A computing circuit board and a computing device comprising the computing circuit board

Abstract

The present invention discloses a computing circuit board and a computing device including the computing circuit board. The computing circuit board includes a copper foil layer, a welding layer, a working chip and a copper sheet. The working chip and the copper sheet are respectively attached to the copper foil layer through the welding layer, and the copper sheet is arranged between adjacent working chips. The welding layer includes a welding layer body and an exhaust gap arranged on the welding body layer. The computing circuit board and the computing device including the computing circuit board of the present invention can exhaust the gas in the solder paste by arranging the exhaust gap on the welding layer, so that the welding is full and free of bubbles, and can also prevent excess solder from seeping out of the working chip and the copper sheet, thereby ensuring the reliability of the connection.

Description

[0001] This application is a divisional application of a Chinese patent application with an application date of November 14, 2018, application number 201811354624.8, and invention name “A computing circuit board and a computing device including the computing circuit board”. Technical Field

[0002] The present invention relates to a circuit board, in particular to a computing circuit board with tight soldering connection and no bubbles. The present invention also relates to a computing device comprising the computing circuit board. Background Art

[0003] PCB, or printed circuit board, is a general term for commonly used circuit boards. It is divided into cardboard, semi-fiberglass board, fiberglass board, metal substrate, etc. according to the material. Among them, PCB boards in the form of metal substrates have good heat dissipation function. Generally, single-sided PCB boards are composed of three layers, namely copper foil layer, insulation thermal conductive layer and metal base layer. The surface mount (SMT) steps of single-sided PCB boards are divided into: pre-coating solder paste → patch → reflow soldering → inspection and electrical testing. Reflow soldering is divided into four zones: heating zone, insulation zone, welding zone and cooling zone. When the PCB board enters the heating zone, the solvent and gas in the solder paste evaporate, and at the same time, the flux in the solder paste wets the pads, component ends and pins, the solder paste softens, collapses and covers the pads, isolating the pads and component pins from oxygen. When the PCB board enters the insulation zone, the PCB board and components are fully preheated. When the PCB enters the welding zone, the temperature rises rapidly, causing the solder paste to melt. The liquid solder wets, diffuses, flows or reflows the pads, component ends and pins of the PCB to form solder joints. When the PCB enters the cooling zone, the solder joints solidify, and the reflow soldering is completed. However, when the PCB is in the heating zone, the gas in the solder paste cannot be discharged in time, resulting in bubbles in the PCB after welding, affecting the heat dissipation and conductive performance. Summary of the invention

[0004] The object of the present invention is to provide a computing circuit board and a computing device including the computing circuit board, which can avoid the generation of bubbles during the circuit board surface mounting process and ensure that the product has good heat dissipation and conductive properties.

[0005] In order to achieve the above-mentioned purpose, the computer circuit board of the present invention includes a copper foil layer, a welding layer, a working chip and a copper sheet, wherein the working chip and the copper sheet are respectively attached to the copper foil layer through the welding layer, and the copper sheet is arranged between adjacent working chips, wherein the welding layer includes a welding layer body and an exhaust gap arranged on the welding body layer.

[0006] In one embodiment of the above-mentioned computer circuit board, the exhaust gap includes an open end, and at the open end the welding layer body includes a first body end and a second body end separated from each other.

[0007] In one embodiment of the above-mentioned computer circuit board, the exhaust gap is in the shape of a long rectangle or a fan.

[0008] In one embodiment of the above-mentioned computer circuit board, the welding layer body includes a first side and a second side opposite to each other, and the exhaust gap is arranged on the first side and / or the second side.

[0009] In one embodiment of the above-mentioned computer circuit board, a metal substrate is further included. The copper foil layer includes a first surface and a second surface. The working chip and the copper sheet are attached to the first surface, and the metal substrate is attached to the second surface.

[0010] In one embodiment of the above-mentioned computing circuit board, the working chips are multiple and arranged along a first direction.

[0011] In one embodiment of the computing circuit board described above, the distance between adjacent working chips increases / decreases along the first direction.

[0012] In one embodiment of the above-mentioned computing circuit board, the working chips are arranged in multiple rows along the second direction.

[0013] In one implementation of the above-mentioned computing circuit board, the first direction is perpendicular to the second direction.

[0014] The computing device of the present invention comprises a power supply unit, a control unit connected to the power supply unit, and a computing unit connected to the control unit and the power supply unit, wherein the computing unit is integrated on one or more computing boards, wherein the computing board is the above-mentioned computing circuit board.

[0015] The beneficial effect of the present invention is that the computer circuit board of the present invention and the computing device including the computer circuit board can not only discharge the gas in the solder paste to make the welding full and free of bubbles by setting an exhaust gap on the welding layer, but also prevent excess solder from seeping out of the working chip and the copper sheet, thereby ensuring the reliability of the connection.

[0016] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a top view schematic diagram of the computing circuit board of the present invention when no working chip and copper sheet are attached;

[0018] Figure 2 for Figure 1 AA cross-sectional view of (after attaching the working chip and copper sheet);

[0019] Figure 3It is a structural schematic diagram of an embodiment of a welding layer of a computing circuit board of the present invention;

[0020] Figure 4 It is a structural schematic diagram of an embodiment of a welding layer of a computing circuit board of the present invention;

[0021] Figure 5 A block diagram of a computing device according to an embodiment of the present invention.

[0022] Among them, the reference numerals

[0023] 20: Computing circuit board

[0024] 100: Copper foil layer

[0025] 200: welding layer

[0026] 210: Welding layer body

[0027] 211: First subject end

[0028] 212: Second main end

[0029] 210a: First side

[0030] 210b: Second side

[0031] 210c: Third side

[0032] 210d: Fourth side

[0033] 220: Exhaust clearance

[0034] 220a: Open end

[0035] 200': welding layer

[0036] 210': Welding layer body

[0037] 210a': Edge

[0038] 220': Exhaust clearance

[0039] 300: Working chip

[0040] 400: Copper sheet

[0041] 500: Metal substrate

[0042] 600: Insulation and thermal conductive layer

[0043] 10: Computing Devices

[0044] 11: Power supply unit

[0045] 12: Control unit

[0046] 13: Computational Unit

[0047] 13A: Computing board

[0048] 14: Cooling unit

[0049] X: First direction

[0050] Y: Second direction

[0051] S1: Side 1

[0052] S2: Side 2

[0053] p1, p2, p3: spacing DETAILED DESCRIPTION

[0054] The technical solution of the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments to further understand the purpose, solution and effect of the present invention, but it is not intended to limit the scope of protection of the claims attached to the present invention.

[0055] References in the specification to "an embodiment", "another embodiment", "this embodiment", etc., mean that the described embodiment may include specific features, structures or characteristics, but not every embodiment must include these specific features, structures or characteristics. In addition, such expressions do not refer to the same embodiment. Further, when describing specific features, structures or characteristics in conjunction with an embodiment, whether or not there is an explicit description, it has been shown that it is within the knowledge of those skilled in the art to combine such features, structures or characteristics into other embodiments.

[0056] Certain words are used in the specification and subsequent claims to refer to specific components or parts. It should be understood by those of ordinary skill in the art that technical users or manufacturers may refer to the same component or part by different nouns or terms. This specification and subsequent claims do not use differences in names as a way to distinguish components or parts, but rather use differences in functions of components or parts as the criteria for distinction. The words "include" and "comprising" mentioned throughout the specification and subsequent claims are open-ended terms and should be interpreted as "including but not limited to". In addition, the word "connected" herein includes any direct and indirect means of connection.

[0057] It should be noted that in the description of the present invention, the orientation or position relationship indicated by the terms "lateral", "longitudinal", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. For the sake of clarity, the order terms such as "first", "second", "third", "fourth", etc. mentioned herein are used to distinguish an element, region, or part from another identical or similar element, region, or part, rather than to limit a specific element, region, or part.

[0058] like Figure 1 and Figure 2 As shown, the computing circuit board 20 of the present invention includes a copper foil layer 100, a welding layer 200, a working chip 300 and a copper sheet 400, and the working chip 300 and the copper sheet 400 are respectively attached to the copper foil layer 100 through the welding layer 200. In detail, there are multiple working chips 300 and copper sheets 400, and the working chip 300 is, for example, various computing and control chips. As the working efficiency of the working chip 300 increases, the heat generated by the working chip 300 also increases. The copper sheet 400 has a good heat dissipation effect. Soldering the copper sheet 400 on the PCB board is an effective heat dissipation method. Generally speaking, the copper sheet 400 is set between adjacent working chips 300. In addition, the copper sheet 400 can also reduce line power loss.

[0059] like Figure 1 As shown, the welding layer 200 includes a welding layer body 210 and a venting gap 220 , and the venting gap 220 is disposed on the welding body layer 210 .

[0060] The present invention attaches the working chip 300 and the copper sheet 400 to the copper foil layer 100 through a welding layer 200 having an exhaust gap 220, which can not only discharge the gas generated by the solder paste in the welding layer 200 in the temperature rising zone to ensure fullness and absence of bubbles after welding, but also prevent excess solder from seeping out of the working chip 300 and the copper sheet 400.

[0061] Especially now that the heat generated by the computer circuit board 20 is getting bigger and bigger, in order to achieve better heat dissipation effect, the size of the copper sheet 400 is generally set to be larger, so the amount of gas generated by the welding layer 200 in the temperature rise zone will be more and more difficult to discharge. The design of the welding layer 200 of the present invention can discharge the gas in time without affecting the welding quality in the subsequent stage, thereby improving the reliability of the product.

[0062] like Figure 3 and Figure 4As shown, the exhaust gap 220 of the welding layer 200 includes an open end 220a, and at the open end 220a, the welding layer body 210 includes a first body end 211 and a second body end 212 separated from each other. When the computer circuit board 20 enters the temperature rise zone, a large amount of gas is generated in the solder paste of the welding layer 200 due to the temperature rise, and the large amount of gas is discharged through the guidance of the exhaust gap 220. In more detail, the large amount of gas follows the exhaust gap 220 and is discharged through the open end 220a located at the tail of the exhaust gap 220, that is, it is discharged to the outside atmosphere through the gap between the first body end 211 and the second body end 212 of the welding layer body 210.

[0063] It should be noted that the welding layer can be set with at least one exhaust gap, or multiple exhaust gaps can be set according to the shape and size of the welding layer. The multiple exhaust gaps can be of uniform shape and size, or of different shapes and sizes, or some of the exhaust gaps have the same shape and size, which are all adjusted according to actual needs and are not limited by the present invention.

[0064] In addition, the shape and quantity of each welding layer body 210 of the welding layer 200 are set according to the shape and quantity of the working chip 300 and the copper sheet 400 to be welded. Figure 3 and Figure 4 The embodiments shown are illustrative.

[0065] like Figure 3 As shown, the welding layer body 210 of the welding layer 200 is rectangular, including a first side 210a and a second side 210b, the first side 210a and the second side 210b are arranged opposite to each other, and the exhaust gap 220 is arranged on the first side 210a and the second side 210b. In detail, the exhaust gaps 220 are arranged in sequence on the first side 210a and the second side 210b, respectively, and the whole is in a fishbone shape. In this embodiment, the exhaust gap 220 is arranged on the relatively long first side 210a and the second side 210b, which is conducive to timely exhaust. Of course, according to the layout and wiring requirements, the exhaust gap 220 can also be arranged on the relatively short third side 210c and the fourth side 210d, or the exhaust gap 220 is simultaneously arranged on the first side 210a and the second side 210b, the third side 210c and the fourth side 210d.

[0066] In this embodiment, the exhaust gap 220 is in the shape of a long rectangle, which not only allows for smooth exhaust but is also easy to manufacture. However, the present invention is not limited thereto, as long as the exhaust gap 220 has an open end for gas to be exhausted.

[0067] like Figure 4As shown, the welding layer body 210' of the welding layer 200' is circular, including an edge 210a', wherein the exhaust gap 220' extends from the middle of the welding layer body 210' to the edge 210a'. In detail, the exhaust gaps 220' are four arranged in sequence along the outer circumference of the welding layer body 210', and the shape of the exhaust gaps 220' is fan-shaped.

[0068] In this embodiment, the exhaust gap 220 ′ may also be in a rectangular, trapezoidal or other shapes, and the number may also be adjusted as required.

[0069] Combination Figure 1 and Figure 2 The computing circuit board 20 of the present invention further includes a metal substrate 500, and the copper foil layer 100 includes a first surface S1 and a second surface S2, wherein the first surface S1 is attached with the working chip 300 and the copper sheet 400, and the metal substrate 500 is attached to the second surface S2. Specifically, the metal substrate 500 is connected to the copper foil layer 100 by hot pressing through the insulating heat-conducting layer 600. When the heat of the components on the copper foil layer 100 is transferred to the metal substrate 500 through the insulating heat-conducting layer 600, the metal of the metal substrate 500 (for example, the metal substrate is an aluminum substrate) has a good heat dissipation effect, and can quickly dissipate the heat, thereby quickly cooling the components on the copper foil layer 100.

[0070] from Figure 1 From the top view of the computing circuit board 20, the computing circuit board 20 includes a first direction X and a second direction Y. The first direction X is perpendicular to the second direction Y. Among them, the working chips 300 are multiple and arranged in sequence along the first direction X. In addition, along the first direction X, the distance between adjacent working chips 300 gradually increases. As shown in the figure, the spacing p1 is smaller than the spacing p2, the spacing p2 is smaller than the spacing p3, and so on. Correspondingly, the size of the copper sheet 400 arranged between adjacent working chips 300 gradually increases, that is, the size of the copper sheet arranged at the spacing p2 is larger than the size of the copper sheet arranged at the spacing p1, the size of the copper sheet arranged at the spacing p3 is larger than the size of the copper sheet arranged at the spacing p2, and so on.

[0071] In other embodiments, the distance between adjacent working chips can be gradually reduced. Accordingly, the size of the copper sheet disposed between adjacent working chips is gradually reduced. In specific implementation, the end of the computing circuit board 20 where the working chips 300 are arranged more closely corresponds to the end with relatively high heat dissipation efficiency in the heat dissipation channel, and the end where the working chips 300 are arranged more sparsely is arranged at the end with relatively low heat dissipation efficiency in the heat dissipation channel. For example, the end where the working chips 300 are arranged more closely can be arranged at the air inlet, and the end where the working chips 300 are arranged more sparsely can be arranged at the air outlet, so as to balance the heat dissipation effect of each working chip 300, ensure the working stability of each working chip 300, and thus ensure the stable operation of the overall circuit.

[0072] like Figure 1 As shown, the working chips 300 can also be arranged in multiple rows along the second direction Y. In this embodiment, the working chips 300 are arranged in two rows along the second direction Y, wherein the number of rows can be adjusted as needed.

[0073] The computing device of the present invention may be a computing device for virtual currency mining, such as Figure 5 As shown, the computing device 10 of the present invention includes a power supply unit 11, a control unit 12, a computing unit 13, a heat dissipation unit 14, etc. The control unit 12 is connected to the power supply unit 11, and the computing unit 13 is connected to the control unit 12 and the power supply unit 11. The power supply unit 11 provides a power source for the control unit 12 and the computing unit 13. The computing unit 13 is used to run a specific algorithm to calculate the data. The control unit 12 is used to receive the calculation data of the computing unit 13, and analyze and process the calculation data and output it so as to obtain the corresponding virtual currency after communicating with the remote server. The heat dissipation unit 14 is used to dissipate heat from the computing unit 13 to ensure its normal operation. Among them, the computing unit 13 is, for example, integrated on a computing board 13A. Of course, the computing unit 13 may also include multiple computing boards 13A, combined with Figure 1 and Figure 5 As shown, the computing board 13A is the computing circuit board 20 mentioned above.

[0074] It should be noted that the connection method of the power supply unit, control unit and computing unit of the above-mentioned computing device is only an example of a specific implementation method, and the possibility of other connection methods is not excluded. The present invention does not limit the connection method of the various units of the computing device.

[0075] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art may make various corresponding changes and modifications based on the present invention, but these corresponding changes and modifications should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. A circuit board, characterized in that: include: substrate; A metal layer is disposed on the substrate; A plurality of working chips are arranged on a surface of the metal layer away from the substrate, wherein copper sheets are arranged between at least some of the working chips, and the plurality of working chips are arranged into at least one row along a first direction of the circuit board, and the circuit board has a first end and a second end in the first direction, and a size of the copper sheet between adjacent working chips in the first direction gradually increases from the first end to the second end, and a size of the copper sheet is positively correlated with a spacing between the working chips connected to the copper sheet, and when the circuit board is located in a heat dissipation channel, the first end is closer to an air inlet than the second end, so that the heat dissipation efficiency of the first end is higher than that of the second end.

2. The circuit board according to claim 1, characterized in that: The copper sheet is arranged between adjacent working chips.

3. The circuit board according to claim 1, characterized in that: In the first direction of the metal layer, sizes of copper sheets arranged between at least some adjacent working chips are different.

4. The circuit board according to claim 1, characterized in that: In the first direction of the metal layer, the size of the copper sheet disposed between at least a portion of adjacent working chips is larger than the size of the copper sheet disposed between at least another portion of adjacent working chips.

5. The circuit board according to any one of claims 1 to 4, characterized in that: The copper sheet is used to dissipate heat for the working chip connected to the copper sheet.

6. The circuit board according to any one of claims 1 to 4, characterized in that: The copper sheet is used to reduce line power loss between working chips connected to the copper sheet.

7. The circuit board according to any one of claims 1 to 4, characterized in that: The copper sheet is welded on the circuit board through a welding layer.

8. The circuit board according to claim 7, characterized in that: The welding layer is provided with at least one notch.

9. The circuit board according to claim 8, characterized in that: The notch extends from a region close to the middle of the welding layer to an edge of the welding layer.

10. The circuit board according to claim 8, characterized in that: The notch is an exhaust gap.

11. The circuit board according to claim 7, characterized in that: The shape of the welding layer is adapted to the shape of the copper sheet.

12. The circuit board according to claim 1, characterized in that: The substrate is a metal substrate.

13. The circuit board according to claim 1, characterized in that: Also includes: The insulating heat-conducting layer is arranged between the substrate and the metal layer, and is used to connect the substrate and the metal layer by hot pressing.

14. An electronic device, characterized in that: It comprises a heat dissipation channel and one or more computing boards, wherein the computing board is arranged in the heat dissipation channel, and the computing board is the circuit board according to any one of claims 1 to 13.

15. The electronic device according to claim 14, characterized in that: The first end of the heat dissipation channel is closer to the air inlet than the second end of the heat dissipation channel.

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