A semiconductor automated alkaline etching device

Abstract

The invention discloses an alkali etching device for semiconductor automation. The device comprises a frame, an alkali etching area for semiconductors is arranged on the frame, two mutually parallel guide rails are arranged on both sides of the top of the alkali etching area, slidable bottom plates are arranged on the guide rails, the two bottom plates slide back and forth along the extension direction of the alkali etching area, and the sliding directions are always opposite, a movable slide plate is arranged on the bottom plate, and the movable positions of the slide plate on the bottom plate are respectively set as a moving area and a working area, a lifting cylinder is arranged at the end of the slide plate, a self-rotating motor is arranged at the output end of the lifting cylinder, the output end of the self-rotating motor faces downward and is provided with a fixing groove of the semiconductor, when the slide plate is in the moving area, a safety distance is maintained between the ends of the two slide plates, and when the slide plate is in the working area, the fixing groove is located directly above the alkali etching area. The invention improves the alkali etching efficiency of the semiconductor.

Description

Technical field:

[0002] The invention relates to the technical field of semiconductor etching, in particular to semiconductor automated alkali etching equipment. Background technology:

[0004] Semiconductors refer to materials whose electrical conductivity is between that of conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. Most electronic products, such as computers, mobile phones or digital recorders, have a close relationship with semiconductors in their core units. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most widely used semiconductor material.

[0005] An influential one.

[0006] Silicon is an element with very large reserves, so semiconductor silicon wafers have very broad application prospects. Semiconductor silicon wafers need to be alkaline etched during processing. At present, alkaline etching of semiconductors is mostly performed one by one by operators, and the etching efficiency is low, which can hardly meet the needs of mass production of enterprises. Summary of the invention:

[0008] The object of the present invention is to provide an alkali etching device for semiconductor automation to solve one or more of the above-mentioned prior art problems.

[0009] In order to solve the above technical problems, the present invention provides an automated alkali etching device for semiconductors, the structure of which includes a frame, and the innovation point is that: an alkali etching area for semiconductors is provided on the frame, two mutually parallel guide rails are provided on both sides of the top of the alkali etching area, and a slidable bottom plate is provided on the guide rails, and the two bottom plates slide back and forth along the extension direction of the alkali etching area and the sliding directions are always opposite, a movable slide plate is provided on the bottom plate, and the movable positions of the slide plate on the bottom plate are respectively set as a moving area and a work station area, a lifting cylinder is provided at the end of the slide plate, and a self-rotating motor is provided at the output end of the lifting cylinder, and the output end of the self-rotating motor faces downward and is provided with a fixing groove for the semiconductor, when the slide plate is in the moving area, a safe distance is maintained between the ends of the two slide plates, and when the slide plate is in the work station area, the fixing groove is located directly above the alkali etching area.

[0010] Furthermore, the alkaline etching area includes an etching tank, a primary water washing tank, an acid soaking tank, a primary hot water soaking tank, a secondary hot water soaking tank, a secondary water washing tank and a drying tank which are arranged on the frame from left to right.

[0011] Furthermore, a plurality of acid-resistant and corrosion-resistant pumps are provided at the bottom of the above-mentioned frame, and the input ends of the plurality of acid-resistant and corrosion-resistant pumps are respectively connected to the interior of the etching tank, the water rinsing tank, the acid solution soaking tank, the primary hot water soaking tank, the secondary hot water soaking tank, the water rinsing tank and the drying tank, and the output ends of the plurality of acid-resistant and corrosion-resistant pumps are connected to the same waste liquid pipe.

[0012] Furthermore, the above-mentioned frame is provided with a fixed frame, the guide rail is fixed on the fixed frame, the fixed frame is provided with a transverse rack parallel to the guide rail, a rotatable driving gear is provided at the bottom of the base plate, a driving motor is provided on the base plate to drive the driving gear to rotate, and the driving gear is meshed and connected to the transverse rack.

[0013] Furthermore, a vertical plate extending vertically downward is provided at the bottom of the base plate, a guide track is provided on the side of the fixed frame, the guide track is parallel to the guide rail, a slider is provided on the vertical plate, and the slider is slidably arranged on the guide track.

[0014] Furthermore, a fixed plate parallel to the horizontal plane is provided at the bottom of the vertical plate, and a slidable residual liquid collecting groove is provided on the fixed plate. The sliding direction of the residual liquid collecting groove is close to or away from the alkali etching area. When the lifting cylinder drives the fixed groove to move to the top of the alkali etching area, the sliding position of the residual liquid collecting groove is always located directly below the fixed groove. When the lifting cylinder drives the fixed groove to move toward the inside of the alkali etching area, the residual liquid collecting groove slides away from the alkali etching area.

[0015] Furthermore, symmetrical clamps are provided on both sides of the base plate, the slide plate is slidably arranged on the top of the clamp plate, the bottom of the slide plate is provided with a screw nut, the surface of the base plate is provided with a fixing nut, and a screw is connected between the screw nut and the fixing nut.

[0016] The beneficial effects of the present invention are:

[0017] 1. The present invention provides an automated alkaline etching device for semiconductors. The setting of two guide rails can move the fixed grooves alternately toward the operator, thereby improving the alkaline etching efficiency of the semiconductor.

[0018] 2. The present invention provides an automated alkaline etching device for semiconductors. During the alkaline etching process of the semiconductor, the position of the slide plate is always in the work station area, so that the semiconductor on the fixed groove can enter the interior of the alkaline etching area conveniently. Since the movement directions of the two bottom plates are always opposite, when the movement positions of the two bottom plates on the two guide rails are about to intersect, the position of the slide plate will move to the moving area, thereby driving the fixed groove away from the alkaline etching area, thereby avoiding interference between the ends of the two slide plates and ensuring smooth movement of the bottom plate on the guide rail.

[0019] 3. The present invention provides an automated alkali etching device for semiconductors. During the semiconductor alkali etching process, the semiconductor needs to be moved at different positions in the alkali etching zone. In view of this, when the semiconductor is located above the alkali etching zone, some liquid will remain on the semiconductor. At this time, the residual liquid collection tank is located below the fixed tank, and the liquid dripping on the semiconductor can be collected. When the semiconductor needs to enter the alkali etching zone for alkali etching treatment, the residual liquid collection tank moves away from the alkali etching zone, thereby facilitating the semiconductor to enter the alkali etching zone. Description of the drawings:

[0021] Figure 1 An isometric view of the present invention.

[0022] Figure 2 It is a front structural diagram of the fixing frame of the present invention on the guide rail.

[0023] Figure 3 It is a side structural diagram of the fixing frame of the present invention on the guide rail.

[0024] Figure 4 This is a back structural diagram of the fixing frame of the present invention on the guide rail.

[0025] Figure 5 It is the internal structure diagram of the alkali etching area of ​​the present invention. Specific implementation method:

[0027] In order to deepen the understanding of the present invention, the present invention will be further described in detail below in conjunction with embodiments and drawings. The embodiments are only used to explain the present invention and do not constitute a limitation on the protection scope of the present invention.

[0028] like Figure 1 to Figure 2 It is a specific embodiment of the present invention, and its structure includes a frame 1, on which is provided an alkali etching area 101 for semiconductors, two mutually parallel guide rails 2 are provided on both sides of the top of the alkali etching area 101, and a slidable bottom plate 21 is provided on the guide rails 2, and the two bottom plates 21 slide back and forth along the extension direction of the alkali etching area 101 and the sliding directions are always opposite, and a movable slide plate 22 is provided on the bottom plate 21, and the movable positions of the slide plate 22 on the bottom plate 21 are respectively set as a moving area and a working area, and a lifting cylinder 23 is provided at the end of the slide plate 22, and a self-rotating motor 24 is provided at the output end of the lifting cylinder 23, and the output end of the self-rotating motor 24 faces downward and is provided with a fixed groove 25 for semiconductors, when the slide plate 22 is in the moving area, a safety distance is maintained between the ends of the two slide plates 22, and when the slide plate 22 is in the working area, the fixed groove 25 is located directly above the alkali etching area 101.

[0029] In the present invention, the working principle of semiconductor alkali etching is as follows: an operator fixes a semiconductor to be alkali-etched inside one of the fixed grooves 25 at one end of the rack 1, and then the bottom plate 21 moves the semiconductor along the extension direction of the alkali etching area 101. When the bottom plate 21 drives the fixed groove 25 to move along the alkali etching area 101, the lifting cylinder 23 drives the semiconductor on the fixed groove 25 to move downward into the inside of the alkali etching area 101, and then the self-rotating motor 24 drives the semiconductor to rotate, thereby realizing the etching of the semiconductor. When the bottom plate 21 moves away from the operator toward the alkali etching area 101, the other A base plate 21 will move toward the operator, and the operator will continue to install the semiconductor that needs alkaline etching on another fixed groove 25. After the installation of this fixed groove 25 is completed, the base plate 21 will drive the semiconductor on this fixed groove 25 to move toward the alkaline etching area 101. After the semiconductor installed on the fixed groove 25 for the first time completes the alkaline etching, the fixed groove 25 will drive the semiconductor that has completed the alkaline etching to move toward the operator. The operator will remove the semiconductor that has completed the alkaline etching and replace it with another semiconductor. The alkaline etching process of the semiconductor moves alternately toward the operator according to the above process, thereby improving the alkaline etching efficiency of the semiconductor.

[0030] In the present invention, during the alkaline etching process of the semiconductor, the position of the slide plate 22 is always in the working area, so as to facilitate the semiconductor on the fixed groove 25 to enter the interior of the alkaline etching area 101. Since the movement directions of the two bottom plates 21 are always opposite, when the movement positions of the two bottom plates 21 on the two guide rails 2 are about to intersect, the position of the slide plate 22 will move to the moving area, thereby driving the fixed groove 25 away from the alkaline etching area 101, thereby avoiding interference between the ends of the two slide plates 22, ensuring the smooth movement of the bottom plate 21 on the guide rail 2, and after the movement positions of the two bottom plates 21 on the two guide rails 2 are intertwined, the position of the slide plate 22 will continue to move to the working area.

[0031] In the present invention, as a preferred embodiment, the above-mentioned alkaline etching area 101 includes an etching tank 11, a primary water washing tank 12, an acid solution soaking tank 13, a primary hot water soaking tank 14, a secondary hot water soaking tank 15, a secondary water washing tank 16 and a drying tank 17, which are arranged on the frame 1 from left to right.

[0032] In the present invention, the alkaline etching process of the semiconductor needs to sequentially undergo: etching, one water rinse, acid solution soaking, one hot water soaking, two hot water soakings, two water rinses and drying.

[0033] In the present invention, as a preferred embodiment, a plurality of acid-resistant and corrosion-resistant pumps 3 are provided at the bottom of the above-mentioned frame 1, and the input ends of the plurality of acid-resistant and corrosion-resistant pumps 3 are respectively connected to the inside of the etching tank 11, the primary water washing tank 12, the acid liquid soaking tank 13, the primary hot water soaking tank 14, the secondary hot water soaking tank 15, the secondary water rinse tank 16 and the drying tank 17, and the output ends of the plurality of acid-resistant and corrosion-resistant pumps 3 are connected to the same waste liquid pipe 31.

[0034] In the present invention, when it is necessary to replace the waste liquid inside the alkali etching area 101, the acid-resistant and corrosion-resistant pump 3 is opened to draw the liquid inside the etching tank 11, the primary water washing tank 12, the acid solution soaking tank 13, the primary hot water soaking tank 14, the secondary hot water soaking tank 15, the secondary water washing tank 16 or the drying tank 17 into the waste liquid pipe 31, so as to achieve the purpose of discharging the waste liquid inside the alkali etching area 101.

[0035] In the present invention, as a preferred solution, the above-mentioned frame 1 is provided with a fixed frame 4, the guide rail 2 is fixed on the fixed frame 4, the fixed frame 4 is provided with a transverse rack 41 parallel to the guide rail 2, a rotatable driving gear 42 is provided at the bottom of the base plate 21, and a driving motor 43 is provided on the base plate 21 to drive the driving gear 42 to rotate, and the driving gear 42 is meshed and connected to the transverse rack 41.

[0036] In the present invention, the working principle of the movement of the bottom plate 21 is as follows: the driving motor 43 is turned on to drive the driving gear 42 to move on the transverse rack 41 , thereby driving the bottom plate 21 to move on the guide rail 2 .

[0037] In the present invention, as a preferred embodiment, a vertical plate 5 extending vertically downward is provided at the bottom of the base plate 21, a guide track 51 is provided on the side of the fixed frame 4, the guide track 51 is parallel to the guide rail 2, and a slider 52 is provided on the vertical plate 5, and the slider 52 is slidably set on the guide track 51.

[0038] In the present invention, during the movement of the bottom plate 21 , the slider 52 on the vertical plate 5 moves synchronously on the guide rail 51 , thereby ensuring the stability of the movement of the bottom plate 21 .

[0039] In the present invention, as a preferred embodiment, a fixed plate 6 parallel to the horizontal plane is provided at the bottom of the vertical plate 5, and a slidable residual liquid collecting groove 61 is provided on the fixed plate 6. The sliding direction of the residual liquid collecting groove 61 is close to or away from the alkali etching area 101. When the lifting cylinder 23 drives the fixed groove 25 to move to the top of the alkali etching area 101, the sliding position of the residual liquid collecting groove 61 is always located directly below the fixed groove 25. When the lifting cylinder 23 drives the fixed groove 25 to move toward the inside of the alkali etching area 101, the residual liquid collection groove 61 slides away from the alkali etching area 101.

[0040] In the present invention, during the semiconductor alkaline etching process, the semiconductor needs to be moved at different positions in the alkali etching zone 101. In view of this, when the semiconductor is located above the alkali etching zone 101, some liquid will remain on the semiconductor. At this time, the residual liquid collection groove 61 is located below the fixed groove 25, and the liquid dripping on the semiconductor can be collected. When the semiconductor needs to enter the interior of the alkali etching zone 101 for alkaline etching treatment, the residual liquid collection groove 61 moves away from the alkali etching zone 101, thereby facilitating the semiconductor to enter the interior of the alkali etching zone 101.

[0041] In the present invention, as a preferred embodiment, symmetrical clamps 7 are provided on both sides of the above-mentioned base plate 21, the slide plate 22 is slidably arranged on the top of the clamp plate 7, a screw nut 71 is provided at the bottom of the slide plate 22, a fixing nut 72 is provided on the surface of the base plate 21, and a screw 73 is connected between the screw nut 71 and the fixing nut 72.

[0042] In the present invention, when the slide plate 22 needs to slide, external power acts on the screw rod 73 to rotate the screw rod 73 , and under the action of the screw rod 73 and the screw rod nut 71 , the slide plate 22 is driven to slide on the clamping plate 7 .

[0043] Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may be subject to various changes and improvements, which are within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor automated alkali etching device, comprising a frame (1), characterized in that: The frame (1) is provided with a semiconductor alkali etching area (101), two mutually parallel guide rails (2) are provided on both sides of the top of the alkali etching area (101), and a slidable bottom plate (21) is provided on each of the guide rails (2). Both of the two bottom plates (21) slide back and forth along the extension direction of the alkali etching area (101) and the sliding directions are always opposite. A movable slide plate (22) is provided on the bottom plate (21), and the movable position of the slide plate (22) on the bottom plate (21) is divided into The slide plate (22) is provided with a lifting cylinder (23) at the end thereof, and a self-rotating motor (24) is provided at the output end thereof. The output end of the self-rotating motor (24) faces downward and is provided with a semiconductor fixing groove (25). When the slide plate (22) is in the moving zone, a safety distance is maintained between the ends of the two slide plates (22). When the slide plate (22) is in the working zone, the fixing groove (25) is located directly above the alkali etching zone (101); The frame (1) is provided with a fixed frame (4), the guide rail (2) is fixed on the fixed frame (4), the fixed frame (4) is provided with a transverse rack (41) parallel to the guide rail (2), a rotatable driving gear (42) is provided at the bottom of the base plate (21), a driving motor (43) for driving the driving gear (42) to rotate is provided on the base plate (21), and the driving gear (42) is meshedly connected to the transverse rack (41); A vertical plate (5) extending vertically downward is provided at the bottom of the base plate (21); a guide rail (51) is provided on the side of the fixed frame (4); the guide rail (51) is parallel to the guide rail (2); a slider (52) is provided on the vertical plate (5); the slider (52) is slidably arranged on the guide rail (51); A fixed plate (6) parallel to the horizontal plane is provided at the bottom of the vertical plate (5), and a slidable residual liquid collecting groove (61) is provided on the fixed plate (6). The sliding direction of the residual liquid collecting groove (61) is close to or away from the alkali etching area (101). When the lifting cylinder (23) drives the fixed groove (25) to move above the alkali etching area (101), the sliding position of the residual liquid collecting groove (61) is always located directly below the fixed groove (25). When the lifting cylinder (23) drives the fixed groove (25) to move toward the inside of the alkali etching area (101), the residual liquid collecting groove (61) slides away from the alkali etching area (101).

2. The semiconductor automated alkali etching equipment according to claim 1, characterized in that: The alkaline etching area (101) comprises an etching tank (11), a primary water washing tank (12), an acid soaking tank (13), a primary hot water soaking tank (14), a secondary hot water soaking tank (15), a secondary water washing tank (16) and a drying tank (17) which are arranged on the frame (1) from left to right.

3. A semiconductor automated alkali etching device according to claim 2, characterized in that: A plurality of acid-resistant and corrosion-resistant pumps (3) are provided at the bottom of the frame (1), and the input ends of the plurality of acid-resistant and corrosion-resistant pumps (3) are respectively connected to the inside of the etching tank (11), the primary water washing tank (12), the acid solution soaking tank (13), the primary hot water soaking tank (14), the secondary hot water soaking tank (15), the secondary water washing tank (16) and the drying tank (17), and the output ends of the plurality of acid-resistant and corrosion-resistant pumps (3) are connected to the same waste liquid pipe (31).

4. The semiconductor automated alkali etching equipment according to claim 1, characterized in that: Symmetrical clamping plates (7) are provided on both sides of the base plate (21); the slide plate (22) is slidably arranged on the top of the clamping plates (7); a screw nut (71) is provided at the bottom of the slide plate (22); a fixing nut (72) is provided on the surface of the base plate (21); and a screw (73) is connected between the screw nut (71) and the fixing nut (72).

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