Double-sided heat source heat dissipation device

Abstract

The application discloses a double-sided heat source heat dissipation device, which comprises a lower shell adjacent to a first heat source and an upper shell adjacent to a second heat source; a first capillary structure of the lower shell is opposite to a fifth capillary structure of the upper shell and covers a region of the first heat source; a sixth capillary structure of the upper shell is opposite to a second capillary structure of the lower shell and covers a region of the second heat source; and a fourth capillary structure is arranged along the length direction of a third capillary structure and passes through the corresponding regions of the first heat source and the second heat source. The application improves the heat dissipation performance of the heat dissipation device by arranging multiple capillary structures with different specifications in stages, and solves the heat dissipation problem of the heat dissipation device with heat sources on both upper and lower surfaces, i.e. double-sided heat sources.

Description

Technical Field

[0001] The invention relates to a heat dissipation device, in particular to a double-sided heat source heat dissipation device. Background Art

[0002] During the operation of electronic products, the heat generated by the processor needs to be quickly discharged to keep the operating temperature within the normal range. Commonly used heat dissipation devices, such as heat spreaders, are usually vacuum-sealed cavity structures surrounded by upper and lower shells. The inner surface of the cavity is provided with a capillary structure, and the interior of the cavity is filled with liquid working medium. During operation, the lower shell absorbs the heat emitted by the heat source, causing the liquid working medium in the heat spreader near the heat source to evaporate into a gaseous state. The gaseous working medium contacts the colder upper shell and condenses into a liquid state, releasing heat. The condensed liquid working medium flows back to the lower shell under the action of the capillary structure, and this cycle repeats. By utilizing the principle that the liquid working medium absorbs heat when evaporating at high temperature and releases heat when liquefying at low temperature, the heat spreader exhibits the characteristics of rapid temperature uniformity, thereby achieving the purpose of heat transfer and heat dissipation.

[0003] With the upgrading of electronic products, products are becoming thinner and lighter, with more compact internal configurations and faster operation speeds. The heat generated per unit area during operation is also increasing, and the requirements for heat dissipation devices are becoming increasingly higher. Taking thin and light high-end laptops as an example, heat dissipation is a universal problem due to the small space and concentrated heat inside the machine. When the machine body overheats, the chip will automatically reduce its frequency, affecting the performance of the entire machine, and may even cause a freeze or automatic shutdown, affecting the user's normal use. The GPU and CPU of high-end laptops have higher power, so the heat dissipation requirements are high. In addition, the GPU and CPU of some high-end laptops are located on the upper and lower sides of the heat dissipation device. This double-sided heat source situation also poses a higher challenge to the heat dissipation performance of the heat dissipation device.

[0004] Therefore, how to meet the high power requirements of high-end notebook computers, especially the heat dissipation requirements of double-sided heat sources, is a key issue to be solved by the present invention. Summary of the Invention

[0005] In view of this, the present invention proposes a double-sided heat source heat dissipation device.

[0006] According to an embodiment of the present invention, a double-sided heat source heat dissipation device is disclosed, including a lower shell adjacent to a first heat source and an upper shell adjacent to a second heat source; a first capillary structure, a second capillary structure and two third capillary structures are attached to the inner surface of the lower shell; the first capillary structure and the second capillary structure are connected, one of the two third capillary structures is connected to the first capillary structure, and the other of the two third capillary structures is connected to the second capillary structure; the upper shell and the lower shell together form a closed vacuum chamber, and a fifth capillary structure and a sixth capillary structure are attached to the inner surface of the upper shell; the fifth capillary structure and the sixth capillary structure are connected; the first capillary structure pair is located in the fifth capillary structure and can cover the area where the first heat source is located; the sixth capillary structure pair is located in the second capillary structure and can cover the area where the second heat source is located. The power of the first heat source is greater than the power of the second heat source; the lower housing further includes two fourth capillary structures, each of which is arranged along the length of one of the third capillary structures and extends into the area of ​​the first capillary structure corresponding to the first heat source; or the lower housing further includes a fourth capillary structure, which is arranged along the length of two of the third capillary structures and passes through the area of ​​the first capillary structure corresponding to the first heat source and the area of ​​the second capillary structure corresponding to the second heat source. The capillary force of the first capillary structure is greater than the capillary force of the second capillary structure, the capillary force of the second capillary structure is greater than the capillary force of the third capillary structure, and the capillary force of the third capillary structure is greater than the capillary force of the fourth capillary structure. The capillary force of the fifth capillary structure is greater than the capillary force of the sixth capillary structure. The capillary force of the fifth capillary structure is equal to the capillary force of the first capillary structure, and the capillary force of the sixth capillary structure is equal to the capillary force of the second capillary structure. Two seventh capillary structures are also attached to the inner surface of the upper shell, one of which is connected to the fifth capillary structure, and the other of which is connected to the sixth capillary structure. The capillary force of the sixth capillary structure is greater than the capillary force of the seventh capillary structure. The capillary force of the seventh capillary structure is equal to the capillary force of the third capillary structure. The ratio of the total capillary thickness to the steam channel in any cross-section is less than or equal to 75%:25%. The upper shell also includes multiple eighth capillary structures, each of which is attached to a connector within the area where the first and second capillary structures are located and is connected to the first or second capillary structure. The capillary thickness of the first and fifth capillary structures is greater than or equal to the capillary thickness of the second and sixth capillary structures. The permeability of the fourth capillary structure is greater than the permeability of the first, second, and third capillary structures.

[0007] According to another embodiment of the present invention, a double-sided heat source heat dissipation device is disclosed, comprising a lower housing adjacent to a first heat source and an upper housing adjacent to a second heat source. A first capillary structure, a second capillary structure, and two third capillary structures are attached to the inner surface of the lower housing. The second capillary structure surrounds the first capillary structure, and two third capillary structures are connected to opposite ends of the second capillary structure. The upper housing and the lower housing together form a sealed vacuum chamber. A fifth capillary structure and a sixth capillary structure are attached to the inner surface of the upper housing. The sixth capillary structure surrounds the fifth capillary structure. The first capillary structure pair is located within the fifth capillary structure and covers the areas where the first and second heat sources are located. The sixth capillary structure pair is located within the second capillary structure. The power of the first heat source is greater than that of the second heat source. The lower housing further comprises two fourth capillary structures, each of which is arranged along the length of one of the third capillary structures and extends into the area of ​​the first capillary structure corresponding to the first heat source. Alternatively, the lower housing further includes a fourth capillary structure, arranged along the length of the two third capillary structures and passing through the area of ​​the first capillary structure corresponding to the first heat source and the area corresponding to the second heat source. The capillary force of the first capillary structure is greater than the capillary force of the second capillary structure, the capillary force of the second capillary structure is greater than the capillary force of the third capillary structure, and the capillary force of the third capillary structure is greater than the capillary force of the fourth capillary structure. The capillary force of the fifth capillary structure is greater than the capillary force of the sixth capillary structure. The capillary force of the fifth capillary structure is equal to the capillary force of the first capillary structure, and the capillary force of the sixth capillary structure is equal to the capillary force of the second capillary structure. Two seventh capillary structures are further attached to the inner surface of the upper housing, with the two seventh capillary structures respectively connected to the ends of the sixth capillary structure. The capillary force of the sixth capillary structure is greater than the capillary force of the seventh capillary structure. The capillary force of the seventh capillary structure is equal to the capillary force of the third capillary structure. The ratio of the total capillary thickness to the vapor channel in any cross-section is less than or equal to 75%:25%. The device further includes a plurality of eighth capillary structures, each of which is attached to a connector within the region where the first and second capillary structures are located and communicates with the first or second capillary structure. The capillary thickness of the first and fifth capillary structures is greater than or equal to the capillary thickness of the second and sixth capillary structures. The permeability of the fourth capillary structure is greater than the permeabilities of the first, second, and third capillary structures.

[0008] One or more of the first capillary structure, the second capillary structure, the third capillary structure, the fourth capillary structure, the fifth capillary structure, the sixth capillary structure, the seventh capillary structure and the eighth capillary structure of the double-sided heat source heat dissipation device disclosed in the aforementioned embodiment of the present invention are attached to the upper shell, the lower shell or the connecting part by sintering using one of powder, wire mesh or fiber.

[0009] The double-sided heat source heat dissipation device disclosed in the aforementioned embodiment of the present invention arranges capillary structures of various specifications in a hierarchical manner according to the different power requirements and locations of multiple heat sources, fully utilizing the advantages of different capillary structures to enable the working medium in the heat dissipation device to quickly and fully participate in the cyclic heat transfer of the liquid-vapor two-phase change, thereby improving the heat dissipation performance of the heat dissipation device; the present invention particularly solves the heat dissipation problem of large-sized heat dissipation devices with heat sources on both the upper and lower surfaces, i.e., double-sided heat sources.

[0010] The above description of the content of the present invention and the following description of the embodiments are intended to demonstrate and explain the principles of the present invention, and to provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the three-dimensional structure of the double-sided heat source heat dissipation device of the present invention;

[0012] Figure 2 This is an exploded view of the structure of the double-sided heat source heat dissipation device according to the first embodiment of the present invention;

[0013] Figure 2a This is a plan view of the internal structure of the lower housing of the first embodiment of the present invention;

[0014] Figure 2b This is a plan view of the internal structure of the upper housing of the first embodiment of the present invention;

[0015] Figure 2c This is a plan view of the internal structure of the lower housing of the second embodiment of the present invention;

[0016] Figure 3 This is an exploded view of the structure of the double-sided heat source heat dissipation device according to the third embodiment of the present invention;

[0017] Figure 3a This is a plan view of the internal structure of the lower housing of the third embodiment of the present invention;

[0018] Figure 3b This is a plan view of the internal structure of the upper housing of the third embodiment of the present invention;

[0019] Figure 3c This is a plan view of the internal structure of the lower shell of Example 4 of the present invention.

[0020] Wherein, the reference numerals:

[0021] 10, 10a, 10c…Double-sided heat source cooling device

[0022] 20, 20a, 20b, 20c, 20d…first heat source

[0023] 30, 30a, 30b, 30c, 30d…second heat source

[0024] 100, 100a, 100b, 100c, 100d...lower shell

[0025] 101a, 101b, 101c, 101d…first capillary structure

[0026] 102a, 102b, 102c, 102d...second capillary structure

[0027] 103a, 103b, 103c, 103d...third capillary structure

[0028] 104a, 104b, 104c, 104d...fourth capillary structure

[0029] 105a, 105b, 105c, 105d…connectors

[0030] 106a, 106b, 106c, 106d...eighth capillary structure

[0031] 200, 200a, 200c…upper housing

[0032] 201a, 201c…fifth capillary structure

[0033] 202a, 202c...sixth capillary structure

[0034] 203a, 203c...seventh capillary structure

[0035] 204a, 204c...grooved portion DETAILED DESCRIPTION

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0037] The exemplary embodiments of the present invention and their description are used to explain the present invention, but are not intended to limit the present invention. In addition, elements / components with the same or similar reference numerals used in the drawings and embodiments are used to represent the same or similar parts.

[0038] The directional terms used herein, such as up, down, left, right, front, or back, are only used to refer to the directions in the accompanying drawings. Therefore, the directional terms used are used to illustrate and not to limit the present invention.

[0039] The words “include,” “including,” “have,” “contain,” etc. used in this document are open-ended terms, meaning including but not limited to.

[0040] As used herein, "and / or" includes any and all combinations of the items mentioned.

[0041] Regarding "plurality" in this document, "plurality" includes "two" and "more than two"; regarding "plurality groups" in this document, "plurality groups" includes "two groups" and "more than two groups".

[0042] Certain terms used to describe the present application are discussed below, or elsewhere in this specification, to provide additional guidance to those skilled in the art regarding the description of the present application.

[0043] See also Figure 1 . Figure 1 Schematic diagram of the three-dimensional structure of the double-sided heat source heat dissipation device of the present invention. Figure 1 As shown, the double-sided heat source heat dissipation device 10 includes an upper shell 200 and a lower shell 100, which together form a closed vacuum chamber; the first heat source 20 and the second heat source 30 are arranged on the upper and lower surfaces of the double-sided heat source heat dissipation device 10, and the power of the first heat source 20 (such as GPU) is higher than the power of the second heat source 30 (such as CPU), wherein the lower shell 100 is adjacent to the first heat source 20, and the upper shell 200 is adjacent to the second heat source 30. Figure 1 It is mainly used to illustrate the application environment of the double-sided heat source cooling device 10 for subsequent description.

[0044] See also Figure 2 、 Figure 2a and Figure 2b . Figure 2 This is an exploded view of the structure of the double-sided heat source heat dissipation device according to the first embodiment of the present invention; Figure 2a This is a plan view of the internal structure of the lower housing of the first embodiment of the present invention; Figure 2b FIG. 1 is a plan view of the internal structure of the upper shell of the first embodiment of the present invention. Figure 2 、 Figure 2a and Figure 2bAs shown, the double-sided heat source heat dissipation device 10a includes a lower shell 100a and an upper shell 200a; the inner surface of the lower shell 100a is attached with a first capillary structure 101a, a second capillary structure 102a, two third capillary structures 103a and two fourth capillary structures 104a; the first capillary structure 101a and the second capillary structure 102a are connected, one of the two third capillary structures 103a is connected to the first capillary structure 101a, the other of the two third capillary structures 103a is connected to the second capillary structure 102a, and each fourth capillary structure 104a is connected along A third capillary structure 103a is arranged in the length direction and extends to the area on the first capillary structure 101a where the first heat source 20a with higher power is located; a fifth capillary structure 201a, a sixth capillary structure 202a and two seventh capillary structures 203a are attached to the inner surface of the upper shell 200a; the fifth capillary structure 201a and the sixth capillary structure 202a are connected, one of the two seventh capillary structures 203a is connected to the fifth capillary structure 201a, and the other of the two seventh capillary structures 203a is connected to the sixth capillary structure 202a. The first capillary structure 101a is opposite to the fifth capillary structure 201a, and the areas of the first capillary structure 101a and the fifth capillary structure 201a are both larger than the area of ​​the first heat source 20a, and the positions of the two can cover the area where the first heat source 20a is located; the sixth capillary structure 202a is opposite to the second capillary structure 102a, and the areas of the sixth capillary structure 202a and the second capillary structure 102a are both larger than the area of ​​the second heat source 30a, and the positions of the two can cover the area where the second heat source 30a is located. The double-sided heat source heat sink 10a further includes a plurality of connectors 105a. The top and bottom surfaces of the connectors 105a are connected to the inner surfaces of the upper shell 200a and the lower shell 100a, respectively, thereby supporting the upper shell 200a and the lower shell 100a. An eighth capillary structure 106a is attached to the connectors 105a within the region where the first capillary structure 101a and the second capillary structure 102a are located, and communicates with the first capillary structure 101a or the second capillary structure 102a. The connectors 105a are bonded to the upper shell 200a or the lower shell 100a by welding, diffusion bonding, hot pressing, soldering, brazing, or adhesives. Alternatively, the connectors 105a may be integrally formed with the upper shell 200a or the lower shell 100a. One or more of the first capillary structure 101a, the second capillary structure 102a, the third capillary structure 103a, the fourth capillary structure 104a, the fifth capillary structure 201a, the sixth capillary structure 202a, the seventh capillary structure 203a and the eighth capillary structure 106a are attached to the upper shell 200a, the lower shell 100a or the connecting part 105a by high-temperature sintering using one of powder, wire mesh or fiber.

[0045] Based on the first embodiment, the capillary force relationship of each capillary structure of the lower shell 100a is: first capillary structure 101a>second capillary structure 102a>third capillary structure 103a>fourth capillary structure 104a; the capillary force relationship of each capillary structure of the upper shell 200a is: fifth capillary structure 201a>sixth capillary structure 202a>seventh capillary structure 203a; the capillary force relationship of each capillary structure of the lower shell 100a and the upper shell 200a is: fifth capillary structure 201a=first capillary structure 101a, sixth capillary structure 202a=second capillary structure 102a, seventh capillary structure 203a=third capillary structure 103a. Generally speaking, the smaller the particles or porosity of the capillary structure, the greater the capillary force and the greater the heat transfer, but its permeability is small and the liquid flow resistance is large; conversely, the larger the particles or porosity of the capillary structure, the smaller the capillary force and the smaller the heat transfer, but its permeability is large, it can absorb more liquid, the liquid reflux resistance is small, and it is conducive to the rapid reflux of the liquid.

[0046] When the double-sided heat source heat dissipation device 10a is working, the lower shell 100a absorbs the heat emitted by the first heat source 20a, causing the liquid working medium near the first heat source 20a to vaporize and evaporate into a gas through the first capillary structure 101a; the upper shell 200a absorbs the heat emitted by the second heat source 30a, causing the liquid working medium near the second heat source 30a to vaporize and evaporate into a gas through the sixth capillary structure 202a; this vaporization process generates local high pressure near the heat source, and the gaseous working medium flows toward the cold ends on both sides of the double-sided heat source heat dissipation device 10a under the action of pressure. The gaseous working medium condenses into liquid due to cooling and releases heat. The condensed liquid working medium flows back to the heat source area under the action of the third capillary structure 103a and the fourth capillary structure 104a. In this embodiment, the first capillary structure 101a and the fifth capillary structure 201a with the largest capillary force have the largest heat transfer capacity, which can quickly evaporate and vaporize the liquid working medium near the first heat source 20a, so as to quickly absorb the heat of the first heat source 20a with higher power for heat transfer; the second capillary structure 102a and the sixth capillary structure 202a with larger capillary force have larger heat transfer capacity, which can quickly evaporate and vaporize the liquid working medium near the second heat source 30a, so as to quickly absorb the heat of the second heat source 30a with lower power for heat transfer; the third capillary structure 103a and the seventh capillary structure with smaller capillary force have larger heat transfer capacity. 203a has a higher permeability, can adsorb more liquid, and has a smaller liquid return resistance, so that the condensed liquid working medium can quickly return; and the fourth capillary structure 104a with the smallest capillary force has the highest permeability, can adsorb more liquid, and has a very small liquid return resistance, which can significantly accelerate the return speed of the liquid working medium, so that it can quickly return to the corresponding areas of the first heat source 20a and the second heat source 30a, and enable the higher-power first heat source 20a to accept more refluxed liquid working medium; therefore, this embodiment effectively improves the heat dissipation performance, especially taking into account the heat dissipation performance of the higher-power first heat source 20a.

[0047] The above requires clarification:

[0048] (1) In this embodiment, the first heat source 20a is designated as a heat source with a higher power. If the second heat source 30a is designated as a heat source with a higher power, the capillary force of the second capillary structure 102a and the sixth capillary structure 202a should be greater than the capillary force of the first capillary structure 101a and the fifth capillary structure 201a, and each fourth capillary structure 104a should extend to the area on the second capillary structure 102a corresponding to the second heat source 30a with a higher power. In other words, a heat source with a higher power corresponds to a capillary structure with a larger capillary force and accepts more refluxed liquid working medium.

[0049] (2) In some embodiments, because the upper shell 200a is adjacent to the second heat source 30a with lower power, the upper shell 200a may not be provided with the seventh capillary structure 203a while meeting the heat dissipation requirements, and the reflux of the condensed liquid working medium may be completed directly by relying on the fourth capillary structure 104a;

[0050] (3) In this embodiment, the eighth capillary structure 106a is used to assist in increasing the vaporization, evaporation and transmission of the liquid working medium; in some embodiments, the eighth capillary structure 106a may not be provided on the connecting member 105a when the heat dissipation requirements are met;

[0051] (4) In this embodiment, the groove portion 204a of the upper shell 200a corresponds to the area where the second heat source 30a is located. The purpose is to enable the upper shell 200a to be in closer contact with the second heat source 30a to improve the heat transfer effect. However, the present invention is not limited to this. In specific applications, the designer can adjust the layout of the groove portion or the boss structure to be closer to the heat source to improve the heat transfer effect according to the actual location of different heat sources and the heat dissipation requirements.

[0052] (5) In the present invention, the capillary thickness of each capillary structure may be the same or different. In the present embodiment, the capillary thickness of the first capillary structure 101a and the fifth capillary structure 201a corresponding to the first heat source 20a is the same as the capillary thickness of the second capillary structure 102a and the sixth capillary structure 202a corresponding to the second heat source 30a. In other embodiments, the capillary thickness of the first capillary structure 101a and the fifth capillary structure 201a corresponding to the first heat source 20a may be greater than the capillary thickness of the second capillary structure 102a and the sixth capillary structure 202a corresponding to the second heat source 30a.

[0053] (6) In the present invention, the ratio of the total capillary thickness to the steam channel on any cross section of the double-sided heat source heat dissipation device 10a is less than or equal to 75%:25%, that is, the maximum proportion of the total capillary thickness is 75%, thereby ensuring sufficient steam channels to meet the heat dissipation performance requirements.

[0054] Based on the first embodiment, the fourth capillary structure 104a of the lower shell 100a is changed to form the second embodiment. Figure 2c . Figure 2c FIG. 1 is a plan view of the internal structure of the lower shell of the second embodiment of the present invention. Figure 2cAs shown, the lower shell 100b can be provided with a fourth capillary structure 104b, which is arranged along the length direction of the two third capillary structures 103b and passes through the regions corresponding to the first heat source 20b on the first capillary structure 101b and the second heat source 30b on the second capillary structure 102b, that is, the fourth capillary structure 104b completely connects the first capillary structure 101b, the second capillary structure 102b and the two third capillary structures 103b in series in the length direction and passes through the regions corresponding to the first heat source 20b and the second heat source 30b; the layout of the connecting piece 105b is adaptively adjusted according to the fourth capillary structure 104b. The condensed liquid working medium flows back through the third capillary structure 103b and the fourth capillary structure 104b, and the fourth capillary structure 104b with the smallest capillary force and the largest permeability obviously accelerates the flow-back speed of the liquid working medium, so that the liquid working medium rapidly flows back to the corresponding regions of the first heat source 20b and the second heat source 30b, thereby improving the heat dissipation performance.

[0055] Please refer to Figure 3 、 Figure 3a and Figure 3b . Figure 3 is a structure explosion drawing of the double-sided heat source heat dissipation device of the third embodiment of the present application; Figure 3a is a plan view of the internal structure of the lower shell of the third embodiment of the present application; Figure 3b is a plan view of the internal structure of the upper shell of the third embodiment of the present application. As Figure 3 、 Figure 3a and Figure 3bAs shown, the double-sided heat source heat dissipation device 10c includes a lower shell 100c and an upper shell 200c; the inner surface of the lower shell 100c is attached with a first capillary structure 101c, a second capillary structure 102c, two third capillary structures 103c and two fourth capillary structures 104c; the second capillary structure 102c surrounds the first capillary structure 101c, the two third capillary structures 103c are respectively connected to the two ends of the second capillary structure 102c, and each fourth capillary structure 104c is connected along a The third capillary structures 103c are arranged along the length of the first capillary structure 101c and extend into the area corresponding to the higher-power first heat source 20c. A fifth capillary structure 201c, a sixth capillary structure 202c, and two seventh capillary structures 203c are attached to the inner surface of the upper shell 200c. The sixth capillary structure 202c surrounds the fifth capillary structure 201c, and the two seventh capillary structures 203c are connected to the ends of the sixth capillary structure 202c. The first capillary structure 101c is located opposite the fifth capillary structure 201c. The areas of the first and fifth capillary structures 101c and 201c are both greater than the combined areas of the first and second heat sources 20c and 30c, and they are positioned to cover the areas of the first and second heat sources 20c and 30c. The sixth capillary structure 202c is located opposite the second capillary structure 102c. The double-sided heat source heat sink 10c further includes a plurality of connectors 105c, the top and bottom surfaces of which are connected to the inner surfaces of the upper shell 200c and the lower shell 100c, respectively, thereby supporting the upper shell 200c and the lower shell 100c. An eighth capillary structure 106c is attached to the connectors 105c within the region where the first capillary structure 101c and the second capillary structure 102c are located, and communicates with the first capillary structure 101c or the second capillary structure 102c. The connectors 105c are bonded to the upper shell 200c or the lower shell 100c by welding, diffusion bonding, hot pressing, soldering, brazing, or adhesives; alternatively, the connectors 105c may be integrally formed with the upper shell 200c or the lower shell 100c. One or more of the first capillary structure 101c, the second capillary structure 102c, the third capillary structure 103c, the fourth capillary structure 104c, the fifth capillary structure 201c, the sixth capillary structure 202c, the seventh capillary structure 203c and the eighth capillary structure 106c are attached to the upper shell 200c, the lower shell 100c or the connecting part 105c by high-temperature sintering using one of powder, wire mesh or fiber.

[0056] Based on the third embodiment, the capillary force relationship of each capillary structure of the lower shell 100c is: first capillary structure 101c>second capillary structure 102c>third capillary structure 103c>fourth capillary structure 104c; the capillary force relationship of each capillary structure of the upper shell 200c is: fifth capillary structure 201c>sixth capillary structure 202c>seventh capillary structure 203c; the capillary force relationship of each capillary structure of the lower shell 100c and the upper shell 200c is: fifth capillary structure 201c=first capillary structure 101c, sixth capillary structure 202c=second capillary structure 102c, seventh capillary structure 203c=third capillary structure 103c. Generally speaking, the smaller the particles or porosity of the capillary structure, the greater the capillary force and the greater the heat transfer, but its permeability is small and the liquid flow resistance is large; conversely, the larger the particles or porosity of the capillary structure, the smaller the capillary force and the smaller the heat transfer, but its permeability is large, it can absorb more liquid, the liquid reflux resistance is small, and it is conducive to the rapid reflux of the liquid.

[0057] When the double-sided heat source heat dissipation device 10c is in operation, the lower shell 100c absorbs the heat emitted by the first heat source 20c, causing the liquid working medium near the first heat source 20c to vaporize and evaporate into a gas through the first capillary structure 101c; the upper shell 200c absorbs the heat emitted by the second heat source 30c, causing the liquid working medium near the second heat source 30c to vaporize and evaporate into a gas through the fifth capillary structure 201c; this vaporization process generates local high pressure near the heat source, and the gaseous working medium flows toward the cold ends on both sides of the double-sided heat source heat dissipation device 10c under the action of pressure. The gaseous working medium condenses into a liquid due to cooling and releases heat. The condensed liquid working medium flows back to the heat source area under the action of the third capillary structure 103c and the fourth capillary structure 104c. In this embodiment, the first capillary structure 101c and the fifth capillary structure 201c with the largest capillary force have the largest heat transfer capacity, which can quickly evaporate the liquid working medium near the first heat source 20c and the second heat source 30c, so as to quickly absorb the heat of the first heat source 20c and the second heat source 30c with higher power for heat transfer; the second capillary structure 102c and the sixth capillary structure 202c with larger capillary force transmit the vaporized gaseous working medium to the cold end; the third capillary structure 103c and the seventh capillary structure 203c with smaller capillary force have higher permeability, which can More liquid is adsorbed and the liquid return resistance is small, so that the condensed liquid working medium can return quickly; and the fourth capillary structure 104c with the smallest capillary force has the highest permeability, can adsorb more liquid, and has very small liquid return resistance, which can significantly accelerate the return speed of the liquid working medium, so that it can quickly return to the corresponding areas of the first heat source 20c and the second heat source 30c, and enable the first heat source 20c with higher power to accept more refluxed liquid working medium; therefore, this embodiment effectively improves the heat dissipation performance, especially taking into account the heat dissipation performance of the first heat source 20c with higher power.

[0058] The above requires clarification:

[0059] (1) In this embodiment, the first heat source 20c is designated as a heat source with a higher power. If the second heat source 30c is designated as a heat source with a higher power, each fourth capillary structure 104c should extend to the area of ​​the first capillary structure 101c corresponding to the second heat source 30c with a higher power; that is, the heat source with a higher power receives more refluxed liquid medium.

[0060] (2) In some embodiments, because the upper shell 200c is adjacent to the second heat source 30c with lower power, the upper shell 200c may not be provided with the seventh capillary structure 203c while meeting the heat dissipation requirements, and the reflux of the condensed liquid working medium may be completed directly by relying on the fourth capillary structure 104c;

[0061] (3) In this embodiment, the eighth capillary structure 106c is used to assist in increasing the vaporization, evaporation and transmission of the liquid working medium; in some embodiments, the eighth capillary structure 106c may not be provided on the connecting member 105c when the heat dissipation requirements are met;

[0062] (4) In this embodiment, the groove portion 204c of the upper shell 200c corresponds to the area where the second heat source 30c is located. The purpose is to enable the upper shell 200c to be in closer contact with the second heat source 30c to improve the heat transfer effect. However, the present invention is not limited to this. In specific applications, the designer can adjust the layout of the groove portion or the boss structure to be closer to the heat source to improve the heat transfer effect according to the actual location of different heat sources and the heat dissipation requirements.

[0063] (5) In the present invention, the capillary thickness of each capillary structure may be the same or different. In the present embodiment, the capillary thickness of the first capillary structure 101c and the fifth capillary structure 201c corresponding to the first heat source 20c and the second heat source 30c is the same as the capillary thickness of the second capillary structure 102c and the sixth capillary structure 202c. In other embodiments, the capillary thickness of the first capillary structure 101c and the fifth capillary structure 201c corresponding to the first heat source 20c and the second heat source 30c may be greater than the capillary thickness of the second capillary structure 102c and the sixth capillary structure 202c.

[0064] (6) In the present invention, the ratio of the total capillary thickness to the steam channel on any cross section of the double-sided heat source heat dissipation device 10c is less than or equal to 75%:25%, that is, the maximum proportion of the total capillary thickness is 75%, thereby ensuring sufficient steam channels to meet the heat dissipation performance requirements.

[0065] Based on the third embodiment, the fourth capillary structure 104c of the lower shell 100c is changed to form the fourth embodiment. Figure 3c . Figure 3cFIG. 1 is a plan view of the internal structure of the lower shell of the fourth embodiment of the present invention. Figure 3c As shown, the lower housing 100d can be provided with a fourth capillary structure 104d. The fourth capillary structure 104d is arranged along the length of the two third capillary structures 103d and passes through the area corresponding to the first heat source 20d and the area corresponding to the second heat source 30d on the first capillary structure 101d. That is, the fourth capillary structure 104d completely connects the first capillary structure 101d, the second capillary structure 102d, and the two third capillary structures 103d in series in the length direction and passes through the areas corresponding to the first heat source 20d and the second heat source 30d. The layout of the connector 105d is adaptively adjusted based on the fourth capillary structure 104d. The condensed liquid working medium flows back through the third capillary structure 103d and the fourth capillary structure 104d. The fourth capillary structure 104d, which has the smallest capillary force and the largest permeability, significantly accelerates the return speed of the liquid working medium, causing it to quickly flow back to the corresponding areas of the first heat source 20d and the second heat source 30d, thereby improving heat dissipation performance.

[0066] It should be noted that the double-sided heat source heat dissipation device of the present invention is suitable for situations where multiple heat sources are arranged on the upper and lower sides of the heat dissipation device. However, the present invention is not limited to this and is also suitable for situations where multiple heat sources are located on the same side of the heat dissipation device.

[0067] In summary, the present invention proposes a double-sided heat source heat dissipation device, which arranges capillary structures of various different specifications in a hierarchical manner according to the different power requirements and locations of multiple heat sources, fully utilizing the advantages of different capillary structures to enable the working medium in the heat dissipation device to quickly and fully participate in the cyclic heat transfer of the liquid-vapor two-phase change, thereby improving the heat dissipation performance of the heat dissipation device; the present invention particularly solves the heat dissipation problem of large-scale heat dissipation devices with heat sources on both the upper and lower surfaces, that is, double-sided heat sources.

[0068] Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Anyone skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the claims attached to this specification.

Claims

1. A double-sided heat source heat dissipation device, characterized in that: include: a lower housing adjacent to the first heat source, wherein a first capillary structure, a second capillary structure, and two third capillary structures are attached to an inner surface of the lower housing; the first capillary structure and the second capillary structure are connected, one of the two third capillary structures is connected to the first capillary structure, and the other of the two third capillary structures is connected to the second capillary structure; an upper shell adjacent to the second heat source, the upper shell and the lower shell together forming a sealed vacuum chamber, a fifth capillary structure and a sixth capillary structure attached to an inner surface of the upper shell; the fifth capillary structure and the sixth capillary structure are connected; The first capillary structure is located on the fifth capillary structure and can cover the area where the first heat source is located; The sixth capillary structure is located on the second capillary structure and can cover the area where the second heat source is located; Among them, the power of the first heat source is greater than the power of the second heat source, the capillary force of the first capillary structure is greater than the capillary force of the second capillary structure, the capillary force of the second capillary structure is greater than the capillary force of the third capillary structure, and the capillary force of the fifth capillary structure is greater than the capillary force of the sixth capillary structure.

2. The double-sided heat source heat dissipation device according to claim 1, characterized in that: The lower shell further includes two fourth capillary structures, each of which is arranged along the length direction of one of the third capillary structures and extends to the area on the first capillary structure corresponding to the first heat source.

3. The double-sided heat source heat dissipation device according to claim 1, characterized in that: The lower shell also includes a fourth capillary structure, which is arranged along the length direction of the two third capillary structures and passes through the area on the first capillary structure corresponding to the first heat source and the area on the second capillary structure corresponding to the second heat source.

4. The double-sided heat source heat dissipation device according to any one of claims 2 or 3, characterized in that: The capillary force of the third capillary structure is greater than the capillary force of the fourth capillary structure.

5. The double-sided heat source heat dissipation device according to claim 4, characterized in that: The capillary force of the fifth capillary structure is equal to the capillary force of the first capillary structure, and the capillary force of the sixth capillary structure is equal to the capillary force of the second capillary structure.

6. The double-sided heat source heat dissipation device according to claim 4, characterized in that: Two seventh capillary structures are further attached to the inner surface of the upper shell, one of the two seventh capillary structures is connected to the fifth capillary structure, and the other of the two seventh capillary structures is connected to the sixth capillary structure.

7. The double-sided heat source heat dissipation device according to claim 6, wherein: The capillary force of the sixth capillary structure is greater than the capillary force of the seventh capillary structure.

8. The double-sided heat source heat dissipation device according to claim 7, characterized in that: The capillary force of the seventh capillary structure is equal to the capillary force of the third capillary structure.

9. The double-sided heat source heat dissipation device according to claim 8, characterized in that: The ratio of the total capillary thickness to the steam channel on any cross section is less than or equal to 75%:25%.

10. The double-sided heat source heat dissipation device according to claim 6, wherein: It also includes a plurality of eighth capillary structures, which are attached to the connecting piece in the area where the first capillary structure and the second capillary structure are located, and are communicated with the first capillary structure or the second capillary structure.

11. The double-sided heat source heat dissipation device according to claim 9, wherein: The capillary thickness of the first capillary structure and the fifth capillary structure is greater than or equal to the capillary thickness of the second capillary structure and the sixth capillary structure.

12. The double-sided heat source heat dissipation device according to claim 8, wherein: The permeability of the fourth capillary structure is greater than the permeabilities of the first capillary structure, the second capillary structure, and the third capillary structure.

13. The double-sided heat source heat dissipation device according to any one of claim 10, wherein: One or more of the first capillary structure, the second capillary structure, the third capillary structure, the fourth capillary structure, the fifth capillary structure, the sixth capillary structure, the seventh capillary structure and the eighth capillary structure are attached to the upper shell, the lower shell or the connecting part by sintering using one of powder, wire mesh or fiber.

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