Semiconductor process equipment and its separation devices

Abstract

This application provides a semiconductor process equipment and its separation device. The separation device is used to separate two wafers bonded by epitaxial processes into a laminate. It includes a base, a support mechanism, and a clamping separation mechanism. The support mechanism is disposed on the base and is used to hold a cassette containing the laminate. It extends into the cassette to lift the laminate and create a gap between the main wafer and the secondary wafer. The clamping separation mechanism is disposed above the support mechanism and is used to clamp the laminate with the gap, completely separating the main wafer and the secondary wafer. This application achieves automated wafer separation, suitable for large-scale batch production, significantly improving throughput and yield, and also significantly reducing labor costs.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and more specifically, to a semiconductor process equipment and its separation device. Background Technology

[0002] Currently, due to the surge in global chip demand and the shortage of production capacity, my country's semiconductor industry has achieved rapid development. As a result, the production lines have increased their requirements for the capacity and reliability of semiconductor process equipment, leading to a growing demand for high-precision automated semiconductor process equipment.

[0003] In existing technologies, after two wafers are bonded together using epitaxial processes, it is necessary to completely separate the two fully bonded wafers. Specifically, a lifting mechanism removes the fully bonded wafers from the cassette, and after the wafers have cooled sufficiently, they are manually separated into the main wafer and the secondary wafer. However, due to the large number of wafers to be separated, manual operation is not only slow but also carries the risk of damaging the wafer's process layers. Therefore, the existing solutions not only result in high labor costs but also severely impact semiconductor equipment throughput and yield due to the inability to automate the process. Summary of the Invention

[0004] This application addresses the shortcomings of existing methods by proposing a semiconductor process equipment and its separation device to solve the technical problems of high labor costs, low production capacity and low yield in the prior art.

[0005] In a first aspect, embodiments of this application provide a separation device for semiconductor process equipment, used to separate a wafer formed from two wafers bonded by epitaxial processes, comprising: a base, a support mechanism, and a clamping separation mechanism; the support mechanism is disposed on the base and is used to place a cassette containing the wafer, and can extend into the cassette to drive the wafer upward and create a gap between the main wafer and the secondary wafer of the wafer; the clamping separation mechanism is disposed above the support mechanism and is used to clamp the wafer with the gap and completely separate the main wafer and the secondary wafer.

[0006] In one embodiment of this application, the supporting mechanism includes a support platform and a support structure. The support platform is fixedly disposed on the base and is used to place the cartridge. The support structure is vertically and flexibly disposed on the support platform. The support structure has a plurality of parallelly arranged support grooves for accommodating the edges of the plurality of composite pieces respectively. A separation tooth is provided at the center of the support groove. The separation tooth extends along the extension direction of the support groove and is used to extend between the main piece and the auxiliary piece to create a gap between the main piece and the auxiliary piece.

[0007] In one embodiment of this application, both sides of the bearing groove have positioning slopes. The positioning slopes are located at the bottom of the side walls. The two opposing positioning slopes are inclined inward from top to bottom to define the positions of the main piece and the auxiliary piece, so that the size of the gap is a preset value.

[0008] In one embodiment of this application, both sides of the bearing groove have guide slopes, the bottom of the guide slopes are connected to the top of the positioning slopes, and the two opposing guide slopes are inclined inward from top to bottom to guide the two sides of the assembly piece so that the edge of the assembly piece falls into the bearing groove.

[0009] In one embodiment of this application, the two opposing positioning inclined surfaces of the bearing groove form a first preset angle, the first preset angle being greater than or equal to 15 degrees and less than or equal to 25 degrees, and the preset value being 0.05 mm to 0.1 mm.

[0010] In one embodiment of this application, the two opposing guide ramps of the bearing groove form a second preset angle, which is less than 90 degrees and greater than 45 degrees.

[0011] In one embodiment of this application, the cross-section of the separating tooth is a wedge-shaped structure, and the top of the separating tooth has a preset distance between it and the two opposing positioning inclined surfaces. The preset distance is less than 1.5 times the thickness of the main piece or the auxiliary piece.

[0012] In one embodiment of this application, the support structure includes two symmetrically arranged support rods, the two support rods are spaced apart, and a plurality of support grooves are arranged side by side along the axial direction of the support rods, the two support rods cooperate with each other to support the composite piece.

[0013] In one embodiment of this application, the clamping and separating mechanism includes two symmetrically arranged separating components. Each of the two separating components is provided with a separating groove that corresponds one-to-one with the bearing groove, and the separating grooves of the two separating components are arranged opposite to each other to accommodate the two opposite edges of the composite piece to clamp the composite piece.

[0014] In one embodiment of this application, the separation groove includes a fixed section and a movable section. The fixed section is used to accommodate the edge of the main piece, and the movable section is used to accommodate the edge of the secondary piece, and to move the secondary piece along a first direction so that the main piece and the secondary piece are completely separated; or, the fixed section is used to accommodate the edge of the secondary piece, and the movable section is used to accommodate the edge of the main piece, and to move the main piece along a first direction so that the main piece and the secondary piece are completely separated.

[0015] In one embodiment of this application, the separation component includes a fixed block, a movable block, and a first driving component. The fixed block and the movable block are stacked on top of each other, and the fixed block is provided with the fixed segment, and the movable block is provided with the movable segment. The first driving component is used to drive the movable block to move relative to the fixed block along the first direction.

[0016] In one embodiment of this application, the fixed segment includes a first sidewall and a second sidewall, and the movable segment includes a third sidewall and a fourth sidewall; the second sidewall and the third sidewall are aligned in their extending directions, and the first sidewall and the fourth sidewall are located on opposite sides of the extending directions of the second sidewall and the third sidewall, respectively.

[0017] In one embodiment of this application, the bottom surface of the fixed segment protrudes from the surface of the fixed block, and the bottom surface of the movable segment protrudes from the surface of the movable block; the first sidewall has a first height relative to the surface of the fixed block, and the second sidewall has a second height relative to the surface of the fixed block; the third sidewall has the second height relative to the surface of the movable block, and the fourth sidewall has the first height relative to the surface of the movable block, wherein the first height is greater than the second height.

[0018] In one embodiment of this application, the first drive assembly includes a first drive unit and a first lead screw component, wherein the first drive unit drives the movable block to move via the first lead screw component.

[0019] In one embodiment of this application, the clamping and separating mechanism further includes columns, a second driving assembly, and a guide assembly. The bottom ends of the two columns are slidably disposed on the base, and the top ends of the two columns are respectively provided with the separating assembly. The two guide assemblies are arranged sequentially along the extension direction of the columns, and the two ends of the guide assemblies are respectively connected to the two columns. The second driving assembly is located between the two guide assemblies. The second driving assembly includes a second driving part and a second lead screw component. The two second driving parts are respectively connected to the two columns through the two second lead screw components, for simultaneously driving the two columns to move towards each other or backwards.

[0020] Secondly, embodiments of this application provide a semiconductor process apparatus, including a process chamber, a robotic arm, and a separation device as provided in the first aspect, wherein the robotic arm is used to transfer a cassette loaded with wafers between the process chamber and the separation device.

[0021] The beneficial technical effects of the technical solutions provided in this application are:

[0022] This embodiment of the application uses a carrier mechanism to carry the cartridge and extend into the cartridge to lift multiple laminated pieces inside. The carrier mechanism also performs initial separation of the laminated pieces to create gaps between the main piece and the secondary piece. A clamping and separating mechanism is then used to clamp the laminated pieces with gaps conveyed by the carrier mechanism and further separate them to completely separate the main piece and the laminated pieces. This design enables automated separation of laminated pieces, suitable for large-scale mass production, significantly improving production capacity and yield while also substantially reducing labor costs.

[0023] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0024] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0025] Figure 1 This is a schematic diagram of the structure of a separation device provided in an embodiment of this application;

[0026] Figure 2 A partial structural schematic diagram of a load-bearing rod provided in an embodiment of this application;

[0027] Figure 3 A cross-sectional schematic diagram showing the engagement of the separating teeth and the mating piece in a bearing groove, as provided in an embodiment of this application;

[0028] Figure 4 A cross-sectional schematic diagram of the guide slope of a bearing groove and its fit with a composite piece, provided for an embodiment of this application;

[0029] Figure 5A A partial structural diagram of a separate component provided in an embodiment of this application;

[0030] Figure 5B A cross-sectional schematic diagram showing the cooperation between a first drive unit and a first lead screw component, provided for an embodiment of this application;

[0031] Figure 6A This is a cross-sectional structural diagram of a fixed segment provided in an embodiment of this application;

[0032] Figure 6B A cross-sectional structural diagram of an active segment provided in an embodiment of this application;

[0033] Figure 6C This is a cross-sectional structural diagram of a piece in which the active segment and the fixed segment are completely separated and joined together, as provided in an embodiment of this application.

[0034] Figure 7 This is a schematic diagram of a separation mechanism provided in an embodiment of this application. Detailed Implementation

[0035] This application is described in detail below. Examples of embodiments of this application are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Furthermore, detailed descriptions of known technologies that are unnecessary for the features of this application are omitted. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0036] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0037] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments.

[0038] This application provides a separation device for semiconductor process equipment, used to separate a wafer 100 formed by two wafers bonded by epitaxial processes. A schematic diagram of the separation device is shown below. Figure 1 As shown, it includes: a base 1, a support mechanism 2, and a clamping and separating mechanism 3; the support mechanism 2 is disposed on the base 1 and is used to place a cartridge (not shown in the figure) loaded with the composite piece 100, and can extend into the cartridge to drive the composite piece 100 to rise and create a gap between the main piece and the secondary piece of the composite piece 100; the clamping and separating mechanism 3 is disposed above the support structure 2 and is used to clamp the composite piece 100 with the gap and completely separate the main piece and the secondary piece.

[0039] like Figure 1As shown, semiconductor process equipment can be used to perform epitaxial processes on wafers and to perform bonding on wafers. However, the embodiments of this application do not limit the specific process types performed by the semiconductor process equipment, and those skilled in the art can adjust the settings according to actual conditions. The base 1 can be fixedly arranged in the horizontal direction for mounting the carrier mechanism 2 and the clamping and separating mechanism 3. The carrier mechanism 2 may include a carrier platform 21 and a support structure 22. The carrier platform 21 is stacked on the base 1 for mounting the support structure 22 and the carrier cassette. The support structure 22 is vertically and vertically mounted on the carrier platform 21. However, the embodiments of this application do not limit the specific structure of the carrier mechanism 2. For example, the support structure 22 can be directly mounted on the base 1 and can be raised and lowered relative to the base 1. The clamping and separating mechanism 3 may include a clamping structure 31 and a separating structure 32. The bottom of the clamping structure 31 can be located on both sides of the carrier platform 21, and the separating structure 32 can be located on the top of the clamping structure 31, that is, the separating structure 32 is located above the support structure 22. However, the embodiments of this application do not limit its specific position. However, the embodiments of this application do not limit the specific structure of the clamping and separating mechanism 3, and those skilled in the art can adjust the settings according to the actual situation. In practical applications, the robot arm of the semiconductor process equipment transfers the cartridge to the carrier stage 21, with the opening of the cartridge facing the separating structure 32. At this time, the support structure 22 can enter from the bottom of the cartridge and drive the multiple laminates 100 inside the cartridge to rise, and perform initial separation of the laminates 100 so that there is a gap between the main laminate and the secondary laminate of the laminate 100, but the two are still bonded together. The support structure 22 continues to drive the laminates 100 to rise to the position of the separating structure 32. The clamping structure 31 can drive the separating structure 32 to clamp the laminates 100 with gaps, and the separating structure 32 can further separate the laminates 100 so that the main laminate and the secondary laminate are completely separated.

[0040] This embodiment of the application uses a carrier mechanism to carry the cartridge and extend into the cartridge to lift multiple laminated pieces inside. The carrier mechanism also performs initial separation of the laminated pieces to create gaps between the main piece and the secondary piece. A clamping and separating mechanism is then used to clamp the laminated pieces with gaps conveyed by the carrier mechanism and further separate them to completely separate the main piece and the laminated pieces. This design enables automated separation of laminated pieces, suitable for large-scale mass production, significantly improving production capacity and yield while also substantially reducing labor costs.

[0041] It should be noted that the embodiments of this application do not limit the timing of separating the support structure 100 from the supporting structure 22. For example, the supporting structure 22 can be separated from the supporting structure 100 when it begins to rise, or the supporting structure 100 can be separated during the rising process. Therefore, the implementation of this application is not limited to this, and those skilled in the art can adjust the settings according to the actual situation.

[0042] In one embodiment of this application, as Figure 1 and Figure 2 As shown, the support mechanism 2 includes a support platform 21 and a support structure 22. The support platform 21 is fixedly mounted on the base 1 and is used to place the cartridge. The support structure 22 is mounted on the support platform 21 in a height-adjustable manner. The support structure 22 has multiple parallel support grooves 23 for accommodating the edges of multiple composite pieces 100 respectively. A separation tooth 24 is provided at the center of the support groove 23. The separation tooth 24 extends along the extension direction of the support groove 23 and is used to extend between the main piece and the auxiliary piece to create a gap between the main piece and the auxiliary piece.

[0043] like Figure 1 and Figure 2 As shown, the supporting mechanism 2 may include a supporting platform 21 and a supporting structure 22. The supporting platform 21 is stacked on the base 1 and is used to install the supporting structure 22 and the supporting cartridge. The supporting structure 22 is movably mounted on the supporting platform 21, making the structure of this embodiment simple and easy to disassemble and maintain. The top of the supporting structure 22 has multiple parallelly arranged supporting grooves 23. Each supporting groove 23 is used to accommodate the edge of a single composite piece 100, so that the composite piece 100 stands upright on the supporting structure 22. The multiple supporting grooves 23 respectively accommodate the edges of multiple composite pieces 100. A separating tooth 24 is provided at the middle position of the width direction of the supporting groove 23, and the separating tooth 24 extends along the length direction of the supporting groove 23. Since the edges of the main piece and the auxiliary piece are both arc-shaped structures, the separating tooth 24 can extend between the main piece and the auxiliary piece to create a gap between them. In practical applications, the position of the assembled piece 100 is defined by the bearing groove 23. Therefore, when the support structure 22 contacts the assembled piece 100, the separating teeth 24 can enter between the main piece and the secondary piece due to the gravity of the assembled piece 100 itself, creating a gap between them. Furthermore, since the support structure 22 needs to drive the assembled piece 100 to rise, it will exert an upward impact force on the assembled piece 100, allowing the separating teeth 24 to better separate the main piece and the secondary piece, thereby further improving the efficiency of the slicing process. With the above design, due to the limiting effect of the bearing groove 23, the assembled piece stands upright on the support structure 22, thus avoiding slippage between the main piece and the secondary piece due to translation, thereby significantly improving the yield of this embodiment. Furthermore, during the rising process of the support structure 22, the separating teeth 24 can better enter between the main piece and the secondary piece through the upward force and the gravity of the assembled piece 100 itself, which not only increases production capacity but also reduces the failure rate of this embodiment, thereby extending the service life.

[0044] It should be noted that the embodiments of this application do not limit the specific implementation of the separating teeth 24. For example, the separating teeth 24 can adopt a multi-segment design, which can also achieve the above-mentioned technical effects. Therefore, the implementation of this application is not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0045] In one embodiment of this application, as Figures 1 to 4 As shown, both sides of the bearing groove 23 have positioning inclined surfaces 231. The positioning inclined surfaces 231 are located at the bottom of the side walls. The two opposing positioning inclined surfaces 231 are inclined inward from top to bottom to limit the position of the main piece and the auxiliary piece so that the gap size is a preset value.

[0046] like Figures 1 to 4 As shown, the carrier groove 23 can be a strip-shaped groove formed on the surface of the support structure 22. Both side walls of the carrier groove 23 are provided with positioning inclined surfaces 231 extending along the length direction, and these positioning inclined surfaces 231 can be located at the bottom of the side walls, i.e., connected to the bottom surface of the carrier groove 23. Both positioning inclined surfaces 231 can be inclined inwards from top to bottom, i.e., the two positioning inclined surfaces 231 together form an inverted trapezoidal structure. In practical applications, the main wafer and the secondary wafer separate to both sides under the action of the separating teeth 24. At this time, the positioning inclined surfaces 231 located on both sides of the separating teeth 24 limit the main wafer and the secondary wafer, so that the gap between them is a preset value, i.e., to avoid the gap between the main wafer and the secondary wafer being too large, causing mutual interference between multiple wafers 100, and affecting the subsequent separation structure 32 to completely separate the wafers 100. Furthermore, due to the size limitation of the cassette, if the above-mentioned gap is too large, it will also cause mechanical interference with the cassette, thereby causing a decrease in wafer yield. The above design not only improves the security of fragmentation, but also enhances the applicability and scope of the embodiments of this application, thereby further reducing application costs.

[0047] In one embodiment of this application, as Figures 1 to 4As shown, both side walls of the bearing groove 23 have guide slopes 232. The bottom of the guide slopes 232 is connected to the top of the positioning slopes 231. The two opposing guide slopes 232 slope inward from top to bottom to guide the two sides of the assembled piece 100 so that the edge of the assembled piece 100 falls into the bearing groove 23. Specifically, both side walls of the bearing groove 23 are provided with guide slopes 232. The guide slopes 232 are located at the top of the side walls, and the bottom of the guide slopes 232 is connected to the top of the positioning slopes 231. That is, the guide slopes 232 and the positioning slopes 231 together form the side walls of the bearing groove 23. The two opposing guide slopes 232 of the bearing groove 23 slope inward from top to bottom to guide the two sides of the assembled piece 100 so that the edge of the assembled piece 100 can fall into the bearing groove 23. The above design allows the cartridge to have certain tolerances, ensuring that all the multiple pieces 100 within the cartridge can fall into the bearing groove 23, thereby significantly improving the applicability and scope of the embodiments of this application. However, the embodiments of this application are not limited thereto; for example, in some embodiments, the guide ramp 232 may be omitted.

[0048] In one embodiment of this application, as Figures 1 to 4 As shown, the two opposing positioning inclined surfaces 231 of the bearing groove 23 form a first preset angle A1, which is greater than or equal to 15 degrees and less than or equal to 25 degrees, with a preset value of 0.05 mm to 0.1 mm. Specifically, since the edges of the main piece and the auxiliary piece in the composite piece 100 are both arc-shaped, the first preset angle A1 between the two opposing positioning inclined surfaces 231 of the bearing groove 23 is quite important. This first preset angle A1 can be, for example, greater than or equal to 15 degrees and less than or equal to 25 degrees. For example, if the first preset angle A1 is set to 20 degrees, when the composite piece 100 contacts the bearing groove 23, the composite piece 100 will slide laterally under the constraint of the two positioning inclined surfaces 231, thereby allowing the separating tooth 24 to slide into the central groove position of the edge of the composite piece 100. Furthermore, the positioning inclined surface 231 also serves to limit the position of the assembled sheet 100, preventing excessive gaps between the main sheet and the auxiliary sheet. Experiments show that when the preset angle is 20 degrees, the preset gap value can be maintained between 0.05mm and 0.1mm, ensuring that the assembled sheet 100 remains separated but not scattering. This design makes the support structure 22 more stable during the separation of the assembled sheet 100, preventing it from tilting to either side after complete separation, thereby further improving production capacity and yield.

[0049] In one embodiment of this application, as Figures 1 to 4As shown, the two opposing guide ramps 232 of the bearing groove 23 form a second preset angle A2, which is less than 90 degrees and greater than 45 degrees. Specifically, the second preset angle A2 can be any value among 50 degrees, 60 degrees, 70 degrees, 80 degrees, or 89 degrees. In practical applications, during the upward movement of the support structure 22, as long as the edge of the composite piece 100 contacts any one of the guide sides of the bearing groove 23, the composite piece 100 will slide into the bearing groove 23 under the constraint of gravity by the guide ramps 232, thereby further improving the usability of this embodiment and also improving its applicability and scope of application.

[0050] In one embodiment of this application, as Figures 1 to 4 As shown, the cross-section of the separating tooth 24 is a wedge-shaped structure, and there is a preset distance between the top of the separating tooth 24 and the two opposing positioning inclined surfaces 231. The preset distance is less than 1.5 times the thickness of the main sheet or the auxiliary sheet.

[0051] like Figures 1 to 4 As shown, the separating tooth 24, due to its wedge-shaped structure, has a sharp tip, creating a linear contact between the separating tooth 24 and the edge of the mat 100. Furthermore, because the edge of the mat 100 is rounded, the tip of the separating tooth 24 more easily enters the mat 100. In practical applications, under the influence of the upward force of the supporting structure 22 and the weight of the mat 100 itself, the tip of the separating tooth 24 can slowly insert between the main piece and the secondary piece, creating a gap between them. For details, please refer to... Figure 3 As shown. Furthermore, the top of the separating tooth 24 has a preset distance from the positioning inclined surfaces 231 on both sides. That is, the top of the separating tooth 24 has a preset distance in the horizontal direction from the positioning inclined surface 231 on the left, and the top of the separating tooth 24 has a preset distance in the horizontal direction from the positioning inclined surface 231 on the right, and this preset distance is less than 1.5 times the thickness of the main piece or the auxiliary piece. In other words, the two positioning inclined surfaces 231 at the top of the separating tooth 24 have a width in the horizontal direction, which can be less than 1.5 times the overall thickness of the composite piece 100. Using the above design, the alignment accuracy between the separating tooth 24 and the composite piece 100 can be effectively improved, thereby significantly improving the working efficiency of this embodiment and avoiding separation failure of the composite piece 100. Since the preset distance is set according to the thickness of the main piece and the auxiliary piece, this embodiment can be applied to composite pieces of various thicknesses, thereby significantly improving applicability and scope of application.

[0052] It should be noted that the embodiments of this application do not limit the specific structure of the separating teeth 24, as long as the tip of the separating teeth 24 is relatively thin. Therefore, the implementation of this application is not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0053] In one embodiment of this application, as Figures 1 to 2 As shown, the support structure 22 includes two symmetrically arranged support rods 221, spaced apart, with multiple support grooves 23 arranged side-by-side along the axial direction of each support rod 221. The two support rods 221 cooperate to support the laminate 100. Specifically, the support rods 221 can be rectangular rod-shaped structures, and the two support rods 221 are arranged side-by-side and spaced apart along the axial direction to support the laminate 100 on both sides of the bottom edge of the wafer. That is, when the laminate 100 is in an upright state, the two support rods 221 are located on the bottom sides of the laminate 100 to support it. The opposite sides of the two support rods 221 can be formed with concave arc-shaped surfaces, and multiple support grooves 23 arranged side-by-side along the axial direction of the support rods 221 are formed on these arc-shaped surfaces. The support grooves 23 on the two support rods 221 cooperate to support the laminate 100. By adopting the above design, the presence of two support rods 221 not only improves the stability of the supporting assembly 100 but also reduces the contact area between the support structure 22 and the assembly 100, thereby preventing contamination of the surface of the assembly 100. However, this application embodiment is not limited to this. For example, the support structure 22 may be an integral structure, with multiple axially arranged parallel support grooves 23 directly formed on its top surface. Therefore, this application implementation is not limited to this, and those skilled in the art can adjust the configuration according to actual conditions.

[0054] In one embodiment of this application, as Figure 1 , Figure 2 and Figure 5A As shown, the clamping and separating mechanism 3 includes two symmetrically arranged separating components 33. Each of the two separating components 33 is provided with a separating groove 34 that corresponds one-to-one with the bearing groove 23. The separating grooves 34 of the two separating components 33 are arranged opposite to each other to accommodate the two opposite edges of the composite piece 100 to clamp the composite piece 100.

[0055] like Figure 1 and Figure 5AAs shown, the separation structure 32 of the clamping and separating mechanism 3 may include two symmetrically arranged separation components, that is, the clamping and separating mechanism 3 includes two symmetrically arranged separation components 33. The axial direction of the two separation components 33 is parallel to the axial direction of the support structure 22, and both are located above the support structure 22. For example, the two separation components 33 are located above the two bearing rods 221 respectively. The two separation components 33 can adopt the same structure and are symmetrically arranged on the clamping structure 31 to clamp the composite piece 100 from both sides. Since the support structure 22 clamps the composite piece 100 from the bottom and can drive the composite piece 100 to rise, setting the two separation components 33 on both sides of the composite piece 100 facilitates clamping the composite piece 100, thereby avoiding mechanical interference between the separation components 33 and the support structure 22. In other words, the two separation components 33 are located on both sides above the support structure 22 and are symmetrically arranged with respect to the axial direction of the support structure 22. Multiple separation grooves 34 can also be provided on the opposite sides of the two separation components 33. The multiple separation grooves 34 are arranged one-to-one with the multiple bearing grooves 23. That is, the multiple separation grooves 34 are arranged in parallel along the axis of the separation component 33 to accommodate the opposite sides of the composite piece 100, thereby clamping the composite piece 100.

[0056] It should be noted that the embodiments of this application do not limit the specific structure of the separating components 33. For example, the two separating components 33 can support the composite piece 100 in the same way as the supporting structure 22, that is, the two separating components 33 are located on both sides of the bottom of the composite piece 100 when clamping the composite piece 100. Therefore, the implementation of this application is not limited to this, and those skilled in the art can adjust the settings according to the actual situation.

[0057] In one embodiment of this application, as Figure 5A As shown, the separation groove 34 includes a fixed section 341 and a movable section 342. The fixed section 341 is used to accommodate the edge of the main piece, and the movable section 342 is used to accommodate the edge of the secondary piece and drive the secondary piece to move along the first direction so that the main piece and the secondary piece are completely separated; or, the fixed section 341 is used to accommodate the edge of the secondary piece, and the movable section is used to accommodate the edge of the main piece and drive the main piece to move along the first direction so that the main piece and the secondary piece are completely separated.

[0058] like Figures 5A to 6CAs shown, the separation groove 34 may include two fixed sections 341 and one movable section 342, and the separation groove 34 as a whole can extend vertically. The two fixed sections 341 can be located above and below the movable section 342, respectively. It should be noted that the specific number of fixed sections 341 is not limited in this embodiment. For example, the number of fixed sections 341 may be only one, and it may be located at the bottom of the movable section 342. Therefore, this embodiment is not limited thereto. In practical applications, the two fixed sections 341 can be used to accommodate the edge of the main piece, while the movable section 342 is used to accommodate the edge of the secondary piece. At this time, the movable section 342 drives the secondary piece to move along a first direction, which is the axial direction of the separation component 33 and is directed away from the main piece, thereby achieving complete separation of the main piece and the secondary piece. Alternatively, the two fixed segments 341 can be used to accommodate the edges of the secondary sheet, while the movable segment 342 is used to accommodate the edges of the primary sheet. In this case, the movable segment 342 drives the primary sheet to move along a first direction, which is the axial direction of the separation component 33 and is oriented away from the secondary sheet, thereby achieving complete separation of the primary sheet and the secondary sheet. Using the above design, the embodiments of this application employ a relatively simple structure, achieving complete separation of the primary sheet and the secondary sheet. This not only avoids contaminating the surfaces of the primary sheet and the secondary sheet, thus improving process yield, but also significantly improves work efficiency, enabling large-scale mass production, and significantly reduces production costs.

[0059] It should be noted that the embodiments of this application do not limit the specific implementation of the separation groove 34. For example, the bottom of the separation groove 34 may also be provided with separation teeth 24 at a large angle, thereby completing the complete separation of the main piece and the secondary piece. Therefore, the implementation of this application is not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0060] In one embodiment of this application, as Figure 1 and Figure 5A As shown, the separation component 33 includes a fixed block 331, a movable block 332, and a first drive component 333. The fixed block 331 and the movable block 332 are stacked, and the fixed block 331 is provided with a fixed segment 341, and the movable block 332 is provided with a movable segment 342. The first drive component 333 is used to drive the movable block 332 to move relative to the fixed block 331 along a first direction.

[0061] like Figure 1 and Figure 5AAs shown, the separating component 33 may include two fixed blocks 331 and one movable block 332. The two fixed blocks 331 are located above and below the movable block 332, respectively, meaning the fixed blocks 331 and the movable block 332 are stacked. The opposing sides of the two separating components 33 may be provided with concave arcuate structures, meaning the sides of the fixed blocks 331 and the movable block 332 cooperate to form concave arcuate structures for engaging with the edges of the composite sheet 100. Specifically, the fixed block 331 is provided with a fixed segment 341, and the movable block 332 is provided with a movable segment 342, for respectively accommodating the edges of the main sheet and the auxiliary sheet. The first driving component 333 may, for example, be connected to one end of the movable block 332 to drive the movable block 332 to move relative to the fixed block 331 along a first direction. Optionally, the fixing block 331, the movable block 332, and the first driving component 333 can all be mounted on a mounting plate (not shown in the figure), and all three are mounted on the clamping structure 31 via the mounting plate. However, this embodiment is not limited to this; for example, the mounting plate can be integrally formed on the clamping structure 31. With the above design, the two fixing blocks 331 respectively clamp the upper and lower parts of the side edge height direction of the main piece or the auxiliary piece, and the movable block 332 can clamp the middle part of the side edge height direction of the main piece or the auxiliary piece, thereby significantly improving the stability of this embodiment and preventing fragmentation due to clamping failure.

[0062] It should be noted that the embodiments of this application do not limit the specific implementation of the fixed block 331 and the movable block 332. For example, they may only be provided in one fixed block 331, and the movable block 332 may be provided on top of the fixed block 331. Therefore, the implementation of this application is not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0063] In one embodiment of this application, as Figures 5A to 6C As shown, the fixed section 341 includes a first sidewall 3411 and a second sidewall 3412, and the movable section 342 includes a third sidewall 3421 and a fourth sidewall 3422; the extension directions of the second sidewall 3412 and the third sidewall 3421 are aligned, and the first sidewall 3411 and the fourth sidewall 3422 are located on opposite sides of the extension directions of the second sidewall 3412 and the third sidewall 3421, respectively.

[0064] like Figures 5A to 6C As shown, the fixed section 341 includes a first sidewall 3411 and a second sidewall 3412 disposed opposite to each other, and from left to right, the first sidewall 3411 and the second sidewall 3412 are respectively as follows. Figure 6A As shown. The movable segment 342 includes a third sidewall 3421 and a fourth sidewall 3422 arranged opposite to each other, and from left to right, the third sidewall 3421 and the fourth sidewall 3422 are respectively, as detailed below. Figure 6BAs shown. Furthermore, the second sidewall 3412 and the third sidewall 3421 can be aligned along the extension direction of the separation groove 34, that is, the second sidewall 3412 and the third sidewall 3421 extend in the same direction, with the first sidewall 3411 located to the left of the second sidewall 3412 and the fourth sidewall 3422 located to the right of the third sidewall 3421. In other words, the first sidewall 3411 and the fourth sidewall 3422 are located on opposite sides of the extension direction of the second sidewall 3412 and the third sidewall 3421, respectively. This design ensures that the fixed section 341 and the movable section 342 are staggered while maintaining a small gap between them, thus ensuring that the separation groove 34 can cooperate with the initially separated composite piece 100, thereby significantly improving the separation accuracy of the composite piece 100, as well as increasing work efficiency and process yield. Furthermore, the movable segment 342 moves along the first direction to a position between two adjacent separation grooves 34 to achieve complete separation of the main film and the secondary film. For example, the movable segment 342 moves to the right to the middle position of the two adjacent separation grooves 34, thereby avoiding mechanical interference with the right-side separation groove 34. Specifically, as shown... Figure 6C As shown. By adopting the above design, the large spacing between the separation grooves 34 can be avoided, which not only reduces the space occupied, but also ensures that the embodiments of this application can be used with existing components such as cartridges, thereby reducing the application and modification costs and improving the applicability and scope of application of the embodiments of this application.

[0065] In one embodiment of this application, as Figures 5A to 6CAs shown, the bottom surface of the fixed segment 341 protrudes from the surface of the fixed block 331, and the bottom surface of the movable segment 342 protrudes from the surface of the movable block 332. The first sidewall 3411 has a first height relative to the surface of the fixed block 331, and the second sidewall 3412 has a second height relative to the surface of the fixed block 331. The third sidewall 3421 has a second height relative to the surface of the movable block 332, and the fourth sidewall 3422 has a first height relative to the surface of the movable block 332, with the first height being greater than the second height. Specifically, both the first sidewall 3411 and the second sidewall 3412 protrude from the surface of the fixed block 331, and the bottom surface between the first sidewall 3411 and the second sidewall 3412 is higher than the surface of the fixed block 331, so that the bottom surface of the fixed segment 341 protrudes from the surface of the fixed block 331. Both the third sidewall 3421 and the fourth sidewall 3422 protrude from the surface of the movable block 332. The bottom surface between the third sidewall 3421 and the fourth sidewall 3422 is higher than the surface of the movable block 332, so that the bottom surface of the fixed section 341 protrudes from the surface of the movable block 332. With the above design, when the movable section 342 moves the main sheet or the auxiliary sheet, it can avoid the edge of the main sheet or the auxiliary sheet from rubbing against the surface of the fixed block 331 and being damaged, thereby improving the process yield. Furthermore, the first sidewall 3411 and the fourth sidewall 3422 have a first height relative to the surfaces of the fixed block 331 and the movable block 332, respectively, and the second sidewall 3412 and the third sidewall 3421 have a second height relative to the surfaces of the fixed block 331 and the movable block 332, respectively, and the first height is greater than the second height. This design makes it easier for the assembled pieces to be guided into the separation groove 34, and facilitates the second sidewall 3412 and the third sidewall 3421 to extend into the gap of the assembled pieces in the initial separation state, thereby improving the success rate of separation and work efficiency.

[0066] In one embodiment of this application, as Figure 5A and Figure 5B As shown, the first drive assembly 333 includes a first drive unit 3331 and a first lead screw component 3332. The first drive unit 3331 drives the movable block 332 to move via the first lead screw component 3332. Specifically, the first drive unit 3331 may be a servo motor or a stepper motor. The first drive unit 3331 is mounted on a mounting plate and is connected to one end of the first lead screw component 3332 via a coupling 3333. The other end of the first lead screw component 3332 is connected to one end of the movable block 332, thereby significantly improving the accuracy and control precision of the movement of the movable block 332. However, the embodiments of this application are not limited thereto. For example, a threaded hole may be provided in the movable block 332, and the output shaft of the first drive unit 3331 may be matched with the threaded hole of the movable block 332 to achieve the same effect. Therefore, the implementation of this application is not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0067] In one embodiment of this application, as Figure 1 and Figure 7 As shown, the clamping and separating mechanism 3 also includes columns 311, a second drive assembly 312, and a guide assembly 313. The bottom ends of the two columns 311 are slidably mounted on the base 1, and the top ends of the two columns 311 are respectively provided with separating assemblies 33. The second drive assembly 312 is used to drive the two columns 311 to move towards each other or away from each other. The guide assembly 313 is used to guide the two columns 311. Specifically, the clamping structure 31 of the clamping and separating mechanism 3 also includes columns 311, a second drive assembly 312, and a guide assembly 313. Both columns 311 extend vertically, and the bottom ends of both columns 311 are slidably mounted on the base 1 and located on opposite sides of the support platform 21. The two separating assemblies 33 are respectively mounted on the two columns 311. The second drive assembly 312 can drive the two columns 311 to move towards each other, thereby bringing the two separation assemblies 33 closer together to clamp multiple pieces 100 with gaps. Alternatively, the second drive assembly 312 can drive the two columns 311 to move away from each other, thereby moving the two separation assemblies 33 away to release the multiple completely separated pieces 100, allowing the robotic arm to transport the completely separated pieces 100 to another location. The guide assembly 313 can be connected to the two columns 311 to guide them during movement, ensuring that both columns 311 move horizontally, thus ensuring more uniform force on the pieces 100 and preventing fragmentation due to uneven force. This design simplifies the structure of this embodiment, significantly reducing application and maintenance costs. However, this embodiment does not limit the specific implementation of the clamping structure 31, as long as it can drive the two separation assemblies 33 to clamp the pieces 100 with gaps. Therefore, this embodiment is not limited to this.

[0068] In one embodiment of this application, as Figure 1 and Figure 7As shown, the guide component 313 is specifically a linear guide rail. Two guide components 313 are arranged sequentially along the extension direction of the column 311, and the two ends of each guide component 313 are connected to the two columns 311 respectively. The second drive component 312 is located between the two guide components 313. Specifically, the guide component 313 can be, for example, a linear guide rail, but this embodiment is not limited thereto, and those skilled in the art can adjust the setting according to the actual situation. The two guide components 313 can be arranged sequentially from top to bottom, and the two guide components 313 can be arranged sequentially along the extension direction of the column 311, with one guide component 313 located near the top of the column 311 and the other guide component 313 located near the bottom of the column 311. The two ends of each guide component 313 are connected to the two columns 311 respectively, so as to guide the two columns 311 simultaneously when they move towards each other or away from each other, thereby improving the stability of this embodiment. The second drive assembly 312 can be disposed between the two guide assemblies 313, and the second drive assembly 312 can be located at a specific position between the two guide assemblies 313. With the above design, when the second drive assembly 312 drives the two columns 311 to move, the two guide assemblies 313 can prevent the openings at the top of the two columns 311 from being too large or too small, thereby making the force on the laminate 100 more uniform and improving the process yield.

[0069] In one embodiment of this application, as Figure 1 and Figure 7 As shown, the second drive assembly 312 includes a second drive unit 3121 and a second lead screw component 3122. The two second drive units 3121 are respectively connected to the two columns 311 via the two second lead screw components 3122, for simultaneously driving the two columns 311 to move towards each other or away from each other. Specifically, the second drive unit 3121 may be a servo motor or a stepper motor. The two second drive units 3121 are respectively disposed on opposite sides of the two columns 311, and are connected to the columns 311 via the second lead screw components 3122 to simultaneously drive the two columns 311 to move. This design results in higher control precision and smoother movement of the two columns 311, thereby further improving the process yield.

[0070] In one embodiment of this application, as Figure 1As shown, the supporting mechanism 2 also includes temporary storage structures 25. Two temporary storage structures 25 are respectively mounted on the base 1 via a support platform 21, and both are located on one side of the supporting structure 22. The temporary storage structures 25 may have multiple temporary storage slots arranged side-by-side along the axial direction, used to support the main sheet and the secondary sheet after the composite sheet 100 is completely separated. Specifically, the temporary storage structure 25 on the left can be used to temporarily store the main sheet, while the temporary storage structure 25 on the right can be used to support the secondary sheet. However, this embodiment does not limit the specific functions of the two; for example, their functions can be interchanged. By adopting the above design, the separate temporary storage of the main sheet and the secondary sheet facilitates subsequent processing of the main sheet and the secondary sheet, thereby improving the working efficiency of this embodiment.

[0071] Based on the same inventive concept, this application provides a semiconductor process apparatus, including a process chamber, a robot arm, and a separation device as provided in the above embodiments. The robot arm is used to transfer a cassette loaded with wafers between the process chamber and the separation device.

[0072] By applying the embodiments of this application, at least the following beneficial effects can be achieved:

[0073] This embodiment of the application uses a carrier mechanism to carry the cartridge and extend into the cartridge to lift multiple laminated pieces inside. The carrier mechanism also performs initial separation of the laminated pieces to create gaps between the main piece and the secondary piece. A clamping and separating mechanism is then used to clamp the laminated pieces with gaps conveyed by the carrier mechanism and further separate them to completely separate the main piece and the laminated pieces. This design enables automated separation of laminated pieces, suitable for large-scale mass production, significantly improving production capacity and yield while also substantially reducing labor costs.

[0074] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

[0075] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0076] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0077] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0078] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0079] The above description is only a partial embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A separation device for semiconductor process equipment, used to separate a wafer formed by two wafers bonded by epitaxial processes, characterized in that, include: Base, bearing mechanism and clamping and separation mechanism; The supporting mechanism is disposed on the base and is used to place the cartridge containing the composite piece. It can extend into the cartridge to drive the composite piece to rise and create a gap between the main piece and the supporting piece of the composite piece. The bearing mechanism includes a support structure, on which a plurality of parallel bearing grooves are provided for accommodating the edges of the plurality of composite pieces respectively; a separation tooth is provided at the center of the bearing groove, the separation tooth extends along the extension direction of the bearing groove, and is used to extend into the space between the main piece and the auxiliary piece to create a gap between the main piece and the auxiliary piece. Both sides of the bearing groove have positioning inclined surfaces, which are located at the bottom of the side walls. The two opposite positioning inclined surfaces are inclined inward from top to bottom to define the positions of the main piece and the auxiliary piece. The two opposite positioning inclined surfaces of the bearing groove form a first preset angle. The clamping and separating mechanism is located above the bearing mechanism and is used to clamp the assembled pieces with gaps and completely separate the main piece and the auxiliary piece.

2. The separation device as described in claim 1, characterized in that, The supporting mechanism includes a supporting platform, which is fixedly mounted on the base and used to place the cartridge. The supporting structure is vertically and flexibly mounted on the supporting platform.

3. The separation device as described in claim 2, characterized in that, Both sides of the bearing groove have guide slopes. The bottom of the guide slope is connected to the top of the positioning slope. The two opposing guide slopes are inclined inward from top to bottom to guide the two sides of the assembly piece so that the edge of the assembly piece falls into the bearing groove.

4. The separation device as described in claim 2, characterized in that, The first preset included angle is greater than or equal to 15 degrees and less than or equal to 25 degrees. The positioning bevel is used to define the position of the main piece and the auxiliary piece so that the size of the gap is a preset value, which is 0.05mm to 0.1mm.

5. The separation device as described in claim 3, characterized in that, The two opposing guide slopes of the bearing groove form a second preset angle, which is less than 90 degrees and greater than 45 degrees.

6. The separation device as described in claim 2, characterized in that, The cross-section of the separating tooth is wedge-shaped, and there is a preset distance between the top of the separating tooth and the two opposite positioning inclined surfaces. The preset distance is less than 1.5 times the thickness of the main piece or the auxiliary piece.

7. The separation device as described in claim 2, characterized in that, The support structure includes two symmetrically arranged support rods, which are spaced apart, and multiple support grooves are arranged side by side along the axial direction of the support rods. The two support rods cooperate with each other to support the composite piece.

8. The separation device as described in claim 2, characterized in that, The clamping and separating mechanism includes two symmetrically arranged separating components. Each of the two separating components is provided with a separating groove that corresponds one-to-one with the bearing groove. The separating grooves of the two separating components are arranged opposite to each other to accommodate the two opposite edges of the composite piece to clamp the composite piece.

9. The separation device as described in claim 8, characterized in that, The separation groove includes a fixed section and a movable section. The fixed section is used to accommodate the edge of the main piece, and the movable section is used to accommodate the edge of the secondary piece, and to move the secondary piece along a first direction so that the main piece and the secondary piece are completely separated; or, the fixed section is used to accommodate the edge of the secondary piece, and the movable section is used to accommodate the edge of the main piece, and to move the main piece along a first direction so that the main piece and the secondary piece are completely separated.

10. The separation device as described in claim 9, characterized in that, The separation component includes a fixed block, a movable block, and a first driving component. The fixed block and the movable block are stacked on top of each other, and the fixed block is provided with a fixed segment, and the movable block is provided with a movable segment. The first driving component is used to drive the movable block to move relative to the fixed block along the first direction.

11. The separation apparatus as claimed in claim 10, characterized in that, The fixed section includes a first sidewall and a second sidewall, and the movable section includes a third sidewall and a fourth sidewall; the second sidewall and the third sidewall are aligned in their extending directions, and the first sidewall and the fourth sidewall are located on opposite sides of the extending directions of the second sidewall and the third sidewall, respectively.

12. The separation device as claimed in claim 11, characterized in that, The bottom surface of the fixed section protrudes from the surface of the fixed block, and the bottom surface of the movable section protrudes from the surface of the movable block; the first sidewall has a first height relative to the surface of the fixed block, and the second sidewall has a second height relative to the surface of the fixed block; the third sidewall has the second height relative to the surface of the movable block, and the fourth sidewall has the first height relative to the surface of the movable block, wherein the first height is greater than the second height.

13. The separation device as claimed in claim 10, characterized in that, The first drive assembly includes a first drive unit and a first lead screw component, wherein the first drive unit drives the movable block to move through the first lead screw component.

14. The separation device as claimed in claim 8, characterized in that, The clamping and separating mechanism further includes columns, a second drive assembly, and a guide assembly. The bottom ends of the two columns are slidably disposed on the base, and the top ends of the two columns are respectively provided with the separating assembly. The two guide assemblies are arranged sequentially along the extension direction of the columns, and the two ends of the guide assemblies are respectively connected to the two columns. The second drive assembly is located between the two guide assemblies. The second drive assembly includes a second drive part and a second lead screw component. The two second drive parts are respectively connected to the two columns through the two second lead screw components, for simultaneously driving the two columns to move towards each other or backwards.

15. A semiconductor process apparatus, characterized in that, It includes a process chamber, a robotic arm, and a separation device as described in any one of claims 1 to 14, wherein the robotic arm is used to transfer a cassette loaded with the assembled pieces between the process chamber and the separation device.

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