Temperature sensor and method for manufacturing the same

Abstract

The present invention provides a thinner temperature sensor. The temperature sensor (1) comprises a first supporting film (30) made of an electrical insulating material, a second supporting film (50) stacked on the first supporting film (30) and made of an electrical insulating material, and a sensor element (10) disposed between the first supporting film (30) and the second supporting film (50). The sensor element (10) comprises a heat-sensitive body (11) whose electrical characteristics change according to temperature, and a first conductor pattern (12) and a second conductor pattern (16) electrically connected to the heat-sensitive body (11). The first supporting film (30) and the second supporting film (50) are arranged to face each other in a region where the heat-sensitive body (11) is disposed.

Description

Technical Field

[0001] The present invention relates to a temperature sensor, and in particular to a temperature sensor that can be made thinner. Background Art

[0002] Some temperature sensors use thermistors (short for thermally sensitive resistors) that have a property that their resistance changes according to temperature to detect temperature. The temperature sensor can be used to measure a variety of objects, and the temperature sensor is required to have resistance corresponding to the environment in which it is used. Resistance includes heat resistance, water resistance, chemical resistance, oil resistance, etc. In addition, depending on the relationship with the object to be measured, the temperature sensor also has requirements related to size and shape. Regarding size and shape, for example, a thin temperature sensor is required to be inserted into an extremely narrow space to measure the temperature of the object to be measured.

[0003] Conventionally, as thin temperature sensors, for example, Patent Document 1 and Patent Document 2 disclose such sensors.

[0004] The temperature sensor of Patent Document 1 comprises a sensor element, a lead wire connected to the sensor element, and a package covering a portion of the lead wire and the sensor element. The package comprises two layers of insulating films that are in close contact with each other, and the sensor element and a portion of the lead wire are sandwiched and covered between the two layers of insulating films.

[0005] In addition, the temperature sensor of Patent Document 2 is a temperature sensor in which the thermistor element, the lead wire, and the connection portion between the lead wire and the lead wire are covered by an inner layer and sandwiched between a pair of outer layers. Furthermore, the surface of the pair of outer layers includes a portion corresponding to the thermistor element, the lead wire, and the connection portion between the lead wire and the lead wire and is flat.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Laid-Open No. 8-128901

[0009] Patent Document 2: Japanese Patent No. 6606308 Summary of the invention

[0010] Problems to be solved by the invention

[0011] The temperature sensors disclosed in Patent Documents 1 and 2 achieve a certain level of thinness. For example, according to Patent Document 1, a temperature sensor with a thickness of less than 2 mm is achieved. However, depending on the object of temperature measurement, this level of thinness may not be sufficient. In addition, it is sometimes difficult to manufacture a thin temperature sensor.

[0012] In view of the above, an object of the present invention is to provide a temperature sensor that is easy to manufacture and thin.

[0013] Means for solving problems

[0014] The present invention includes a first supporting film made of an electrically insulating material, a second supporting film made of an electrically insulating material, and a sensor element provided between the first supporting film and the second supporting film.

[0015] The sensor element of the present invention includes a heat-sensitive body whose electrical characteristics change according to temperature, and a conductor pattern disposed on a first supporting film or a second supporting film and electrically connected to the heat-sensitive body.

[0016] The first supporting film and the second supporting film of the present invention are disposed so as to face each other in a region where the heat sensitive body is provided.

[0017] The conductor pattern of the present invention preferably includes a first conductor pattern and a second conductor pattern, and the first conductor pattern and the second conductor pattern are bonded to the first supporting film on the same plane facing the second supporting film.

[0018] In the present invention, it is preferable that the second supporting film has a third conductive pad on a surface facing the region where the heat sensitive body is provided. The first conductive pattern and the second conductive pattern are electrically connected via the third conductive pad electrically connected to the heat sensitive body.

[0019] In the present invention, preferably, the first supporting film includes a first conducting pad that supports the heat sensitive body and is electrically connected to the first conducting pattern, and a second conducting pad that is electrically connected to the second conducting pattern.

[0020] In the present invention, it is preferable that the first conductor pattern and the second conductor pattern be electrically connected by electrically connecting the third conductive pad to the first conductive pad and the second conductive pad.

[0021] In the present invention, it is preferable that the heat sensitive body includes a pair of electrodes, one of the pair of electrodes is disposed to face the first conductive pad, and the other of the pair of electrodes is disposed to face the third conductive pad.

[0022] In the present invention, it is preferred that the first conductive pad and the second conductive pad are arranged at intervals in the longitudinal direction (L) of the first supporting film, and the first conductive pad is arranged closer to an end in the longitudinal direction (L) than the second conductive pad.

[0023] In the present invention, it is preferable that the first conductive pad and the second conductive pad are arranged at the center of the first supporting film in the width direction (W).

[0024] In the present invention, the first supporting film and the second supporting film are preferably configured independently, or configured by folding an integrated supporting film at a predetermined position.

[0025] In the present invention, the electrical connection between one or both of the first and third via pads and the heat sensitive body is preferably performed via an electrical junction body using an anisotropic conductive paste or an anisotropic conductive film as a starting material.

[0026] In the present invention, the first supporting film and the second supporting film are preferably formed of a flexible printed circuit board, but the cover layer is omitted in the region where the second conductive pad is arranged.

[0027] The method for manufacturing a temperature sensor of the present invention comprises: a step (a) of laminating a first supporting film formed of an electrical insulating material and having a sensor element attached to one surface thereof and a second supporting film formed of an electrical insulating material in a state where one surface thereof faces the second supporting film; and

[0028] A step (b) of bonding the first supporting film and the second supporting film.

[0029] The sensor element of the present invention includes a heat sensitive body whose electrical characteristics change according to temperature, and a first conductor pattern and a second conductor pattern electrically connected to the heat sensitive body.

[0030] In the step (a) of the present invention, the second supporting film having a smaller plane area than the first supporting film is laminated so as to cover a part of the first supporting film including the region where the heat sensitive body is provided.

[0031] In the method for manufacturing a temperature sensor of the present invention, the second supporting film preferably has a third conductive pad on a surface facing the region where the heat sensitive body is provided. In step (a) of the present invention, the first conductor pattern and the second conductor pattern are electrically connected via the third conductive pad electrically connected to the heat sensitive body.

[0032] In the manufacturing method of the temperature sensor of the present invention, the first supporting film includes a first conductive pad that supports the heat-sensitive body and is electrically connected to the first conductive pattern, and a second conductive pad that is electrically connected to the second conductive pattern. Then, in the present invention, in step (a), the third conductive pad is electrically connected to the first conductive pad and the second conductive pad 15, thereby electrically connecting the first conductive pattern to the second conductive pattern.

[0033] Effects of the Invention

[0034] According to the temperature sensor of the present invention, the first supporting film made of an electrically insulating material, the second supporting film stacked on the first supporting film and made of an electrically insulating material, and the sensor element provided between the first supporting film and the second supporting film can be made thinner. In addition, the first supporting film and the second supporting film are arranged to face each other in the region where the heat-sensitive body is provided, and the second supporting film covers only a portion of the first supporting film, so that the second supporting film can be easily attached to the first supporting film. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 (a) is a plan view of the temperature sensor according to the first embodiment of the present invention, and (b) is a bottom view thereof.

[0036] Figure 2 (a) is Figure 1 (a) is a cross-sectional view taken along the IIa-IIa direction, and (b) is three views of the thermistor, namely a plan view (PV), a side view (SV), and a front view (FV).

[0037] Figure 3 (a) is Figure 1 The IIIa-IIIa cross-sectional view, (b) is Figure 1 Cross-sectional view as viewed along the line IIIb-IIIb.

[0038] Figure 4 It is a diagram showing the procedure of manufacturing the temperature sensor according to the first embodiment, and is a process of manufacturing the first supporting film.

[0039] Figure 5 It is a diagram showing the procedure of manufacturing the temperature sensor of the first embodiment and a process of manufacturing the second supporting film.

[0040] Figure 6 The diagram shows the procedure for manufacturing the temperature sensor according to the first embodiment, and is a diagram showing a step of bonding a first supporting film and a second supporting film.

[0041] Figure 7 1 and 2 are plan views of a temperature sensor according to a second embodiment of the present invention, wherein (a) shows a state in which a first supporting film and a second supporting film are unfolded, and (b) shows a state in which the second supporting film is bonded to the first supporting film.

[0042] Figure 8 It is a plan view of a temperature sensor according to a third embodiment of the present invention.

[0043] Fig. 9 A temperature sensor according to a fourth embodiment of the present invention is shown, wherein (a) is a plan view and (b) is a bottom view.

[0044] Fig.10 yes Fig. 9Cross-sectional view along line XX.

[0045] Fig.11 (a) is Fig. 9 The XIa-XIa line cross-sectional view, (b) is Fig. 9 Cross-sectional view along line XIb-XIb.

[0046] Fig.12 The procedure for manufacturing the temperature sensor according to the fourth embodiment is shown, and is performed in the order of (a), (b), and (c).

[0047] Fig.13 then Fig.12 The procedure for manufacturing the temperature sensor according to the fourth embodiment is shown, and is performed in the order of (a), (b), and (c).

[0048] Fig.14 is a temperature sensor representing a fifth embodiment of the present invention and Fig.10 The corresponding cross-sectional view.

[0049] Fig.15 (a) is related to Fig.10 (a) corresponds to the cross-sectional view, (b) is the cross-sectional view corresponding to Fig.10 (b) Corresponding cross-sectional view.

[0050] Fig.16 is with Fig.13 (c) The corresponding figure. DETAILED DESCRIPTION

[0051] Hereinafter, several embodiments of the present invention will be described with reference to the drawings.

[0052] [First embodiment: Figure 1 to Figure 6 〕

[0053] [Overall composition]

[0054] Reference Figure 1 to Figure 6 The temperature sensor 1 according to the first embodiment will be described.

[0055] like Figure 1 As shown in the figure, the temperature sensor 1 includes a sensor element 10, a first supporting film 30, and a second supporting film 50 laminated on the first supporting film 30 by bonding. In the following description, the following case is exemplified for explanation: the first supporting film 30 and the second supporting film 50 are both formed into a rectangular shape in a plan view, and the plane area of ​​the second supporting film 50 is set smaller than that of the first supporting film 30. Therefore, the second supporting film 50 covers only a part of the area including the front of the first supporting film 30 and where the heat-sensitive body 11 is provided.

[0056] In temperature sensor 1, if Figure 1As shown in the figure, the side of the sensor element 10 where the heat-sensitive body 11 is provided is defined as the front (F), and the side opposite to the front (F) is defined as the back (B). Depending on the situation, the front (F) is referred to as the front (F), the front end (F), etc. The same applies to the back (B).

[0057] Furthermore, in the temperature sensor 1, as Figure 1 The width direction (W) and the length direction (L) are defined as shown.

[0058] Furthermore, in the temperature sensor 1 , the side where the second supporting film 50 is provided is defined as the front side, and the opposite side is defined as the back side.

[0059] [Sensor element 10: Figure 1 to Figure 3 ]

[0060] As described below, a main portion of the sensor element 10 is provided between the first supporting film 30 and the second supporting film 50 .

[0061] like Figure 1 to Figure 3 As shown, the sensor element 10 includes a first conductive pad 14 made of copper foil, a heat-sensitive body 11 including a thermistor electrically connected to the first conductive pad 14 as a component, and a first conductor pattern 12 electrically connected to the heat-sensitive body 11. In addition, the sensor element 10 includes a second conductive pad 15 made of copper foil, and a second conductor pattern 16 electrically connected to the second conductive pad 15.

[0062] like Figure 1 As shown, the heat-sensitive body 11 and the first conductive pad 14 are arranged near the front end (F) of the temperature sensor 1 and in the center in the width direction (W). In addition, the second conductive pad 15 is arranged at a position closer to the rear end (B) than the heat-sensitive body 11 and in the center in the width direction (W). That is, the heat-sensitive body 11 (the first conductive pad 14) and the second conductive pad 15 are spaced apart in the length direction (L), and arranged in the order of the heat-sensitive body 11 and the second conductive pad 15 from the front end (F) side at a position that divides the temperature sensor 1 into two equal parts in the width direction (W). The arrangement of the heat-sensitive body 11 closer to the front end (F) than the second conductive pad 15 is one of the essential factors for the effect exerted by the temperature sensor 1.

[0063] like Figure 1 As shown in FIG. 1 , the first conductor pattern 12 is formed from the heat-sensitive body 11 (the first conductive pad 14) to one side in the width direction (W) (in Figure 1The first conductor pattern 12 is led out from the rear end (right side in (a)) and then extends straight toward the rear end (B), forming an L-shaped shape when viewed from above. The first terminal pad 13 is electrically connected to the rear end (B) side of the first conductor pattern 12. The width of the first terminal pad 13 is formed to be larger than the width of the first conductor pattern 12, and is connected to an external terminal or the like.

[0064] The second conductor pattern 16 is formed in a manner that extends from the second via pad 15 to the other side in the width direction (W) (in the Figure 1 The second conductor pattern 16 is led out from the rear end (B) and then extends straightly toward the rear end (B), forming an L-shaped shape when viewed from above. The rear end (B) side of the second conductor pattern 16 is electrically connected to the second terminal pad 17. The width of the second terminal pad 17 is greater than the width of the second conductor pattern 16, and is connected to an external terminal or the like.

[0065] As an example, the first conductor pattern 12 and the second conductor pattern 16 have the same width and are arranged parallel to each other. The first conductor pattern 12 and the second conductor pattern 16 are made of a foil made of a conductive material such as a copper alloy formed as the first supporting film 30. The first supporting film 30 and the second supporting film 50 are formed of a so-called single-sided FPC (Flexible Printed Circuits), and the first conductor pattern 12, the first terminal pad 13, the second conductor pattern 16, and the second terminal pad 17 correspond to the circuit portion of the FPC.

[0066] The first conductor pattern 12 and the second conductor pattern 16 are buried inside the first supporting film 30 in the thickness direction and are not exposed to the outside. However, the first terminal pad 13 and the second terminal pad 17 connected to the first conductor pattern 12 and the second conductor pattern 16 are opened to the front side through the connection windows 47 and 48 provided near the rear end (B) of the first supporting film 30.

[0067] The sensor element 10 includes a 3A conductive pad 18, a 3B conductive pad 19, and a 3C conductive pad 21 that electrically connect the heat-sensitive body 11 (first conductive pad 14) and the second conductive pad 15. The 3A conductive pad 18 is provided at a position corresponding to the heat-sensitive body 11 and the first conductive pad 14. The heat-sensitive body 11 is sandwiched between the second conductor pattern 16 and the 3A conductive pad 18, and the second conductor pattern 16 and the 3A conductive pad 18 are electrically connected. In addition, the 3B conductive pad 19 is provided at a position corresponding to the second conductive pad 15, and the second conductive pad 15 and the third conductive pad 19 are electrically connected. The 3A conductive pad 18 and the 3B conductive pad 19 are electrically connected through the 3C conductive pad 21. The 3A conductive pad 18 , the 3B conductive pad 19 , and the 3C conductive pad 21 are integrally formed and bonded to the second supporting film 50 .

[0068] like Figure 2 As shown in (b), the heat-sensitive body 11 includes a thermistor 11A, a first electrode 11B provided on one surface side of the thermistor 11A, and a second electrode 11C provided on the other surface side of the thermistor 11A. As an example, the heat-sensitive body 11 is arranged so that the first electrode 11B faces the first conductive pad 14, and the second electrode 11C faces the 3A conductive pad 18. That is, the heat-sensitive body 11 is arranged with the first electrode 11B and the second electrode 11C along the front and back sides of the temperature sensor 1. Regardless of the arrangement of the heat-sensitive body 11, the first conductor pattern 12 and the second conductor pattern 16 of the temperature sensor 1 are formed on the same plane.

[0069] The thermistor 11A has a characteristic that the resistance changes greatly with temperature changes. Thermistors include: NTC (Negative Temperature Coefficient) thermistors whose resistance value decreases when the temperature rises; and PTC (Positive Temperature Coefficient) thermistors whose resistance value is constant up to a certain temperature and whose resistance value increases sharply at a certain temperature. The thermistor 11A of this embodiment can also be applied to any thermistor of NTC and PTC.

[0070] The first electrode 11B and the second electrode 11C are made of gold, silver, copper, platinum, or the like, and are formed on both the front and back surfaces of the thermistor 11A by vapor deposition or the like.

[0071] The thermistor 11A of this embodiment has dimensions in the width direction (W), length direction (L), and thickness direction, for example, in the range of 0.05 to 0.1 mm. The heat-sensitive body 11 is not provided with a protective layer such as glass that covers the thermistor 11A, the first electrode 11B, and the second electrode 11C from the periphery. As a result, the size of the heat-sensitive body 11 is reduced.

[0072] [The first supporting film 30: Figure 2 , Figure 3 ]

[0073] Next, the first supporting film 30 provided on the back side of the temperature sensor 1 will be described. The first supporting film 30 is an element for supporting the sensor element 10, and is composed of an FPC as an example. Figure 2 (a) and Figure 3As shown in (a) and (b) of FIG. 1 , the FPC includes a substrate 31, a cover 33 disposed opposite to the substrate 31, and a conductive pattern 35 disposed on the surface of the substrate 31 and being a portion where the cover 33 is cut away. The first conductor pattern 12, the first terminal pad 13, the first conductive pad 14, the second conductive pad 15, the second conductor pattern 16, and the second terminal pad 17, which are components of the sensor element 10, are constituted by the conductive pattern 35. That is, the first conductor pattern 12 and the second conductor pattern 16 are disposed on the same plane on the front side of the substrate 31. Figure 2 (a) and Figure 3 The shapes and thicknesses of the cover 33, the cover 33 and the conductive pattern 35 in (a), (b), etc. do not reflect the entity. In addition, in the present embodiment, the so-called film refers to a component that is thin enough relative to the area. In the FPC, the base 31 and the conductive pattern 35 are, for example, less than 50 μm, preferably 30 μm, and more preferably less than 20 μm. In addition, the film in the present embodiment has no direct relationship with its rigidity. That is, when it becomes a cantilever structure, it includes the degree of bending from the supporting part due to the inability to maintain the flat original shape due to its own weight, to the degree of being able to maintain a flat state.

[0074] The base 31 and the cover 33 are made of an electrically insulating material, for example, polyimide, and the conductive pattern 35 is made of copper foil. The manufacturing process of the FPC is well known, so the description is omitted. In addition, a bonding layer based on an adhesive is formed between the base 31 and the conductive pattern 35 and between the cover 33 and the conductive pattern 35, but in Figure 2 (a) and Figure 3 The description is omitted in (a) and (b).

[0075] [Second supporting film 50: Figure 2 , Figure 3 ]

[0076] Next, the second supporting film 50 provided on the front side of the temperature sensor 1 will be described.

[0077] The second supporting film 50 is a component for electrically connecting the heat sensitive body 11 and the second conductive pad 15 .

[0078] As an example, the second supporting film 50 is also made of FPC like the first supporting film 30. Figure 2 (a) and Figure 3 As shown in (a) and (b) of FIG. 5 , the second supporting film 50 includes a base 51, a cover 53 disposed opposite to the base 51, and a conductive pattern 55. The conductive pattern 55 in the second supporting film 50 is electrically connected to the heat-sensitive body 11 and to the second conductive pad 15. The conductive pattern 55 is disposed across the base 51 and the cover 53.

[0079] The 3A conductive pad 18, 3B conductive pad 19, and 3C conductive pad 21, which are components of the sensor element 10, are formed by the conductive pattern 55. Thus, the 3A conductive pad 18, 3B conductive pad 19, and 3C conductive pad 21 are attached to the second supporting film 50 on the same plane facing the first supporting film 30.

[0080] The first supporting film 30 and the second supporting film 50 are bonded together by a double-sided tape 54 as an example.

[0081] [Electrical connection relationship: Figure 2 , Figure 3 ]

[0082] like Figure 2 (a) and Figure 3 As shown in (a), a conductive bonding body 37 is provided between the heat-sensitive body 11 and the first conductive pad 14, and a conductive bonding body 57 is provided between the heat-sensitive body 11 and the conductive pattern 55. Figure 2 (a) and Figure 3 As shown in (b), the conductive bonding body 39 and the conductive bonding body 59 are provided between the second conductive pad 15 and the conductive pattern 55. In this way, the sensor element 10 forms a circuit through the first conductor pattern 12, the heat-sensitive body 11, and the second conductor pattern 16. That is, the sensor element 10 is electrically connected in the order of the first conductor pattern 12, the 3B conductive pad 19, the 3C conductive pad 21, the 3A conductive pad 18, the heat-sensitive body 11, the first conductive pad 14, the second conductive pad 15, and the second conductor pattern 16. Even if the first electrode 11B and the second electrode 11C of the heat-sensitive body 11 are arranged along the front and back sides of the temperature sensor 1, this circuit is required in order to form the first conductor pattern 12 and the second conductor pattern 16 of the temperature sensor 1 on the same plane.

[0083] The materials used for the joint bodies 57, 59, etc. are arbitrary, for example, a conductive adhesive is selected. The following materials are widely used for conductive adhesives: conductive fillers are dispersed in adhesive resins such as epoxy resins and polyurethanes, and these fillers form conductive paths after bonding, thereby achieving conductive bonding. As conductive fillers, in addition to metal powders such as copper, nickel, and silver, carbon-based materials such as graphite and CNT (carbon nanotubes) can also be used. In addition, solder with conductivity and bonding functions can also be used, and anisotropic conductive pastes, anisotropic conductive films, etc. can also be used as described later. In addition, these materials can also be used in combination.

[0084] [Method for manufacturing temperature sensor 1 Figures 4 to 6 ]

[0085] Next, refer to Figures 4 to 6The procedure for manufacturing the temperature sensor 1 will be described.

[0086] First, refer to Figure 4 The first supporting film 30 will be described.

[0087] like Figure 4 As shown in (a) of FIG. 1 , a first FPC 41 as a starting material of the first supporting film 30 is prepared. The first FPC 41 has already formed therein housing holes 43 and 45 for the heat-sensitive body 11 and the bonding bodies 37 and 39. The housing holes 43 and 45 are formed by etching the cover 33. The first conductive pad 14 and the second conductive pad 15 are formed in the housing holes 43 and 45, respectively. In addition, in the first FPC 41, for the same components as those of the first supporting film 30, the same reference numerals as those of the first supporting film 30 are given and their descriptions are omitted.

[0088] like Figure 4 As shown in (b) of FIG. 1 , the bonding bodies 37 and 39 are applied to the receiving holes 43 and 45 provided in the first FPC 41. The bonding bodies 37 and 39 are electrically connected to the surfaces of the first and second via pads 14 and 15 in the receiving holes 43 and 45, respectively.

[0089] Then, if Figure 4 As shown in FIG. 5( c ), the heat-sensitive body 11 is placed on the top of the bonding body 37 disposed in the receiving hole 43 . One of the first electrode 11B and the second electrode 11C (not shown) of the heat-sensitive body 11 is in contact with the bonding body 37 .

[0090] At this point, the first FPC 41 is provided so as to be bonded to the FPC 61 which is the starting material of the second supporting film 50 .

[0091] Next, refer to Figure 5 The second supporting film 50 will be described.

[0092] like Figure 5 As shown in (a) of FIG. 1 , the second FPC 61, which is the starting material of the second supporting film 50, is prepared. The second FPC 61 has already formed therein receiving holes 63 and 65 for arranging the bonding bodies 57 and 59. As an example, the receiving holes 63 and 65 are formed by laser processing the cover 53. In addition, in the second FPC 61, the same components as those of the second supporting film 50 are given the same reference numerals as those of the second supporting film 50, and their descriptions are omitted.

[0093] like Figure 5 As shown in FIG. 2( b ), the bonding bodies 57 and 59 are applied to the receiving holes 63 and 65 provided in the second FPC 61 , respectively. The bonding bodies 57 and 59 are electrically connected to the surface of the third B-type conductive pad 19 in the receiving holes 63 and 65 .

[0094] At this point, the second FPC 61 is provided so as to be bonded to the first FPC 41 .

[0095] Next, if Figure 6 As shown in (a) of FIG. 1 , the first FPC 41 and the second FPC 61 are aligned. This alignment means that the bonded bodies 37 and 39 of the first FPC 41 and the bonded bodies 57 and 59 of the second FPC 61 are placed at the same position in the horizontal direction H.

[0096] After the first FPC 41 and the second FPC 61 are aligned, the first FPC 41 and the second FPC 61 are overlapped. Figure 6 As shown in (b), the bonding body 59 is in contact with the heat-sensitive body 11. In the overlapping state, the cover 33 of the first FPC 41 and the cover 53 of the second FPC 61 are bonded. This bonding is selected from a method such as heat pressing and double-sided tape while applying heat and pressure.

[0097] Through the above-mentioned procedures, the temperature sensor 1 can be obtained.

[0098] [Effects of the First Embodiment]

[0099] Next, the effects exerted by the temperature sensor 1 will be described.

[0100] [1st effect: Thinning]

[0101] The temperature sensor 1 has no protective layer such as glass on the heat-sensitive body 11 and utilizes FPC technology to achieve a thinner overall thickness including the first supporting film 30 and the second supporting film 50 of 0.5 mm or less, preferably 0.3 mm or less.

[0102] [Second effect: Fitting range]

[0103] Next, the temperature sensor 1 is formed by laminating the first supporting film 30 and the second supporting film 50 , but the second supporting film 50 covers the first supporting film 30 only in a portion of the first supporting film 30 , particularly in a region that electrically connects the heat sensitive body 11 to both the first conductive pattern 12 and the second conductive pattern 16 .

[0104] Here, when two films are bonded together, the larger the area of ​​the film, the more difficult it is to bond together, and the greater the possibility of causing a problem such as wrinkles. In addition, the larger the area of ​​the film, the higher the material cost.

[0105] In contrast to the above, in the temperature sensor 1 , since the surface area of ​​the second supporting film 50 is small, the work of bonding with the first supporting film 30 becomes easy and the material cost can be suppressed.

[0106] [Third Effect: Position of Heat-Sensing Body 11]

[0107] In the temperature sensor 1, the heat-sensitive body 11 is provided at a position closer to the front end (F) than the second conductive pad 15. In this way, if the heat-sensitive body 11 is close to the front end (F), when the object to be measured of temperature is located in the inner side of a relatively narrow space, the heat-sensitive body 11 can be brought close to the object to be measured by inserting the temperature sensor 1 into the space from the front end (F). Thus, the temperature sensor 1 can measure the temperature of the object to be measured with high accuracy.

[0108] In addition, the temperature sensor 1 has a heat-sensitive body 11 disposed at the center in the width direction (W). Therefore, if the heat-sensitive body 11 is aligned with the center of the heat source of the measurement object, the heat from the heat source can be efficiently absorbed. Therefore, the temperature sensor 1 can measure the temperature of the measurement object with high accuracy.

[0109] However, the temperature sensor of the present invention is not limited to arranging the heat-sensitive body 11 at these positions, and the heat-sensitive body 11 can also be arranged at other positions. For example, based on the position of the measurement object, the positions of the first conductive pad 14 and the second conductive pad 15 to which the heat-sensitive body 11 is electrically connected can be reversed in the length direction L, and the position of the heat-sensitive body 11 can also be displaced from the center in the width direction (W).

[0110] [Fourth Effect: Positional Relationship Between the First Conductor Pattern 12 and the Second Conductor Pattern 16]

[0111] Next, the temperature sensor 1 is formed by forming the first conductor pattern 12 and the second conductor pattern 16 between the base 31 of the first support film 30 and the cover 33. That is, the first conductor pattern 12 and the second conductor pattern 16 are arranged on the same plane. Thus, the connection operation of the wire from one side of the temperature sensor 1 to the first terminal pad 13 and the second terminal pad 17 can be performed.

[0112] In this way, the above-mentioned electrical connection relationship is adopted in order to provide the first conductor pattern 12 and the second conductor pattern 16 on the same plane.

[0113] [Second embodiment] Figure 7 〕

[0114] Next, refer to Figure 7 The temperature sensor 2 according to the second embodiment will be described.

[0115] The temperature sensor 2 has the same structure as the temperature sensor 1, but the manufacturing method is different. Figure 7 As shown in (a) of FIG. 2 , the temperature sensor 2 includes a supporting film 2Pr in which a first supporting film 30 and a second supporting film 50 are integrally connected. In the supporting film 2Pr, the second supporting film 50 is bent relative to the first supporting film 30, as shown in FIG. Figure 7 As shown in (b) of FIG. 1 , the second supporting film 50 is overlapped with the first supporting film 30. Then, the second supporting film 50 and the first supporting film 30 are bonded together by any method such as the above-mentioned heat pressing. Thus, a temperature sensor 2 having the same structure as the temperature sensor 1 can be obtained.

[0116] [Effects of the Second Embodiment]

[0117] The temperature sensor 2 exerts the first to fourth effects described above. In addition, the temperature sensor 2 is that the first supporting film 30 and the second supporting film 50 only need to be prepared with one sheet of raw material, such as FPC. This contributes to cost reduction compared to the first embodiment in which the first supporting film 30 and the second supporting film 50 are prepared separately.

[0118] [Third embodiment: Figure 8 〕

[0119] Next, refer to Figure 8 The temperature sensor 3 according to the third embodiment will be described.

[0120] like Figure 8 As shown, in the temperature sensor 3, the first conductive pad 14 and the second conductive pad 15 are arranged side by side in the width direction (W). In addition, in the temperature sensor 3, the sensor elements 10 are arranged line-symmetrically with respect to the center in the width direction (W).

[0121] The temperature sensor 3 exhibits the above-mentioned first effect, second effect, and fourth effect. Furthermore, according to the temperature sensor 3, since the sensor elements 10 are symmetrically arranged, the temperature sensor 3 is easier to manufacture than the asymmetrical temperature sensor 1.

[0122] [Fourth embodiment: Figures 9 to 12 〕

[0123] Next, refer to Figures 9 to 12 The temperature sensor 4 of the fourth embodiment is described. The temperature sensor 4 uses ACP (Anisotropic Conductive Paste) to electrically connect the first support film 130 and the second support film 150. In addition, the temperature sensor 4 omits the first embodiment in the area (second area A2) that is responsible for the electrical connection not via the heat-sensitive body 11. Figure 2 The covers 33, 53 are shown as corresponding parts.

[0124] like Fig. 9As shown in FIG. 1 , the structure of the temperature sensor 4 when viewed from above and from below is similar to that of the temperature sensor 1. However, in the temperature sensor 4, the specific structure of the first supporting film 130 and the second supporting film 150 is different from that of the first supporting film 30 and the second supporting film 50 of the temperature sensor 1. In particular, the first supporting film 130 is divided into a first area A1 having a cover 137 and a cover 157, and a second area A2 not having a cover 137 and a cover 157. The first area A1 sandwiches the second area A2 and includes a portion related to the support of the sensor element 10 and a portion not related thereto. Fig.10 The first supporting film 130 and the second supporting film 150 will be described.

[0125] [First supporting film 130 (supporting portion of the sensor element 10): Fig.10 , Fig.11 (a)]

[0126] The first supporting film 130 is an element for supporting the sensor element 10 and is composed of FPC as an example. Fig.10 as well as Fig.11 As shown in (a) of FIG. 1 , the FPC includes a base 131 and a first conductive pad 133A made of copper foil stacked on the base 131. The first supporting film 130 is made of FPC, and a cover 137 is stacked on the surface of the first conductive pad 133A via an adhesive layer 135. The material, thickness and other dimensions of the base 131, the first conductive pad 133A and the cover 137 can be determined according to the temperature sensor 1.

[0127] like Fig.10 as well as Fig.11 As shown in (a), the first supporting film 130 includes a first region A1 of the heat-sensitive body 11 interrupted by an adhesive layer 135 and a cover 137. In the first region A1, a bonded body 134 using ACP as a starting material is provided on the surface of the first conductive pad 133A. The heat-sensitive body 11 is bonded to the surface of the bonded body 134.

[0128] In the first area A1 and the second area A2 , the first supporting film 130 and the second supporting film 150 are attached to each other by a double-sided tape 140 .

[0129] [First supporting film 130 (second area A2): Fig.10 , Fig.11 (b)]

[0130] Next, in the second region A2, the first supporting film 130 includes the base 131 and the second via pads 133B made of copper foil stacked on the base 131. In the second region A2, the adhesive layer 135 and the cover 137 provided in the first region A1 are omitted.

[0131] In the second region A2, a junction body 145 is formed on the surface of the second conductive pad 133B, which is responsible for electrical connection with the second supporting film 150 and uses ACP as a starting material.

[0132] [Second supporting film 150 (supporting portion of the sensor element 10): Fig.10 , Fig.11 (a)]

[0133] In the first area A1, the second supporting film 150 also includes FPC like the first supporting film 130, and Fig.10 as well as Fig.11 As shown in (a) of FIG. 1 , the FPC includes a base 151 and a third conductive pad 153 made of copper foil stacked on the base 151. The second supporting film 150 is formed by stacking a cover 157 on the surface of the third conductive pad 153 via an adhesive layer 155, and constitutes the above-mentioned FPC. The material, thickness and other dimensions of the base 151, the third conductive pad 153 and the cover 157 can be determined according to the temperature sensor 1.

[0134] like Fig.10 as well as Fig.11 As shown in (a), the second supporting film 150 also has a first region A1 of the heat-sensitive body 11 interrupted by the adhesive layer 155 and the cover 157. In the first region A1, a bonded body 154 using ACP as a starting material is provided on the surface of the third conductive pad 153. The heat-sensitive body 11 is arranged between the bonded body 154 and the bonded body 134 of the first supporting film 130.

[0135] [Second supporting film 150 (second area A2): Fig.10 as well as Fig.11 (b)]

[0136] Next, in the second region A2, the second supporting film 150 includes a base 151 and a third via pad 153 made of copper foil stacked on the base 151. In the second region A2, the adhesive layer 155 and the cover 157 provided in the first region A1 are omitted.

[0137] In the second region A2, a junction body 145 is formed between the third conductive pad 153 and the second conductive pad 133B, which serves as an electrical connection with the first supporting film 130 and uses ACP as a starting material.

[0138] [Electrical connection relationship: Figures 9 to 11 ]

[0139] like Fig. 9 , Fig.10 as well as Fig.11As shown in the figure, the heat-sensitive body 11 is arranged between the first conductive pad 133A and the third conductive pad 153, and is electrically connected to both. The third conductive pad 153 is electrically connected to the second conductive pad 133B via the joint body 145. The first conductive pad 133A is electrically connected to the first conductor pattern 12, and the second conductive pad 133B is electrically connected to the second conductor pattern 16. In this way, in the temperature sensor 4, the sensor element 10 forms a circuit through the first conductor pattern 12, the heat-sensitive body 11, and the second conductor pattern 16. That is, the sensor element 10 is electrically connected in the order of the first conductor pattern 12, the first conductive pad 133A, the joint body 134, the heat-sensitive body 11, the joint body 154, the third conductive pad 153, the joint body 145, the conductive pattern 145, and the second conductor pattern 16.

[0140] [Manufacturing method of temperature sensor 4: Figure 12 to Figure 14 ]

[0141] Next, refer to Figure 12 to Figure 14 The procedure for manufacturing the temperature sensor 4 will be described.

[0142] First, refer to Fig.12 The first supporting film 130 will be described.

[0143] like Fig.12 As shown in (a), the first FPC 141, which is the starting material of the first supporting film 130, is prepared. The first conductor pattern 12, the first terminal pad 13, the second conductor pattern 16, the second terminal pad 17, the first conductive pads 133A and 133B are already formed on the first FPC 141. In addition, the first FPC 141 is divided into a first area A1 and a second area A2. In addition, in the first FPC 141, for the same components as the first supporting film 130, the same symbols as the first supporting film 130 are given and their descriptions are omitted.

[0144] like Fig.12 As shown in (b) of FIG. 1 , an anisotropic conductive paste ACP1 (hereinafter, simply referred to as ACP1 ) which is a starting material of the bonded body 134 is applied to a predetermined position of the first via pad 133A provided on the first FPC 141 .

[0145] Then, if Fig.12 As shown in (c), a heat-sensitive body 11 is arranged on the surface of ACP1, and then a curing process of ACP1 is performed.

[0146] Next, if Fig.13 As shown in (a) of FIG. 1 , an anisotropic conductive paste ACP2 (hereinafter, simply referred to as ACP2), which is a starting material of the junction body 154, is applied to a predetermined position of the second via pad 133B.

[0147] After the ACP2 is applied, the second FPC161, which is the starting material of the second supporting film 150 prepared separately, is applied to the substrate. Fig.13 After being aligned as shown in (b), it is bonded to the first FPC 141 and then heat-pressed to obtain the temperature sensor 4.

[0148] Here, Fig.13 (c) shows the second FPC 161 which is the starting material of the second supporting film 150 . Fig.13 (c) shows the side of the surface to be bonded to the second supporting film 150 .

[0149] like Fig.13 As shown in (c), a third conductive pad 153 is formed on the second FPC 161, but a starting material ACP3 of the bonding body 154 is applied at a position corresponding to the heat-sensitive body 11, and a starting material ACP4 of the bonding body 145 is applied at a position corresponding to the bonding body 145.

[0150] [Effect of temperature sensor 4]

[0151] The temperature sensor 4 exerts the above-mentioned first to fourth effects, and also exerts the following effects.

[0152] The temperature sensor 4 is not provided with the covers 137 and 157 in the second area A2. When the covers 137 and 157 are provided around the second area A2, the covers 137 and 157 rebound to return to their original thickness after the heat and pressure bonding, and the bonding interface of the bonded body 145 using ACP as the starting material may be peeled off. Therefore, according to the temperature sensor 4, the conduction of the bonded body 145 using ACP as the starting material can be ensured.

[0153] In this embodiment, the case where ACP is used for both the bonded bodies 134 and 135 for electrically connecting the first supporting film 130 and the second supporting film 150 is described as an example, but ordinary solder may be used for either one as long as electrical connection can be made.

[0154] [Fifth embodiment]

[0155] Next, refer to Figure 14 to Figure 16 The temperature sensor 5 of the fifth embodiment is described. The temperature sensor 5 uses an ACF (Anisotropic Conductive Film) instead of the ACP used in the temperature sensor 4 of the fourth embodiment for the electrical connection between the first supporting film 130 and the second supporting film 150. Therefore, the temperature sensor 5 will be described below with this difference as the center. Figure 14 to Figure 16 In the example, the same elements as those of the temperature sensor 4 are assigned Figures 9 to 13 The same symbols are used and their descriptions are omitted.

[0156] [Configuration of Temperature Sensor 5]

[0157] like Fig.14 as well as Fig.15 As shown in (a) of FIG. 5 , the temperature sensor 5 is provided with a bonded body 156 using ACP as a starting material between the cover 137 and the cover 157 in the first region A1. The bonded body 156 has conductivity and is therefore electrically bonded to the heat-sensitive body 11. Fig.14 as well as Fig.15 As shown in FIG. 2( b ), the bonding body 156 is extended to the second region A2 and is electrically bonded to the second conductive pad 133B and the third conductive pad 153 .

[0158] Thus, in the temperature sensor 5, similarly to the temperature sensor 4, the sensor element 10 forms a circuit through the first conductor pattern 12, the heat-sensitive body 11, and the second conductor pattern 16. That is, the sensor element 10 is electrically connected in the order of the first conductor pattern 12, the first conductive pad 133A, the junction body 134, the heat-sensitive body 11, the junction body 154, the third conductive pad 153, the junction body 145, the second conductive pad 133B, and the second conductor pattern 16.

[0159] The basic manufacturing method of the temperature sensor 5 is the same as that of the temperature sensor 4, but Fig.16 As shown in (b), the anisotropic conductive film ACF is attached to the second FPC 161, and the second FPC 161 is overlapped with the first FPC 141 and thermocompression-bonded, thereby obtaining the temperature sensor 5 including the first supporting film 130 and the second supporting film 150.

[0160] [Effect of temperature sensor 5]

[0161] The temperature sensor 5 exhibits the same effects as the temperature sensor 4 and also exhibits the following effects.

[0162] In the temperature sensor 5 , the anisotropic conductive film ACF has a function of a double-sided tape, and therefore the first supporting film 130 and the second supporting film 150 can be bonded together without providing the double-sided tape required for the temperature sensor 4 .

[0163] In this embodiment, the case where ACF is used to electrically connect the first supporting film 130 and the second supporting film 150 is described as an example, but a normal solder may be used for either one, or one may be ACF and the other may be ACP.

[0164] The temperature sensor according to the preferred embodiment of the present invention has been described above. However, other than the above, the configurations listed in the above embodiment may be selected or replaced, or may be appropriately changed to other configurations without departing from the gist of the present invention.

[0165] For example, the shape and size of the temperature sensors 1 to 3 are merely an example of the present invention. Compared with the temperature sensors 1 to 3, the size in the length direction (L) can be lengthened or shortened, and the size in the width direction (W) can be lengthened or shortened. The same is true for the first conductive pad 14, the second conductive pad 15, etc. For example, the planar shape of these pads can be made into a shape other than a rectangle, such as a circle. In addition, the planar shape of the first supporting film 130 and the second supporting film 150 is not limited to a rectangle. For example, one end in the length direction (L) can be protruded or recessed in an arc shape. The planar shape of the first supporting film 130 and the second supporting film 150 is any shape such as a trapezoid or a triangle.

[0166] In the manufacturing procedure of the temperature sensor 1 , the heat sensitive body 11 may be disposed on the second starting material 61 side of the second supporting film 150 and then laminated and bonded to the first starting material 41 of the first supporting film 130 .

[0167] In the above embodiment, the first conductor pattern 12 and the second conductor pattern 16 are provided on the first supporting film 130 having a larger dimension in the longitudinal direction (L), but the present invention is not limited thereto. The first conductor pattern 12 and the second conductor pattern 16 may be provided on the second supporting film 150 having a smaller dimension in the longitudinal direction (L).

[0168] Explanation of symbols

[0169] 1, 2, 3, 4, 5 Temperature sensor

[0170] 10 Sensor element

[0171] 11. Heat-sensitive body

[0172] 12 1st conductor pattern

[0173] 13 1st terminal pad

[0174] 14 1st conductive pad

[0175] 15 Second conductive pad

[0176] 16 2nd conductor pattern

[0177] 17 2nd terminal pad

[0178] 18 3A conductive pad

[0179] 19 3B conductive pad

[0180] 21 3C conductive pad

[0181] 30, 130 1st supporting film

[0182] 47, 48 connecting window

[0183] 50, 130 Second supporting film

Claims

1. A temperature sensor, characterized in that: have: A first supporting film made of an electrically insulating material; a second supporting film made of an electrically insulating material; and a sensor element disposed between the first supporting film and the second supporting film, The sensor element includes a heat-sensitive body whose electrical characteristics change according to temperature, and a conductor pattern disposed on the first supporting film or the second supporting film and electrically connected to the heat-sensitive body. The first supporting film and the second supporting film are disposed so as to face each other in a region where the heat-sensitive body is provided. The conductor pattern includes a first conductor pattern and a second conductor pattern. The first conductor pattern and the second conductor pattern are attached to the first supporting film on the same plane facing the second supporting film. The second supporting film includes a third conductive pad on a surface facing the region where the heat sensitive body is provided. The first conductor pattern and the second conductor pattern are electrically connected via the third conductive pad electrically connected to the heat-sensitive body. The first supporting film comprises: a first conductive pad supporting the heat-sensitive body and electrically connected to the first conductive line pattern; and The second conductive pad is electrically connected to the second conductive line pattern.

2. The temperature sensor according to claim 1, wherein: The heat-sensitive body has a pair of electrodes. One of the pair of electrodes is arranged to face the first conductive pad, and the other of the pair of electrodes is arranged to face the third conductive pad.

3. The temperature sensor according to claim 2, wherein: The first conductive pad and the second conductive pad are arranged at a distance in the longitudinal direction of the first supporting film, and the first conductive pad is arranged closer to an end in the longitudinal direction than the second conductive pad.

4. The temperature sensor according to claim 3, wherein: The first conductive pad and the second conductive pad are arranged at the center of the first supporting film in the width direction (W).

5. The temperature sensor according to any one of claims 1 to 4, wherein: The first supporting film and the second supporting film are configured as separate bodies.

6. The temperature sensor according to any one of claims 1 to 4, wherein: The first supporting film and the second supporting film are formed by folding an integral supporting film at a predetermined position.

7. The temperature sensor according to any one of claims 1 to 4, wherein: The electrical connection between one or both of the first and third via pads and the heat-sensitive body is performed via an electrical junction body using an anisotropic conductive paste or an anisotropic conductive film as a starting material.

8. The temperature sensor according to any one of claims 1 to 4, wherein: The first supporting film and the second supporting film are formed of a flexible printed circuit board. The cover layer is omitted in the region where the second conductive pad is arranged.

9. A method for manufacturing a temperature sensor, characterized in that: have: A step (a) of laminating a first support film formed of an electrical insulating material and having a sensor element attached to one surface thereof and a second support film formed of an electrical insulating material in a state where the one surface thereof faces the second support film; and a step (b) of bonding the first supporting film and the second supporting film, The sensor element includes a heat-sensitive body whose electrical characteristics change according to temperature, and a first conductor pattern and a second conductor pattern electrically connected to the heat-sensitive body. In the step (a), the second supporting film having a smaller plane area than the first supporting film is laminated so as to cover a portion of the first supporting film including a region where the heat sensitive body is provided. The second supporting film includes a third conductive pad on a surface facing the region where the heat sensitive body is provided. In the step (a), the first conductive line pattern and the second conductive line pattern are electrically connected via the third conductive pad electrically connected to the heat sensitive body.

10. The method for manufacturing a temperature sensor according to claim 9, wherein: The first supporting film comprises: a first conductive pad supporting the heat-sensitive body and electrically connected to the first conductive pattern; and a second conductive pad electrically connected to the second conductor pattern, In the step (a), the third conductive pad is electrically connected to the first conductive pad and the second conductive pad, thereby electrically connecting the first conductive pattern to the second conductive pattern.

Images