A wafer transfer manipulator for semiconductor devices
By designing wafer transport robots for semiconductor equipment, the problems of low efficiency and low accuracy caused by traditional manual operations are solved, and efficient and accurate wafer transport and loading processes are achieved.
Patent Information
- Application Number
- CN202210611267.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-05-31
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2042-05-31
AI Technical Summary
During the traditional wafer processing process, manual operation leads to low working efficiency and low substrate alignment accuracy, which affects the exposure effect.
A wafer transport robot for semiconductor equipment is designed, including a robot pneumatic θ-directional rotation mechanism and a robot electric Z-directional lifting mechanism. Combined with a vacuum wafer extraction mechanism and a suction cup locking mechanism, it realizes multi-directional and multi-height operation of the wafer.
It improves the working efficiency of wafer transportation and loading, ensures the alignment accuracy and safety of wafers, and avoids the risk of wafer falling off during loading.
Smart Images
Figure CN114927451B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor equipment, and specifically refers to a wafer transfer manipulator for semiconductor equipment. Background Art
[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer. The main processing methods of wafers are single-wafer processing and batch processing, that is, processing one or more wafers simultaneously. As the semiconductor feature size becomes smaller and the processing and measurement equipment becomes more advanced, new data characteristics have emerged in wafer processing. At the same time, the reduction of the feature size increases the influence of the number of particles in the air on the quality and reliability of the wafer after processing. With the improvement of cleanliness, new data characteristics have also emerged for the number of particles.
[0003] Currently, the traditional manual lithography machine for processing wafers requires operators to manually carry the wafers to the workbench. Manually loading the wafers by operators can neither ensure work efficiency nor the alignment accuracy required for the substrate, and is very likely to affect the exposure effect. Therefore, we propose a wafer transfer manipulator for semiconductor equipment to solve the above problems. Summary of the Invention
[0004] The technical problem to be solved by the present invention is to overcome the above technical problems and provide a wafer transfer manipulator for semiconductor equipment with novel structure, reasonable design, and high work efficiency.
[0005] To solve the above technical problems, the technical solution provided by the present invention is: a wafer transfer manipulator for semiconductor equipment, including a pneumatic θ-direction rotation mechanism of the manipulator. The pneumatic θ-direction rotation mechanism of the manipulator includes a base, a cylinder flange is connected to the base, a cylinder is connected to the cylinder flange, a rail positioning and moving module is connected to the base. The rail positioning and moving module includes a rail, a rail slider is movably connected to the rail, a rotating shaft module is connected to the rail. The rotating shaft module includes a bearing seat, a rotating shaft is rotatably connected to the bearing seat. A motorized Z-direction lifting mechanism of the manipulator is connected to the pneumatic θ-direction rotation mechanism of the manipulator. The motorized Z-direction lifting mechanism of the manipulator includes a fixed base, a lifting base is connected to the fixed base, the lower part of the lifting base is connected to the rotating shaft, a motor mounting seat is connected to the lifting base, a motor is connected to the motor mounting seat, a positioning rail is connected to the side of the lifting base, a slider is connected to the positioning rail, a ball screw module is connected to the motor mounting seat. The ball screw module includes a ball screw, the ball screw is connected to the output end of the motor, a screw slider is movably sleeved on the ball screw, the screw slider is connected to the slider, a mounting plate is connected to the slider, a wafer vacuum pickup mechanism of the manipulator is connected to the mounting plate. The wafer vacuum pickup mechanism of the manipulator includes a manipulator mounting base, a movable suction cup is connected to the manipulator mounting base, a vacuum ring groove and a vacuum locking groove are provided on the movable suction cup, a manipulator suction cup locking mechanism is connected in the vacuum locking groove. The manipulator suction cup locking mechanism includes a thin cylinder, the thin cylinder is installed on the manipulator mounting base, a spring is connected to the thin cylinder, a locking lever is connected to the spring, and a locking top column is connected to the locking lever.
[0006] As an improvement, a limit and buffer module is connected to the base. The limit and buffer module includes a buffer seat, and a buffer is connected to the buffer seat.
[0007] As an improvement, a reinforcing rib plate is connected to the fixed base.
[0008] As an improvement, a travel switch is connected to the lifting base.
[0009] As an improvement, a protection cover plate is connected to the manipulator mounting base.
[0010] As an improvement, an adjusting screw is connected in the vacuum locking groove.
[0011] As an improvement, a guiding block is sleeved on the locking top column.
[0012] As an improvement, the manipulator suction cup locking mechanism includes a photoelectric limit module.
[0013] After adopting the above structure, the present invention has the following advantages: The structure of the present invention is novel and reasonably designed. The setting of the air cylinder can control the movement of the guide rail slider on the guide rail, and then drive the movement of the bearing seat. The bearing seat drives the rotation of the rotating shaft, and then can control the rotation of the lifting base, so as to realize the θ-direction rotation of the wafer transfer manipulator for semiconductor equipment, which is convenient for wafer loading, more labor-saving. The combined use of the motor, the lifting base, the positioning guide rail and the slider ball screw module can control the Z-direction lifting of the wafer transfer manipulator for semiconductor equipment, which is convenient for Z-direction taking of the wafer. The setting of the movable suction cup can adsorb the wafer to realize the taking of the wafer. The combined use of the thin air cylinder, the spring, the locking lever and the locking ejector pin can lock the wafer on the movable suction cup, and it will not fall off during the wafer loading process, which is safer, improves the work efficiency and has better practicability. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 is a schematic structural diagram of a wafer transfer manipulator for semiconductor equipment according to the present invention.
[0015] Figure 2 is a schematic structural diagram of a pneumatic θ-direction rotation mechanism part of the manipulator in a wafer transfer manipulator for semiconductor equipment according to the present invention.
[0016] Figure 3 is a schematic structural diagram of a mechanical hand electric Z-direction lifting mechanism part in a wafer transfer manipulator for semiconductor equipment according to the present invention Figure 1 。
[0017] Figure 4 is a schematic structural diagram of a mechanical hand electric Z-direction lifting mechanism part in a wafer transfer manipulator for semiconductor equipment according to the present invention Figure 2 。
[0018] Figure 5 is a schematic structural diagram of a mechanical hand vacuum wafer taking mechanism part in a wafer transfer manipulator for semiconductor equipment according to the present invention.
[0019] Figure 6 is a schematic structural diagram of a mechanical hand suction cup locking mechanism part in a wafer transfer manipulator for semiconductor equipment according to the present invention.
[0020] As shown in the figure: 1. Pneumatic θ-direction rotation mechanism of the manipulator; 2. Base; 3. Cylinder flange; 4. Cylinder; 5. Guide rail positioning and moving module; 6. Guide rail; 7. Guide rail slider; 8. Rotating shaft module; 9. Bearing seat; 10. Rotating shaft; 11. Electric Z-direction lifting mechanism of the manipulator; 12. Fixed base; 13. Lifting base; 14. Motor mounting seat; 15. Motor; 16. Positioning guide rail; 17. Slide block; 18. Ball screw module; 19. Ball screw; 20. Screw slider; 21. Mounting plate; 22. Vacuum wafer picking mechanism of the manipulator; 23. Manipulator mounting base; 24. Movable suction cup; 25. Vacuum ring groove; 26. Vacuum locking groove; 27. Manipulator suction cup locking mechanism; 28. Thin cylinder; 29. Spring; 30. Locking lever; 31. Locking top column; 32. Limit buffer module; 33. Buffer seat; 34. Buffer; 35. Reinforcing rib plate; 36. Travel switch; 37. Protection cover plate; 38. Adjusting screw; 39. Guide block; 40. Photoelectric limit module.
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings. Detailed implementation manners
[0022] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "center", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation structure and operation. Therefore, it should not be construed as a limitation of the present invention.
[0023] In the description of the present invention, it should also be noted that unless otherwise clearly defined and limited, the terms "provided with", "installed", "connected", "coupled", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0024] The following will further elaborate on the present invention in conjunction with the drawings.
[0025] Combined with the attached Figures 1-6, a wafer transfer manipulator for a semiconductor device, comprising a manipulator pneumatic θ-direction rotation mechanism 1. The manipulator pneumatic θ-direction rotation mechanism 1 includes a base 2. A limit buffer module 32 is connected to the base 2. The limit buffer module 32 includes a buffer seat 33. A buffer 34 is connected to the buffer seat 33. A cylinder flange 3 is connected to the base 2. A cylinder 4 is connected to the cylinder flange 3. A guide rail positioning and moving module 5 is connected to the base 2. The guide rail positioning and moving module 5 includes a guide rail 6. A guide rail slider 7 is movably connected to the guide rail 6. A rotating shaft module 8 is connected to the guide rail 6. The rotating shaft module 8 includes a bearing seat 9. A rotating shaft 10 is rotatably connected to the bearing seat 9. A manipulator electric Z-direction lifting mechanism 11 is connected to the manipulator pneumatic θ-direction rotation mechanism 1. The manipulator electric Z-direction lifting mechanism 11 includes a fixed base 12. A reinforcing rib plate 35 is connected to the fixed base 12. A lifting base 13 is connected to the fixed base 12. A travel switch 36 is connected to the lifting base 13. The lower part of the lifting base 13 is connected to the rotating shaft 10. A motor mounting seat 14 is connected to the lifting base 13. A motor 15 is connected to the motor mounting seat 14. A positioning guide rail 16 is connected to the side of the lifting base 13. A slider 17 is connected to the positioning guide rail 16. A ball screw module 18 is connected to the motor mounting seat 14. The ball screw module 18 includes a ball screw 19. The ball screw 19 is connected to the output end of the motor 15. A screw slider 20 is movably sleeved on the ball screw 19. The screw slider 20 is connected to the slider 17. An installation plate 21 is connected to the slider 17. A manipulator vacuum wafer pickup mechanism 22 is connected to the installation plate 21. The manipulator vacuum wafer pickup mechanism 22 includes a manipulator installation base 23. A protection cover plate 37 is connected to the manipulator installation base 23. A movable suction cup 24 is connected to the manipulator installation base 23. A vacuum ring groove 25 and a vacuum locking groove 26 are provided on the movable suction cup 24. An adjusting screw 38 is connected in the vacuum locking groove 26. A manipulator suction cup locking mechanism 27 is connected in the vacuum locking groove 26. The manipulator suction cup locking mechanism 27 includes a photoelectric limit module 40. The manipulator suction cup locking mechanism 27 includes a thin cylinder 28. The thin cylinder 28 is installed on the manipulator installation base 23. A spring 29 is connected to the thin cylinder 28. A locking lever 30 is connected to the spring 29. A locking top column 31 is connected to the locking lever 30. A guide block 39 is sleeved on the locking top column 31.
[0026] In the specific implementation of the present invention, the thin cylinder 28 is started to drive the locking lever 30 to move, thereby locking the jacking column 31. The movable suction cup 24 is installed on the manipulator mounting base 23. The movable suction cup 24 is adjusted by the adjusting screw 38 to make it coaxial with the vacuum annular groove 25. The motor 15 is started to drive the ball screw 19 to rotate, thereby controlling the up and down movement of the screw slider 20. The screw slider 20 drives the slider 17 to move in the Z direction on the positioning guide rail 16. The movable suction cup 24 is placed on the wafer to be processed, and the wafer to be processed is adsorbed on the movable suction cup 24. The cylinder 4 is started to control the guide rail slider 7 to move on the guide rail 6, thereby driving the bearing seat 9 to move. The bearing seat 9 drives the rotating shaft 10 to rotate, and thus the lifting base 13 can be controlled to rotate, realizing the θ-direction rotation of the wafer transfer manipulator for semiconductor equipment, meeting the use requirements in multiple directions and at multiple heights during the wafer loading process, improving the work efficiency and having better practicability.
[0027] The above describes the present invention and its implementation manners. Such description is not restrictive. What is shown in the drawings is only one of the implementation manners of the present invention, and the actual structure is not limited thereto. Generally speaking, if those of ordinary skill in the art are inspired by it and design similar structural manners and embodiments without creative efforts without departing from the spirit of the present invention, they shall fall within the protection scope of the present invention.
Claims
1. A wafer transfer manipulator for a semiconductor device, characterized in that: It includes a manipulator pneumatic θ-direction rotation mechanism (1). The manipulator pneumatic θ-direction rotation mechanism (1) includes a base (2). A cylinder flange (3) is connected to the base (2). A cylinder (4) is connected to the cylinder flange (3). A guide rail positioning and moving module (5) is connected to the base (2). The guide rail positioning and moving module (5) includes a guide rail (6). A guide rail slider (7) is movably connected to the guide rail (6). A rotating shaft module (8) is connected to the guide rail (6). The rotating shaft module (8) includes a bearing seat (9). A rotating shaft (10) is rotatably connected to the bearing seat (9). A manipulator electric Z-direction lifting mechanism (11) is connected to the manipulator pneumatic θ-direction rotation mechanism (1). The manipulator electric Z-direction lifting mechanism (11) includes a fixed base (12). A lifting base (13) is connected to the fixed base (12). The lower part of the lifting base (13) is connected to the rotating shaft (10). A motor mounting seat (14) is connected to the lifting base (13). A motor (15) is connected to the motor mounting seat (14). A positioning guide rail (16) is connected to the side of the lifting base (13). A slider (17) is connected to the positioning guide rail (16). A ball screw module (18) is connected to the motor mounting seat (14). The ball screw module (18) includes a ball screw (19). The ball screw (19) is connected to the output end of the motor (15). A screw slider (20) is movably sleeved on the ball screw (19). The screw slider (20) is connected to the slider (17). An installation plate (21) is connected to the slider (17). A manipulator vacuum wafer picking mechanism (22) is connected to the installation plate (21). The manipulator vacuum wafer picking mechanism (22) includes a manipulator installation base (23). A movable suction cup (24) is connected to the manipulator installation base (23). A vacuum ring groove (25) and a vacuum locking groove (26) are provided on the movable suction cup (24). A manipulator suction cup locking mechanism (27) is connected in the vacuum locking groove (26). The manipulator suction cup locking mechanism (27) includes a thin cylinder (28). The thin cylinder (28) is installed on the manipulator installation base (23). A spring (29) is connected to the thin cylinder (28). A locking lever (30) is connected to the spring (29). A locking top column (31) is connected to the locking lever (30).
2. The wafer transfer manipulator for a semiconductor device according to claim 1, characterized in that: A limit and buffer module (32) is connected to the base (2). The limit and buffer module (32) includes a buffer seat (33). A buffer (34) is connected to the buffer seat (33).
3. The wafer transfer manipulator for a semiconductor device according to claim 1, characterized in that: A reinforcing rib plate (35) is connected to the fixed base (12).
4. A wafer transfer manipulator for a semiconductor device according to claim 1, characterized in that: A travel switch (36) is connected to the lifting base (13).
5. A wafer transfer manipulator for a semiconductor device according to claim 1, characterized in that: A protective cover plate (37) is connected to the manipulator mounting base (23).
6. A wafer transfer manipulator for a semiconductor device according to claim 1, characterized in that: An adjusting screw (38) is connected in the vacuum locking groove (26).
7. A wafer transfer manipulator for a semiconductor device according to claim 1, characterized in that: A guide block (39) is sleeved on the locking top column (31).
8. A wafer transfer manipulator for a semiconductor device according to claim 1, characterized in that: The manipulator suction cup locking mechanism (27) includes a photoelectric limit module (40).
Citation Information
Patent Citations
Silicon wafer separating and moving mechanism
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Semiconductor wafer inspection device
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