Display device manufacturing process and display device

Abstract

The present invention discloses a display device preparation process and a display device, wherein the display device preparation process includes the steps of first attachment, initiation, second attachment, hot pressing and degassing; the display device is made by the display device preparation process. In the present invention, the initiator in the bonding adhesive is stimulated in advance, so that the curing of the bonding adhesive runs through the second attachment, hot pressing and degassing steps, and the bonding adhesive has sufficient curing time, which is conducive to improving the curing degree of the bonding adhesive. Compared with the traditional preparation process, the curing method after degassing effectively shortens the preparation time of the display device and improves the preparation efficiency of the display device. The bonding adhesive continues to react and cross-link in the subsequent steps, and no other curing steps need to be set, so that the preparation process of the display device is simpler and easy to execute.

Description

Technical Field

[0001] The present invention relates to the technical field of display preparation, and in particular to a display device preparation process and a display device. Background Art

[0002] A display device generally includes a display panel for presenting an image, and a protective panel for protecting the display panel. In the related art, a bonding adhesive is arranged between the display panel and the protective panel. After the bonding adhesive is cured, the display panel and the protective panel are bonded to complete the preparation of the display device. Usually, after the colloid is excited, it is necessary to wait for a certain period of time before the colloid can be completely cured. The curing process takes a long time, which affects the preparation efficiency of the display device. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a display device manufacturing process, which can improve the manufacturing efficiency of the display device.

[0004] The present invention also provides a display device manufactured by using the above display device manufacturing process.

[0005] The display device manufacturing process according to the first aspect of the present invention is characterized by comprising:

[0006] First attachment, providing a bonding adhesive, tearing off the release film on one side of the bonding adhesive, attaching the first exposed side of the bonding adhesive to the surface of the first panel, and tearing off the release film on the other side of the bonding adhesive;

[0007] Initiating, stimulating the initiator in the bonding adhesive;

[0008] Second attachment, attaching the second exposed side of the bonding adhesive to the surface of the second panel to form a bonded body;

[0009] Hot pressing, hot pressing the bonding body to make the bonding adhesive and the bonding parts of the first panel and the second panel airtight;

[0010] Degassing: pressing the bonded body to discharge the bubbles in the bonded body.

[0011] The display device manufacturing process according to the embodiment of the present invention has at least the following beneficial effects:

[0012] The display device preparation process provided in the embodiment of the present invention excites the initiator in the bonding adhesive in advance, so that the curing of the bonding adhesive runs through the second attachment, hot pressing and degassing steps. The bonding adhesive has sufficient curing time, which is beneficial to improving the curing degree of the bonding adhesive. Compared with the traditional preparation process, the curing method after degassing effectively shortens the preparation time of the display device and improves the preparation efficiency of the display device. In addition, in the hot pressing step, the initiator in the bonding adhesive is affected by the temperature and has high activity, which can accelerate the curing progress of the bonding adhesive and make the curing of the bonding adhesive more sufficient. After the initiator of the bonding adhesive is excited, the bonding adhesive continues to react and cross-link in the subsequent steps, and there is no need to set other curing steps, which makes the preparation process of the display device simpler and easy to execute.

[0013] According to some embodiments of the present invention, in the initiating step and the second attaching step, the second exposed side of the bonding adhesive is arranged to face downward.

[0014] According to some embodiments of the present invention, in the second attaching step, a bonding jig is provided and the second panel is placed on the bonding jig. After the initiating step is completed, the bonding jig is quickly moved and the second exposed side of the bonding adhesive is attached to the second panel.

[0015] According to some embodiments of the present invention, in the initiating step, the bonding adhesive is subjected to UV irradiation.

[0016] According to some embodiments of the present invention, in the initiating step, UV irradiation is performed toward the second exposed side of the bonding adhesive.

[0017] According to some embodiments of the present invention, in the heat pressing step, the laminated body is placed in a heat pressing chamber, a heat pressing plate is provided to heat press the laminated body, and the heat pressing chamber is vacuumed.

[0018] According to some embodiments of the present invention, in the degassing step, the pressing of the laminate is delayed.

[0019] According to some embodiments of the present invention, after the degassing step, the bonded body is inspected for appearance, and defective products are repaired.

[0020] According to some embodiments of the present invention, after the degassing step, the bonded body is left to stand for a preset preparation time, and after the preset preparation time is reached, the bonded body is tested and defective products are repaired.

[0021] The display device according to the second aspect of the present invention is manufactured by using the display device bonding process of the first aspect of the present invention.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0024] Figure 1 A schematic diagram of a process flow of an embodiment of a display device manufacturing process of the present invention;

[0025] Figure 2 It is a schematic structural diagram of an embodiment of a display device of the present invention.

[0026] Reference numerals:

[0027] The first panel 100 ; the adhesive 200 ; and the second panel 300 . DETAILED DESCRIPTION

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0029] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0031] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0032] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0033] A display device preparation process is provided in an embodiment of the present invention, including a first attachment, initiation, a second attachment, hot pressing and degassing steps. Through the combination of the above steps, the bonding and fixation between two panels in the display device are completed, and the preparation efficiency of the display device is improved.

[0034] Specifically, the first attaching step includes setting a bonding adhesive, first tearing off the release film on one side of the bonding adhesive to expose one side of the bonding adhesive to form a first exposed side, attaching the first exposed side of the bonding adhesive to the surface of the first panel, and then tearing off the release film on the other side of the bonding adhesive to expose the other side of the bonding adhesive to form a second exposed side. The initiation step includes stimulating the initiator in the bonding adhesive. After the initiator is triggered, the chemical bonds between the internal elements thereof are opened, and a cross-linking reaction gradually begins. The bonding adhesive generates an adhesive force and the adhesive force gradually increases. After the bonding adhesive completes all cross-linking reactions, the bonding adhesive is completely cured and adheres to the panel to which it is attached. After the initiation step, the second attaching step is performed. The second attaching step includes attaching the second exposed side of the bonding adhesive to the surface of the second panel. The first panel, the bonding adhesive and the second panel are stacked in sequence to form a bonding body. The hot pressing step includes hot pressing the bonding body. During the hot pressing process, the bonding adhesive is heated to convert from a solid state to a molten state, and It flows between the first panel and the second panel, and under the action of pressure, the bubbles between the first panel and the second panel are discharged, so that the bonding part between the bonding adhesive and the first panel, and the bonding part between the bonding adhesive and the second panel are sealed, and the contact between the bonding adhesive and the first panel and the second panel is closer, which is beneficial to improve the bonding strength between the first panel and the second panel; after the hot pressing step, there is still air that has not been completely discharged in the bonding body, and the air is presented in the bonding body in the form of bubbles, which affects the display effect of the display device. In an embodiment of the present invention, a degassing operation is performed after the hot pressing step, and the bubbles in the bonding body are further discharged by pressing the bonding body to improve the preparation yield of the display device.

[0035] Therefore, the display device preparation process provided in the embodiment of the present invention excites the initiator in the bonding adhesive in advance, so that the curing of the bonding adhesive runs through the second attachment, hot pressing and degassing steps, so that the bonding adhesive has sufficient curing time, which is beneficial to improving the curing degree of the bonding adhesive. Compared with the traditional preparation process, the curing method after degassing effectively shortens the preparation time of the display device and improves the preparation efficiency of the display device. In addition, in the hot pressing step, the initiator in the bonding adhesive is affected by the temperature and has high activity, which can accelerate the curing progress of the bonding adhesive and make the curing of the bonding adhesive more sufficient. After the initiator of the bonding adhesive is excited, the bonding adhesive continues to react and cross-link in the subsequent steps, and there is no need to set other curing steps, which makes the preparation process of the display device simpler and easy to execute.

[0036] It should be noted that before the initiator is triggered, the adhesive has not been cross-linked and has no adhesive force. In the first attaching step, the adhesive only has self-adhesion and is attached to the surface of the first panel. After the triggering step, the adhesive force between the adhesive and the first panel gradually increases. When the triggering step is performed, the release films on both sides of the adhesive have been torn off, which can prevent the silicone oil on the release film from being transferred to the adhesive during the triggering process, affecting the appearance of the display device, and reducing the adhesive force between the adhesive and the panel, resulting in poor bonding between the panel and the adhesive.

[0037] In addition, one of the first panel and the second panel is a display panel, and the other is a protection panel. The display panel can be an LED display module, an OLED module, etc., and the protection panel can be a protective glass, a functional panel with a touch function, etc.

[0038] In an embodiment of the present invention, after the initiator of the bonding adhesive is triggered, no other curing steps are required, so the bonding adhesive can use a single-curing type colloid, that is, only one type of initiator exists in the bonding adhesive to complete the curing. According to the different types of initiators in the bonding adhesive, different methods can be used to stimulate the initiator. In one embodiment, the bonding adhesive includes a thermosetting initiator, and in the initiation step, the initiator is excited by heating the bonding adhesive; because in an embodiment of the present invention, the initiation step is set before the bonding adhesive is attached to the second panel, it is impossible to directly contact the bonding adhesive to heat the bonding adhesive, and the heating equipment has a complex structure, which is not conducive to operation, and it is easy to introduce impurities into the bonding adhesive. Based on this, in another embodiment of the present invention, the bonding adhesive includes a photocurable initiator, and in the initiation step, the bonding adhesive is UV irradiated to excite the initiator. The UV source does not need to contact the first panel and the bonding adhesive to achieve the initiation of the initiator, and the operation is convenient.

[0039] Specifically, in the initiation step, an initiation jig is provided, in which a plurality of UV light sources are integrated, and the UV light sources emit ultraviolet light, and the UV light sources are arranged in an array so that the ultraviolet light evenly irradiates the bonding adhesive, thereby ensuring the uniformity of the excitation of the initiator in different areas of the bonding adhesive by the UV light source; further, the UV light source is provided on both sides of the bonding adhesive, and simultaneously irradiates toward the bonding adhesive from both sides of the bonding adhesive, so as to further improve the uniformity of the initiation of the initiator in the bonding adhesive.

[0040] When the first panel or a part of the first panel is opaque, the adhesive can be excited by irradiating UV toward the side of the adhesive facing away from the first panel. Since in the embodiment of the present invention, the initiation step is set before the adhesive is attached to the second panel, when the initiator is excited by UV irradiation, the initiator is excited by irradiating UV directly toward the side of the adhesive facing away from the first panel, the UV irradiation is not blocked by the panel, and no other curing steps are required in the subsequent preparation process. Therefore, the preparation process provided in the embodiment of the present invention is suitable for the preparation of display devices in which both the first panel and the second panel are opaque.

[0041] The bonding adhesive can be made of UV-curable optically transparent hot melt adhesive (Thermal-melt Optical Clear Adhesive, TOCA) with optical properties. After tearing off the release film on the side, the internal adhesive film can be exposed. The adhesive film has high light transmittance and good ductility. It has good flow properties after heating, which can prevent the adhesive film from rebounding and the material from warping and deformation. It also has strong self-adhesion and high bonding strength.

[0042] In the initiation step and the second attaching step, before the second panel is attached to the bonding adhesive, the bonding adhesive continues to remain exposed on the second exposed side. To prevent external air and impurities from adhering to the second exposed side, in an embodiment of the present invention, in the initiation step and the second attaching step, the second exposed side of the bonding adhesive is set downward to prevent impurities in the air from falling on the second exposed side and affecting the bonding quality of the display device.

[0043] In addition, in order to avoid oxidation of the bonding adhesive and reduction of the bonding strength of the bonding adhesive to the panel due to long-term exposure of the second exposed side of the bonding adhesive, in an embodiment of the present invention, after the initiation step is completed, the second panel is immediately attached to the second exposed side; on the one hand, the second panel quickly covers the second exposed side to prevent impurities from entering the bonding body, and on the other hand, after the bonding adhesive is initiated, its bonding strength gradually increases. Excessive bonding strength of the bonding adhesive will affect the bonding quality between the second exposed side and the second panel, resulting in wrinkles in the bonding adhesive and low bonding flatness.

[0044] Specifically, in the second attaching step, a bonding jig is set and the second panel is placed on the bonding jig. The bonding jig fixes the second panel by vacuum adsorption, clamping with claws, etc. After the initiation step is completed, the bonding jig moves quickly to align the second panel with the second exposed side of the bonding adhesive so that the second exposed side of the bonding adhesive is attached to the second panel.

[0045] Since the bonding adhesive has been triggered before being attached to the second panel and has a certain bonding force, the first panel and the second panel in the bonding body structure are stably bonded to the bonding adhesive. This bonding force can prevent the different components inside the bonding body from shifting in position when the bonding body is transferred to other processing stations, thereby affecting the production yield.

[0046] To prevent the external environment from affecting the hot pressing effect, one embodiment of the present invention provides a relatively closed vacuum hot pressing environment for hot pressing. Specifically, an upper box is provided. After the bonding body is placed on the lower pressing plate, the lower pressing plate is moved to the bottom of the upper box, and then the upper box descends and snaps onto the top of the lower pressing plate, thereby forming a closed hot pressing cavity between the upper box and the lower pressing plate. The hot pressing cavity is closed by snapping the upper box onto the lower pressing plate, and the bonding body is isolated from the external environment. Subsequently, the hot pressing cavity is evacuated to place the bonding body in a vacuum environment to prevent air from entering between the stepless color-changing film and the protective glass during the hot pressing process and forming bubbles.

[0047] After the hot pressing cavity forms a vacuum environment, the upper pressing plate descends and covers the bonding body. The upper and lower pressing plates combine to apply pressure to the bonding body and transfer heat to the bonding body, so that the adhesive film melts and flows; when the bonding body is in the pressed state of the upper and lower pressing plates, the vacuum state in the hot pressing cavity is broken, so that the bonding body can adapt to the atmospheric environment in advance, and because the bonding body is pressed, external air will not enter the inside of the bonding body; as the upper pressing plate gradually rises, the upper pressing plate is lifted away from the bonding body. At this time, the pressure of the pressing plate on the bonding body is removed, and the bonding body is in an atmospheric pressure environment. The adhesive film is still in a free flow state, which can avoid the rebound of the adhesive film due to excessive pressure changes; after the upper pressing plate returns to its initial state, the upper box is lifted away from the lower pressing plate, the hot pressing cavity is opened, and the bonding body can follow the lower pressing plate to move out of the hot pressing station, so as to facilitate the hot pressing of the next bonding body.

[0048] The degassing step is arranged after the hot pressing step, and is used to further discharge bubbles from the bonded body and optimize the bonding quality. In the degassing step, air pressure is applied to the bonded body so that the bubbles in the bonded body are pressurized to flow to the edge of the bonded body and discharged. In order to prevent gas from entering the bonded body during the degassing process, in the embodiment of the present invention, when the hot pressing step is performed, the adhesive film flows to the outer edge of the bonded body and seals the outer edge of the bonded body, thereby achieving the effect of sealing the edge of the bonded body; since the adhesive film melts when heated and has flow characteristics, during hot pressing, the adhesive film is easily converted to liquid and flows to the edge of the bonded body, and the edge sealing effect of the bonded body is achieved through the overflow of the adhesive film.

[0049] In one embodiment, the step of applying air pressure is that the pressure application area gradually diffuses from the central area of ​​the fitting body to the edge area of ​​the fitting body, which is conducive to making the bubbles in the fitting body flow to the edge of the fitting body and facilitates the discharge of bubbles.

[0050] In order to make the curing of the bonding adhesive more complete, in an embodiment of the present invention, when executing the degassing step, the pressing of the bonding body is delayed, and the bonding adhesive is continuously subjected to the combined action of pressure and temperature, so that the initiator in the bonding adhesive undergoes a cross-linking reaction with higher activity, thereby improving the curing efficiency of the bonding adhesive. Moreover, under the pressure of degassing, the bonding strength between the bonding adhesive and the panel is improved.

[0051] After degassing, the bonded body is inspected. This inspection is mainly for appearance inspection. The appearance inspection is mainly to observe whether the bonded body has obvious non-bonded positions, cracks, overflow of glue, etc. If there are defective products, the bonding glue on the surface of the panel can be torn off by spraying alcohol on the panel or freezing it, and then the bonding glue can be re-attached to the panel. This will not cause waste of components in the display device and reduce the scrap rate.

[0052] In addition, after degassing, the laminated body can be left to stand for a while. On the one hand, this allows the initiator in the adhesive to react further to increase the degree of curing of the adhesive and the bonding strength to the panel. On the other hand, the adhesive is cooled during the standing process to facilitate subsequent testing.

[0053] It should be noted that the test of display devices is usually set within the preset preparation time (such as 48h-72h) after the display device is bonded. During the static process of the bonded body, on the one hand, the preset preparation time of the display device is completed, and on the other hand, it can continue to solidify during the static process. The test of display devices includes electrical performance test, adhesion test, etc. The electrical performance test is mainly to detect whether the panel can normally present the effect after the bonded body is powered on, etc. The adhesion test can be completed by pulling the bonded body. If defective products appear during the test, they can also be repaired by spraying alcohol reagent on the panel and freezing it.

[0054] A display device is also provided in an embodiment of the present invention, including a first panel 100, a bonding adhesive 200 and a second panel 300, wherein the bonding adhesive 200 is located between the first panel 100 and the second panel 300 and bonds the first panel 100 and the second panel 300, and the display device is prepared by the above-mentioned preparation process.

[0055] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A display device manufacturing process, characterized in that: include: First attachment, providing a bonding adhesive, tearing off the release film on one side of the bonding adhesive, attaching the first exposed side of the bonding adhesive to the surface of the first panel, tearing off the release film on the other side of the bonding adhesive, exposing the other side of the bonding adhesive to form a second exposed side, and keeping the second exposed side exposed; Initiating, stimulating the initiator in the bonding adhesive; Second attachment, immediately attaching the second exposed side of the bonding adhesive to the surface of the second panel after the initiation step is completed to form a bonded body, wherein in the initiation step and the second attachment step, the second exposed side of the bonding adhesive is arranged downward; Hot pressing, hot pressing the bonding body to make the bonding adhesive and the bonding parts of the first panel and the second panel airtight; Degassing: pressing the bonded body to discharge the bubbles in the bonded body.

2. The process for preparing a display device according to claim 1, characterized in that: In the second attaching step, a bonding jig is provided and the second panel is placed on the bonding jig. After the initiating step is completed, the bonding jig is quickly moved and the second exposed side of the bonding adhesive is attached to the second panel.

3. The process for preparing a display device according to claim 1, characterized in that: In the initiation step, the bonding adhesive is subjected to UV irradiation.

4. The process for preparing a display device according to claim 3, characterized in that: In the initiating step, UV irradiation is performed toward the second exposed side of the bonding adhesive.

5. The process for preparing a display device according to claim 1, characterized in that: In the heat pressing step, the laminated body is placed in a heat pressing chamber, a heat pressing plate is provided to heat press the laminated body, and the heat pressing chamber is vacuumed.

6. The process for preparing a display device according to claim 1, characterized in that: In the degassing step, the pressing of the laminate is delayed.

7. The process for preparing a display device according to claim 1, characterized in that: After the degassing step, the laminated body is inspected for appearance, and defective products are repaired.

8. The process for preparing a display device according to claim 1, characterized in that: After the degassing step, the laminated body is left to stand for a preset preparation time, and after the preset preparation time is reached, the laminated body is tested and defective products are repaired.

9. A display device, characterized in that The display device is prepared by the display device preparation process described in any one of claims 1 to 8.

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