Heating component of atomizing device and preparation method thereof

Abstract

The present invention relates to a heating component of an atomizing device and a preparation method thereof. The heating component of the atomizing device includes a porous body, a heating film layer and an adhesive layer. The heating film layer is arranged on the surface of the porous body. The heating film layer includes a substrate film, a plurality of liquid inlet holes provided on the substrate film and a heating circuit printed on the substrate film. The adhesive layer is arranged between the heating film layer and the porous body. The present invention can improve the bonding force between the porous body and the heating film layer and improve the heat transfer efficiency by providing an adhesive layer between the heating film layer and the porous body; by providing a heating circuit on the substrate film and by providing a plurality of liquid inlet holes in the substrate film, the liquid inlet holes are connected to the liquid guide holes through micropores, and the atomized liquid can enter the liquid inlet holes from the plurality of liquid guide holes through the micropores, and the heating circuit can generate heat to heat the atomized liquid atomized and entering the substrate film, thereby improving the atomization efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of atomizing devices, and in particular to a heating component of an atomizing device and a preparation method thereof. Background Art

[0002] The core component of the atomizer is the heating element. After more than a decade of development, the heating element has undergone three generations of technological evolution. The first generation of technology is a glass fiber rope wrapped around a heating wire. Due to the problems of easy floc formation, easy powder loss, and uneven heating, it has been eliminated. The second generation of technology is a resistance wire cotton core. It has the advantages of large liquid storage capacity, good liquid conductivity, and dense smoke volume, but it also has obvious disadvantages. For example, the cotton core is not resistant to high temperatures and is prone to dry burning. The resistance wire heats the atomized liquid unevenly, which is prone to producing a burnt smell. The cotton core has a loose structure and poor liquid locking ability, which is prone to leakage and large atomized molecular particles. The third generation of technology is a ceramic heating element. Its advantages are small atomized particles, delicate taste, good consistency, and it is not prone to leakage and burning.

[0003] However, ceramic heating components still have defects. Since their preparation method usually involves printing heating circuits on the surface of porous ceramics, the thermal conductivity of the ceramic material is low, and only part of the heating circuit is heated, resulting in low heating efficiency and slow heating response speed. Summary of the Invention

[0004] Based on this, it is necessary to provide a heating component of an atomization device and a preparation method thereof that can improve heat transfer efficiency and atomization efficiency.

[0005] A heating component of an atomizing device includes a porous body having a liquid storage tank and a plurality of liquid guide holes connected to the liquid storage tank. The heating component of the atomizing device also includes:

[0006] A heating film layer, which is disposed on the surface of the porous body and includes a substrate film, a plurality of liquid inlet holes provided on the substrate film, and a heating circuit printed on the substrate film;

[0007] An adhesive layer is provided between the heating film layer and the porous body, wherein the adhesive layer has a plurality of micropores, and the liquid guide hole is connected with the liquid inlet hole through the micropores.

[0008] In one embodiment, the heating circuit includes leads exposed from the substrate film.

[0009] In one embodiment, the heating circuit includes a circuit heating portion and a conductive portion, and the conductive portion connects the lead to the circuit heating portion.

[0010] In one embodiment, the heating circuit includes a plurality of heating circuits, and the plurality of heating circuits are arranged at intervals on the substrate film.

[0011] In one embodiment, the substrate film is a polyimide film.

[0012] The present application also provides a method for preparing a heating component of an atomizing device, comprising the following steps:

[0013] opening a liquid inlet hole on the substrate film;

[0014] Printing a heating paste on the substrate film, and using the heating paste to prepare a heating circuit to form a heating film layer;

[0015] The heating film layer is arranged on the surface of the porous body through an adhesive layer.

[0016] In one embodiment, the heating paste includes heating paste and conductive paste, and preparing the heating circuit includes the following steps:

[0017] Printing heating paste on the substrate film to form a circuit heating portion;

[0018] Conductive paste is printed on the base film to form a conductive portion connected to the circuit heating portion.

[0019] In one embodiment, before the liquid inlet hole is formed on the substrate film, the method further includes the following steps: performing corona treatment on the substrate film.

[0020] In one embodiment, the heating slurry includes the following components by weight: 30-45 parts of carbon-based heating material, 20-45 parts of polymer resin, 0.8-1.5 parts of dispersant, 10-25 parts of organic solvent, 0.5-1 part of promoter, 1-2 parts of defoaming agent, and 5-15 parts of filler.

[0021] Among them, the carbon-based heating material includes at least one of graphite powder, carbon fiber, carbon nanotube, carbon nanotube fiber, and carbon powder; the filler includes at least one of gypsum powder, kapok fiber, cattail fiber, bamboo pulp fiber, crop straw, cotton fiber, and wool natural fiber.

[0022] In one embodiment, the conductive paste includes the following components by weight: 70-88 parts of flaky silver powder, 15-20 parts of polymer resin, 0.8-1.5 parts of surfactant, 0.5-1.5 parts of dispersant, 10-15 parts of organic solvent, and 0.8-1.2 parts of accelerator.

[0023] In the above scheme, by setting an adhesive layer between the heating film layer and the porous body, the bonding force between the porous body and the heating film layer can be improved, and the heat transfer efficiency can be improved; by setting a heating circuit on the substrate film, and by opening a plurality of liquid inlet holes in the substrate film, the liquid inlet holes are connected to the liquid guide holes through micropores, and the atomized liquid can enter the liquid inlet holes from the plurality of liquid guide holes through the micropores, and the heating circuit can generate heat to heat the atomized liquid that is atomized and enters the substrate film, thereby improving the atomization efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 This is a front structural diagram of a heating component of an atomization device according to an embodiment of the present invention;

[0027] Figure 2 This is a top view of the heat-generating film layer according to an embodiment of the present invention;

[0028] Figure 3 A top view of the heat-generating film layer according to another embodiment of the present invention;

[0029] Figure 4 This is a flowchart of the steps of a method for preparing a heating component of an atomization device according to an embodiment of the present invention.

[0030] Description of Reference Numerals

[0031] 10. Heating component of the atomizing device; 100. Porous body; 200. Heating film layer; 210. Base film; 220. Liquid inlet hole; 230. Heating circuit; 231. Circuit heating part; 232. Conductive part; 300. Adhesive layer. DETAILED DESCRIPTION

[0032] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0035] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0036] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0037] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0038] See also Figure 1 One embodiment of the present invention provides a heating component 10 of an atomizing device, comprising a porous body 100, a heating film layer 200 and an adhesive layer 300. The porous body 100 is used to store and conduct atomized liquid in a heated state. The adhesive layer 300 and the heating film layer 200 are sequentially arranged on the surface of the porous body 100. The heating film layer 200 is used to heat the atomized liquid so that the atomized liquid is heated and atomized. By arranging the adhesive layer 300 on the porous body 100 and the heating film layer 200, the bonding force between the porous body 100 and the heating film layer 200 can be improved. Specifically, the porous body 100 has a liquid storage tank and a plurality of liquid guide holes connected to the liquid storage tank. The liquid storage tank is used to store atomized liquid, and the liquid guide holes are used to transfer atomized liquid in a heated state. The liquid guide holes are arranged throughout the porous body 100.

[0039] See also Figure 1 、 Figure 2 and Figure 3 The heating film layer 200 includes a substrate film 210, a plurality of liquid inlet holes 220 provided on the substrate film 210, and a heating circuit 230 printed on the substrate film 210. The heating circuit 230 is used to generate heat.

[0040] In this embodiment, the substrate film 210 is a polyimide film. The preparation method of the polyimide film is: polyamic acid solution is cast into a film, stretched, and then imidized at high temperature. The polyimide film is yellow and transparent, with a relative density of 1.39 to 1.45. The polyimide film has outstanding thermal stability, high temperature resistance, radiation resistance, chemical corrosion resistance and electrical insulation properties, and can be used for a long time in air at 250 to 280°C. The glass transition temperatures are 280°C (Upilex R), 385°C (Kapton) and above 500°C (Upilex S), respectively. The tensile strength is 200 MPa at 20°C and greater than 100 MPa at 200°C. In other embodiments, the substrate film 210 is made of a high-temperature resistant material. For example, the substrate film 210 is made of polyimide fiber.

[0041] The diameter of the liquid inlet hole 220 is 0.1 mm to 1 mm. The number of liquid inlet holes 220 and the diameter of the liquid inlet holes 220 are not limited in this application and can be set according to the use requirements. For example, the diameter of the liquid inlet hole 220 is 1 mm.

[0042] The adhesive layer 300 has multiple micropores, and the liquid guide hole is connected to the liquid inlet hole 220 through the micropores. It is important to understand that the adhesive layer 300 uses a porous adhesive that bonds at low temperatures. After being formed, the porous adhesive has multiple micropores formed within it. Atomized liquid can enter the liquid inlet hole 220 through the micropores from the liquid guide holes. The heating circuit 230 disposed on the substrate film 210 generates heat to heat the atomized liquid that has entered the substrate film 210.

[0043] See also Figure 1 、 Figure 2 and Figure 3 According to some embodiments of the present application, the heating circuit 230 may optionally include leads exposed from the substrate film 210. A power supply and a control circuit may be provided outside the substrate film 210, and the power supply and the control circuit are connected to the heating circuit 230 via the leads. The power supply can supply power to the heating circuit 230, and the control circuit can be used to control the on / off state of the circuit between the power supply and the heating circuit 230.

[0044] See also Figure 1 、 Figure 2 and Figure 3 According to some embodiments of the present application, the heating circuit 230 optionally includes a circuit heating portion 231 and a conductive portion 232. The conductive portion 232 connects the lead to the circuit heating portion 231 to heat the circuit heating portion 231. The shape of the circuit heating portion 231 can be a curve, a straight line, a wavy line, a spiral line, or a combination of a curve and a straight line, or a combination of a straight line and a wavy line, and this application does not impose any restrictions.

[0045] See also Figure 2 and Figure 3 According to some embodiments of the present application, the heating circuit 230 optionally includes at least a plurality of heating circuits 230, and the plurality of heating circuits 230 are disposed at intervals on the substrate film 210. It should be understood that the greater the ratio of the area of the heating circuit 230 to the area of the substrate film 210, the higher the efficiency of atomizing the atomized liquid onto the substrate film 210; conversely, the smaller the ratio of the area of the heating circuit 230 to the area of the substrate film 210, the lower the efficiency of atomizing the atomized liquid onto the substrate film 210. This application does not impose any restrictions on this, and it can be set according to the needs of the user.

[0046] See also Figure 2 In one embodiment, the heating circuit 230 includes four heating circuits, and the shape of the circuit heating portion 231 is as follows: Figure 2The four heating circuits 230 are arranged at intervals on the substrate film 210. In this embodiment, the heating circuits 230 are arranged throughout the substrate film 210, which can improve the efficiency of heating the atomized liquid entering the substrate film 210.

[0047] See also Figure 3 In another embodiment, the heating circuit 230 includes a plurality of heating parts, and the shape of the circuit heating part 231 is as follows Figure 3 As shown in the straight line, a plurality of circuit heating parts 231 are arranged at intervals along the length direction or the width direction of the base film 210. In this embodiment, the heating circuits 230 are arranged throughout the base film 210.

[0048] In another embodiment, the number of the heating circuit 230 is one, and the shape of the circuit heating portion 231 is a curve. In this embodiment, the heating circuit 230 is disposed throughout the base film 210 .

[0049] See also Figure 1 、 Figure 2 and Figure 4 The present application also provides a method for preparing the heating component 10 of the atomizing device as described above, comprising the following steps:

[0050] Step 1: Corona-treating the substrate film 210. The corona-treated substrate film 210 has stronger adhesion (i.e., a higher dyne coefficient), thereby increasing the bonding strength between the substrate film 210 and the heating paste, and preventing the substrate film 210 from being loosely adhered during subsequent processing.

[0051] Step 2: Open a liquid inlet hole 220 on the substrate film 210. The substrate film 210 is punched mechanically or by laser. Specifically, the diameter of the liquid inlet hole 220 is 0.1 mm to 1 mm.

[0052] Step 3: Printing a heating paste on the substrate film 210 and using the heating paste to prepare a heating circuit 230 to form the heating film layer 200. The heating paste can be printed on the substrate film 210 using either a screen printing process or an electroplating process. In this embodiment, the heating paste is printed on the substrate film 210 using a screen printing process.

[0053] Step 4: Cut the heating film layer 200 .

[0054] Step 5: Place the heating film layer 200 on the surface of the porous body 100 via the adhesive layer 300. The heating film layer 200 is bonded to the surface of the porous body 100 via the adhesive layer 300. Specifically, the adhesive layer 300 uses a porous adhesive that bonds at low temperatures, effectively preventing the adhesive from clogging the channel connecting the liquid guide hole and the liquid inlet hole 220. For example, the adhesive is gypsum.

[0055] See also Figure 1 and Figure 2 According to some embodiments of the present application, optionally, the heating paste includes a heating paste and a conductive paste, and preparing the heating circuit 230 includes the following steps;

[0056] Step 1: Print heating paste on substrate film 210 to form circuit heating portion 231. Screen printing is used to print the pattern of circuit heating portion 231. Specifically, the parameters for printing the heating paste are a mesh size of 200-800 and a squeegee pressure of 40-95N. For example, the parameters for printing the heating paste are a mesh size of 400 and a squeegee pressure of 50N.

[0057] Step 2: Print a conductive paste on the substrate film 210 to form a conductive portion 232 connected to the circuit heating portion 231. The circuit heating portion 231 is connected to one end of the lead through the conductive portion 232, and the other end of the lead is connected to the power supply and the control circuit. The power supply can supply power to the circuit heating portion 231, and the control circuit can be used to control the on and off of the circuit between the power supply and the circuit heating portion 231. Specifically, the parameters when printing the conductive paste are a mesh size of 50-200 mesh and a scraper pressure of 45-100N. Specifically, the parameters when printing the conductive paste are a mesh size of 200 mesh and a scraper pressure of 60N.

[0058] According to some embodiments of the present application, optionally, the heating slurry includes the following components by weight: 30-45 parts of carbon-based heating material, 20-45 parts of polymer resin, 0.8-1.5 parts of dispersant, 10-25 parts of organic solvent, 0.5-1 part of promoter, 1-2 parts of defoaming agent, and 5-15 parts of filler.

[0059] Specifically, the carbon-based heating material includes at least one of graphite powder, carbon fibers, carbon nanotubes, carbon nanotube fibers, and carbon powder. Graphite powder has properties such as high temperature resistance, electrical conductivity, thermal conductivity, chemical stability, and thermal shock resistance. Graphite powder has properties such as high temperature resistance, friction resistance, electrical conductivity, thermal conductivity, and corrosion resistance. Carbon nanotubes have high modulus, high strength, good electrical conductivity, and good thermal transfer properties. Carbon nanotube fibers have good electrical conductivity and good thermal transfer properties. Carbon powder has properties such as high temperature resistance, electrical conductivity, and thermal conductivity.

[0060] The polymer resin is epoxy resin or silica gel. The dispersant is a BYK series dispersant, illustratively BYK-1165. The organic solvent includes at least one of ethyl acetate, dioctyl phthalate, diethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, and ethanol. Exemplarily, the accelerator is KH-550 coupling agent. The defoamer is polydimethylsiloxane. The filler includes at least one of gypsum powder, kapok fiber, cattail fiber, bamboo pulp fiber, crop straw, cotton fiber, and wool.

[0061] According to some embodiments of the present application, optionally, the conductive paste includes the following components by weight: 70-88 parts of flaky silver powder, 15-20 parts of polymer resin, 0.8-1.5 parts of surfactant, 0.5-1.5 parts of dispersant, 10-15 parts of organic solvent, and 0.8-1.2 parts of accelerator.

[0062] Specifically, the purity of the flaky silver powder is greater than 99.99%. The polymer resin is epoxy resin or silica gel. The surfactant is polyvinyl pyrrolidone or lactic acid monoglyceride. The dispersant is RENTANL or Reotan LAM. The organic solvent includes at least one of ethyl acetate, dioctyl phthalate, diethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, and ethanol. The accelerator is a silane coupling agent. Specifically, the accelerator is A171 (vinyl trimethoxysilane) or A172 (vinyl tri(β-methoxyethoxy) silane).

[0063] Example:

[0064] The present disclosure is more specifically described with reference to the following examples, which are intended to be illustrative only, since various modifications and variations within the scope of the present disclosure will be apparent to those skilled in the art.

[0065] Example 1:

[0066] The substrate film 210 was corona treated, and then a liquid inlet hole 220 with a diameter of 0.1 mm was opened in the substrate film 210 by mechanical punching. Then, a conductive paste was printed on the substrate film 210 to form the circuit heating portion 231. The parameters for printing the heating paste were a mesh size of 200 and a scraper pressure of 40N.

[0067] A conductive paste is then printed on the substrate film 210 to form the conductive portion 232, which is then connected to the circuit heating portion 231. The parameters for printing the conductive paste are a 50-mesh grid and a squeegee pressure of 45 N. The heating film layer 200 is then cut and finally attached to the surface of the porous body 100 via the adhesive layer 300.

[0068] The heating paste includes the following components by weight: 30 parts carbon-based heating material, 20 parts polymer resin, 0.8 parts dispersant, 10 parts organic solvent, 0.5 parts accelerator, 1 part defoamer, and 5 parts filler. The conductive paste includes the following components by weight: 70 parts flake silver powder, 15 parts polymer resin, 0.8 parts surfactant, 0.5 parts dispersant, 10 parts organic solvent, and 0.8 parts accelerator.

[0069] More specifically, the carbon-based heating material uses graphite powder. The polymer resin uses epoxy resin. The dispersant for the heating slurry is BYK-1165, and the organic solvent is diethylene glycol ethyl ether acetate. The accelerator is KH-550 coupling agent. The defoamer is polydimethylsiloxane. The filler is gypsum powder. The purity of the flaky silver powder is 99.99%. The surfactant is polyvinyl pyrrolidone. The dispersant for the conductive paste is RENTANL. The accelerator is A171 (vinyltrimethoxysilane).

[0070] Example 2:

[0071] The substrate film 210 was corona treated, and then a liquid inlet hole 220 with a diameter of 1 mm was opened in the substrate film 210 by laser drilling. Then, a conductive paste was printed on the substrate film 210 to form the circuit heating portion 231. The parameters for printing the heating paste were a mesh size of 800 and a scraper pressure of 95N.

[0072] A conductive paste is then printed on the substrate film 210 to form the conductive portion 232, which is then connected to the circuit heating portion 231. The parameters for printing the conductive paste are a 200 mesh grid and a squeegee pressure of 100 N. The heating film layer 200 is then cut and finally attached to the surface of the porous body 100 via the adhesive layer 300.

[0073] The heating paste includes the following components by weight: 45 parts carbon-based heating material, 45 parts polymer resin, 1.5 parts dispersant, 25 parts organic solvent, 1 part accelerator, 2 parts defoamer, and 15 parts filler. The conductive paste includes the following components by weight: 88 parts flake silver powder, 20 parts polymer resin, 1.5 parts surfactant, 1.5 parts dispersant, 15 parts organic solvent, and 1.2 parts accelerator.

[0074] More specifically, the carbon-based heating material uses carbon fiber. The polymer resin uses silica gel. The dispersant for the heating slurry is BYK-190, and the organic solvent is diethylene glycol butyl ether acetate. The accelerator is KH-550 coupling agent. The defoaming agent is polydimethylsiloxane. The filler is kapok fiber. The purity of the flaky silver powder is 99.99%. The surfactant is monoglyceride of lactate. The dispersant for the conductive slurry is Reotan LAM. The accelerator is A172 (vinyl tri(β-methoxyethoxy) silane)).

[0075] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A heating component of an atomizing device, comprising a porous body having a liquid storage tank and a plurality of liquid guide holes connected to the liquid storage tank, characterized in that: include: A heating film layer, which is arranged on the surface of the porous body, and includes a substrate film, a plurality of liquid inlet holes provided on the substrate film, and a heating circuit printed on the substrate film; the substrate film is made of a polyimide film; The adhesive layer is arranged between the heating film layer and the porous body, the heating film layer is bonded to the surface of the porous body through the adhesive layer, the adhesive layer has a plurality of micropores, and the liquid guide hole is connected with the liquid inlet hole through the micropores.

2. The heating component of the atomizing device according to claim 1, characterized in that: The heating circuit includes leads exposed from the base film.

3. The heating component of the atomizing device according to claim 2, characterized in that: The heating circuit includes a circuit heating portion and a conductive portion, and the conductive portion connects the lead wire and the circuit heating portion.

4. The heating component of the atomizing device according to claim 1, characterized in that: The heating circuits include a plurality of heating circuits, and the plurality of heating circuits are arranged on the base film at intervals.

5. The heating component of the atomizing device according to claim 1, characterized in that: The diameter of the liquid inlet hole is 0.1mm-1mm.

6. A method for preparing a heating component of an atomizing device according to any one of claims 1 to 5, characterized in that: The preparation method comprises the following steps: A liquid inlet hole is provided on the substrate film; Printing a heating paste on the substrate film, and using the heating paste to prepare a heating circuit to form a heating film layer; The heating film layer is arranged on the surface of the porous body through an adhesive layer.

7. The method for preparing the heating component of the atomizing device according to claim 6, characterized in that: The heating paste includes heating paste and conductive paste, and preparing the heating circuit includes the following steps: Printing heating paste on the substrate film to form a circuit heating portion; Conductive paste is printed on the base film to form a conductive portion connected to the circuit heating portion.

8. The method for preparing the heating component of the atomizing device according to claim 6, characterized in that: Before the liquid inlet hole is formed on the substrate film, the method further comprises the following steps: performing corona treatment on the substrate film.

9. The method for preparing the heating component of the atomizing device according to claim 7, characterized in that: The heating slurry includes the following components by weight: 30-45 parts of carbon-based heating material, 20-45 parts of polymer resin, 0.8-1.5 parts of dispersant, 10-25 parts of organic solvent, 0.5-1 part of accelerator, 1-2 parts of defoaming agent, and 5-15 parts of filler.

10. The method for preparing the heating component of the atomizing device according to claim 7, characterized in that: The conductive paste comprises the following components by weight: 70-88 parts of flaky silver powder, 15-20 parts of polymer resin, 0.8-1.5 parts of surfactant, 0.5-1.5 parts of dispersant, 10-15 parts of organic solvent, and 0.8-1.2 parts of accelerator.

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