Oscillator and manufacturing method

Abstract

Oscillator and manufacturing method. In joining of an IC and a package by FCB, there is a problem that the performance of the IC can be degraded. An oscillator includes a package provided with a plurality of external terminals at a mounting surface, a circuit element housed in the package, and a vibrator housed in the package and electrically connected to the circuit element, the circuit element being electrically connected to the package by a plurality of connection pads each joined to the package via a bump member, the circuit element being rectangular in plan view, and at least three of the bump members closest to four corners of the circuit element among the bump members being joined to the package at positions overlapping the plurality of external terminals in plan view.

Description

TECHNICAL FIELD

[0001] The present application relates to an oscillator and a manufacturing method. BACKGROUND

[0002] There is an oscillator in which an IC is mounted to a package of a material such as ceramic by an FCB (flip chip bonding) process. Patent Document 1 discloses an oscillator of such a configuration, which is configured so that an external terminal and a land of an IC do not overlap in plan view.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2011-055033

[0004] In the case of miniaturizing the oscillator of such a configuration described in Patent Document 1, the external terminals of the package become narrower. If the distance between the external terminals is simply made narrower, it is predicted that a part of the lands of the IC overlaps the external terminals in plan view.

[0005] However, in the oscillator, the thickness of the package is different between the case where the external terminals exist on the back surface and the case where the external terminals do not exist. Therefore, in the mounting surface of the IC of the package, a step is generated at the mounting position of each of the plurality of lands of the IC. Thus, there is a problem that, at the time of bonding the IC and the package by FCB, the pressure applied at the time of bonding is deviated at the positions of the plurality of lands of the IC, and the performance of the IC can be deteriorated. SUMMARY

[0006] An oscillator for solving the above problem has a package provided with a plurality of external terminals on a mounting surface, a circuit element housed in the package, and a vibrator housed in the package and electrically connected to the circuit element, the circuit element being electrically connected to the package by a plurality of lands each bonded to the package via a bump member, the circuit element being rectangular in plan view, and at least three of the bump members closest to the four corners of the circuit element in plan view being bonded to the package at positions overlapping the plurality of external terminals in plan view. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 is a perspective view of an oscillator.

[0008] Figure 2 is a sectional view of an oscillator.

[0009] Figure 3 is a plan view of an IC arrangement surface.

[0010] Figure 4 is a diagram explaining the configuration of an oscillator of a comparative example.

[0011] Figure 5is a diagram showing the state at the time of IC bonding of a comparative example.

[0012] Figure 6 is a perspective top view of an oscillator.

[0013] Figure 7 is a perspective top view of an oscillator.

[0014] Figure 8 is a perspective top view of an oscillator.

[0015] Explanation of Reference Signs

[0016] 1: oscillator; 1a: oscillator; 1b: oscillator; 2: oscillator; 10: container; 11: substrate; 11a: 1st surface; 11b: 2nd surface; 11c: IC placement surface; 12: 1st frame; 13: 2nd frame; 14: joint ring; 15: package; 16: lid; 20: vibrator; 41a-41b: connection wiring; 42a-42f: connection wiring; 421a: 1st portion; 422a: 2nd portion; 421d: 3rd portion; 422d: 4th portion; 421e: 5th portion; 422e: 6th portion; 421f: 7th portion; 422f: 8th portion; 43a-43b: through hole; 44a-44d: external terminal; 45a-45b: bump member; 46a-46f: bump member; 50: IC; 51a-51f: connection pad; 61: 1st side; 62: 2nd side; 63: 3rd side; 64: 4th side; 65: 5th side; 66: 6th side; 67: 7th side; 68: 8th side; 71: IC placement surface; 72a-72d: external terminal; 73a-73f: bump member; 74a-74f: connection wiring; 75: package; 80: IC; 81a-81f: connection pad. DETAILED DESCRIPTION

[0017] Here, the embodiments of the present application are described in the following order.

[0018] (1) 1st Embodiment:

[0019] (1-1) Structure of Oscillator:

[0020] (1-2) Method of Manufacturing Oscillator:

[0021] (2) 2nd Embodiment:

[0022] (2-1) Structure of Oscillator:

[0023] (2-2) Method of Manufacturing Oscillator:

[0024] (3) 3rd Embodiment:

[0025] (3-1) Structure of Oscillator:

[0026] (3-2) Method for manufacturing the oscillator:

[0027] (4) Other embodiments:

[0028] (1) First embodiment:

[0029] (1-1) Structure of the oscillator:

[0030] Using Figure 1 , 2 The structure of the oscillator 1 of the first embodiment will be described. For ease of description, it is assumed that the oscillator 1 is disposed on an XYZ coordinate system composed of three axes, i.e., an X axis, a Y axis, and a Z axis, which are orthogonal to each other. The oscillator 1 is disposed with a surface, i.e., a mounting surface, for connection to an external substrate as a bottom portion in a manner in which the height direction is parallel to the Z axis. The oscillator 1 is rectangular in plan view, and is disposed in a manner in which the long side direction of the rectangle is parallel to the X axis and the short side direction is parallel to the Y axis. On the X axis, the tip side of an arrow is set as the right or right side, and the base end side is set as the left or left side. On the Y axis, the tip side of an arrow is set as the inside, and the base end side is set as the front. On the Z axis, the tip side of an arrow is set as the upper side, and the base end side is set as the bottom or lower side.

[0031] Figure 1 is a perspective plan view of the oscillator 1 viewed from above. Hereinafter, a plan view of an object viewed from above will be referred to as a plan view. Figure 2 is Figure 1 is a cross-sectional view of the oscillator 1 taken along A-A shown in

[0032] The oscillator 1 of the present embodiment has a container 10, a vibrator 20, and an IC 50.

[0033] The container 10 has a package 15 and a lid 16. The package 15 is a housing that accommodates the vibrator 20 and the IC 50. The lid 16 is a metal lid that covers the upper surface of the package 15. Figure 1 is a plan view of the oscillator 1 in which the lid 16 is transparent.

[0034] As shown in Figure 1 , in plan view, the package 15 is rectangular with a first edge 61 that is the edge of the left end, a second edge 62 that is the opposite edge of the first edge 61, a third edge 63 that is the edge of the inside end, and a fourth edge 64 that is the opposite edge of the third edge 63.

[0035] The vibrator 20 is a vibration piece that uses a quartz substrate as a piezoelectric body.

[0036] IC50 is an integrated circuit element (Integrated Circuit) in a rectangular plate shape having a plurality of lands 51a to 51f on one surface for electrically connecting with the package 15. Hereinafter, the lands 51a to 51f will be appropriately collectively referred to as lands 51.

[0037] As shown in FIG. 1, the IC 50 is a rectangular shape having a left end edge, i.e., a fifth edge 65, which is parallel to the first edge 61, a sixth edge 66, which is a pair edge of the fifth edge 65 and is farther from the first edge 61 than the fifth edge 65, a right end edge, i.e., a seventh edge 67, and an eighth edge 68, which is a pair edge of the seventh edge 67, when viewed from above. Figure 1

[0038] The distance (distance in the X-axis direction) between the first edge 61 and the fifth edge 65 is greater than the distance between the second edge 62 and the sixth edge 66.

[0039] The land 51a is a power supply land to which a power supply voltage is applied. Further, the land 51b is a first vibrator land to which the vibrator 20 is electrically connected. Further, the land 51c is a second vibrator land to which the vibrator 20 is electrically connected. Further, the land 51d is a control land to which an output control signal of a clock signal is input.

[0040] Further, the land 51e is a ground land to which a ground potential is supplied. Further, the land 51f is an output land to which the clock signal is output.

[0041] Further, a land group of the lands 51a to 51d is disposed along the fifth edge 65 so as to be closer to the fifth edge 65 than to the sixth edge 66. The land group disposed along the fifth edge 65 so as to be closer to the fifth edge 65 than to the sixth edge 66 is set as a first land group. The lands 51a to 51d are disposed at the same position in the X-axis direction. However, each land 51 of the first land group can be disposed at a different position in the X-axis direction. Further, a part of the lands of the first land group can be disposed at the same position in the X-axis direction.

[0042] Further, a land group of the lands 51e to 51f is disposed along the sixth edge 66 so as to be closer to the sixth edge 66 than to the fifth edge 65. The land group disposed along the sixth edge 66 so as to be closer to the sixth edge 66 than to the fifth edge 65 is set as a second land group. The lands 51e to 51f are disposed at the same position in the X-axis direction. However, each land 51 of the second land group can be disposed at a different position in the X-axis direction. Further, a part of the lands of the second land group can be disposed at the same position in the X-axis direction.

[0043] ​In this embodiment, the distance between the sixth side 66 and the second land group on the X axis is greater than the distance between the fifth side 65 and the first land group on the X axis. That is, the second land group is arranged closer to the center of the IC 50 than the first land group in the X axis direction.

[0044] like Figure 1 、 2 As shown, package 15 includes a substrate 11 forming its bottom, a first frame 12 forming a housing space for IC 50 and a support base for vibrator 20, a second frame 13 forming a housing space for vibrator 20, and a seam ring 14 serving as a bonding material for connecting to lid 16. Package 15 also includes a plurality of connection wires 41a and 41b for connecting to vibrator 20, a plurality of connection wires 42a to 42f for connecting to IC 50, a through-hole 43a for connecting connection wires 41a and 42b, a through-hole 43b (not shown) for connecting connection wires 41b and 42c, and a plurality of external terminals 44a to 44d for connecting to an external substrate. Hereinafter, connection wires 41a and 41b will be collectively referred to as connection wires 41. Furthermore, connection wires 42a to 42f will be collectively referred to as connection wires 42. Furthermore, through-holes 43a and 43b will be collectively referred to as through-holes 43. In addition, below, the external terminals 44a to 44d are collectively referred to as the external terminals 44 as needed.

[0045] The connection wirings 41a, 41b and the vibrator 20 are connected via the bump parts 45a, 45b, respectively. Hereinafter, the bump parts 45a, 45b will be collectively referred to as the bump part 45 as appropriate. Figure 2 As shown, bump member 45a is located between connection wiring 41a and vibrator 20. Similarly, bump member 45b is located between connection wiring 41b and vibrator 20. Connection wiring 42a-42f and IC 50 lands 51a-51f are bonded via bump members 46a-46f, respectively. Hereinafter, bump members 46a and 46b will be collectively referred to as bump member 46, as appropriate.

[0046] The substrate 11 has a front surface as a first surface 11a and a back surface as a second surface 11b. In this embodiment, the substrate 11 is a ceramic substrate. The substrate 11 may also be made of an insulating substrate material such as glass or resin, or a composite of these.

[0047] External terminals 44a to 44d are located at the four corners of the bottom surface of substrate 11, or second surface 11b. When viewed from above, external terminals 44a to 44d are located at the upper left, lower left, upper right, and lower right corners of second surface 11b, respectively. Each of external terminals 44a to 44d is a metal component having a plate-shaped portion whose surface is parallel to the XY plane, and a portion extending in the height direction from the corner of second surface 11b to connect to connection wiring 42. When viewed from above, external terminals 44a, 44c, and 44d each have a shape that includes a rectangular region and an area connecting this region to the corner of second surface 11b. When viewed from above, external terminal 44b has a shape that includes a rectangular region with a corner cut off near the center of second surface 11b and an area connecting this region to the corner of second surface 11b. Thus, among external terminals 44a to 44d, the shape of external terminal 44b when viewed from above differs from that of the other external terminals. This allows the user to visually identify which external terminals 44a to 44d are. However, as long as one of the external terminals 44a to 44d is shaped distinct from the others, the external terminals 44a to 44d may have other shapes. Furthermore, a portion of each of the external terminals 44a to 44d overlaps with the IC 50 when viewed from above.

[0048] In this embodiment, the connection lands 51 are arranged so as to overlap with any one of the external terminals 44 in a plan view in the oscillator 1. Specifically, the connection lands 51a and 51b overlap with the external terminal 44a, the connection lands 51c and 51d overlap with the external terminal 44b, the connection land 51e overlaps with the external terminal 44c, and the connection land 51f overlaps with the external terminal 44d.

[0049] In this embodiment, the oscillator 1 uses the miniaturized package 15. Therefore, the external terminals 44 occupy a larger proportion of the second surface 11b than when using a non-miniaturized package 15. As a result, the IC 50 and the external terminals 44a to 44d overlap in a plan view.

[0050] External terminals 44a and 44b are provided along first side 61, closer to first side 61 than to second side 62. External terminal 44a is a terminal supplied with a power supply voltage, i.e., a power terminal. External terminal 44b is a control terminal to which a signal for controlling the on / off switching of a clock signal is applied. External terminals 44c and 44d are provided along second side 62, closer to second side 62 than to first side 61. External terminal 44c is a terminal for outputting a clock signal, i.e., an output terminal. External terminal 44d is a ground terminal supplied with a ground potential.

[0051] The first frame 12 and the second frame 13 are stacked on the substrate 11 in a frame shape. The inner wall of the left portion of the first frame 12 protrudes to the right side with respect to the inner wall of the left portion of the second frame 13, and a step is formed. Here, the frame shape means a frame shape that surrounds a cuboid-shaped space. Hereinafter, a portion in the first surface 11a surrounded by the inner wall of the first frame 12 and on which the IC 50 is disposed is referred to as an IC disposition surface 11c. The distance between the first edge 61 and the fifth edge 65 is greater than the distance between the second edge 62 and the sixth edge 66, and thus the IC disposition surface 11c is disposed to the right on the X axis in plan view.

[0052] The connection wires 42a to 42f are disposed on the IC disposition surface 11c. The connection wires 42a to 42f are each a plate-shaped metal member for connection to the connection pads 51a to 51f. The connection wires 42a, 42d, 42e, and 42f each have a shape in which two portions each having a long shape in plan view are combined. The connection wires 42b and 42c each have a rectangular shape in plan view on the IC disposition surface 11c. Figure 3 The connection wires 42 disposed on the IC disposition surface 11c and the connection pads 51 are shown.

[0053] In the present embodiment, the connection wire 42a is a power supply wire for electrically connecting to the power supply connection pad, that is, the connection pad 51a. The connection wire 42a includes a first portion 421a extending in a right direction from the upper left corner of the IC disposition surface 11c in plan view, and a second portion 422a extending in a front direction from the right end of the first portion 421a in plan view. The first portion 421a is a portion for connecting the power supply connection pad, that is, the connection pad 51a, and the power supply terminal, that is, the external terminal 44a. The second portion 422a is disposed to extend between the output connection pad, that is, the connection pad 51e, and the first vibrator connection pad, that is, the connection pad 51b, in plan view.

[0054] The connection wire 42d is a control wire for electrically connecting to the control connection pad, that is, the connection pad 51d. The connection wire 42d includes a third portion 421d extending in a right direction from the lower left corner of the IC disposition surface 11c in plan view, and a fourth portion 422d extending in a rear direction from the right end of the third portion 421d. The third portion 421d is a portion for connecting the control connection pad, that is, the connection pad 51d, and the control terminal, that is, the external terminal 44b. The fourth portion 422d is disposed to extend between the ground connection pad, that is, the connection pad 51f, and the second vibrator connection pad, that is, the connection pad 51c, in plan view.

[0055] Further, the connection wiring 42b, 42c respectively includes a rectangular portion connected to the 1st vibrator land, i.e., the land 51b, and the 2nd vibrator land, i.e., the land 51c, and extending in the right direction from the left end of the IC arrangement surface 11c in plan view. Further, the connection wiring 42e includes a 5th portion 421e connected to the output land, i.e., the land 51e, and extending in the left direction from the upper right corner of the IC arrangement surface 11c in plan view, and a 6th portion 422e extending in the front direction from the left end of the 5th portion 421e in plan view. Further, the connection wiring 42f includes a 7th portion 421f connected to the ground land, i.e., the land 51f, and extending in the left direction from the lower right corner of the IC arrangement surface 11c in plan view, and an 8th portion 422f extending in the inner direction from the left end of the 7th portion 421f in plan view.

[0056] The IC 50 is arranged on the IC arrangement surface 11c in such a manner that the surface having the lands 51 opposes the IC arrangement surface 11c, and the lands 51a to 51f overlap the connection wirings 42a to 42f, respectively, in plan view. The lands 51a to 51f and the connection wirings 42a to 42f are joined by flip-chip bonding by means of joining members, i.e., bump members 46a to 46f, composed of a conductive material such as solder. The lands 51 are arranged so as to overlap any one of the external terminals 44 in plan view, respectively, and thus the bump members 46 are joined to the package 15 at positions overlapping any one of the external terminals 44 in plan view, respectively.

[0057] The portion of the step formed by the 1st frame 12, i.e., the portion of the upper surface of the 1st frame 12 surrounded by the inner wall of the 2nd frame 13, functions as a support platform that supports the vibrator 20. Hereinafter, this portion is referred to as a vibrator support surface. The arrangement position of the vibrator 20 in the vibrator support surface is arranged with a plurality of connection wirings 41a to 41b for connection to the vibrator 20.

[0058] The vibrator 20 is electrically connected to the connection wirings 41a, 41b via joining members, i.e., bump members 45a, 45b, composed of a conductive material such as solder, and is fixed to the vibrator support surface. The connection wirings 41a, 41b are electrically connected to the connection wirings 42b, 42c via a through-hole 43a that penetrates the inside of the 1st frame 12 downward and a not-shown through-hole 43b.

[0059] Thus, the vibrator 20 and the IC 50 are housed in the space surrounded by the frame-shaped 1st frame 12 and 2nd frame 13 with the IC arrangement surface 11c as the bottom. In addition, the 1st frame 12 and 2nd frame 13 are made of the same material as the substrate 11.

[0060] In the preferred embodiment, the material of the lid 16 is Kovar (Fe-Ni-Co alloy), and the material of the seaming ring 14 is silver solder. The receiving space formed in the package 15 is an inert gas environment of nitrogen, helium, argon, or the like, or a reduced pressure environment lower in pressure than atmospheric pressure, which is sealed by the lid 16. Thus, the IC 50, the vibrator 20, and the like housed in the receiving space are protected from impacts, dust, heat, humidity, and the like. In addition, the lid 16 made of metal is connected to the ground potential.

[0061] Here, the use of the same reference numerals in the drawings indicates the same or similar elements throughout the drawings. The same applies to the following description. Figure 4 The oscillator 2 of the comparative example will be described. Figure 4 is a view illustrating the positional relationship between the lands 81a to 81f of the IC 80 in the oscillator 2 and the external terminals 72a to 72d. Figure 4 The lands 81a to 81f and the external terminals 72a to 72d in the oscillator 2 are shown in plan view. Hereinafter, the lands 81a to 81f will be collectively referred to as the lands 81 as appropriate. In addition, the external terminals 72a to 72d will be collectively referred to as the external terminals 72 as appropriate.

[0062] As shown in Figure 4 In the oscillator 2 of the comparative example, the lands 81a to 81d, like the lands 51a to 51d, do not overlap any of the external terminals 72 in plan view. On the other hand, the lands 81e, 81f overlap the external terminals 72c, 72d, respectively, in plan view.

[0063] Due to the influence of the arrangement of the external terminals 72 on the mounting surface of the oscillator 2, the thickness of the substrate of the package in the Z-axis direction differs between the region where the external terminal 72 is present on the back surface and the region where the external terminal 72 is not present in the IC arrangement surface 71 of the oscillator 2. Thus, a difference in level is generated between the region overlapping the external terminal 72 and the region not overlapping the external terminal 72 in plan view in the IC arrangement surface 71. Accordingly, a difference in level is generated at the positions on the IC arrangement surface 71 where the lands 81a to 81f are arranged, respectively.

[0064] When mounting the IC to the package, the following operation is performed. First, the bump members of the same shape are joined to the lands of the IC, respectively. Then, the surface of the IC on which the lands are provided is opposed to the upper portion of the package, and the mounting surface of the package and the surface of the IC are made parallel, and in this state, the IC is brought close to the IC arrangement surface of the package. When the bumps provided to the lands of the IC and the connection wiring of the IC arrangement surface come into contact with each other, a load and ultrasonic waves are applied between the lands and the connection wiring, whereby the bump members and the connection wiring are joined.

[0065] In the case where the IC 80 is mounted to the package 75 of the oscillator 2 by the above operation, the following situation occurs. That is, the bump members 73a to 73f are arranged in the IC 80 of the lands 81a to 81f close to the IC arrangement surface 71 of the package 75. Hereinafter, the bump members 73a to 73f are appropriately collectively referred to as the bump members 73. First, the bump members 73e, 73f in the lands 81e, 81f come into contact with the connection wirings 74e, 74f of the IC arrangement surface 71 earlier than the bump members 73a to 73d in the lands 81a to 81d. Figure 5 The situation in this case is shown. Then, the state where the surface of the IC 80 and the mounting surface of the package 75 are kept parallel is further maintained, and the IC 80 and the package 75 are brought close to each other. After the bump members 73a to 73f in the lands 81a to 81f come into contact with the connection wirings 74a to 74f, a load and ultrasonic waves are applied to the portions of the lands 81a to 81f, and the IC 80 is joined to the package 75. Hereinafter, the connection wirings 74a to 74f are appropriately collectively referred to as the connection wirings 74.

[0066] Thus, in the portions of the lands 81e, 81f, the IC 80 is pushed into the IC arrangement surface 71 after the bump members 73 and the connection wirings 74 of the IC arrangement surface 71 temporarily come into contact with each other, before the bump members 73 and the connection wirings 74 of the IC arrangement surface 71 come into contact with each other in the portions of the lands 81a to 81d. As a result, a larger pressure is applied to the portions of the lands 81e to 81f than to the portions of the lands 81a to 81d, and the pressure applied at the time of joining of the IC 80 and the package 75 based on flip-chip joining becomes unbalanced. As a result, an excessive force is applied around the portions of the lands 81e to 81f, and the performance of the IC 50 can be deteriorated.

[0067] In the oscillator 1 of the present embodiment, the lands 51a to 51f overlap any one of the external terminals 44 in plan view, and the bump members 46a to 46f also overlap any one of the external terminals 44 in plan view. That is, the arrangement positions of the lands 51a to 51f of the connection wirings 42 of the IC arrangement surface 11c of the package 15 are positions where the external terminals 44 exist in the bottom portion. Therefore, compared with the case where a part of the lands 51a to 51f overlap the external terminals 44 in plan view, the imbalance in the height of the arrangement positions of the lands 51a to 51f in the IC arrangement surface 11c is reduced. As a result, the pressure applied around each of the lands 51a to 51f at the time of joining of the IC 50 and the package 15 based on flip-chip joining is more uniformly close. As a result, it is possible to reduce the possibility that an excessive pressure is applied around a part of the lands 51a to 51f to deteriorate the performance of the IC 50.

[0068] Further, in the present embodiment, the connection wiring 42a includes a second portion 422a extending between the land 51b and the land 51e in plan view. The connection wiring 42a is connected to the power supply land, i.e., the land 51a, and is supplied with a direct-current potential. The alternating-current signals flow through the connection wiring 42e connected to the output land, i.e., the land 51e, and the connection wiring 42b connected to the first vibrator land, i.e., the land 51b, respectively. Thus, it is possible that these alternating-current signals interfere with each other to deteriorate the noise performance. In the present embodiment, the second portion 422a of the connection wiring 42a supplied with the direct-current potential, which is present between the connection wiring 42b and the connection wiring 42e, functions as a shield, whereby the interference of these alternating-current signals with each other is reduced, and the deterioration of the noise performance is reduced.

[0069] Further, in the present embodiment, the connection wiring 42d includes a fourth portion 422d extending between the land 51c and the land 51f in plan view. The connection wiring 42d is connected to the control land, i.e., the land 51d, and is supplied with an output control signal, i.e., a direct-current potential, of a clock signal. Thus, the fourth portion 422d of the connection wiring 42d, like the second portion 422a of the connection wiring 42a, functions as a shield between the connection wiring 42c and the connection wiring 42f, whereby the interference of the signals flowing through the connection wiring 42c and the connection wiring 42f with each other is reduced, and the deterioration of the noise performance is reduced.

[0070] (1-2) Method of manufacturing the oscillator:

[0071] An example of a method of manufacturing the oscillator 1 will be described.

[0072] First, bump members 46 are formed on the lands 51 of the IC 50 by ultrasonic bump bonding using Au bonding wires.

[0073] Next, a bonding process of bonding the IC 50 to the IC arrangement surface 11c of the package 15 will be described. The IC 50 is turned upside down and is handed over to a tip nozzle of an ultrasonic horn of a flip-chip bonder. Then, the flip-chip bonder is used to position the surface of the IC 50 on which the lands 51 are provided in parallel with the IC arrangement surface 11c of the package 15 which is positioned in a horizontal position with the mounting surface as a bottom. At this time, the lands 51 respectively overlap any one of the external terminals 44 in plan view. Thus, in the oscillator 1, the bump members 46 become positions overlapping any one of the external terminals 44 in plan view, respectively.

[0074] Then, the IC 50 is moved downward by a flip chip bonding apparatus to approach the IC mounting surface 11c. The bump members 46 provided to the lands 51 of the IC 50 come into contact with the connection wiring 42 of the IC mounting surface 11c, and when the load thereof is detected by the flip chip bonding apparatus, a predetermined load is applied to each of the bump members, and the bump members 46 and the connection wiring 42 are bonded by applying ultrasonic waves. The conditions of the ultrasonic waves are set by the power of the ultrasonic waves and the time of applying the ultrasonic waves. In addition, the bonding also requires moderate heat. A predetermined heat (for example, 150 to 200°C) is applied to the package 15 in advance. In addition, the same heat is applied to the package 15 in the ultrasonic processing.

[0075] Next, the vibrator 20 is connected and fixed to the connection wiring 41 of the vibrator supporting surface of the package 15 by a conductive adhesive. Then, including curing of the conductive adhesive, the package 15 in which the IC 50 and the vibrator 20 are mounted is subjected to an annealing process at a high temperature. This also has the effect of removing exhaust gas from the conductive adhesive and the package 15 and the like. Then, the metal lid 16 is aligned with the position of the seam ring 14 of the package 15 and fixed, and is hermetically sealed by seam welding.

[0076] Thus, the oscillator 1 is manufactured.

[0077] (2) Second Embodiment:

[0078] (2-1) Structure of Oscillator:

[0079] The oscillator 1a of the present embodiment will be described. The oscillator 1a of the present embodiment is the same as the oscillator 1 of the first embodiment except that the shapes of the external terminals 44a to 44d are different. Regarding the oscillator 1a, the differences from the oscillator 1 will be described.

[0080] Figure 6 is a plan view of the lid 16 and the vibrator 20 of the oscillator 1a.

[0081] In plan view, the external terminals 44a to 44d of the present embodiment are each a shape including a rectangular shape and a region connecting a corner of the region and the second surface 11b. The width in the left-right direction and the depth direction of the rectangular shape in plan view in the external terminals 44a to 44d is smaller than that in the external terminals 44a, 44c, 44d of the first embodiment.

[0082] In the present embodiment, a portion of each of the connection pads 51 overlaps with any of the external terminals 44. Specifically, a portion of the connection pads 51a, 51b overlaps with the external terminal 44a, a portion of the connection pads 51c, 51d overlaps with the external terminal 44b, a portion of the connection pad 51e overlaps with the external terminal 44c, and a portion of the connection pad 51f overlaps with the external terminal 44d. Therefore, the bump members 46 are respectively arranged at positions where a portion overlaps with any of the external terminals 44.

[0083] With the above-described structure according to the present embodiment, in the oscillator 1a, a portion of each of the connection pads overlaps with any of the external terminals 44 in plan view. Therefore, compared to a case where some of the plurality of connection pads of the IC overlap with the external terminals 44 and the other connection pads do not overlap with the external terminals 44 at all as in the oscillator 2, the unevenness in height of the arrangement positions of the connection pads 51a to 51f in the IC arrangement surface 11c is reduced. Thus, at the time of flip-chip bonding of the IC 50 and the package 15, the pressure applied around each of the connection pads 51a to 51f is more uniformly close. As a result, it is possible to reduce the possibility that the performance of the IC 50 is degraded by excessive pressure being applied around some of the connection pads 51a to 51f.

[0084] In the present embodiment, a portion of each of the connection pads 51 overlaps with any of the external terminals 44. Further, in the first embodiment, each of the connection pads 51 overlaps with any of the external terminals 44. However, the oscillator 1a can be configured such that some of the connection pads 51 overlap with any of the external terminals 44 and a portion of the remaining connection pads 51 overlap with any of the external terminals 44. In this case, at least a portion of the connection pads 51 overlaps with the external terminals 44. Thus, compared to a case where some of the plurality of connection pads 51 overlap with the external terminals 44 and the other connection pads 51 do not overlap with the external terminals 44 at all, it is possible to reduce the unevenness in height of the arrangement positions of the connection pads 51a to 51f in the IC arrangement surface 11c and reduce the possibility that the performance of the IC 50 is degraded.

[0085] (2-2) Method of manufacturing an oscillator:

[0086] A method of manufacturing the oscillator 1a will be described.

[0087] First, the bump members 46 are formed on the connection pads 51 of the IC 50 by the same method as the method of manufacturing the oscillator 1 of the first embodiment.

[0088] Next, the IC 50 is flipped over, and the tip nozzle of the ultrasonic horn of the flip chip bonder is given to the IC 50. Then, by the flip chip bonder, the surface of the IC 50 on which the lands 51 are provided is opposed to the IC arrangement surface lie of the package 15 in a horizontal position with the mounting surface as the bottom. At this time, a part of each of the lands 51a to 51f overlaps with any one of the external terminals 44 in plan view. Thus, in the oscillator la, the bump members 46 become positions where a part of each of the bump members 46 overlaps with any one of the external terminals 44 in plan view.

[0089] Then, by the flip chip bonder, the IC 50 is moved in the downward direction to approach the IC arrangement surface lie. The bump members 46 of the lands 51 provided on the IC 50 come into contact with the connection wiring 42 of the IC arrangement surface lie, and when the load thereof is detected by the flip chip bonder, the bump members 46 and the connection wiring 42 are joined by applying a predetermined load and ultrasonic waves.

[0090] Next, by the same method as the method of manufacturing the oscillator 1 of the first embodiment, the vibrator 20 is connected and fixed to the connection wiring 41, the lid 16 is aligned with the position of the seam ring 14 of the package 15 and fixed, and hermetically sealed by seam welding.

[0091] Thus, the oscillator la is manufactured.

[0092] (3) Third Embodiment:

[0093] (3-1) Structure of Oscillator:

[0094] The oscillator lb of the present embodiment will be described. The oscillator lb of the present embodiment is the same as the oscillator 1 of the first embodiment except for the shape of the external terminals 44 in plan view and the positions of the lands 51e and 51f in the IC 50. Regarding the oscillator lb, the differences from the oscillator 1 will be described.

[0095] Figure 7 is a plan view of the lid 16 and the vibrator 20 of the oscillator lb.

[0096] The external terminals 44a to 44d of the present embodiment are smaller in width in the depth direction in the shape in plan view than the external terminals 44a to 44d of the first embodiment.

[0097] The land 51e of the present embodiment is disposed on the inner side compared with the land 51e of the first embodiment, and the land 51f of the present embodiment is disposed on the front side compared with the land 51f of the first embodiment. That is, the lands 51e and 51f of the present embodiment are disposed farther from the center in the depth direction in the IC 50 compared with the lands 51e and 51f of the first embodiment.

[0098] As Figure 7 shown, in the present embodiment, the connecting pad 51a overlaps the external terminal 44a in plan view. Further, the connecting pad 51d overlaps the external terminal 44b in plan view. Further, a part of the connecting pad 51e overlaps the external terminal 44c in plan view. Further, the connecting pad 51f overlaps the external terminal 44d in plan view. Further, the connecting pads 51b and 51c do not overlap either of the external terminals 44d in plan view, respectively. That is, in the present embodiment, at least a part of each of the connecting pads 51 closest to the four corners of the IC 50 overlaps any one of the external terminals 44 in plan view.

[0099] According to the structure of the present embodiment, at least a part of each of the connecting pads 51a, 51d, 51e, and 51f overlaps any one of the external terminals 44 in plan view. Therefore, the unevenness in height of the arrangement positions of the connecting pads 51a, 51d, 51e, and 51f in the IC arrangement face 11c is reduced. At the time of joining the IC 50 based on flip-chip joining and the package 15, the bump members 46a, 46d, 46e, and 46f in the connecting pads 51a, 51d, 51e, and 51f come into contact with the connecting wiring 42 of the IC arrangement face 11c before the bump members 46b and 46c in the connecting pads 51b and 51c come into contact with the connecting wiring 42 of the IC arrangement face 11c. In this case, the bump members 46a, 46d, 46e, and 46f receive the applied force. The bump members 46a, 46d, 46e, and 46f are not arranged on a straight line, and receive the applied force as one plane including the positions of the respective bump members 46a, 46d, 46e, and 46f. Thus, compared with the case where one point, i.e., one bump member 46 receives the applied force, and the case where a line, i.e., the bump members 46 arranged on a straight line receive the applied force, the applied force can be received more stably. As a result, the possibility of performance deterioration of the IC 50 can be reduced.

[0100] In the present embodiment, at least a portion of each of the lands 51a, 51d, 51e, 51f closest to the four corners of the IC 50 overlaps the external terminal 44. However, it is also possible that at least a portion of each of three lands among the lands 51a, 51d, 51e, 51f closest to the four corners of the IC 50 overlaps the external terminal 44. The three lands among the lands 51a, 51d, 51e, 51f closest to the four corners of the IC 50 are not arranged on a straight line, and a plane can be formed by the three lands 51. Therefore, when the IC 50 is joined to the package 15 based on flip-chip joining, the three bump members 46 among the three lands 51 can receive a force applied as a plane formed by three points of the three bump members 46. As a result, it is possible to reduce the possibility that the performance of the IC 50 is degraded by excessive pressure being applied around a portion of the lands 51a to 51f.

[0101] Further, the shape of the external terminal 44, i.e., the external terminals 44c, 44d, which are closer to the first land group (the lands 51a to 51d) than the second land group (the lands 51e to 51f) in the present embodiment is not limited to the shape shown in Figure 7 , for example. It is also possible that the shape shown in Figure 8 , which is larger in the width in the depth direction than the external terminals 44a, 44b, which are closer to the second land group (the lands 51e to 51f) than the first land group (the lands 51a to 51d). Thereby, as shown in Figure 8 , in the case where the lands 51e, 51f are arranged at positions closer to the center in the depth direction on the IC 50, it is also possible to overlap at least a portion of the external terminals 44c, 44d with the lands 51e, 51f.

[0102] (3-2) Method of manufacturing the oscillator:

[0103] A method of manufacturing the oscillator 1b will be described.

[0104] First, the bump members 46 are formed on the lands 51 of the IC 50 by the same method as the method of manufacturing the oscillator 1 of the first embodiment.

[0105] Next, the IC 50 is flipped over, and the tip nozzle of the ultrasonic horn of the flip chip bonder is brought into contact with the IC 50. Then, the flip chip bonder is used to position the surface of the IC 50 on which the lands 51 are provided in parallel with the IC mounting surface lie of the package 15 that is positioned horizontally with the mounting surface as the bottom. At this time, a portion of the lands 51a, 51d, 51e, 51f respectively overlaps with the external terminals 44a, 44b, 44c, 44d in plan view. In addition, the lands 51b, 51c do not overlap with any of the external terminals 44. Thus, in the oscillator lb, the bump members 46a, 46d, 46e, 46f respectively become positions at which a portion overlaps with any of the external terminals 44 in plan view. In addition, the bump members 46b, 46c respectively become positions at which none of the bump members 46b, 46c overlaps with any of the external terminals 44 in plan view.

[0106] Then, the flip chip bonder is used to move the IC 50 in the downward direction toward the IC mounting surface lie. The bump members 46 of the lands 51 provided on the IC 50 come into contact with the connection wiring 42 of the IC mounting surface lie, and when the flip chip bonder detects the load, the bump members 46 and the connection wiring 42 are joined by applying a predetermined load and ultrasonic waves.

[0107] Next, the same method as the method of manufacturing the oscillator 1 of the first embodiment is used to connect and fix the vibrator 20 to the connection wiring 41, to align and fix the lid 16 with the position of the seam ring 14 of the package 15, and to hermetically seal by seam welding.

[0108] Thus, the oscillator lb is manufactured.

[0109] (4) Other Embodiments

[0110] The above embodiments are one example of implementing the present application. In addition to this, various embodiments can be adopted in which at least one of the positions of the lands 51 of the IC 50, the positions or shapes of the external terminals 44, or a plurality of the lands 51 of which at least a portion of three lands that include the lands 51 closest to the four corners of the IC 50 overlap with any of the external terminals 44 in plan view are adjusted.

[0111] In each of the above embodiments, the lands 51a to 51f respectively function as a power supply land, a first vibrator land, a second vibrator land, a control land, a ground land, and an output land. However, the lands 51a to 51f can also function differently. For example, the land 51a can be a control land, and the land 51d can be a power supply land. In addition, the functions of the connection wiring 42a to 42f and the external terminals 44a to 44f can also be different from those of each of the above embodiments depending on the functions of the lands 51a to 51f.

[0112] Further, in each of the above embodiments, a quartz resonator is used as the resonator 20. However, another kind of resonator such as a ceramic resonator can be used as the resonator 20.

[0113] Further, in each of the above embodiments, at least a portion of the land 51 overlapping the external terminal 44 overlaps one external terminal 44. However, the land 51 overlapping the external terminal 44 can be configured so as to overlap at least a portion of two or more external terminals 44.

[0114] Further, in Embodiment 3 described above, the lands 51b and 51c of the lands 51 do not overlap the external terminal 44. The portion of the IC arrangement surface lie overlapping the external terminal 44 in plan view is higher than the surrounding. Further, also with respect to the portion of the IC arrangement surface lie not overlapping the external terminal 44 in plan view, due to the influence of the external terminal 44, the closer to the external terminal 44, the higher, and the farther from the external terminal 44, the lower. Therefore, with respect to the land 51 not overlapping the external terminal 44, the arrangement position is set in a range of a distance from the external terminal 44 being a predetermined distance or less in plan view, whereby the unevenness in the height of the arrangement positions of the lands 51a to 51f of the IC arrangement surface lie can be further reduced. The distance here is the shortest distance between the outer edge of the external terminal 44 and the outer edge of the land 51. Therefore, when a portion of the land 51 overlaps the external terminal 44, the distance between the external terminal 44 and the land 51 is 0. As the predetermined distance, for example, there are a distance of twice the width of the land 51, a distance of three times the width, and the like.

[0115] Further, in each of the above embodiments, the first land group includes four lands 51 (51a to 51d), and the second land group includes two lands 51 (51e and 51f). However, the number of lands 51 included in the first land group and the second land group is not limited thereto. For example, the first land group and the second land group can each include three lands 51.

[0116] With respect to the external terminal and the package, a portion of the surface of the package on which the circuit element is arranged and the external terminal can overlap in plan view.

[0117] The circuit element can be configured so that at least three of the lands of the four corners each overlap a portion of the external terminal in plan view.

Claims

1. An oscillator comprising: A package having a plurality of external terminals provided on a mounting surface; a circuit element housed in the package; and a vibrator housed in the package and electrically connected to the circuit element; The circuit element is electrically connected to the package via a plurality of connection pads, and the plurality of connection pads are respectively bonded to the package via bump components. The circuit element is rectangular in plan view. At least three of the bump components closest to the four corners of the circuit element are bonded to the package at positions overlapping the plurality of external terminals in a plan view. In a plan view, the package has a rectangular shape having a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side. In a plan view, the circuit element is rectangular and has a fifth side aligned with the first side, a sixth side opposite the fifth side and farther from the first side than the fifth side, a seventh side, and an eighth side opposite the seventh side. The plurality of connection pads include a first connection pad group disposed along the fifth side closer to the fifth side than to the sixth side, and a second connection pad group disposed along the sixth side closer to the sixth side than to the fifth side. The distance between the first side and the fifth side is greater than the distance between the second side and the sixth side. An external terminal of the plurality of external terminals that is closer to the second land group than to the first land group has a longer length along the second side than an external terminal of the plurality of external terminals that is closer to the first land group than to the second land group.

2. An oscillator comprising: A package having a plurality of external terminals provided on a mounting surface; a circuit element housed in the package; and a vibrator housed in the package and electrically connected to the circuit element; The circuit element is electrically connected to the package via a plurality of connection pads, and the plurality of connection pads are respectively bonded to the package via bump components. The circuit element is rectangular in plan view. At least three of the bump components closest to the four corners of the circuit element are bonded to the package at positions overlapping the plurality of external terminals in a plan view. In a plan view, the package has a rectangular shape having a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side. In a plan view, the circuit element is rectangular and has a fifth side aligned with the first side, a sixth side opposite the fifth side and farther from the first side than the fifth side, a seventh side, and an eighth side opposite the seventh side. The plurality of connection pads are included in either a first connection pad group provided along the fifth side closer to the fifth side than to the sixth side, or a second connection pad group provided along the sixth side closer to the sixth side than to the fifth side. The distance between the first side and the fifth side is greater than the distance between the second side and the sixth side.

3. The oscillator according to claim 1 or 2, wherein: Each of the bump members is bonded to the package at a position overlapping at least one of the plurality of external terminals in a plan view.

4. The oscillator according to claim 2, wherein An external terminal of the plurality of external terminals that is closer to the second land group than to the first land group has a longer length along the second side than an external terminal of the plurality of external terminals that is closer to the first land group than to the second land group.

5. The oscillator according to claim 2, wherein The distance between the fifth side and the first connection land group is smaller than the distance between the sixth side and the second connection land group.

6. The oscillator according to claim 1 or 2, wherein: The plurality of connection pads include a power connection pad to which a power supply voltage is applied, a ground connection pad to which a ground potential is supplied, a first vibrator connection pad electrically connected to the vibrator, a second vibrator connection pad electrically connected to the vibrator, an output connection pad to which a clock signal is output, and a control connection pad to which an output control signal of the clock signal is input.

7. The oscillator according to claim 6, wherein The package includes power wiring electrically connected to the power connection pad, The power supply wiring includes a first portion connecting the power connection land and a power terminal included in the plurality of external terminals, and a second portion extending between the output connection land and the first vibrator connection land in a plan view.

8. The oscillator according to claim 6, wherein The package has a control wiring electrically connected to the control connection pad, The control wiring includes a third portion connecting the control land and a control terminal included in the plurality of external terminals, and a fourth portion extending between the ground land and the second vibrator land in a plan view.

9. A method for manufacturing an oscillator, the oscillator comprising: a package having a plurality of external terminals provided on a mounting surface; a circuit element housed in the package and having a rectangular shape when viewed from above; and an oscillator housed in the package and electrically connected to the circuit element, wherein: The manufacturing method includes the following bonding step: bonding a plurality of lands of the circuit element to the package via bump members, thereby electrically connecting the circuit element to the package; In the bonding step, the plurality of connection pads are bonded to the package in such a manner that at least a portion of at least three of the bump components closest to the four corners of the circuit element overlaps with the plurality of external terminals when viewed from above. In a plan view, the package has a rectangular shape having a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side. In a plan view, the circuit element is rectangular and has a fifth side aligned with the first side, a sixth side opposite the fifth side and farther from the first side than the fifth side, a seventh side, and an eighth side opposite the seventh side. The plurality of connection pads include a first connection pad group disposed along the fifth side closer to the fifth side than to the sixth side, and a second connection pad group disposed along the sixth side closer to the sixth side than to the fifth side. The distance between the first side and the fifth side is greater than the distance between the second side and the sixth side. An external terminal of the plurality of external terminals that is closer to the second land group than to the first land group has a longer length along the second side than an external terminal of the plurality of external terminals that is closer to the first land group than to the second land group.

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