Film sticking equipment, film sticking equipment control method and device

Abstract

The present disclosure relates to a film pasting device, a film pasting device control method and a device, and the film pasting device is used for film pasting of electronic devices. The film pasting device includes an interactive component, a film material cutting module and a mounting module. The control mechanism of the film material cutting module is electrically connected to the interactive component to control the cutting component to cut the original film material according to the set cutting trajectory to obtain a laminated film material. The positioning mechanism of the mounting module can achieve the matching of the laminated film material and / or the electronic device, so as to cooperate with the fitting mechanism to achieve the positioning and fitting of the designated area of ​​the laminated film material with the preset position of the electronic device. The above-mentioned structural arrangement enables the film pasting device to cut and fit the film material according to the model of the electronic device to be pasted. During use, the film pasting can be completed by simply determining the model of the electronic device to be pasted, which improves the film pasting effect of the electronic device and the convenience of the film pasting operation.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic technology, and in particular to film pasting equipment, a film pasting equipment control method and a device. Background Art

[0002] In the related art, in order to prevent the surface of electronic devices such as mobile phones from being rubbed and scratched, users usually choose to stick a protective film on the surface of the electronic device to provide protection for the surface of the electronic device. However, due to the wide variety of electronic devices, it is difficult for users to find automatic film-sticking equipment that is suitable for their own models. In addition, the surface of the electronic device to be filmed itself contains a complex structure of flat and curved surfaces. When manual filming is chosen, it is easy to cause film warping, shedding and other laminating problems, which affects the convenience of film-sticking for electronic device users. Summary of the invention

[0003] The present invention provides a film pasting device, a film pasting device control method and a device to improve the film pasting effect and convenience.

[0004] According to a first aspect of the present disclosure, a film pasting device is provided, which is used for pasting films on electronic devices; the film pasting device comprises: a frame, an interactive component, a film material cutting module and a mounting module, wherein the film material cutting module and the mounting module are assembled on the frame;

[0005] The film material cutting module includes a control mechanism and a cutting component; the cutting component cooperates with the control mechanism, and the control mechanism is electrically connected to the interactive component to control the cutting component to cut the original film material according to the set cutting track to obtain the bonded film material; wherein the set cutting track matches the bonded film material corresponding to the electronic device model to be bonded;

[0006] The mounting module includes a positioning mechanism and a laminating mechanism, and the positioning mechanism cooperates with the laminating film material and / or the electronic device to position and cooperate a designated area of ​​the laminating film material with a preset position of the electronic device.

[0007] Optionally, the control mechanism includes a numerical control component and a first drive component electrically connected to the numerical control component, the numerical control component is electrically connected to the interactive component, and the cutting component cooperates with the first drive component; the first drive component includes at least a first drive member, a second drive member and a third drive member whose driving directions are perpendicular to each other.

[0008] Optionally, the cutting component includes at least one of a laser cutting head and a die cutting knife.

[0009] Optionally, the mounting module further includes a pressing mechanism, which is assembled on the frame and cooperates with the laminating film material to provide a laminating force for the laminating film material toward the electronic device.

[0010] Optionally, the pressing mechanism comprises a plane rolling mechanism, and the plane rolling mechanism is matched with a plane matching area of ​​the bonding film material;

[0011] The plane rolling mechanism includes a first roller and a second driving assembly matched with the first roller, and the second driving assembly includes a fourth driving member, a fifth driving member and a sixth driving member whose driving directions are perpendicular to each other.

[0012] Optionally, the pressing mechanism includes a side rolling mechanism, and the side rolling mechanism is matched with the curved surface matching area of ​​the bonding film material.

[0013] Optionally, the pressing mechanism comprises an air pressure pressing mechanism, and the air pressure pressing mechanism is matched with the plane matching area and / or the curved surface matching area of ​​the bonding film material.

[0014] Optionally, the mounting module further includes a cleaning mechanism; an equipment entrance is provided on the frame, and the cleaning mechanism is arranged inside the frame.

[0015] Optionally, the mounting module further includes a light-curing device, which includes a curing light source; the curing light source includes at least one of an ultraviolet lamp, a mercury arc lamp, a flash lamp, a fluorescent lamp, an excimer lamp, a light-emitting diode, and a laser.

[0016] Optionally, the film pasting equipment further includes a detection module assembled on the frame, and a detection range of the detection module covers the mounting module.

[0017] Optionally, the detection module includes a visual detection module and / or an infrared detection module.

[0018] Optionally, the film laminating equipment further includes an operating mechanism cooperating with the laminating film material and / or the original film material, and the operating mechanism includes at least one of a robot, a turntable, a conveyor belt and an assembly line carrier.

[0019] Optionally, the frame includes a material storage rack; the material storage rack is provided with a plurality of first storage positions for placing original film materials.

[0020] Optionally, the film-sticking device further includes an auxiliary function module associated with the interactive component; the auxiliary function module includes at least one of a power bank rental and purchase module and an advertising placement module.

[0021] Optionally, the film-mounting device further comprises a wireless transmission module associated with a background server, and the wireless transmission module is electrically connected to the interactive component, the film material cutting module and the mounting module to obtain working data of the film-mounting device.

[0022] According to a second aspect of the present disclosure, a film laminating device control method is provided, which is applied to any film laminating device described in the first aspect. The method includes:

[0023] Acquire film material data corresponding to the model of the electronic device to be filmed; wherein the film material data includes at least one of the film material area, fillet arc, plane matching area size and curved surface matching area size;

[0024] Control the film material cutting module to cut the original film material to obtain the bonded film material according to the film material data;

[0025] According to the film material data, the positioning mechanism is controlled to cooperate with the laminating film material and / or the electronic device, so that the designated area of ​​the laminating film material is positioned and matched with the preset position of the electronic device; wherein the designated area of ​​the laminating film material includes the plane matching area of ​​the laminating film material, and the preset position of the electronic device includes the plane area of ​​the electronic device;

[0026] The laminating mechanism is controlled to achieve laminating of a designated area of ​​the laminating film material with a preset position of the electronic device.

[0027] Optionally, the mounting module includes a light curing device, and the light curing device includes a pressing mechanism and a curing light source; after controlling the laminating mechanism of the mounting module to achieve lamination of a designated area of ​​the laminating film material with a preset position of the electronic device, the method further includes:

[0028] Controlling the pressing mechanism to achieve the lamination of the designated area of ​​the laminating film material with the preset position of the electronic device; wherein the designated area of ​​the laminating film material includes the curved surface matching area of ​​the laminating film material, and the preset position of the electronic device includes the curved surface area of ​​the electronic device;

[0029] The curing light source is controlled to irradiate the bonding film material so that the bonding film material is cured and bonded to the electronic device.

[0030] Optionally, the film-sticking device includes a power bank rental and purchase module associated with the interactive component; and the method further includes:

[0031] Receiving an interactive instruction related to renting or purchasing a power bank sent by the interactive component;

[0032] The power bank rental and purchase module is controlled to perform related operations according to the interactive instruction.

[0033] Optionally, the film-sticking device includes an advertisement delivery module associated with the interactive component; and the method further includes:

[0034] Determine whether the interactive component is in an operating state, and if not, control the advertisement delivery module to send advertisement information to the interactive component.

[0035] Optionally, the film pasting device includes a wireless transmission module associated with the background server, the wireless transmission module is associated with the interactive component, the film material cutting module and the pasting module, and the method further includes:

[0036] Receiving working data sent by the wireless transmission module; wherein the working data includes fault data sent to the wireless transmission module by at least one of the interactive component, the film material cutting module and the mounting module;

[0037] The working data is sent to a backend server.

[0038] Optionally, the film-sticking device includes a detection module assembled on the frame, and the method further includes:

[0039] Receiving the detection result obtained by the detection module, wherein the detection result includes at least one of the lamination accuracy, lamination effect, and curing effect of the lamination film material;

[0040] It is determined whether the detection result meets the preset standard. If not, the bonding film material is removed to re-bond the electronic device to be bonded.

[0041] According to a third aspect of the present disclosure, a film laminating device control device is provided, which is applied to any film laminating device described in the first aspect, and the device includes:

[0042] An acquisition unit is configured to acquire film material data corresponding to the model of the electronic device to be filmed; wherein the film material data includes at least one of the following: film material area, fillet arc, plane matching area size, and curved surface matching area size;

[0043] A first control unit controls the film material cutting module to cut the original film material to obtain a laminated film material according to the film material data;

[0044] A second control unit controls the positioning mechanism to cooperate with the laminating film material and / or the electronic device according to the film material data, so that the designated area of ​​the laminating film material is positioned and matched with the preset position of the electronic device; wherein the designated area of ​​the laminating film material includes the plane matching area of ​​the laminating film material, and the preset position of the electronic device includes the plane area of ​​the electronic device;

[0045] The third control unit controls the laminating mechanism to achieve lamination of the designated area of ​​the laminating film material with the preset position of the electronic device.

[0046] Optionally, the mounting module includes a light curing device, which includes a pressing mechanism and a curing light source; the device also includes:

[0047] A fourth control unit controls the pressing mechanism to achieve the lamination of the designated area of ​​the laminating film material with the preset position of the electronic device; wherein the designated area of ​​the laminating film material includes the curved surface matching area of ​​the laminating film material, and the preset position of the electronic device includes the curved surface area of ​​the electronic device;

[0048] The fifth control unit controls the curing light source to irradiate the bonding film material so that the bonding film material is cured and bonded to the electronic device.

[0049] Optionally, the film-sticking device includes a power bank rental and purchase module associated with the interactive component; the device also includes:

[0050] A first receiving unit receives an interactive instruction related to renting or purchasing a power bank sent by the interactive component;

[0051] The sixth control unit controls the power bank rental and purchase module to perform related operations according to the interactive instruction.

[0052] Optionally, the film sticking device includes an advertisement delivery module associated with the interactive component; the device also includes:

[0053] The first judgment unit judges whether the interactive component is in an operation state, and if not, controls the advertisement delivery module to send advertisement information to the interactive component.

[0054] Optionally, the film pasting device includes a wireless transmission module associated with the background server, the wireless transmission module is associated with the interactive component, the film material cutting module and the pasting module, and the device further includes:

[0055] A second receiving unit receives working data sent by the wireless transmission module; wherein the working data includes fault data sent to the wireless transmission module by at least one of the interactive component, the film material cutting module and the mounting module;

[0056] The sending unit sends the working data to the background server.

[0057] Optionally, the film-sticking equipment includes a detection module assembled on the frame, and the device further includes:

[0058] a third receiving unit, receiving the detection result obtained by the detection module, wherein the detection result includes at least one of the lamination accuracy, lamination effect, and curing effect of the lamination film material;

[0059] The second judgment unit judges whether the detection result meets the preset standard. If not, the bonding film material is removed to re-bond the electronic device to be bonded.

[0060] According to a fourth aspect of the present disclosure, a computer-readable storage medium is provided, on which computer instructions are stored. When the instructions are executed by a processor, the steps of any film-laminating device control method described in the second aspect are implemented.

[0061] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0062] The film laminating device disclosed in the present invention includes an interactive component, a film material cutting module and a mounting module. The control mechanism of the film material cutting module is electrically connected to the interactive component to control the cutting component to cut the original film material according to the set cutting trajectory to obtain the laminated film material. The positioning mechanism of the mounting module can achieve the matching of the laminated film material and / or the electronic device, so as to cooperate with the laminating mechanism to achieve the positioning and laminating of the designated area of ​​the laminated film material and the preset position of the electronic device. The above structural setting enables the film laminating device to cut and laminate the film material according to the electronic device model to be laminated. During use, the film laminating can be completed by simply confirming the electronic device model to be laminated, which improves the film laminating effect of the electronic device and the convenience of the film laminating operation.

[0063] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0065] Figure 1 is a schematic diagram of the external structure of a film-sticking device in an exemplary embodiment of the present disclosure;

[0066] Figure 2 is a top view of the internal structure of a film sticking device in an exemplary embodiment of the present disclosure;

[0067] Figure 3 It is a schematic diagram of the internal three-dimensional structure of a film sticking device in an exemplary embodiment of the present disclosure;

[0068] Figure 4 It is a three-dimensional structural schematic diagram of a planar rolling mechanism and an electronic device in cooperation with each other in an exemplary embodiment of the present disclosure;

[0069] Figure 5 is a schematic diagram of a three-dimensional structure of a light curing device in an exemplary embodiment of the present disclosure;

[0070] Figure 6It is a structural schematic diagram of a curing light source and an electronic device in an exemplary embodiment of the present disclosure;

[0071] Figure 7 is a schematic diagram of a three-dimensional structure of a light curing device in another exemplary embodiment of the present disclosure;

[0072] Figure 8 is a flow chart of a film sticking equipment control method in an exemplary embodiment of the present disclosure;

[0073] Fig. 9 is a flow chart of a film sticking equipment control method in another exemplary embodiment of the present disclosure;

[0074] Fig.10 is a flow chart of a film sticking equipment control method in another exemplary embodiment of the present disclosure;

[0075] Fig.11 is a structural block diagram of a film sticking equipment control device in an exemplary embodiment of the present disclosure;

[0076] Fig.12 is a structural block diagram of a film sticking equipment control device in an exemplary embodiment of the present disclosure;

[0077] Fig.13 is a structural block diagram of a film sticking equipment control device in an exemplary embodiment of the present disclosure;

[0078] Fig.14 It is a block diagram of a device for controlling a film sticking device according to an exemplary embodiment. DETAILED DESCRIPTION

[0079] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0080] In the related art, in order to prevent the surface of electronic devices such as mobile phones from being rubbed and scratched, users usually choose to stick a protective film on the surface of the electronic device to provide protection for the surface of the electronic device. However, due to the wide variety of electronic devices, it is difficult for users to find automatic film-sticking equipment that is suitable for their own models. In addition, the surface of the electronic device to be filmed itself contains a complex structure of flat and curved surfaces. When manual filming is chosen, it is easy to cause film warping, shedding and other laminating problems, which affects the convenience of film-sticking for electronic device users.

[0081] The present disclosure provides a film pasting device for pasting films on electronic devices. Figure 1 is a schematic diagram of the external structure of a film-sticking device in an exemplary embodiment of the present disclosure; Figure 2 is a top view of the internal structure of a film sticking device in an exemplary embodiment of the present disclosure; Figure 3 It is a schematic diagram of the internal three-dimensional structure of a film-sticking device in an exemplary embodiment of the present disclosure.

[0082] like Figure 1 , Figure 2 , Figure 3 As shown, the film-sticking device 1 includes: a frame 11, an interactive component 12, a film material cutting module 13 and a mounting module 14, and the film material cutting module 13 and the mounting module 14 are assembled on the frame 11. The film material cutting module 13 includes a control mechanism 131 and a cutting component 132, and the cutting component 132 cooperates with the control mechanism 131. The control mechanism 131 is electrically connected to the interactive component 12 to control the cutting component 132 to cut the original film material according to the set cutting track to obtain the bonded film material. Among them, the set cutting track matches the bonding film material corresponding to the model of the electronic device 2 to be filmed. The mounting module 14 includes a positioning mechanism 141 and a bonding mechanism 142, and the positioning mechanism 141 cooperates with the bonding film material and / or the electronic device 2 so that the designated area of ​​the bonding film material is positioned and matched with the preset position of the electronic device 2. Among them, the model of the electronic device 2 to be filmed can be selected according to the user's operation of the interactive component 12, and the model of the electronic device 2 to be filmed can also be automatically identified by the recognition module of the film-sticking device 1.

[0083] In the above embodiment, the film laminating device 1 includes an interactive component 12, a film material cutting module 13 and a mounting module 14. The control mechanism 131 of the film material cutting module 13 is electrically connected to the interactive component 12 to control the cutting component 132 to cut the original film material according to the set cutting trajectory to obtain the laminated film material. The positioning mechanism 141 of the mounting module 14 can achieve the matching of the laminated film material and / or the electronic device 2, so as to cooperate with the laminating mechanism 142 to achieve the positioning and laminating of the designated area of ​​the laminated film material and the preset position of the electronic device 2. The above structural setting enables the film laminating device 1 to cut and laminate the film material according to the model of the electronic device 2 to be laminated. During use, the film laminating can be completed by simply confirming the model of the electronic device 2 to be laminated, which improves the film laminating effect of the electronic device 2 and the convenience of the film laminating operation.

[0084] In some embodiments, the positioning mechanism 141 of the mounting module 14 may include a first positioning structure and a second positioning structure, wherein the electronic device 2 may be assembled to the first positioning structure, and the laminating film may be assembled to the second positioning structure. At least one of the first positioning structure and the second positioning structure may move relative to the frame 11 to adjust the relative position between the preset position of the electronic device 2 and the designated area of ​​the laminating film.

[0085] In other embodiments, the positioning mechanism 141 of the mounting module 14 may include a first positioning structure, the electronic device 2 or the laminating film material is assembled in the first positioning structure, and the first positioning structure can move relative to the frame 11 to adjust the relative position between the preset position of the electronic device 2 and the designated area of ​​the laminating film material. For example, the electronic device 2 is assembled in the first positioning structure, and before the mounting operation is performed, the laminating film material is directly moved to the set position by the operating mechanism 16 such as a manipulator, and the position of the electronic device 2 can be adjusted at this time so that the preset position of the electronic device 2 corresponds to the position of the designated area of ​​the laminating film material.

[0086] The following is an example in which the positioning mechanism 141 includes a first positioning structure and the electronic device 2 is assembled on the first positioning structure to exemplify the structural arrangement of the film sticking device 1:

[0087] In some embodiments, the control mechanism 131 includes a numerical control component 1311 and a first drive component 1312 electrically connected to the numerical control component 1311, the numerical control component 1311 is electrically connected to the interactive component 12, and the cutting component 132 cooperates with the first drive component 1312. The first drive component 1312 at least includes a first drive member 1312a, a second drive member 1312b, and a third drive member 1312c whose driving directions are perpendicular to each other. For example, the first drive component 1312 may include a first drive member 1312a, a second drive member 1312b, and a third drive member 1312c whose driving directions are perpendicular to each other. The numerical control component 1311 is electrically connected to the interactive component 12 to obtain a set cutting trajectory, wherein the set cutting trajectory matches the bonding film material corresponding to the model of the electronic device 2 to be bonded. When the numerical control component 1311 obtains the set cutting trajectory, it can control the first drive component 1312 to drive the cutting component 132 to cut the original film material according to the set cutting trajectory to obtain the bonding film material.

[0088] In some embodiments, the interactive component 12 can be assembled on the frame 11, and the interactive component 12 can be a screen, on which icons of commonly used electronic device 2 models are displayed. The user can directly click on the electronic device 2 model icon that matches his or her electronic device 2 model, or search for his or her own electronic device 2 model through the search box on the screen module to complete the selection.

[0089] It should be noted that the cutting component 132 may include at least one of a laser cutting head and a die cutter. When the cutting component 132 is a laser cutting head, the original film material can be cut by laser. When the cutting component 132 is a die cutter, the original film material can be cut by ordinary cutting tools. For example, the control mechanism 131 may be a three-axis CNC (Computer Numerical Control) processing platform, which can cut the original film material by the movement of the CNC tool along the three directions of X, Y, and Z, which is conducive to the convenience and flexibility of cutting.

[0090] It should be noted that the material of the bonding film material can be PET (Polyethylene terephthalate), which has good hardness, scratch resistance and yield resistance, and can provide good protection for the surface of the electronic device 2. Alternatively, the bonding film layer can also choose other materials with suitable hardness, scratch resistance and yield resistance, and the present disclosure is not limited to this. In addition, the area to be filmed of the electronic device 2 may include a plane area 21 and / or a curved area 22, and the bonding film material matches the size of the area to be filmed of the electronic device 2. When working, the mounting module 14 can cooperate with the plane area 21 and / or the curved area 22 of the electronic device 2 to position and fit the bonding film material with the plane area 21 and / or the curved area 22 of the electronic device 2.

[0091] In some embodiments, Figure 4 As shown, the mounting module 14 also includes a pressing mechanism 151, which is matched with the bonding film material to provide the bonding force for the bonding film material toward the electronic device 2. The above-mentioned pressing mechanism can be a plane rolling mechanism 144 movably assembled on the frame 11. When the mounting module 14 is matched with the electronic device 2, the plane rolling mechanism 144 is matched with the plane matching area of ​​the bonding film material, and the plane matching area of ​​the bonding film material corresponds to the plane area 21 of the electronic device 2. For example, after the positioning mechanism 141 of the mounting module 14 completes the positioning of the plane area 21 of the electronic device 2 and the plane matching area of ​​the bonding film material, the bonding mechanism 142 works to achieve the bonding of the plane matching area of ​​the bonding film material and the plane area 21 of the electronic device 2. After the bonding is completed, the plane rolling mechanism 144 can roll on the plane area 21 of the electronic device 2 with the bonding film material, so as to complete the bonding of the plane area 21 of the electronic device 2 and the plane matching area of ​​the bonding film material by rolling, thereby improving the film bonding effect of the plane area 21 of the electronic device 2.

[0092] In the above embodiment, the plane rolling mechanism 144 may include a first roller 1441 and a second driving assembly 1442 matched with the first roller 1441, and the second driving assembly 1442 includes a fourth driving member 1442a, a fifth driving member 1442b and a sixth driving member 1442c whose driving directions are perpendicular to each other. Among them, the first roller 1441 can contact and roll with the plane matching area of ​​the bonding film material, and the fourth driving member 1442a and the fifth driving member 1442b of the second driving assembly 1442 can drive the first roller 1441 to move in any plane, and the sixth driving member 1442c can adjust the pressure between the first roller 1441 and the bonding film material to avoid pressure damage to the electronic device 2 by the first roller 1441 while ensuring the bonding effect.

[0093] In some embodiments, Figure 5 , Figure 6 , Figure 7 As shown, the mounting module 14 may also include a light-curing device 15, and the light-curing device 15 includes a curing light source 152. The light-curing device 15 can cooperate with the flat area 21 and the curved area 22 of the electronic device 2 during operation, so as to achieve the curing and bonding of the bonding film material and the entire area to be bonded of the electronic device 2 through the light-curing device 15. The pressing mechanism 151 can provide the bonding force of the bonding film material toward the electronic device 2 before or during the light-curing process to enhance the light-curing bonding effect. In addition, the light-curing device 15 may also include a structural component for assembling the curing light source 152 and positioning the electronic device 2.

[0094] It should be noted that the laminating mechanism 151 may include a side rolling mechanism 1511 and / or an air pressure laminating mechanism 1512. Since PET has good yield resistance, the film layer may easily warp when laminating the curved surface area 22 of the electronic device 2. The side rolling mechanism 1511 or the air pressure laminating mechanism 1512 may cooperate with the curved surface area 22 of the electronic device 2 to achieve rolling of the curved surface area 22, improve the curing effect of the light curing process, and avoid problems such as residual bubbles and warping in the film layer.

[0095] When the pressing mechanism 151 includes a side rolling mechanism 1511, as Figure 5 , Figure 6 As shown, the side rolling mechanism 1511 and the curing light source 152 can work simultaneously to achieve curing and bonding of the curved surface area 22 during the rolling process of the side rolling mechanism 1511 on the curved surface area 22. Alternatively, the curing light source 152 can be turned on when the side rolling mechanism 1511 is at a specific position of the curved surface area 22 of the electronic device 2 to achieve curing and bonding of the specific position.

[0096] In the above embodiment, the side rolling mechanism 1511 may include a second roller 1511a matched with the electronic device 2, and the material of the second roller 1511a is a light-transmitting material. When the side rolling mechanism 1511 is matched with the electronic device 2, the second roller 1511a is matched with the curved surface area 22 of the electronic device 2. Taking the case where the curing light source 152 is turned on when the side rolling mechanism 1511 is at a specific position of the curved surface area 22 of the electronic device 2 as an example, the second roller 1511a may be a columnar structure, and the specific position of the curved surface area 22 of the electronic device 2 may include an edge position and a center position. When the side of the columnar structure is matched with the edge position or the center position of the curved surface area 22 of the electronic device 2, the second roller 1511a stops and the curing light source 152 is turned on, so as to realize the curing and bonding of the curved surface area 22 of the electronic device 2 by pressing and curing the specific position. It should be noted that the above-mentioned specific position may be a partial position of the curved surface area 22, or may cover the entire position of the curved surface area 22, and the present disclosure is not limited to this.

[0097] In some embodiments, Figure 7 As shown, the above-mentioned air pressure pressing mechanism 1512 can be an air pressure pressing mechanism 1512 based on the positive pressure principle, or it can be an air pressure pressing mechanism 1512 based on the negative pressure principle. When the air pressure pressing mechanism 1512 is an air pressure pressing mechanism 1512 based on the positive pressure principle, the air pressure pressing mechanism 1512 can include a blowing device to apply positive pressure to the curved surface area 22 of the electronic device 2 with the bonding film material through the blowing device, so that the bonding film material completes the bonding with the curved surface area 22 of the electronic device 2. When the air pressure pressing mechanism 1512 is an air pressure combination mechanism based on the negative pressure principle, the air pressure pressing mechanism 1512 can include a vacuum suction device to apply negative pressure to the curved surface area 22 of the electronic device 2 with the bonding film material through the vacuum suction device, so that the bonding film material completes the bonding with the curved surface area 22 of the electronic device 2.

[0098] It should be noted that the curing light source 152 may include at least one of an ultraviolet lamp, a mercury arc lamp, a flash lamp, a fluorescent lamp, an excimer lamp, a light emitting diode, and a laser. For example, when the curing light source 152 is an ultraviolet lamp, ultraviolet light of a certain wavelength may be used to illuminate the film layer so that the film layer material is cured due to the polymerization of the resin. The ultraviolet lamp may be an electrodeless microwave-driven UV (Ultraviolet) lamp.

[0099] In some embodiments, the mounting module 14 may further include a cleaning mechanism 143. An equipment entrance 111 is provided on the frame 11, and the cleaning mechanism 143 is arranged inside the frame 11, and the cleaning mechanism 143 is close to the equipment entrance 111, so that when the electronic device 2 enters the film-sticking device 1 through the equipment entrance 111, the electronic device 2 can be cleaned first to prevent the surface of the electronic device 2 from being dirty and affecting the subsequent film-sticking effect. Among them, the cleaning mechanism 143 may include a film tearing assembly and a cleaning cloth assembly, and the film tearing assembly can tear off the original old film on the surface of the electronic device 2, and the cleaning cloth assembly can automatically wipe and clean the surface of the electronic device 2. Alternatively, in other embodiments, the cleaning mechanism 143 may include a cleaning cloth supply assembly to provide a cleaning cloth to the user through a preset opening 112 on the frame 11, so that the user can self-clean the electronic device 2.

[0100] In some embodiments, the film laminating equipment 1 may further include an operating mechanism 16 that cooperates with the laminating film material and / or the original film material, and the operating mechanism 16 includes at least one of a robot, a turntable, a conveyor belt, and an assembly line carrier.

[0101] In one embodiment, the frame 11 includes a storage rack 113, and the storage rack 113 is provided with a plurality of first storage positions 1131 for placing the original film material. Taking the operating mechanism 16 as a manipulator as an example, the manipulator can take the original film material from the first storage position 1131, and operate it to the film material cutting module 13 to complete the cutting of the original film material to obtain the bonded film material. The manipulator can also operate the bonded film material from the film material cutting module 13 to the film tearing position to complete the separation of the film layer of the bonded film material and the release paper, and then operate the bonded film material after the film tearing to the bonding position through the manipulator to achieve the bonding of the bonded film material and the electronic device 2.

[0102] In some embodiments, the film laminating device 1 may further include a detection module (not marked) assembled on the frame 11, and the detection range of the detection module covers the mounting module 14. The detection module covers the mounting module 14, so that it can detect the positioning and laminating position accuracy and laminating effect of the laminating film material and the electronic device 2, and can also detect the cleaning effect of the cleaning mechanism 143 and the light-curing bonding effect of the light-curing device 15. When the above-mentioned laminating position accuracy, laminating effect, cleaning effect and light-curing bonding effect do not meet the preset conditions, the detection module can feedback the detection results so that the film laminating device 1 can re-perform the film laminating operation on the electronic device 2.

[0103] It should be noted that the detection module may include a visual detection module and / or an infrared detection module. The time detection module may detect the working process of the film sticking device 1 by image detection; the infrared detection module may detect the working process of the film sticking device 1 by infrared light detection.

[0104] In some embodiments, the film-sticking device 1 may further include an auxiliary function module (not marked) associated with the interactive component 12, and the auxiliary function module includes at least one of a power bank rental and purchase module and an advertising module. When the auxiliary function module includes a power bank rental and purchase module, the rack 11 may include a storage rack 113, and the storage rack 113 is provided with a plurality of second storage positions 1132 for placing power banks. The user can select the power bank to be rented or purchased through the interactive component 12 and form an interactive instruction, and the power bank rental and purchase module can be controlled to take out the power bank to the user through the device outlet on the rack 11 according to the interactive instruction.

[0105] In one embodiment, the interactive component 12 may be a screen, which may display a power bank selection interface and a corresponding payment interface. When the user completes the power bank selection and the corresponding rental payment or purchase payment, the power bank rental and purchase module may be controlled to take out the power bank to the user through the device outlet on the rack 11 according to the interactive instruction.

[0106] In another embodiment, the interactive component 12 may be a screen. When the auxiliary function module includes an advertising module, the user may watch the video advertising content on the screen, or may touch the screen to stop playing the advertisement and jump to the electronic device 2 film model selection interface or the power bank rental and purchase interface. It should be noted that the screen may also automatically jump to play the video advertising content within a preset time after the user completes the film application or the power bank rental and purchase.

[0107] In some embodiments, the film laminating device 1 may further include a wireless transmission module (not labeled) associated with the background server, and the wireless transmission module is electrically connected to the interactive component 12, the film material cutting module 13, and the mounting module 14 to obtain the working data of the film laminating device 1. The above working data may include user refund data, complaint data, data on failures of the interactive component 12, the film material cutting module 13, and the mounting module 14 of the film laminating device 1, etc. The wireless transmission module may transmit the above working data to the background server so that the technicians can repair and optimize the film laminating device 1.

[0108] It should be noted that the electronic device 2 may be a mobile phone, a wearable device, a tablet computer, a television, an advertising screen, a vehicle terminal, a medical terminal, etc., and the present disclosure does not limit this. The area to be film-coated of the electronic device 2 may be a screen module area of ​​the electronic device 2, or may be other areas of the electronic device 2 that require film-coating, and the present disclosure does not limit this.

[0109] The present disclosure further proposes a film pasting equipment control method, which is applied to the above-mentioned film pasting equipment. Figure 8 is a flow chart of a film sticking device control in an exemplary embodiment of the present disclosure, such as Figure 8As shown, the above method can be implemented by the following steps:

[0110] In step S801, the film material data corresponding to the electronic device model to be filmed is obtained; wherein the film material data includes at least one of the film material area, fillet radian, plane matching area size and curved surface matching area size.

[0111] Among them, the model of the electronic device 2 to be filmed can be selected according to the user operation interaction component 12, or the model of the electronic device 2 to be filmed can be automatically identified by the identification module of the film-pasting device 1. The film-pasting device stores a variety of electronic device models and film material data corresponding to the various electronic device models. According to the shape, structure and size of the surface of the electronic device to be filmed, the film material data may include at least one of the film material area, fillet radian, plane matching area size and curved surface matching area size. The original film material can be processed through the film material data to obtain a film material that matches the model of the electronic device to be filmed.

[0112] After the electronic device model is to be film-laminated, the film-laminated device can control the interactive component to jump to the payment interface corresponding to the electronic device model, so as to carry out subsequent processes such as film material cutting and film laminating after the user completes the payment.

[0113] In step S802, the film material cutting module is controlled according to the film material data to cut the original film material to obtain the bonded film material.

[0114] The film material cutting module may include a control mechanism and a cutting component, the cutting component cooperates with the control mechanism, and the control mechanism is electrically connected to the interactive component to control the cutting component to cut the original film material according to the set cutting track to obtain the laminated film material. The set cutting track matches the laminated film material corresponding to the electronic device model to be laminated.

[0115] In step S803, the positioning mechanism is controlled to cooperate with the bonding film material and / or the electronic device according to the film material data, so that the designated area of ​​the bonding film material is positioned and matched with the preset position of the electronic device; wherein the designated area of ​​the bonding film material includes the planar matching area of ​​the bonding film material, and the preset position of the electronic device includes the planar area of ​​the electronic device.

[0116] In step S804, the laminating mechanism is controlled to achieve lamination of the designated area of ​​the laminating film material with the preset position of the electronic device.

[0117] For example, the position of the electronic device can be adjusted by the positioning mechanism so that the preset position of the electronic device is positioned and matched with the designated area of ​​the bonding film material to ensure the bonding accuracy of the bonding film material. Taking the example that the area to be filmed of the electronic device includes a flat area and a curved area, the bonding film material includes a flat matching area that matches the structural size of the flat area, and a curved matching area that matches the structural size of the curved area. In the bonding process of the bonding film material and the electronic device, the positioning mechanism and the bonding mechanism can be used to first position and fit the flat matching area of ​​the bonding film material with the flat area of ​​the electronic device to achieve preliminary positioning and matching of the bonding film material and the electronic device. The curved matching area of ​​the bonding film material and the curved area of ​​the electronic device can be bonded and fixed in the subsequent photocuring process.

[0118] It should be noted that the film pasting device can control the interactive components or other visual windows to display the film pasting progress, so as to let the user know the film pasting progress and improve the user experience.

[0119] In the above embodiment, since the film laminating device can control the cutting component to cut the original film material according to the set cutting trajectory to obtain the laminated film material, the positioning mechanism of the mounting module can achieve the cooperation of the laminated film material and / or the electronic device, so as to cooperate with the laminating mechanism to achieve the positioning and laminating of the designated area of ​​the laminated film material and the preset position of the electronic device. The above structural setting enables the film laminating device to cut and laminate the film material according to the model of the electronic device to be laminated. During use, the user only needs to select the model of the electronic device to be laminated or identify the model of the electronic device to be laminated through the film laminating device to complete the laminating, which improves the film laminating effect of the electronic device and the convenience of the film laminating operation.

[0120] In some embodiments, the mounting module includes a light-curing device, which includes a pressing mechanism and a curing light source. Fig. 9 FIG. 1 is a flow chart of a film sticking equipment control method in another exemplary embodiment of the present disclosure. Fig. 9 As shown, the above method can be implemented by the following steps:

[0121] In step S901, the film material data corresponding to the electronic device model to be filmed is obtained; wherein the film material data includes at least one of the film material area, fillet radian, plane matching area size and curved surface matching area size.

[0122] Among them, the model of the electronic device 2 to be filmed can be selected according to the user operation interaction component 12, or the model of the electronic device 2 to be filmed can be automatically identified by the identification module of the film-pasting device 1. The film-pasting device stores a variety of electronic device models and film material data corresponding to the various electronic device models. According to the shape, structure and size of the surface of the electronic device to be filmed, the film material data may include at least one of the film material area, fillet radian, plane matching area size and curved surface matching area size. The original film material can be processed through the film material data to obtain a film material that matches the model of the electronic device to be filmed.

[0123] In step S902, the film material cutting module is controlled according to the film material data to cut the original film material to obtain the bonded film material.

[0124] The film material cutting module may include a control mechanism and a cutting component, the cutting component cooperates with the control mechanism, and the control mechanism is electrically connected to the interactive component to control the cutting component to cut the original film material according to the set cutting track to obtain the laminated film material. The set cutting track matches the laminated film material corresponding to the electronic device model to be laminated.

[0125] In step S903, the positioning mechanism is controlled to cooperate with the bonding film material and / or the electronic device according to the film material data so that the designated area of ​​the bonding film material is positioned and matched with the preset position of the electronic device; wherein the designated area of ​​the bonding film material includes the planar matching area of ​​the bonding film material, and the preset position of the electronic device includes the planar area of ​​the electronic device.

[0126] In step S904, the laminating mechanism is controlled to achieve lamination of the designated area of ​​the laminating film material with the preset position of the electronic device.

[0127] In step S905, the laminating mechanism is controlled to achieve lamination of the designated area of ​​the laminating film material with the preset position of the electronic device, wherein the designated area of ​​the laminating film material includes the curved surface matching area of ​​the laminating film material, and the preset position of the electronic device includes the curved surface area of ​​the electronic device.

[0128] For example, the position of the electronic device can be adjusted by the positioning mechanism so that the preset position of the electronic device is positioned and matched with the designated area of ​​the bonding film material to ensure the bonding accuracy of the bonding film material. For example, the area to be film-bonded of the electronic device includes a flat area and a curved area, and the bonding film material includes a flat matching area that matches the structural dimensions of the flat area, and a curved matching area that matches the structural dimensions of the curved area. In the bonding process of the bonding film material and the electronic device, the positioning mechanism and the bonding mechanism can be used to first position and bond the flat matching area of ​​the bonding film material with the flat area of ​​the electronic device to achieve preliminary positioning and matching of the bonding film material and the electronic device.

[0129] The bonding of the designated area of ​​the bonding film material and the preset position of the electronic device by the pressing mechanism can improve the curing and bonding effect of the light curing process. After the flat matching area of ​​the bonding film material and the flat area of ​​the electronic device are positioned and bonded, the curved matching area of ​​the bonding film material and the curved area of ​​the electronic device can be positioned and bonded by the pressing mechanism, providing a good curing matching foundation for the subsequent light curing process.

[0130] In step S906, the curing light source is controlled to irradiate the bonding film material so that the bonding film material and the electronic device are cured and bonded.

[0131] In some embodiments, the film-sticking device includes a power bank rental and purchase module associated with the interactive component. Fig.10 FIG. 1 is a flow chart of a film sticking equipment control method in another exemplary embodiment of the present disclosure. Fig.10 As shown, the above method can also be implemented by the following steps:

[0132] In step S1001, an interaction instruction related to renting or purchasing a power bank is received from an interaction component.

[0133] In step S1002, the power bank rental and purchase module is controlled to perform related operations according to the interactive instruction.

[0134] The user can select the power bank that needs to be rented or purchased and form an interactive instruction through the interactive component, and the power bank rental and purchase module can be controlled to take the power bank out to the user through the equipment outlet on the rack according to the interactive instruction.

[0135] In one embodiment, the interactive component may be a screen, which may display a power bank selection interface and a corresponding payment interface. When the user completes the power bank selection and the corresponding rental payment or purchase payment, the power bank rental and purchase module may be controlled to take out the power bank to the user through the device outlet on the rack according to the interactive instruction.

[0136] In the above embodiment, the film pasting device may further include an advertisement delivery module associated with the interactive component. The control method of the film pasting device may further include: determining whether the interactive component is in an operating state, and if not, controlling the advertisement delivery module to send advertisement information to the interactive component.

[0137] In one embodiment, the interactive component may be a screen, and the user may watch the video advertisement content on the screen, or may touch the screen to stop playing the advertisement and jump to the electronic device film model selection interface or the power bank rental and purchase interface. It should be noted that the screen may also automatically jump to play the video advertisement content within a preset time after the user completes the film application or the power bank rental and purchase.

[0138] In some embodiments, the film laminating equipment may include a detection module assembled on a frame, and the control method of the film laminating equipment may further include: receiving the detection result obtained by the detection module, wherein the detection result includes at least one of the laminating accuracy, laminating effect, and curing effect of the laminating film material. Determine whether the detection result meets the preset standard, if not, remove the laminating film material to re-laminate the electronic device to be laminar. If the detection result meets the preset standard, the electronic device that has completed laminating is returned to the user through the equipment outlet on the frame. It should be noted that the above-mentioned steps of re-laminating the electronic device to be laminar can refer to Figure 8-Figure 10 The film sticking control method described in the embodiment will not be described in detail here.

[0139] In the above embodiment, the film laminating device may further include a wireless transmission module associated with the background server, and the wireless transmission module is associated with the interactive component, the film material cutting module, and the mounting module. The film laminating device control method may further include: receiving working data sent by the wireless transmission module, and sending the working data to the background server. The working data includes fault data sent to the wireless transmission module by at least one of the interactive component, the film material cutting module, and the mounting module.

[0140] The present disclosure further proposes a film pasting equipment control device, which is applied to the above-mentioned film pasting equipment. Fig.11 1 is a structural block diagram of a film laminating equipment control device in an exemplary embodiment of the present disclosure. Fig.11 As shown, the film sticking equipment control device 110 includes: an acquisition unit 1101, a first control unit 1102, a second control unit 1103 and a third control unit 1104. Among them:

[0141] The acquisition unit 1101 is configured to acquire the film material data corresponding to the electronic device model to be filmed, wherein the film material data includes at least one of the film material area, fillet arc, plane matching area size and curved surface matching area size.

[0142] The first control unit 1102 is configured to control the film material cutting module to cut the original film material to obtain the bonded film material according to the film material data.

[0143] The second control unit 1103 is configured to control the positioning mechanism to cooperate with the laminating film material and / or the electronic device according to the film material data, so that the designated area of ​​the laminating film material is positioned and matched with the preset position of the electronic device. The designated area of ​​the laminating film material includes the plane matching area of ​​the laminating film material, and the preset position of the electronic device includes the plane area of ​​the electronic device.

[0144] The third control unit 1104 is configured to control the laminating mechanism to achieve lamination of a designated area of ​​the laminating film material with a preset position of the electronic device.

[0145] In some embodiments, the mounting module includes a light-curing device, which includes a pressing mechanism and a curing light source. Fig.12 FIG. 1 is a structural block diagram of a film sticking equipment control device in another exemplary embodiment of the present disclosure. Fig.12 As shown, the film sticking equipment control device 110 also includes: a fourth control unit 1105 and a fifth control unit 1106. Among them:

[0146] The fourth control unit 1105 is configured to control the laminating mechanism to achieve lamination of the designated area of ​​the laminating film material with the preset position of the electronic device, wherein the designated area of ​​the laminating film material includes the curved surface matching area of ​​the laminating film material, and the preset position of the electronic device includes the curved surface area of ​​the electronic device.

[0147] The fifth control unit 1106 is configured to control the curing light source to irradiate the bonding film material so that the bonding film material is cured and bonded to the electronic device.

[0148] In some embodiments, the film-sticking device includes a power bank rental and purchase module associated with the interactive component. Fig.13 FIG. 1 is a structural block diagram of a film sticking equipment control device in another exemplary embodiment of the present disclosure. Fig.13 As shown, the film sticking equipment control device 110 includes: a first receiving unit 1107 and a sixth control unit 1108. Among them:

[0149] The first receiving unit 1107 is configured to receive an interactive instruction related to renting or purchasing a power bank sent by the interactive component;

[0150] The sixth control unit 1108 is configured to control the power bank rental and purchase module to perform related operations according to the interactive instruction.

[0151] In the above embodiment, the film pasting device includes an advertisement delivery module associated with the interactive component. The above film pasting device control device may also include: a first judgment unit. The first judgment unit is configured to judge whether the interactive component is in an operating state, and if not, control the advertisement delivery module to send advertisement information to the interactive component.

[0152] In the above embodiment, the film pasting equipment includes a wireless transmission module associated with the background server, and the wireless transmission module is associated with the interactive component, the film material cutting module and the mounting module. The above film pasting equipment control device may also include: a second receiving unit and a sending unit. The second receiving unit is configured to receive working data sent by the wireless transmission module. The working data includes fault data sent to the wireless transmission module by at least one of the interactive component, the film material cutting module and the mounting module. The sending unit is configured to send the working data to the background server.

[0153] In some embodiments, the film pasting equipment may include a detection module assembled on a frame, and the control device of the film pasting equipment may further include: a third receiving unit and a second judgment unit. The third receiving unit is configured to receive the detection result obtained by the detection module, wherein the detection result includes at least one of the laminating accuracy, laminating effect, and curing effect of the laminating film material. The second judgment unit is configured to determine whether the detection result meets the preset standard, if not, remove the laminating film material to re-film the electronic device to be filmed. If the detection result meets the preset standard, the electronic device that has completed the film pasting is returned to the user through the equipment outlet on the frame.

[0154] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0155] For the device embodiments, since they basically correspond to the method embodiments, the relevant parts can refer to the partial description of the method embodiments. The device embodiments described above are only schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the disclosed solution. A person of ordinary skill in the art can understand and implement it without paying any creative work.

[0156] Accordingly, the present disclosure further provides a device for controlling a film laminating device, comprising: a processor; a memory for storing instructions executable by the processor; wherein the processor is configured to:

[0157] Obtain film material data corresponding to the model of the electronic device to be filmed; wherein the film material data includes at least one of the film material area, fillet radian, plane matching area size and curved surface matching area size.

[0158] The film material cutting module is controlled according to the film material data to cut the original film material to obtain the laminated film material.

[0159] The positioning mechanism is controlled to cooperate with the bonding film material and / or the electronic device according to the film material data so that the designated area of ​​the bonding film material is positioned and matched with the preset position of the electronic device; wherein the designated area of ​​the bonding film material includes the planar matching area of ​​the bonding film material, and the preset position of the electronic device includes the planar area of ​​the electronic device.

[0160] The laminating mechanism is controlled to achieve laminating of a designated area of ​​the laminating film material with a preset position of the electronic device.

[0161] Accordingly, the present disclosure further provides a terminal, the terminal comprising a memory and one or more programs, wherein the one or more programs are stored in the memory and are configured to be executed by one or more processors, wherein the one or more programs include instructions for performing the following operations:

[0162] Obtain film material data corresponding to the model of the electronic device to be filmed; wherein the film material data includes at least one of the film material area, fillet radian, plane matching area size and curved surface matching area size.

[0163] The film material cutting module is controlled according to the film material data to cut the original film material to obtain the laminated film material.

[0164] The positioning mechanism is controlled to cooperate with the bonding film material and / or the electronic device according to the film material data so that the designated area of ​​the bonding film material is positioned and matched with the preset position of the electronic device; wherein the designated area of ​​the bonding film material includes the planar matching area of ​​the bonding film material, and the preset position of the electronic device includes the planar area of ​​the electronic device.

[0165] The laminating mechanism is controlled to achieve laminating of a designated area of ​​the laminating film material with a preset position of the electronic device.

[0166] Fig.14 1400 is a block diagram of a device for controlling a film-sticking device according to an exemplary embodiment. For example, the device 1400 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0167] Reference Fig.14 , the device 1400 may include one or more of the following components: a processing component 1402 , a memory 1404 , a power component 1406 , a multimedia component 1408 , an audio component 1410 , an input / output (I / O) interface 1412 , a sensor component 1414 , and a communication component 1416 .

[0168] The processing component 1402 generally controls the overall operation of the device 1400, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 1402 may include one or more processors 1420 to execute instructions to perform all or part of the steps of the above-described method. In addition, the processing component 1402 may include one or more modules to facilitate the interaction between the processing component 1402 and other components. For example, the processing component 1402 may include a multimedia module to facilitate the interaction between the multimedia component 1408 and the processing component 1402.

[0169] The memory 1404 is configured to store various types of data to support operations on the device 1400. Examples of such data include instructions for any application or method operating on the device 1400, contact data, phone book data, messages, pictures, videos, etc. The memory 1404 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0170] The power supply component 1406 provides power to the various components of the device 1400. The power supply component 1406 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the device 1400.

[0171] The multimedia component 1408 includes a screen that provides an output interface between the device 1400 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 1408 includes a front camera and / or a rear camera. When the device 1400 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera may receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

[0172] The audio component 1410 is configured to output and / or input audio signals. For example, the audio component 1410 includes a microphone (MIC), and when the device 1400 is in an operating mode, such as a call mode, a recording mode, and a speech recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 1404 or sent via the communication component 1416. In some embodiments, the audio component 1410 also includes a speaker for outputting audio signals.

[0173] I / O interface 1412 provides an interface between processing component 1402 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: home button, volume button, start button, and lock button.

[0174] The sensor assembly 1414 includes one or more sensors for providing various aspects of the status assessment of the device 1400. For example, the sensor assembly 1414 can detect the open / closed state of the device 1400, the relative positioning of components, such as the display and keypad of the device 1400, the sensor assembly 1414 can also detect the position change of the device 1400 or a component of the device 1400, the presence or absence of user contact with the device 1400, the orientation or acceleration / deceleration of the device 1400, and the temperature change of the device 1400. The sensor assembly 1414 can include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 1414 can also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 1414 can also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0175] The communication component 1416 is configured to facilitate wired or wireless communication between the device 1400 and other devices. The device 1400 can access a wireless network based on a communication standard, such as WiFi, 2G or 14G, 4G LTE, 5G NR, or a combination thereof. In an exemplary embodiment, the communication component 1416 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 1416 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0176] In an exemplary embodiment, the device 1400 can be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors or other electronic components to perform the above methods.

[0177] The present disclosure further proposes a computer-readable storage medium having computer instructions stored thereon, which, when executed by a processor, implement the steps of the above-mentioned film-mounting device control method. In an exemplary embodiment, a non-temporary computer-readable storage medium including instructions is also provided, such as a memory 1404 including instructions, and the above-mentioned instructions can be executed by a processor 1420 of the device 1400 to complete the above-mentioned film-mounting device control method. For example, the non-temporary computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.

[0178] Those skilled in the art will readily come up with other embodiments of the present disclosure after considering the specification and practicing the technical solutions disclosed herein. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or customary technical means in the art that are not disclosed in the present disclosure. The description and examples are to be regarded as exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0179] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A film laminating device, characterized in that: Used for film pasting of electronic equipment; the film pasting equipment comprises: a frame, an interactive component, a film material cutting module and a mounting module, and the film material cutting module and the mounting module are assembled on the frame; The film material cutting module includes a control mechanism and a cutting component; the cutting component cooperates with the control mechanism, and the control mechanism is electrically connected to the interactive component to control the cutting component to cut the original film material according to the set cutting track to obtain the bonded film material; wherein the set cutting track matches the bonded film material corresponding to the electronic device model to be bonded; The mounting module includes a positioning mechanism and a bonding mechanism, wherein the positioning mechanism is matched with the bonding film material and / or the electronic device so that a designated area of ​​the bonding film material is positioned and matched with a preset position of the electronic device; the mounting module also includes a pressing mechanism, which is assembled on the frame and matched with the bonding film material to provide a bonding force for the bonding film material toward the electronic device; The laminating mechanism comprises a plane rolling mechanism, and the plane rolling mechanism is matched with the plane matching area of ​​the laminating film material; the plane rolling mechanism comprises a first roller and a second driving component matched with the first roller, and the second driving component comprises a fourth driving member, a fifth driving member and a sixth driving member whose driving directions are perpendicular to each other; The lamination mechanism includes a side rolling mechanism, and the side rolling mechanism is matched with the curved surface matching area of ​​the laminating film material; The pressing mechanism comprises an air pressure pressing mechanism, and the air pressure pressing mechanism is matched with the plane matching area and / or the curved surface matching area of ​​the bonding film material.

2. The film laminating device according to claim 1, characterized in that: The control mechanism includes a numerical control component and a first drive component electrically connected to the numerical control component, the numerical control component is electrically connected to the interactive component, and the cutting component cooperates with the first drive component; the first drive component at least includes a first drive member, a second drive member and a third drive member whose driving directions are perpendicular to each other.

3. The film sticking equipment according to claim 1, characterized in that: The cutting component includes at least one of a laser cutting head and a die cutting knife.

4. The film laminating device according to claim 1, characterized in that: The mounting module also includes a cleaning mechanism; an equipment entrance is provided on the frame, and the cleaning mechanism is arranged inside the frame.

5. The film sticking equipment according to claim 1, characterized in that: The mounting module also includes a light curing device, which includes a curing light source; the curing light source includes at least one of an ultraviolet lamp, a mercury arc lamp, a flash lamp, a fluorescent lamp, an excimer lamp, a light emitting diode, and a laser.

6. The film laminating device according to claim 1, characterized in that: It also includes a detection module assembled on the frame, and the detection range of the detection module covers the mounting module.

7. The film sticking equipment according to claim 6, characterized in that: The detection module includes a visual detection module and / or an infrared detection module.

8. The film sticking equipment according to claim 1, characterized in that: It also includes an operating mechanism that cooperates with the laminating film material and / or the original film material, and the operating mechanism includes at least one of a robot, a turntable, a conveyor belt and an assembly line carrier.

9. The film sticking equipment according to claim 1, characterized in that: The frame comprises a material storage rack; the material storage rack is provided with a plurality of first material storage positions for placing original film materials.

10. The film laminating device according to claim 1, characterized in that: It also includes an auxiliary function module associated with the interactive component; the auxiliary function module includes at least one of a power bank rental and purchase module and an advertising module.

11. The film laminating device according to claim 1, characterized in that: It also includes a wireless transmission module associated with the background server, and the wireless transmission module is electrically connected to the interactive component, the film material cutting module and the mounting module to obtain the working data of the film mounting equipment.

12. A film laminating equipment control method, characterized in that: Applied to the film attaching device according to any one of claims 1 to 11, the method comprises: Acquire film material data corresponding to the model of the electronic device to be filmed; wherein the film material data includes at least one of the film material area, fillet arc, plane matching area size and curved surface matching area size; Control the film material cutting module to cut the original film material to obtain the bonded film material according to the film material data; According to the film material data, the positioning mechanism is controlled to cooperate with the laminating film material and / or the electronic device, so that the designated area of ​​the laminating film material is positioned and matched with the preset position of the electronic device; wherein the designated area of ​​the laminating film material includes the plane matching area of ​​the laminating film material, and the preset position of the electronic device includes the plane area of ​​the electronic device; The laminating mechanism is controlled to achieve laminating of a designated area of ​​the laminating film material with a preset position of the electronic device.

13. The film laminating equipment control method according to claim 12, characterized in that: The mounting module includes a light curing device, and the light curing device includes a pressing mechanism and a curing light source; after controlling the laminating mechanism of the mounting module to achieve lamination of the designated area of ​​the laminating film material with the preset position of the electronic device, the method further includes: Controlling the pressing mechanism to achieve the lamination of the designated area of ​​the laminating film material with the preset position of the electronic device; wherein the designated area of ​​the laminating film material includes the curved surface matching area of ​​the laminating film material, and the preset position of the electronic device includes the curved surface area of ​​the electronic device; The curing light source is controlled to irradiate the bonding film material so that the bonding film material is cured and bonded to the electronic device.

14. The film laminating equipment control method according to claim 12, characterized in that: The film-sticking device includes a power bank rental and purchase module associated with the interactive component; the method also includes: Receiving an interactive instruction related to renting or purchasing a power bank sent by the interactive component; The power bank rental and purchase module is controlled to perform related operations according to the interactive instruction.

15. The film laminating equipment control method according to claim 12, characterized in that: The film sticking device includes an advertisement delivery module associated with the interactive component; and the method further includes: Determine whether the interactive component is in an operating state, and if not, control the advertisement delivery module to send advertisement information to the interactive component.

16. The film laminating equipment control method according to claim 12, characterized in that: The film pasting device includes a wireless transmission module associated with a background server, and the wireless transmission module is associated with the interactive component, the film material cutting module and the pasting module. The method further includes: Receiving working data sent by the wireless transmission module; wherein the working data includes fault data sent to the wireless transmission module by at least one of the interactive component, the film material cutting module and the mounting module; The working data is sent to a backend server.

17. The film laminating equipment control method according to claim 12, characterized in that: The film pasting device includes a detection module assembled on the frame, and the method further includes: Receiving the detection result obtained by the detection module, wherein the detection result includes at least one of the lamination accuracy, lamination effect, and curing effect of the lamination film material; It is determined whether the detection result meets the preset standard. If not, the bonding film material is removed to re-bond the electronic device to be bonded.

18. A film laminating equipment control device, characterized in that: Applicable to the film laminating device according to any one of claims 1 to 11, the device comprising: An acquisition unit is configured to acquire film material data corresponding to the model of the electronic device to be filmed; wherein the film material data includes at least one of the following: film material area, fillet arc, plane matching area size, and curved surface matching area size; A first control unit controls the film material cutting module to cut the original film material to obtain a laminated film material according to the film material data; A second control unit controls the positioning mechanism to cooperate with the laminating film material and / or the electronic device according to the film material data, so that the designated area of ​​the laminating film material is positioned and matched with the preset position of the electronic device; wherein the designated area of ​​the laminating film material includes the plane matching area of ​​the laminating film material, and the preset position of the electronic device includes the plane area of ​​the electronic device; The third control unit controls the laminating mechanism to achieve lamination of the designated area of ​​the laminating film material with the preset position of the electronic device.

19. The film sticking equipment control device according to claim 18, characterized in that: The mounting module includes a light curing device, which includes a pressing mechanism and a curing light source; the device also includes: A fourth control unit controls the pressing mechanism to achieve the lamination of the designated area of ​​the laminating film material with the preset position of the electronic device; wherein the designated area of ​​the laminating film material includes the curved surface matching area of ​​the laminating film material, and the preset position of the electronic device includes the curved surface area of ​​the electronic device; The fifth control unit controls the curing light source to irradiate the bonding film material so that the bonding film material is cured and bonded to the electronic device.

20. The film sticking equipment control device according to claim 18, characterized in that: The film sticking device includes a power bank rental and purchase module associated with the interactive component; the device also includes: A first receiving unit receives an interactive instruction related to renting or purchasing a power bank sent by the interactive component; The sixth control unit controls the power bank rental and purchase module to perform related operations according to the interactive instruction.

21. The film sticking equipment control device according to claim 18, characterized in that: The film sticking device includes an advertising delivery module associated with the interactive component; the device also includes: The first judgment unit judges whether the interactive component is in an operation state, and if not, controls the advertisement delivery module to send advertisement information to the interactive component.

22. The film sticking equipment control device according to claim 18, characterized in that: The film pasting device includes a wireless transmission module associated with a background server, the wireless transmission module is associated with the interactive component, the film material cutting module and the pasting module, and the device also includes: A second receiving unit receives working data sent by the wireless transmission module; wherein the working data includes fault data sent to the wireless transmission module by at least one of the interactive component, the film material cutting module and the mounting module; The sending unit sends the working data to the background server.

23. The film sticking equipment control device according to claim 18, characterized in that: The film pasting equipment includes a detection module assembled on the frame, and the device also includes: a third receiving unit, receiving the detection result obtained by the detection module, wherein the detection result includes at least one of the lamination accuracy, lamination effect, and curing effect of the lamination film material; The second judgment unit judges whether the detection result meets the preset standard. If not, the bonding film material is removed to re-bond the electronic device to be bonded.

24. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the instruction is executed by the processor, it implements: the steps of the film-sticking equipment control method as described in any one of claims 12-17.

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