Transfer jig and chip mounting method

Abstract

The present application provides a transfer jig and a chip mounting method. In this application, the chip mounting method includes: obtaining a chip to be mounted, the chip being positioned on a first carrier film with the back of the chip facing the first carrier film; using a transfer jig to transfer the chip from the first carrier film to a second carrier film, with the front of the chip facing the second carrier film; picking up the chip from the second carrier film and mounting the chip on a carrier board. In embodiments of the present application, residue on the back of the chip can be effectively removed, reducing defects in subsequent rewiring processes and preventing residue on the back of the chip from falling onto the carrier board and affecting the rewiring yield.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a film transfer jig and a chip mounting method. Background Art

[0002] In the fan-out packaging process, chip placement is performed directly after wafer sawing. Because the backside of the chip is cut with a diamond knife and lacks ABF (insulating film) protection, defects and debris are inevitable. During chip placement, chipping residue from the backside of the chip can fall onto the substrate, affecting the yield of the redistribution layer.

[0003] However, how to prevent the residue on the back of the chip caused by cutting from falling onto the carrier board and affecting the rewiring yield is a technical problem that needs to be solved. Summary of the Invention

[0004] The embodiments of the present application provide a film transfer jig and a chip bonding method, which can prevent the residue on the back of the chip caused by cutting from falling onto the carrier and affecting the rewiring yield.

[0005] The present invention provides a chip mounting method, including:

[0006] Obtaining a chip to be mounted, wherein the chip is located on a first carrier film, with the back side of the chip facing the first carrier film;

[0007] Using a transfer jig to transfer the chip from the first carrier film to a second carrier film, with the front side of the chip facing the second carrier film;

[0008] The chip is picked up from the second carrier film and mounted on a carrier board.

[0009] In one embodiment, obtaining a chip to be mounted includes:

[0010] fixing the first carrier film on the first wafer ring;

[0011] Fixing a wafer on the first carrier film, the wafer including N chips, where N is an integer greater than 2;

[0012] cutting the wafer so that there is a gap between two adjacent chips;

[0013] The fixed relationship between the chip and the first carrier film is eliminated to obtain a first intermediate transition structure, which includes the first wafer ring, the first carrier film and the chip to be mounted.

[0014] In one embodiment, the material of the first carrier film is a photosensitive polymer; eliminating the fixed relationship between the chip and the first carrier film includes:

[0015] The first carrier film is irradiated with ultraviolet light to separate the chip from the first carrier film.

[0016] In one embodiment, transferring the chip from the first carrier film to the second carrier film using a transfer jig includes:

[0017] The second carrier film is fixed on the front surface of the chip using the transfer jig to obtain a second intermediate transition structure; the second intermediate transition structure includes the second carrier film and the chip;

[0018] The second intermediate transition structure is turned over to transfer the chip from the first carrier film to the second carrier film.

[0019] In one embodiment, the film transfer jig includes a base and a cover; the cover is movably connected to the base;

[0020] The base includes a base, a first bracket, a second bracket, a boss and a fixing structure; the first bracket and the second bracket are respectively located on both sides of the base, the boss and the fixing structure are located on the base, the fixing structure is arranged around the boss, the fixing structure is used to fix the first wafer ring, the height of the boss is greater than the height of the fixing structure, the first wafer ring is used to fix the first carrier film; the boss is used to place the chip; the fixing structure includes a scale mark;

[0021] The cover includes a first end, a second end, a slot, a roller, and a track. The first end is opposite to the second end, the first end is movably connected to the first bracket, the track is located between the first end and the second end, the roller matches the track, and the roller can roll along the track. The slot is located under the roller, the slot is used to fix the second wafer ring, and the second wafer ring is used to fix the second carrier film.

[0022] The second carrier film is fixed on the front surface of the chip using the film transfer jig to obtain a second intermediate transition structure, including:

[0023] determining the orientation of the wafer on the boss according to a relative relationship between the orientations of the chip and the wafer and the orientation of the chip on the carrier;

[0024] The first intermediate transition structure is fixed to the base according to the orientation of the wafer on the boss, the first orientation mark of the wafer, and the scale mark, wherein the first wafer ring is fixed to the fixing structure, the first carrier film is located on the boss, and the chip is located on a side of the first carrier film away from the boss;

[0025] fixing the second carrier film on the second wafer ring to obtain a third intermediate transition structure;

[0026] Fixing the third intermediate transition structure in the cover, wherein the second wafer ring is fixed in the clamping groove;

[0027] Pressing down the cover so that the second end of the cover is located on the second bracket and the second carrier film is located on a side of the chip away from the boss;

[0028] controlling the roller to roll along the track so that the second carrier film is fixed on the front surface of the chip to obtain the second intermediate transition structure;

[0029] Turning over the second intermediate transition structure to transfer the chip from the first carrier film to the second carrier film includes:

[0030] The cover is lifted and turned over to turn over the second intermediate transition structure, the chip is separated from the first carrier film, and the chip is transferred from the first carrier film to the second carrier film.

[0031] In one embodiment, after lifting the lid and turning the lid over, the method further comprises:

[0032] Take out the second wafer ring and the second intermediate transition structure from the slot.

[0033] In one embodiment, before picking up the chip from the second carrier film and mounting the chip on a carrier board, the method further includes:

[0034] The fixed relationship between the chip and the second carrier film is eliminated.

[0035] In one embodiment, the material of the second carrier film is a photosensitive polymer; eliminating the fixed relationship between the chip and the second carrier film includes:

[0036] The second carrier film is irradiated with ultraviolet light to separate the chip from the second carrier film.

[0037] Some embodiments of the present application further provide a film transfer jig for use in the above-mentioned chip bonding method, wherein the film transfer jig comprises: a base and a cover;

[0038] The base is used to fix the first carrier film, and the first carrier film is used to carry the chip to be mounted, with the back side of the chip facing the first carrier film;

[0039] The cover is used to fix the second carrier film; the cover cooperates with the base to transfer the chip from the first carrier film to the second carrier film, with the front side of the chip facing the second carrier film.

[0040] In one embodiment, the cover is movably connected to the base;

[0041] The base includes a base, a first bracket, a second bracket, a boss and a fixing structure; the first bracket and the second bracket are respectively located on both sides of the base, the boss and the fixing structure are located on the base, the fixing structure is arranged around the boss, the fixing structure is used to fix the first wafer ring, the height of the boss is greater than the height of the fixing structure, the first wafer ring is used to fix the first carrier film; the boss is used to place the chip; the fixing structure includes a scale mark and a buckle; the scale mark is used to locate the direction of the wafer on the boss, and the buckle is used to fix the first wafer ring;

[0042] The cover includes a first end, a second end, a slot, a roller and a track; the first end is opposite to the second end, the first end is movably connected to the first bracket, the track is located between the first end and the second end, the roller matches the track, the roller can roll along the track, the slot is located under the roller, the slot is used to fix the second wafer ring, and the second wafer ring is used to fix the second carrier film.

[0043] In an embodiment of the present application, when the chip to be mounted is located on a first carrier film and the back of the chip faces the first carrier film, a transfer jig is used to transfer the chip from the first carrier film to a second carrier film so that the front of the chip faces the second carrier film. Then, the chip is picked up from the second carrier film and mounted on a carrier board. In this way, the residue on the back of the chip can be left on the first carrier film, and the residue on the back of the chip can be effectively removed to prevent the residue on the back of the chip from falling onto the carrier board and affecting the rewiring yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a flow chart of a chip mounting method according to an embodiment of the present application.

[0045] Figure 2 It is a structural schematic diagram of an intermediate structure generated during the chip bonding process according to an embodiment of the present application.

[0046] Figure 3 It is a flow chart of another chip mounting method according to an embodiment of the present application.

[0047] Figure 4 It is a flow chart of another chip mounting method according to an embodiment of the present application.

[0048] Figure 5 It is a structural schematic diagram of another intermediate structure generated during the chip bonding process according to an embodiment of the present application.

[0049] Figure 6 It is a structural schematic diagram of a film transfer jig according to an embodiment of the present application.

[0050] Figure 7 It is a flow chart of another chip mounting method according to an embodiment of the present application.

[0051] Figure 8 It is a structural schematic diagram of another intermediate structure generated during the chip bonding process according to an embodiment of the present application.

[0052] Figure 9 It is a structural schematic diagram of another intermediate structure generated during the chip bonding process according to an embodiment of the present application.

[0053] Figure 10 It is a structural schematic diagram of another film transfer fixture according to an embodiment of the present application.

[0054] Figure 11 It is a structural schematic diagram of another film transfer fixture according to an embodiment of the present application.

[0055] Figure 12 It is a structural schematic diagram of another intermediate structure generated during the chip bonding process according to an embodiment of the present application.

[0056] Figure 13 It is a structural schematic diagram of another intermediate structure generated during the chip bonding process according to an embodiment of the present application. DETAILED DESCRIPTION

[0057] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0058] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0059] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0060] The following embodiments of the present application are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0061] In the related art, the process from wafer sawing to die bonding has three main drawbacks:

[0062] 1. During die bonding, chip residue from cutting on the back of the chip (chipping) will fall onto the substrate, affecting the yield of the redistribution layer.

[0063] 2. In the fan-out packaging process where the die is placed face down first, the die is directly placed after being cut. Each die needs to be grabbed and flipped 180 degrees for placement, which is inefficient.

[0064] 3. If the carrier film has voids, wrinkles, or is at an incorrect angle before chip dicing, rework is currently only possible by manual transfer. Manual transfer can lead to inaccurate chip film orientation and easily result in defects such as voids and wrinkles.

[0065] In order to solve the above technical problems, the present application provides a transfer jig and a chip mounting method, which can effectively remove the residue on the back of the chip, prevent the residue on the back of the chip from falling onto the carrier and affecting the rewiring yield, improve the mounting efficiency, and avoid rework.

[0066] The embodiment of the present application provides a chip mounting method. Figure 1As shown, the chip mounting method includes the following steps 101 to 103:

[0067] In step 101 , a chip 21 to be mounted is obtained. The chip 21 to be mounted is located on a first carrier film 22 , and the back surface F1 of the chip 21 to be mounted faces the first carrier film 22 .

[0068] like Figure 2 As shown, the chips 21 to be mounted are positioned on a first carrier film 22, with the back surface F1 of the chips 21 facing the first carrier film 22 and the front surface F2 of the chips 21 facing away from the first carrier film 22. Bonding pads (not shown) are provided on the front surfaces F2 of the chips 21 to be mounted. A gap 23 exists between adjacent chips 21 to be mounted. The gap 23, also known as a scribe line, is formed by dicing the wafer.

[0069] In this embodiment, if Figure 3 As shown, step 101 may include the following steps 1011 to 1014:

[0070] In step 1011 , the first carrier film 22 is fixed on the first wafer ring.

[0071] In this embodiment, the first wafer ring is used to fix the first carrier film 22 and to tighten the first carrier film 22. The material of the first carrier film 22 can be a photosensitive polymer, which has viscosity and can be cured to lose viscosity after being irradiated by ultraviolet rays.

[0072] In step 1012 , a wafer is fixed on a first carrier film 22 , wherein the wafer includes N chips 21 to be mounted, where N is an integer greater than 2. For example, N is 2, 10, 100, or other numbers.

[0073] In this embodiment, before the wafer is cut, the N chips 21 to be mounted are not separate entities, but are connected together by the rest of the wafer except the chips 21. After the first carrier film 22 is tightened, the wafer warping can be reduced, making cutting easier.

[0074] In step 1013 , the wafer is cut so that there is a gap between two adjacent chips 21 .

[0075] In this embodiment, if Figure 2 As shown, after the wafer is cut, a gap 23 exists between two adjacent chips 21 , and the chips 21 become separate entities.

[0076] In step 1014 , the fixed relationship between the chip 21 and the first carrier film 22 is eliminated to obtain a first intermediate transition structure. The first intermediate transition structure includes the first wafer ring, the first carrier film 22 and the chip 21 to be mounted.

[0077] In this embodiment, ultraviolet light can be used to illuminate the first carrier film 22 from the side of the first carrier film 22 where the chip 21 is not fixed, so that the first carrier film 22 loses its stickiness, thereby separating the chip 21 from the first carrier film 22 and eliminating the fixed relationship between the chip 21 and the first carrier film 22. In this way, the chip 21 can be detached from the first carrier film 22.

[0078] In step 102 , a transfer jig is used to transfer the chip 21 from the first carrier film 22 to the second carrier film, with the front surface of the chip 21 facing the second carrier film.

[0079] In this embodiment, if Figure 4 As shown, step 102 may include the following steps 1021-1022:

[0080] In step 1021 , a transfer jig is used to fix the second carrier film 51 on the front surface F2 of the chip 21 to obtain a second intermediate transition structure 52 ; the second intermediate transition structure 52 includes the second carrier film 51 and the chip 21 .

[0081] like Figure 5 As shown, a film transfer jig can be used to fix the second carrier film 51 on the front side F2 of the chip 21 to obtain a second intermediate transition structure 52 .

[0082] In this embodiment, the film transfer jig includes a base (not shown) and a cover (not shown); the cover is movably connected to the base.

[0083] like Figure 6 As shown, the base includes a base 61, a first bracket 62, a second bracket 63, a boss 64, and a fixing structure 65. The first bracket 62 and the second bracket 63 are located on either side of the base 61, respectively. The boss 64 and the fixing structure 65 are located on the base 61. The fixing structure 65 is arranged around the boss 64 and is used to secure the first wafer ring. The height of the boss 64 is greater than that of the fixing structure 65, thereby ensuring tension on the first carrier film 22. The boss 64 is used to place the chip 21. The fixing structure 65 includes a fixing step 651, a scale mark, and a latch. The scale mark is located on the fixing step 651 and is used to locate the wafer on the boss 64. The latch is used to secure the first wafer ring.

[0084] like Figure 6 As shown, the cover includes a first end 66, a second end 67, a slot 68, a roller 69, and a track 610. The first end 66 and the second end 67 are opposite each other and are movably connected to the first bracket 62. The track 610 is located between the first end 66 and the second end 67. The roller 69 matches the track 610 and can roll along the track 610. The slot 68 is located below the roller 69 and is used to secure the second wafer ring, which is used to secure the second carrier film 51.

[0085] In this embodiment, if Figure 7 As shown, step 1021 may include the following steps 701 to 706:

[0086] In step 701 , the orientation of the wafer on the boss 64 is determined based on the relative relationship between the orientations of the chip 21 and the wafer and the orientation of the chip 21 on the carrier.

[0087] It should be noted that if Figure 8 and Figure 9 As shown, wafer 81, chip 21, and carrier 91 are directional. Wafer 81 has a first direction mark 811, chip 21 has a second direction mark 211, and carrier 91 has a third direction mark 911. The first direction mark 811 is used to identify the direction of wafer 81, the second direction mark 211 is used to identify the direction of chip 21, and the third direction mark 911 is used to identify the direction of carrier 91. The relative relationship between the direction of chip 21 and the direction of wafer 81 can be 0°, 45°, 90°, 180°, or other degrees.

[0088] In this embodiment, the relative relationship between the direction of the chip 21 and the direction of the wafer 81 is 0°.

[0089] In this embodiment, step 701 can be implemented manually or with the aid of a device. When implemented with the aid of a device, an image acquisition device can be used to acquire a wafer image, and the wafer image can be identified by a processing device to obtain the direction of the chip 21 and the direction of the wafer 81. An image acquisition device can also be used to acquire a carrier image, and a processing device can be used to identify the carrier image to obtain the direction of the carrier 91. The processing device can also obtain the relative relationship between the direction of the chip 21 and the direction of the wafer 81 based on the direction of the chip 21 and the direction of the wafer 81. The processing device can also obtain pre-stored information on the direction of the chip 21 on the carrier 91 to determine the direction of the chip 21 on the carrier 91, and then determine the direction of the wafer 81 on the boss 64 based on the relative relationship between the direction of the chip 21 and the direction of the wafer 81 and the direction of the chip 21 on the carrier 91.

[0090] In step 702, the first intermediate transition structure is fixed on the base according to the direction of the wafer 81 on the boss 64, the first direction mark 811 of the wafer 81 and the scale mark of the fixed structure 65, wherein the first wafer ring is fixed on the fixed structure 65, the first carrier film 22 is located on the boss 64, and the chip 21 is located on the side of the first carrier film 22 away from the boss 64.

[0091] In this embodiment, if Figure 10As shown, the scale mark on the fixed step 651 is an angle scale mark 1002, and the angle scale mark 1002 may include 0°, 45°, 90°, 180°, 135°, 180°, 225°, 270°, and 315°, but is not limited thereto.

[0092] In this embodiment, if Figure 10 As shown, after the first intermediate transition structure is fixed on the base, the buckle 1001 is used to fix the first wafer ring.

[0093] In this embodiment, if Figure 10 As shown, the first direction mark 811 of the wafer 81 is aligned with 0°.

[0094] In step 703 , the second carrier film 51 is fixed on the second wafer ring to obtain a third intermediate transition structure.

[0095] In this embodiment, the second carrier film 51 can be fixed on the second wafer ring (not shown) to obtain a third intermediate transition structure. The third intermediate transition structure includes the second wafer ring and the second carrier film 51. The second wafer ring is used to fix the second carrier film 51.

[0096] In step 704 , the third intermediate transition structure is fixed in the cover, wherein the second wafer ring is fixed in the clamping groove 68 .

[0097] In this embodiment, if Figure 6 As shown, the third intermediate transition structure is fixed in the cover, wherein the second wafer ring is fixed in the clamping groove 68. In this way, the third intermediate transition structure can rotate as the cover rotates.

[0098] In step 705 , the cover is pressed down so that the second end 67 of the cover is located on the second support 63 , and the second carrier film 51 is located on the side of the chip 21 away from the boss 64 .

[0099] In this embodiment, step 705 can be implemented manually or automatically by a first driving device, which is used to drive the cover to rotate. Figure 6 and Figure 11 As shown, in this step, the lid can be pressed down so that the second end 67 of the lid is located on the second bracket 63, and the second carrier film 51 is located on the side of the chip 21 away from the boss 64. The second carrier film 51 can be parallel to the surface of the boss 64 close to the lid. The second wafer ring 111 is fixed in the slot 68.

[0100] In step 706 , the roller 69 is controlled to roll along the track 610 to fix the second carrier film 51 on the front surface F2 of the chip 21 , thereby obtaining a second intermediate transition structure 52 .

[0101] In this embodiment, step 706 can be implemented manually or automatically by a second driving device, which is used to drive the roller 69 to roll along the track 610. Figure 6 As shown, when step 706 is implemented manually, the roller 69 further includes a handle 691 for facilitating the operator to drive the roller 69 to roll along the track 610 .

[0102] In this embodiment, by controlling the roller 69 to roll along the track 610 , the second carrier film 51 can be fixed on the front surface F2 of the chip 21 to form a second intermediate transition structure 52 . The second intermediate transition structure 52 includes the second carrier film 51 and the chip 21 .

[0103] In step 1022 , the second intermediate transition structure 52 is flipped over to transfer the chip 21 from the first carrier film 22 to the second carrier film 51 .

[0104] In this embodiment, the cover can be lifted and flipped to flip the second intermediate transition structure 52, separate the chip 21 from the first carrier film 22, and transfer the chip 21 from the first carrier film 22 to the second carrier film 51. Figure 5 As shown, the chip 21 can be transferred from the first carrier film 22 to the second carrier film 51 by turning over the cover.

[0105] In this embodiment, after the cover is turned over and the second intermediate transition structure 52 is turned over, the second wafer ring and the second intermediate transition structure 52 can be taken out from the slot 68 to obtain the following: Figure 12 The intermediate structure shown.

[0106] In this embodiment, after the second wafer ring and the second intermediate transition structure 52 are removed from the slot 68, ultraviolet light can be used to illuminate the second carrier film 51 from the side of the second carrier film 51 where the chip 21 is not fixed, so that the second carrier film 51 loses its stickiness, thereby separating the chip 21 from the second carrier film 51 and eliminating the fixed relationship between the chip 21 and the second carrier film 51. In this way, the chip 21 can be detached from the second carrier film 51.

[0107] In step 103 , the chip 21 is picked up from the second carrier film 51 and mounted on the carrier board 91 .

[0108] In this embodiment, if Figure 13 As shown, a robot arm can be used to pick up the chip 21 from the second carrier film 51 and mount the chip 21 on the carrier board 91 , wherein the front side F2 of the chip 21 faces the carrier board 91 .

[0109] In the embodiment of the present application, when the chip 21 to be mounted is located on the first carrier film 22 and the back side F1 of the chip 21 faces the first carrier film 22, a transfer jig is used to transfer the chip 21 from the first carrier film 22 to the second carrier film 51, so that the front side F2 of the chip 21 faces the second carrier film 51. Then, the chip 21 is picked up from the second carrier film 51 and mounted on the carrier board 91. In this way, the residue on the back side F1 of the chip 21 can be left on the first carrier film 22, and the residue on the back side F1 of the chip 21 can be effectively removed, thereby reducing defects in the redistribution process in the later process and preventing the residue on the back side F1 of the chip 21 from falling onto the carrier board 91 and affecting the redistribution yield.

[0110] Moreover, in this embodiment, since a transfer jig is used to transfer multiple chips 21 from the first carrier film 22 to the second carrier film 51 at one time, so that the front side F2 of the chip 21 faces the second carrier film 51, it is possible to avoid the robot arm flipping the chip 21 each time after picking it up and then mounting it on the carrier board 91, which can greatly improve the mounting efficiency and accuracy, and can also avoid the defects introduced by flipping the chip 21, thereby ensuring the transfer yield. Moreover, since the transfer jig is provided with a scale mark, the transfer direction of the wafer 81 can be accurately adjusted.

[0111] Furthermore, in this embodiment, a transfer jig is used to transfer multiple chips 21 from the first carrier film 22 to the second carrier film 51 at once, so that the front side F2 of the chip 21 faces the second carrier film 51. Even if there are voids, wrinkles, or misaligned angles between the chip 21 and the first carrier film 22 before or after dicing, rework can be avoided, thereby improving efficiency.

[0112] It should be noted that when the back side F1 of the chip 21 faces the carrier 91, the residue on the back side F1 of the chip 21 can also be left on the first carrier film 22, thereby effectively removing the residue on the back side F1 of the chip 21, reducing defects in the subsequent redistribution process, and preventing the residue on the back side F1 of the chip 21 from falling onto the carrier 91 and affecting the redistribution yield.

[0113] The chip 21 bonding method provided in the embodiment of the present application can be used for transferring an uncut wafer 81 or for transferring a cut wafer 81 .

[0114] The embodiment of the present application further provides a transfer jig for use in the above-mentioned chip 21 bonding method. The transfer jig includes: a base and a cover.

[0115] The base is used to secure the first carrier film 22, which supports the chip 21 to be mounted, with the back surface F1 of the chip 21 facing the first carrier film 22. The lid is used to secure the second carrier film 51; the lid and base cooperate to transfer the chip 21 from the first carrier film 22 to the second carrier film 51, with the front surface F2 of the chip 21 facing the second carrier film 51.

[0116] In this embodiment, the cover is movably connected to the base.

[0117] like Figure 6 and Figure 10 As shown, in this embodiment, the base includes a base 61, a first bracket 62, a second bracket 63, a boss 64 and a fixing structure 65; the first bracket 62 and the second bracket 63 are respectively located on both sides of the base 61, the boss 64 and the fixing structure 65 are located on the base 61, and the fixing structure 65 is arranged around the boss 64. The fixing structure 65 is used to fix the first wafer ring. The height of the boss 64 is greater than the height of the fixing structure 65. The first wafer ring is used to fix the first carrier film 22; the boss 64 is used to place the chip 21; the fixing structure 65 includes a fixing step 651, a scale mark and a buckle; the scale mark is located on the fixing step 651, the scale mark is used to locate the direction of the wafer 81 on the boss 64, and the buckle is used to fix the first wafer ring.

[0118] like Figure 6 and Figure 11 As shown, in this embodiment, the cover includes a first end 66, a second end 67, a slot 68, a roller 69 and a track 610; the first end 66 is opposite to the second end 67, the first end 66 is movably connected to the first bracket 62, the track 610 is located between the first end 66 and the second end 67, the roller 69 matches the track 610, the roller 69 can roll along the track 610, the slot 68 is located under the roller 69, the slot 68 is used to fix the second wafer ring, and the second wafer ring is used to fix the second carrier film 51.

[0119] In the embodiment of the present application, when the chip 21 to be mounted is located on the first carrier film 22 and the back side F1 of the chip 21 faces the first carrier film 22, a transfer jig is used to transfer the chip 21 from the first carrier film 22 to the second carrier film 51, so that the front side F2 of the chip 21 faces the second carrier film 51. Then, the chip 21 is picked up from the second carrier film 51 and mounted on the carrier board 91. In this way, the residue on the back side F1 of the chip 21 can be left on the first carrier film 22, and the residue on the back side F1 of the chip 21 can be effectively removed, thereby reducing the defects of the rewiring in the subsequent process and preventing the residue on the back side F1 of the chip 21 from falling onto the carrier board 91 and affecting the rewiring yield.

[0120] In the present application, the device embodiments and method embodiments can complement each other without conflict. The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed across multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present application. A person of ordinary skill in the art can understand and implement the present invention without inventive effort.

[0121] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A chip bonding method, characterized in that: include: Obtaining a chip to be mounted, wherein the chip is located on a first carrier film, with the back side of the chip facing the first carrier film; Using a transfer jig to transfer the chip from the first carrier film to a second carrier film, with the front side of the chip facing the second carrier film; Pick up the chip from the second carrier film and mount the chip on a carrier board; Get the chips to be mounted, including: fixing the first carrier film on the first wafer ring; Fixing a wafer on the first carrier film, the wafer including N chips, where N is an integer greater than 2; cutting the wafer so that there is a gap between two adjacent chips; Eliminating the fixed relationship between the chip and the first carrier film to obtain a first intermediate transition structure, wherein the first intermediate transition structure includes the first wafer ring, the first carrier film, and the chip to be mounted; Transferring the chip from the first carrier film to the second carrier film using a transfer jig, comprising: The second carrier film is fixed on the front surface of the chip using the film transfer jig to obtain a second intermediate transition structure; the second intermediate transition structure includes the second carrier film and the chip; flipping the second intermediate transition structure to transfer the chip from the first carrier film to the second carrier film; The film transfer fixture includes a base and a cover; the cover is movably connected to the base; The base includes a base, a first bracket, a second bracket, a boss and a fixing structure; the first bracket and the second bracket are respectively located on both sides of the base, the boss and the fixing structure are located on the base, the fixing structure is arranged around the boss, the fixing structure is used to fix the first wafer ring, the height of the boss is greater than the height of the fixing structure, the first wafer ring is used to fix the first carrier film; the boss is used to place the chip; the fixing structure includes a scale mark; The cover includes a first end, a second end, a slot, a roller, and a track. The first end is opposite to the second end, the first end is movably connected to the first bracket, the track is located between the first end and the second end, the roller matches the track, and the roller can roll along the track. The slot is located under the roller, the slot is used to fix the second wafer ring, and the second wafer ring is used to fix the second carrier film. The second carrier film is fixed on the front surface of the chip using the film transfer jig to obtain a second intermediate transition structure, including: determining the orientation of the wafer on the boss according to a relative relationship between the orientations of the chip and the wafer and the orientation of the chip on the carrier; The first intermediate transition structure is fixed to the base according to the orientation of the wafer on the boss, the first orientation mark of the wafer, and the scale mark, wherein the first wafer ring is fixed to the fixing structure, the first carrier film is located on the boss, and the chip is located on a side of the first carrier film away from the boss; fixing the second carrier film on the second wafer ring to obtain a third intermediate transition structure; Fixing the third intermediate transition structure in the cover, wherein the second wafer ring is fixed in the clamping groove; Pressing down the cover so that the second end of the cover is located on the second bracket and the second carrier film is located on a side of the chip away from the boss; controlling the roller to roll along the track so that the second carrier film is fixed on the front surface of the chip to obtain the second intermediate transition structure; Flipping the second intermediate transition structure to transfer the chip from the first carrier film to the second carrier film includes: The cover is lifted and turned over to turn over the second intermediate transition structure, the chip is separated from the first carrier film, and the chip is transferred from the first carrier film to the second carrier film.

2. The chip bonding method according to claim 1, wherein: The material of the first carrier film is a photosensitive polymer; eliminating the fixed relationship between the chip and the first carrier film includes: The first carrier film is irradiated with ultraviolet light to separate the chip from the first carrier film.

3. The chip bonding method according to claim 1, wherein: Lifting the cover and turning it over further comprises: Take out the second wafer ring and the second intermediate transition structure from the slot.

4. The chip bonding method according to claim 1, wherein: Before picking up the chip from the second carrier film and mounting the chip on a carrier board, the method further includes: The fixed relationship between the chip and the second carrier film is eliminated.

5. The chip bonding method according to claim 4, characterized in that: The material of the second carrier film is a photosensitive polymer; eliminating the fixed relationship between the chip and the second carrier film includes: The second carrier film is irradiated with ultraviolet light to separate the chip from the second carrier film.

6. A film transfer jig, characterized in that: The chip bonding method according to any one of claims 1 to 5, wherein the film transfer jig comprises: a base and a cover; The base is used to fix the first carrier film, and the first carrier film is used to carry the chip to be mounted, with the back side of the chip facing the first carrier film; The cover is used to fix the second carrier film; the cover cooperates with the base to transfer the chip from the first carrier film to the second carrier film, with the front side of the chip facing the second carrier film; The cover is movably connected to the base; The base includes a base, a first bracket, a second bracket, a boss and a fixing structure; the first bracket and the second bracket are respectively located on both sides of the base, the boss and the fixing structure are located on the base, the fixing structure is arranged around the boss, the fixing structure is used to fix the first wafer ring, the height of the boss is greater than the height of the fixing structure, the first wafer ring is used to fix the first carrier film; the boss is used to place the chip; the fixing structure includes a scale mark and a buckle; the scale mark is used to locate the direction of the wafer on the boss, and the buckle is used to fix the first wafer ring; The cover includes a first end, a second end, a slot, a roller and a track; the first end is opposite to the second end, the first end is movably connected to the first bracket, the track is located between the first end and the second end, the roller matches the track, the roller can roll along the track, the slot is located under the roller, the slot is used to fix the second wafer ring, and the second wafer ring is used to fix the second carrier film.

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