Electronic device

Abstract

An embodiment of the present invention relates to an electronic device comprising: an electronic panel including a plurality of light-emitting portions, wherein an active region comprising the plurality of light-emitting portions includes a foldable region foldable about a folding axis extending along a first direction, and a first non-foldable region and a second non-foldable region spaced apart from each other and adjacent to the foldable region in a second direction intersecting the first direction; a first support plate disposed on the lower side of the electronic panel and including a folded portion overlapping the folded region and a first support portion and a second support portion spaced apart from each other in the second direction and sandwiching the folded portion therebetween; a second support plate disposed on the lower side of the first support plate and comprising metal; and a first input sensor disposed between the first support plate and the second support plate and sensing a first external input, wherein the edge of the second support plate protrudes beyond the edge of the first support plate along the second direction.

Description

Technical Field

[0001] This invention relates to electronic devices, and more particularly to foldable electronic devices. Background Technology

[0002] Electronic devices include active areas that are activated according to electrical signals. These active areas can sense externally applied input and simultaneously display various images to provide information to the user. In recent years, display devices of various shapes have been developed, and active areas with various shapes are being realized. Summary of the Invention

[0003] Therefore, the object of the present invention is to provide an electronic device that can be folded and can sense external input.

[0004] An embodiment of the present invention relates to an electronic device comprising: an electronic panel including a plurality of light-emitting portions, wherein an active region of the plurality of light-emitting portions comprises a foldable region foldable about a folding axis extending along a first direction, and a first non-foldable region and a second non-foldable region spaced apart from each other and adjacent to the foldable region in a second direction intersecting the first direction; a first support plate disposed on the lower side of the electronic panel, and comprising a folded portion overlapping the folded region, and a first support portion and a second support portion spaced apart from each other in the second direction and sandwiching the folded portion therebetween; a second support plate disposed on the lower side of the first support plate and comprising metal; and a first input sensor disposed between the first support plate and the second support plate and sensing a first external input, wherein the edge of the second support plate protrudes beyond the edge of the first support plate along the second direction.

[0005] It is possible that the distance between the edge of the second support plate and the edge of the first support plate is more than 100 μm and less than 500 μm.

[0006] The first support portion and the second support portion may respectively comprise glass or plastic.

[0007] The folded portion may include metal.

[0008] It can be that, on a plane, a plurality of through portions are defined through the fold portion.

[0009] Alternatively, the folded portion may have a grid shape on a plane.

[0010] Alternatively, the folded portion may have a striped shape arranged along the second direction on a plane.

[0011] Alternatively, the electronic panel may further include: a second input sensor, which overlaps with the active area and senses a second external input, the second external input being different from the first external input.

[0012] Alternatively, the first external input may be pen input, and the second external input may be user touch input.

[0013] Alternatively, the second support plate may include a first plate and a second plate, spaced apart in the second direction and sandwiching the folded area therebetween, and including sides facing each other, wherein the edges of the second support plate are defined in the first plate and the second plate, respectively.

[0014] Alternatively, the second support plate may include: a planar portion that overlaps with the electronic panel; and a bent portion that extends from the planar portion by bending and does not overlap with the electronic panel in the plane, wherein, when viewed from the second direction, the bent portion overlaps with the edge of the first support plate.

[0015] Alternatively, the second support plate may further include: an additional bend extending from the bend, wherein, when viewed from the second direction, the bend and the additional bend overlap with the edge of the first support plate.

[0016] Alternatively, the first support plate may comprise a copper alloy or SUS.

[0017] An embodiment of the present invention relates to an electronic device comprising: an electronic panel including a foldable region foldable about a folding axis extending along a first direction, and a first non-foldable region and a second non-foldable region spaced apart from each other and adjacent to the foldable region in a second direction intersecting the first direction; a first support plate disposed on the lower side of the electronic panel, and including a folded portion overlapping the foldable region and a first support portion and a second support portion spaced apart from each other in the second direction and sandwiching the folded portion therebetween; a second support plate disposed on the lower side of the first support plate and comprising metal; and an input sensor disposed between the first support plate and the second support plate and sensing external input, wherein, in a plane, the second support plate protrudes outwardly from the edge of the first support plate.

[0018] Alternatively, the first support portion and the second support portion may be electrically insulated.

[0019] It is possible that the distance between the edge of the second support plate and the edge of the first support plate is more than 100 μm and less than 500 μm.

[0020] Alternatively, the second support plate may include: a planar portion that overlaps with both the first and second support portions; and a bent portion that extends from the planar portion by being bent, wherein, when viewed from the second direction, the bent portion overlaps with the edge of the first support plate.

[0021] Alternatively, the second support plate may further include: an additional bend extending from the bend, wherein, when viewed from the second direction, the bend and the additional bend overlap with the edge of the first plate.

[0022] Alternatively, the second support plate may comprise a copper alloy or SUS.

[0023] Alternatively, the folded portion may comprise a material different from that of the first support portion and the second support portion.

[0024] (Invention Effects)

[0025] According to the present invention, the reliability of electronic devices against external impacts can be improved. Attached Figure Description

[0026] Figures 1a to 1e This is a perspective view of an electronic device according to an embodiment of the present invention.

[0027] Figure 2a This is an exploded perspective view of an electronic device according to an embodiment of the present invention.

[0028] Figure 2b This is a block diagram of an electronic device according to an embodiment of the present invention.

[0029] Figure 3 This is a cross-sectional view of an electronic device according to an embodiment of the present invention.

[0030] Figure 4a and Figure 4b This is a plan view of a portion of the electronic device according to an embodiment of the present invention.

[0031] Figure 5a This is a cross-sectional view showing a portion of the configuration of an electronic device according to an embodiment of the present invention.

[0032] Figure 5b This is a diagram illustrating a portion of the electronic device according to an embodiment of the present invention.

[0033] Figures 6a to 6c This is a cross-sectional view of an electronic device according to an embodiment of the present invention.

[0034] Symbol explanation:

[0035] 1000: Electronic device; AX: Folding shaft; 100: Electronic panel; 200: First input sensor; 300: First support plate; 400: Second support plate. Detailed Implementation

[0036] In this specification, when it is mentioned that a certain constituent element (or region, layer, part, etc.) is located on, connected to or combined with other constituent elements, it means that it can be directly configured / connected / combined with other constituent elements, or a third constituent element can be configured therein.

[0037] The same symbols refer to the same constituent elements. In addition, the thickness, proportions, and dimensions of the constituent elements in the various figures are exaggerated for the purpose of effectively illustrating the technical content.

[0038] "And / or" includes more than one combination of all possible related components.

[0039] The terms "first," "second," etc., can be used to describe various constituent elements, but the constituent elements described should not be limited to these terms. These terms are used only to distinguish one constituent element from others. For example, without departing from the scope of this invention, a first constituent element can be named a second constituent element, and similarly, a second constituent element can be named a first constituent element. Singular expressions include plural expressions unless explicitly stated otherwise in the text.

[0040] Furthermore, terms such as "below," "on the lower side," "above," and "on the upper side" are used to explain the connection relationships between the components in the diagram. These terms are relative concepts and are explained based on the direction shown in the diagram.

[0041] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) shall have the same meaning as commonly understood by those skilled in the art. Furthermore, terms defined in commonly used dictionaries shall be interpreted as having a meaning consistent with the relevant technical context, and shall not be interpreted as having an idealized or overly formal meaning unless explicitly defined in this application.

[0042] Terms such as “including” or “having” should be understood as referring to the presence of features, figures, steps, operations, constituent elements, components, or combinations thereof as recorded in the instruction manual, and do not preclude the existence or additional possibilities of one or more other features, figures, steps, operations, constituent elements, components, or combinations thereof.

[0043] Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings.

[0044] Figures 1a to 1eThis is a perspective view of an electronic device according to an embodiment of the present invention. Figure 1a The image shows a perspective view of the electronic device 1000 in its unfolded state. Figures 1b to 1d A perspective view of the electronic device 1000 in a folded state is shown. Figure 1e The image shows a perspective view of the electronic device 1001 in a folded state. See below for reference. Figures 1a to 1e This invention is described.

[0045] Electronic devices 1000 and 1001 can be devices activated by electrical signals. Electronic devices 1000 and 1001 can include various embodiments. For example, electronic devices 1000 and 1001 can include tablets, laptops, computers, smart TVs, etc. In this embodiment, the case where electronic devices 1000 and 1001 are smartphones is illustrated.

[0046] Electronic devices 1000 and 1001 can display an image IM facing a third direction DR3 via a first display surface FS that is parallel to the first direction DR1 and the second direction DR2, respectively. The first display surface FS for displaying the image IM can correspond to the front surface of electronic devices 1000 and 1001. The image IM can include dynamic images, and of course, it can also include static images. Figures 1a to 1e The image IM example shows an internet search window and a clock window.

[0047] In this embodiment, in the unfolded state, the front surface (or upper surface) and back surface (or lower surface) of each component are defined with reference to the direction of the displayed image IM. The front surface and back surface can be opposite each other on the third direction DR3, and the normal directions of the front surface and back surface can be parallel to the third direction DR3.

[0048] The spacing between the front and back surfaces on the third-direction DR3 can correspond to the thickness / height of electronic devices 1000 and 1001 on the third-direction DR3. On the other hand, the directions indicated by the first direction DR1, the second direction DR2, and the third-direction DR3 are relative concepts and can be changed to other directions.

[0049] Electronic devices 1000 and 1001 can sense external input applied from the outside. External input can be user input. User input can include various forms of input such as a part of the user's body, an electromagnetic pen PN, light, heat, or pressure.

[0050] For example, external input can include contact caused by a part of the user's body such as their hand, as well as external input applied near the electronic devices 1000 and 1001 or at a predetermined distance (e.g., hovering). Furthermore, it can take various forms such as force, pressure, temperature, and light. In addition, the electronic devices 1000 and 1001 of the present invention can also sense external input caused by the electromagnetic pen PN that generates a magnetic field. Furthermore, the electronic devices 1000 and 1001 can also sense multiple inputs of different forms. For example, the electronic devices 1000 and 1001 can sense external input via the electromagnetic pen PN and external input via the user's hand.

[0051] Figure 1a An example of user input via an external electromagnetic pen PN is shown. Although not shown, the electromagnetic pen PN can be installed inside or outside the electronic devices 1000 and 1001, and can also be removed from the electronic devices 1000 and 1001. The electronic devices 1000 and 1001 can provide and receive signals corresponding to the installation and removal of the electromagnetic pen PN.

[0052] The first display surface FS may include a first active region F-AA (active region), a first peripheral region F-NAA (peripheral region), and an electronic module region MH. The first peripheral region F-NAA is adjacent to the first active region F-AA. The first peripheral region F-NAA may have a lower transmittance than the first active region F-AA and may have a predetermined color.

[0053] In this embodiment, the first peripheral region F-NAA may surround the first active region F-AA. Therefore, the shape of the first active region F-AA can be substantially defined based on the first peripheral region F-NAA. However, this is illustrative; the first peripheral region F-NAA may also be configured to be adjacent only to one side of the first active region F-AA, or it may be omitted.

[0054] An embodiment of the present invention relates to electronic devices 1000 and 1001 that can be folded around a predetermined folding axis. For example, see reference... Figure 1b In the electronic device 1000, a virtual first folding axis AX1 extending along a first direction DR1 can be defined. The first folding axis AX1 can extend along the first direction DR1 on the first display surface FS.

[0055] The first display surface FS of the electronic device 1000 may include a folded region FA folded according to a first folding axis AX1, and a first non-folded region NFA1 and a second non-folded region NFA2 spaced apart from each other in a second direction DR2 and sandwiching the folded region FA therebetween. The electronic device 1000 may be folded in an in-folding manner, in which it is folded with respect to the first folding axis AX1, thereby folding in a direction in which the first non-folded region NFA1 and the second non-folded region NFA2 face each other.

[0056] Or, such as Figure 1c and Figure 1d As shown, the electronic device 1000 can also be folded outwards, in which it is folded with the second folding axis AX2 as the center in a direction in which the first non-folding region NFA1 and the second non-folding region NFA2 are opposite to each other. When the electronic device 1000 is completely folded, as... Figure 1d As shown, a display surface FS-F with a relatively reduced area compared to the first display surface FS in its unfolded state can be provided.

[0057] The electronic device 1000 may operate only in one of the following modes: folding inward with a folding axis as the center and folding outward. Alternatively, the electronic device 1000 may operate in either the folding inward or outward mode with a folding axis as the center.

[0058] Or, such as Figure 1e As shown, multiple folding axes can also be defined in the electronic device 1001. A first folding axis AX1 and a second folding axis AX2 can be defined in the electronic device 1001, extending along a first direction DR1 and spaced apart from each other along a second direction DR2. The electronic device 1001 can be folded with respect to the first folding axis AX1 and the second folding axis AX2. The display surface FS1 of the electronic device 1001 may include a first folded region FA1 and a second folded region FA2 folded with respect to the first folding axis AX1 and the second folding axis AX2, respectively, and a first non-folded region NFA1, a second non-folded region NFA2, and a third non-folded region NFA3 spaced apart from each other along the second direction DR2, with the first folded region FA1 and the second folded region FA2 sandwiched between them.

[0059] Specifically, the electronic device 1001 can be folded in a folding manner other than the first folding axis AX1. Thus, in the electronic device 1001, with the first folding axis AX1 as the center, the first non-folding region NFA1 and the second non-folding region NFA2 are opposite each other, and the first folding region FA1 is folded so that it protrudes toward the first folding axis AX1.

[0060] Furthermore, the electronic device 1001 can be folded inward around the second folding axis AX2. Thus, in the electronic device 1001, the second non-folding region NFA2 and the third non-folding region NFA3 face each other, and the second folding region FA2 is folded to surround the second folding axis AX2.

[0061] On the other hand, the electronic device 1001 can also be folded in the same manner with the first folding axis AX1 and the second folding axis AX2 as the center. Furthermore, the electronic device according to an embodiment of the present invention can also be folded according to three or more folding axes, and the extending direction of the folding axes can also be defined as a direction other than the first direction DR1. The electronic devices 1000 and 1001 according to an embodiment of the present invention can include various embodiments as long as they can sense external input and can be folded, and are not limited to any one embodiment.

[0062] Figure 2a This is an exploded perspective view of an electronic device according to an embodiment of the present invention. Figure 2b This is a block diagram of an electronic device according to an embodiment of the present invention. Figure 2a The text simply shows... Figure 1a The exploded perspective view of the electronic device shown is in Figure 2b The module also demonstrates Figure 2a The omitted components in each of the shown structures. See below for reference. Figure 2a and Figure 2b To illustrate the present invention.

[0063] like Figure 2a As shown, the electronic device 1000 may include an electronic panel 100, a first input sensor 200, a first support plate 300, a second support plate 400, and a window 500.

[0064] The electronic panel 100 can be a flexible panel. Therefore, the electronic panel 100 can be rolled up entirely or folded or unfolded around the folding axis AX. The electronic panel 100 may include an active area AA and a peripheral area NAA.

[0065] The active region AA can display the image IM or sense the applied external input. The surrounding region NAA is adjacent to the active region AA. In this embodiment, the case where the surrounding region NAA surrounds the active region AA is shown, but it is not limited to this.

[0066] Electronic panel 100 may include display panel 110 and input sensor 120 (hereinafter referred to as second input sensor). Display panel 110 generates images. Display panel 110 may be a light-emitting display panel, without particular limitation. For example, display panel 110 may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel may include quantum dots and quantum rods, etc. Hereinafter, display panel 110 will be described using an organic light-emitting display panel as an example.

[0067] The display panel 110 may include a plurality of light-emitting units. Each light-emitting unit is disposed in an active region AA and emits light of a predetermined color. When multiple light-emitting layers are provided, each light-emitting unit may correspond to a specific light-emitting layer. Alternatively, when a single light-emitting layer is provided, each light-emitting unit may correspond to a specific color filter or a specific color conversion component.

[0068] The second input sensor 120 is disposed on the display panel 110. The second input sensor 120 can sense external input. In this embodiment, the second input sensor 120 can sense signals transmitted by the user's hand. The second input sensor 120 can sense the position and / or intensity of the user's hand being applied across the entire surface of the active region AA. On the other hand, this is by way of illustration, and the second input sensor 120 can sense various types of input and is not limited to any one embodiment.

[0069] The second input sensor 120 may include multiple sensing electrodes. Each sensing electrode is disposed in an active region AA. The second input sensor 120 can sense the position or intensity information of an external input by detecting changes in the capacitance or resistance between the sensing electrodes caused by the applied external input.

[0070] The second input sensor 120 can be directly disposed on the display panel 110. According to one embodiment of the present invention, the second input sensor 120 can be formed on the display panel 110 through a continuous process. That is, the second input sensor 120 can be directly formed on the display panel 110 without a separate bonding component such as an adhesive film. However, the present invention is not limited thereto, and the second input sensor 120 can be bonded to the display panel 110 by sandwiching a bonding component such as an adhesive film between the second input sensor 120 and the display panel 110. In this case, the second input sensor 120 can be manufactured in a process separate from the display panel 110 and then bonded to the upper surface of the display panel 110 by an adhesive film. On the other hand, this is by way of illustration, and in the electronic panel 100 according to an embodiment of the present invention, the second input sensor 120 may also be omitted.

[0071] The first input sensor 200 is disposed between the electronic panel 100 and the second support plate 400. The first input sensor 200 can sense external inputs sensed by the electronic panel 100, specifically, it can sense external inputs different from those sensed by the second input sensor 120. For example, the first input sensor 200 can sense an electromagnetic pen PN (see above). Figure 1a External input caused by ).

[0072] The first input sensor 200 can sense the position or intensity of the electromagnetic pen PN input to the window 500. For example, the first input sensor 200 may include a digitizer. The first input sensor 200 may be driven using a method that utilizes electromagnetic resonance (EMR). However, this is illustrative, and the first input sensor 200 can be designed with various driving methods as long as it can sense the input of the electromagnetic pen PN, and is not limited to any one embodiment.

[0073] The first input sensor 200 may include a first sensor 210 and a second sensor 220. The first sensor 210 overlaps with a first non-folded region NFA1, and the second sensor 220 overlaps with a second non-folded region NFA2. The first sensor 210 and the second sensor 220 may be configured to sandwich the folded region FA and be spaced apart from each other in a second direction DR2. The first sensor 210 and the second sensor 220 may have the same structure and may be driven in the same manner. According to the invention, the first input sensor 200 is not subjected to stress caused by folding, thereby preventing damage caused by folding. However, this is by way of illustration, and the first input sensor 200 may also be configured as a single sensor overlapping the folded region FA, the first non-folded region NFA1, and the second non-folded region NFA2 respectively, but is not limited to any particular embodiment.

[0074] A first support plate 300 is disposed between the electronic panel 100 and the first input sensor 200, thereby supporting the electronic panel 100. The first support plate 300 may include a first support portion 310, a second support portion 320, and a folding portion 330. The first support portion 310 and the second support portion 320 are spaced apart from each other in the second direction DR2, sandwiching the folding portion 330 between them.

[0075] The first support portion 310 overlaps with the first non-folded region NFA1, and the second support portion 320 overlaps with the second non-folded region NFA2. The first support portion 310 and the second support portion 320 may each be insulating. For example, the first support portion 310 and the second support portion 320 may each be formed of plastic or glass.

[0076] The fold portion 330 overlaps with the folding area FA. Multiple holes can be defined through the fold portion 330. Through these multiple holes, the shape of the fold portion 330 can easily deform when folded. Alternatively, the fold portion 330 can include a material different from the first support portion 310 and the second support portion 320. For example, the fold portion 330 can include a single metal or alloy. Thus, the fold portion 330 can stably protect the folding area FA of the electronic panel 100 even when folded. However, this is merely illustrative; the fold portion 330 can also be formed of the same material as the first support portion 310 or the second support portion 320, but is not limited to any particular embodiment.

[0077] The second support plate 400 is disposed below the first input sensor 200, thereby supporting the first input sensor 200. The second support plate 400 may include a first plate 410 and a second plate 420 spaced apart from each other in the second direction DR2.

[0078] The first plate 410 overlaps with the first non-folded region NFA1 on a plane. The second plate 420 overlaps with the second non-folded region NFA2 on a plane. For ease of illustration, the folded region FA, the first non-folded region NFA1, and the second non-folded region NFA2 are shown on the second support plate 400.

[0079] The second support plate 400 may have a higher modulus than the first support plate 300. Specifically, the first plate 410 and the second plate 420 may comprise materials having a higher modulus than the first support portion 310 and the second support portion 320. For example, the first plate 410 and the second plate 420 may each comprise a copper alloy or a metal such as SUS (steel use stainless steel). Thus, the second support plate 400 can stably protect the first input sensor 200 from impacts generated from the outside.

[0080] A window 500 is disposed on the electronic panel 100. The window 500 overlaps with the active area AA of the electronic panel 100 and provides an optically transparent area. The window 500 provides a first display surface FS corresponding to the front surface of the electronic device 1000. External input such as an electromagnetic pen PN can be substantially applied to the window 500. The image IM displayed on the electronic panel 100 can be recognized by the user through the window 500.

[0081] Window 500 may include a thin-film glass or a synthetic resin film. When window 500 includes thin-film glass, its thickness may be less than 100 μm, for example, 30 μm, but the thickness is not limited to this. When window 500 includes a synthetic resin film, it may include a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0082] The window 500 can have a multi-layered or single-layered structure. For example, the window 500 may include multiple synthetic resin films bonded together with an adhesive, or a glass substrate and a synthetic resin film bonded together with an adhesive. The window 500 can be formed of a flexible material. Thus, the window 500 can be folded or unfolded around the folding axis AX. That is, when the shape of the electronic panel 100 is deformed, the shape of the window 500 can also deform correspondingly to the shape of the electronic panel 100.

[0083] The window 500 allows images from the electronic panel 100 to pass through while mitigating external impacts, thereby preventing damage or malfunction of the electronic panel 100 due to external impacts. External impacts can be manifested as external forces such as pressure or stress, representing forces that can cause defects in the electronic panel 100.

[0084] On the other hand, although not shown, the electronic device 1000 may also include a protective layer disposed on the window portion 500. The protective layer may be a layer that improves the impact resistance of the window portion 500 and prevents scattering in the event of breakage. The protective layer may include at least one selected from urethane resins, epoxy resins, polyester resins, polyether resins, acrylic resins, ABS resin (acrylonitrile-butadiene-styrene resin), and rubber. As an example of the present invention, the protective layer may include at least one selected from phenylene, polyethylene terephthalate (PET), polyimide (PI), polyamide (PAI), polyethylene naphthalate (PEN), and polycarbonate (PC).

[0085] Alternatively, although not shown, the electronic device 1000 may also include one or more functional layers disposed between the electronic panel 100 and the window 500. For example, the functional layer may be an anti-reflective layer that blocks the reflection of external light. The anti-reflective layer can prevent the external identification of the components constituting the electronic panel 100 due to external light incident on the front surface of the electronic device 1000. The anti-reflective layer may include a phase retarder, a polarizer, or a color filter.

[0086] The electronic module 600 may be disposed on the underside of the second support plate 400. The electronic module 600 may include at least one of a camera, a speaker, a light sensor, and a heat sensor. The electronic module 600 may also include multiple configurations and is not limited to any one embodiment.

[0087] The electronic module 600 can be configured to overlap with the active region AA. Correspondingly, through holes H1, H2, H3, and H4 can be defined in the electronic panel 100, the first input sensor 200, the first support plate 300, and the second support plate 400, respectively. Through the through holes H1, H2, H3, and H4, external subjects existing outside the electronic device 1000 can be sensed, or sound signals such as audio signals can be provided to the outside. On the other hand, this is shown as an example, and any one of the through holes H1, H2, H3, and H4 can be omitted. Furthermore, in an embodiment of the electronic device 1000 according to the present invention, the electronic module 600 can also be configured not to overlap with the active region AA. In this case, the through holes H1, H2, H3, and H4 can be omitted.

[0088] Reference Figure 2b The electronic device 1000 may further include a power supply module PM, a first electronic module EM1, and a second electronic module EM2. The electronic panel 100, the first input sensor 200, the power supply module PM, the first electronic module EM1, and the second electronic module EM2 may be electrically connected to each other.

[0089] The power supply module PM supplies the power required for the overall operation of the electronic device 1000. The power supply module PM may include a conventional battery module.

[0090] The first electronic module EM1 and the second electronic module EM2 include various functional modules for enabling the electronic device 1000 to operate. The first electronic module EM1 can be directly installed on the motherboard that is electrically connected to the electronic panel 100, or it can be installed on a separate substrate and electrically connected to the motherboard via a connector (not shown) or the like.

[0091] The first electronic module EM1 may include a control module CTM, a wireless communication module TM, an image input module IIM, an audio input module AIM, a memory MM, and an external interface IF. Some of these modules may not be mounted on the motherboard but instead electrically connected to it via a flexible circuit board.

[0092] The control module CTM controls the overall operation of the electronic device 1000. The control module CTM can be a microprocessor. For example, the control module CTM activates or disables the electronic panel 100. The control module CTM can control other modules such as the image input module IIM or the audio input module AIM based on touch signals received from the electronic panel 100.

[0093] The wireless communication module™ can send / receive wireless signals with other terminals using Bluetooth or Wi-Fi links. The wireless communication module™ can also send / receive audio signals using conventional communication links. The wireless communication module™ includes a transmitting unit TM1 that modulates the signal to be transmitted for transmission and a receiving unit TM2 that demodulates the received signal.

[0094] The external interface (IF) serves as an interface for connecting to external chargers, wired / wireless data interfaces, card slots (e.g., memory cards, SIM / UIM cards), etc.

[0095] The second electronic module EM2 may include an audio output module AOM, a light-emitting module LM, a light-receiving module LRM, and a camera module CMM, etc. This configuration can be directly mounted on the motherboard, or it can be mounted on a separate substrate and electrically connected to the electronic panel 100 or the first electronic module EM1 via a connector (not shown).

[0096] The audio output module AOM transforms audio data received from the wireless communication module TM or stored in the memory MM and outputs it to the outside.

[0097] The light-emitting module (LM) generates and outputs light. The LM can output infrared light. The LM may include LED elements. The light-receiving module (LRM) senses infrared light. The LRM can be activated when it senses infrared light at a predetermined level or higher. The LRM may include a CMOS sensor. After the infrared light generated by the LM is output, it is reflected by external objects (such as a user's finger or face), and the reflected infrared light can then be incident on the LRM. The camera module (CMM) captures external images.

[0098] An embodiment of the present invention relates to an electronic module 600 that may include at least any one of the components of a second electronic module EM2. For example, the electronic module 600 may include at least one of a camera, a speaker, a light sensor, and a heat sensor. The electronic module 600 may sense an external subject received through the electronic module region MH or provide sound signals, such as audio signals, to the outside through the electronic module region MH. Furthermore, the electronic module 600 may include multiple components and is not limited to any one embodiment.

[0099] Figure 3 This is a cross-sectional view of an electronic device according to an embodiment of the present invention. Figure 4a and Figure 4b This is a plan view of a portion of the electronic device according to an embodiment of the present invention. Figure 3 The text shows the relationship with... Figure 2a The section corresponding to Ⅰ-Ⅰ' shown is in Figure 4a and Figure 4b The text simply shows... Figure 2a The AA region is shown below. See below for reference. Figures 3 to 4b To illustrate the present invention. On the other hand, regarding the relationship with... Figures 1a to 2b For structures that are identical to those described in the text, assign the same symbols and omit duplicate descriptions.

[0100] like Figure 3 As shown, in addition to the electronic panel 100, the first input sensor 200, the first support plate 300, the second support plate 400, and the window 500, the electronic device 1000 may also include various functional layers.

[0101] An optical layer OPL and an adhesive layer AD1 may be included between the window 500 and the electronic panel 100. The window 500 may include a first layer 510, a second layer 520, and a border pattern BZ. The first layer 510 may include glass. For example, the first layer 510 may have a thickness of about 10 μm or less. Therefore, the first layer 510 can be easily folded.

[0102] The second layer 520 is disposed on the first layer 510. The second layer 520 may include a material having a relatively low modulus compared to the first layer 510. For example, the second layer 520 may be a film comprising organic matter. The second layer 520 may have a relatively high thickness compared to the first layer 510. The second layer 520 protects the upper surface of the first layer 510.

[0103] On the other hand, the border pattern BZ can be embedded within the second layer 520. However, this is by way of illustration; the border pattern BZ can also be disposed on the lower or upper surface of the second layer 520. The border pattern BZ can be a colored pattern or a reflective pattern with a predetermined color. The border pattern BZ can define the aforementioned first peripheral area F-NAA. On the other hand, this is by way of illustration; in the window portion 500 according to an embodiment of the present invention, the border pattern BZ may also be omitted. Furthermore, the window portion 500 according to an embodiment of the present invention can be formed by a single layer or may also include other functional layers, and is not limited to any particular embodiment.

[0104] An optical layer (OPL) is disposed on the electronic panel 100. The OPL reduces the reflectivity of external light. The OPL may comprise a stretched synthetic resin film. For example, an iodine compound can be applied to a polyvinyl alcohol (PVA) film to provide the OPL. Alternatively, the OPL may also include a color filter. The OPL can comprise various layers as long as it reduces the reflectivity of external light, and is not limited to any particular embodiment.

[0105] The optical layer OPL and the window 500 can be bonded together by a predetermined adhesive layer AD1. Adhesive layer AD1 may include an optically clear adhesive (OCA), an optically clear resin (OCR), or a pressure-sensitive adhesive (PSA). The adhesive layers described below may include the same material as adhesive layer AD1 and may include conventional adhesives or binders.

[0106] A panel protective film PFL and a lower protective film CPL may be included between the electronic panel 100 and the first support plate 300.

[0107] A panel protective film (PFL) can be disposed on the underside of the electronic panel 100. The panel protective film PFL protects the lower part of the electronic panel 100. The panel protective film PFL may include a flexible plastic material. For example, the panel protective film PFL may include polyethylene terephthalate (PET).

[0108] The lower protective film CPL can be disposed on the underside of the panel protective film PFL. The lower protective film CPL can have a predetermined color. The lower protective film CPL can protect the back of the electronic panel 100 while preventing back-view issues caused by light. The lower protective film CPL can be formed from a material with high light absorption.

[0109] On the other hand, a predetermined recess CPL_G can be formed in the lower protective film CPL, overlapping the folded region FA. The recess CPL_G can reduce the thickness of the lower protective film CPL in the folded region FA, thereby reducing folding stress. Furthermore, an adhesive layer can be added to the recess CPL_G to improve the bonding force with the first support plate 300.

[0110] The first support plate 300 and the first input sensor 200 can be bonded together by a predetermined adhesive layer AD2. A predetermined recess AD2_G overlapping the folded region FA can be formed in the adhesive layer AD2. The recess AD2_G reduces the folding stress in the folded region FA. However, as illustrated by example, the recess AD2_G can be omitted from the adhesive layer AD2, or the portion of the adhesive layer AD2 overlapping the folded region FA can be removed; it is not limited to any particular embodiment.

[0111] On the other hand, refer to Figure 4a and Figure 4b The first support portion 310, the second support portion 320, and the folding portion 330 of the first support plate 300 are described in detail. Figure 4a As shown, a folding portion 330 may be disposed between the first support portion 310 and the second support portion 320.

[0112] In this embodiment, the folded portion 330 can be formed of a different material than the first support portion 310 and the second support portion 320. For example, the first support portion 310 and the second support portion 320 can be formed of an insulating material such as plastic or glass, and the folded portion 330 can be formed of metal or alloy. The folded portion 330 can be bonded to the first support portion 310 and the second support portion 320 respectively through a predetermined adhesive layer AS.

[0113] Multiple predetermined holes OP can be formed in the folded portion 330. Thus, the folded portion 330 can have a lattice shape in the plane. As the size of the multiple holes OP changes, the shape deformation of the first support plate 300 in the folded region FA can be easily achieved. On the other hand, although not shown, a highly flexible material can be filled into the multiple holes OP.

[0114] like Figure 4b As shown, multiple openings OP_1 with a slit shape can also be defined in the folded portion 330_1. Thus, the folded portion 330_1 can have a stripe shape arranged at intervals along the second direction DR2. The two ends of the folded portion 330_1 are respectively bonded to the first support portion 310_1 and the second support portion 320_1 via a predetermined adhesive layer AS_1.

[0115] The second support plate 400 and the first input sensor 200 can be joined together by a predetermined adhesive layer AD3. The first plate 410 can be joined with the first sensor 210, and the second plate 420 can be joined with the second sensor 220.

[0116] The electronic device 1000 may further include a padding layer CS, an insulating layer TP, and a height difference compensation component AS disposed on the underside of the second support plate 400. The padding layer CS can absorb external impacts to protect the electronic panel 100. The padding layer CS may include a foam sheet with a predetermined elasticity. The padding layer CS may include sponge or polyurethane. The padding layer CS may be provided in multiple layers CS1, CS2, thereby bonding to the first plate 410 and the second plate 420 respectively.

[0117] An insulating layer TP is disposed on the underside of the padding layer CS. The insulating layer TP can be an insulating film. The insulating layer TP can prevent the inflow of static electricity. The insulating layer TP can be provided in multiple layers TP1, TP2, thereby bonding to the first plate 410 and the second plate 420 respectively. The height difference compensation component AS is bonded to the underside of the second support plate 400. The height difference compensation component AS can be double-sided adhesive or an insulating film.

[0118] In an embodiment of the electronic device 1000 of the present invention, the edge 400_E (hereinafter referred to as the second edge) of the second support plate 400 may protrude further outward than the edge 300_E (hereinafter referred to as the first edge) of the first support plate 300. In this embodiment, the distance GP between the first edge 300_E and the second edge 400_E may be more than 100 μm and less than 500 μm. When the distance GP between the first edge 300_E and the second edge 400_E is less than 100 μm, the possibility of interference with the first support plate 300 may be high due to the thickness of the second support plate 400 itself. Therefore, it is difficult to protect the first support plate 300 by means of the second support plate 400.

[0119] Furthermore, if the distance GP between the first edge 300_E and the second edge 400_E exceeds 500 μm, the dead space of the electronic device 1000 will increase, potentially causing the bezel to expand. Therefore, in this embodiment, the distance GP between the first edge 300_E and the second edge 400_E can be between 100 μm and 500 μm.

[0120] According to the present invention, the second edge 400_E protrudes further outward than the first edge 300_E, so that external impacts applied to the electronic device 1000 can be applied to the second support plate 400 before the first support plate 300. This prevents damage to the relatively low-rigidity first support plate 300, while the relatively high-rigidity second support plate 400 protects other components, including the first support plate 300, thereby improving the reliability of the electronic device 1000.

[0121] Figure 5a This is a cross-sectional view showing a portion of the configuration of an electronic device according to an embodiment of the present invention. Figure 5b This is a diagram illustrating a portion of the configuration of an electronic device according to an embodiment of the present invention. Figure 5a The diagram illustrates the stacking relationship between the electronic panel 100, the first input sensor 200, and the first support plate 300 in the various components of the electronic device 1000. Figure 5b The signal diagram of the first input sensor 200 is simply shown below. Refer to the following... Figure 5a and Figure 5b To illustrate the present invention.

[0122] like Figure 5a As shown, the display panel 110 may include a substrate layer 111, a circuit layer 112, a light-emitting element layer 113, and an encapsulation layer 114.

[0123] The substrate 111 may include a synthetic resin film. The synthetic resin film may include a thermosetting resin. The substrate 111 may have a multilayer structure. For example, the substrate 111 may also have a three-layer structure consisting of a synthetic resin layer, an adhesive layer, and a synthetic resin layer. In particular, the synthetic resin layer may be a polyimide-based resin layer, the material of which is not specifically shown. The synthetic resin layer may include at least one of acrylic resins, methacrylic resins, polyisoprene, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins. Furthermore, the substrate 111 may include a glass substrate or an organic / inorganic composite substrate, etc.

[0124] Circuit layer 112 can be disposed on substrate layer 111. Circuit layer 112 may include insulating layers, semiconductor patterns, conductive patterns, and signal lines. After forming insulating layers, semiconductor layers, and conductive layers on substrate layer 111 by means of coating, deposition, etc., the insulating layers, semiconductor layers, and conductive layers are selectively patterned by multiple photolithography processes. Then, semiconductor patterns, conductive patterns, and signal lines included in circuit layer 112 can be formed.

[0125] The light-emitting element layer 113 may be disposed on the circuit layer 112. The light-emitting element layer 113 may include a light-emitting element. For example, the light-emitting element layer 113 may include an organic light-emitting material, a quantum dot, a quantum rod, or a micro LED.

[0126] The encapsulation layer 114 may be disposed on the light-emitting element layer 113. The encapsulation layer 114 may include an inorganic layer, an organic layer and an inorganic layer stacked in sequence, but the layers constituting the encapsulation layer 114 are not limited to these.

[0127] The inorganic layer protects the light-emitting element layer 113 from moisture and oxygen, while the organic layer protects it from foreign substances such as dust particles. The inorganic layers may include silicon nitride layers, silicon oxide nitride layers, silicon oxide layers, titanium oxide layers, or aluminum oxide layers, etc. The organic layers may include acrylic organic layers, but are not limited to these.

[0128] In this embodiment, the second input sensor 120 is directly disposed on the display panel 110. The second input sensor 120 may include a substrate insulating layer 121, a first conductive layer 122, a sensing insulating layer 123, a second conductive layer 124, and a covering insulating layer 125.

[0129] The substrate insulating layer 121 can be directly disposed on the display panel 110. For example, the substrate insulating layer 121 can be in direct contact with the encapsulation layer 114. The substrate insulating layer 121 can have a single-layer or multi-layer structure. Alternatively, the substrate insulating layer 121 can be omitted. Alternatively, the substrate insulating layer 121 can also be formed on a separate substrate layer, which can be bonded to the display panel 110 by adhesive attachments.

[0130] The first conductive layer 122 and the second conductive layer 124 can each have a single-layer structure or a multilayer structure stacked along the third direction DR3. The single-layer conductive layers 122 and 124 can include a metal layer or a transparent conductive layer. The metal layer can include molybdenum, silver, titanium, copper, aluminum, and alloys thereof. The transparent conductive layer can include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium zinc tin oxide (IZTO). Furthermore, the transparent conductive layer can include conductive polymers such as PEDOT, metal nanowires, graphene, etc.

[0131] The multilayer conductive layers 122 and 124 may include multiple metal layers. For example, the multilayer metal layers may have a titanium / aluminum / titanium three-layer structure. The multilayer conductive layers may include at least one metal layer and at least one transparent conductive layer.

[0132] The first conductive layer 122 and the second conductive layer 124 may each include patterns constituting sensing electrodes. The second input sensor 120 can obtain information about external inputs by means of changes in capacitance between the sensing electrodes.

[0133] A sensing insulating layer 123 may be disposed between the first conductive layer 122 and the second conductive layer 124, and cover the first conductive layer 122. A portion of the second conductive layer 124 may be electrically connected to a portion of the first conductive layer 122 through a contact hole penetrating the sensing insulating layer 123. A covering insulating layer 125 may be disposed on the sensing insulating layer 123 and cover the second conductive layer 124.

[0134] At least one of the substrate insulating layer 121, the sensing insulating layer 123, and the covering insulating layer 125 may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, zirconium oxide, and hafnium oxide.

[0135] At least one of the substrate insulating layer 121, the sensing insulating layer 123, and the covering insulating layer 125 may include an organic film. The organic film may include at least one of acrylic resins, methacrylic resins, polyisoprene, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and perylene resins.

[0136] The first input sensor 200 can be bonded to the second support plate 400 via the adhesive layer AD3. The first input sensor 200 may include a first sensor 210 and a second sensor 220. The first sensor 210 and the second sensor 220 can respectively sense external input through electromagnetic resonance (EMR).

[0137] The electromagnetic resonance (EMR) method generates a magnetic field through a resonant circuit formed inside the electromagnetic pen PN. The vibrating magnetic field induces signals on the multiple coils included in sensors 210 and 220, respectively, and the position of the electromagnetic pen PN is detected by the signals induced on the coils. In this embodiment, the layer structure of the first input sensor 200 can correspond to the structure of the first sensor 210 and the second sensor 220, respectively.

[0138] The first input sensor 200 may include a base film 211, a first conductive layer 212, a first insulating layer 213, a second conductive layer 214, and a second insulating layer 215. The base film 211, the first conductive layer 212, the first insulating layer 213, the second conductive layer 214, and the second insulating layer 215 may have a structure in which they are sequentially stacked in a direction away from the electronic panel 100.

[0139] The base film 211 may comprise a plastic film, such as at least one selected from polyethylene terephthalate (PET), polyimide (PI), polyamide (PAI), polyethylene naphthalate (PEN), and polycarbonate (PC). The base film 211 may define the upper surface 200US of the first input sensor 200.

[0140] A first conductive layer 212 is disposed on the lower surface of a base film 211. The first conductive layer 212 comprises a conductive material. For example, the first conductive layer 212 may comprise copper, but is not limited thereto.

[0141] The first conductive layer 212 may include multiple conductive patterns. These multiple conductive patterns can constitute a coil for forming electromagnetic resonance. For example, a portion of the multiple conductive patterns may also constitute... Figure 5b The first coil 211, and another portion of the plurality of conductive patterns constitutes the second coil 212. Alternatively, the plurality of conductive patterns may be a configuration entirely included in the first coil 211 or entirely included in the second coil 212.

[0142] A first insulating layer 213 is disposed between a base film 211 and a second conductive layer 214. The first insulating layer 213 may include, but is not limited to, epoxy resin. The first insulating layer 213 may cover the first conductive layer 212, thereby electrically insulating the first conductive layer 212 from the outside.

[0143] The second conductive layer 214 is disposed on the lower surface of the first insulating layer 213. The second conductive layer 214 may include a plurality of conductive patterns. For example, a portion of the plurality of conductive patterns may constitute the first coil 211, and another portion of the plurality of conductive patterns may constitute the second coil 212. Alternatively, the plurality of conductive patterns may be entirely included in the first coil 211 or entirely included in the second coil 212.

[0144] The second insulating layer 215 covers the underside of the second conductive layer 214 to protect the second conductive layer 214. The second insulating layer 215 may define the lower surface 200BS of the first input sensor 200.

[0145] Reference Figure 5b The first input sensor 200 may include a plurality of first coils 211 and a plurality of second coils 212. The first coils 211 may be referred to as driving coils, and the second coils 212 may be referred to as sensing coils.

[0146] Each first coil 211 can be arranged in an insulated, cross-shaped configuration with each second coil 212. This is for sensing the electromagnetic pen PN (refer to...). Figure 1a The first coil 211 provides an AC signal to its first terminal 211t in sequence. The first coil 211 can be configured as a closed loop, so that when current flows through it, magnetic field lines can be induced between the first coil 211 and the second coil 212. The second coil 212 outputs a signal sensing the induced electromagnetic force radiated from the electromagnetic pen PN to its second terminal 212t.

[0147] exist Figure 5b The configuration of the digitizer is illustrated illustratively, but is not limited thereto. Furthermore, the arrangement of the first coil 211 and the second coil 212 is not limited to... Figure 5b The situation shown can be transformed in various ways.

[0148] Refer again Figure 5a A first support plate 300 is disposed between the electronic panel 100 and the first input sensor 200. As described above, the first input sensor 200 is provided with conductive layers 212 and 214 for sensing external input caused by the electromagnetic pen PN. The external input caused by the electromagnetic pen PN is applied to the upper side of the electronic panel 100, specifically to the window portion 500 (see reference). Figure 2a ).

[0149] The first support plate 300 of the present invention can be electrically insulating. In the case where a folded portion 330 of a conductive material is included, since it is disposed only in the folded region FA, the area overlapping with the first input sensor 200 can be small. Therefore, the first input sensor 200 can reliably sense external input from the first support plate 300 without electrical interference.

[0150] Figures 6a to 6c This is a cross-sectional view of an electronic device according to an embodiment of the present invention. Figures 6a to 6c The configuration arranged on the lower side of the electronic panel 100 is shown only as an example. Hereinafter, refer to... Figures 6a to 6c To illustrate the present invention. On the other hand, regarding the relationship with... Figures 1a to 5b The same components described herein are assigned the same symbols, and repeated descriptions are omitted.

[0151] like Figure 6aAs shown, in the electronic device 1000, the edge of the second support plate 400 may protrude outward more than the edge of the first support plate 300. Specifically, the edge 410_E of the first plate 410 protrudes outward by a predetermined distance GP more than the edge 310_E of the first support portion 310. Similarly, the edge 420_E of the second plate 420 protrudes outward more than the edge 320_E of the second support portion 320.

[0152] Therefore, when an external impact FS is applied to the electronic device 1000, such as Figure 6a As shown, an impact FS can be applied to the second support plate 400, which protrudes outwards the most. The second support plate 400 is made of metal or the like, and therefore has high rigidity, thus it can be stable against the impact FS.

[0153] As described above, to prevent a decrease in the sensitivity of the first input sensor 200, the first support plate 300 is formed of glass or plastic with relatively low rigidity. According to the present invention, the second support plate 400 absorbs external impacts FS, thereby preventing the application of impacts FS to the first support plate 300 and improving the reliability of the electronic device 1000.

[0154] Or, such as Figure 6b As shown, the second support plate 400C may further include at least one bent portion. Specifically, the first plate 410C may include a first flat portion 411 and a first bent portion 412. The first flat portion 411 overlaps with the first non-folded region NFA1, and the first bent portion 412 extends from the first flat portion 411 in an upward direction by bending. The first bent portion 412 may extend to the edge 310_E of the first input sensor 200 and the first support portion 310, thereby protecting the first support portion 310. Similarly, the second plate 420C may include a second flat portion 421 and a second bent portion 422, and the second bent portion 422 may extend to the edge 320_E of the second support portion 320 to protect the second support portion 320.

[0155] An external impact FS can be applied to the first bending portion 412 or the second bending portion 422. This prevents the external impact FS from being directly applied to the first support plate 300, thereby preventing damage to the first support plate 300 and improving the reliability of the electronic device 1000.

[0156] Or, such as Figure 6cAs shown, the second support plate 400C1 may further include multiple bends. Specifically, the first plate 410C1 may include a first flat portion 411, a first bend 412, and an additional first bend 413. The first flat portion 411 overlaps with the first non-folded region NFA1, and the first bend 412 extends from the first flat portion 411 in an upward direction by bending. The additional first bend 413 extends from the first bend 412 in a downward direction by bending.

[0157] In the direction of observation of the first support portion 310, the first bend 412 and the additional first bend 413 overlap with the edge 310_E of the first support portion 310. Therefore, the edge 310_E of the first support portion 310 can be protected by the additional first bend 413 and the first bend 412. Thus, it is possible to prevent external impacts FS from being directly applied to the first support plate 300.

[0158] Similarly, the second plate 420C1 may include a second flat portion 421, a second bent portion 422, and an additional second bent portion 423. In the direction of viewing the second support portion 320, the second bent portion 422 and the additional second bent portion 423 overlap with the edge 320_E of the second support portion 320. The edge 320_E of the second support portion 320 can be protected by the second bent portion 422 and the additional second bent portion 423, thereby ensuring stability against external impacts FS.

[0159] According to the present invention, by making the edge of the second support plate 400 protrude further outward than the edges 310_E and 320_E of the first support plate 300, damage to the first support plate 300 can be prevented. This improves the reliability of the electronic device 1000.

[0160] The present invention has been described above with reference to preferred embodiments. However, those skilled in the art or those of ordinary skill in the art should understand that various modifications and alterations can be made to the present invention without departing from the scope of the concept and technical field of the invention as set forth in the claims. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed specification, but should be determined solely by the claims.

Claims

1. An electronic device comprising: An electronic panel includes a plurality of light-emitting portions and an active region configured with the plurality of light-emitting portions. The active region includes a foldable region foldable about a folding axis extending along a first direction, and a first non-foldable region and a second non-foldable region that are spaced apart from each other and adjacent to the foldable region in a second direction intersecting the first direction. A first support plate is disposed on the lower side of the electronic panel and includes a folded portion that overlaps with the folded area, and a first support portion and a second support portion that are spaced apart from each other in the second direction and sandwich the folded portion therebetween. A second support plate, disposed below the first support plate, includes a first plate and a second plate spaced apart in the second direction and sandwiching the folded area therebetween, each including sides facing each other; the first plate and the second plate are respectively made of metal; and A first input sensor is disposed between the first support plate and the second support plate, and senses a first external input. The edges of the second support plate are located on the first plate and the second plate, respectively. The edge of the second support plate protrudes more than the edge of the first support plate along the second direction.

2. The electronic device according to claim 1, wherein, The distance between the edge of the second support plate and the edge of the first support plate is more than 100 μm and less than 500 μm.

3. The electronic device according to claim 1, wherein, The first support portion and the second support portion respectively comprise glass or plastic.

4. The electronic device according to claim 3, wherein, The folded portion comprises metal.

5. The electronic device according to claim 3, wherein, On a plane, a plurality of through portions are defined through the fold portion.

6. The electronic device according to claim 5, wherein, The folded portion has a grid shape on a plane.

7. The electronic device according to claim 1, wherein, The electronic panel further includes a second input sensor, which overlaps with the active area and senses a second external input. The second external input is different from the first external input.

8. The electronic device according to claim 1, wherein, The second support plate includes: a planar portion that overlaps with the electronic panel; and a bent portion that extends from the planar portion by bending and does not overlap with the electronic panel in the planar plane. When viewed from the second direction, the bent portion overlaps with the edge of the first support plate.

9. The electronic device according to claim 8, wherein, The second support plate further includes: an additional bent portion, extending from the bent portion by bending. When viewed from the second direction, the bent portion and the additional bent portion overlap with the edge of the first support plate.

10. An electronic device comprising: An electronic panel includes a foldable region foldable about a folding axis extending along a first direction, and a first non-foldable region and a second non-foldable region that are spaced apart from each other and adjacent to the foldable region in a second direction intersecting the first direction. A first support plate is disposed on the lower side of the electronic panel and includes a folded portion that overlaps with the folded area, and a first support portion and a second support portion that are spaced apart from each other in the second direction and sandwich the folded portion therebetween. A second support plate, disposed below the first support plate, includes a first plate and a second plate spaced apart in the second direction and sandwiching the folded area therebetween, each including sides facing each other; the first plate and the second plate are respectively made of metal; and An input sensor is configured between the first support plate and the second support plate to sense external input. The edges of the second support plate are located on the first plate and the second plate, respectively. On the plane, the second support plate protrudes outward more than the edge of the first support plate.

Images