A high-precision laser chip temperature adjustment device

Abstract

The present invention relates to the technical field of heat dissipation and temperature reduction, and provides a high-precision laser chip temperature adjustment device, which includes a cooling circuit pipeline and a micro water pump, and further includes: a heat conduction column, the surface of the cooling circuit pipeline is connected to the laser chip through a plurality of heat conduction columns; a heat dissipation cavity for cooling the liquid in the cooling circuit pipeline, an upper partition plate and a lower partition plate are installed in the cooling circuit pipeline, and the space between the upper partition plate and the lower partition plate is the heat dissipation cavity. The upper partition plate and the lower partition plate are respectively provided with water spraying holes and return holes. An air inlet and an air outlet are arranged on the outer wall of the heat dissipation cavity, and waterproof breathable membranes are installed in both the air inlet and the air outlet. A rotating shaft is rotatably installed in the heat dissipation cavity, and a plurality of rotating blades are fixedly connected to the side surface of the rotating shaft. The liquid sprayed out from the water spraying holes hits the rotating blades, causing the rotating blades to rotate. Through the arrangement of the heat dissipation cavity and the rotating blades in the present invention, the electrolyte in the cooling circuit pipeline is automatically cooled when passing through the heat dissipation cavity.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation and temperature reduction, and particularly to a temperature regulation device for a high-precision laser chip. Background Art

[0002] When a high-precision laser is working, a large amount of heat energy will be generated by its chip, which will cause the working medium of the laser to heat up, thereby affecting the wavelength, output power, mode stability and service life of the laser. When the temperature is too high, the output optical wavelength of the laser will drift, which will cause the laser conversion efficiency to be greatly reduced and the overall system stability to be poor. Therefore, a high-precision laser requires a heat dissipation device with outstanding cooling performance to prevent thermal damage and shorten the service life or even cause damage. In the prior art, the more common temperature control methods are water cooling and refrigerant cooling. Refrigerant cooling requires a large amount of additional energy consumption, and it is difficult for water cooling to automatically cool the water. Therefore, a temperature regulation device for a high-precision laser chip is needed to solve the above problems. Summary of the Invention

[0003] The purpose of the present invention is to provide a temperature regulation device for a high-precision laser chip, aiming to solve the problems mentioned in the background art.

[0004] To achieve the above purpose, the present invention provides the following technical solution. A temperature regulation device for a high-precision laser chip includes a cooling circuit pipe and a micro water pump. The micro water pump is installed on the cooling circuit pipe. The temperature regulation device for a high-precision laser chip further includes:

[0005] A heat conducting column, the surface of the cooling circuit pipe is connected to the laser chip through a plurality of heat conducting columns;

[0006] A heat dissipation cavity for cooling the liquid in the cooling circuit pipe. An upper partition board and a lower partition board are fixedly connected to the inner wall of the cooling circuit pipe. The space between the upper partition board and the lower partition board is the heat dissipation cavity. Spraying holes and return holes are respectively arranged on the upper partition board and the lower partition board. An air inlet and an air outlet are arranged on the outer wall of the heat dissipation cavity. Waterproof breathable membranes are installed in both the air inlet and the air outlet. A rotating shaft is rotatably installed in the heat dissipation cavity. A plurality of rotating blades are fixedly connected to the side surface of the rotating shaft. The liquid sprayed out from the spraying holes hits the rotating blades, causing the rotating blades to rotate.

[0007] As a further solution of the present invention, the heat dissipation cavity is located above the laser chip. The heat dissipation cavity is vertically arranged. The upper partition board is directly above the lower partition board. The cooling circuit pipe is filled with electrolyte. During normal use, the plane of the electrolyte is lower than the lower partition board.

[0008] As a further solution of the present invention, the water spray holes are located above the left or right of the rotating shaft. When the water spray holes are located above the left of the rotating shaft, the air inlet is located above the air outlet; when the water spray holes are located above the right of the rotating shaft, the air inlet is located below the air outlet. The electrolyte sprayed out of the water spray holes strikes the edge position of the rotating blades, and a plurality of the rotating blades are circumferentially arrayed about the center line of the rotating shaft.

[0009] As a further solution of the present invention, first guide grooves are provided on both the left and right side walls of the return hole. A first blocking block is arranged in the left first guide groove. The first blocking block is slidably connected with the inner wall of the first guide groove. The first blocking block is connected to the end face of the first guide groove through a first return spring. A first electromagnet is embedded in the lower partition board. A liquid collecting groove is arranged on one side of the first electromagnet. The first electromagnet is connected to the right first guide groove. The liquid collecting groove is arranged on the bottom surface of the lower partition board. One end of a first wire is arranged in the liquid collecting groove, and the other end of the first wire is connected to the controller of the micro water pump. The first blocking block is made of ferromagnetic material. When the first guide groove is filled with electrolyte, the first electromagnet is energized to attract the first blocking block, and the first blocking block moves to block the return hole.

[0010] As a further solution of the present invention, second guide grooves are provided on both the left and right side walls of the water spray holes. A second blocking block is arranged in the left second guide groove. The second blocking block is made of ferromagnetic material. The second blocking block is slidably connected with the inner wall of the second guide groove. The second blocking block is connected to the end face of the second guide groove through a second return spring. A second electromagnet is embedded in the upper partition board. The second electromagnet is connected to the right second guide groove. The second electromagnet is connected to the first electromagnet through a second wire. When the first electromagnet is energized, the second electromagnet is also energized to attract the second blocking block, and the second blocking block moves to block the water spray holes.

[0011] As a further solution of the present invention, when the device is used normally, the liquid collecting groove is not filled with electrolyte. When the device is placed upside down, the liquid collecting groove is filled with electrolyte.

[0012] As a further solution of the present invention, when the first electromagnet is energized, the controller of the micro water pump causes the micro water pump to stop working. The micro water pump is installed outside the laser housing, so as to avoid the heat generated by the micro water pump affecting the laser chip.

[0013] In summary, the beneficial effects of the present invention are as follows:

[0014] In the present invention, through the provision of a heat dissipation cavity and rotating blades, the electrolyte in the cooling circuit pipe is automatically cooled when passing through the heat dissipation cavity. Specifically, when the electrolyte sprays out from the water spraying holes, it strikes the rotating blades, causing the rotating blades to rotate, generating an air flow in the heat dissipation cavity, and the air flow cools the electrolyte. In this way, the overall temperature of the cooling circuit pipe drops, and thus the laser chip can be cooled better. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings, where:

[0016] Figure 1 It is a schematic diagram of the overall structure of a high-precision laser chip temperature regulation device according to an embodiment of the present invention.

[0017] Figure 2 is Figure 1 a partial enlarged schematic diagram of part A in

[0018] Figure 3 is Figure 2 a partial enlarged schematic diagram of part B in

[0019] Figure 4 is Figure 2 a partial enlarged schematic diagram of part C in

[0020] Reference numerals: 1 - cooling circuit pipe, 2 - heat conducting column, 3 - laser chip, 4 - micro water pump, 5 - heat dissipation cavity, 6 - upper partition board, 7 - lower partition board, 8 - air inlet, 9 - air outlet, 10 - waterproof and breathable membrane, 11 - rotating shaft, 12 - rotating blade, 13 - water spraying hole, 14 - return hole, 15 - first wire, 16 - second wire, 17 - first electromagnet, 18 - liquid collecting tank, 19 - first guide groove, 20 - first plug, 21 - first return spring, 22 - second electromagnet, 23 - second guide groove, 24 - second plug, 25 - second return spring. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further details the present invention in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0022] The following details the specific implementation of the present invention in conjunction with specific embodiments.

[0023] Please refer toFigure 1 and Figure 2 A high-precision laser chip temperature regulation device provided by an embodiment of the present invention includes a cooling circuit pipe 1 and a micro water pump 4. The micro water pump 4 is installed on the cooling circuit pipe 1. The high-precision laser chip temperature regulation device further includes:

[0024] Thermal conduction columns 2. The surface of the cooling circuit pipe 1 is connected to the laser chip 3 through a plurality of thermal conduction columns 2;

[0025] A heat dissipation cavity 5 for cooling the liquid in the cooling circuit pipe 1. An upper partition 6 and a lower partition 7 are fixedly connected to the inner wall of the cooling circuit pipe 1. The space between the upper partition 6 and the lower partition 7 is the heat dissipation cavity 5. A water spraying hole 13 and a return hole 14 are respectively arranged on the upper partition 6 and the lower partition 7. An air inlet 8 and an air outlet 9 are arranged on the outer wall of the heat dissipation cavity 5. Waterproof breathable membranes 10 are installed in both the air inlet 8 and the air outlet 9. A rotating shaft 11 is rotatably installed in the heat dissipation cavity 5. A plurality of rotating blades 12 are fixedly connected to the side surface of the rotating shaft 11. The liquid sprayed out from the water spraying hole 13 hits the rotating blades 12, causing the rotating blades 12 to rotate.

[0026] In the embodiment of the present invention, the heat dissipation cavity 5 is located above the laser chip 3. The heat dissipation cavity 5 is vertically arranged. The upper partition 6 is directly above the lower partition 7. The cooling circuit pipe 1 is filled with electrolyte. During normal use, the plane of the electrolyte is lower than the lower partition 7. The water spraying hole 13 is located above the left or right of the rotating shaft 11. When the water spraying hole 13 is located above the left of the rotating shaft 11, the air inlet 8 is located above the air outlet 9; when the water spraying hole 13 is located above the right of the rotating shaft 11, the air inlet 8 is located below the air outlet 9; the electrolyte sprayed out from the water spraying hole 13 hits the edge position of the rotating blade 12. A plurality of the rotating blades 12 are arranged in a circumferential array about the center line of the rotating shaft 11. During use, the micro water pump 4 is started. The electrolyte is sprayed out from the water spraying hole 13 and hits the rotating blades 12. The rotating blades 12 rotate, generating an air flow in the heat dissipation cavity 5 to cool the electrolyte. In this way, the overall temperature of the cooling circuit pipe 1 drops, and then the laser chip 3 can be better cooled. The micro water pump 4 is installed outside the laser housing to avoid the heat generated by the micro water pump 4 affecting the laser chip 3.

[0027] Refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4In one embodiment of the present invention, first guide grooves 19 are provided on the left and right side walls of the reflux hole 14, and a first blocking block 20 is provided in the first guide groove 19 on the left side. The first blocking block 20 is slidably connected to the inner wall of the first guide groove 19, and the first blocking block 20 is connected to the end surface of the first guide groove 19 through a first return spring 21. A first electromagnet 17 is embedded in the lower partition 7, and a liquid collecting tank 18 is provided on one side of the first electromagnet 17. The first electromagnet 17 is connected to the first guide groove 19 on the right side. The liquid collecting tank 18 is provided on the bottom surface of the lower partition 7, and one end of the first wire 15 is provided in the liquid collecting tank 18. The other end of the first wire 15 is connected to the controller of the micro water pump 4. The first blocking block 20 is made of ferromagnetic material and can be attracted by a magnet. When the first guide groove 18 is filled with electrolyte, the first electromagnet 17 is energized to attract the first blocking block 20, and the first blocking block 20 moves to block the reflux hole 14. The left and right side walls of the water spray hole 13 are both provided with second guide grooves 23, and a second blocking block 24 is provided in the second guide groove 23 on the left. The second blocking block 24 is made of ferromagnetic material, and the second blocking block 24 is slidably connected to the inner wall of the second guide groove 23. The second blocking block 24 is connected to the end face of the second guide groove 23 through a second return spring 25. A second electromagnet 22 is embedded in the upper partition 6, and the second electromagnet 22 is connected to the second guide groove 23 on the right. The second electromagnet 22 is connected to the first electromagnet 17 through a second wire 16. When the first electromagnet 17 is energized, the second electromagnet 22 will also be energized, thereby attracting the second blocking block 24. The second blocking block 24 moves to block the water spray hole 13, and a battery is built into the micro water pump 4.

[0028] In an embodiment of the present invention, when the device is in normal use, that is, when the device is upright, the sump 18 is not filled with electrolyte. When the device is inverted or tilted, the sump 18 is filled with electrolyte. At this time, the first electromagnet 17 and the second electromagnet 22 are both energized, and the water spray hole 13 and the return hole 14 are both blocked, preventing a large amount of electrolyte from entering the heat dissipation cavity 5, thereby preventing the waterproof breathable membrane 10 from being ruptured by water pressure. In addition, when the first electromagnet 17 is energized, the controller of the micro water pump 4 causes the micro water pump 4 to stop operating because the water spray hole 13 and the return hole 14 are blocked, and the electrolyte cannot circulate in the cooling circuit pipe 1.

[0029] The working process of the embodiment of the present invention is as follows: When it is necessary to cool the laser chip 3, the micro water pump 4 is started, and the electrolyte sprays out from the water spraying holes 13 and strikes the rotating blades 12. The rotating blades 12 rotate, causing an air flow to be generated in the heat dissipation cavity 5 to cool the electrolyte. In this way, the overall temperature of the cooling circuit pipe 1 drops, and thus the laser chip 3 can be cooled better. The micro water pump 4 is installed outside the laser housing to prevent the heat generated by the micro water pump 4 from affecting the laser chip 3.

[0030] For those skilled in the art, although several embodiments and examples of the present invention have been described, these embodiments and examples are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention and are included in the scope of the invention described in the claims and its equivalents.

[0031] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only includes an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A high-precision laser chip temperature regulation device, comprising a cooling circuit pipeline and a micro water pump, the micro water pump is installed on the cooling circuit pipeline, and is characterized in that, The high-precision laser chip temperature adjustment device further includes: Thermal conduction columns, and the surface of the cooling circuit pipe is connected to the laser chip through a plurality of thermal conduction columns; A heat dissipation cavity for cooling the liquid in the cooling circuit pipe. An upper partition board and a lower partition board are fixedly connected to the inner wall of the cooling circuit pipe. The space between the upper partition board and the lower partition board is the heat dissipation cavity. A water spraying hole and a return hole are respectively arranged on the upper partition board and the lower partition board. An air inlet and an air outlet are arranged on the outer wall of the heat dissipation cavity. Waterproof breathable membranes are installed in both the air inlet and the air outlet. A rotating shaft is rotatably installed in the heat dissipation cavity. A plurality of rotating blades are fixedly connected to the side surface of the rotating shaft. The liquid sprayed out from the water spraying hole hits the rotating blades, causing the rotating blades to rotate; First guide grooves are arranged on the left and right side walls of the return hole. A first plug block is arranged in the left first guide groove. The first plug block is slidably connected with the inner wall of the first guide groove. The first plug block is connected to the end face of the first guide groove through a first return spring. A first electromagnet is embedded in the lower partition board. A liquid collecting groove is arranged on one side of the first electromagnet. The first electromagnet is connected to the right first guide groove. The liquid collecting groove is arranged on the bottom surface of the lower partition board. One end of a first wire is arranged in the liquid collecting groove. The other end of the first wire is connected to the controller of the micro water pump. The first plug block is made of ferromagnetic material. When the first guide groove is filled with electrolyte, the first electromagnet is electrified to attract the first plug block, and the first plug block moves to block the return hole; Second guide grooves are arranged on the left and right side walls of the water spraying hole. A second plug block is arranged in the left second guide groove. The second plug block is made of ferromagnetic material. The second plug block is slidably connected with the inner wall of the second guide groove. The second plug block is connected to the end face of the second guide groove through a second return spring. A second electromagnet is embedded in the upper partition board. The second electromagnet is connected to the right second guide groove. The second electromagnet is connected to the first electromagnet through a second wire. When the first electromagnet is electrified, the second electromagnet is also electrified to attract the second plug block, and the second plug block moves to block the water spraying hole; When the device is used normally, the liquid collecting groove is not filled with electrolyte. When the device is placed upside down, the liquid collecting groove is filled with electrolyte; When the first electromagnet is electrified, the controller of the micro water pump makes the micro water pump stop working.

2. The high-precision laser chip temperature regulation device according to claim 1, wherein The heat dissipation cavity is higher than the laser chip. The heat dissipation cavity is vertically arranged. The upper partition board is directly above the lower partition board. The cooling circuit pipe is filled with electrolyte. When used normally, the plane of the electrolyte is lower than the lower partition board.

3. The high-precision laser chip temperature regulation device according to claim 2, wherein, The water spraying hole is located above the left or right of the rotating shaft. The electrolyte sprayed out from the water spraying hole hits the edge position of the rotating blade. A plurality of the rotating blades are arranged in a circular array about the center line of the rotating shaft.

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