A large flow ball suction mechanism for BGA ball planting

Abstract

The present application discloses a high-flow ball suction mechanism for BGA ball planting, which relates to the field of BGA packaging technology. The mechanism includes a cavity forming component, an air path component, a buffer component, and a vacuum control component. The cavity forming component includes a lower support plate and an upper cover plate arranged on the lower support plate. The inner side wall of the upper cover plate and the top of the lower support plate together form a receiving cavity. The bottom of the lower support plate is provided with ball suction holes corresponding to the circuit pins of the substrate. The air path component is connected to the top of the upper cover plate. The buffer component is located at the end of the air path component away from the receiving cavity. The vacuum control component is responsible for connecting or disconnecting the vacuum. When connected, air is sucked from the receiving cavity through the air path component and the buffer component, thereby adsorbing the solder balls at the ball suction holes. The present application provides an adjustment space by constructing a receiving cavity and uses a buffer component to buffer the airflow during high-flow ball suction. While maintaining a high level of flow control, it can significantly increase the flow of the ball suction mechanism and improve the stability of solder ball adsorption.

Description

Technical Field

[0001] The present application relates to the field of BGA packaging technology, and in particular to a high-flow ball suction mechanism for BGA ball planting. Background Art

[0002] The integration of silicon single chips continues to increase, the requirements for integrated circuit packaging are more stringent, the number of I / O pins increases sharply, and power consumption also increases accordingly.

[0003] BGA packaging, or ball grid array packaging, uses an array of solder balls on the bottom of the package substrate as the I / O terminals for interconnection with the printed circuit board (PCB). Arranging the pins in a grid-like pattern and using solder balls as both the pins and solder joints can double or triple the memory capacity without changing the size. Compared to traditional packaging methods like TSOP, BGA offers a smaller footprint, better heat dissipation, and better electrical performance, making it the optimal packaging option for VLSI chips such as CPUs and north and south bridges.

[0004] The core of BGA packaging is BGA ball placement. A key step in BGA ball placement is to align the solder balls with the circuit pins on a substrate that has been printed with solder paste or flux. In related technologies, a suction device attracts the solder balls to the tapered holes on a solder desoldering seat. The release of suction pressure releases the solder balls onto the substrate, which has already been printed with solder paste or flux.

[0005] With respect to the above-mentioned related technologies, the inventors found that the roundness of solder balls may vary, resulting in gaps between some solder balls and the tapered holes during ball suction, causing vibration, displacement, and even falling during the process. Summary of the Invention

[0006] In order to improve the stability of solder ball adsorption during BGA ball planting and improve the quality of finished substrates, the present application provides a large-flow ball suction mechanism for BGA ball planting.

[0007] The present application provides a high-flow ball suction mechanism for BGA ball planting that adopts the following technical solutions:

[0008] A high-flow ball suction mechanism for BGA ball planting includes a cavity forming component, an air circuit component, a buffer component and a vacuum control component. The cavity forming component includes a lower support plate and an upper cover plate arranged on the lower support plate. The inner side wall of the upper cover plate and the top of the lower support plate jointly form an accommodating cavity. The bottom of the lower support plate is provided with ball suction holes corresponding one-to-one to the substrate circuit pins. The air circuit component is connected to the top of the upper cover plate. The buffer component is located at the end of the air circuit component away from the accommodating cavity. The vacuum control component is responsible for connecting or disconnecting the vacuum. When connected, air is sucked from the accommodating cavity through the air circuit component and the buffer component, thereby adsorbing the solder balls at the ball suction holes.

[0009] By adopting the above technical solution, when working, the vacuum control component is turned on, and the vacuum control component sucks air from the accommodating chamber through the air path component and the buffer component, forming a negative pressure environment in the accommodating chamber, thereby adsorbing the solder balls on the ball-absorbing holes of the lower support plate; the accommodating chamber is constructed to provide an adjustment space; a buffer component is set at the end of the air path component away from the accommodating chamber to buffer the airflow during large-flow ball absorption, thereby being able to significantly increase the flow of the ball absorption mechanism while maintaining a high level of flow control, thereby improving the stability of the ball absorption mechanism in adsorbing solder balls and improving the quality of the finished substrate.

[0010] Optionally, the air path assembly includes an air intake pipe connected to the top of the accommodating cavity and a buffer tank arranged at one end of the air intake pipe away from the accommodating cavity, and the buffer assembly is located at the buffer tank.

[0011] By adopting the above technical solution, the air path assembly includes an air intake pipe and a buffer tank. The buffer tank can provide a larger space, reducing the direct impact of the buffer assembly on the air intake pipe, thereby further increasing the air intake flow of the mechanism.

[0012] Optionally, two groups of air circuit components are provided, and the two groups of air circuit components are respectively arranged at the two ends of the top of the upper cover plate. The buffer assembly includes a buffer tube and a buffer valve. The two ends of the buffer tube are respectively connected to the two buffer tanks, and the buffer valve is connected to the middle of the buffer tube.

[0013] By adopting the above technical solution, a group of air path components are provided at both ends of the top of the upper cover plate to increase the ball suction flow rate and uniformly distribute the suction force at each ball suction hole. The buffer tube and the buffer valve are used to buffer and adjust the connection between the buffer tank and the buffer tube, so as to facilitate precise control of the ball suction flow rate.

[0014] Optionally, a light board is provided in the accommodating cavity, and a perspective detection light is provided on a side of the light board facing the ball-absorbing plate, and the perspective detection lights correspond one-to-one to the ball-absorbing holes.

[0015] By adopting the above technical solution, the perspective detection lights correspond to the ball-absorbing holes one by one, and the light transmission is used to detect whether the solder balls are adsorbed in the ball-absorbing holes. When all the solder balls are adsorbed in the ball-absorbing holes, the next step of operation is carried out, making the design more comprehensive and improving the quality of the finished substrate.

[0016] Optionally, a pressing component acting on the lamp board is provided on the top of the cavity forming component.

[0017] By adopting the above technical solution, the lamp board is accommodated in the accommodating cavity. When the flow rate of the ball suction mechanism is large, the lamp board will rise under the action of the airflow and collide with the upper cover plate. The pressing component is used to press down and position the lamp board to protect it. At the same time, it can also prevent the lamp board from moving up to block the connection between the accommodating cavity and the air path component, thereby increasing the upper limit of the flow rate of the ball suction mechanism as much as possible.

[0018] Optionally, the lower support plate includes a docking plate frame and a ball suction plate, the top of the docking plate frame docks with the bottom edge of the upper cover plate, the bottom of the docking plate frame is detachably connected to the ball suction plate, and the ball suction hole is opened on the ball suction plate.

[0019] By adopting the above technical solution, the lower support plate is divided into a docking plate frame and a ball suction plate. The ball suction plate is detachably connected to the bottom of the docking plate frame. On the one hand, it is convenient to replace ball suction plates of different models and improve the adaptability of the device. On the other hand, it minimizes the impact of replacing the ball suction plate on the accommodation of the light panel, making the design more reasonable.

[0020] Optionally, the upper cover plate is detachably connected to the top of the docking plate frame.

[0021] By adopting the above technical solution, the lamp board in the accommodating cavity can be inspected and replaced.

[0022] Optionally, a lifting frame for connecting a lifting mechanism is provided on the outer wall of the upper cover plate.

[0023] By adopting the above technical solution, the lifting mechanism is connected with the lifting frame, which in turn drives the ball suction mechanism to move up and down, actively connects the ball laying mechanism and the ball planting mechanism, and improves the degree of automation of the device.

[0024] Optionally, the ball-absorbing hole is hemispherical, and a through hole connecting the ball-absorbing hole to the accommodating cavity is provided in the middle of the hemispherical surface of the ball-absorbing hole.

[0025] By adopting the above technical solution, the shape of the ball suction hole is improved, the contact area between the inner wall of the ball suction hole and the solder ball is increased, and the stability of the ball suction process is improved.

[0026] In summary, this application includes at least one of the following beneficial technical effects:

[0027] 1. During operation, the vacuum control assembly is turned on, and the vacuum control assembly draws air from the accommodating chamber through the air path assembly and the buffer assembly, forming a negative pressure environment in the accommodating chamber, thereby adsorbing the solder balls to the ball-adsorbing holes of the lower support plate; the accommodating chamber is constructed to provide adjustment space; a buffer assembly is set at the end of the air path assembly away from the accommodating chamber to buffer the airflow during high-flow ball adsorption. This can significantly increase the flow rate of the ball-adsorbing mechanism while maintaining a high level of flow control, thereby improving the stability of the ball-adsorbing mechanism in adsorbing solder balls and improving the quality of the finished substrate;

[0028] 2. By installing a set of air path components at both ends of the top of the upper cover plate, the ball suction flow rate is increased and the suction force at each ball suction hole is uniform. The buffer tube and buffer valve are used to buffer and adjust the connection between the buffer tank and the buffer tube, facilitating the precise control of the ball suction flow rate.

[0029] 3. When the flow rate of the ball suction mechanism is large, the lamp panel will rise under the action of the airflow and collide with the upper cover plate. The pressing component is used to press down and position the lamp panel to protect it. At the same time, it can also prevent the lamp panel from moving up and blocking the connection between the accommodating cavity and the air path component, thereby increasing the flow limit of the ball suction mechanism as much as possible. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0031] Figure 2 This is a schematic diagram showing the ball-absorbing plate and ball-absorbing hole structure in an embodiment of the present application.

[0032] Figure 3 This is a partial exploded schematic diagram showing the structure of the cavity forming component in the embodiment of the present application;

[0033] Figure 4 This is a schematic diagram showing the structure of the gas circuit assembly and the buffer assembly in the embodiment of the present application;

[0034] Figure 5 This is a schematic diagram showing the structure of the gas circuit assembly and the buffer assembly from another angle in the embodiment of the present application;

[0035] Figure 6 This is a schematic diagram showing the structure of the light board and the pressing assembly in the embodiment of the present application;

[0036] Figure numerals: 1. Cavity forming assembly; 11. Upper cover plate; 12. Lower support plate; 121. Docking plate frame; 122. Ball suction plate; 2. Air path assembly; 21. Suction pipe; 22. Buffer tank; 3. Buffer assembly; 31. Buffer pipe; 32. Buffer valve; 4. Vacuum control assembly; 41. Valve electrical box; 42. Valve body; 5. Accommodating chamber; 6. Ball suction hole; 7. Light board; 8. X-ray detection light; 9. Pressing assembly; 91. Telescopic cylinder; 10. Buckle; 13. Assembly plate; 14. Lifting frame; 15. Pipe mounting hole. DETAILED DESCRIPTION

[0037] The following is combined with Figure 1-6 This application is described in further detail.

[0038] The embodiment of the present application discloses a high-flow ball suction mechanism for BGA ball planting.

[0039] Reference Figure 1 A high-flow ball suction mechanism for BGA ball planting includes a cavity component 1 fixed on a ball planting machine, and air path components 2 are provided at both ends of the top of the cavity component 1. The air path component 2 is connected to the cavity component 1, and a vacuum control component 4 responsible for connecting or disconnecting the vacuum is provided at the end of the air path component 2 away from the cavity component 1. A buffer component 3 for buffering the suction airflow is also provided at the end of the air path component 2 away from the cavity component 1.

[0040] Reference Figure 2 and Figure 3 The cavity forming assembly 1 includes an upper cover plate 11 and a lower support plate 12. The lower support plate 12 includes a docking plate frame 121 and a ball suction plate 122. The top of the docking plate frame 121 docks with the bottom edge of the upper cover plate 11, and the bottom of the docking plate frame 121 docks with the ball suction plate 122. A groove is formed on the side of the upper cover plate 11 near the lower support plate 12. The inner side wall of the upper cover plate 11, the inner peripheral wall of the docking plate frame 121, and the top of the ball suction plate 122 together form a receiving chamber 5. The ball suction plate 122 is provided with ball suction holes 6, which correspond one-to-one with the circuit pins of the substrate. When the vacuum control assembly 4 is connected, the vacuum control assembly 4 draws air from the receiving chamber 5 through the air path assembly 2 and the buffer assembly 3, forming a negative pressure environment in the receiving chamber 5, thereby adsorbing the solder balls to the ball suction holes 6 of the lower support plate 12. The receiving chamber 5 provides an adjustment space to support the ball suction mechanism to perform a large-flow ball suction operation.

[0041] Ball-receiving hole 6 is hemispherical, and the through-hole connecting it to the accommodating chamber 5 is located in the middle of the hemispherical surface of ball-receiving hole 6. Compared to the linear contact of a conical hole, this increases the contact area between the inner wall of ball-receiving hole 6 and the solder ball, improving the stability of the ball-receiving process. Ball-receiving plate 122 is detachably connected to the bottom of docking plate frame 121 via bolts, facilitating the replacement of different models of ball-receiving plates 122 and enhancing the adaptability of the device.

[0042] Reference Figure 3 and Figure 4 There are two groups of air path components 2, and the two groups of air path components 2 are respectively connected to the two ends of the top of the upper cover plate 11, which can increase the ball suction flow rate and uniform the suction force at each ball suction hole 6. The air path component 2 includes an air intake pipe 21 and a buffer tank 22. The top of the upper cover plate 11 is integrally formed with a pipe hole 15, and the air intake pipe 21 is connected to the top of the upper cover plate 11 by flange connection or welding. The buffer tank 22 is connected to the end of the air intake pipe 21 away from the accommodating cavity 5 in the same way. The buffer tank 22 is used to provide a larger space to reduce the direct impact of the buffer component 3 on the air intake pipe 21, so as to support further increase in the air intake flow of the mechanism.

[0043] Reference Figure 3 and Figure 5 The buffer assembly 3 is located in the buffer tank 22. The buffer assembly 3 includes a buffer pipe 31 and a buffer valve 32. The ends of the buffer pipe 31 are connected to the two buffer tanks 22, respectively, and the buffer valve 32 is connected to the middle of the buffer pipe 31. The buffer pipe 31 and the buffer valve 32 cooperate to slowly open the connection between the buffer tank 22 and the buffer pipe 31, thereby slowly increasing the ball suction flow rate and improving the stability of the mechanism. The connection between the buffer tank 22 and the buffer pipe 31 is buffered and adjusted, facilitating precise control of the ball suction flow rate.

[0044] The vacuum control assembly 4 is a vacuum control solenoid valve, which includes a valve electrical box 41 and a valve body 42. When sucking balls, the vacuum is turned on by the vacuum control solenoid valve, and air is sucked from the accommodating chamber 5 through the air path assembly 2 and the buffer assembly 3, forming a negative pressure environment in the accommodating chamber 5, thereby adsorbing the solder balls to the ball-absorbing hole 6 of the lower support plate 12. The vacuum is then disconnected by the vacuum control solenoid valve, and the suction force is removed, allowing the solder balls to fall from the ball-absorbing hole 6 to the substrate on the ball-planting mechanism. The accommodating chamber 5 provides an adjustable space, and the buffer assembly 3 is used to buffer the airflow during high-flow ball suction. This can significantly increase the flow rate of the ball-absorbing mechanism while maintaining a high level of flow control, improve the stability of the ball-absorbing mechanism in adsorbing solder balls, alleviate the problem of solder ball displacement and falling, and improve the quality of the finished substrate.

[0045] Reference Figure 3 and Figure 6 A lifting frame 14 for connecting the lifting mechanism is fixed on the outer wall of the upper cover plate 11 by bolts. Thanks to the increase in the solder ball flow rate of the suction mechanism and the improvement in the ball suction stability, the lifting mechanism is connected by the lifting frame 14, which in turn drives the lifting and lowering displacement of the ball suction mechanism, actively connecting the ball laying mechanism and the ball planting mechanism, thereby improving the degree of automation of the device and improving production efficiency.

[0046] Further, refer to Figure 3 and Figure 6The accommodating cavity 5 contains a lamp board 7, and a perspective detection lamp 8 is provided on the side of the lamp board 7 facing the ball-absorbing plate 122. The perspective detection lamp 8 corresponds to the ball-absorbing holes 6 one by one, and detects whether the solder balls are adsorbed in the ball-absorbing holes 6 by the light transmission. When all the solder balls are adsorbed in the ball-absorbing holes 6, the next step of operation is carried out to improve the quality of the finished substrate.

[0047] Guide posts and guide sleeves are provided between the upper cover plate 11 and the docking plate frame 121. These cooperate to allow the upper cover plate 11 to be removably connected to the top of the docking plate frame 121, facilitating inspection and replacement of the lamp board 7 within the accommodating chamber 5 while minimizing the impact of replacing the ball-absorbing plate 122 on the accommodation of the lamp board 7. A buckle 10 is provided between the upper cover plate 11 and the lower support plate 12 to enhance the connection stability between the upper cover plate 11 and the lower support plate 12 when they are closed, thereby better sealing the accommodating chamber 5 and enclosing the lamp board 7, making the design more comprehensive.

[0048] The lamp panel 7 is accommodated in the accommodating chamber 5. When the flow rate of the ball suction mechanism is large, the lamp panel 7 will rise under the action of the airflow and collide with the upper cover plate 11. A pressing component 9 acting on the lamp panel 7 is provided on the top of the upper cover plate 11. An assembly plate 13 is provided at the end of the lifting frame 14. The top of the upper cover plate 11 is fixed to the near-ground side of the assembly plate 13 by bolts. The pressing component 9 includes a telescopic cylinder 91 fixed to the far-ground side of the assembly plate 13 by bolts. The piston rod of the telescopic cylinder 91 passes through the assembly plate 13 and acts on the lamp panel 7, which can press down to position the lamp panel 7, making the perspective detection result more accurate, and improving the problem that the lamp panel 7 moves up under the action of large-flow airflow to block the connection between the accommodating chamber 5 and the suction pipe 21, so as to increase the flow upper limit of the ball suction mechanism as much as possible and make the design more perfect.

[0049] The implementation principle of a large-flow ball suction mechanism for BGA ball planting in the embodiment of the present application is as follows: through the coordinated arrangement of the cavity forming component 1, the air path component 2, the buffer component 3 and the vacuum control component 4, when sucking the ball, the vacuum is turned on by the vacuum control component 4, and air is sucked from the accommodating cavity 5 through the air path component 2 and the buffer component 3, forming a negative pressure environment in the accommodating cavity 5, thereby adsorbing the solder ball on the ball suction hole 6 of the lower support plate 12; when the vacuum is disconnected and the suction force is removed, the solder ball can fall from the ball suction hole 6 to the substrate on the ball planting mechanism.

[0050] The accommodating chamber 5 constructed using the cavity forming assembly 1 provides an adjustment space; the buffer tank 22 in the air path assembly 2 provides a larger space to buffer the airflow during high-flow ball suction, reducing the direct impact of the buffer assembly 3 on the suction pipe 21, thereby supporting a further increase in the mechanism's suction flow. The buffer assembly 3 is set at the buffer tank 22. Through the cooperation of the buffer pipe 31 and the buffer valve 32, the connection between the buffer tank 22 and the buffer pipe 31 is slowly opened, facilitating the precise control of the ball suction flow. This can significantly increase the flow of the ball suction mechanism while taking into account the requirements of operational stability, improve the stability of the mechanism in adsorbing solder balls, alleviate the problems of solder ball displacement and falling, and improve the quality of the finished substrate.

[0051] A light board 7 equipped with a transparent inspection light 8 is installed within the accommodating chamber. The light transmitted through it detects whether solder balls are properly adsorbed into the ball-receiving holes 6. When all the balls are properly adsorbed into the ball-receiving holes 6, the next step is performed, thereby improving the quality of the finished substrate. The accommodating chamber comprises a removable upper cover plate 11, a docking frame 121, and a ball-receiving plate 122. This allows for easy inspection and replacement of the light board 7 within the accommodating chamber 5, as well as the remodeling of the ball-receiving plate 122, further improving the design.

[0052] Benefiting from the improvement of solder ball flow rate of the suction mechanism and the improvement of ball suction stability, a lifting frame 14 is set on the outer wall of the upper cover plate 11, and the lifting frame 14 is used to connect the lifting mechanism, thereby driving the lifting and displacement of the ball suction mechanism, actively connecting the ball laying mechanism and the ball planting mechanism, making the design more comprehensive.

[0053] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A high-flow ball suction mechanism for BGA ball planting, characterized by: The invention comprises a cavity forming component (1), an air circuit component (2), a buffer component (3) and a vacuum control component (4), wherein the cavity forming component (1) comprises a lower support plate (12) and an upper cover plate (11) arranged on the lower support plate (12), the inner side wall of the upper cover plate (11) and the top of the lower support plate (12) jointly form a receiving cavity (5), the bottom of the lower support plate (12) is provided with ball suction holes (6) corresponding to the circuit pins of the substrate, the air circuit component (2) is connected to the top of the upper cover plate (11), the buffer component (3) is located at the end of the air circuit component (2) away from the receiving cavity (5), and the vacuum control component (4) is responsible for connecting or disconnecting the vacuum, and when connected, air is sucked from the receiving cavity (5) through the air circuit component (2) and the buffer component (3), thereby adsorbing the solder balls at the ball suction holes (6); The air path assembly (2) comprises an air intake pipe (21) connected to the top of the accommodating chamber (5) and a buffer tank (22) arranged at one end of the air intake pipe (21) away from the accommodating chamber (5), and the buffer assembly (3) is located at the buffer tank (22); The gas circuit assembly (2) is provided with two groups, and the two groups of gas circuit assemblies (2) are respectively arranged at the two ends of the top of the upper cover plate (11); the buffer assembly (3) includes a buffer tube (31) and a buffer valve (32); the two ends of the buffer tube (31) are respectively connected to the two buffer tanks (22); the buffer valve (32) is connected to the middle of the buffer tube (31); A light board (7) is provided in the accommodating cavity (5), and a perspective detection light (8) is provided on the side of the light board (7) facing the lower supporting plate (12), and the perspective detection light (8) corresponds one-to-one with the ball-absorbing holes (6); a pressing component (9) acting on the light board (7) is provided on the top of the cavity forming component (1).

2. The high-flow ball suction mechanism for BGA ball planting according to claim 1, characterized in that: The lower supporting plate (12) comprises a docking plate frame (121) and a ball absorbing plate (122); the top of the docking plate frame (121) docks with the bottom edge of the upper cover plate (11); the bottom of the docking plate frame (121) is detachably connected to the ball absorbing plate (122); and the ball absorbing hole (6) is provided on the ball absorbing plate (122).

3. The high-flow ball suction mechanism for BGA ball planting according to claim 2, characterized in that: The upper cover plate (11) is detachably connected to the top of the docking plate frame (121).

4. The high-flow ball suction mechanism for BGA ball planting according to claim 1, characterized in that: A lifting frame (14) for connecting a lifting mechanism is provided on the outer wall of the upper cover plate (11).

5. The high-flow ball suction mechanism for BGA ball planting according to claim 1, characterized in that: The ball-absorbing hole (6) is hemispherical, and a through hole connecting the ball-absorbing hole (6) to the accommodating cavity (5) is provided in the middle of the hemispherical surface of the ball-absorbing hole (6).

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