Optical image stabilization device, electronic device

Abstract

The present invention provides an optical image stabilization device and an electronic device. The optical image stabilization device includes an image sensor chip, a resilient member, and a first flexible circuit unit electrically connected to the image sensor chip. The image sensor chip moves in the X and Y directions and rotates in a plane under the action of an external force to perform motion compensation for optical image stabilization, and returns to its initial position under the action of the resilient member. The optical image stabilization device using a moving image sensor chip for motion compensation provided by the present invention can better adapt to the increasing trend of thinning of digital products with camera modules.

Description

Technical Field

[0001] The present invention relates to the field of image imaging technology, and in particular, to an optical image stabilization device and an electronic device that use a mobile image sensor chip for optical image stabilization. Background Art

[0002] When a handheld portable intelligent device takes pictures or videos, the interference of physiological tremors of the human body and external vibrations on the handheld portable intelligent device is inevitable. The physiological tremors of the human body cannot be overcome through training, and the external vibrations change with the environment, making it inevitable that the handheld portable intelligent device will be affected by the above factors and generate unwanted jitters during taking pictures or videos, resulting in a decline in image quality. The most obvious manifestation is that the images obtained by taking pictures or videos are blurred and unclear.

[0003] Existing handheld portable intelligent devices use a lens assembly that can move in the XY axis directions in the camera module to compensate for physiological tremors of the human body and external vibrations, so as to obtain high-quality images. However, with the progress of technology and the continuous improvement of consumers' pursuit of images, the camera modules of existing handheld portable intelligent devices have increased in size and weight due to the increase in the image sensor, and the lens has increased proportionally. The traditional method of compensating for movement in the XY axis directions of the lens has become increasingly difficult to push the heavy lens. Moreover, the compensable angle of the method of compensating for movement in the XY axis directions of the lens can no longer meet the customer's requirements for image quality.

[0004] In the prior art, the optical image stabilization method provided by the movement of the image sensor chip has a complex structure and is mostly applied to single-lens reflex digital cameras, and there are few cases of mass production in handheld portable intelligent devices. Summary of the Invention

[0005] To solve the above technical problems, an object of the present invention is to provide an optical image stabilization device that uses a mobile image sensor chip for motion compensation, including:

[0006] An image sensor chip, a resilient member, and a first flexible circuit unit electrically connected to the image sensor chip;

[0007] The image sensor chip moves and rotates in the plane in the X and Y directions under the action of an external force to perform motion compensation for optical image stabilization, and returns to the initial position under the action of the resilient member.

[0008] Preferably, the image sensor chip is adapted to move and rotate in the plane in the X and Y directions under the action of a first driving unit.

[0009] Preferably, the first driving unit includes a shape memory alloy wire, and the shape memory alloy wire is adapted to receive a control signal from the optical image stabilization control unit to deform according to the control signal when the control signal changes, so that the image sensor chip generates displacements in the X and Y directions or planar rotation.

[0010] Preferably, the optical image stabilization device further includes:

[0011] A lower substrate located below the image sensor chip;

[0012] One end of the first driving unit is electrically connected to the lower substrate, and the other end acts on the image sensor chip.

[0013] Preferably, the first driving unit includes a shape memory alloy wire, one end of which is electrically connected to the optical image stabilization control unit through the lower substrate, and the other end acts on the image sensor chip.

[0014] Preferably, the optical image stabilization device further includes:

[0015] One end of the resilient member is connected to the lower substrate, and the other end acts on the image sensor chip.

[0016] Preferably, the resilient member includes:

[0017] A flexure portion;

[0018] The flexure portion is provided with at least one elastic cantilever, and the image sensor chip is adapted to return to its initial position under the action of the elastic cantilever.

[0019] Preferably, the resilient member further includes:

[0020] An inner frame;

[0021] The inner frame is fixedly connected to the image sensor chip, and the periphery of the inner frame is adapted to lead out the flexure portion.

[0022] Preferably, a carrier board is further provided, the image sensor chip is fixedly arranged with the carrier board, the carrier board includes a logic circuit unit, the logic circuit unit merges the circuits of the pins of the image sensor chip and is electrically connected to the first flexible circuit unit.

[0023] Preferably, the acting end of the first driving unit and the image sensor chip are fixed at a corner of the carrier board.

[0024] Preferably, one end of the resilient member is fixedly connected to the bottom surface of the carrier board.

[0025] Preferably, the carrier board is located above the lower substrate.

[0026] Preferably, a capacitor is disposed on the carrier board, and the capacitors are arranged in a strip shape and surround the side of the image sensor.

[0027] Preferably, an opening or a groove is provided at a position corresponding to the orthographic projection of the image sensor chip on the lower substrate, and the image sensor chip is adapted to move or rotate in the X and Y directions in the opening or the groove.

[0028] Preferably, an opening or a groove is provided at a position corresponding to the orthographic projection of the image sensor chip on the carrier board.

[0029] Preferably, the first driving unit includes a shape memory alloy wire. One end of the shape memory alloy wire is disposed on the lower substrate and is electrically connected to the optical image stabilization control unit through the lower substrate, and the other end acts on a corner of the carrier board.

[0030] Preferably, there are at least two shape memory alloy wires, which are respectively disposed on the sides of the carrier board in the X and Y directions.

[0031] Preferably, a support member is further disposed on the lower substrate. The support member is adapted to leave a gap with a predetermined height between the lower substrate and the image sensor chip, and the support member is adapted to roll or slide as the image sensor chip moves.

[0032] Preferably, the lower substrate includes a printed circuit board (PCB) and a reinforcing plate attached to the bottom surface of the printed circuit board (PCB). An opening is provided at a position corresponding to the orthographic projection of the image sensor chip on the printed circuit board (PCB), and a groove is provided at a position corresponding to the orthographic projection of the support member on the reinforcing plate. The support member is disposed in the groove.

[0033] Preferably, the support member is a metal ball or a ceramic ball.

[0034] Preferably, an opening or a groove is provided on the lower substrate, and the opening or the groove is adapted to dispose the support member.

[0035] Preferably, there are at least three support members, which respectively correspond to at least three sides of the image sensor chip. Their rolling or sliding directions are in the X and Y directions, so as to reduce the moving friction of the image sensor chip in the X and Y directions and provide flatness guarantee for the image sensor.

[0036] Preferably, a carrier board is further provided. The image sensor chip is fixedly arranged with the carrier board. The carrier board includes a logic circuit unit which combines the circuits of the pins of the image sensor chip and is electrically connected to the first flexible circuit unit. The support is arranged between the carrier board and the lower substrate.

[0037] Preferably, the predetermined height is greater than or equal to 50 microns.

[0038] Preferably, at least one side of the lower substrate is provided with a second flexible circuit unit.

[0039] Preferably, the second flexible circuit unit is arranged opposite to and electrically connected to the first flexible circuit unit.

[0040] Preferably, a filter assembly is further included. The filter assembly includes a filter located above the image sensor chip.

[0041] Preferably, a filter assembly is further included. The filter is arranged in the carrier board and located above the image sensor chip.

[0042] Preferably, a second driving unit is further included. The second driving unit is adapted to drive the lens unit to move in the Z direction.

[0043] Preferably, the second driving unit is a shape memory alloy driving unit, an electromagnetic driving unit or a piezoelectric ceramic driving unit.

[0044] Preferably, a base is further included. The base includes a receiving space and a side wall. The graphic sensor chip is located at the center of the lower part of the receiving space. The receiving space is adapted to receive the second driving unit and the lens unit therein.

[0045] Preferably, the first flexible circuit unit is arranged outside the side wall.

[0046] Preferably, the first flexible circuit unit includes at least one bending part to surround the side wall.

[0047] Preferably, a housing is further included. The housing partially covers the outside of the part of the first flexible circuit unit surrounding the side wall.

[0048] Preferably, a base is further included. The base includes a receiving space and a side wall. The receiving space is adapted to receive the second driving unit and the lens unit therein. The bottom of the base is fixedly arranged on the lower substrate. At least one side of the lower substrate is provided with a second flexible circuit unit. The second driving unit is adapted to achieve electrical connection through the second flexible circuit unit.

[0049] Preferably, the position of the image sensor chip is feedback and controlled in real time by the change in the resistance value of the shape memory alloy wire.

[0050] Preferably, one end of the first driving unit is powered by the lower substrate, and the other end is connected to the ground terminal of the carrier board; or one end of the first driving unit is powered by the carrier board, and the other end is connected to the ground terminal of the lower substrate.

[0051] The technical solution of the present invention also provides an electronic device, including the optical image stabilization device using a mobile image sensor for motion compensation as described above.

[0052] Compared with the prior art, the optical image stabilization device and the electronic device using a mobile image sensor chip for motion compensation of the present invention have the following beneficial effects:

[0053] For the optical image stabilization device provided by the present invention, compared with the existing design, in this patent, the first driving unit is used to drive the image sensor chip to generate displacements in the X and Y directions or planar rotations of the image sensor chip. The first driving unit may include a structure of a shape memory alloy wire with a relatively small volume, so that the formed driving component has a simple structure and is easy to operate, and can further reduce the volume of the optical image stabilization device.

[0054] Furthermore, the optical image stabilization device provided by the present invention is provided with a resilient member to enable the image sensor chip to return to its initial position. The resilient member has a thin, light and simple structure and is easy to operate, and can further reduce the volume of the optical image stabilization device.

[0055] Furthermore, in the optical image stabilization device provided by the present invention, the image sensor chip may be fixedly arranged on the carrier board. The carrier board includes a logic circuit unit, and the logic circuit unit merges the circuits of the pins of the image sensor chip, which can further reduce the volume of the optical image stabilization device.

[0056] Furthermore, the carrier board is provided with an opening, and the image sensor chip can be embedded in the carrier board, which can reduce the overall thickness of the optical image stabilization device provided by the present invention, that is, reduce the distance between the photosensitive surface of the image sensor chip and the lowest surface of the optical image stabilization device, and can further reduce the volume and thickness of the optical image stabilization device, and can better adapt to the trend of increasing thinness of digital products with camera modules.

[0057] Further, in the optical image stabilization device provided by the present invention, openings or grooves are also provided in the lower substrate, and the image sensor chip and / or the carrier board can be further close to the lowest surface of the lower substrate, that is, the distance between the photosensitive surface of the image sensor chip and the lowest surface of the optical image stabilization device is further reduced, which can better adapt to the trend of the increasing thinness and lightness of digital products with camera modules.

[0058] Further, in the optical image stabilization device provided by the present invention, the power supply of the carrier board adopts a first flexible circuit unit, and the first flexible circuit unit can be partially bent and arranged between the side wall of the base of the optical image stabilization device and the housing, which can further reduce the volume of the optical image stabilization device.

[0059] Further, in the optical image stabilization device provided by the present invention, the power supply of the lower substrate adopts a second flexible circuit unit, and the first flexible circuit unit and the second flexible circuit are oppositely arranged and connected to each other, so that the structure of the optical image stabilization device is simple and light.

[0060] Further, in the optical image stabilization device provided by the present invention, the lens unit can also be driven by a second driving unit to move in the Z direction, further realizing a more precise OIS image stabilization effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figures 1 to 5 It is a schematic structural diagram of the optical image stabilization device provided by the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0062] Many specific details are set forth in the following description in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0063] Secondly, the present invention is described in detail with reference to the schematic diagrams. When describing the embodiments of the present invention in detail, for the sake of convenience of explanation, the schematic diagrams are only examples and should not limit the scope of protection of the present invention herein.

[0064] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the integrated capacitive grating sensor of the present invention will be described in detail below with reference to the accompanying drawings.

[0065] Reference Figure 1 As shown, in an embodiment of the present invention, an optical image stabilization device using a mobile image sensor chip for motion compensation is provided, including:

[0066] An image sensor chip 100, a resilient member 410, and a first flexible circuit unit 120 electrically connected to the image sensor chip;

[0067] The image sensor chip 100 moves and rotates in the X and Y directions and rotates in a plane under an external force to perform motion compensation for optical image stabilization, and returns to its initial position under the action of the resilient member 410.

[0068] In this embodiment, the image sensor chip 100 is adapted to move and rotate in the X and Y directions and rotate in a plane under the action of a first driving unit 420.

[0069] In this embodiment, the first driving unit 420 includes a shape memory alloy wire, and the shape memory alloy wire is adapted to receive a control signal from an optical image stabilization control unit (not shown), and deforms according to the control signal when the control signal changes, causing the image sensor chip 100 to generate displacements in the X and Y directions or rotate in a plane.

[0070] In this embodiment, the optical image stabilization device further includes: a lower substrate 500 and / or a carrier plate 110.

[0071] Combined Figure 1 with Figure 2 as shown, the lower substrate 500 is located below the image sensor chip 100; a first driving unit 420 is further provided between the lower substrate 500 and the image sensor chip 100. Preferably, the optical image stabilization device further includes a resilient member 410.

[0072] Specifically, one end of the first driving unit 420 is electrically connected to the lower substrate 500, and the other end acts on the image sensor chip 100.

[0073] In this embodiment, the first driving unit 420 includes a shape memory alloy wire, one end of which is electrically connected to an optical image stabilization control unit (not shown) through the lower substrate 500, and the other end acts on the image sensor chip 100.

[0074] Specifically, one end of the resilient member 410 is connected to the lower substrate 500, and the other end acts on the image sensor chip 100.

[0075] Combined Figure 1 with Figure 3As shown, in this embodiment, the resilient member 410 includes: a flexure portion 415; at least one elastic cantilever is provided on the flexure portion 415, and the elastic cantilever is fixedly connected to the image sensor chip 100. The image sensor chip 100 leaves the initial position under the driving or pulling action of the first driving unit 420, and is adapted to return to the initial position under the action of the elastic cantilever after the first driving unit 420 stops working.

[0076] Specifically, in this embodiment, the resilient member 410 further includes: an inner frame 414; the inner frame 414 is fixedly connected to the side of the image sensor chip 100, and the periphery of the inner frame 414 is adapted to lead out the flexure portion 415.

[0077] In one implementation, the image sensor chip 100 is fixedly arranged with the carrier board 110. The carrier board 110 includes a logic circuit unit, and the logic circuit unit merges the circuits of the pins of the image sensor chip 100 and is electrically connected to the first flexible circuit unit 120.

[0078] One end of the first driving unit 420 acting on the image sensor chip 100 is fixed to the bottom surface of the carrier board 110. One end of the flexure portion 415 of the resilient member 410 is fixedly connected to the bottom surface of the carrier board 110.

[0079] In one implementation, the first driving unit includes a shape memory alloy wire. One end of the shape memory alloy wire is arranged on the lower substrate 500 and is electrically connected to the optical image stabilization control unit through the lower substrate 500, and the other end acts on a corner of the carrier board 100.

[0080] In one implementation, there are at least two shape memory alloy wires 420, which are respectively arranged on the sides of the carrier board 110 in the X and Y directions.

[0081] In one implementation, the carrier board 110 is located above the lower substrate 500.

[0082] In one implementation, capacitors are arranged on the carrier board 110. The capacitors are arranged in a strip shape and surround the side of the image sensor.

[0083] Further, in one implementation, an opening is provided at the position corresponding to the orthographic projection of the lower substrate 500 on the carrier board 110. The image sensor chip 100 is adapted to be fixedly arranged on the carrier board 110, and the carrier board 110 realizes movement or rotation in the X and Y directions in the opening.

[0084] Further, in one embodiment, an opening or a groove is provided at a position corresponding to the orthographic projection of the carrier board 110 on the image sensor chip 100. The image sensor chip 100 is adapted to be embedded in the opening.

[0085] Further, in one embodiment, an opening is provided at a position corresponding to the orthographic projection of the lower substrate 500 on the carrier board 110, and an opening or a groove is provided at a position corresponding to the orthographic projection of the carrier board 110 on the image sensor chip 100. The image sensor chip 100 is adapted to be embedded in the opening of the carrier board 110 and fixedly connected to the carrier board 110, and the carrier board 110 is adapted to move or rotate in the X and Y directions in the opening of the lower substrate 500.

[0086] In this embodiment, a support member 44 is further provided on the lower substrate 500. The support member 44 is adapted to leave a gap with a predetermined height between the lower substrate 500 and the image sensor chip 100, and the support member 44 is adapted to roll or slide as the image sensor chip 100 moves.

[0087] In one embodiment, the lower substrate 500 includes a printed circuit board (PCB) and a reinforcing plate attached to the bottom surface of the printed circuit board (PCB). An opening is provided at a position corresponding to the orthographic projection of the printed circuit board (PCB) on the image sensor chip, and a groove 54 is provided at a position corresponding to the orthographic projection of the support member on the reinforcing plate. The support member is disposed in the groove 54.

[0088] In this embodiment, the support member 44 is a metal ball or a ceramic ball.

[0089] In this embodiment, an opening or a groove 54 is provided on the lower substrate 500, and the opening or the groove 54 is adapted to be provided with the support member 44.

[0090] In this embodiment, there are at least three support members 44, which respectively correspond to at least three sides of the image sensor chip 100, and their rolling or sliding directions are the X and Y directions, so as to reduce the moving friction of the image sensor chip 100 in the X and Y directions and provide flatness guarantee for the image sensor chip 100.

[0091] In this embodiment, the predetermined height is greater than or equal to 50 microns.

[0092] In this embodiment, a second flexible circuit unit 520 is provided on at least one side of the lower substrate 500.

[0093] Reference Figure 4As shown, in this embodiment, the second flexible circuit unit 520 is disposed opposite to and electrically connected to the first flexible circuit unit 120.

[0094] Reference Figure 5 As shown, in this embodiment, the optical image stabilization device further includes a filter assembly, and the filter assembly includes a filter 170 located above the image sensor chip 100.

[0095] In one implementation, the filter 170 is disposed in the carrier plate 110 and is located above the image sensor chip 100.

[0096] In one implementation, the optical image stabilization device further includes a second driving unit (not shown), and the second driving unit is adapted to drive the lens unit 210 to move in the Z direction.

[0097] Furthermore, the second driving unit is a shape memory alloy driving unit, an electromagnetic driving unit or a piezoelectric ceramic driving unit.

[0098] Continue to refer Figure 1 As shown, the optical image stabilization device further includes a base 300. The base 300 includes an accommodation space and a side wall. The graphic sensor chip 100 is located at the center of the lower part of the accommodation space, and the accommodation space is adapted to accommodate the second driving unit and the lens unit therein.

[0099] In this embodiment, the first flexible circuit unit 120 is disposed outside the side wall. Specifically, the first flexible circuit unit 120 includes at least one bent portion to surround the side wall.

[0100] In this embodiment, the optical image stabilization device further includes a housing 600, and the housing 600 partially covers the outside of the portion of the first flexible circuit unit 120 surrounding the side wall.

[0101] In this embodiment, the bottom of the base 300 is fixedly disposed on the lower substrate 500, and the second flexible circuit unit 120 is disposed on at least one side of the lower substrate 500. The second driving unit is adapted to achieve electrical connection through the second flexible circuit unit 120.

[0102] In this embodiment, the position of the image sensor chip 100 is feedback and controlled in real time through the change of the resistance value of the shape memory alloy wire.

[0103] In this embodiment, one end of the first driving unit 420 is powered by the lower substrate 500, and the other end is connected to the ground terminal of the carrier plate 110; or one end of the first driving unit 420 is powered by the carrier plate 110, and the other end is connected to the ground terminal of the lower substrate 500.

[0104] Compared with the existing designs, in the optical image stabilization device provided by the present invention, the first driving unit 420 is used to drive the image sensor chip 100, so that the image sensor chip 100 generates displacements in the X and Y directions or planar rotations. The first driving unit 420 may include a structure of a shape memory alloy wire with a relatively small volume. Thus, the formed driving assembly has a simple structure and is easy to operate, and can further reduce the volume of the optical image stabilization device.

[0105] Furthermore, the optical image stabilization device provided by the present invention is provided with a rebounding component to enable the image sensor chip 100 to return to its initial position. The rebounding component 410 has a thin, light and simple structure and is easy to operate, and can further reduce the volume of the optical image stabilization device.

[0106] Furthermore, in the optical image stabilization device provided by the present invention, the image sensor chip may be fixedly arranged on a carrier board. The carrier board 110 includes a logic circuit unit, and the logic circuit unit merges the circuits of the pins of the image sensor chip 100, which can further reduce the volume of the optical image stabilization device.

[0107] Furthermore, the carrier board 110 is provided with an opening, and the image sensor chip may be embedded in the carrier board 110, which can reduce the overall thickness of the optical image stabilization device provided by the present invention, that is, reduce the distance between the photosensitive surface of the image sensor chip 100 and the lowest surface of the optical image stabilization device, and can further reduce the volume and thickness of the optical image stabilization device, and can better adapt to the trend of increasing thinness of digital products with camera modules.

[0108] Furthermore, in the optical image stabilization device provided by the present invention, the lower substrate 500 is also provided with an opening or a groove, and the image sensor chip 100 and / or the carrier board 110 can be further close to the lowest surface of the lower substrate 500, that is, further reduce the distance between the photosensitive surface of the image sensor chip 100 and the lowest surface of the optical image stabilization device, and can better adapt to the trend of increasing thinness of digital products with camera modules.

[0109] Furthermore, in the optical image stabilization device provided by the present invention, the power supply of the carrier board 110 adopts a first flexible circuit unit 120, and the first flexible circuit unit 120 can be partially bent and arranged between the side wall of the base of the optical image stabilization device and the housing 600, which can further reduce the volume of the optical image stabilization device.

[0110] Further, in the optical image stabilization device provided by the present invention, the lower substrate 500 is powered by a second flexible circuit unit 520. The first flexible circuit unit 120 and the second flexible circuit 520 are disposed opposite to each other and connected to each other, so that the structure of the optical image stabilization device is simple and light.

[0111] Further, in the optical image stabilization device provided by the present invention, the lens unit can also be driven by a second driving unit to move in the Z direction, further realizing a more precise OIS anti-shake effect.

[0112] The technical solution of the present invention also provides an electronic device, including the optical image stabilization device using a mobile image sensor for motion compensation as described above.

[0113] Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. An optical image stabilization device that uses a mobile image sensor chip for motion compensation, characterized in that, Comprising, a carrier board, a lower substrate, a first driving unit, a resilient member, and an image sensor chip; the image sensor chip is embedded in an opening or a groove of the carrier board, and the lower substrate is located below the image sensor chip; the first driving unit is disposed between the lower substrate and the image sensor chip, one end of the first driving unit is electrically connected to the lower substrate, and the other end acts on the image sensor chip, and the image sensor chip moves or rotates in a plane in the X and Y directions under the action of the first driving unit to perform motion compensation for optical image stabilization; one end of the resilient member is connected to the lower substrate, and the other end acts on the image sensor chip. The resilient member includes a flexure portion and an inner frame. The inner frame is fixedly connected to the side of the image sensor chip, and the periphery of the inner frame is adapted to lead out the flexure portion. The flexure portion includes at least one elastic cantilever. The elastic cantilever is fixedly connected to the image sensor chip. After the first driving unit stops performing motion compensation for optical image stabilization, the image sensor chip returns to its initial position under the action of the elastic cantilever.

2. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that, The image sensor chip is adapted to move in the X and Y directions and rotate in a plane under the action of the first driving unit.

3. The optical image stabilization device for motion compensation using a mobile image sensor chip as described in claim 2, wherein The first driving unit includes a shape memory alloy wire, and the shape memory alloy wire is adapted to receive a control signal from an optical image stabilization control unit and deform according to the control signal when the control signal changes, so that the image sensor chip generates displacement in the X and Y directions or rotates in a plane.

4. The optical image stabilization device for performing motion compensation by moving an image sensor chip according to claim 1, wherein: the first driving unit includes a shape memory alloy wire, one end of the shape memory alloy wire is electrically connected to the optical image stabilization control unit through the lower substrate, and the other end acts on the image sensor chip.

5. The optical image stabilization device using a mobile image sensor chip for motion compensation as described in claim 1, wherein, The carrier board includes a logic circuit unit, and the logic circuit unit merges the circuits of the pins of the image sensor chip and is electrically connected to a first flexible circuit unit.

6. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that, One end of the first driving unit acting on the image sensor chip is fixed at a corner of the carrier board.

7. The optical image stabilization device using a mobile image sensor chip for motion compensation as claimed in claim 1, wherein One end of the resilient member is fixedly connected to the bottom surface of the carrier board.

8. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that, Capacitors are provided on the carrier board, and the capacitors are arranged in a strip shape and surround the side of the image sensor.

9. The optical image stabilization device for motion compensation using a mobile image sensor chip according to claim 1, characterized in that, Openings or grooves are provided at the positions corresponding to the orthographic projection of the image sensor chip on the lower substrate, and the image sensor chip is adapted to move or rotate in the X and Y directions in the openings or grooves.

10. The optical image stabilization device for performing motion compensation by moving an image sensor chip according to claim 1, wherein: the first driving unit includes a shape memory alloy wire, one end of the shape memory alloy wire is disposed on the lower substrate and is electrically connected to the optical image stabilization control unit through the lower substrate, and the other end acts on a corner of the carrier board.

11. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 10, characterized in that, There are at least two shape memory alloy wires, which are respectively disposed on the sides of the carrier board in the X and Y directions.

12. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, wherein, A support member is further provided on the lower substrate. The support member is adapted to leave a gap with a predetermined height between the lower substrate and the image sensor chip, and the support member is adapted to roll or slide as the image sensor chip moves.

13. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 12, wherein The lower substrate includes a printed circuit board and a reinforcing board attached to the bottom surface of the printed circuit board. The printed circuit board is provided with an opening at the position corresponding to the orthographic projection of the image sensor chip, and the reinforcing board is provided with a groove at the position corresponding to the orthographic projection of the support member. The support member is disposed in the groove.

14. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 12, characterized in that, The support member is a metal ball or a ceramic ball.

15. The optical image stabilization device for motion compensation using a mobile image sensor chip according to claim 12, characterized in that, An opening or a groove is provided on the lower substrate, and the opening or the groove is adapted to dispose the support member.

16. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 12, characterized in that, There are at least three support members, corresponding to at least three sides of the image sensor chip respectively. Their rolling or sliding directions are in the X and Y directions, so as to reduce the moving friction of the image sensor chip in the X and Y directions and provide guarantee for the flatness of the image sensor.

17. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 16, characterized in that, The carrier board includes a logic circuit unit. The logic circuit unit combines the circuits of the pins of the image sensor chip and is electrically connected to the first flexible circuit unit; the support member is disposed between the carrier board and the lower substrate.

18. The optical image stabilization device for motion compensation using a mobile image sensor chip as claimed in claim 12, wherein The predetermined height is greater than or equal to 50 microns.

19. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 5, characterized in that, At least one side of the lower substrate is provided with a second flexible circuit unit.

20. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 19, wherein The second flexible circuit unit is disposed opposite to and electrically connected to the first flexible circuit unit.

21. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that, A filter assembly is further included. The filter assembly includes a filter located above the image sensor chip.

22. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 21, characterized in that, The filter is disposed in the carrier board.

23. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1 or 2, characterized in that, A second driving unit is further included. The second driving unit is adapted to drive the lens unit to move in the Z direction.

24. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 23, characterized in that, The second driving unit is a shape memory alloy driving unit, an electromagnetic driving unit or a piezoelectric ceramic driving unit.

25. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 23, characterized in that, A base is further included. The base includes an accommodation space and a side wall. The image sensor chip is located at the center of the lower part of the accommodation space. The accommodation space is adapted to accommodate the second driving unit and the lens unit therein.

26. The optical image stabilization device for motion compensation using a mobile image sensor chip according to claim 25, wherein The first flexible circuit unit is disposed outside the side wall.

27. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 26, characterized in that, The first flexible circuit unit includes at least one bending portion to surround the side wall.

28. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 26, wherein A housing is further included. The housing partially covers the outside of the portion of the first flexible circuit unit surrounding the side wall.

29. The optical image stabilization device for motion compensation using a mobile image sensor chip according to claim 23, characterized in that, A base is further included. The base includes an accommodation space and a side wall. The accommodation space is adapted to accommodate the second driving unit and the lens unit therein. The bottom of the base is fixedly disposed on the lower substrate. At least one side of the lower substrate is provided with a second flexible circuit unit. The second driving unit is adapted to achieve electrical connection through the second flexible circuit unit.

30. The optical image stabilization device for motion compensation using a mobile image sensor chip as claimed in claim 3, 4 or 10, wherein The position of the image sensor chip is real-time feedback and controlled through the change of the resistance value of the shape memory alloy wire.

31. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, characterized in that, One end of the first driving unit is powered by the lower substrate, and the other end is connected to the ground terminal of the carrier board; or one end of the first driving unit is powered by the carrier board, and the other end is connected to the ground terminal of the lower substrate.

32. An electronic device, characterized in that, An optical image stabilization device using a moving image sensor for motion compensation as described in claim 1 is included.

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