Substrate transfer platform and substrate processing device

Abstract

The embodiment of the present invention provides a substrate transfer platform and a substrate processing device. The substrate transfer platform includes an adsorption platform, an adhesive layer and an adsorption component. The adhesive layer is attached to one side of the adsorption platform, the adsorption component is attached to the adhesive layer, and the adhesive layer is a heat-insulating material layer. By setting the adhesive layer as a heat-insulating material layer, when the adsorption component adsorbs and transfers the substrate, the heat generated by the substrate cannot be transferred to the transfer platform, thereby avoiding the problem of the temperature of the substrate in the area being reduced, ensuring the thickness of the film layer in the area, and effectively improving the display effect of the display panel.

Description

Technical Field

[0001] The present invention relates to the technical field of display substrate manufacturing, and in particular to a substrate transfer platform and a substrate processing device. Background Art

[0002] With the development of display panel manufacturing technology, people have put forward higher requirements on the display effect and comprehensive performance of display panels and display devices.

[0003] As one of the important pillar industries of the electronic information industry, the flat panel display industry is crucial to the economic development of a country and region with its huge economic benefits and industrial agglomeration effects. Among them, organic light-emitting diode technology has gradually developed and is most likely to replace thin-film transistor display technology. Compared with traditional liquid crystal displays, organic light-emitting diode (OLED) devices have many advantages such as lighter weight, higher brightness, lower power consumption, faster response, higher clarity and higher luminous efficiency. However, in the process of manufacturing the above-mentioned display devices, it is generally necessary to go through more manufacturing processes to finally obtain the ideal product. Therefore, the quality of each process will directly affect the performance of the finished product. However, in the process of forming products in the prior art, when transferring the substrate, a transfer device such as a chuck is usually used for transfer, and other processes such as evaporation are performed during the transfer process. Since the transfer device adsorbed with the substrate has good thermal conductivity, the area in contact with the substrate has greater heat transfer, which leads to a decrease in the temperature of the substrate in this area. The lower temperature causes the molecules in the substrate to deposit or aggregate, and ultimately leads to a thicker film layer in this area during evaporation, and uneven film layer thickness in each area. When the display panel is finally formed and displayed, poor display problems such as color deviation are prone to occur in this area.

[0004] In summary, when preparing a display panel, heat transfer is easily generated between the substrate and the transfer equipment during the transfer process, which results in a thicker film layer in the area during film evaporation, ultimately affecting the display effect of the panel. Summary of the invention

[0005] The embodiment of the present invention provides a substrate transfer table to effectively improve the problem that during the preparation process of a display panel, heat transfer is easily generated between the substrate and the transfer table, resulting in a thicker film layer in the area, which ultimately affects the display effect of the panel.

[0006] In order to solve the above technical problems, the present invention provides a substrate transfer platform, which is used for adsorption and transfer of substrates, comprising:

[0007] Adsorption platform;

[0008] an adhesive layer, the adhesive layer being arranged at least at an edge region of the adsorption platform and attached to one side of the adsorption platform; and

[0009] An adsorption component, wherein the adsorption component is arranged on a side of the adhesive layer away from the adsorption platform;

[0010] Wherein, the adhesive layer is a thermal insulation material layer.

[0011] According to an embodiment of the present invention, a plurality of first holes are disposed on a side of the adhesive layer close to the adsorption platform.

[0012] According to an embodiment of the present invention, the height of the region corresponding to the first hole disposed in the adhesive layer is less than half of the thickness of the adhesive layer.

[0013] According to an embodiment of the present invention, a plurality of grooves are provided on a side of the adhesive layer close to the adsorption platform.

[0014] According to an embodiment of the present invention, the plurality of grooves are arranged at intervals, and adjacent grooves are connected.

[0015] According to an embodiment of the present invention, the adhesive force between the adhesive layer and the adsorption platform is greater than the adhesive force on a side of the adsorption component away from the adsorption platform.

[0016] According to an embodiment of the present invention, the adsorption component includes a first adsorption component and a second adsorption component;

[0017] The first adsorption component is attached to the adhesive layer, and the second adsorption component is arranged on a side of the first adsorption component away from the adsorption platform;

[0018] Wherein, a second hole is arranged on a side of the second adsorption component away from the adsorption platform.

[0019] According to an embodiment of the present invention, the insulating material layer includes any one of aerogel felt, polyethylene foam plastic and vacuum panel.

[0020] According to an embodiment of the present invention, the thermal conductivity of the adhesive layer is less than 0.18 W / (m·K).

[0021] According to a second aspect of an embodiment of the present invention, there is further provided a substrate processing device, wherein the substrate processing device comprises:

[0022] a substrate transfer platform, the substrate transfer platform being used to absorb and transfer the pre-processed substrate; and

[0023] A supporting portion, the supporting portion being used to support the pre-processed substrate;

[0024] Among them, the substrate transfer platform is the substrate transfer platform provided in the embodiment of the present application.

[0025] Beneficial effects of the embodiments of the present invention: Compared with the prior art, the embodiments of the present invention provide a substrate transfer platform and a substrate processing device. The substrate transfer platform includes an adsorption platform, an adhesive layer and an adsorption component, wherein the adhesive layer is attached to one side of the adsorption platform, the adsorption component is attached to the adhesive layer, and the adhesive layer is an insulating material layer. In the embodiment of the present application, by setting the adhesive layer as an insulating material layer, when the adsorption component adsorbs and transfers the substrate, in the area corresponding to the adsorption platform and the adsorption component and the substrate, the heat generated by the substrate cannot be directly transferred to the transfer platform, thereby avoiding the problem of a sudden drop in the temperature of the substrate in the area, thereby ensuring the thickness of the film layer in the area, avoiding the problem of color deviation of the formed display panel due to uneven film thickness, and effectively improving the overall performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of a processing technique for a display panel during preparation provided in the prior art;

[0028] Figure 2 A schematic diagram of the structure of a substrate transfer platform provided in an embodiment of the present application;

[0029] Figure 3 A schematic diagram of a partial structure of a transfer platform provided in an embodiment of the present application;

[0030] Figure 4 A schematic diagram of the arrangement of the first holes provided in an embodiment of the present application;

[0031] Figure 5 A schematic diagram of a partial structure of another transfer platform provided in an embodiment of the present application;

[0032] Figure 6 This is a schematic diagram of the working process of the substrate processing device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] In conjunction with the accompanying drawings in the embodiments of the present invention, the following disclosure provides different implementation methods or examples to implement different structures of the present invention. In order to simplify the present invention, the components and settings of specific examples are described below. In addition, the examples of various specific processes and materials provided by the present invention are examples that ordinary technicians in the field can recognize the application of other processes. All other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0034] In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0035] With the continuous development of display panel manufacturing technology, people have put forward higher requirements on the performance and display effect of display panels and display devices.

[0036] like Figure 1 As shown, Figure 1 The schematic diagram of the processing process of the display panel in the preparation process provided in the prior art is shown in FIG. Generally, the display panel needs to be processed through multiple processes, and in different processing steps, the pre-processed substrate needs to be transferred and transported before continuing different operations.

[0037] However, in the prior art, when transferring the pre-processed substrate 102, it is usually done with the help of components such as the adsorption platform 101 and the transfer auxiliary component 103. For example, the transfer auxiliary component 103 has a certain viscosity, one end of which is adsorbed to the pre-processed substrate 102, and the other end is adsorbed to the adsorption platform 101. When the adsorption platform 101 moves forward, the pre-processed substrate 102 and the transfer auxiliary component 103 move accordingly, and the transfer of the substrate is realized.

[0038] When other film layers are evaporated on the pre-processed substrate 102, such as when the light-emitting layer 105 is evaporated on one side thereof, the temperature of the pre-processed substrate 102 is relatively high, such as the temperature in the first region 16 is relatively high, while the temperature on the adsorption platform 101 is relatively low, such as the temperature in the second region 15 is relatively low. Therefore, the temperature on the first region 16 of the pre-processed substrate 102 can be directly transferred to the second region 15 of the adsorption platform 101, resulting in a relatively low temperature in the first region 16, and the evaporated light-emitting layer 105 is deposited quickly, so that the film thickness in the first region 16 is relatively thicker than that in other regions, thereby causing color deviation at the edge of the display panel, such as red edge and other poor display problems.

[0039] The embodiments of the present application provide a substrate transfer table and a substrate processing device to effectively improve the problem that heat transfer between the substrate and the transfer device during the preparation of the display panel may result in uneven thickness of the film layer, thereby affecting the display effect of the display panel.

[0040] like Figure 2 As shown, Figure 2 Schematic diagram of the structure of a substrate transfer platform provided in an embodiment of the present application. Specifically, the substrate transfer platform may include an adsorption platform 101, an adsorption component 202 and an adhesive layer 201. The adsorption component 202 and the adhesive layer 201 are at least arranged at the edge area of ​​the adsorption platform 101. For example, the adsorption component 202 and the adhesive layer 201 are both arranged in the second area 15.

[0041] Specifically, in the embodiment of the present application, the adsorption component 202 and the adhesive layer 201 can be both disposed at an edge region of one side of the adsorption platform 101. In the following embodiments, the adsorption component 202 and the adhesive layer 201 are both disposed in the second region 15 corresponding to the edge of the adsorption platform 101.

[0042] At the same time, the adhesive layer 201 is attached to the adsorption platform 101 and to the side of the adsorption platform 101 close to the pre-processed substrate 102. The adsorption component 202 is attached to the adhesive layer 201 and is attached to the side of the adhesive layer 201 away from the adsorption platform 101.

[0043] Specifically, the other side of the adsorption component 202, such as the bottom surface of the adsorption component 202, is directly attached to the pre-processed substrate 102. Therefore, the adhesive layer 201 and the adsorption component 202 form a stacked structure, and when the pre-processed substrate 102 needs to be transferred or moved, the adsorption platform 101 only needs to be transferred forward to achieve the movement of the pre-processed substrate 102.

[0044] In the embodiment of the present application, the pre-processed substrate 102 may be a glass substrate or a thin film transistor array substrate. In the following embodiments, the pre-processed substrate 102 is described by taking a thin film transistor array substrate as an example.

[0045] In the embodiment of the present application, the adsorption component 202 is configured to be multi-layered. For example, the adsorption component 202 may include a first adsorption component 13 and a second adsorption component 14 .

[0046] Specifically, the first adsorption component 13 in the embodiment of the present application is arranged on the second adsorption component 14, and the first adsorption component 13 is bonded to one side of the adhesive layer 201, one side of the second adsorption component 14 is bonded to the first adsorption component 13, and the other side of the second adsorption component 14 is directly bonded to one side of the pre-treated substrate 102.

[0047] Furthermore, in order to ensure that the pre-processed substrate 102 has good stability during the transfer process. In the embodiment of the present application, the bonding force between the contact surface of the adhesive layer 201 and the adsorption platform 101 is F1, and the bonding force between the contact surface of the second adsorption component 14 and the pre-processed substrate 102 is F2. Since the weight to be borne by the adsorption platform 101 is greater, in the embodiment of the present application, the bonding force F1 can be made greater than the bonding force F2, thereby ensuring that the pre-processed substrate 102 and the adsorption component will not fall off during the movement of the substrate transfer platform. At the same time, it is also ensured that the bonding force on the two adhesive surfaces of the adhesive layer is greater than the bonding force on the two adhesive surfaces of the adsorption component.

[0048] Preferably, in the embodiment of the present application, the area of ​​the bonding surface between the adhesive layer 201 and the adsorption platform 101 may be no less than the area of ​​the bonding surface between the second adsorption component 14 and the pre-processed substrate 102 .

[0049] In the embodiment of the present application, the adhesive layer 201 is set as a heat insulating material layer. When the pre-processed substrate 102 needs to be evaporated with other film layers, such as the luminescent layer 205, the luminescent layer 205 is set on the side of the pre-processed substrate 102 away from the adsorption platform 101.

[0050] During the evaporation process, different areas of the light-emitting layer 205 require higher temperatures, such as in the first area 16 close to the second area 15. The temperature in the first area 16 will be conducted along the adsorption component 202 to the adsorption platform 101. During the transfer process, the temperature on the light-emitting layer 205 will also decrease.

[0051] In the embodiment of the present application, since the adhesive layer 201 is provided, and the adhesive layer 201 is a heat-insulating material layer, the heat will be blocked by the heat-insulating material layer during the transfer process. Therefore, the temperature on the light-emitting layer 205 cannot be further transferred to the adsorption platform 101, thereby effectively ensuring that the light-emitting layer 205 has the same temperature in the first area 16 and other positions during the evaporation. After the evaporation is completed and solidified, the thickness of the light-emitting layer 205 has good consistency.

[0052] Specifically, in the embodiment of the present application, the material of the adhesive layer 201 may include any one of aerogel felt, polyethylene foam plastic and vacuum plate. At the same time, the thermal conductivity of the adhesive layer 201 is ensured to be less than 0.18 W / (m·K).

[0053] In the embodiment of the present application, the film thickness of the adhesive layer 201 may be smaller than the thickness of the first adsorption component 13 and the second adsorption component 14 .

[0054] Further, such as Figure 3 As shown, Figure 3 The schematic diagram of the partial structure of the transfer platform provided in the embodiment of the present application is as follows. In the embodiment of the present application, when the adhesive layer 201 and the first adsorption component 13 and the second adsorption component 14 are provided, the first hole 311 is provided on the adhesive layer 201 and the second hole 312 is provided on the second adsorption component 14.

[0055] Specifically, the first hole 311 may be disposed on a side of the adhesive layer 201 close to the adsorption platform 101 , and the second hole 312 may be disposed on a side of the second adsorption component 14 close to the pre-processed substrate 102 .

[0056] When the temperature is being conducted, it can effectively prevent the adsorption component and the adsorption platform from absorbing and transferring the heat on the substrate, thereby ensuring the consistency of the temperature in different areas of the pre-processed substrate 102 and ensuring the film forming effect.

[0057] Preferably, in the embodiment of the present application, when setting the first hole 311 and the second hole 312, the depth of the first hole 311 in the adhesive layer 201 is less than half of the overall thickness of the adhesive layer 201, and when setting, the first hole 311 is set from the surface of the adhesive layer 201 toward the inside.

[0058] Preferably, when setting the second hole 312, the second hole 312 is set starting from the surface of the second adsorption component 14, and the arrangement depth of the second hole 312 in the second adsorption component 14 is less than half the thickness of the second adsorption component 14, thereby ensuring that the adhesive layer and the adsorption component not only have good strength, but also effectively prevent them from absorbing and transferring temperature on the pre-treated substrate.

[0059] Furthermore, the size and arrangement density of the first hole 311 and the second hole 312 can be set according to actual conditions, such as the weight and size of the pre-processed substrate to be transferred. At the same time, the first hole 311 and the second hole 312 can be set as at least one of an open hole or a closed hole.

[0060] When the first hole 311 and the second hole 312 are both configured as open holes, Figure 4 As shown, Figure 4 The diagram is a schematic diagram of the arrangement of the first holes provided in the embodiment of the present application. The adjacent first holes 311 are connected to each other and form a connecting air path in the adhesive layer. The multiple connecting air paths can further reduce the absorption and transmission of the substrate temperature by the component, thereby ensuring the consistency of the temperature on the pre-treated substrate.

[0061] Furthermore, in the embodiment of the present application, when the first hole 311 and the second hole 312 are provided, the first hole 311 and the second hole 312 can be formed by introducing an inert gas. When the inert gas is introduced into the adhesive layer and the adsorption component, the gas will form a plurality of dense pores under the action of the internal pressure of the object. Preferably, direct micromachining or ultrasonic vibration or other processes can be used to form the corresponding first hole 311 and the second hole 312 on the adhesive layer and the second adsorption component.

[0062] like Figure 5 As shown, Figure 5 FIG. 1 is a partial structural diagram of another transfer platform provided in an embodiment of the present application. Figure 3-Figure 4 In the embodiment of the present application, when setting the structure inside the adhesive layer and the second adsorption component 14, the above-mentioned multiple dense holes can also be set as a groove structure. For example, multiple spaced first grooves 511 are set in the adhesive layer 201, and multiple spaced second grooves 512 are set on the second adsorption component 14.

[0063] Preferably, in the embodiment of the present application, a connecting hole 513 may be provided between two adjacent grooves, so as to further prevent the bonding layer and the adsorption component from absorbing and transmitting the temperature on the pre-processed substrate, thereby ensuring the consistency of the temperature in different areas of the pre-processed substrate.

[0064] Furthermore, in the embodiment of the present application, holes or grooves of the above structure can be provided near the adhesive surface of the first adsorption component 13. Alternatively, the above holes or groove structures can be provided on both adhesive surfaces of the above adhesive layer and both adhesive surfaces of the second adsorption component, or can be provided on only one adhesive surface of the first adsorption component or the second adsorption component. In order to further improve the performance and effect of the substrate transfer platform, at the same time, the adhesive layer can also be provided between the first adsorption component and the second adsorption component. When the adhesive layer is provided between the first adsorption component and the second adsorption component, it can still prevent the heat on the pre-treated substrate from being transferred to the adsorption platform.

[0065] Preferably, Figure 6 As shown, Figure 6 Schematic diagram of the working process of the substrate processing device provided in the embodiment of the present application. In the embodiment of the present application, when the substrate processing device is used, the adhesive layer 201 and the adsorption component 202 are correspondingly arranged on one side of the adsorption platform 101. After the attachment is completed, an adsorption surface of the adsorption component 202 is attached to the pre-processed substrate 102.

[0066] The adsorption platform 101 is moved, and the pre-processed substrate 102 moves accordingly under the adhesive force of the adsorption component 202. The pre-processed substrate 102 is evaporated, such as evaporating a light-emitting layer 205 on one side of the pre-processed substrate.

[0067] In the embodiment of the present application, during the evaporation process, the pre-processed substrate can be supported by the support portion 106 to ensure the stability of the pre-processed substrate. At the same time, since holes are provided on the adsorption component and the adhesive layer in the embodiment of the present application, and the adhesive layer is provided as a heat insulating material layer, the temperature in the first region 16 corresponding to the light-emitting layer 205 is effectively blocked from being transferred to the adsorption platform 101.

[0068] Since the temperature in different regions of the light-emitting layer 205 is relatively consistent, when depositing the film, the thickness of the film in the first region 16 can be effectively ensured to be consistent with the thickness of the film in other regions, and when the display panel is prepared, the display panel has a relatively good light-emitting effect, thereby effectively improving the comprehensive performance of the display panel.

[0069] Furthermore, in the embodiment of the present invention, a display panel with uniform thickness of each film layer is finally obtained by the substrate transfer table. Specifically, the display panel and display device prepared by the substrate transfer table can be applied to any product or component with flexible bending or folding function, such as mobile phones, computers, notebook computers, digital photo frames, etc., and the specific type is not specifically limited.

[0070] In summary, the above is a detailed introduction to a substrate transfer table and a substrate processing device provided in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the technical solution and core idea of ​​the present invention. Although the present invention is disclosed as above in the preferred embodiments, the above preferred embodiments are not used to limit the present invention. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is based on the scope defined by the claims.

Claims

1. A substrate transfer table, used for adsorption and transfer of substrates, characterized in that: The substrate transfer platform comprises: Adsorption platform; an adhesive layer, the adhesive layer being arranged at least at an edge region of the adsorption platform and attached to one side of the adsorption platform; and An adsorption component, wherein the adsorption component is arranged on a side of the adhesive layer away from the adsorption platform; Among them, the bonding layer is an insulating material layer, and a plurality of first holes are arranged on the side of the bonding layer close to the adsorption platform. The first holes are arranged on the side of the bonding layer close to the adsorption platform. The bonding layer is used to prevent the adsorption platform and the adsorption component from absorbing and transferring heat on the substrate, thereby ensuring the consistency of temperature in different areas of the substrate.

2. The substrate transfer platform according to claim 1, characterized in that: The height of the area corresponding to the first hole disposed in the adhesive layer is less than half of the thickness of the adhesive layer.

3. The substrate transfer platform according to claim 1, characterized in that: A plurality of grooves are arranged on one side of the adhesive layer close to the adsorption platform.

4. The substrate transfer stage according to claim 3, characterized in that: The plurality of grooves are arranged at intervals, and adjacent grooves are connected.

5. The substrate transfer stage according to claim 1, wherein: The adhesive force between the adhesive layer and the adsorption platform is greater than the adhesive force on a side of the adsorption component away from the adsorption platform.

6. The substrate transfer stage according to claim 5, characterized in that: The adsorption component includes a first adsorption component and a second adsorption component; The first adsorption component is attached to the adhesive layer, and the second adsorption component is arranged on a side of the first adsorption component away from the adsorption platform; Wherein, a second hole is arranged on a side of the second adsorption component away from the adsorption platform.

7. The substrate transfer stage according to claim 1, wherein: The thermal insulation material layer includes any one of aerogel felt, polyethylene foam plastic and vacuum panel.

8. The substrate transfer stage according to claim 6, wherein: The thermal conductivity of the adhesive layer is less than 0.18 W / (m·K).

9. A substrate processing device, characterized in that: include: A substrate transfer platform, the substrate transfer platform is used to absorb and transfer the pre-processed substrate; as well as, A supporting portion, the supporting portion being used to support the pre-processed substrate; Wherein, the substrate transfer platform is the substrate transfer platform as described in any one of claims 1-8.

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