Transfer substrate, transfer equipment and transfer method

Abstract

The embodiments of the present application provide a transfer substrate, a transfer device, and a transfer method. The transfer substrate includes a base and a deformation layer disposed on one side of the base. The deformation layer includes at least one deformation unit. The side of the deformation unit away from the base contacts the microdevice when the microdevice is transferred. The deformation unit includes a photodeformable material and has a first state and a second state. The deformation unit has a larger contact area with the microdevice in the first state than in the second state. Under the action of light, the deformation unit transforms from the first state to the second state. With this design, the contact area between the deformation unit and the microdevice becomes smaller. The reduction in contact area reduces the bonding area between the deformation unit and the microdevice, and reduces the adhesion force, thereby making it easier for the microdevice to detach from the deformation unit, completing the transfer of the microdevice. Because light irradiation deformation is a non-contact, fast, and controllable deformation method, it can achieve fast and efficient microdevice transfer.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of micro device preparation and assembly, and in particular to a transfer substrate, a transfer device, and a transfer method. Background Art

[0002] Mini LED refers to LED chips with a crystal size of approximately 100μm to 300μm, while Micro LED refers to LED chips with a crystal size of less than 100μm. Mini LED / Micro LED chips can be used as self-luminous LED displays, offering advantages such as low power consumption, high brightness, high resolution, high color saturation, fast response, long life, and high efficiency.

[0003] During the manufacturing process of display devices featuring Mini LED / Micro LED chips, millions or even tens of millions of Mini LED / Micro LED chips must be accurately and efficiently transferred to the display backplane. This process is known as mass transfer. In existing technologies, the mass transfer process typically involves: placing an adhesive layer on a transfer substrate, adhering the Mini LED / Micro LED chips to the growth substrate through the adhesive layer, then transferring the Mini LED / Micro LED chips to the display backplane using the transfer substrate; and finally, separating the transfer substrate from the Mini LED / Micro LED chips.

[0004] However, due to the strong adhesion of the adhesive layer to the Mini LED / Micro LED chip, when separating the Mini LED / Micro LED chip from the transfer substrate, the adhesive layer needs to be debonded, also known as peeling; the peeling process requires dedicated peeling equipment, which is costly; and the peeling efficiency is low. Summary of the Invention

[0005] In view of this, the purpose of the embodiments of the present application is to provide a transfer substrate, a transfer device and a transfer method.

[0006] In a first aspect, an embodiment of the present application provides a transfer substrate, comprising a base and a deformation layer arranged on one side of the base, the deformation layer comprising at least one deformation unit, the deformation unit being in contact with the micro-device on the side away from the base when the micro-device is transferred; the deformation unit comprises a photodeformable material and has a first state and a second state; the deformation unit has a larger contact area with the micro-device in the first state than in the second state; under the action of light, the deformation unit is converted from the first state to the second state.

[0007] With this design, under the action of light, the contact area between the deformation unit and the microdevice becomes smaller. This reduced contact area reduces the bonding area between the deformation unit and the microdevice, reducing the adhesive force, making it easier for the microdevice to detach from the deformation unit and complete the transfer of the microdevice. Because light irradiation deformation is a non-contact, fast, and controllable deformation method, it can achieve fast and efficient microdevice transfer.

[0008] In a possible implementation manner, a support layer is provided on one side of the substrate, the support layer having a support unit corresponding to the deformation unit, the support unit including a groove and a groove edge surrounding the groove; the deformation unit covers the groove and is connected to the groove edge; the deformation unit is in the second state and bulges outward toward the side away from the substrate compared to the first state.

[0009] In a possible implementation manner, when the deformation unit is in the first state, it is a plate-shaped structure parallel to the base; when the deformation unit is in the second state, it is a convex structure convex relative to the base.

[0010] In a possible implementation manner, the deformation units in the deformation layer are independent structures, and deformation gaps are provided between adjacent deformation units.

[0011] In a possible implementation manner, the support units in the support layer are independent structures, and there are edge gaps between adjacent support units.

[0012] In a possible implementation manner, when the deformation unit is in the first state and is projected onto the substrate, the deformation unit covers the supporting unit.

[0013] In a possible implementation manner, in an orthographic projection onto the substrate, the groove is a circular groove.

[0014] In a possible implementation manner, a support layer is provided on one side of the substrate, the support layer includes a support protrusion corresponding to the deformation unit, and the deformation unit is provided on the support protrusion; when the deformation unit is in the first state, in an orthographic projection onto the substrate, the projection area of ​​the deformation unit is larger than the support protrusion; under the action of light, the deformation unit bends toward a side away from the substrate relative to the support protrusion.

[0015] In a possible implementation manner, when the deformation unit is in the first state, it is a plate-shaped structure parallel to the base; when the deformation unit is in the second state, it is a curved structure bent relative to the supporting protrusion toward a side away from the base.

[0016] In a possible implementation manner, when the deformation unit is in the first state, it is a rectangular plate parallel to the base, and the supporting protrusion is provided at a center position or an edge position of the rectangular unit.

[0017] In a possible implementation manner, the deformation units in the deformation layer are independent structures, and deformation gaps are provided between adjacent deformation units; the support bumps in the support layer are independent structures, and edge gaps are provided between adjacent support bumps.

[0018] In a possible implementation manner, the deformable layer is connected to the base via a viscous material, the deformable unit is a hemispherical arc surface convex relative to the base, and the curvature of the deformable unit in the first state is smaller than the curvature in the second state.

[0019] In a possible implementation manner, the deformation units in the deformation layer are connected as one body.

[0020] In a possible implementation manner, the deformable layer is made entirely or partially of a photodeformable material.

[0021] In a second aspect, an embodiment of the present application provides a micro device transfer apparatus, comprising a transfer substrate as described in any one of the embodiments of the first aspect.

[0022] In a third aspect, embodiments of the present application provide a method for transferring a microchip, using the transfer substrate described in any one of the embodiments of the first aspect, to transfer the microdevice from a first substrate to a second substrate, comprising the following steps:

[0023] Controlling the transfer substrate to align with the first substrate, and picking up the micro device in the first substrate through the deformation unit;

[0024] Controlling the transfer substrate and the second substrate to align, and bonding the micro devices in the transfer substrate to the second substrate;

[0025] Using a light source to illuminate the deformation unit, so that the deformation unit deforms to reduce the contact area with the micro device;

[0026] Separate the transfer substrate and the micro device.

[0027] In a possible implementation manner, between the control transfer substrate and the first substrate pairing box, the steps include:

[0028] An adhesive layer is coated on the side of the deformation unit away from the substrate.

[0029] In a possible implementation manner, irradiating the deformation unit with a light source includes:

[0030] Control the light source to illuminate part or all of the deformation units in the deformation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only one or more embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 A schematic structural diagram of a transfer substrate in a first state provided by an embodiment of the present application;

[0033] Figure 2 A schematic structural diagram of a transfer substrate in a second state provided in an embodiment of the present application;

[0034] Figure 3 A schematic structural diagram of another transfer substrate in a first state provided by an embodiment of the present application;

[0035] Figure 4 A schematic structural diagram of another transfer substrate in a second state provided by an embodiment of the present application;

[0036] Figure 5 A schematic structural diagram of another transfer substrate in a first state provided by an embodiment of the present application;

[0037] Figure 6 A schematic structural diagram of another transfer substrate in a second state provided in an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 1-substrate, 2-supporting layer, 3-deformation layer, 4-micro device, 5-deformation unit, 6-deformation gap, 7-groove edge, 8-supporting groove, 9-supporting gap, 10-supporting protrusion, 11-supporting unit. DETAILED DESCRIPTION

[0040] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0041] An embodiment of the present application provides a transfer substrate for transferring a micro device from a substrate to a target substrate, wherein the micro device may be a Mini LED chip, a Micro LED chip or other micro chips.

[0042] Figure 1 This is a schematic structural diagram of a transfer substrate in a first state provided by an embodiment of the present application. Figure 2 A schematic diagram of a transfer substrate in a second state is provided in an embodiment of the present application. Figure 1 and Figure 2 As shown, the transfer substrate includes a base 1, a support layer 2 and a deformable layer 3. The base 1 is a plate-shaped structure, the support layer 2 is arranged on one side of the base 1, and the deformable layer 3 is arranged on the side of the support layer 2 away from the base 1.

[0043] The support layer 2 is provided with a plurality of support units 11 arranged in an array, with support gaps 9 between adjacent support units 11. The support units 11 include support grooves 8 and groove edges 7 surrounding the support grooves 8. The support grooves 8 can be circular, that is, in an orthographic projection onto the substrate 1, the support grooves 8 have a circular shape. The deformable layer 3 includes a plurality of independent deformable units 5, each corresponding one to each support unit 11. When the deformable layer 3 is connected to the support units 11, the deformable units 5 cover the support grooves 8 and are connected to the groove edges 7. Deformation gaps 6 are provided between adjacent deformable units 5.

[0044] The deformation unit 5 is used to contact and bond with the micro device 4 to be transferred during the transfer process. The size of the micro device 4 can be the same as or smaller than the size of the micro device 4 to be transferred. In other words, during the transfer process of the micro device 4, the transfer substrate can be connected to one micro device 4 by one deformation unit 5, or two or more deformation units 5 can be connected to the same micro device 4. In this embodiment, the transfer of one micro device 4 by one deformation unit 5 is described as an example.

[0045] The deformable layer 3 is made entirely or partially of a photodeformable material. A photodeformable material can deform under light exposure, typically including photothermal deformation and photoisomerization. For example, in this embodiment, the deformable layer 3 is made of photoinduced shape memory polymers (SMPs).

[0046] Shape memory polymers (SMPs) are polymer materials that have a certain original shape. After being deformed by a process, they can return to their original shape when exposed to certain external stimuli, such as light or heat, while in the deformed state. Photoinduced shape memory polymers (SMPs) are such intelligent materials that can undergo this shape recovery process using light as a stimulus. In addition to the change in shape, their Young's modulus also changes. SMPs are materials with specific photosensitive groups introduced into the main chain or side chain of the polymer. When exposed to light, the photosensitive groups absorb light of a certain wavelength and respond in a specific way, causing the original conformation of the molecular chain to change, leading to photoisomerization of the molecules and thus macroscopic deformation of the material. The deformed material can then be irradiated with light of a different wavelength, causing it to return to its original shape. The photosensitive groups mainly include some azobenzene groups that can undergo reversible cis-trans isomerization under light of different wavelengths, triphenylmethane groups and their derivatives that can undergo photoinduced ion dissociation, and cinnamic groups and their derivatives that can undergo reversible cross-linking and de-cross-linking.

[0047] The deformable layer 3, which has a photodeformable material, will expand or contract after being irradiated by light or laser, and will return to its original shape after the light is removed or light of a different wavelength is used. Figure 1 and Figure 2 In the transfer substrate provided in the embodiment of the present application, the deformable unit 5 has a first state and a second state. In the first state, the deformable unit 5 is a plate-like structure parallel to the substrate 1. In the second state, the deformable unit 5 bulges outward relative to the substrate 1 to form a hemispherical structure. Under the influence of light, the deformable unit 5 transforms from the first state to the second state. That is, under the influence of light, the deformable unit 5 deforms relative to the connected groove edge 7.

[0048] In this embodiment, there is a deformation gap 6 of a certain distance between the deformation units 5. The setting of the deformation gap 6 makes the deformation units 5 independent structures, and the deformation layer 3 is not a continuous structure. Such a setting can, on the one hand, avoid erroneous deformation caused by mutual influence between the deformation units 5, and on the other hand, avoid linkage between the deformation units 5, so that the deformation layer 3 can be selectively transferred by irradiating different deformation units 5 with laser points.

[0049] An embodiment of the present application also provides a transfer method, which uses the transfer substrate in the above embodiment to transfer the micro device 4 from a first substrate to a second substrate. The first substrate is usually the growth substrate of the micro device 4, and the second substrate is usually the display backplane corresponding to the micro device 4.

[0050] The transfer methods include:

[0051] First, the transfer substrate is aligned with the first substrate, and the deformation unit 5 is bonded to the micro device 4 through an adhesive layer or its own adhesiveness; in an embodiment in which the deformation unit 5 is bonded to the micro device 4 through an adhesive layer, before the transfer substrate is aligned with the first substrate, an adhesive layer is also coated on the side of the deformation unit 5 away from the base 1.

[0052] The adhesive force between the deformation unit 5 and the micro device 4 must be greater than the fixing force of the micro device 4 on the first substrate to ensure that the transfer substrate can peel the micro device 4 from the first substrate, that is, pick up the micro device 4 .

[0053] After picking up the micro device 4, the transfer substrate is moved and aligned with the second substrate; the micro device 4 on the transfer substrate is bonded to the second substrate; then a light source is used to illuminate the deformation unit 5, causing the deformation unit 5 to convexly deform, thereby reducing the bonding area between the deformation unit 5 and the micro device 4 and reducing the adhesive force, thereby causing the micro device 4 to detach from the deformation unit 5.

[0054] It should be noted that using a light source to irradiate the deformation unit 5 includes controlling the light source to irradiate part or all of the deformation units 5 in the deformable layer 3 . By irradiating part of the deformation units 5 , the micro-device 4 can be transferred selectively and accurately.

[0055] As can be seen from the previous description, the side of the deformable unit 5 facing away from the substrate 1 forms the contact surface with the micro-device 4. The deformable unit 5 has a first state and a second state. The contact area between the deformable unit 5 and the micro-device 4 in the first state is larger than the contact area between the deformable unit 5 and the micro-device 4 in the second state. When the deformable unit 5 is exposed to light, it changes from the first state to the second state. In other words, under the influence of light, the contact area between the deformable unit 5 and the micro-device 4 decreases. This reduction in contact area reduces the bonding area between the deformable unit 5 and the micro-device 4, lowering the bonding force. This makes it easier for the micro-device 4 to detach from the deformable unit 5, completing the transfer of the micro-device 4.

[0056] In the transfer substrate provided in the embodiment of the present application, a photodeformable material is used to make the deformation unit 5 in contact with the micro device 4, and the shape change caused by the response of the material to ultraviolet light, visible light and other light is used to realize the transfer of the micro device 4; because light irradiation deformation is a non-contact, fast and controllable deformation method, combined with the high energy, high speed and precision of the laser, it can realize fast and efficient transfer of the micro device 4.

[0057] The present invention also provides a method for manufacturing the transfer substrate, which comprises the following steps:

[0058] Provide a temporary base;

[0059] A sacrificial layer and a deformable layer 3 are formed on one side of the temporary substrate;

[0060] A plurality of deformation units 5 are formed on the deformation layer 3 by a patterning process;

[0061] A support layer 2 is formed on the side of the deformable layer 3 away from the temporary substrate, and a support unit 11 connected to the deformable unit 5 is formed by a patterning process;

[0062] Connecting the substrate 1 to the side of the support layer 2 away from the temporary substrate;

[0063] The temporary substrate is removed through the sacrificial layer.

[0064] The "patterning process" includes processes such as film deposition, photoresist coating, mask exposure, development, etching, and photoresist stripping. Deposition can be performed by any one or more of sputtering, evaporation, and chemical vapor deposition; coating can be performed by any one or more of spray coating and spin coating; and etching can be performed by any one or more of dry etching and wet etching.

[0065] In the above steps, the deformation gap 6, the support unit 11, the support groove 8 and the support gap 9 etc. can be manufactured in the patterning process according to design requirements.

[0066] Figure 3 This is a schematic structural diagram of another transfer substrate in a first state provided by an embodiment of the present application. Figure 4 A schematic structural diagram of another transfer substrate in the second state provided in an embodiment of the present application is shown in FIG. Figure 3 and Figure 4 As shown, the transfer substrate includes a base 1, a support layer 2 and a deformable layer 3. The base 1 is a plate-shaped structure, the support layer 2 is arranged on one side of the base 1, and the deformable layer 3 is arranged on the side of the support layer 2 away from the base 1.

[0067] The support layer 2 is provided with a plurality of support bumps arranged in an array, with support gaps 9 between adjacent support bumps. The deformable layer 3 includes a plurality of independent deformable units 5, each corresponding to a support bump. The deformable units 5 are connected to the corresponding support bumps, and in the orthographic projection onto the substrate 1, the projection of the support bump is located within the projection of the deformable unit 5, that is, the area of ​​the deformable unit 5 is larger than the support area of ​​the support bump.

[0068] The deformable layer 3 comprises a photodeformable material and has a first state and a second state. In the first state, the deformable unit 5 is a plate-like structure parallel to the substrate 1. In the second state, the deformable unit 5 bends relative to the support protrusion 10, away from the substrate 1. Under the influence of light, the deformable unit 5 changes from the first state to the second state. That is, under the influence of light, the deformable unit 5 bends relative to the support protrusion 10, away from the substrate 1.

[0069] In this embodiment, the deformation unit 5 is a rectangular plate, with the support protrusion 10 disposed at its center. When the deformation unit 5 is in the second state, the outer periphery of the support protrusion 10 bends away from the base 1, forming a bucket-shaped structure with the support protrusion 10 as its base. However, the present embodiment is not limited to this. For example, the support protrusion 10 may be disposed at one end of the deformation unit 5. In this design, when the deformation unit 5 is in the second state, the outer periphery of the support protrusion 10 bends away from the base 1. For another example, the deformation unit 5 may have a circular, square, or other shape.

[0070] The deformation unit 5 is used to contact and bond with the micro device 4 to be transferred during the transfer process. The size of the micro device 4 can be the same as or smaller than the size of the micro device 4 to be transferred. In other words, during the transfer process of the micro device 4, the transfer substrate can be connected to one micro device 4 by one deformation unit 5, or two or more deformation units 5 can be connected to the same micro device 4. In this embodiment, the transfer of one micro device 4 by one deformation unit 5 is described as an example.

[0071] An embodiment of the present application also provides a transfer method, which uses the transfer substrate in the above embodiment to transfer the micro device 4 from a first substrate to a second substrate. The first substrate is usually the growth substrate of the micro device 4, and the second substrate is usually the display backplane corresponding to the micro device 4.

[0072] The transfer methods include:

[0073] First, the transfer substrate is aligned with the first substrate, and the deformation unit 5 is bonded to the micro device 4 via an adhesive layer or its own adhesive properties, and the micro device 4 is picked up. In embodiments where the deformation unit 5 is bonded to the micro device 4 via an adhesive layer, before the transfer substrate is aligned with the first substrate, an adhesive layer is further applied to the side of the deformation unit 5 facing away from the base 1.

[0074] After picking up the micro-device 4, the transfer substrate is moved and aligned with the second substrate; the micro-device 4 on the transfer substrate adheres to the second substrate. A light source is then used to illuminate the deformable elements 5, causing them to convexly deform, reducing the bonding area between the deformable elements 5 and the micro-device 4 and lowering the adhesive force, thereby releasing the micro-device 4 from the deformable elements 5. Illuminating the deformable elements 5 with a light source, including controlling the light source to illuminate some or all of the deformable elements 5 in the deformable layer 3, allows for selective and precise transfer of the micro-device 4.

[0075] As can be seen from the previous description, the side of the deformable unit 5 facing away from the substrate 1 forms the contact surface with the micro-device 4. The deformable unit 5 has a first state and a second state. The contact area between the deformable unit 5 and the micro-device 4 in the first state is larger than the contact area between the deformable unit 5 and the micro-device 4 in the second state. When the deformable unit 5 is exposed to light, it changes from the first state to the second state. In other words, under the influence of light, the contact area between the deformable unit 5 and the micro-device 4 decreases. This reduction in contact area reduces the bonding area between the deformable unit 5 and the micro-device 4, lowering the bonding force. This makes it easier for the micro-device 4 to detach from the deformable unit 5, completing the transfer of the micro-device 4.

[0076] In the transfer substrate provided in the embodiment of the present application, a photodeformable material is used to make the deformation unit 5 in contact with the micro device 4, and the shape change caused by the response of the material to ultraviolet light, visible light and other light is used to realize the transfer of the micro device 4; because light irradiation deformation is a non-contact, fast and controllable deformation method, combined with the high energy, high speed and precision of the laser, it can realize fast and efficient transfer of the micro device 4.

[0077] In this embodiment, there is a deformation gap 6 of a certain distance between the deformation units 5. The setting of the deformation gap 6 makes the deformation units 5 independent structures, and the deformation layer 3 is not a continuous structure. Such a setting can, on the one hand, avoid erroneous deformation caused by mutual influence between the deformation units 5, and on the other hand, avoid linkage between the deformation units 5, so that the deformation layer 3 can be selectively transferred by irradiating different deformation units 5 with laser points.

[0078] For the method of manufacturing the transfer substrate in this embodiment, reference may be made to the above-mentioned method of manufacturing the transfer substrate, which will not be described in detail here.

[0079] Figure 5 This is a schematic structural diagram of another transfer substrate in a first state provided by an embodiment of the present application. Figure 6 A schematic structural diagram of another transfer substrate in the second state provided in an embodiment of the present application is shown in FIG. Figure 5 and Figure 6 As shown, the transfer substrate includes a base 1 and a deformable layer 3. The base 1 is a plate-shaped structure, and the deformable layer 3 is arranged on one side of the base 1.

[0080] The deformation layer 3 includes a photodeformable material and includes a plurality of hemispherical arc surfaces connected as one body. Each hemispherical arc surface structure is a deformation unit 5. The deformation unit 5 has a first state and a second state. The deformation unit 5 in the first state bulges outward toward the side away from the substrate 1. The deformation unit 5 in the second state bulges outward toward the side away from the substrate 1, but the curvature is greater than that of the deformation unit 5 in the first state.

[0081] During the production of the transfer substrate, the photodeformable material may be firstly used to produce the deformable layer 3 by nanoimprinting or injection molding, and then bonded to the base by an adhesive material.

[0082] The deformation unit 5 is used to contact and bond with the micro device 4 to be transferred during the transfer process. The size of the micro device 4 can be the same as or smaller than the size of the micro device 4 to be transferred. In other words, during the transfer process of the micro device 4, the transfer substrate can be connected to one micro device 4 by one deformation unit 5, or two or more deformation units 5 can be connected to the same micro device 4. In this embodiment, four deformation units 5 are used to transfer one micro device 4.

[0083] An embodiment of the present application also provides a transfer method, which uses the transfer substrate in the above embodiment to transfer the micro device 4 from a first substrate to a second substrate. The first substrate is usually the growth substrate of the micro device 4, and the second substrate is usually the display backplane corresponding to the micro device 4.

[0084] The transfer methods include:

[0085] First, the transfer substrate is aligned with the first substrate, and the deformation unit 5 is bonded to the micro device 4 via an adhesive layer or its own adhesive properties, and the micro device 4 is picked up. In embodiments where the deformation unit 5 is bonded to the micro device 4 via an adhesive layer, before the transfer substrate is aligned with the first substrate, an adhesive layer is further applied to the side of the deformation unit 5 facing away from the base 1.

[0086] After picking up the micro-device 4, the transfer substrate is moved and aligned with the second substrate; the micro-device 4 on the transfer substrate adheres to the second substrate. A light source is then used to illuminate the deformable elements 5, causing them to convexly deform, reducing the bonding area between the deformable elements 5 and the micro-device 4 and lowering the adhesive force, thereby releasing the micro-device 4 from the deformable elements 5. Illuminating the deformable elements 5 with a light source, including controlling the light source to illuminate some or all of the deformable elements 5 in the deformable layer 3, allows for selective and precise transfer of the micro-device 4.

[0087] As can be seen from the previous description, the side of the deformable unit 5 facing away from the substrate 1 forms the contact surface with the micro-device 4. The deformable unit 5 has a first state and a second state. The contact area between the deformable unit 5 and the micro-device 4 in the first state is larger than the contact area between the deformable unit 5 and the micro-device 4 in the second state. When the deformable unit 5 is exposed to light, it changes from the first state to the second state. In other words, under the influence of light, the contact area between the deformable unit 5 and the micro-device 4 decreases. This reduction in contact area reduces the bonding area between the deformable unit 5 and the micro-device 4, lowering the bonding force. This makes it easier for the micro-device 4 to detach from the deformable unit 5, completing the transfer of the micro-device 4.

[0088] In the transfer substrate provided in the embodiment of the present application, a photodeformable material is used to make the deformation unit 5 in contact with the micro device 4, and the shape change caused by the response of the material to ultraviolet light, visible light and other light is used to realize the transfer of the micro device 4; because light irradiation deformation is a non-contact, fast and controllable deformation method, combined with the high energy, high speed and precision of the laser, it can realize fast and efficient transfer of the micro device 4.

[0089] The embodiment of the present application also provides a microchip transfer device, which includes the transfer substrate in the above embodiment.

[0090] In the description of the embodiments of the present application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present application and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0091] In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present application based on the specific circumstances.

[0092] In addition, the technical features involved in the different embodiments of the present application described above can be combined with each other as long as they do not conflict with each other.

[0093] Thus far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present application.

Claims

1. A transfer substrate, characterized in that: The device comprises a substrate and a deformable layer disposed on one side of the substrate, the deformable layer comprising at least one deformable unit, wherein a side of the deformable unit away from the substrate contacts the micro-device when the micro-device is transferred; the deformable unit comprises a photodeformable material and has a first state and a second state; the deformable unit in the first state has a larger contact area with the micro-device than in the second state; Under the action of light, the deformation unit transforms from the first state to the second state; A support layer is provided on one side of the substrate, the support layer includes a support protrusion corresponding to the deformation unit, and the deformation unit is provided on the support protrusion; when the deformation unit is in the first state, in an orthographic projection onto the substrate, the projection area of ​​the deformation unit is larger than the support protrusion; The deformation unit bends toward a side away from the base relative to the supporting protrusion under the action of light; The curvature of the deformation unit in the first state is smaller than that in the second state; in the second state, a portion of the deformation unit located at the periphery of the supporting protrusion is curved toward a side away from the base.

2. The transfer substrate according to claim 1, wherein A supporting layer is provided on one side of the substrate, and the supporting layer has a supporting unit corresponding to the deformation unit, and the supporting unit includes a groove and a groove edge surrounding the groove; the deformation unit covers the groove and is connected to the groove edge; the deformation unit is in the second state and bulges outward toward the side away from the substrate compared to the first state.

3. The transfer substrate according to claim 2, wherein: When the deformation unit is in the first state, it is a plate-shaped structure parallel to the base. When the deformation unit is in the second state, it is a convex structure convex relative to the base.

4. The transfer substrate according to claim 2 or 3, characterized in that: The deformation units in the deformation layer are independent structures, and deformation gaps are provided between adjacent deformation units.

5. The transfer substrate according to claim 4, characterized in that The support units in the support layer are independent structures, and there are edge gaps between adjacent support units.

6. The transfer substrate according to claim 3, wherein: When the deformation unit is in the first state, the deformation unit covers the supporting unit in an orthographic projection onto the substrate.

7. The transfer substrate according to claim 2, wherein: In an orthographic projection onto the substrate, the groove is a circular groove.

8. The transfer substrate according to claim 1, wherein When the deformation unit is in the first state, it is a plate-shaped structure parallel to the base. When the deformation unit is in the second state, it is a curved structure bent relative to the supporting bump toward a side away from the base.

9. The transfer substrate according to claim 8, wherein: When the deformation unit is in the first state, it is a rectangular plate parallel to the base, and the supporting protrusion is arranged at the center or edge of the rectangular unit.

10. The transfer substrate according to any one of claims 8 to 9, characterized in that: The deformation units in the deformation layer are independent structures, and deformation gaps are provided between adjacent deformation units; the support convex blocks in the support layer are independent structures, and edge gaps are provided between adjacent support convex blocks.

11. The transfer substrate according to claim 1, wherein The deformable layer is connected to the base through a viscous material, and the deformable unit is a hemispherical arc surface convex relative to the base.

12. The transfer substrate according to claim 11, wherein: The deformation units in the deformation layer are connected as one body.

13. The transfer substrate according to claim 1, wherein The deformation layer is made entirely or partially of photodeformable material.

14. A micro device transfer device, characterized in that: The transfer substrate comprises the transfer substrate according to any one of claims 1 to 13.

15. A method for transferring a microchip, characterized in that: The transfer substrate according to any one of claims 1 to 13 is used to transfer a micro device from a first substrate to a second substrate, comprising the following steps: Controlling the transfer substrate to align with the first substrate, and picking up the micro device in the first substrate through the deformation unit; Controlling the transfer substrate and the second substrate to align, and bonding the micro devices in the transfer substrate to the second substrate; Using a light source to illuminate the deformation unit, so that the deformation unit deforms to reduce the contact area with the micro device; Separate the transfer substrate and the micro device.

16. The transfer method according to claim 15, characterized in that Between the control transfer substrate and the first substrate pairing box, including: An adhesive layer is coated on the side of the deformation unit away from the substrate.

17. The transfer method according to claim 15, characterized in that The method of irradiating the deformation unit with a light source includes: Control the light source to illuminate part or all of the deformation units in the deformation layer.

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