An efficient film stripping device and film stripping process for wafers

Abstract

The present invention discloses an efficient film stripping device and a film stripping process for wafers, belonging to the field of wafer processing. An efficient film stripping device for wafers includes a frame. A conveyor belt is arranged on the upper part of the frame. A number of wafer fixing frames are arranged on the conveyor belt. A combination of a wafer body and a film is assembled on the wafer fixing frame. One end of the conveyor belt is the starting end and the other end is the ending end. A primary separation mechanism and a secondary stripping mechanism are arranged on the frame and on the upper side of the conveyor belt. And the primary separation mechanism is located on the side of the secondary stripping mechanism close to the starting end. A waste film recycling mechanism is arranged on the secondary stripping mechanism. A dust box is fixedly connected to the lower side of the frame at the ending end of the conveyor belt. The primary separation mechanism includes an L-shaped bracket fixedly connected to the frame. It can achieve continuous stripping and storage of multiple wafer bodies and films, improve the film stripping efficiency, and have a better film stripping effect.

Description

Technical Field

[0001] The present invention relates to the field of wafer processing, and more specifically, to an efficient film stripping device and film stripping process for wafers. Background Art

[0002] Through patent retrieval, it is found that a Chinese patent with the publication number CN216015313U discloses a new type of wafer film stripper. This device completes batch film stripping through the methods of heat baking and vacuum suction, improving work efficiency and effect, and enhancing reliability;

[0003] However, it uses vacuum suction to strip the film from the wafer. When the wafer and the film are firmly adhered, it is unable to effectively peel the film from the wafer, resulting in poor film stripping effect. For this reason, we propose an efficient film stripping device and film stripping process for wafers. Summary of the Invention

[0004] 1. Technical Problems to be Solved

[0005] Aiming at the problems existing in the prior art, the purpose of the present invention is to provide an efficient film stripping device and film stripping process for wafers, which can achieve continuous stripping and storage of multiple wafer bodies and films, improve film stripping efficiency, and have a better film stripping effect.

[0006] 2. Technical Solutions

[0007] To solve the above problems, the present invention adopts the following technical solutions.

[0008] An efficient film stripping device for wafers includes a frame. An upper part of the frame is provided with a conveyor belt, and a plurality of wafer fixing frames are arranged on the conveyor belt. A combination of a wafer body and a film is assembled on the wafer fixing frame. One end of the conveyor belt is the starting end, and the other end is the ending end. An initial separation mechanism and a secondary stripping mechanism are arranged on the frame and above the conveyor belt, and the initial separation mechanism is located on the side of the secondary stripping mechanism closer to the starting end;

[0009] A waste film recycling mechanism is arranged on the secondary stripping mechanism, and a dust box is fixedly connected to the lower side of the frame at the ending end of the conveyor belt.

[0010] Furthermore, the initial separation mechanism includes an L-shaped bracket fixedly connected to the frame. A plurality of small brackets are fixedly connected to a lower part of the L-shaped bracket, and elastic ropes are assembled on the small brackets.

[0011] Furthermore, the secondary stripping mechanism includes an auxiliary bracket fixedly connected to the frame. A hot melt film stripping cylinder located above the conveyor belt is rotatably connected to the conveyor belt, and a driving mechanism for driving the hot melt film stripping cylinder to rotate is also fixedly connected to the auxiliary bracket.

[0012] Furthermore, the waste film recycling mechanism includes a stripping wire assembly fixedly connected to the auxiliary bracket and a waste film recycling box. A guide plate is fixedly connected to the waste film recycling box in an inclined manner and abuts against the hot melt film stripping cylinder.

[0013] The stripping wire assembly includes two elastic frames fixedly connected to the auxiliary bracket, and the two elastic frames are respectively located on both sides of the hot melt film stripping cylinder. A separation steel wire is fixedly connected between the two elastic frames, and the lower part of the separation steel wire abuts against the upper part of the hot melt film stripping cylinder.

[0014] Furthermore, the wafer fixing frame includes a plurality of mounting grooves obliquely formed in the fixing base, and the upper part of the mounting groove is inclined towards the side close to the starting end of the conveyor belt, and the side of the mounting groove close to the ending end of the conveyor belt is designed to be open.

[0015] A plurality of clamping cavities are formed inside the fixing base, and the plurality of clamping cavities are respectively adapted to the plurality of mounting grooves. Two symmetrically arranged clamping strips are rotatably connected to both sides of the mounting groove inside the clamping cavity, and a synchronous adjustment assembly is further arranged on the fixing base.

[0016] Furthermore, the clamping strip includes a hook-shaped clamping strip and a driving plate. The hook-shaped clamping strip and the driving plate are fixedly connected in an inclined manner. The hook-shaped clamping strip is located inside the clamping cavity and has a hook shape, and the openings of the two hook-shaped clamping strips face each other. The driving plate extends to the outside of the clamping cavity and is connected to the synchronous adjustment assembly. A rotating rod rotatably connected to the clamping cavity is fixedly connected to the connection part of the hook-shaped clamping strip and the driving plate.

[0017] Furthermore, the synchronous adjustment assembly includes an adjustment self-locking assembly, a transmission plate, a plurality of conduction round rods and a plurality of universal balls. The fixing base and the transmission plate are connected through the adjustment self-locking assembly. The plurality of conduction round rods are slidably connected to the lower side of the transmission plate. The universal ball is rotatably connected to one end of the driving plate far from the hook-shaped clamping strip, and the conduction round rod is inserted into the universal ball.

[0018] Furthermore, a elastic bottom pad assembly is further arranged on the fixing base and located below the mounting groove. The elastic bottom pad assembly includes an elastic cavity formed in the fixing base, and the upper part of the elastic cavity is communicated with the lower part of the mounting groove. A return spring is installed inside the elastic cavity, and a support piece is installed inside the elastic cavity and above the return spring.

[0019] Furthermore, a quick feeding assembly is also provided on the fixed seat. The quick feeding assembly includes a guiding chute opened on the fixed seat along the long side direction of the fixed seat and an auxiliary support plate fixedly connected to one side of the fixed seat. A storage cylinder is slidably connected to the guiding chute, and a tension mechanism is fixedly connected to the auxiliary support plate. The output end of the tension mechanism is connected to the storage cylinder.

[0020] An efficient film stripping process for wafers, the process comprising the following steps:

[0021] S1: Sequentially place a combination of multiple wafer bodies and film sheets into the interior of the storage cylinder;

[0022] S2: Slide the storage cylinder along the long side direction of the fixed seat, and sequentially drop the multiple combinations inside the storage cylinder into multiple installation slots;

[0023] S3: Drive the threaded rod to rotate through the adjusting device, adjust the angle of the hook-shaped clamping strip, and clamp the wafer body;

[0024] S4: Start the conveyor belt to drive the combination of the wafer body and the film sheet to move, and complete the initial separation of the wafer body and the film sheet and the film stripping work on the wafer;

[0025] S5: Start the driving mechanism to drive the hot melt film stripping cylinder to rotate, separate the film sheet on the hot melt film stripping cylinder through the stripping line assembly, and let the stripped film sheet fall into the interior of the waste film recycling bin for storage;

[0026] S6: Drive the threaded rod to rotate again through the adjusting device, adjust the angle of the hook-shaped clamping strip, so that the hook-shaped clamping strip no longer contacts the wafer body, and release the clamping and fixing of the wafer body by the hook-shaped clamping strip;

[0027] S7: Start the conveyor belt to drive the wafer body after film stripping to move. When the wafer body moves to the end of the conveyor belt, the film sheet automatically falls into the interior of the ash bin for recycling.

[0028] 3. Beneficial effects

[0029] Compared with the prior art, the advantages of the present invention are as follows:

[0030] (1) In this solution, the conveyor belt drives the combination of multiple wafer bodies and film sheets to move. During the movement, the wafer body and the film sheet are stripped by the primary separation mechanism and the secondary stripping mechanism, and the stripped film sheet is recycled and stored by the waste film recycling mechanism, and the stripped wafer body is recycled and stored by the ash bin. Therefore, it is possible to continuously strip and store multiple wafer bodies and film sheets, improve the film stripping efficiency, and the film stripping effect is better. Description of the drawings

[0031] Figure 1 It is a schematic structural diagram of the present invention;

[0032] Figure 2 It is a schematic structural diagram of the wafer fixing frame of the present invention;

[0033] Figure 3 It is a sectional side view of the wafer fixing frame of the present invention;

[0034] Figure 4 It is a schematic structural diagram of the partial section of the wafer fixing frame of the present invention;

[0035] Figure 5 It is a schematic structural diagram of the primary separation mechanism of the present invention;

[0036] Figure 6 It is a schematic structural diagram of the elastic frame of the present invention.

[0037] Description of reference numerals in the figure:

[0038] 1. Frame; 2. Conveyor belt; 3. Fixed seat; 4. Installation groove; 5. Wafer body; 6. Diaphragm; 7. Elastic cavity; 8. Return spring; 9. Support piece; 10. Clamping cavity; 11. Hook-shaped clamping bar; 12. Universal ball; 13. Conducting round rod; 14. Transmission plate; 15. Threaded ring; 16. Connector; 17. Threaded rod; 18. Guide chute; 19. Storage cylinder; 20. Auxiliary support plate; 21. Tension mechanism; 22. Driving plate; 23. Rotating rod; 24. Auxiliary support; 25. Hot melt film stripping cylinder; 26. Driving mechanism; 27. Waste film recycling box; 28. Guide plate; 29. Ash box; 30. Guide sleeve; 31. Lifting rod; 32. Separation steel wire; 33. Tension spring; 34. L-shaped bracket; 35. Small bracket; 36. Elastic pull rope; 37. Adjusting device. Detailed implementation manners

[0039] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0040] Embodiment 1:

[0041] Please refer to Figures 1-6As shown in the figure, an efficient film stripping device for wafers includes a frame 1. A conveyor belt 2 is arranged at the upper part of the frame 1. A number of wafer fixing frames are arranged on the conveyor belt 2. A combination of a wafer body 5 and a film 6 is assembled on the wafer fixing frame. One end of the conveyor belt 2 is the starting end and the other end is the ending end. A primary separation mechanism and a secondary stripping mechanism are arranged on the frame 1 and above the conveyor belt 2, and the primary separation mechanism is located on the side of the secondary stripping mechanism closer to the starting end.

[0042] Among them, please refer to Figure 1 and Figure 5 As shown in the figure, the primary separation mechanism includes an L-shaped bracket 34 fixedly connected to the frame 1. A plurality of small brackets 35 are fixedly connected to the lower part of the L-shaped bracket 34. Elastic ropes 36 are assembled on the small brackets 35.

[0043] At this time, the combination of the wafer body 5 and the film 6 is placed obliquely on the wafer fixing frame. When the combination moves above the conveyor belt 2, the wafer body 5 will contact the elastic rope 36. When the wafer body 5 continues to move, the elastic rope 36 will move upward along the slope of the wafer body 5 until it reaches the connection between the wafer body 5 and the film 6. When the wafer body 5 continues to move, the elastic rope 36 will separate a corner of the wafer body 5 and the film 6, completing the primary separation of the combination of the wafer body 5 and the film 6.

[0044] Among them, please refer to Figure 1 As shown in the figure, the secondary stripping mechanism includes an auxiliary bracket 24 fixedly connected to the frame 1. A hot melt film stripping cylinder 25 is rotatably connected on the conveyor belt 2 and above the conveyor belt 2. A driving mechanism 26 for driving the hot melt film stripping cylinder 25 to rotate is also fixedly connected to the auxiliary bracket 24.

[0045] When the driving mechanism 26 is started, it will drive the hot melt film stripping cylinder 25 to rotate. When the combination of the wafer body 5 and the film 6 moves to the lower part of the hot melt film stripping cylinder 25, the lower part of the hot melt film stripping cylinder 25 will bond the film 6 on the wafer body 5, and then continue to rotate the driving mechanism 26 to tear the film 6 from the wafer body 5, completing the film stripping work of the wafer.

[0046] At the same time, in order to recycle the wafer body 5 and the film 6 after film stripping, a waste film recycling mechanism is arranged on the secondary stripping mechanism. A dust box 29 is fixedly connected to the frame 1 and below the ending end of the conveyor belt 2.

[0047] The waste film recycling mechanism is used to clean and recycle the film 6 adhered to the wafer body 5, and the dust box 29 is used to recycle the wafer body 5 falling from the ending end of the conveyor belt 2.

[0048] Among them, the waste film recycling mechanism includes a peeling wire assembly fixedly connected to the auxiliary support 24 and a waste film recycling box 27. A guide plate 28 that abuts against the hot-melt film peeling cylinder 25 is fixedly connected to the waste film recycling box 27 in an inclined manner. When the hot-melt film peeling cylinder 25 rotates, the film sheet 6 on the hot-melt film peeling cylinder 25 is separated by the peeling wire assembly, and then the peeled film sheet 6 falls onto the guide plate 28 and falls into the interior of the waste film recycling box 27 along the slope of the guide plate 28 for storage.

[0049] Among them, the peeling wire assembly includes two elastic frames fixedly connected to the auxiliary support 24, and the two elastic frames are respectively located on both sides of the hot-melt film peeling cylinder 25. A separating steel wire 32 is fixedly connected between the two elastic frames, and the lower part of the separating steel wire 32 abuts against the upper part of the hot-melt film peeling cylinder 25. When the film sheet 6 on the hot-melt film peeling cylinder 25 comes into contact with the separating steel wire 32, it will be separated by the separating steel wire 32.

[0050] Please refer to Figure 1 and Figure 6 As shown, the elastic frame is used to drive the separating steel wire 32 to move downward. It includes a guide sleeve 30 fixedly connected to the auxiliary support 24. A lifting rod 31 is slidably connected inside the guide sleeve 30. The upper part of the lifting rod 31 is connected to the separating steel wire 32. A tension spring 33 is installed inside the guide sleeve 30 and below the lifting rod 31. At this time, the lifting rod 31 is pulled by the self-deformation performance of the tension spring 33 itself, so that the lifting rod 31 drives the separating steel wire 32 to move downward.

[0051] Among them, please refer to Figures 1-4 As shown, the wafer fixing frame includes a plurality of mounting grooves 4 obliquely opened on the fixing base 3, and the upper part of the mounting groove 4 is inclined toward the starting end of the conveyor belt 2. The side of the mounting groove 4 close to the end of the conveyor belt 2 is designed to be open;

[0052] At this time, when the combination of the wafer body 5 and the film sheet 6 is placed inside the mounting groove 4, due to the angle setting of the mounting groove 4 itself, the wafer body 5 can be kept at an inclined angle;

[0053] At the same time, please refer to Figures 3-4 As shown, in order to maintain the stability of the combination when placed inside the mounting groove 4, a plurality of clamping cavities 10 are opened inside the fixing base 3. The plurality of clamping cavities 10 are respectively adapted to the plurality of mounting grooves 4. Two symmetrically arranged clamping bars are rotatably connected inside the clamping cavity 10 and on both sides of the mounting groove 4. A synchronous adjustment assembly is also provided on the fixing base 3 for synchronously adjusting the angles of the two clamping bars to clamp the wafer body 5;

[0054] Here, please refer to Figure 4As shown, the clamping strip includes a hook-shaped clamping strip 11 and a driving plate 22. The hook-shaped clamping strip 11 and the driving plate 22 are fixedly inclined. The hook-shaped clamping strip 11 is located inside the clamping cavity 10, and its shape is hook-shaped, and the openings of the two hook-shaped clamping strips 11 face each other. The driving plate 22 extends to the outside of the clamping cavity 10 and is connected to the synchronous adjustment assembly. A rotating rod 23 rotatably connected to the clamping cavity 10 is fixedly connected at the connection between the hook-shaped clamping strip 11 and the driving plate 22. When the angle of the driving plate 22 changes, it will drive the hook-shaped clamping strip 11 to rotate around the rotating rod 23 as the center, adjust the angle of the hook-shaped clamping strip 11, and clamp the wafer body 5.

[0055] Here, please refer to again Figures 3-4 As shown, the synchronous adjustment assembly includes an adjustment self-locking assembly, a transmission plate 14, a plurality of conduction round rods 13 and a plurality of universal balls 12. The fixed seat 3 and the transmission plate 14 are connected by the adjustment self-locking assembly to adjust the distance between the fixed seat 3 and the transmission plate 14. A plurality of conduction round rods 13 are slidably connected to the lower side of the transmission plate 14. The universal balls 12 are rotatably connected to one end of the driving plate 22 away from the hook-shaped clamping strip 11, and the conduction round rods 13 are inserted into the universal balls 12;

[0056] At this time, when the transmission plate 14 moves, it will drive the universal balls 12 to move together through the conduction round rods 13. When the universal balls 12 move, they will move horizontally through one end of the driving plate 22 away from the hook-shaped clamping strip 11, thereby adjusting the angle of the driving plate 22;

[0057] In order to ensure the rotation range of the driving plate 22, a circular cavity is opened at one end of the driving plate 22 away from the hook-shaped clamping strip 11, and the universal ball 12 is installed inside the circular cavity, so that the universal ball 12 can rotate within a larger range inside the circular cavity.

[0058] Among them, the adjustment self-locking assembly includes a threaded ring 15, a connecting piece 16 and a threaded rod 17. The threaded ring 15 is fixedly connected to the transmission plate 14, the connecting piece 16 is fixedly connected to the fixed seat 3, the threaded rod 17 is rotatably connected to the connecting piece 16, and the threaded ring 15 and the threaded rod 17 are threadedly connected. When the threaded rod 17 rotates, it will drive the threaded ring 15 threadedly connected to it to move horizontally. When the threaded ring 15 moves horizontally, it will drive the transmission plate 14 to move together, and after the movement is completed, the threaded ring 15 is fixed through its thread to complete the locking of the transmission plate 14.

[0059] Moreover, the adjustment self-locking assembly further includes an adjustment device 37 connected to the threaded rod 17. The adjustment device 37 can be any one of a motor and a knob. When the adjustment device 37 is a motor, the motor is fixedly connected to the fixed seat 3.

[0060] Meanwhile, in order to enable the diaphragm 6 to be in close contact with the hot-melt film stripping cylinder 25, an elastic bottom pad assembly is further provided on the fixing base 3 and below the installation groove 4. The elastic bottom pad assembly includes an elastic cavity 7 opened on the fixing base 3, and the upper part of the elastic cavity 7 communicates with the lower part of the installation groove 4. A return spring 8 is installed inside the elastic cavity 7, and a support piece 9 is installed above the return spring 8 inside the elastic cavity 7. At this time, the elastic force of the return spring 8 can push the support piece 9, causing the support piece 9 to drive the wafer body 5 to move upward, so that the diaphragm 6 abuts against the hot-melt film stripping cylinder 25.

[0061] Meanwhile, please refer to Figures 2-3 As shown, in order to more conveniently place multiple wafer bodies 5 into the multiple installation grooves 4 respectively, a quick feeding assembly is further provided on the fixing base 3. The quick feeding assembly includes a guiding chute 18 opened on the fixing base 3 along the long side direction of the fixing base 3 and an auxiliary support plate 20 fixedly connected to one side of the fixing base 3. A storage cylinder 19 is slidably connected to the guiding chute 18, and a tension mechanism 21 is fixedly connected to the auxiliary support plate 20. The output end of the tension mechanism 21 is connected to the storage cylinder 19. The combinations of multiple wafer bodies 5 and diaphragms 6 are vertically stacked and placed inside the storage cylinder 19. When the storage cylinder 19 slides, the combinations inside the storage cylinder 19 will sequentially fall into different installation grooves 4. After the sliding is completed, by stretching the storage cylinder 19 through the tension mechanism 21, the storage cylinder 19 can be driven to reset.

[0062] Embodiment 2:

[0063] On the basis of Embodiment 1, an efficient film stripping process for wafers is disclosed, which is a method for using an efficient film stripping device for wafers. The process includes the following steps:

[0064] The first step: sequentially place the combinations of multiple wafer bodies 5 and diaphragms 6 into the storage cylinder 19.

[0065] The second step: slide the storage cylinder 19 along the long side direction of the fixing base 3. During the sliding process, the multiple combinations inside the storage cylinder 19 will sequentially fall into the multiple installation grooves 4, and then the storage cylinder 19 is reset through the tension mechanism 21.

[0066] The third step: drive the threaded rod 17 to rotate through the adjusting device 37. When the threaded rod 17 rotates, it will drive the threaded ring 15 threadedly connected to it to move horizontally. When the threaded ring 15 moves horizontally, it will drive the transmission plate 14 to move together. After the movement is completed, the threaded ring 15 is fixed through its thread to complete the locking of the transmission plate 14.

[0067] When the transmission plate 14 moves, it will drive the universal ball 12 to move together through the conduction round rod 13. When the universal ball 12 moves, it will move horizontally through the end of the driving plate 22 away from the hook-shaped clamping strip 11, thereby adjusting the angle of the driving plate 22;

[0068] When the angle of the driving plate 22 changes, it will drive the hook-shaped clamping strip 11 to rotate around the rotating rod 23, adjust the angle of the hook-shaped clamping strip 11, and clamp the wafer body 5;

[0069] Step 4: Start the conveyor belt 2 to drive the combination of the wafer body 5 and the diaphragm 6 to move. When the combination passes through the elastic pull rope 36, the wafer body 5 will contact the elastic pull rope 36. When the wafer body 5 continues to move, the elastic pull rope 36 will move upward along the slope of the wafer body 5 until it moves to the connection between the wafer body 5 and the diaphragm 6. When the wafer body 5 continues to move, the elastic pull rope 36 will separate a corner of the wafer body 5 and the diaphragm 6 to complete the initial separation of the combination of the wafer body 5 and the diaphragm 6;

[0070] When the combination passes under the hot-melt film stripping cylinder 25, the lower part of the hot-melt film stripping cylinder 25 will bond the diaphragm 6 on the wafer body 5 and tear the diaphragm 6 from the wafer body 5 to complete the film stripping work of the wafer;

[0071] Step 5: Start the driving mechanism 26 to drive the hot-melt film stripping cylinder 25 to rotate, separate the diaphragm 6 on the hot-melt film stripping cylinder 25 through the stripping line assembly, and then let the stripped diaphragm 6 fall onto the guide plate 28 and fall into the waste film recycling bin 27 along the slope of the guide plate 28 for storage;

[0072] Step 6: Rotate the threaded rod 17 again through the adjusting device 37. When the threaded rod 17 rotates, it will drive the threaded ring 15 threadedly connected to it to move horizontally. When the threaded ring 15 moves horizontally, it will drive the transmission plate 14 to move together. After the movement is completed, fix the threaded ring 15 through its thread to complete the locking of the transmission plate 14;

[0073] When the transmission plate 14 moves, it will drive the universal ball 12 to move together through the conduction round rod 13. When the universal ball 12 moves, it will move horizontally through the end of the driving plate 22 away from the hook-shaped clamping strip 11, thereby adjusting the angle of the driving plate 22;

[0074] When the angle of the driving plate 22 changes, it will drive the hook-shaped clamping strip 11 to rotate around the rotating rod 23, adjust the angle of the hook-shaped clamping strip 11, so that the hook-shaped clamping strip 11 no longer contacts the wafer body 5, and release the clamping and fixing of the hook-shaped clamping strip 11 on the wafer body 5;

[0075] Step 7: Start the conveyor belt 2 to drive the wafer body 5 after film peeling to move. When the wafer body 5 moves to the end of the conveyor belt 2, the opening of the installation groove 4 faces downward, and the wafer body 5 inside it automatically falls due to gravity and falls into the ash bin 29 for recycling.

[0076] In summary, the present invention drives the combination of multiple wafer bodies 5 and diaphragm 6 by the conveyor belt 2 to move. During the movement, the wafer body 5 and the diaphragm 6 are peeled off by the primary separation mechanism and the secondary peeling mechanism, and the peeled diaphragm 6 is recycled and stored by the waste film recycling mechanism, and the peeled wafer body 5 is recycled and stored by the ash bin 29, so that multiple wafer bodies 5 and diaphragm 6 can be continuously peeled off and stored, improving the film peeling efficiency. Moreover, by opening the connection between the wafer body 5 and the diaphragm 6 through the primary separation mechanism and peeling the diaphragm 6 through the secondary peeling mechanism, the film peeling effect can be effectively improved.

[0077] The above is only the preferred specific implementation manner of the present invention; however, the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its improved concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. An efficient film stripping device for wafers, comprising a frame (1), characterized in that: The upper part of the frame (1) is provided with a conveyor belt (2), and a number of wafer fixing frames are arranged on the conveyor belt (2). A combination of a wafer body (5) and a diaphragm (6) is assembled on the wafer fixing frame. One end of the conveyor belt (2) is the starting end, and the other end is the ending end. An initial separation mechanism and a secondary peeling mechanism are arranged on the frame (1) and above the conveyor belt (2), and the initial separation mechanism is located on the side of the secondary peeling mechanism closer to the starting end; A waste film recycling mechanism is arranged on the secondary peeling mechanism, and a dust box (29) is fixedly connected to the lower side of the frame (1) at the ending end of the conveyor belt (2); The initial separation mechanism includes an L-shaped bracket (34) fixedly connected to the frame (1). A plurality of small brackets (35) are fixedly connected to the lower part of the L-shaped bracket (34), and elastic drawstrings (36) are assembled on the small brackets (35); The secondary peeling mechanism includes an auxiliary bracket (24) fixedly connected to the frame (1). A hot melt film peeling cylinder (25) located above the conveyor belt (2) is rotatably connected to the conveyor belt (2). A driving mechanism (26) for driving the hot melt film peeling cylinder (25) to rotate is also fixedly connected to the auxiliary bracket (24); The waste film recycling mechanism includes a peeling line assembly and a waste film recycling box (27) fixedly connected to the auxiliary bracket (24). A guide plate (28) abutted against the hot melt film peeling cylinder (25) is fixedly connected to the waste film recycling box (27) in an inclined manner; The peeling line assembly includes two elastic frames fixedly connected to the auxiliary bracket (24), and the two elastic frames are respectively located on both sides of the hot melt film peeling cylinder (25). A separation steel wire (32) is fixedly connected between the two elastic frames, and the lower part of the separation steel wire (32) abuts against the upper part of the hot melt film peeling cylinder (25).

2. The high-efficiency film stripping device for wafers according to claim 1, wherein: The wafer fixing frame includes a plurality of mounting grooves (4) obliquely opened on a fixed seat (3), and the upper part of the mounting groove (4) is inclined toward the side closer to the starting end of the conveyor belt (2). The side of the mounting groove (4) closer to the ending end of the conveyor belt (2) is designed to be open; A plurality of clamping cavities (10) are formed inside the fixed seat (3), and the plurality of clamping cavities (10) are respectively adapted to the plurality of mounting grooves (4). Two symmetrically arranged clamping strips are rotatably connected to both sides of the mounting groove (4) inside the clamping cavity (10). A synchronous adjustment assembly is also arranged on the fixed seat (3).

3. The high-efficiency film stripping device for wafers according to claim 2, wherein: The clamping strip includes a hook-shaped clamping strip (11) and a driving plate (22). The hook-shaped clamping strip (11) and the driving plate (22) are fixedly connected obliquely. The hook-shaped clamping strip (11) is located inside the clamping cavity (10) and has a hook shape. The openings of the two hook-shaped clamping strips (11) face each other. The driving plate (22) extends outside the clamping cavity (10) and is connected to the synchronous adjustment assembly. A rotating rod (23) rotatably connected to the clamping cavity (10) is fixedly connected to the connection part of the hook-shaped clamping strip (11) and the driving plate (22).

4. The high-efficiency film stripping device for wafers according to claim 3, wherein: The synchronous adjustment component includes an adjustment self-locking component, a transmission plate (14), a plurality of conduction round rods (13) and a plurality of universal balls (12). The fixed seat (3) and the transmission plate (14) are connected by the adjustment self-locking component. The plurality of conduction round rods (13) are slidably connected to the lower side of the transmission plate (14). The universal balls (12) are rotatably connected to one end of the driving plate (22) away from the hook-shaped clamping strip (11). The conduction round rods (13) are inserted into the universal balls (12).

5. The high-efficiency film stripping device for wafers according to claim 2, wherein: A elastic bottom pad component is further provided on the fixed seat (3) and located at the lower part of the installation groove (4). The elastic bottom pad component includes an elastic cavity (7) opened on the fixed seat (3), and the upper part of the elastic cavity (7) is communicated with the lower part of the installation groove (4). A return spring (8) is installed inside the elastic cavity (7), and a support piece (9) is installed inside the elastic cavity (7) and located above the return spring (8).

6. The high-efficiency film stripping device for wafers according to claim 2, wherein: A quick feeding component is further provided on the fixed seat (3). The quick feeding component includes a guiding chute (18) opened on the fixed seat (3) along the long side direction of the fixed seat (3) and an auxiliary support plate (20) fixedly connected to one side of the fixed seat (3). A storage barrel (19) is slidably connected to the guiding chute (18). A tension mechanism (21) is fixedly connected to the auxiliary support plate (20), and the output end of the tension mechanism (21) is connected to the storage barrel (19).

7. An efficient film stripping process for wafers, characterized in that: Adopt a high-efficiency film stripping device for wafers as described in any one of claims 1-6. The process includes the following steps: S1: Sequentially place the combination of a plurality of wafer bodies (5) and film pieces (6) into the interior of the storage barrel (19). S2: Slide the storage barrel (19) along the long side direction of the fixed seat (3), and sequentially drop the plurality of combinations inside the storage barrel (19) into the plurality of installation grooves (4). S3: Drive the threaded rod (17) to rotate through the adjusting device (37), adjust the angle of the hook-shaped clamping strip (11), and clamp the wafer body (5). S4: Start the conveyor belt (2) to drive the combination of the wafer body (5) and the film piece (6) to move, and complete the initial separation of the combination of the wafer body (5) and the film piece (6) and the film stripping work on the wafer. S5: Start the driving mechanism (26) to drive the hot-melt film stripping cylinder (25) to rotate, separate the film piece (6) on the hot-melt film stripping cylinder (25) through the stripping line component, and let the stripped film piece (6) fall into the interior of the waste film recycling box (27) for storage. S6: Drive the threaded rod (17) to rotate again through the adjusting device (37), adjust the angle of the hook-shaped clamping strip (11), so that the hook-shaped clamping strip (11) no longer contacts the wafer body (5), and release the clamping and fixing of the hook-shaped clamping strip (11) on the wafer body (5). S7: Start the conveyor belt (2) to drive the wafer body (5) after film stripping to move. When the wafer body (5) moves to the end of the conveyor belt (2), the film piece (6) automatically falls into the interior of the ash box (29) for recycling.

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