Scanning distortion adaptive correction method, device, system and storage medium

Abstract

This invention discloses a method, apparatus, system, and storage medium for adaptive correction of scanning distortion in a MEMS mirror. The method includes: controlling a MEMS mirror to perform a matrix scanning of a plane to be acquired based on pre-loaded matrix scanning parameters; acquiring the scanning path of the MEMS mirror performing the matrix scanning based on laser points projected onto the plane to be acquired; establishing a Cartesian coordinate system for the scanning path; calculating the horizontal distortion in the horizontal direction and the vertical distortion in the vertical direction of the scanning path based on the coordinate data of each laser point in the Cartesian coordinate system; and correcting the matrix scanning parameters of the MEMS mirror based on the horizontal and vertical distortions, so that the MEMS mirror performs a matrix scanning of the plane to be acquired based on the corrected matrix scanning parameters. This method can drive a MEMS mirror to complete distortion-free scanning.

Description

Technical Field

[0001] The present invention belongs to the field of photoelectric detection, and in particular relates to a method, device, system and storage medium for adaptively correcting scanning distortion of a MEMS mirror. Background Art

[0002] MEMS (Micro-Electro-Mechanical System) is a micro system that uses micro-machining technology and integrated circuit (IC) technology to integrate micro sensors, micro actuators and micro control circuits into one or more chips. MEMS has been developed since the 1950s. Due to its many advantages such as miniaturization, intelligence and integration, it has been widely used in military and civilian fields and has contributed to the development and progress of society. Compared with traditional optical scanning mirrors, MEMS scanning mirrors have the advantages of small size, low cost, high scanning frequency, fast response speed and low power consumption. They have been widely used in strip scanning, optical communication, laser projection display, endoscopes and other fields. Due to its fast speed and small size, MEMS scanning mirrors also have good application prospects in the field of scanning laser radar.

[0003] For MEMS mirror LiDAR, by controlling the deflection of the dual-axis MEMS mirror, the depth information of the target surface is collected, and the distance image can achieve a higher imaging resolution. However, in actual application, when the scanning beam is off-axis, controlling the dual-axis MEMS mirror to perform row-column scanning without modulation will cause obvious distortion in the scanning area. The distortion is caused by the change in the trajectory of the off-axis beam from the scanning mirror to the scanning plane. The traditional distortion correction method is to use optical elements to correct the output light path, but the propagation of the beam in the optical element will cause energy loss, which reduces the maximum detection distance of the LiDAR. Summary of the invention

[0004] In order to solve the above technical problems, the embodiments of the present application provide a method, device, system and storage medium for adaptive correction of MEMS mirror scanning distortion.

[0005] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0006] The objective of the present invention is achieved through the following technical solutions:

[0007] The present invention discloses a method for adaptively correcting scanning distortion of a MEMS mirror, comprising:

[0008] Controlling the MEMS mirror to perform a linear scan on the plane to be collected according to the pre-loaded linear scan parameters; wherein the MEMS mirror projects a laser point onto the plane to be collected when performing the linear scan;

[0009] According to the laser points projected on the plane to be collected, the scanning path of the MEMS mirror for row-column scanning is collected; wherein the scanning path is composed of a plurality of laser points;

[0010] Establishing a rectangular coordinate system for the scanning path;

[0011] Calculating a horizontal distortion amount of the scanning path in a horizontal direction and a vertical distortion amount of the scanning path in a vertical direction according to coordinate data of each laser point in the scanning path in the rectangular coordinate system;

[0012] The linear scanning parameters of the MEMS mirror are corrected based on the horizontal distortion amount and the vertical distortion amount, so that the MEMS mirror performs linear scanning on the plane to be collected based on the corrected linear scanning parameters.

[0013] Further, controlling the MEMS mirror to perform a linear scan on the plane to be collected according to the pre-loaded linear scan parameters includes:

[0014] Reading multiple scanning points in the pre-loaded row-column scanning parameters; wherein one scanning point corresponds to one horizontal scanning angle and one elevation scanning angle;

[0015] The plurality of scanning points are converted into corresponding voltage values, so as to drive the MEMS mirror to scan the plane to be collected in a column-by-column manner through the voltage values.

[0016] Further, the scanning path of the MEMS mirror for performing row-column scanning is collected according to the laser point projected on the plane to be collected, including:

[0017] The plane to be collected is photographed according to the frequency of the MEMS mirror performing the row-column scanning to obtain multiple frames of images; wherein the acquisition frequency of each frame of image is the same as the frequency of the MEMS mirror performing the row-column scanning, and each frame of image corresponds to a laser point projected by the MEMS mirror on the plane to be collected;

[0018] Binarizing the multiple frames of images to extract laser points from the multiple frames of images;

[0019] The extracted laser points are arranged according to the path of the MEMS mirror for row-by-row scanning to obtain the scanning path.

[0020] Further, the calculating the horizontal distortion amount of the scanning path in the horizontal direction and the vertical distortion amount of the scanning path in the vertical direction according to the coordinate data of each laser point in the scanning path in the rectangular coordinate system includes:

[0021] Extracting first coordinate data of the laser points on the scanning path in the same row, and extracting second coordinate data of the laser points on the scanning path in the same column;

[0022] Calculate the vertical distortion amount in the vertical direction according to the longitudinal coordinate in the first coordinate data;

[0023] The horizontal distortion amount in the horizontal direction is calculated according to the abscissa in the second coordinate data.

[0024] Further, the correcting process of the column-type scanning parameters of the MEMS mirror based on the horizontal distortion amount and the vertical distortion amount, so that the MEMS mirror performs a column-type scanning on the plane to be collected based on the corrected column-type scanning parameters, includes:

[0025] Correcting the pitch scanning angle in the determinant scanning parameter based on the vertical distortion amount in the vertical direction to obtain a corrected pitch scanning angle;

[0026] Correcting the horizontal scanning angle in the determinant scanning parameter based on the horizontal distortion amount in the horizontal direction to obtain a corrected horizontal scanning angle;

[0027] The MEMS mirror is controlled to perform a matrix scan on a plane to be collected based on the corrected pitch scanning angle and the corrected horizontal scanning angle.

[0028] Furthermore, the corrected pitch scanning angle is calculated by the following formula:

[0029]

[0030] Among them, β′ A is the corrected pitch scanning angle of scanning point A in the determinant scanning parameter, α A is the horizontal scanning angle of scanning point A in the determinant scanning parameter, α max is the horizontal scanning angle with the largest value among the determinant scanning parameters, β A is the pitch scanning angle of scanning point A in the determinant scanning parameter, β A is the pitch scanning angle of scanning point A in the determinant scanning parameter, y 2 is the ordinate of the first coordinate data, y 1 is another vertical coordinate of the first coordinate data; where y 2 The laser point and y 1 The laser points are in the same row of the scanning path.

[0031] Furthermore, the corrected horizontal scanning angle is calculated by the following formula:

[0032]

[0033] Among them, α′ B is the horizontal scanning angle of scanning point B after correction in the linear scanning parameter, α B is the horizontal scanning angle of scanning point B in the determinant scanning parameter, β B is the pitch scanning angle of scanning point B in the determinant scanning parameter, β max is the maximum value of the elevation scan among the determinant scan parameters, x 3 is a horizontal coordinate of the second coordinate data, x 4 is another horizontal coordinate of the second coordinate data, where x 3 The laser point and x 4 The laser points are in the same column of the scanning path.

[0034] The present invention also discloses a device for adaptively correcting scanning distortion of a MEMS mirror, comprising:

[0035] An initial linear scanning module is configured to control the MEMS mirror to perform a linear scan on the plane to be collected according to pre-loaded linear scanning parameters; wherein the MEMS mirror projects a laser point to the plane to be collected when performing the linear scan;

[0036] A scanning path acquisition module, configured to acquire a scanning path of the MEMS mirror for performing a row-by-row scanning according to a laser point projected on the plane to be acquired; wherein the scanning path is composed of a plurality of laser points;

[0037] A rectangular coordinate system establishing module, configured to establish a rectangular coordinate system for the scanning path;

[0038] A distortion amount acquisition module, configured to calculate a horizontal distortion amount of the scanning path in a horizontal direction and a vertical distortion amount of the scanning path in a vertical direction according to coordinate data of each laser point in the scanning path in the rectangular coordinate system;

[0039] The correction matrix scanning module is configured to correct the matrix scanning parameters of the MEMS mirror based on the horizontal distortion amount and the vertical distortion amount, so that the MEMS mirror performs matrix scanning on the plane to be collected based on the corrected matrix scanning parameters.

[0040] The present invention also discloses a system for adaptively correcting scanning distortion of a MEMS mirror, comprising:

[0041] Memory for storing computer programs;

[0042] A processor is used to execute the computer program to implement the method as described above.

[0043] The present invention also discloses a readable storage medium, wherein the readable storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the method as described above.

[0044] Beneficial effects:

[0045] The present invention discloses a method for adaptively correcting scanning distortion of a MEMS mirror, which corrects the scanning field distortion of an off-axis incident MEMS mirror scanning system, and can adaptively adjust the correction amount for MEMS mirrors with different scanning fields of view, different incident angles, and different voltage responses, thereby achieving high-efficiency, energy-loss-free correction of the scanning field distortion of the MEMS mirror. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 Schematic diagram of the hardware structure required for the operation process of the embodiment of the present invention

[0047] Figure 2 This is an operation flow chart of a method for adaptively correcting scanning distortion of a MEMS mirror according to the present invention;

[0048] Figure 3 Extracting the scanning trajectory diagram of the MEMS mirror in the embodiment of the present invention;

[0049] Figure 4 A scanning path result diagram shown in an embodiment of the present invention;

[0050] Figure 5 A scanning field diagram of a row-by-row scanning using a corrected pitch scanning angle in an embodiment of the present invention;

[0051] Figure 6 This is a scanning field diagram of a row-by-row scanning using a corrected horizontal scanning angle in an embodiment of the present invention;

[0052] Figure 7 The scanning field of view diagram is obtained by performing a row-by-row scanning based on the corrected row-by-row scanning parameters in the embodiment of the present invention;

[0053] Figure 8 A schematic structural diagram of a device for adaptively correcting scanning distortion of a MEMS mirror according to the present invention;

[0054] Figure 1 In the figure, 1 is FPGA development board, 2 is laser driver, 3 is laser, 4 is MEMS mirror driver, 5 is MEMS mirror, 6 is reflector, 7 is camera, and 8 is host computer. DETAILED DESCRIPTION

[0055] The present invention will be described in detail below with reference to the accompanying drawings and embodiments. The technical problems solved by the technical solution of the present invention and the beneficial effects are also described. It should be noted that the described embodiments are only intended to facilitate the understanding of the present invention and do not have any limiting effect on it.

[0056] In order to further explain the present invention, the following Figure 1 The hardware structure diagram shown is further explained.

[0057] like Figure 1 As shown, the hardware structure required for the operation process in this embodiment includes: FPGA development board 1, laser driving device 2, laser 3, MEMS mirror driving device 4, MEMS mirror 5, reflector 6, camera 7, host computer 8; wherein the camera 7 can be a camera driven by a motor such as a CCD (charge coupled device), and the reflector 6 is the plane to be collected. Figure 1 In order to facilitate the acquisition of the subsequent scanning path of the method for adaptive correction of MEMS mirror scanning distortion, a white high-reflectivity flat plate can be used for experiments.

[0058] The method for adaptively correcting the scanning distortion of the MEMS mirror in this embodiment is based on Figure 1 The hardware structure in is completed. Figure 1 The workflow of the entire hardware structure is as follows: FPGA development board 1 sends a start signal to laser driver 2, drives laser 3 to emit laser to MEMS mirror 5, and MEMS mirror 5 reflects laser to reflector 6; at the same time, FPGA development board 1 loads a preset voltage, outputs different levels to MEMS mirror driver 4, converts digital levels into analog voltages, drives MEMS mirror 5 to deflect, and uses column-by-column scanning to scan reflector 6. Camera 7 collects scanning trajectory images and transmits data to host computer 8. Host computer 8 calculates distortion based on the collected data, corrects the column-by-column scanning data, and transmits the angle value after the correction to FPGA1. FPGA1 outputs digital levels to MEMS mirror driver 4 according to the new angle value, driving MEMS mirror 5 to achieve distortion-free scanning.

[0059] based on Figure 1 The hardware structure in Figure 2 This is a flow chart of the operation of a method for adaptively correcting scanning distortion of a MEMS mirror in this embodiment, and the specific implementation steps are as follows:

[0060] Step S201: controlling the MEMS mirror to perform a linear scan on the plane to be collected according to the pre-loaded linear scan parameters.

[0061] In this embodiment, by Figure 1The FPGA in the array loads the row-column scanning parameters, which include the number of rows M and columns N of the array scanning, the number of M*N scanning points, and the horizontal scanning field of view ±α max , vertical scanning field of view ±β max , these parameters can generate a set of horizontal scanning angles (α 1 , α 2 ,…,α M ) and a set of pitch scanning angles (β 1 , β 2 , …, β N ) Two sets of angle values ​​are stored in ROM (Read-Only Memory). Each scanning point corresponds to a horizontal scanning angle and a pitch scanning angle. FPGA reads the angle value and converts it into a voltage value to drive the MEMS mirror to perform row and column scanning.

[0062] like Figure 3 As shown, Figure 3 FIG. 1 is a scanning trajectory diagram of a MEMS mirror performing row-column scanning in an exemplary embodiment. Figure 3 Each point in the matrix is ​​a scanning point. The starting point of the matrix scanning is the maximum deflection angle of the MEMS scanning mirror to the right and upward, and the matrix scanning begins. The rotation angle of the MEMS mirror is determined by the voltage difference between the positive channel and the negative channel on the axis: Figure 3 The scanning trajectory diagram in the figure constructs a rectangular coordinate system. As the voltage difference on the X-axis gradually increases, the MEMS scanning mirror gradually deflects horizontally to the left; as the voltage difference on the Y-axis gradually increases, the MEMS scanning mirror gradually deflects vertically downward.

[0063] At the same time, when the MEMS mirror is performing row and column scanning, the laser emits laser to the MEMS mirror, and the MEMS mirror reflects the laser to the plane to be collected. The MEMS mirror projects laser points to the plane to be collected while performing row and column scanning. Based on the characteristics of row and column scanning, the laser points projected on the plane to be collected should overlap with the scanning trajectory diagram of the MEMS mirror during row and column scanning.

[0064] Step S202: According to the laser points projected on the plane to be collected, the scanning path of the MEMS mirror for row-column scanning is collected.

[0065] The scanning path in this embodiment is composed of multiple laser points.

[0066] Specifically, a camera is used to capture the scanning trajectory of the plane to be captured. The camera adopts a time-delay mode. The time for capturing one frame of image is the same as the time for the MEMS mirror to scan the field of view once, that is, the acquisition frequency of each frame of image is the same as the frequency of the MEMS mirror performing row and column scanning, and each frame of image corresponds to a laser point projected by the MEMS mirror on the plane to be captured. The scanning trajectory of the scanning light point is completely captured to obtain a complete scanning field of view.

[0067] After collecting multiple frames of images, the images can be sent to the host computer. After receiving the images, the host computer performs binarization processing on the images to separate the scanning track image and the scanning background. The scanning track image is the laser point in the image, and the scanning background is the other parts of the image except the laser point. Then, the separated multi-frame scanning track images are arranged according to the scanning track of the MEMS mirror for row-by-row scanning, that is, the separated laser points are arranged on the same plane, and the scanning path, that is, the scanning track of the MEMS mirror, can be obtained. Figure 4 That is the scanning path diagram obtained in one embodiment.

[0068] Step S203: Establish a rectangular coordinate system for the scanning path.

[0069] In this embodiment, a rectangular coordinate system is established for the scanning path on a plane, such as Figure 4 , the center point of the scanning path can be used as the origin to construct a rectangular coordinate system, but in other embodiments, any point on the plane where the scanning path is located can be used as the origin to construct a rectangular coordinate system. After the rectangular coordinate system is constructed, all laser points in the scanning path will be assigned their corresponding coordinate data.

[0070] Step S204: Calculate the horizontal distortion amount of the scanning path in the horizontal direction and the vertical distortion amount of the scanning path in the vertical direction according to the coordinate data of each laser point in the scanning path in the rectangular coordinate system.

[0071] Extract the first coordinate data of the laser point in the same row of the scanning path, and extract the second coordinate data of the laser point in the same column of the scanning path; calculate the vertical distortion amount in the vertical direction according to the ordinate in the first coordinate data; calculate the horizontal distortion amount in the horizontal direction according to the abscissa in the second coordinate data.

[0072] Specifically, for the scanning path in the rectangular coordinate system, for the laser points in the same row, if the scanning is not distorted, all the laser points should be on the same horizontal line, that is, the laser points in the same row have the same vertical coordinates in the rectangular coordinate system; for the laser points in the same column, if the scanning is not distorted, the laser points in the same column have the same horizontal coordinates in the rectangular coordinate system, so the vertical distortion amount in the vertical direction / horizontal distortion amount in the horizontal direction can be calculated based on the coordinate data of the laser points in the same row / column.

[0073] In a specific embodiment, taking the laser points in the first row and the first column of the scanning path as an example, the first coordinate data of the two laser points in the first row are (x 1 ,y 1 )、(x 2 ,y 2 ), then we can say that the vertical distortion in the vertical direction is y 2 -y 1 or Among them, y 2 The absolute value of must be greater than y 1 The absolute value of the second coordinate data of the two laser points in the first column is (x 3 ,y 3 )、(x 4 ,y 4 ), then we can say that the vertical distortion in the vertical direction is y 4 -y 3 or Among them, y 4 The absolute value of must be greater than y 3 In this way, the scanning path can be corrected by the vertical distortion amount in the vertical direction / the horizontal distortion amount in the horizontal direction.

[0074] Of course, when calculating the vertical distortion amount / horizontal distortion amount, the data of the first row / first column may not be used for calculation, but the first coordinate data / second coordinate data of each row / each column may be compared to finally obtain the final vertical distortion amount / horizontal distortion amount.

[0075] Of course, based on the trajectory diagram of the MEMS mirror scanning, as shown in reference Figure 4 When the pitch scanning angle shown is unchanged, the scanning trajectory has a negative slope; when the horizontal scanning angle is unchanged, the scanning trajectory is actually a quadratic curve opening to the right. The first laser point m1 in the scanning path, the laser point m2 (i.e., the laser point in the upper right corner) that is in the same row as the first laser point and has the largest horizontal scanning angle, and m3 (the leftmost point m on the X-axis) that is in the same column as m2 and has the largest pitch scanning angle can be used as key points to calculate the vertical distortion / horizontal distortion.

[0076] Specifically, determine the coordinates of the upper left corner point m1(x 1 ,y 1 ), the coordinates of the upper right corner point m2 (x 2 ,y 2 ), the coordinate of the leftmost point m3 on the X-axis (x 3 ,y 3 ), then m1(x 1 ,y 1 )、m2(x 2 ,y 2) is the first coordinate data, m2(x 2 ,y 2 )、m3(x 3 ,y 3 ) is the second coordinate data, and the vertical distortion is calculated with the ordinates of m1 and m2, and the horizontal scanning angle is calculated from 0° to α max max, the horizontal coordinate offset; the horizontal distortion is calculated by the horizontal coordinates of m2 and m3 to calculate the pitch scanning angle from 0° to β max The offset of the horizontal axis during the process.

[0077] Step S205: Correcting the determinant scanning parameters of the MEMS mirror based on the horizontal distortion amount and the vertical distortion amount, so that the MEMS mirror performs determinant scanning on the plane to be collected based on the corrected determinant scanning parameters.

[0078] The scanning field of view of the off-axis incident MEMS mirror scanning system is distorted into a sector shape that is symmetrical along the X-axis, wide on the left and narrow on the right. The distortion of the scanning field of view can be divided into two parts: vertical distortion and horizontal distortion. The vertical distortion is related to the horizontal scanning angle of the MEMS mirror. When the pitch scanning angle remains unchanged, the scanning trajectory is ideally a straight line parallel to the X-axis. In fact, the scanning trajectory is a straight line with a negative slope. The proportion of the decrease in the ordinate during the process from the minimum horizontal scanning angle to the maximum horizontal scanning angle can be calculated based on the ordinate of the first coordinate data, that is, the corrected pitch scanning angle can be calculated using the following formula:

[0079]

[0080] Among them, β′ A is the corrected pitch scanning angle of scanning point A in the determinant scanning parameter, α A is the horizontal scanning angle of scanning point A in the determinant scanning parameter, α max is the horizontal scanning angle with the largest value among the determinant scanning parameters, β A is the pitch scanning angle of scanning point A in the determinant scanning parameter, β A is the pitch scanning angle of scanning point A in the determinant scanning parameter, y 2 is the ordinate of the first coordinate data, y 1 is another vertical coordinate of the first coordinate data; where y 2 The laser point and y 1 The laser points are in the same row of the scan path.

[0081] Of course, if Figure 4 m1 and m2 are used as the first coordinate data to calculate the corrected pitch scanning angle. 2 With y 1 is the vertical coordinate of m1 and m2.

[0082] The scanning field of view using the corrected pitch scanning angle for row scanning can be referenced Figure 5 Each point in the scanning field of view is a corrected scanning point of the MEMS mirror, or it can be a scanning path composed of all laser points reflected by the MEMS mirror on the image to be scanned, photographed by a camera with the same scanning frequency.

[0083] The horizontal distortion is related to the pitch scanning angle of the MEMS mirror. When the horizontal scanning angle remains unchanged, the scanning trajectory is ideally a straight line parallel to the Y axis. In fact, the scanning trajectory is a quadratic curve opening to the right. According to the horizontal coordinate x1 of point m1 and the horizontal coordinate x3 of point m3, the pitch scanning angle from 0° to β can be calculated. max In the process of , the offset of the horizontal axis, that is, the corrected horizontal scanning angle is calculated by the following formula:

[0084]

[0085] Among them, α′ B is the horizontal scanning angle after correction of scanning point B in the determinant scanning parameter, α B is the horizontal scanning angle of scanning point B in the determinant scanning parameter, β B is the pitch scanning angle of scanning point B in the determinant scanning parameter, β max is the pitch scan with the largest value among the determinant scan parameters, x 3 is a horizontal coordinate of the second coordinate data, x 4 is another horizontal coordinate of the second coordinate data, where x 3 The laser point and x 4 The laser points are in the same column of the scan path.

[0086] Of course, if Figure 4 m2 and m3 are used as the second coordinate data to calculate the corrected horizontal scanning angle. 3 With x 4 They are the horizontal coordinates of m2 and m3 respectively.

[0087] exist Figure 5 Based on this, the scanning field diagram of the row-column scanning using the corrected horizontal scanning angle can be referred to Figure 6 .

[0088] In this embodiment, the pitch scanning angle in the row scanning parameter is corrected by the above method to obtain the corrected pitch scanning angle; the horizontal scanning angle in the row scanning parameter is corrected to generate the corrected horizontal scanning angle (α′ 1 , α′ 2 ,…,α′ M ) and the corrected vertical scanning angle (β′1 , β′ 2 ,…,β′ N ) two sets of data. The host computer transmits the two sets of data to the ROM of the FPGA through the serial port. When achieving distortion-free scanning, the FPGA reads the angle value from the ROM and converts it into the driving voltage of the MEMS mirror. The FPGA transmits the corrected scanning voltage data together with the address data to the MEMS mirror drive device, driving the MEMS mirror to achieve distortion-free scanning. The MEMS mirror performs a row-column scan based on the corrected row-column scanning parameters to obtain a scanning field of view such as Figure 7 shown.

[0089] The method for adaptively correcting the scanning distortion of the MEMS mirror in this embodiment is as follows: Figure 1 The FPGA development board 1 in the hardware structure diagram shown in the figure loads the horizontal scanning angle value and the pitch scanning angle value stored in the ROM, starts the row-column scanning, and sends the start signal to Figure 1 The laser driving device 2 in the device drives the laser 3 to emit laser light to the MEMS mirror 5 through the laser driving device 2; while the MEMS mirror 5 performs a deterministic scanning on the reflector 6, it will reflect the laser light on the reflector, and the camera 7 collects the complete scanning trajectory image and transmits it to the host computer 8, which processes the image and extracts the coordinate data information of the key points. According to the coordinate information of the key points, the distortion law of the scanning field in the horizontal and vertical directions can be calculated. The host computer 8 transmits the horizontal angle value and the pitch angle value after the compensation distortion back to the ROM of FPGA1, and the driving voltage is generated by FPGA1 and imported into the MEMS mirror driving device 4 to complete the distortion-free scanning.

[0090] Based on the method for adaptively correcting the scanning distortion of the MEMS mirror proposed in the above embodiment, a device for adaptively correcting the scanning distortion of the MEMS mirror is proposed in this embodiment, and its structure is as follows: Figure 8 , including:

[0091] The initial linear scanning module 810 is configured to control the MEMS mirror to perform linear scanning on the plane to be collected according to the pre-loaded linear scanning parameters; wherein the MEMS mirror projects a laser point to the plane to be collected when performing the linear scanning;

[0092] The scanning path acquisition module 820 is configured to acquire the scanning path of the MEMS mirror for row-column scanning according to the laser points projected on the plane to be acquired; wherein the scanning path is composed of a plurality of laser points;

[0093] A rectangular coordinate system establishing module 830, configured to establish a rectangular coordinate system for the scanning path;

[0094] The distortion amount acquisition module 840 is configured to calculate the horizontal distortion amount of the scanning path in the horizontal direction and the vertical distortion amount of the scanning path in the vertical direction according to the coordinate data of each laser point in the scanning path in the rectangular coordinate system;

[0095] The correction matrix scanning module 850 is configured to correct the matrix scanning parameters of the MEMS mirror based on the horizontal distortion amount and the vertical distortion amount, so that the MEMS mirror performs matrix scanning on the plane to be collected based on the corrected matrix scanning parameters.

[0096] The device for adaptive correction of MEMS mirror scanning distortion and the method for adaptive correction of MEMS mirror scanning distortion proposed in this embodiment belong to the same technical concept. For details, please refer to the technical solution in the method for adaptive correction of MEMS mirror scanning distortion, which will not be repeated here.

[0097] The specific description above further illustrates the purpose, technical solutions and beneficial effects of the invention in detail. It should be understood that the above is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for adaptively correcting scanning distortion of a MEMS mirror, characterized in that: include: Controlling the MEMS mirror to perform a linear scan on the plane to be collected according to the pre-loaded linear scan parameters; wherein the MEMS mirror projects a laser point onto the plane to be collected when performing the linear scan; According to the laser points projected on the plane to be collected, the scanning path of the MEMS mirror for row-column scanning is collected; wherein the scanning path is composed of a plurality of laser points; Establishing a rectangular coordinate system for the scanning path; Calculating a horizontal distortion amount of the scanning path in a horizontal direction and a vertical distortion amount of the scanning path in a vertical direction according to coordinate data of each laser point in the scanning path in the rectangular coordinate system; Correcting the determinant scanning parameters of the MEMS mirror based on the horizontal distortion amount and the vertical distortion amount, so that the MEMS mirror performs determinant scanning on the plane to be collected based on the corrected determinant scanning parameters; The step of calculating the horizontal distortion amount of the scanning path in the horizontal direction and the vertical distortion amount of the scanning path in the vertical direction according to the coordinate data of each laser point in the scanning path in the rectangular coordinate system comprises: Extracting first coordinate data of the laser points on the scanning path in the same row, and extracting second coordinate data of the laser points on the scanning path in the same column; Calculate the vertical distortion amount in the vertical direction according to the longitudinal coordinate in the first coordinate data; Calculate the horizontal distortion amount in the horizontal direction according to the abscissa in the second coordinate data; The correcting the matrix scanning parameters of the MEMS mirror based on the horizontal distortion amount and the vertical distortion amount so that the MEMS mirror performs matrix scanning on the plane to be collected based on the corrected matrix scanning parameters includes: Correcting the pitch scanning angle in the determinant scanning parameter based on the vertical distortion amount in the vertical direction to obtain a corrected pitch scanning angle; Correcting the horizontal scanning angle in the determinant scanning parameter based on the horizontal distortion amount in the horizontal direction to obtain a corrected horizontal scanning angle; Controlling the MEMS mirror to perform a matrix scan on a plane to be collected based on the corrected pitch scanning angle and the corrected horizontal scanning angle; The corrected pitch scan angle is calculated using the following formula: Among them, β' A is the corrected pitch scanning angle of scanning point A in the determinant scanning parameter, α A is the horizontal scanning angle of scanning point A in the determinant scanning parameter, α max is the horizontal scanning angle with the largest value among the determinant scanning parameters, β A is the pitch scanning angle of scanning point A in the determinant scanning parameter, β A is the pitch scanning angle of the scanning point A in the matrix scanning parameter, y2 is the ordinate of the first coordinate data, and y1 is another ordinate of the first coordinate data; wherein the laser point where y2 is located and the laser point where y1 is located are in the same row of the scanning path; wherein the two first key points where y2 and y1 are located are in the same row of the scanning path, and the difference in the ordinates between the two first key points where y2 and y1 are located is the largest.

2. The method according to claim 1, characterized in that The controlling the MEMS mirror to perform a linear scan on the plane to be collected according to the pre-loaded linear scan parameters comprises: Reading multiple scanning points in the pre-loaded row-column scanning parameters; wherein one scanning point corresponds to one horizontal scanning angle and one elevation scanning angle; The plurality of scanning points are converted into corresponding voltage values, so as to drive the MEMS mirror to scan the plane to be collected in a column-by-column manner through the voltage values.

3. The method according to claim 1, characterized in that The method of collecting the scanning path of the MEMS mirror for performing row-column scanning according to the laser points projected on the plane to be collected comprises: The plane to be collected is photographed according to the frequency of the MEMS mirror performing the row-column scanning to obtain multiple frames of images; wherein the acquisition frequency of each frame of image is the same as the frequency of the MEMS mirror performing the row-column scanning, and each frame of image corresponds to a laser point projected by the MEMS mirror on the plane to be collected; Binarizing the multiple frames of images to extract laser points from the multiple frames of images; The extracted laser points are arranged according to the path of the MEMS mirror for row-by-row scanning to obtain the scanning path.

4. The method according to claim 1, characterized in that: The corrected horizontal scanning angle is calculated by the following formula: Among them, α' B is the horizontal scanning angle of scanning point B after correction in the linear scanning parameter, α B is the horizontal scanning angle of scanning point B in the determinant scanning parameter, β B is the pitch scanning angle of scanning point B in the determinant scanning parameter, β max is the pitch scan with the largest value in the column-type scanning parameter, x3 is a horizontal coordinate of the second coordinate data, and x4 is another horizontal coordinate of the second coordinate data, wherein the laser point where x3 is located and the laser point where x4 is located are in the same column of the scanning path.

5. A device for adaptively correcting scanning distortion of a MEMS mirror, characterized in that: include: An initial linear scanning module is configured to control the MEMS mirror to perform a linear scan on the plane to be collected according to pre-loaded linear scanning parameters; wherein the MEMS mirror projects a laser point to the plane to be collected when performing the linear scan; A scanning path acquisition module, configured to acquire a scanning path of the MEMS mirror for performing a row-by-row scanning according to a laser point projected on the plane to be acquired; wherein the scanning path is composed of a plurality of laser points; A rectangular coordinate system establishing module, configured to establish a rectangular coordinate system for the scanning path; A distortion amount acquisition module, configured to calculate a horizontal distortion amount of the scanning path in a horizontal direction and a vertical distortion amount of the scanning path in a vertical direction according to coordinate data of each laser point in the scanning path in the rectangular coordinate system; A correction matrix scanning module, configured to perform correction processing on the matrix scanning parameters of the MEMS mirror based on the horizontal distortion amount and the vertical distortion amount, so that the MEMS mirror performs matrix scanning on the plane to be collected based on the matrix scanning parameters after correction processing; The distortion amount acquisition module is further configured as follows: Extracting first coordinate data of the laser points on the scanning path in the same row, and extracting second coordinate data of the laser points on the scanning path in the same column; Calculate the vertical distortion amount in the vertical direction according to the longitudinal coordinate in the first coordinate data; Calculate the horizontal distortion amount in the horizontal direction according to the abscissa in the second coordinate data; The correction column scanning module is further configured as follows: Correcting the pitch scanning angle in the determinant scanning parameter based on the vertical distortion amount in the vertical direction to obtain a corrected pitch scanning angle; Correcting the horizontal scanning angle in the determinant scanning parameter based on the horizontal distortion amount in the horizontal direction to obtain a corrected horizontal scanning angle; Controlling the MEMS mirror to perform a matrix scan on a plane to be collected based on the corrected pitch scanning angle and the corrected horizontal scanning angle; The corrected pitch scan angle is calculated using the following formula: Among them, β' A is the corrected pitch scanning angle of scanning point A in the determinant scanning parameter, α A is the horizontal scanning angle of scanning point A in the determinant scanning parameter, α max is the horizontal scanning angle with the largest value among the determinant scanning parameters, β A is the pitch scanning angle of scanning point A in the determinant scanning parameter, β A is the pitch scanning angle of the scanning point A in the matrix scanning parameter, y2 is the ordinate of the first coordinate data, and y1 is another ordinate of the first coordinate data; wherein the laser point where y2 is located and the laser point where y1 is located are in the same row of the scanning path; wherein the two first key points where y2 and y1 are located are in the same row of the scanning path, and the difference in the ordinates between the two first key points where y2 and y1 are located is the largest.

6. A system for adaptive correction of MEMS mirror scanning distortion, characterized in that: include: Memory for storing computer programs; A processor, configured to execute the computer program to implement the method according to any one of claims 1 to 4.

7. A readable storage medium, characterized in that: The readable storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the method according to any one of claims 1 to 4.

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