Silicon wafer transfer mechanism and photovoltaic cell production system

Abstract

The present invention relates to a silicon wafer transfer mechanism and a photovoltaic cell production system, which can be surrounded by a cover plate, a first side plate and a second side plate to form a protective cavity, thereby shielding a conveyor belt in the protective cavity, preventing the conveyor belt from being exposed to the air, and preventing particulate impurities in the air from being adsorbed on the conveyor belt, ensuring that the silicon wafer will not be contaminated by particulate impurities when being transferred on the conveyor belt, and ensuring the yield of products produced by subsequent processes. Moreover, there is no need to stop the machine for cleaning, which can effectively improve production capacity and work efficiency.

Description

Technical Field

[0001] The present invention relates to the field of photovoltaic technology, and in particular to a silicon wafer transport mechanism and a photovoltaic cell production system. Background Art

[0002] As the core component of photovoltaic cells, the quality of silicon wafers directly affects the performance of photovoltaic cells. During the production process, silicon wafers need to be transported using components such as conveyor belts. Since conveyor belts easily absorb particulate impurities in the air, silicon wafers are easily contaminated during transportation, resulting in a decrease in product yield. Summary of the invention

[0003] Based on this, it is necessary to provide a silicon wafer transfer mechanism and a photovoltaic cell production system to address the problem of decreased product yield.

[0004] The technical solution is as follows:

[0005] In one aspect, a silicon wafer transport mechanism is provided, comprising:

[0006] Conveyor belts;

[0007] a first side plate, the first side plate being arranged on one side of the conveyor belt;

[0008] A second side plate, the second side plate is disposed on the other side of the conveyor belt; and

[0009] A cover plate is disposed above the conveyor belt, and the cover plate, the first side plate and the second side plate can be enclosed to form a protective cavity.

[0010] The technical solution is further described below:

[0011] In one of the embodiments, the silicon wafer transport mechanism further includes a removal element for removing particulate impurities, and the removal element is disposed in the protective cavity.

[0012] In one embodiment, the removal element includes at least one of an ion fan and a vacuum adsorber.

[0013] In one of the embodiments, the silicon wafer transfer mechanism further includes a temperature control component, and the temperature control component is disposed in the protective cavity to remove water vapor in the protective cavity.

[0014] In one embodiment, the silicon wafer transfer mechanism further includes a first transmission assembly, which is in transmission connection with the cover plate, so that the cover plate can move relative to the first side plate and the second side plate to open or close the protective cavity.

[0015] In one embodiment, the silicon wafer transfer mechanism also includes a second transmission assembly, and at least one of the first side plate and the second side plate is transmission-connected to the second transmission assembly, so that at least one of the first side plate and the second side plate can move up and down relative to the conveyor belt.

[0016] In one embodiment, the silicon wafer transfer mechanism further includes a suction nozzle and a closing component having a closing cavity, wherein the closing component can move relative to the suction nozzle so that the suction nozzle can be disposed in the closing cavity or the suction nozzle can be separated from the closing component.

[0017] In one embodiment, the closing component includes two closing sleeves arranged opposite to each other, each of the closing sleeves is provided with a cavity, and the silicon wafer transfer mechanism also includes a third transmission component, and the third transmission component is transmission-connected to the two closing sleeves, so that the two closing sleeves can be sleeved on the outside of the suction nozzle to form the closed cavity.

[0018] In one of the embodiments, the silicon wafer transfer mechanism further includes a protective gas source, the closed component is provided with a connecting cavity connected to the closed cavity, and the protective gas source is connected to the closed cavity through the connecting cavity.

[0019] On the other hand, a photovoltaic cell production system is provided, comprising the photovoltaic cell production system.

[0020] The silicon wafer transfer mechanism and photovoltaic cell production system of the above-mentioned embodiment can be surrounded by a protective cavity using the cover plate, the first side plate and the second side plate, so as to shield the conveyor belt in the protective cavity, prevent the conveyor belt from being exposed to the air, and prevent particulate impurities in the air from being adsorbed on the conveyor belt, thereby ensuring that the silicon wafer will not be contaminated by particulate impurities when being transferred on the conveyor belt, and ensuring the yield of the products produced by the subsequent process. Moreover, there is no need to stop the machine for cleaning, which can effectively improve production capacity and work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 A schematic diagram of the structure of a silicon wafer transport mechanism according to an embodiment;

[0024] Figure 2 for Figure 1 A schematic structural diagram of a first side plate and a cover plate of a silicon wafer transport mechanism;

[0025] Figure 3 for Figure 1 Schematic diagram of the structure of the closed component of the silicon wafer transfer mechanism.

[0026] Description of reference numerals:

[0027] 100, first side panel; 200, second side panel; 300, cover panel; 400, protective cavity; 500, removal element; 600, temperature control component; 700, suction nozzle; 800, closing component; 810, closing cavity; 820, closing sleeve; 821, cavity. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0029] In one embodiment, a photovoltaic cell production system is provided, including a silicon wafer transfer mechanism. Thus, during the production of photovoltaic cells, the silicon wafer transfer mechanism can be used to transfer silicon wafers between different processes, ensuring that the silicon wafers will not be contaminated during the transfer process, thereby ensuring the yield of the product.

[0030] like Figure 1 and Figure 2 As shown, specifically, the silicon wafer transport mechanism includes a conveyor belt (not shown), a first side plate 100 , a second side plate 200 and a cover plate 300 .

[0031] The conveyor belt may be in the form of a belt, and the silicon wafer is placed on the belt. The silicon wafer can be transported to a predetermined position by the operation of the belt to facilitate the transportation of the silicon wafer.

[0032] It is understandable that the operation of the belt can be driven by rollers, drums and other components, and no limitation is made here. In addition, in actual use, in order to meet the transmission needs, the conveyor belt can also be supported by a support structure such as a support frame, so that the conveyor belt can support the silicon wafer.

[0033] In addition, in order to ensure that the conveyor belt can transport the silicon wafer to the predetermined position, the position information of the silicon wafer can be detected and collected with the help of position sensors, CCD (charge coupled device) cameras and other components to ensure the accuracy of the silicon wafer transmission.

[0034] The first side plate 100 , the second side plate 200 and the cover plate 300 may all be made of lightweight materials that are not prone to adsorbing particulate impurities.

[0035] like Figure 1 As shown, the first side plate 100 is arranged on one side of the conveyor belt and the second side plate 200 is arranged on the other side of the conveyor belt, that is, the first side plate 100 and the second side plate 200 are respectively located on two opposite sides of the conveyor belt.

[0036] For example, the first side plate 100 is located on the left side of the conveyor belt, and the second side plate 200 is located on the right side of the conveyor belt.

[0037] The cover plate 300 is disposed above the conveyor belt. Furthermore, the cover plate 300, the first side plate 100 and the second side plate 200 can be used to enclose a protective cavity 400, thereby shielding the conveyor belt in the protective cavity 400, preventing the conveyor belt from being exposed to the air, and preventing particulate impurities in the air from being adsorbed on the conveyor belt, thereby ensuring that the silicon wafers will not be contaminated by particulate impurities when being transported on the conveyor belt, and ensuring the yield of the products produced by the subsequent process. Moreover, there is no need to stop the machine for cleaning, which can effectively improve production capacity and work efficiency.

[0038] In addition, during the operation of the conveyor belt, the conveyor belt rubs against the motor and other driving components, thus generating debris, which is also easily adsorbed on the conveyor belt. In addition, during the idling of the carrier plate, the dust generated during the magnetron sputtering process is also easy to fall on the conveyor belt.

[0039] like Figure 2 As shown, optionally, the silicon wafer transport mechanism further includes a removal element 500 for removing particle impurities. The removal element 500 is disposed in the protection cavity 400. In this way, the removal element 500 can be used to remove the particle impurities in the protection cavity 400, which can more effectively prevent the silicon wafer from being contaminated when it contacts the conveyor belt.

[0040] Specifically, the removal element 500 can be used to effectively remove debris generated by friction and dust generated during magnetron sputtering, thereby preventing them from being adsorbed on the conveyor belt and causing contamination to the silicon wafer.

[0041] The removal element 500 may be at least one of an ion fan and a vacuum adsorber.

[0042] Specifically, when the removal element 500 is an ion fan, the ion fan can be fixed to any part of the first side plate 100, the second side plate 200 or the cover plate 300 by plugging, screwing, etc., and the static electricity on the surface of the conveyor belt can be eliminated and neutralized by the ion fan, thereby suppressing static electricity adsorption, thereby removing the particle impurities on the conveyor belt and preventing the silicon wafer from being contaminated. In addition, the ion fan can also purge the particle impurities on the conveyor belt to prevent the particle impurities from adhering to the conveyor belt.

[0043] Specifically, when the removal element 500 is a vacuum adsorber, the vacuum adsorber can be fixed to any part of the first side plate 100, the second side plate 200 or the cover plate 300 by means of plugging, screwing, etc., and the particulate impurities in the protective cavity 400 can be sucked out by vacuuming to achieve the effect of removing the particulate impurities on the conveyor belt, thereby protecting the silicon wafer from contamination.

[0044] Of course, you can also use the ion fan together with the vacuum adsorber to achieve better removal of particulate impurities.

[0045] In addition, the conveyor belt is also prone to adsorbing water vapor in the air, which can also cause pollution to the conveyor belt. The cover plate 300, the first side plate 100 and the second side plate 200 can be used to enclose a protective cavity 400, thereby shielding the conveyor belt in the protective cavity 400 to prevent the conveyor belt from being exposed to the air, and to prevent water vapor in the air from being adsorbed on the conveyor belt, thereby ensuring that the silicon wafers will not be contaminated when being transported on the conveyor belt, and ensuring the yield of the products produced by the subsequent process.

[0046] like Figure 2 As shown, further, the silicon wafer transport mechanism also includes a temperature control component 600. The temperature control component 600 is disposed in the protective cavity 400 to remove the water vapor in the protective cavity 400. In this way, the temperature control component 600 is used to adjust the temperature in the protective cavity 400 to remove the water vapor in the protective cavity 400, thereby preventing the water vapor from being adsorbed on the conveyor belt, and ensuring that the silicon wafer is not contaminated by the water vapor when being transported on the conveyor belt. Of course, the temperature control component 600 adjusts the temperature in the protective cavity 400, and can also prevent the temperature difference between the conveyor belt and the outside world from being too large to generate condensed water.

[0047] The temperature control component 600 may be any element capable of heating the protection cavity 400 to remove water vapor in the protection cavity 400 .

[0048] Specifically in the embodiment of the present application, the temperature control component 600 includes a heating wire, a controller and a temperature sensor. The heating wire is fixed at any position of the cover plate 300, the first side plate 100 and the second side plate 200 in the form of a snap-in or plug-in connection and is located in the protective cavity 400. The temperature sensor is fixed at any position of the cover plate 300, the first side plate 100 and the second side plate 200 in the form of a snap-in or plug-in connection and is located in the protective cavity 400. The heating wire and the temperature sensor are both electrically connected to the controller. In this way, the temperature sensor is used to detect the air temperature in the protective cavity 400 and transmit the detected temperature information to the controller. When the controller detects that the air temperature in the protective cavity 400 deviates from the preset temperature value, the heating wire can be started or turned off, so that the air temperature in the protective cavity 400 is at the preset temperature value, which can effectively remove water vapor and prevent water vapor from being adsorbed on the conveyor belt.

[0049] The preset temperature value may be a specific temperature value or a temperature range, and may be flexibly adjusted or designed according to actual use needs. For example, the preset temperature value may be 20°C to 40°C.

[0050] The controller may be a device with control function such as a single chip microcomputer and a circuit board.

[0051] The removal element 500 and the temperature control component 600 may be used separately or simultaneously, and may be flexibly adjusted or selected according to actual use needs.

[0052] In actual use, when the silicon wafer is transferred to a predetermined position on the conveyor belt, it is also necessary to transfer the silicon wafer to the next process for processing and production. Therefore, it is necessary to ensure that the silicon wafer can be transferred normally without causing interference.

[0053] Optionally, the silicon wafer transfer mechanism further includes a first transmission assembly (not shown), wherein the first transmission assembly is in transmission connection with the cover plate 300, so that the first transmission assembly drives the cover plate 300 to move relative to the first side plate 100 and the second side plate 200, thereby opening or closing the protective cavity 400 at the cover plate 300.

[0054] Specifically, when the cover plate 300 is moved relative to the first side plate 100 and the second side plate 200 by the first transmission assembly to open the protective cavity 400, the top of the protective cavity 400 has a top opening, so that the silicon wafer can be taken out from the top opening to be transported to the next process for processing and production. After the silicon wafer is transported to the next subsequent process, the cover plate 300 is moved to the top opening by the first transmission assembly to close the protective cavity 400, so that particles and water vapor in the air can be prevented from entering the protective cavity 400.

[0055] Among them, the first transmission assembly drives the cover plate 300 to move relative to the first side plate 100 and the second side plate 200. It can be achieved by connecting rod drive or motor drive, as long as the cover plate 300 can open or close the protective cavity 400.

[0056] Specifically, in the embodiment of the present application, the first transmission assembly includes a servo motor and a transmission gear disposed on the rotation output end of the servo motor. The upper surface of the cover plate 300 is provided with a rack extending from the first side plate 100 to the second side plate 200, and the transmission gear is meshed with the rack. When the rotation output end of the servo motor rotates in a certain direction (clockwise or counterclockwise), the transmission gear is driven to rotate synchronously in the same direction, and the meshing of the transmission gear and the rack is utilized to move the cover plate 300 toward one side of the conveyor belt, thereby opening the top opening of the protective cavity 400. When the rotation output end of the servo motor rotates in the opposite direction of a certain direction (counterclockwise or clockwise), the transmission gear is driven to rotate synchronously in the same direction, and the meshing of the transmission gear and the rack is utilized to move the cover plate 300 toward the other side of the conveyor belt, thereby closing the top opening of the protective cavity 400.

[0057] Optionally, the wafer transfer mechanism further includes a second transmission assembly (not shown). At least one of the first side plate 100 and the second side plate 200 is in transmission connection with the second transmission assembly, so that the second transmission assembly drives at least one of the first side plate 100 and the second side plate 200 to move, thereby causing at least one of the first side plate 100 and the second side plate 200 to move up and down relative to the conveyor belt, so that the protective cavity 400 can be opened or closed from at least one side.

[0058] The following embodiments illustrate the working principle of the second transmission component by taking the example of the second transmission component driving the first side plate 100 to perform lifting motion relative to the conveyor belt. The principle of the second transmission component driving the second side plate 200 to perform lifting motion relative to the conveyor belt is the same and will not be repeated here.

[0059] Specifically, the first side plate 100 is disposed on the left side of the conveyor belt. When the first side plate 100 is moved relative to the conveyor belt to the left side of the open protection cavity 400 by the second transmission assembly, the left side of the protection cavity 400 has a left opening, so that the left side of the protection cavity 400 is open to avoid interference with the transmission and transportation of the silicon wafers. When the silicon wafers are transported, the first side plate 100 is moved to the left side opening by the second transmission assembly to close the protection cavity 400, so that the conveyor belt is prevented from being exposed to the air, thereby preventing particles and water vapor in the air from entering the protection cavity 400.

[0060] Among them, the second transmission component drives the first side plate 100 to move up and down relative to the conveyor belt. It can be achieved by driving a cylinder or a hydraulic cylinder, or by driving a motor, as long as the first side plate 100 can open or close the left opening.

[0061] Specifically in the embodiment of the present application, the second transmission assembly includes a lifting cylinder, and the lifting end of the lifting cylinder is connected to the first side plate 100 by means of a snap connection or a screw connection, so as to drive the first side plate 100 to move up and down relative to the conveyor belt to open or close the left opening.

[0062] Optionally, the removal element 500 can be set on the first side plate 100 and / or the second side plate 200, and the temperature control component 600 can be set on the cover plate 300. When the cover plate 300 moves to open the protective cavity 400, the removal element 500 can be used to remove particulate impurities entering the protective cavity 400 to avoid contamination during the transportation of silicon wafers.

[0063] When the silicon wafer is transferred to a predetermined position on the conveyor belt, the silicon wafer needs to be transferred to the next process for processing and production.

[0064] like Figure 1 As shown, optionally, the silicon wafer transfer mechanism further includes a suction nozzle 700. In this way, the suction nozzle 700 is used to absorb and pick up the silicon wafer, so that the silicon wafer can be flexibly and conveniently transferred to the next process.

[0065] The suction nozzle 700 may be disposed above the conveyor belt.

[0066] In actual use, the suction nozzle 700 is also prone to adsorbing particle impurities. When the suction nozzle 700 adsorbs and picks up the silicon wafer, there is also a risk of contaminating the silicon wafer.

[0067] like Figure 1 and Figure 3 As shown, in one embodiment, the silicon wafer transport mechanism further includes a sealing component 800 having a sealing cavity 810. The sealing component 800 can move relative to the suction nozzle 700, so that the sealing component 800 can be moved to place the suction nozzle 700 in the sealing cavity 810 to prevent external particles from being adsorbed on the suction nozzle 700; the sealing component 800 can also be moved to be separated from the suction nozzle 700, which will not affect the suction and picking up of the silicon wafer by the suction nozzle 700.

[0068] Furthermore, the silicon wafer transfer mechanism also includes a protective gas source (not shown). In addition, the closed component 800 is provided with a connecting cavity connected to the closed cavity 810, and the protective gas source is connected to the closed cavity 810 through the connecting cavity. In this way, after the closed component 800 is moved to make the suction nozzle 700 located in the closed cavity 810, the protective gas source can be used to pass the protective gas into the closed cavity 810 through the connecting cavity, so as to further protect the suction nozzle 700 and ensure that the suction nozzle 700 will not be attached with particulate impurities.

[0069] The shielding gas source may be a gas storage bottle or other components capable of containing shielding gas. The shielding gas may be nitrogen or other suitable inert gas.

[0070] Of course, the protective gas may also be introduced into the protective cavity 400 to protect the conveyor belt and ensure that no particle impurities adhere to the conveyor belt.

[0071] In addition, a corresponding removal element 500 and a temperature control assembly 600 may be disposed in the closed cavity 810, so as to further remove the particle impurities and prevent water vapor from being adsorbed on the suction nozzle 700, thereby further preventing the suction nozzle 700 from contaminating the silicon wafer. Furthermore, the outline and size of the closed cavity 810 may match the outline and size of the suction nozzle 700.

[0072] Among them, the closing component 800 can be an integral structure, that is, the closing component 800 is a separate component, and the closing component 800 is moved so that the suction nozzle 700 is inserted into the closing cavity 810 to achieve closed protection for the suction nozzle 700; the closing component 800 can also be a split structure, that is, the closing component 800 includes multiple components, and the closed cavity 810 is formed or separated from the suction nozzle 700 by bringing the multiple components together or apart.

[0073] like Figure 3 As shown, in the embodiment of the present application, the sealing assembly 800 includes two sealing sleeves 820 arranged opposite to each other. Each sealing sleeve 820 is provided with a cavity 821. Thus, when the two sealing sleeves 820 are close to each other, the two cavities 821 are connected to form a closed cavity 810.

[0074] Furthermore, the silicon wafer transfer mechanism also includes a third transmission component (not shown). Moreover, the third transmission component is transmission-connected with both the closed sleeves 820, so that the two closed sleeves 820 are driven to move closer to each other by the third transmission component, so that the two closed sleeves 820 are sleeved on the outside of the suction nozzle 700 and form a closed cavity 810, and then the suction nozzle 700 is located in the closed cavity 810. When the suction nozzle 700 needs to suck and pick up the silicon wafer, it only needs to use the third transmission component to drive the two closed sleeves 820 away from each other, so as to separate from the suction nozzle 700, and will not interfere with the normal operation of the suction nozzle 700.

[0075] The sealing sleeve 820 may be made of an elastic material, so that when the two sealing sleeves 820 are brought close to each other, they can fit together, be squeezed and deformed, thereby ensuring the sealing of the sealing cavity 810 .

[0076] Among them, the third transmission component drives the two sealing sleeves 820 to move closer to or away from each other, which can be achieved by motor drive or connecting rod drive. It only needs to ensure that the two sealing sleeves 820 form a closed cavity 810 when they move closer to each other and separate from the suction nozzle 700 when they separate.

[0077] Specifically, in the embodiment of the present application, the third transmission assembly includes two telescopic cylinders, and the two telescopic cylinders are arranged one by one with the two closed sleeves 820, and the telescopic ends of the telescopic cylinders are connected to the closed sleeves 820 by means of clamping or screwing. When the two telescopic cylinders are extended, the two closed sleeves 820 can be driven to move closer to each other and be sleeved on the outside of the suction nozzle 700 to form a closed cavity 810 for accommodating the suction nozzle 700, so as to prevent the suction nozzle 700 from contacting with particulate impurities in the air; when the two telescopic cylinders are retracted, the two closed sleeves 820 can be driven to move away from each other and separate from the suction nozzle 700. In addition, the third transmission assembly can also include rotating parts such as motors, and the rotation of rotating parts such as motors can also drive the closed sleeve 820 to rotate relative to the suction nozzle 700, so that the closed sleeve 820 can be further away from the suction nozzle 700 to avoid interference with the movement of the suction nozzle 700.

[0078] It should be noted that "some body" or "some part" can be a part of the corresponding "component", that is, "some body" or "some part" can be integrally formed with the "other parts of the component"; it can also be an independent component that can be separated from the "other parts of the component", that is, "some body" or "some part" can be manufactured independently and then combined with the "other parts of the component" into a whole. The expression of the above-mentioned "some body" or "some part" in this application is only one of the embodiments, for the convenience of reading, and not to limit the scope of protection of this application. As long as it contains the above-mentioned features and has the same function, it should be understood as an equivalent technical solution of this application.

[0079] It should be noted that the components included in the "unit", "assembly", "mechanism" and "device" of this application can also be flexibly combined, that is, modular production can be carried out according to actual needs to facilitate modular assembly. The division of the above components in this application is only one of the embodiments, for the convenience of reading, and not to limit the scope of protection of this application. As long as the above components are included and have the same functions, it should be understood that it is an equivalent technical solution of this application.

[0080] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention. The term "and / or" used in the present invention includes any and all combinations of one or more related listed items.

[0081] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0082] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0083] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0084] It should be noted that when an element is referred to as being "fixed on", "set on", "fixed on" or "installed on" another element, it can be directly on the other element or there can be a central element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be a central element at the same time. Further, when an element is considered to be "fixed transmission connected" to another element, the two can be fixed in a detachable connection manner or in a non-detachable connection, as long as power transmission can be achieved, such as socketing, snap-on, one-piece molding fixation, welding, etc., which can be achieved in the prior art and will not be repeated here. When an element is perpendicular or approximately perpendicular to another element, it means that the ideal state of the two is vertical, but due to the influence of manufacturing and assembly, there may be a certain vertical error. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0085] It should also be understood that when explaining the connection relationship or positional relationship of elements, although not explicitly described, the connection relationship and positional relationship are interpreted as including an error range, which should be within the acceptable deviation range of a specific value determined by those skilled in the art. For example, "approximately", "approximately" or "substantially" may mean within one or more standard deviations, which are not limited here.

[0086] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A silicon wafer transport mechanism, characterized in that: include: Conveyor belts; a first side plate, the first side plate being arranged on one side of the conveyor belt; a second side plate, the second side plate being disposed on the other side of the conveyor belt; and A cover plate, wherein the cover plate is disposed above the conveyor belt, and the cover plate, the first side plate and the second side plate can be enclosed to form a protective cavity; The silicon wafer transfer mechanism further includes a suction nozzle and a sealing component provided with a sealing cavity, wherein the sealing component can move relative to the suction nozzle so that the sealing component can move to place the suction nozzle in the sealing cavity to prevent external particles and impurities from being adsorbed on the suction nozzle; and the sealing component can also move to be separated from the suction nozzle to prevent the sealing component from affecting the suction and picking up of the silicon wafer by the suction nozzle; The sealing component includes two sealing sleeves arranged opposite to each other, each of which is provided with a cavity. The silicon wafer transfer mechanism also includes a third transmission component, which is transmission-connected to the two sealing sleeves so that the two sealing sleeves can be sleeved on the outside of the suction nozzle to form the closed cavity.

2. The silicon wafer transport mechanism according to claim 1, characterized in that: The silicon wafer transport mechanism further includes a removal element for removing particulate impurities, and the removal element is disposed in the protection cavity.

3. The silicon wafer transport mechanism according to claim 2, characterized in that: The removal element includes at least one of an ion fan and a vacuum adsorber.

4. The silicon wafer transport mechanism according to claim 1, characterized in that: The silicon wafer transport mechanism also includes a temperature control component, which is arranged in the protective cavity to remove water vapor in the protective cavity.

5. The silicon wafer transport mechanism according to claim 1, characterized in that: The silicon wafer transfer mechanism also includes a first transmission component, which is in transmission connection with the cover plate, so that the cover plate can move relative to the first side plate and the second side plate to open or close the protective cavity.

6. The silicon wafer transport mechanism according to claim 1, characterized in that: The silicon wafer transfer mechanism also includes a second transmission assembly, and at least one of the first side plate and the second side plate is transmission-connected to the second transmission assembly, so that at least one of the first side plate and the second side plate can move up and down relative to the conveyor belt.

7. The silicon wafer transport mechanism according to claim 1, characterized in that: The silicon wafer transport mechanism also includes a protective gas source, and the closed component is provided with a connecting cavity connected to the closed cavity, and the protective gas source is connected to the closed cavity through the connecting cavity.

8. A photovoltaic cell production system, characterized in that: It comprises a silicon wafer transport mechanism as described in any one of claims 1 to 7.

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