Probe card for testing a wafer

Abstract

A probe card for testing a wafer is disclosed. The probe card includes a substrate and a block including an insulating portion and a conductive portion disposed on the insulating portion. The insulating portion includes a via and a probe to contact an object to be tested. The conductive portion includes a contact electrically connected to the substrate and a conductive pattern to electrically connect the contact to the probe through the via. A spacing between a plurality of such probes is less than a spacing between a plurality of such contacts. The block includes a plurality of unit blocks. The plurality of unit blocks each include the insulating portion and the conductive portion, and at least portions of the insulating portions of the unit blocks are arranged to be spaced apart from each other.

Description

TECHNICAL FIELD

[0001] Embodiments relate to a probe card for testing a wafer. BACKGROUND

[0002] A probe card is a device configured to connect a semiconductor chip in a wafer state before packaging to a test apparatus. The probe card includes a plurality of probes in physical contact with the wafer. The probe card transmits an electrical signal to the wafer through the probes and receives a returned electrical signal.

[0003] As the integration of semiconductor devices is improved and the development of miniaturization thereof is developed, the pitch of contact pads of a wafer is reduced, and the probe card is also correspondingly made smaller and miniaturized. The interval between the probes is formed very small, thereby being suitable for a fine pitch of the wafer.

[0004] Therefore, a block compensating for the interval difference between the contacts of the printed circuit board and the contacts of the probes is required. The block is disposed between the probes and the printed circuit board and includes an insulating portion and a conductive portion. The insulating portion secures a space to compensate for the interval difference between the contacts of the printed circuit board and the contacts of the probes, and the conductive portion is disposed on the insulating portion and forms a path electrically connecting the contacts of the printed circuit board to the contacts of the probes.

[0005] The block generally includes a multi-layer ceramic structure formed by stacking a plurality of ceramic sheets using a build-up method. The conductive portion or the insulating portion is disposed on each layer, and the ceramic sheets are stacked such that the conductive portion and the insulating portion are misaligned and alternately arranged.

[0006] However, the block has problems of a complicated manufacturing process, a long manufacturing time, and a high cost, and a low productivity resulting therefrom. In addition, when the block is partially damaged or has a defective portion, the entire block needs to be replaced, and thus the cost is increased. SUMMARY

[0007] [TECHNICAL PROBLEM]

[0008] An object of the present application is to provide a probe card having a simple manufacturing process and being partially replaceable to reduce a cost.

[0009] Aspects of the present application are not limited to the above-described aspects, and other aspects of the present application, which are not stated herein, will be understood by those skilled in the art from the following description.

[0010] [TECHNICAL SOLUTION]

[0011] According to an aspect of the present application, there is provided a probe card for testing a wafer. The probe card includes a substrate and a block including an insulating portion and a conductive portion disposed on the insulating portion. The insulating portion includes a via and a probe that contacts an object to be tested. The conductive portion includes a contact electrically connected to the substrate and a conductive pattern that passes through the via and electrically connects the contact to the probe. A pitch between a plurality of such probes is smaller than a pitch between a plurality of such contacts. The block includes a plurality of unit blocks. The plurality of unit blocks each include the insulating portion and the conductive portion, and at least portions of the insulating portions of the unit blocks are arranged to be spaced apart from each other.

[0012] In the block, the unit blocks having a bar shape can be arranged at intervals in a first direction.

[0013] The unit blocks can include a main body and a plurality of extension portions that branch from the main body in the first direction, and the probes can be disposed on the main body and the plurality of extension portions.

[0014] The plurality of probes disposed on the main body can be arranged in a second direction different from the first direction, and the plurality of probes disposed on the extension portions can be arranged in the first direction.

[0015] The plurality of unit blocks can have the same shape.

[0016] The unit blocks of the block can include first unit blocks and second unit blocks. A plurality of such first unit blocks can be arranged at intervals in a first direction. A plurality of such second unit blocks can be arranged at intervals in a second direction different from the first direction. Further, the first unit blocks and the second unit blocks can be arranged to cross each other.

[0017] The first unit blocks and the second unit blocks can be disposed such that a crossing region overlaps in a vertical direction.

[0018] The first unit blocks can include first grooves. The second unit blocks can include second grooves. The first unit blocks and the second unit blocks can be disposed to cross match each other such that the first grooves engage with the second grooves.

[0019] The plurality of probes arranged on the first unit blocks can be arranged in the second direction different from the first direction, and the plurality of probes arranged on the second unit blocks can be arranged in the first direction.

[0020] The unit block can include a first surface and a second surface, the probes and some of the conductive patterns being disposed on the first surface, and the second surface being adjacent to the first surface. An end portion of the probe can be provided to be more protruded than the second surface.

[0021] [Advantageous Effects]

[0022] According to an embodiment, the manufacturing process of the block of the probe card is simplified by forming the block as one member rather than a multi-layer structure, thereby greatly improving the productivity of the probe card.

[0023] According to an embodiment, since the block is formed of a plurality of unit blocks so that the block can be partially replaced, cost reduction is possible. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a view of a probe card according to an embodiment;

[0025] Figure 2 is Figure 1 is a bottom view of the probe card shown;

[0026] Figure 3 is Figure 1 is an exploded view of the probe card shown;

[0027] Figure 4 is a view of a unit block on which a probe is disposed;

[0028] Figure 5 is Figure 4 is a front view of the unit block shown;

[0029] Figure 6 is a side view of an interposer and a unit block;

[0030] Figure 7 is a view showing a contact disposed on an interposer;

[0031] Figure 8 is a side sectional view of a probe card;

[0032] Figure 9 is a view of a probe card of another embodiment;

[0033] Figure 10 is Figure 9 is a view of a unit block of the probe card shown;

[0034] Figure 11 is a view of a probe card according to still another embodiment;

[0035] Figure 12 is Figure 11 is a view of a first unit block of the probe card shown;

[0036] Figure 13 is Figure 11 a view of a second unit block of the probe card shown in FIG. 1;

[0037] Figure 14 is a perspective view showing a state in which the first unit block and the second unit block are cross-matched with each other; and

[0038] Figure 15 is a side cross-sectional view of the unit block taken along a line A-A of FIG. 2. Figure 14 DETAILED DESCRIPTION

[0039] Hereinafter, exemplary embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0040] However, the present application is not limited to the embodiments disclosed below and can be implemented in various forms. One or more components of the embodiments can be selectively combined with each other or replaced with each other without departing from the scope of the technical idea of the present application.

[0041] Further, unless otherwise defined, terms (including technical and scientific terms) used herein are to be interpreted as being commonly understood by those skilled in the art. Further, terms that are commonly used are to be interpreted in the context of the related art.

[0042] Further, the terms used herein are intended to explain embodiments and not to limit the present application.

[0043] In the present specification, the singular form includes the plural form unless specifically stated otherwise. When stating at least one of (or one or more of) A, B, and C, one or more of all combinations of A, B, and C formed by A, B, and C can be included.

[0044] Further, in describing components of the embodiments of the present application, terms such as first, second, A, B, (a), (b), etc. can be used.

[0045] These terms are used only to distinguish one element from another element, and the nature, order, sequence, etc. of the corresponding elements are not limited by these terms.

[0046] Further, when stating that one element is "connected" or "coupled" to another element, the element can not only be directly connected or coupled to the other element, but also be connected or coupled to the other element through another intervening element.

[0047] ​Further, when it is stated that one element is formed or disposed "above (on) or below (under)" another element, the two elements can not only be in direct contact with each other, but another element can also be formed or disposed between the two elements. Further, "above (on) or below (under)" can include not only a direction upward based on one element but also a direction downward.

[0048] Figure 1 is a view of a probe card according to an embodiment, Figure 2 is Figure 1 is a bottom view of the probe card shown in FIG. 1, Figure 3 is Figure 1 is an exploded view of the probe card shown in FIG. 1.

[0049] Hereinafter, in all the drawings, the X-axis represents the left-right direction of the probe card and is equal to the first direction, the Y-axis represents the front-rear direction of the probe card and is equal to the second direction, and the Z-axis represents the vertical direction of the probe card.

[0050] The probe card according to the embodiment can include a substrate 100, a block 200, and an interposer 300, and a reinforcing portion 400. In order from top to bottom, the block 200, the interposer 300, the substrate 100, and the reinforcing portion 400 can be sequentially stacked and arranged.

[0051] The probe card according to the embodiment includes the block 200 for compensating for a difference between the pitch of the contacts of the substrate 100 and the fine pitch of the contacts of the probe, the block 200 serving as one member, thereby having a feature of greatly simplifying the manufacturing process of the block 200. In addition, since the block 200 includes a plurality of unit blocks 200 to greatly reduce materials and a plurality of such unit blocks 201 are detachably arranged on the interposer 300, a test corresponding to various contact pitches of an object to be tested can be performed.

[0052] Detailed components of the probe card will be described below.

[0053] First, the interposer 300 can be disposed on one side of the substrate 100 based on the vertical direction z. Further, the reinforcing portion 400 can be disposed on the other side of the substrate 100 based on the vertical direction z.

[0054] The interposer 300 is disposed between the block 200 and the substrate 100 based on the vertical direction z, electrically connects the block 200 to the substrate 100, and secures a space between the block 200 and the substrate 100.

[0055] The block 200 is stacked in the vertical direction z and disposed at one side of the interposer 300. Since the interval between the probes 212 is much smaller than the interval between the contacts of the substrate 100, it is necessary to electrically connect them while compensating for the interval therebetween. The block 200 performs a function of electrically connecting the probes 212 to the substrate 100 while compensating for the interval between the probes 212 and the interval between the contacts of the substrate 100.

[0056] The block 200 can include a plurality of unit blocks 201. The plurality of unit blocks 201 can be arranged at uniform intervals.

[0057] Figure 4 is a view showing the unit block 201 on which the probes 212 are arranged, Figure 5 is Figure 4 a front view of the unit block 201.

[0058] Referring to Figure 4 and Figure 5 , the unit block 201 includes an insulating portion 210 and a conductive portion 220 (see Figure 8 ). The insulating portion 210 can be a bar-shaped member having a hexahedral shape. The insulating portion 210 is manufactured by firing ceramics and formed as a single member rather than a stack of a plurality of members. Therefore, the process of manufacturing the block 200 is simpler and less expensive than a process of manufacturing a block by stacking a plurality of members.

[0059] The conductive portion 220 is disposed on the insulating portion 210 and electrically connects the probes 212 to the interposer 300.

[0060] The probes 212 are arranged on one surface of the conductive portion 220 in the vertical direction z.

[0061] One end of the probe 212 contacts a pad of an object to be measured. A plurality of probes 212 can be arranged to be aligned at a fine pitch. In consideration of the insulating portion 210 being formed in an elongated shape in a second direction y perpendicular to the first direction x, the plurality of probes 212 are arranged in groups at a fine pitch along the second direction y, and such groups can be arranged at intervals along the second direction y.

[0062] For example, the conductive portion 220 includes a first surface 201a, a second surface 201b adjacent to the first surface 201a, and a third surface 201c adjacent to the second surface 201b, and the probes 212 can be arranged on the first surface 201a. One group of probes 212 is arranged at one side of the first surface 201a, and another group of probes 212 can be arranged at the other side of the first surface 201a. The end portions of the probes 212 can be disposed to protrude more than the second surface 201b therefrom. The third surface 201c can be disposed to face the first surface 201a and be a surface in contact with the interposer 300.

[0063] Figure 6 is a side view showing the interposer 300 and the unit block 201.

[0064] Referring to Figure 6 , the unit blocks 201 are stacked on one surface of the interposer 300. Also, the unit blocks 201 can be arranged at the same interval w in the first direction x. Based on the first direction x, the ends of the probes 212 can be located between the unit blocks 201.

[0065] Figure 7 is a view showing the contacts 301 arranged on the interposer 300, and Figure 8 is a side cross-sectional view of the probe card.

[0066] Referring to Figure 7 and Figure 8 , a plurality of such contacts 301 are arranged on the interposer 300. The contacts 301 are connected to the conductive patterns 320 arranged on the interposer 300. The pitch between the contacts 301 corresponds to the pitch P2 between the contacts 101 of the substrate 100. The interposer 300 can include a plurality of fastening holes 310. The fastening holes 310 are configured to allow the interposer 300 to be detachably coupled with the block 200.

[0067] Referring to Figure 8 , the insulating part 210 can include a through-hole 211. The through-hole 211 is provided to pass through one surface and the other surface of the insulating part 210 based on the vertical direction z. The through-hole 211 can have a shape including a hole inside which is filled with or surrounded by the conductive pattern 222.

[0068] The conductive part 220 can include contacts 221. The contacts 221 are electrically connected to the substrate 100. When the interposer 300 is disposed, the contacts 221 are electrically connected to the conductive patterns 320 of the interposer 300. Corresponding contacts 221 can be provided on the other surface of the conductive part 220 that contacts the interposer 300. The pitch between the contacts 221 of the conductive part 220 corresponds to the pitch P2 between the contacts 101 of the substrate 100.

[0069] The conductive part 220 is electrically connected to the probes 212. The conductive pattern 222 of the block 200 can pass through the through-hole 211 and connect the probes 212 to the contacts 221 to electrically connect the probes 212 and the substrate 100 and compensate for the pitch P1 between the probes 212 and the pitch P2 between the contacts 101 of the substrate 100.

[0070] The number and position of the unit blocks 201 arranged on the interposer 300 can vary according to the positions of the pads of the object to be measured in contact with the probes 212. Although the unit blocks 201 are shown to include the same shape and size in the drawings, the present application is not limited thereto, and unit blocks including different sizes and shapes can be combined and arranged on the interposer 300 according to the object to be measured. Thus, the block 200 has an advantage of testing various pitches corresponding to the contacts 221 of the object to be measured.

[0071] Figure 9 is a view of a probe card according to another embodiment, and Figure 10 is Figure 9 a view of a unit block 201 of the probe card shown in

[0072] Referring to Figure 9 and Figure 10 , as a probe card according to another embodiment, the unit block 201 can include a main body 201a and a plurality of extension portions 201b. The main body 201a can be a bar-shaped member having a hexahedral shape. The main body 201a can be formed in an elongated type in a longitudinal direction and can be disposed such that the longitudinal direction becomes the second direction y.

[0073] The plurality of extension portions 201b are disposed bifurcated from the main body 201a. Each of the extension portions 201b can be disposed perpendicular to the main body 201a. Each of the extension portions 201b can be arranged in the second direction y. The probes 212 can be arranged on the main body 201a and the extension portions 201b.

[0074] The plurality of probes 212 arranged on the main body 201a are arranged in the second direction y, and the plurality of probes 212 arranged on the extension portions 201b can be arranged in the first direction x.

[0075] Since the probes 212 are arranged on the extension portions 201b in addition to the main body 201a, the probes 212 can be arranged in more various positions to test various pitches corresponding to the contacts 221 of the object to be measured.

[0076] Meanwhile, a fastening hole 201c can be disposed within the extension portion 203b.

[0077] Figure 11 is a view of a probe card according to yet another embodiment, Figure 12 is Figure 11 a view of a first unit block 201A of the probe card shown in Figure 13 is Figure 11 a view of a second unit block 201B of the probe card shown in

[0078] Referring to Figures 11 to 13A probe card according to still another embodiment can include a first unit block 201A and a second unit block 201B as unit blocks 201. Among them, like the first unit block 201A, the second unit block 201B includes an insulating portion 210 and a conductive portion 220, which are the same components as those of the first unit block 201A and can have different positions and shapes therefrom.

[0079] The first unit block 201A and the second unit block 201B can be bar-shaped members having a hexahedral shape.

[0080] The first unit block 201A can be formed in an elongated type in a longitudinal direction and can be disposed such that the longitudinal direction is the second direction y. A plurality of such first unit blocks 201A can be arranged at intervals in the first direction x.

[0081] The second unit block 201B can be formed in an elongated type in a longitudinal direction and can be disposed such that the longitudinal direction is the first direction x. A plurality of such first unit blocks 201B can be arranged at intervals in the first direction x.

[0082] Figure 14 is a perspective view showing a state in which the first unit block and the second unit block are cross-matched with each other, and Figure 15 is a side sectional view of a unit block taken along the A-A line of Figure 14 .

[0083] Referring to Figures 11 to 15 , the first unit block 201A and the second unit block 201B can be disposed to cross each other. In detail, the first unit block 201A and the second unit block 201B can be disposed such that a cross region overlaps in a vertical direction z.

[0084] The first unit block 201A can include a plurality of first grooves H1. The plurality of first grooves H1 can be recessively disposed on one surface of the first unit block 201A facing the second unit block 201B.

[0085] The second unit block 201B can include a plurality of second grooves H2. The plurality of second grooves H2 can be recessively disposed on one surface of the second unit block 201B facing the first unit block 201A. The first unit block 201A and the second unit block 201B can be arranged to cross-match each other. The first unit block 201A and the second unit block 201B can be arranged to have a lattice shape as a whole.

[0086] The first unit block 201A and the second unit block 201B can be arranged to cross-match each other to allow one surface of the first unit block 201A and one surface of the second unit block 201B to be located on the same level based on the vertical direction z. In addition, the other surface of the first unit block 201A and the other surface of the second unit block 201B can be arranged to be located on the same level based on the vertical direction z.

[0087] As described above, the probe card according to the exemplary embodiment of the present application has been described in detail.

[0088] It should be noted that the above-mentioned embodiments of the present application are only examples in all aspects and are not intended to limit the present application, and the protection scope of the present application shall be subject to the claims rather than the above detailed description. And it should be understood that all variable or modifiable forms derived from the meaning and scope of the claims and their equivalents are included in the scope of the present application.

Claims

1. A probe card for testing wafers, the probe card comprising: substrate; and The block includes an insulating portion and a conductive portion disposed on the insulating portion. The insulating part includes a through hole and a probe that contacts the object under test. The conductive portion includes contacts electrically connected to the substrate and a conductive pattern passing through the via and electrically connecting the contacts to the probe. The spacing between multiple such probes is smaller than the spacing between multiple such contacts. The block comprises multiple unit blocks, and Each of the plurality of unit blocks includes the insulating portion and the conductive portion, and at least a portion of the insulating portions of the unit blocks are arranged to be spaced apart from each other. In the block, the strip-shaped unit blocks are arranged at certain intervals in a first direction. The unit block includes a main body and a plurality of extensions branching from the main body in the first direction, and The probe is disposed on the body and the plurality of extensions.

2. The probe card of claim 1, wherein the plurality of probes disposed on the body are arranged in a second direction, the second direction being different from the first direction, and The plurality of probes arranged on the extension are positioned in the first direction.

3. A probe card for testing wafers, the probe card comprising: substrate; and The block includes an insulating portion and a conductive portion disposed on the insulating portion. The insulating part includes a through hole and a probe that contacts the object under test. The conductive portion includes contacts electrically connected to the substrate and a conductive pattern passing through the via and electrically connecting the contacts to the probe. The spacing between multiple such probes is smaller than the spacing between multiple such contacts. The block comprises multiple unit blocks, and Each of the plurality of unit blocks includes the insulating portion and the conductive portion, and at least a portion of the insulating portions of the unit blocks are arranged to be spaced apart from each other. The unit blocks of the block include a first unit block and a second unit block. Multiple such first unit blocks are arranged at certain intervals in the first direction. Multiple such second unit blocks are arranged at certain intervals in a second direction, which is different from the first direction, and The first unit block and the second unit block are arranged to intersect each other.

4. The probe card of claim 3, wherein the first unit block and the second unit block are arranged such that the intersecting regions overlap each other in the vertical direction.

5. The probe card according to claim 3, wherein the first unit block includes a first groove. The second unit block includes a second groove, and The first unit block and the second unit block are arranged to interlock and match each other, such that the first groove engages with the second groove.

6. The probe card of claim 3, wherein the plurality of probes arranged on the first unit block are arranged in a second direction, the second direction being different from the first direction, and The plurality of probes arranged on the second unit block are arranged in the first direction.

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