Composite laminate for electronic packaging, pressing apparatus and pressing method

Abstract

The application relates to a composite laminate for electronic packaging, a pressing device and a pressing method, wherein the composite laminate for electronic packaging comprises a plate body, the plate body comprises opposite first and second side surfaces, and the first and second side surfaces are both configured as arc surfaces protruding towards the outside of the plate body. The composite laminate for electronic packaging can solve the problem that the heat sink produces large deformation in the process of tube-shell assembly, thereby reducing the chip output power and conversion effect.

Description

Technical Field

[0001] This application relates to the field of electronic packaging technology, and in particular to a composite laminate, pressing device and pressing method for electronic packaging. Background Technology

[0002] Electronic packaging refers to the external casing used to mount the built-in chip of an integrated circuit, thus protecting the chip. Composite laminates such as CMC (Cu / Mo / Cu, copper / molybdenum / copper) and CPC (Cu / MoCu / Cu, copper / molybdenum copper / copper) are often used in the electronic packaging of high-power electronic components as heat sinks due to their excellent thermal conductivity and adjustable coefficient of thermal expansion.

[0003] However, during the assembly of the chip casing, the mismatch between the thermal expansion coefficients of the heat sink and the chip causes the heat sink to deform significantly after baking, affecting the reliability of subsequent chip casing mounting and bonding, thereby reducing the chip's output power and conversion efficiency. Summary of the Invention

[0004] Therefore, it is necessary to provide a composite laminate, pressing device, and pressing method for electronic packaging to address the problem that the heat sink undergoes significant deformation during the shell assembly process, which reduces the chip's output power and conversion efficiency.

[0005] According to one aspect of this application, a composite laminate for electronic packaging is provided, comprising a board body; the board body includes opposing first and second sides; both the first and second sides are configured as arcuate surfaces convex outward toward the board body.

[0006] The composite layer board for electronic packaging provided in this application embodiment has a first side and a second side of the board body that are both arc surfaces protruding outwards from the board body. When the composite layer board is applied to electronic packaging, the arc surfaces can at least partially offset the thermal deformation generated by baking during the shell assembly process. This results in a higher surface flatness after shell assembly, thereby improving the reliability of shell mounting and bonding, and increasing chip output power and conversion efficiency.

[0007] In one embodiment, the first side is configured as an arc surface; and / or the second side is configured as an arc surface. When the composite laminate is used as an electronic packaging material, the baking environment of the opposite sides of the composite laminate is relatively similar. Therefore, the stress generated during the baking process results in similar deformation on the opposite sides of the composite laminate. Based on this, by configuring both the first and second sides of the board body as arc surfaces, the deformation on the opposite sides of the board body can be offset to an equal extent. This results in higher flatness of the opposite sides of the board body after the casing is assembled, improving the reliability of casing mounting and bonding, and thus improving chip output power and conversion efficiency.

[0008] In one embodiment, the radius of the arc of the first side is 2517 mm to 4328 mm; and / or the radius of the arc of the second side is 2517 mm to 4328 mm. By designing the radius of the arc of the first side and the radius of the arc of the second side, the flatness of the two sides of the composite board after the shell assembly is high, thereby improving the reliability of shell mounting and bonding, and thus improving the chip output power and conversion efficiency.

[0009] According to another aspect of this application, a pressing device is also provided, including a first pressing cover and a second pressing cover disposed opposite to each other along a first direction; the first pressing cover includes a first pressing surface facing the second pressing cover, the second pressing cover includes a second pressing surface facing the first pressing cover, the first pressing surface and the second pressing surface are spaced apart from each other to form an accommodating space; the first pressing surface is configured as an arc surface formed by inward concavity in a direction away from the second pressing cover, and the second pressing surface is configured as an arc surface formed by inward concavity in a direction away from the first pressing cover.

[0010] The pressing device provided in this application embodiment has an accommodating space between the first pressing surface of the first cover and the second pressing surface of the second cover. The accommodating space is used to accommodate the workpiece to be pressed, thereby using the first cover and the second cover to press the workpiece along a first direction. During the pressing process, the first pressing surface of the first cover and the second pressing surface of the second cover respectively abut against the opposite sides of the workpiece to be pressed. The first pressing surface is constructed as an arc surface that is concave inward in the direction away from the second cover, and the second pressing surface is constructed as an arc surface that is concave in the direction away from the first cover. This makes the opposite sides of the workpiece after pressing arc-shaped. In this way, the arc shape formed during the pressing process can at least partially offset the thermal deformation generated by baking during the subsequent shell assembly process. This results in a higher surface flatness of the workpiece after dry pressing, baking, and assembly, thereby improving the reliability of shell mounting and pressure welding, and increasing the chip output power and conversion efficiency.

[0011] In one embodiment, the first pressing surface is configured as an arc surface; and / or the second pressing surface is configured as an arc surface. It is understood that during the casing assembly process, due to the mismatch between the thermal expansion coefficients of the composite laminate and the chip, the yield strength of the composite laminate is insufficient to withstand the generated stress during baking, resulting in significant deformation of the composite laminate and the formation of a depression in the middle, resembling a "smile," i.e., the "smile effect." In this embodiment, at least one of the first and second pressing surfaces is configured as an arc surface. On the one hand, this ensures that the side shape of the pressed composite laminate corresponds to the shape of the depression that may occur during subsequent baking, effectively counteracting the deformation caused by baking. On the other hand, the structural parameters of the arc surface are relatively simple to control and easy to form.

[0012] In one embodiment, the first pressure cap has a dimension of 80mm ± 0.3mm along the second direction and a dimension of 50mm ± 0.3mm along the third direction; the radius of the arc of the first pressing surface is 2517mm to 4328mm; and / or the second pressure cap has a dimension of 80mm ± 0.3mm along the second direction and a dimension of 50mm ± 0.3mm along the third direction; the radius of the arc of the second pressing surface is 2517mm to 4328mm; wherein the second direction is perpendicular to the third direction, and both the second direction and the third direction are perpendicular to the first direction. By designing the arc radii of the first and second pressing surfaces, the flatness of the relatively flat sides of the workpiece after dry pressing, baking, and assembly is improved, thereby enhancing the reliability of chip mounting and bonding, and ultimately improving chip output power and conversion efficiency.

[0013] In one embodiment, the first pressure cap is made of ceramic or steel; and / or the second pressure cap is made of ceramic or steel. It is understood that the composite layer used as a heat sink in electronic packaging is typically a CPC alloy. When dry-pressing it using the first and second pressure caps, it is necessary to ensure that the hardness of the first and second pressure caps is greater than the hardness of the CPC alloy. In this embodiment, the first pressure cap is made of ceramic or steel, and / or the second pressure cap is made of ceramic or steel, thereby ensuring the dry-pressing effect.

[0014] In one embodiment, the pressing device further includes a drive mechanism and a pressure controller; the drive mechanism is used to drive the first pressure cap and the second pressure cap to reduce the accommodating space; the pressure controller is electrically connected to the drive mechanism to control the magnitude of the pressure applied by the drive mechanism to the first pressure cap and / or the second pressure cap.

[0015] In one embodiment, the driving end of the driving mechanism is provided with a pressure head; the pressure head includes a pressure surface opposite to the side surface of the first cover facing away from the second cover, or the pressure head includes a pressure surface opposite to the side surface of the second cover facing away from the first cover; the pressure surface is configured to be planar. By providing a pressure head at the driving end of the driving mechanism, pressure is applied to the first cover or the second cover using the pressure surface of the pressure head to reduce the accommodating space, making the pressure application process smoother. Furthermore, by setting the pressure surface to be planar, the contact area between the pressure head and the first cover or the second cover is larger when the pressure head applies pressure to the first cover or the second cover, thereby making the pressure application process smoother and the force on the first cover or the second cover more uniform.

[0016] According to another aspect of this application, a pressing method is also provided, which employs the pressing device as described above, the pressing method comprising the following steps:

[0017] Place the part to be pressed into the accommodating space between the first pressure cover and the second pressure cover;

[0018] The first and second pressure caps are controlled to apply pressure to the part to be pressed, so as to press the opposite two sides of the part to be pressed into arc surfaces that match the first pressing surface and the second pressing surface, respectively.

[0019] This application provides a pressing method in which the workpiece to be pressed is placed between a first pressing surface and a second pressing surface. The arc shape of the first pressing surface and the arc shape of the second pressing surface are used to make the opposite sides of the pressed workpiece form arc surfaces that match the first pressing surface and the second pressing surface, respectively. In this way, the arc shape formed during the pressing process can at least partially offset the thermal deformation caused by baking during the subsequent shell assembly process, making the surface of the baked workpiece smoother. This results in higher reliability of subsequent shell mounting and bonding, and improves chip output power and conversion efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the composite laminate structure in one embodiment of this application;

[0021] Figure 2 This is a schematic diagram of the structure of the first and second pressure caps in one embodiment of this application;

[0022] Figure 3 This is a schematic diagram of the structure of a pressing device for a composite layer plate used in electronic packaging according to an embodiment of this application;

[0023] Figure 4 This is a schematic diagram of the structure of the first pressure cap in one embodiment of this application;

[0024] Figure 5 for Figure 4 A structural schematic diagram of the first pressure cap from another perspective;

[0025] Figure 6 This is a schematic diagram of the structure of the second pressure cap in one embodiment of this application.

[0026] Explanation of icon numbers:

[0027] 10. Main body of the panel; 11. First side view; 12. Second side view;

[0028] 100, First pressure cap; 110, First pressing surface; 200, Second pressure cap; 210, Second pressing surface; 300, Pressure head; 400, Pressure controller; Z, First direction; X, Second direction; Y, Third direction. Detailed Implementation

[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0030] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0033] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0034] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0035] CMC (Cu / Mo / Cu, copper / molybdenum / copper) composite laminates and CPC (Cu / MoCu / Cu, copper / molybdenum copper / copper) composite laminates are typically made by hot rolling, explosive forming, and other methods, using copper with relatively high thermal conductivity on both sides and molybdenum or a copper-molybdenum alloy with relatively low thermal conductivity in the middle. When used as heat sinks in electronic packaging, they can conduct heat away from the chips and other electronic devices they support through thermal conductivity in the thickness direction, achieving rapid heat dissipation. However, during the package assembly process, due to the mismatch between the thermal expansion coefficients of the heat sink and the chip, if the yield strength of the heat sink cannot withstand the stress generated during baking, it will cause significant deformation of the heat sink, resulting in a "smile effect"—a depression in the middle of the heat sink. This affects the reliability of subsequent package mounting and bonding, reducing chip output power and conversion efficiency.

[0036] To address the aforementioned issues, this application provides a composite layer board. By setting the opposite sides of the composite layer board as arc surfaces convex outwards, it can counteract the thermal deformation generated during subsequent assembly and baking, thereby improving the reliability of chip mounting and bonding, and enhancing chip output power and conversion efficiency.

[0037] Figure 1 A schematic diagram of the structure of a composite laminate in one embodiment of this application is shown.

[0038] See Figure 1 In some embodiments, the composite layer board for electronic packaging includes a board body 10, which includes opposing first side 11 and second side 12. Both the first side 11 and the second side 12 are configured as arc surfaces convex outward toward the board body 10. When the composite layer board is applied to electronic packaging, the arc surfaces can at least partially offset the thermal deformation generated by baking during the shell assembly process, resulting in a higher surface flatness after shell assembly. This leads to higher reliability of shell mounting and bonding, and improves chip output power and conversion efficiency.

[0039] Furthermore, one or both of the first side 11 and the second side 12 are constructed as arc surfaces. When the composite layer is used as an electronic packaging material, the baking environment of the opposite sides of the composite layer is relatively similar. Therefore, the stress generated during the baking process results in similar deformation on the opposite sides of the composite layer. Based on this, both the first side 11 and the second side 12 of the board body 10 are constructed as arc surfaces, which can equally offset the deformation on the opposite sides of the board body 10. This results in higher flatness of the opposite sides of the board body 10 after the casing is assembled, improving the reliability of casing mounting and bonding, and thus improving chip output power and conversion efficiency.

[0040] Furthermore, the radius of the arc of the first side 11 is between 2517mm and 4328mm, and the radius of the arc of the second side 12 is also between 2517mm and 4328mm. By designing the radius of the arc of the first side 11 and the second side 12, the flatness of the two opposite sides of the composite board after the casing is assembled is relatively high, thereby improving the reliability of casing mounting and bonding, and thus improving the chip output power and conversion efficiency. The radius of the arc of the first side 11 and the radius of the arc of the second side 12 may be the same or different. In other embodiments, the radius of the arc of the first side 11 and the radius of the arc of the second side 12 may also be set to either 2517mm to 4328mm, while the other is not limited.

[0041] For the same inventive purpose, this application also provides a pressing device.

[0042] Figure 2This invention provides a schematic diagram of the structure of the first and second pressure caps in one embodiment of the present application. Figure 3 A schematic diagram of a pressing device for a composite layer for electronic packaging is shown in one embodiment of this application.

[0043] See Figure 2 and Figure 3 An embodiment of this application provides a pressing device including a first pressing cover 100 and a second pressing cover 200 disposed opposite to each other along a first direction Z. The first pressing cover 100 includes a first pressing surface 110 facing the second pressing cover 200, and the second pressing cover 200 includes a second pressing surface 210 facing the first pressing cover 100. The first pressing surface 110 and the second pressing surface 210 are spaced apart from each other and are disposed apart to form an accommodating space for accommodating a workpiece to be pressed. During the pressing process, the first pressing surface 110 and the second pressing surface 210 respectively abut against the opposite sides of the workpiece to be pressed along the first direction Z. The first pressing surface 110 is configured as an arc surface that is concave inward in a direction away from the second pressing cover 200, and the second pressing surface 210 is configured as an arc surface that is concave inward in a direction away from the first pressing cover 100.

[0044] The pressing device provided in this application embodiment uses a first pressure cap 100 and a second pressure cap 200 to press the workpiece to be pressed along a first direction Z. The first pressing surface 110 of the first pressure cap 100 and the second pressing surface 210 of the second pressure cap 200 respectively abut against the opposite sides of the workpiece to be pressed. The first pressing surface 110 is constructed as an arc surface that is concave inward in a direction away from the second pressure cap 200, and the second pressing surface 210 is constructed as an arc surface that is concave inward in a direction away from the first pressure cap 100. This makes the opposite sides of the workpiece after pressing arc-shaped. In this way, the arc shape formed during the pressing process can at least partially offset the thermal deformation generated by baking during the subsequent shell assembly process. This results in a higher surface flatness of the workpiece after dry pressing, baking, and assembly, thereby improving the reliability of shell bonding and pressure welding, and increasing the chip output power and conversion efficiency.

[0045] Specifically, the pressing process of the first pressure cap 100 and the second pressure cap 200 on the workpiece can be dry pressing. The first direction Z can be parallel to the vertical direction, parallel to the horizontal direction, or parallel to other directions. The first pressure cap 100 and the second pressure cap 200 can be respectively mounted on the bracket along the first direction Z, or the first pressure cap 100 can be mounted on the bracket, the workpiece to be pressed can be placed on the first pressure cap 100, and the second pressure cap 200 can be placed on the side of the workpiece to be pressed away from the first pressure cap 100. Preferably, the first direction Z is parallel to the vertical direction, the first pressure cap 100 is mounted on the bracket, the workpiece to be pressed can be placed on the first pressure cap 100, and the second pressure cap 200 can be placed on the side of the workpiece to be pressed away from the first pressure cap 100, thereby simplifying the structure of the pressing device for composite laminates used in electronic packaging, and enabling the weight of the second pressure cap 200 to apply pressure to the workpiece to be pressed.

[0046] In some embodiments, the first pressing surface 110 is configured as an arc surface. It is understood that during the casing assembly process, the thermal expansion coefficients of composite materials with low thermal expansion coefficients, such as copper / silver / aluminum diamond composites, molybdenum-copper alloys, and Kovar alloys, do not match those of the chip. This makes it difficult for the yield strength of the composite material to withstand the stress generated during baking, resulting in significant deformation and a depression in the middle, resembling a "smile," i.e., the "smile effect." In this embodiment, the first pressing surface 110 is configured as an arc surface. On the one hand, this ensures that the side shape of the pressed composite material corresponds to the depression shape that may occur during subsequent baking, effectively counteracting the deformation caused by baking. On the other hand, the structural parameters of the arc surface are relatively simple to control and easy to form.

[0047] In other embodiments, both the first pressing surface 110 and the second pressing surface 210 can be optionally constructed as arc surfaces, so that the opposite sides of the pressed workpiece can form arc surfaces, thereby offsetting the deformation caused by baking on the opposite sides of the workpiece. Alternatively, the second pressing surface 210 can be constructed as an arc surface, and the first pressing surface 110 can be constructed as a non-arc surface, to simplify the structure of the pressing device while ensuring that the deformation caused by baking can be partially offset.

[0048] In some embodiments, both the first pressing surface 110 and the second pressing surface 210 are constructed as arc surfaces, and the arc radius of the first pressing surface 110 is equal to that of the second pressing surface 210. When the workpiece obtained after pressing is used as the material for electronic packaging, the baking environment of the opposite sides of the workpiece is relatively similar. Therefore, the stress generated during the baking process causes relatively similar deformation on the opposite sides of the workpiece. Based on this, in this embodiment, the arc radius of the first pressing surface 110 is set to be equal to that of the second pressing surface 210, so that the deformation on the opposite sides of the workpiece can be offset to the same extent. This results in a higher flatness of the opposite sides of the workpiece after dry pressing, baking, and assembly, improving the reliability of chip mounting and bonding, and increasing chip output power and conversion efficiency.

[0049] Figure 4 A schematic diagram of the structure of the first pressure cap in one embodiment of this application is shown; Figure 5 It shows Figure 4 A structural schematic diagram of the first pressure cap from another perspective; Figure 6 A schematic diagram of the structure of the second pressure cap in one embodiment of this application is shown.

[0050] See Figures 4 to 6 In some embodiments, the first pressure cap 100 has a dimension of 80mm ± 0.3mm along the second direction X, and a dimension of 50mm ± 0.3mm along the third direction Y. The radius of the arc of the first pressing surface is 2517mm to 4328mm. The second direction X is perpendicular to the third direction Y, and both the second direction X and the third direction Y are perpendicular to the first direction. By designing the radius of the arc of the first pressing surface 110, the flatness of the relatively flat sides of the workpiece after dry pressing, baking, and assembly is improved, thereby enhancing the reliability of chip mounting and bonding, and ultimately improving the chip output power and conversion efficiency.

[0051] Furthermore, the dimensions of the second pressure cap 200 and the first pressure cap 100 can be set to be the same. In other embodiments, the dimensions of the second pressure cap 200 along the second direction X can be set to 80mm ± 0.3mm, the dimensions of the second pressure cap 200 along the third direction Y can be set to 50mm ± 0.3mm, and the radius of the arc of the second pressing surface can be 2517mm to 4328mm, while the dimensions of the first pressure cap 100 are different.

[0052] To verify the effect of the arc surface setting on the gland on the flatness of the component to be pressed, the inventors of this application, based on the fact that the arc radii of the first and second glands are equal, changed the size of the arc radius of the gland and the pressure applied during dry pressing, and tested the deformation of the CPC flange after dry pressing and after the shell assembly. The test results are shown in Tables 1 to 3 below. In the table, a positive deformation value indicates that the surface of the sample is concave, and a negative deformation value indicates that the surface of the sample is convex.

[0053] Table 1: Deformation of the sample when the gland is not curved and the applied pressure is 10 MPa.

[0054] sample After dry pressing After assembly 1 3.6 15.2 2 2.2 11.7 3 2.3 16.2

[0055] Table 2: Deformation of the sample when the radius of the gland arc is r = 4328 mm and the applied pressure is 8 MPa, 10 MPa and 12 MPa respectively.

[0056]

[0057] Table 3: Deformation of samples when the radius of curvature of the gland is r = 2517 mm and the applied pressure is 8 MPa, 10 MPa and 12 MPa respectively.

[0058]

[0059] According to the test results in Tables 1 to 3, when the gland is not curved, the flange surface will have a large degree of deformation after the pipe shell is assembled, and the deformation is generally greater than 15. When the radius of the gland is 4328mm or 2517mm, the deformation of the flange surface after the pipe shell is assembled is smaller, and the deformation is generally less than 10.

[0060] In some embodiments, the first pressure cap 100 is made of ceramic or steel. It is understood that the composite layer used as a heat sink in electronic packaging is typically a CPC alloy. When dry-pressing the first pressure cap 100 and the second pressure cap 200, it is necessary to ensure that the hardness of the first pressure cap 100 and the second pressure cap 200 is greater than the hardness of the CPC alloy. In this embodiment, the first pressure cap 100 is made of ceramic or steel to ensure the dry-pressing effect. In some embodiments, the second pressure cap 200 may also be made of ceramic or steel to ensure the dry-pressing effect. Further, the material of the second pressure cap 200 may be the same as or different from the material of the first pressure cap 100.

[0061] In some embodiments, the pressing device further includes a driving mechanism for driving the first pressure plate 100 and the second pressure plate 200 to reduce the accommodating space, thereby applying pressure to the workpiece to be pressed. By driving the first pressure plate 100 and the second pressure plate 200 to apply pressure to the workpiece to be pressed through the driving mechanism, the pressing of the workpiece is completed. Specifically, the driving mechanism may be a motor, a cylinder, etc.

[0062] See Figure 2 and Figure 3Furthermore, the pressing device also includes a pressure controller 400, which is electrically connected to the drive mechanism to control the pressure applied by the drive mechanism to the first pressure cap 100 and / or the second pressure cap 200, thereby controlling the pressure applied by the first pressure cap 100 and the second pressure cap 200 to the workpiece to be pressed. By controlling the pressure applied by the first pressure cap 100 and the second pressure cap 200 to the workpiece to be pressed through the pressure controller 400, pressure control during the pressing process becomes more convenient and precise, thus ensuring the pressing effect.

[0063] In some embodiments, the drive end of the drive mechanism is provided with a pressure head 300. The pressure head 300 includes a pressure surface opposite to the side surface of the first cover 100 facing away from the second cover 200, or the pressure head 300 includes a pressure surface opposite to the side surface of the second cover 200 facing away from the first cover 100. By providing a pressure head 300 at the drive end of the drive mechanism, pressure is applied to the first cover 100 or the second cover 200 using the pressure surface of the pressure head 300, making the pressure application process smoother.

[0064] Furthermore, the pressure surface is constructed to be planar. By setting the pressure surface to be planar, when the pressure head 300 applies pressure to the first pressure cap 100 or the second pressure cap 200, the contact area between the pressure head 300 and the first pressure cap 100 or the second pressure cap 200 is larger, thereby making the pressure application process smoother and the first pressure cap 100 or the second pressure cap 200 more evenly stressed.

[0065] For the same inventive purpose, this application also provides a pressing method using the aforementioned pressing device. In some embodiments, the pressing method includes the following steps:

[0066] Place the part to be pressed into the receiving space between the first pressure cover and the second pressure cover;

[0067] The first and second pressure caps are controlled to apply pressure to the workpiece to be pressed, so as to press the opposite two sides of the workpiece into arc surfaces that match the first and second pressing surfaces respectively.

[0068] The pressing method for composite laminates for electronic packaging provided in this application embodiment places the workpiece to be pressed in the accommodating space between the first pressing surface and the second pressing surface. The arc shape of the first pressing surface and the arc shape of the second pressing surface are used to form arc surfaces on opposite sides of the pressed workpiece that match the first pressing surface and the second pressing surface, respectively. In this way, the arc shape formed during the pressing process can at least partially offset the thermal deformation generated by baking during the subsequent shell assembly process, making the surface of the baked workpiece smoother. This results in higher reliability of subsequent shell mounting and bonding, and improves chip output power and conversion efficiency.

[0069] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A pressing device, characterized in that, For pressing composite laminates for electronic packaging, the pressing device includes a first cover and a second cover disposed opposite to each other along a first direction. The first pressure cap includes a first pressing surface facing the second pressure cap, and the second pressure cap includes a second pressing surface facing the first pressure cap. The first pressing surface and the second pressing surface are spaced apart from each other to form an accommodating space. The first pressing surface is configured as an arc surface that is concave inward in a direction away from the second pressing cover, and the second pressing surface is configured as an arc surface that is concave inward in a direction away from the first pressing cover; The composite laminate includes a main body, which includes a first side and a second side opposite to each other. After the composite laminate is pressed, both the first side and the second side are configured as arc surfaces convex outward toward the main body. The composite laminate is copper / molybdenum / copper or copper / molybdenum-copper / copper.

2. The pressing device according to claim 1, characterized in that, The first pressing surface is configured as an arc surface; and / or The second pressing surface is constructed as an arc surface.

3. The pressing device according to claim 2, characterized in that, The first pressure cap has a dimension of 80mm ± 0.3mm along the second direction, and a dimension of 50mm ± 0.3mm along the third direction; the radius of the arc of the first pressing surface is 2517mm to 4328mm; and / or The second pressure cap has a dimension of 80mm ± 0.3mm along the second direction and a dimension of 50mm ± 0.3mm along the third direction; the radius of the arc of the second pressing surface is 2517mm to 4328mm. The second direction is perpendicular to the third direction, and both the second direction and the third direction are perpendicular to the first direction.

4. The pressing device according to claim 1, characterized in that, The material of the first gland includes ceramic or steel; and / or The material of the second gland may be ceramic or steel.

5. The pressing device according to any one of claims 1 to 4, characterized in that, The pressing device also includes a drive mechanism and a pressure controller; The driving mechanism is used to drive the first pressure cover and the second pressure cover to reduce the accommodating space; The pressure controller is electrically connected to the drive mechanism to control the magnitude of the pressure applied by the drive mechanism to the first pressure cap and / or the second pressure cap.

6. The pressing device according to claim 5, characterized in that, The drive end of the drive mechanism is equipped with a pressure head; The pressure head includes a pressure surface opposite to the side surface of the first pressure cover facing away from the second pressure cover; or, the pressure head includes a pressure surface opposite to the side surface of the second pressure cover facing away from the first pressure cover. The pressure-applying surface is constructed to be planar.

7. A pressing method, characterized in that, The pressing method, employing the pressing apparatus as described in any one of claims 1 to 6, comprises the following steps: The part to be pressed is placed in the accommodating space between the first pressure cover and the second pressure cover; The first and second pressure caps are controlled to apply pressure to the part to be pressed, so as to press the opposite two sides of the part to be pressed into arc surfaces that match the first pressing surface and the second pressing surface, respectively.

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