Substrate suction holding structure and substrate transfer robot

Abstract

A substrate suction holding structure (100) includes: a gasket body (40) having a ring-shaped contact portion (41) and a bottom wall portion (43) that closes a bottom surface (65) of a first vacuum chamber (42) surrounded by the contact portion, and the gasket body (40) has electrical conductivity; a pallet body (3) having an upper surface and a second vacuum chamber (30) formed by recessing the upper surface, and the pallet body has electrical conductivity; a support (44) provided in either one of the second vacuum chamber or the gasket body, supporting the contact portion of the gasket body at a position above the second vacuum chamber and above the upper surface of the pallet body, and the support has electrical conductivity; a cover (7) fixed to the pallet body and covering the second vacuum chamber; and a suction passage (10) extending from the first vacuum chamber, passing through the bottom wall portion of the gasket body, the second vacuum chamber, and the pallet body in this order, and connected to a vacuum source (8).

Description

Technical Field

[0001] This invention relates to a substrate attraction and holding structure and a substrate handling robot. Background Technology

[0002] Conventionally, substrate attraction and holding structures for attracting and holding substrates such as wafers are known. For example, the attraction and holding device shown in Patent Document 1 has an attraction and holding member for vacuum attraction of the object to be held, i.e., a wafer. A contact portion is formed in the attraction and holding member to contact the wafer, and a vacuum channel is opened inside the contact portion. Thus, the wafer can be held by vacuum attraction. In addition, the upper surface of the contact portion and the attraction and holding member is coated with an electrostatic diffusion film, which can prevent the wafer and the attraction and holding member from becoming charged.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2004-186355

[0004] However, if there is a warped wafer, even if the suction and holding device described in Patent Document 1 is used to vacuum-adsorb such a warped wafer, there is a situation where vacuum adsorption of the wafer cannot be performed due to the gap between the adsorption and holding component and the wafer. Summary of the Invention

[0005] To address the aforementioned issues, the substrate attraction and holding structure comprises: a pad body having an annular contact portion and a bottom wall portion that closes the bottom surface of a first vacuum chamber surrounded by the contact portion, and being conductive; a tray body having an upper surface and a second vacuum chamber formed by recessing the upper surface, and being conductive; a support column disposed in either the second vacuum chamber or the pad body, such that the contact portion of the pad body is positioned above the second vacuum chamber above the upper surface of the tray body, supporting the pad body so as to be able to swing relative to the second vacuum chamber, and being conductive; a cover fixed to the tray body and covering the second vacuum chamber; and an attraction passage extending from the first vacuum chamber, passing sequentially through the bottom wall portion of the pad body, the second vacuum chamber, and the tray body, and connected to a vacuum source.

[0006] According to this structure, when a warped substrate is placed on a pad, the pad swings, allowing the contact portion to traverse the lower surface of the substrate. This reliably holds the warped substrate, improving the handling efficiency. Furthermore, static electricity on the substrate can be diffused during handling, preventing particle adhesion and increasing the yield rate of the substrate processing steps.

[0007] The present invention can improve the handling efficiency of substrates and increase the yield of substrate processing steps. Attached Figure Description

[0008] Figure 1 This is a top view showing a structural example of a tray provided with the substrate attraction and retention structure according to Embodiment 1.

[0009] Figure 2 It means possessing Figure 1 A side view of an example structure of a pallet-carrying robot.

[0010] Figure 3 This is a cross-sectional view showing an example of a warped wafer.

[0011] Figure 4 It means Figure 1 A cross-sectional view of a substrate attraction and retention structure example.

[0012] Figure 5 It means Figure 1 A top view of a structure example of a substrate attraction and retention configuration.

[0013] Figure 6 It means Figure 1 A cross-sectional view of a substrate attraction and retention structure that holds the substrate in a specific state.

[0014] Figure 7 It means Figure 1 A bottom perspective view of a structural example of a substrate-attracting and retaining pad support structure.

[0015] Figure 8 This is a bottom perspective view showing a modified example of the support pillar of the pad in the substrate attraction and retention structure according to Embodiment 1.

[0016] Figure 9 This is a bottom perspective view showing a modified example of the support pillar of the pad in the substrate attraction and retention structure according to Embodiment 1.

[0017] Figure 10 This is a bottom perspective view showing a modified example of the support pillar of the pad in the substrate attraction and retention structure according to Embodiment 1.

[0018] Figure 11 This is a bottom perspective view showing a modified example of the support pillar of the pad in the substrate attraction and retention structure according to Embodiment 1.

[0019] Figure 12 This is a cross-sectional view showing a structural example of the substrate attraction and retention structure according to Embodiment 2. Detailed Implementation

[0020] Hereinafter, various embodiments will be described with reference to the accompanying drawings. However, the invention is not limited to these embodiments. Furthermore, in all the accompanying drawings, the same or equivalent elements will be labeled with the same reference numerals, and repeated descriptions will be omitted.

[0021] (Implementation Method 1)

[0022] Figure 1 This is a top view showing a structural example of a tray 9 provided with the substrate attraction and holding structure 100 according to Embodiment 1. Figure 2 This is a side view showing a structural example of a substrate handling robot 1 equipped with a pallet 9.

[0023] like Figure 1 and Figure 2 As shown, the substrate attraction and holding structure 100 is a structure for holding the substrate 110 on the tray 9 of the substrate handling robot 1. The tray 9 is provided at the front end of the robot arm 2, and the tray 9 and the robot arm 2 are electrically connected. The tray 9 provided with the substrate attraction and holding structure 100 constitutes a so-called vacuum-type hand for attracting and holding the substrate 110 and transporting the held substrate 110. In particular, the tray 9 is capable of attracting and holding, for example... Figure 3 The diagram shows the structure of a bow-shaped wafer. In this type of warped wafer, the pad contact area 111 on its lower surface, which contacts the support portion (pad 4) of the hand, is tilted. Furthermore, the warping of the wafer can take various forms, such as bowl-shaped, dome-shaped, or curled, and the tilt angle and direction of the pad contact area 111 are not constant.

[0024] A substrate handling robot 1, such as a mobile robotic arm 2, places multiple substrates 110, housed in a carrier called a FrontOpening Unified Pod, onto a pallet 9. Figure 1 In the illustration, a wafer is shown for substrate 110, but it is not limited to this and could also be a glass substrate. Then, the substrate handling robot 1 moves its robotic arm 2 to remove the wafer from the carrier and transfer it to a designated location. The substrate handling robot 1 is, for example, a SCARA-type horizontal multi-joint robot, and the pallet 9 is moved three-dimensionally by the robotic arm 2 of the substrate handling robot 1, i.e., in three mutually orthogonal axes.

[0025] The substrate attraction and holding structure 100 is configured to have multiple (e.g., three) arranged along a circumferential direction centered on the center C of the substrate 110 held on the tray 9. Thus, the substrate 110 held on the tray 9 is reliably held by being supported at multiple points by the substrate attraction and holding structure 100. The substrate attraction and holding structure 100 includes a second vacuum chamber 30, a pad 4, a cover 7 (pad support), a fixing frame 5, a fastener 6, a suction passage 10, and a vacuum source 8, all disposed on the tray body 3 of the tray 9.

[0026] The tray body 3 is formed as a thin plate extending in the horizontal direction, and its upper surface is substantially flat, forming a surface 3a. The tray body 3 holds the substrate 110 via the pad 4. The tray body 3 is made of a conductive material, such as aluminum. Alternatively, the tray body 3 can be surface-treated with alumina or other insulating ceramics to impart conductivity. Furthermore, the portion of the tray body 3 where the substrate attraction and holding structure 100 is provided has three stepped recesses.

[0027] The pad 4 contacts the substrate 110 and functions to directly support the substrate 110. Additionally, the pad 4 forms part of an attraction path and circuit extending from the substrate 110 toward the tray body 3. The pad 4 contains a conductive material, for example, it is entirely formed of conductive polyetheretherketone (PEEK) resin. Specifically, it is formed of carbon-containing PEEK resin. PEEK resin is a non-elastic material with excellent heat resistance and mechanical strength. This suppresses the generation of particulate matter and improves the yield of the substrate 110 processing steps. Furthermore, the pad 4, which is not conductive, can be surface-treated, such as by electroplating, to impart conductivity.

[0028] The pad 4 includes a pad body 40 and a support 44. The pad body 40 has an annular contact portion 41 extending in the horizontal direction. The top (upper surface) of the contact portion 41 is a substrate support surface 41a that contacts the lower surface of the substrate 110. Moreover, the area surrounded by the contact portion 41 forms a first vacuum chamber 42. Furthermore, a bottom wall portion 43 is continuously provided at the lower edge of the contact portion 41, and the bottom surface 65 of the first vacuum chamber 42 is closed by the bottom wall portion 43. That is, the pad body 40 is generally shallow and disc-shaped, and an open space, namely the first vacuum chamber 42, is formed inside.

[0029] Furthermore, the cylindrical support column 44 extends downward from the lower surface of the bottom wall portion 43. The cylindrical outer peripheral surface 51 of the support column 44 has a diameter smaller than the diameter of the contact portion 41 (for example, approximately half the diameter), and extends downward from the lower surface of the bottom wall portion 43. On the outer peripheral surface 51, at the middle portion in the vertical direction, an annular groove 52 extending circumferentially along the outer peripheral surface 51 is formed. Moreover, the outer peripheral edge 57 of the bottom surface 56 of the support column 44 is connected to the lower edge of the outer peripheral surface 51.

[0030] Furthermore, a protrusion 58 is formed on the bottom surface 56 of the support column 44. The protrusion 58 is shaped to project downwards from the outer periphery 57 toward the inward (central axis of the support column 44). Specifically, as Figure 4 and Figure 7 As shown, protrusion 58 is formed in a conical shape. However, it is also possible that protrusion 58 is alternatively shaped as a frustum (see reference). Figure 8 ) or dome-shaped (see reference) Figure 9 Alternatively, the protrusion 58 can also be formed as a protruding shape within the region of the outer periphery 57. Specifically, it can also be a columnar shape forming a stepped difference with respect to the outer periphery 57 (see [reference]). Figure 10 ), hemispherical (refer to) Figure 11 Thus, a portion of the inner region of the bottom surface 56 protrudes downwards from a portion of the outer region surrounding the inner region. The contact portion 41, the bottom wall portion 43, and the support column 44 constitute the liner. Additionally, the top of the protrusion 58 may be located on the central axis of the support column 44.

[0031] Furthermore, an internal flow path 45 is formed in the liner, penetrating the bottom wall portion 43 and the support column 44. The internal flow path 45 is a through hole extending parallel to the central axis of the support column 44 and penetrating the interior of the liner 4, with its upper end opening on the upper surface of the liner 4. Specifically, the internal flow path 45 includes a liner body internal flow path 45a formed in the liner body 40 and a support column internal flow path 45b formed in the support column 44. The upper end of the liner body internal flow path 45a opens at the bottom surface 65 of the first vacuum chamber 42 and is continuous with the first vacuum chamber 42. Furthermore, the liner body internal flow path 45a extends downward, penetrating the bottom wall portion 43. The upper end of the support column internal flow path 45b is continuous with the lower end of the liner body internal flow path 45a, penetrating the support column 44. Furthermore, the lower end of the support column internal flow path 45b opens at the bottom surface 56 of the support column 44. In this embodiment, two flow paths 45 are formed eccentrically relative to the central axis of the support column 44 and are formed on the side of the top of the protrusion 58.

[0032] The second vacuum chamber 30 is formed in the bottom portion of a recess provided on the upper surface of the tray body 3. Specifically, the third recess from the top (the lowest of the three stepped recesses) is the second vacuum chamber 30. This second vacuum chamber 30 accommodates the lower end of the support 44 of the pad 4, which is open at the lower end of the pad internal flow path 45, thereby connecting the pad internal flow path 45 to the second vacuum chamber 30. In addition, the bottom surface 66 of the second vacuum chamber 30 is flat, and the protrusion 58 of the pad 4 is placed on the bottom surface 66. Thus, the pad 4 can take an upright position on the bottom surface 66, that is, a reference position in which the substrate support surface 41a is on a horizontal plane (see reference). Figure 4 Additionally, the pad 4 can take a radial direction D1 centered on the center of the substrate attraction and holding structure 100 and a direction D2 orthogonal to the radial direction D1 (see reference). Figure 1 The tilting posture of the substrate support surface 41a relative to the horizontal plane is referred to as the tilting posture of the substrate support surface 41a relative to the horizontal plane. Figure 6 Thus, with the part of the support column 44 that contacts the bottom surface 66 of the second vacuum chamber 30 and the bottom surface 56 of the support column 44 as the swing center, the pad body 40 is supported so that it can swing relative to the second vacuum chamber 30.

[0033] Furthermore, by mounting a protrusion 58 on the bottom surface 66, the bottom surface 66 of the second vacuum chamber 30 and the bottom surface 56 of the support column 44 come into contact and are electrically connected via the contact portion between the protrusion 58 and the bottom surface 66 of the second vacuum chamber 30. This simplifies the structure of the circuit connecting the pad 4 and the tray body 3.

[0034] Furthermore, the height dimension of the pad 4, that is, the height dimension from the upper end of the contact portion 41 to the lower end of the support column 44, is formed to be larger than the depth dimension from the flat surface 3a of the upper surface of the tray body 3 to the bottom surface 66 of the second vacuum chamber 30. Moreover, the aforementioned depth and height dimensions are defined such that the substrate support surface 41a of the pad 4 is located above the flat surface 3a of the tray body 3 in both the reference posture and the tilted posture, and the substrate support surface 41a of the pad 4 is defined such that it does not sink into the recess of the tray body 3. In this way, the support column 44 positions the contact portion 41 of the pad body 40 above the second vacuum chamber 30 above the upper surface (flat surface 3a) of the tray body 3, and supports the pad body 40 at a single point.

[0035] Furthermore, an internal flow path 31 is provided in the pallet body 3. The internal flow path 31 is a pipe whose end is connected to the opening of the second vacuum chamber 30. In this embodiment, the internal flow path 31 is a narrow groove formed on the bottom surface of the pallet body 3, extending from the second vacuum chamber 30 to the base end of the pallet body 3. Moreover, a back cover 32 is installed on the pallet body 3 to cover the bottom surface of the pallet body 3, thereby covering the internal flow path 31 from the bottom surface side of the pallet body 3, forming a pipe that passes through the interior of the pallet body 3.

[0036] The cover 7 is a thin, plate-shaped elastic body extending horizontally, possessing elasticity. Furthermore, the cover 7 has a central insertion hole 71. A support post 44 is inserted through the insertion hole 71. The cover 7 is embedded in the stepped recess of the aforementioned tray body 3, in the second-upper recess of the recess constituting the second vacuum chamber 30. When viewed from above, the outer periphery of the cover 7 is located outside the second vacuum chamber 30, and the lower surface of the cover 7 contacts the upper surface of the tray body 3. Thus, the cover 7 is configured to cover and seal the second vacuum chamber 30. Additionally, the inner periphery 72 forming the insertion hole 71 is embedded in the groove 52 of the support post 44. This allows for a more reliable sealing of the second vacuum chamber 30. Furthermore, in other words, the cover 7 supports the pad 4 at a position between its upper and lower surfaces.

[0037] Furthermore, the cover 7 can also be made of a conductive material. In this case, the pad 4 and the tray body 3 are further electrically connected via the cover 7. Thus, even if the inner periphery 72 of the cover 7 comes into contact with the support 44, and the circuit connecting the pad 4 and the tray body 3, caused by the contact portion between the protrusion 58 and the bottom surface 66 of the second vacuum chamber 30, fails to maintain electrical connection between the pad 4 and the tray body 3.

[0038] The fixing frame 5 is a plate-shaped frame that covers the outer periphery of the cover 7. Specifically, the fixing frame 5 is formed as a quadrilateral with rounded corners, and an inner hole 61, which is larger than the pad 4 when viewed from above, is formed in the center of the fixing frame 5. The inner periphery of the fixing frame 5 forming the inner hole 61 covers the outer periphery of the cover 7. In addition, the outer periphery of the fixing frame 5 is embedded in and placed in the recess of the tray body 3, which is the first layer above the recess of the cover 7. When viewed from above, the outer periphery of the fixing frame 5 is located outside the outer periphery of the cover 7 and inside the step difference between the flat surface 3a of the upper surface of the tray body 3 and the recess in which the fixing frame 5 is placed. Thus, by dropping the fixing frame 5 from above into the recess of the tray body 3, the fixing frame 5 can be embedded in the recess of the tray body 3 without interfering with the pad 4. Furthermore, through holes 5a for inserting fasteners 6 are formed at the four corners of the fixed frame 5.

[0039] Fastener 6 is a fastener that can engage and disengage the fixing frame 5 to the tray body 3, for example, an external thread. The tray body 3 has an internal threaded hole 3b that is positioned coaxially with the through hole 5a of the recessed fixing frame 5 embedded in the tray body 3, and the fastener 6 engages with the internal threaded hole 3b.

[0040] Thus, the four corners of the fixing frame 5 are fixed to the tray body 3 by fasteners 6, and the outer periphery of the cover 7 is pressed against the tray body 3 from above by the fixing frame 5. The cover 7 is fixed to the tray body 3 and positioned thereon. As a result, the pad 4 is forced from a swinging position to a reference position by the cover 7 and held in the reference position by the fixing frame 5. Furthermore, the inner periphery 72 of the cover 7 contacts the support column 44, which has a smaller diameter than the pad body 40. Therefore, the radial length of the pad body 40 from the outer periphery to the inner periphery 72 can be taken at a greater extent, allowing the cover 7 to deform more significantly. This allows the pad body 40 to tilt more considerably.

[0041] Furthermore, in this state, the upper surface of the second vacuum chamber 30, located between the inner flow path 45 of the pad and the inner flow path 31 of the tray body, is sealed by the cover 7. The first vacuum chamber 42, the inner flow path 45a of the pad body, the inner flow path 45b of the support column, the second vacuum chamber 30, and the inner flow path 31 of the tray body form a continuous flow path, i.e., a suction passage 10. In other words, the suction passage 10 extends from the first vacuum chamber 42, passing sequentially through the bottom wall 43 of the pad body 40, the support column 44, the second vacuum chamber 30, and the inner flow path 31 of the tray body. Moreover, the suction passage 10 is connected to the vacuum source 8 via a pipe installed in the robot arm 2. Thus, by the suction action of the vacuum source 8, gas in the first vacuum chamber 42 can be attracted. An on / off valve is provided in the suction passage 10. By opening the pipe with the on / off valve, gas in the first vacuum chamber 42 can be attracted. Conversely, by closing the pipe with the on / off valve, the attraction of gas in the first vacuum chamber 42 can be stopped. Vacuum source 8, for example, is a vacuum pump, and is located near or inside the substrate handling robot 1.

[0042] Furthermore, by removing the fastener 6 from the tray body 3, and then removing the fixing frame 5 from the tray body 3, the gasket 4 and the cover 7 can be removed. Therefore, the gasket 4 can be easily replaced.

[0043] like Figure 6 As shown, for the substrate attraction and retention structure 100 configured in this way, if a warped substrate 110 is placed on the substrate support surface 41a, the pad body 40 will be supported by the lower end of the protrusion 58 as the fulcrum. Figure 4The reference posture shown is tilted towards a tilted posture, which allows the substrate support surface 41a to align with the pad contact area 111 on the lower surface of the substrate 110, preventing gaps from forming between the substrate support surface 41a and the pad contact area 111. As a result, by performing a suction action using the vacuum source 8, the warped substrate 110 can be reliably adsorbed onto the pad body 40. As a result, even when the robot arm 2 moves at high speed to transport the substrate 110, a large acceleration acting on the held substrate 110 can prevent positional displacement of the substrate 110. As a result, the handling efficiency of the warped substrate 110 can be improved.

[0044] Furthermore, as described above, a circuit is formed that extends from the substrate support surface 41a of the contact portion 41 to the robot arm 2. The pad contact area 111 of the substrate 110 abuts against the substrate support surface 41a, thereby allowing the static electricity carried by the substrate 110 to diffuse to the pallet body 3 via the contact portion between the bottom surface 56 of the support column 44 and the bottom surface 66 of the second vacuum chamber 30, and further diffuse to the robot arm 2. This prevents the adhesion of particles during handling and improves the yield rate.

[0045] Furthermore, the pad body 40 is configured to swing in a radial direction D1 centered on the center of the substrate attraction and holding structure 100 and in a direction D2 orthogonal to the radial direction D1, thus being able to hold the substrate 110 which has a different bending pattern.

[0046] Furthermore, if the warped substrate 110 is held by an edge-clamping type hand that presses the end of the substrate 110 with a holding member, the substrate 110 may warp further and the holding force may decrease. However, the substrate attraction and holding structure 100 attracts and holds the substrate 110, thus holding the warped substrate 110 more reliably.

[0047] (Implementation Method 2)

[0048] The following description focuses on the differences between the structure of Embodiment 2 and Embodiment 1. Figure 12 This is a cross-sectional view showing a structural example of the substrate attraction and retention structure according to Embodiment 2.

[0049] In Embodiment 1 described above, the support column 44 is disposed on the padding body 40. In contrast, in this embodiment, as... Figure 12As shown, the support column 244 is disposed in the second vacuum chamber 30. Specifically, the lower end of the support column 244 is fixed to the second vacuum chamber 30. Moreover, the support column 244 has: an outer peripheral surface 251 extending upward from the bottom surface 66 of the second vacuum chamber 30; and an upper surface 256 having an outer peripheral edge 257 connected to the outer peripheral surface 251. On the upper surface 256, a protrusion 258 is formed that protrudes upward from the outer peripheral edge 257 toward the inward side or is a portion of the inner region of the outer peripheral edge 257 protruding upward.

[0050] Furthermore, the bottom surface of the bottom wall portion 243 of the pad body 240 is concave upward from the outer periphery toward the center. Moreover, the protrusion 258 of the support column 244 rests on the center of the bottom surface of the bottom wall portion 243, and the support column 244 supports the pad body 240. Thus, the pad body 240, as in Embodiment 1 described above, is supported so that it can swing between a reference posture and an inclined posture. In this way, the support column 244 positions the contact portion 41 of the pad body 240 above the second vacuum chamber 30, slightly above the upper surface (flat surface 3a) of the support plate body 3, providing single-point support for the pad body 240.

[0051] Furthermore, the flow path 245a inside the pad body opens at the bottom surface of the bottom wall portion 243, and connects to the second vacuum chamber 30 at this opening. Moreover, the flow path 245a inside the pad body, connected to the first vacuum chamber 42, the second vacuum chamber 30, and the flow path 31 inside the tray body form a suction passage 210. In other words, the suction passage 210 extends from the first vacuum chamber 42, passing sequentially through the bottom wall portion 243 of the pad body 240, the second vacuum chamber 30, and the tray body 3. Furthermore, the suction passage 210 is connected to the vacuum source 8 via a pipe disposed within the robot arm 2.

[0052] Furthermore, a groove 252 is formed in the middle of the upper and lower direction of the outer peripheral surface of the pad body 240. The inner peripheral edge 72 of the cover 7 is embedded in the groove 252, and the cover 7 applies force to the pad body 240 from the swing posture toward the reference posture, maintaining the pad body 240 in the reference posture.

[0053] Based on the above description, those skilled in the art will clearly understand numerous improvements and other embodiments of this implementation. Therefore, the above description is explained by way of example only, and is provided for the purpose of indicating the best mode for performing the invention to those skilled in the art. Details regarding the possibility of substantially changing its structure and / or function without departing from the spirit of the invention are also provided.

[0054] Explanation of reference numerals in the attached figures

[0055] 3... tray body; 7... cover; 8... vacuum source; 10... suction passage; 30... second vacuum chamber; 40... pad body; 41... contact part; 42... first vacuum chamber; 43... (bottom wall of the first vacuum chamber); 44... support column; 65... (bottom surface of the first vacuum chamber); 100... substrate suction and holding structure.

Claims

1. A substrate attraction and retention structure, characterized in that, have: The liner body has an annular contact portion and a bottom wall portion that closes the bottom surface of a first vacuum chamber surrounded by the contact portion, and is conductive; The pallet body has an upper surface and a second vacuum chamber formed by recessing the upper surface, and is conductive; A support column, disposed in either the second vacuum chamber or the pad body, such that the contact portion of the pad body is positioned above the second vacuum chamber above the upper surface of the tray body, supports the pad body so as to be able to swing relative to the second vacuum chamber, and the support column is conductive. A cover body, which is fixed to the tray body, covers the second vacuum chamber; as well as The suction passage extends from the first vacuum chamber, passes sequentially through the bottom wall of the liner body, the second vacuum chamber, and the tray body, and connects to the vacuum source. The cover is conductive and comes into contact with the support or the padding body. The pad body and the tray body can be electrically connected via the support column, and the pad body and the tray body can be electrically connected via the cover.

2. The substrate attraction support structure according to claim 1, characterized in that, The support column provides single-point support for the padding body.

3. The substrate attraction support structure according to claim 1 or 2, characterized in that, The support column has: an outer peripheral surface disposed on the pad body and extending downward from the lower surface of the bottom wall portion; and a bottom surface having an outer peripheral edge connected to the outer peripheral surface, forming a protrusion that protrudes downward from the outer peripheral edge toward the inward side, or a portion of the inner region of the outer peripheral edge protrudes downward. The second vacuum chamber has a bottom surface that receives the lower end of the support column and supports the protrusion.

4. The substrate attraction support structure according to claim 3, characterized in that, The suction passage includes: an internal flow path in the pad body that extends through the bottom wall; an internal flow path in the support column, one end of which is continuous with the internal flow path in the pad body and extends through the support column, and the other end of which opens on the bottom surface of the support column; a second vacuum chamber that is connected to the other end of the internal flow path in the support column; and an internal flow path in the tray body that is formed therein, one end of which is connected to the second vacuum chamber and the other end of which is connected to a vacuum source.

5. The substrate attraction and retention structure according to claim 3, characterized in that, The protrusion is conical, frustum conical, hemispherical, dome-shaped, or cylindrical with a stepped difference between it and the outer periphery.

6. The substrate attraction and retention structure according to claim 3, characterized in that, The support column and the tray body are electrically connected via the protrusion.

7. The substrate attraction support structure according to claim 1 or 2, characterized in that, The second vacuum chamber has a bottom surface. The support has: an outer peripheral surface disposed in the second vacuum chamber and extending upward from the bottom surface of the second vacuum chamber; and an upper surface having an outer peripheral edge connected to the outer peripheral surface, forming a protrusion that protrudes upward from the outer peripheral edge toward the inward side or a portion of the inner region of the outer peripheral edge.

8. The substrate attraction and retention structure according to claim 7, characterized in that, The protrusion is conical, frustum conical, hemispherical, dome-shaped, or cylindrical with a stepped difference between it and the outer periphery.

9. The substrate attraction and retention structure according to claim 1 or 2, characterized in that, The main body of the pad is made of conductive polyetheretherketone resin.

10. The substrate attraction and retention structure according to claim 1 or 2, characterized in that, The cover is a conductive elastomer with an insertion hole for the support column to pass through, and the inner periphery of the insertion hole is in contact with the support column or the padding body.

11. The substrate attraction and retention structure according to claim 1 or 2, characterized in that, have: A fixing frame having a shape that covers the outer periphery of the cover; and Fasteners that can engage and disengage the fixing frame to the tray body.

12. A substrate attraction and holding structure, comprising a pad body, a pad body support, a tray body, and an attraction passage, characterized in that, The pad is placed on the tray body and has a bottom surface, a portion of the inner region of which protrudes downwards than a portion of the outermost region of the outermost region of the inner region. The pad is tiltable relative to the tray body. The pad support is fixed to the tray body and supports the pad at a position between the upper surface and the bottom surface of the pad. The attraction pathway has: The flow path inside the liner passes through the interior of the liner body and opens on the upper surface of the liner body; and The flow path inside the tray passes through the interior of the tray body, with one end connected to the flow path inside the liner and the other end connected to a vacuum source. The liner, the tray body, and the liner support are all conductive. The pad body can be directly electrically connected to the tray body, and the pad body can be electrically connected to the tray body via the pad body support.

13. A substrate handling robot, characterized in that, The device includes a tray on which a plurality of substrate attraction and retention structures according to any one of claims 1 to 11 are arranged, the plurality of substrate attraction and retention structures being arranged in a circumferential direction centered on the center of a substrate held in the tray body.

14. The substrate handling robot according to claim 13, characterized in that, It also has a robotic arm with the tray provided at its front end. It also has a continuous circuit from the contact portion to the robot arm.

Images