A hybrid integrated circuit automatic bonding compatible fixture and use method

Abstract

The present invention belongs to the technical field of hybrid integrated circuit clamping, and specifically discloses a hybrid integrated circuit automatic bonding compatible clamp and a method of use. It comprises a base, the bottom of the base is provided with a device nesting structure, the top of the base is provided with a placement cavity, the bottom of at least one inner side wall of the placement cavity is provided with a placement step, the bottom of the placement cavity is provided with a heating module, and the symmetrical direction of the placement step is provided with a movable clamping module. The present invention arranges a heating module at the bottom of the placement cavity to replace the heating base of the bonding device, and at the same time adapts to the shell sizes of products of different sizes by moving the clamping module, thereby avoiding the constant replacement of the clamp model, improving the production efficiency, and reducing the production cost.

Description

Technical Field

[0001] The invention belongs to the technical field of hybrid integrated circuit clamping, and in particular relates to a hybrid integrated circuit automatic bonding compatible clamp and a use method thereof. Background Art

[0002] The fixture for automatic bonding of hybrid integrated circuits usually fixes the product by vacuum adsorbing the product shell or applying pressure to the shell with a pressure block to ensure that the product does not move during bonding.

[0003] Existing fixtures fix the product by vacuum adsorbing the product shell or applying pressure to the shell with a pressure block. Such fixtures are basically not compatible. The number of hybrid integrated circuit products in a single batch is small, and the types of shells are many. The equipment needs to be recalibrated every time the fixture is replaced. Summary of the invention

[0004] The purpose of the present invention is to provide a hybrid integrated circuit automatic bonding compatible fixture and a use method to solve the technical problem that the existing fixture is not compatible with various types of hybrid integrated circuit housings, resulting in low production efficiency and high cost.

[0005] To achieve the above purpose, the present invention adopts the following technical solutions:

[0006] In a first aspect, a hybrid integrated circuit automatic bonding compatible fixture includes a base, a device nesting structure is provided at the bottom of the base, a placement cavity is provided at the top of the base, a plurality of first screw holes are provided inside the placement cavity, at least one inner side wall bottom of the placement cavity is provided with a placement step, a heating module is provided at the bottom of the placement cavity, and a movable clamping module is provided in the symmetrical direction of the placement step.

[0007] A further improvement of the present invention is that the device nesting structure is arranged at the bottom center of the base, and the device nesting structure includes a fixing plate, and a plurality of protrusions are evenly arranged on the edge of the fixing plate, and the protrusion direction of the protrusions is downward.

[0008] A further improvement of the present invention is that: a plurality of thermocouple placement holes and a plurality of heating tube placement holes are provided at the bottom of the base side, the heating module comprises a plurality of thermocouples and a plurality of heating tubes, the thermocouples are arranged in the thermocouple placement holes, and the heating tubes are arranged in the heating tube placement holes.

[0009] A further improvement of the present invention is that the mobile clamping module includes a push block, which is connected to a plurality of push rods. The push block is arranged in the placement cavity, and a plurality of first push rod screw holes are arranged on the symmetrical side walls of the base and the placement step, and each push rod passes through a first push rod screw hole.

[0010] A further improvement of the present invention is that: a plurality of first top screw holes are provided on the bottom surface of the base, and a first top screw hole corresponds to the bottom of each thermocouple placement hole or heating tube placement hole.

[0011] A further improvement of the present invention is that a push handle is provided at one end of the push rod away from the base, a push rod groove is provided at one end of the push rod connected to the push block, and the push handle and the push rod groove are connected by a long rod.

[0012] A further improvement of the present invention is that: a plurality of push block straight holes are provided on the side adjacent to the push block and the first push rod screw hole, the push block straight holes and the first push rod screw holes are the same in position, number and size, a plurality of second top screw holes are provided on the top of the push block, the second top screw holes are arranged directly above the push block straight holes, each second top screw hole corresponds to a push block straight hole, and a push block step is provided on the bottom of the side adjacent to the placement step.

[0013] A further improvement of the present invention is that the pushing block step is a rectangular parallelepiped, the height of which is the same as that of the placing step, and the top of the pushing block step and the placing step are in the same horizontal plane.

[0014] A further improvement of the present invention is that the push block and each push rod are fixedly connected via the push rod groove and the jackscrew in the second jackscrew screw hole.

[0015] In a second aspect, a method for using a hybrid integrated circuit automatic bonding compatible fixture comprises the following steps:

[0016] The base is nested on the bonding device through the device nesting structure, and the base is fixed on the bonding device through the first screw hole and the bolt;

[0017] Place the product to be processed into the placement cavity and clamp it between the placement step and the movable clamping module;

[0018] Clamp the product to be processed by moving the clamping module;

[0019] Control the heating module to continuously release heat until the processing is completed;

[0020] After processing is completed, the clamping module is controlled to move away from the product to be processed.

[0021] Compared with the prior art, the present invention has at least the following beneficial effects:

[0022] 1. The present invention arranges a heating module at the bottom of the placement cavity to replace the heating base of the bonding device, and at the same time, moves the clamping module to adapt to the shell sizes of products of different sizes, thereby avoiding the need to constantly change the clamp model, improving production efficiency and reducing production costs;

[0023] 2. The present invention provides a plurality of first top screw holes at the bottom of the base to fix the thermocouple and the heating tube through the top screws, thereby preventing the temperature of the heating tube and the thermocouple from changing during movement, and also reducing damage to the roots of the heating tube and the thermocouple;

[0024] 3. The present invention fixes the push block and the push rod by cooperating the top screw in the top screw hole with the push rod groove, thereby avoiding the problem of the push block not moving when the push rod moves outward, resulting in a problem of loose clamping. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0026] Figure 1 A top schematic diagram of a hybrid integrated circuit automatic bonding compatible fixture base of the present invention;

[0027] Figure 2 A bottom schematic diagram of a hybrid integrated circuit automatic bonding compatible fixture base of the present invention;

[0028] Figure 3 It is a structural schematic diagram of a push block of a hybrid integrated circuit automatic bonding compatible fixture of the present invention;

[0029] Figure 4 It is a structural schematic diagram of a push rod of a hybrid integrated circuit automatic bonding compatible fixture of the present invention;

[0030] Figure 5 The present invention is a schematic diagram of the overall structure of a hybrid integrated circuit automatic bonding compatible fixture.

[0031] In the figure: 1. base; 2. first push rod screw hole; 3. second push rod screw hole; 4. placement cavity; 5. placement step; 6. equipment nesting structure; 7. thermocouple placement hole; 8. heating tube placement hole; 9. first top screw screw hole; 10. second top screw screw hole top screw; 11. push block straight hole; 12. push block step; 13. push handle; 14. push rod slot; 15 first screw hole. DETAILED DESCRIPTION

[0032] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments. It should be noted that the embodiments and features in the embodiments of the present invention can be combined with each other without conflict.

[0033] The following detailed description is an exemplary description, which is intended to provide further detailed description of the present invention. Unless otherwise specified, all technical terms used in the present invention have the same meaning as those generally understood by those skilled in the art to which the present invention belongs. The terms used in the present invention are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present invention.

[0034] Example 1

[0035] like Figure 1-5 As shown, a hybrid integrated circuit automatic bonding compatible fixture includes a base 1, the base 1 is a rectangular parallelepiped, and a device nesting structure 6 is provided on the bottom surface of the base 1;

[0036] A placement cavity 4 is provided on the surface, and the placement cavity 4 is a groove opened on the surface of the base 1;

[0037] At least one side of the inner wall of the placement cavity 4 is provided with a placement step 5, the placement step 5 is a rectangular parallelepiped and lower in height than the placement cavity 4, and a plurality of first screw holes 15 are evenly arranged inside the placement cavity 4;

[0038] A plurality of first push rod screw holes 2 are provided on the side wall of the base 1 symmetrical to the placement step 5. The first push rod screw holes 2 are through holes. A push rod is arranged in each first push rod screw hole 2. A push rod is provided with a push handle 13 at one end of the push rod away from the base 1. The middle part of the push rod is a cylindrical long rod, and a push rod groove 14 is provided along the circumference of the other end.

[0039] A rectangular push block is arranged on one side of the first push rod screw hole 2 in the placement cavity 4, and a plurality of push block straight holes 11 are opened on the side adjacent to the first push rod screw hole 2. The push block straight holes 11 correspond to the first push rod screw hole 2 one by one, and the positions and sizes are the same;

[0040] A plurality of second top screw holes 10 are vertically arranged on the top of the push block, and a top screw hole 10 is arranged on the top of each push rod straight hole 11 in a direction toward the push block straight hole 11;

[0041] The push rod groove 14 on each push rod is fixed in the push block through the top screw in the top screw screw hole 10, so that the push rod is fixedly connected to the push block. A push block step 12 is provided at the bottom of the side wall adjacent to the placement step 5, and the push block step 12 is a rectangular parallelepiped protrusion.

[0042] The side of the base 1 is provided with a plurality of thermocouple placement holes 7 and a plurality of heating tube placement holes 8, and the bottom surface of the base 1 is provided with a plurality of first top screw holes 9, and each thermocouple placement hole 7 or heating tube placement hole 8 has a first top screw hole 9 at the bottom.

[0043] Different from other special clamps, the present invention first removes the heating base of the bonding equipment before use, takes out the heating rod and thermocouple in the heating base, puts the heating rod and thermocouple into the thermocouple placement hole 7 and the heating tube placement hole 8 respectively, and fixes them with the top screw in the first top screw hole 9.

[0044] The device nesting structure 6 includes a fixing plate arranged at the bottom center of the base 1, a plurality of screw holes are arranged in the middle of the fixing plate, a plurality of protrusions are evenly arranged on the edge of the fixing plate, and the protrusions are convex downward. The shape of the fixing plate is the same as the bottom surface of the heating base of the original bonding device, and the base 1 is nested and fixed on the bonding device through the protrusions on the edge of the fixing plate;

[0045] The base 1 and the fixing plate screw holes are provided with through holes of the same number and size at positions corresponding to the screw holes. The base 1 is fixed to the fixing plate and the bonding device through the screw holes, through holes and bolts.

[0046] A plurality of fixing screw holes are arranged at the bottom of the base 1, and the base 1 is first fixed to the bonding device through the fixing screw holes and bolts.

[0047] The first screw hole 15 is used to cooperate with a bolt to fix the base 1 to the bonding device.

[0048] The length and width of the placement cavity 4 are determined according to the working area of ​​the bonding head of the bonding equipment.

[0049] The depth of the placement cavity 4 is determined according to the sparking position of the bonding equipment's splitter, the position of the lowest bonding point, and the height of the product lead.

[0050] The width of the protrusion of the base step 5 is determined according to the minimum width between the tube shell pin and the edge of the tube base.

[0051] The thermocouple in the thermocouple placement hole 7 and the heating tube in the heating tube placement hole 8 form a heating module;

[0052] The length of the thermocouple placement hole 7 is determined according to the thermocouple length;

[0053] The length of the heating tube placement hole 8 is determined according to the length of the heating rod. If the heating rod is too long, the heating tube placement hole 8 is a through hole.

[0054] According to the positions and sizes of the screw holes on the original heating base of the bonding device and the operating table, the positions, quantity and hole diameters of the fixing screw holes on the base 1 that are nested with the bonding device are determined.

[0055] A plurality of first top screw holes 9 are provided at the bottom of the base 1, and the thermocouple and the heating tube are fixed by the top screws to prevent the temperature of the heating tube and the thermocouple from changing during movement, and also to reduce damage to the roots of the heating tube and the thermocouple.

[0056] The push rod and the push block form a movable clamping module, which is arranged on the side wall of the base 1 symmetrical to the placement step 5.

[0057] Since a push block is also required in the placement cavity 4, and some product pins are relatively long, the thermocouple and the heating tube are both arranged at the bottom of the placement cavity 4;

[0058] The first push rod screw hole 2 is set at the position closest to the top surface of the base 1 to avoid the product from warping up when the subsequent operator screws the push rod due to the large distance between the first push rod screw hole 2 and the top surface of the base 1.

[0059] like Figure 3 As shown, the length of the push block is slightly smaller than the length of the placement cavity 4, ensuring that when the push block is subsequently pushed, the side wall of the placement cavity 4 does not affect the movement of the push block.

[0060] The push block step 12 and the protrusion at the bottom of the placement step 5 are at the same height and on the same horizontal plane.

[0061] The push block and the push rod are fixed by the top screw in the top screw hole 10 cooperating with the push rod groove 14, so as to prevent the push block from being immobilized when the push rod moves outward.

[0062] Under normal circumstances, the product can be fixed with one push block, but if there are special circumstances, this method can be used to make a second push block, and a plurality of second push rod screw holes 3 can be set on the side wall of the base 1 perpendicular to the first push rod screw hole 2, and a second set of push rods and push blocks can be installed.

[0063] like Figure 4 As shown, the push handle 13 is a regular hexagon. In order to prevent the push rod from overheating and causing burns during use, the push rod should be as long as possible and the push rod should be treated with high temperature protection. The push handle 13 is made of high temperature resistant material;

[0064] The push rod groove 14 is a milled groove. After the push rod is screwed out from the first push rod screw hole 2 and passed through the straight hole 11 of the push block, the top screw is screwed into the top screw hole 10 at the top of the push block so that the top screw can just fit into the push rod groove 14. The top screw diameter in the top screw hole 10 is smaller than the width of the push rod groove 14.

[0065] The base 1 is made of steel or hard aluminum.

[0066] Example 2

[0067] A method for using a hybrid integrated circuit automatic bonding compatible fixture comprises the following steps:

[0068] The base 1 is nested on the bonding device through the device nesting structure 6, and then the base is fixed on the bonding device through the first screw hole 15, and the thermocouple and the heating rod are respectively placed in the thermocouple placement hole 7 and the heating tube placement hole 8, and fixed by the top screw in the first top screw screw hole 9;

[0069] Place the product to be processed into the placement cavity 4 and clamp it between the placement step 5 and the push block step 12;

[0070] The push rod controls the push block to clamp the product to be processed;

[0071] The thermocouple and the heating rod in the thermocouple placement hole 7 and the heating tube placement hole 8 continue to release heat until the processing is completed;

[0072] After the processing is completed, the push rod is used to control the push block to move away from the product to be processed, and the product to be processed is taken out.

[0073] It is known from common technical knowledge that the present invention can be implemented by other embodiments that do not deviate from its spirit or essential features. Therefore, the above disclosed embodiments are only illustrative in all respects and are not exclusive. All changes within the scope of the present invention or within the scope equivalent to the present invention are included in the present invention.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the present invention can still be modified or replaced by equivalents. Any modification or equivalent replacement that does not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A hybrid integrated circuit automatic bonding compatible fixture, characterized in that: The device comprises a base (1), wherein a device nesting structure (6) is provided at the bottom of the base (1), a placement cavity (4) is provided at the top of the base (1), a plurality of first screw holes (15) are provided inside the placement cavity (4), and the first screw holes (15) are used to cooperate with bolts to fix the base (1) to the bonding device, and at least one inner side wall of the placement cavity (4) is provided with a placement step (5) at the bottom, a heating module is provided at the bottom of the placement cavity (4), and a movable clamping module is provided in a direction opposite to the placement step (5); The bottom of the side of the base (1) is provided with a plurality of thermocouple placement holes (7) and a plurality of heating tube placement holes (8); the heating module comprises a plurality of thermocouples and a plurality of heating tubes; the thermocouples are arranged in the thermocouple placement holes (7), and the heating tubes are arranged in the heating tube placement holes (8); the thermocouples and heating rods in the thermocouple placement holes (7) and the heating tube placement holes (8) continuously release heat until the processing is completed; The bottom surface of the base (1) is provided with a plurality of first top screw holes (9), and each thermocouple placement hole (7) or heating tube placement hole (8) corresponds to a first top screw hole (9); Before use, remove the heating base of the bonding device, take out the heating rod and the thermocouple in the heating base, put the heating rod and the thermocouple into the thermocouple placement hole (7) and the heating tube placement hole (8) respectively, and fix them with the top screw in the first top screw hole (9); The mobile clamping module comprises a push block, the push block is arranged in the placement cavity (4), and a push block step (12) is provided at the bottom of the side surface of the push block adjacent to the placement step (5); the height of the push block step (12) is the same as that of the placement step (5), and the push block step (12) and the top of the placement step (5) are in the same horizontal plane; the product to be processed is clamped between the placement step (5) and the push block step (12).

2. A hybrid integrated circuit automated bonding compatible fixture according to claim 1, characterized in that: The device nesting structure (6) is arranged at the bottom center of the base (1), and the device nesting structure (6) comprises a fixing plate, and a plurality of protrusions are evenly arranged on the edge of the fixing plate, and the protrusion direction of the protrusions is downward.

3. The hybrid integrated circuit automated bonding compatible fixture according to claim 1, characterized in that: The push block is connected to a plurality of push rods. A plurality of first push rod screw holes (2) are provided on the side wall of the base (1) opposite to the placement step (5), and each push rod passes through a first push rod screw hole (2).

4. A hybrid integrated circuit automated bonding compatible fixture according to claim 3, characterized in that: A push handle (13) is provided at one end of the push rod away from the base (1), a push rod groove (14) is provided at one end of the push rod connected to the push block, and the push handle (13) and the push rod groove (14) are connected via a long rod.

5. The hybrid integrated circuit automated bonding compatible fixture according to claim 4, characterized in that: A plurality of push block straight holes (11) are provided on the side surface of the push block adjacent to the first push rod screw hole (2); the push block straight holes (11) are identical in position, number and size to the first push rod screw hole (2); a plurality of second top screw holes (10) are provided on the top of the push block; the second top screw holes (10) are arranged directly above the push block straight holes (11); and each second top screw hole (10) corresponds to a push block straight hole (11).

6. The hybrid integrated circuit automated bonding compatible fixture according to claim 4, characterized in that: The push block step (12) is a rectangular parallelepiped.

7. The hybrid integrated circuit automated bonding compatible fixture according to claim 4, characterized in that: The push block and each push rod are fixedly connected via a push rod groove (14) and a jackscrew in a second jackscrew screw hole (10).

8. A method for using a hybrid integrated circuit automatic bonding compatible fixture, based on a hybrid integrated circuit automatic bonding compatible fixture according to any one of claims 1 to 7, characterized in that: The following steps are involved: The base (1) is nested on the bonding device through the device nesting structure (6), and the base (1) is fixed on the bonding device through the first screw hole (15) and the bolt; The product to be processed is placed in the placement cavity (4) and clamped between the placement step (5) and the movable clamping module; Clamp the product to be processed by moving the clamping module; Control the heating module to continuously release heat until the processing is completed; After processing is completed, the clamping module is controlled to move away from the product to be processed.

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