided on first surface 111 and electronic component 140 is mounted thereon. Sealing resin portion 120 does not cover antenna circuit 617 but covers electronic component 140 .

[0147] In the electronic component module 700a involved in the modified example of embodiment 7 of the present invention, it is possible to suppress the electromagnetic waves generated by the antenna circuit 617 from being transmitted to the electronic component 140 installed on the second surface 112 via the shielding member 170, and it is possible to suppress the above-mentioned electromagnetic waves from being transmitted to the electronic component 140 installed on the first surface 111 via the shielding member 170, thereby effectively suppressing EMI.

[0148] Furthermore, the connector 740 only needs to be provided on at least one of the first surface 111 and the second surface 112. When the connector 740 is provided on the first surface 111, the sealing resin portion 120 does not cover the connector 740.

[0149] In the description of the above embodiments, combinable structures may be combined with each other.

[0150] The embodiments disclosed herein are illustrative in all respects and are not intended to limit the present invention. The scope of the present invention is indicated by the claims rather than the above description, and is intended to include all modifications within the meaning and scope of the claims and equivalents.

[0151] Description of Reference Numerals

[0152] 100, 200, 300, 400, 600, 600a, 700, 700a…electronic component module; 110, 310, 510…module substrate; 110m, 110ma…multilayer substrate; 111…first surface; 112…second surface; 113, 122, 132…side surface; 114, 314, 314a, 314b, 314c, 514, 514a…recess; 114v…gap; 117, 118…electrode terminals Sub; 119…sacrificial layer portion; 120, 130…sealing resin portion; 121, 131…main surface; 140…electronic component; 150…columnar conductor; 160…connecting terminal; 170, 270, 370, 470…shielding member; 171, 371…first separating portion; 260…terminal; 324, 424…groove; 372, 472…second separating portion; 617…antenna circuit; 740…connector; CL…cutting line; GND…ground electrode.

Claims

1. An electronic component module, wherein: have: A module substrate having a first surface, a second surface opposite to the first surface, and a peripheral side surface connecting the first surface and the second surface, wherein an electronic component is mounted on at least one of the first surface and the second surface; a sealing resin portion provided on at least one of the first surface and the second surface for sealing the electronic component; as well as a shielding member provided to cover the sealing resin portion and each of the peripheral side surfaces, A ground electrode is provided on the module substrate. The shielding member is connected to the ground electrode, The shield is separated into a first surface side and a second surface side on the peripheral side. At least one recess is provided on the peripheral side surface. The shielding member covers the portion of the peripheral side surface other than the at least one recessed portion. The shield is separated into the first surface side and the second surface side by the at least one recess on the peripheral side. When the thickness of the shield is set to a and the width of the recess is set to b, the relationship b>2a is satisfied.

2. The electronic component module according to claim 1, wherein The peripheral side surface is provided with an annular groove surrounding the peripheral side surface as the at least one recessed portion.

3. The electronic component module according to claim 1, wherein The peripheral side surface is provided with a plurality of recessed portions spaced apart from each other as the at least one recessed portion.

4. The electronic component module according to claim 1, wherein The at least one recessed portion includes a portion extending in a surface direction of the module substrate and a portion extending in a thickness direction of the module substrate.

5. The electronic component module according to any one of claims 1 to 4, wherein A groove is provided in the sealing resin portion, The shields are separated from each other by the slot and the at least one recess.

6. The electronic component module according to any one of claims 1 to 4, wherein The electronic component is mounted on each of the first surface and the second surface, The sealing resin portion is provided on both the first surface and the second surface.

7. The electronic component module according to any one of claims 1 to 4, wherein An antenna circuit is provided on at least one of the first surface and the second surface.

8. The electronic component module according to any one of claims 1 to 4, wherein A connector as a connection terminal is provided on at least one of the first surface and the second surface.

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