Method, device and electronic device for checking thickness of thermal conductive adhesive of domain controller

Abstract

The present invention provides a method, device and electronic device for checking the thickness of thermal conductive adhesive of a domain controller, which relates to the technical field of domain controller design, including: calculating a first thickness of the thermal conductive adhesive according to a dimension chain of a thermal conductive path of a chip in the domain controller, wherein the thermal conductive path includes a chip path and a heat transfer path, and the heat transfer medium of the heat transfer path includes the thermal conductive adhesive; determining a thermal resistance R of the heat transfer path according to a junction temperature parameter of the chip t ; According to the thermal resistance R in the heat transfer path t and heat transfer parameters, determine the second thickness of the thermally conductive adhesive for calibrating the first thickness, and by adding a calibration operation before the simulation step, alleviate the technical problem of design adjustment of the controller caused by unreasonable thickness of the thermally conductive adhesive in the subsequent simulation steps.

Description

Technical Field

[0001] The present invention relates to the technical field of domain controller design, and in particular to a method, device and electronic equipment for calibrating the thickness of thermal conductive adhesive of a domain controller. Background Art

[0002] As the level of autonomous driving increases, the heat generated by the chips in the domain controller is getting higher and higher, and water cooling is usually required. Thermal conductive adhesive is used to fill the gap between the chip and the water cooling plate. The heat of the chip is transferred to the water cooling plate through the thermal conductive adhesive and taken away by the coolant.

[0003] At present, in the domain controller design process, the thickness of the thermal conductive adhesive is determined based on the dimension chain calculation between the chip and the water cooling plate, but in the later controller simulation, the controller design is often non-compliant due to the thickness not meeting the standard. Therefore, it can be seen that the current method for determining the thickness of the thermal conductive adhesive is not scientific, and the repeated operation of the subsequent simulation steps will also take up a lot of time, and the design efficiency is low. Summary of the invention

[0004] In view of this, the purpose of the present invention is to provide a method, device and electronic device for calibrating the thickness of the thermal conductive paste of a domain controller. By adding a calibration operation before the simulation step, the technical problem of design adjustment of the controller caused by unreasonable thickness of the thermal conductive paste in the subsequent simulation step is alleviated.

[0005] In a first aspect, an embodiment provides a method for checking the thickness of a thermal conductive adhesive of a domain controller, the method comprising:

[0006] Calculating a first thickness of the thermally conductive adhesive according to a dimension chain of a thermally conductive path of a chip in the domain controller, wherein the thermally conductive path includes a chip path and a heat transfer path, and a heat transfer medium of the heat transfer path includes the thermally conductive adhesive;

[0007] According to the junction temperature parameters of the chip, determine the thermal resistance R of the heat transfer path t ;

[0008] According to the thermal resistance R in the heat transfer path t and heat transfer parameters to determine a second thickness of the thermally conductive adhesive, wherein the second thickness is used to calibrate the first thickness.

[0009] In some embodiments, the heat generated by the chip is transferred to the coolant through the heat transfer path, and the heat transfer path includes a water cooling plate, a heat conductive boss disposed on an upper layer of the water cooling plate, and the heat conductive adhesive disposed on the heat conductive boss.

[0010] In some embodiments, the step of calculating the first thickness of the thermally conductive adhesive according to the dimension chain of the thermal conductive path of the chip in the domain controller includes:

[0011] Determining a limit tolerance according to the sum of tolerances of the dimension chain of the heat conduction path;

[0012] Based on the limit tolerance and the gap between the chip and the thermally conductive boss, a first thickness of the thermally conductive adhesive is calculated.

[0013] In some embodiments, the thermal resistance R of the heat transfer path is determined according to the junction temperature parameters of the chip. t The steps include:

[0014] Determining junction temperature parameters according to the selection of the chip;

[0015] Based on the junction temperature parameter, calculating the thermal resistance R of the heat conduction path;

[0016] Based on the difference between the thermal resistance R of the heat conduction path and the thermal resistance R of the chip path, the thermal resistance R of the heat transfer path is determined. t .

[0017] In some embodiments, according to the thermal resistance R in the heat transfer path t and heat transfer parameters, and determining a second thickness of the thermally conductive adhesive, comprising:

[0018] Determining the thermal resistance of the thermal conductive glue, the thermal resistance of the thermal conductive boss, and the thermal resistance of the water cooling plate in the heat transfer path according to the heat transfer parameters in the heat transfer path;

[0019] According to the thermal resistance R in the heat transfer path t The second thickness of the thermally conductive adhesive is determined according to the corresponding relationship between the thermal resistance of the thermally conductive adhesive, the thermal resistance of the thermally conductive boss, and the thermal resistance of the water-cooling plate in the heat transfer path.

[0020] In some embodiments, the method further comprises:

[0021] Verifying the first thickness by using the second thickness of the thermally conductive adhesive;

[0022] If the first thickness is not greater than the second thickness, the simulation operation of the domain controller may be performed according to the first thickness.

[0023] In some embodiments, the method further comprises:

[0024] If the first thickness is greater than the second thickness, the dimension chain design of the domain controller is adjusted, and the calibration step of the thickness of the thermal conductive adhesive is re-executed.

[0025] In a second aspect, an embodiment provides a device for checking the thickness of a thermal conductive adhesive of a domain controller, the device comprising:

[0026] A calculation module, which calculates a first thickness of the thermal conductive adhesive according to a size chain of a heat conduction path of a chip in the domain controller, wherein the heat conduction path includes a chip path and a heat transfer path, and a heat transfer medium of the heat transfer path includes the thermal conductive adhesive;

[0027] The first determination module determines the thermal resistance R of the heat transfer path according to the junction temperature parameters of the chip. t ;

[0028] The second determining module determines the heat transfer path according to the thermal resistance R t and heat transfer parameters to determine a second thickness of the thermally conductive adhesive, wherein the second thickness is used to calibrate the first thickness.

[0029] In a third aspect, an embodiment provides an electronic device, including a memory and a processor, wherein the memory stores a computer program that can be run on the processor, and when the processor executes the computer program, the steps of the method described in any of the aforementioned implementation methods are implemented.

[0030] In a fourth aspect, an embodiment provides a machine-readable storage medium, wherein the machine-readable storage medium stores machine-executable instructions. When the machine-executable instructions are called and executed by a processor, the machine-executable instructions prompt the processor to implement the steps of the method described in any one of the aforementioned implementations.

[0031] The embodiment of the present invention provides a method, device and electronic device for checking the thickness of thermal conductive adhesive of a domain controller, which determines the thermal resistance R of the heat transfer path for conducting the heat of the chip according to the chip junction temperature. t , and then according to the thermal resistance R t and heat transfer parameters used to characterize heat conduction conditions, determine a more reasonable second thickness of the thermally conductive adhesive, which is the maximum thermally conductive adhesive thickness that can meet the chip junction temperature requirements, and verify the first thickness obtained based on the dimension chain of the domain controller's thermal conduction path according to the second thickness, and then determine a more accurate design value of the thermally conductive adhesive thickness, so that subsequent simulation experiments will not involve the redesign and adjustment of the domain controller due to the thermally conductive adhesive thickness not meeting the requirements.

[0032] Other features and advantages of the present disclosure will be set forth in the following description, or some features and advantages may be inferred or unambiguously determined from the description, or may be learned by implementing the above-mentioned technology of the present disclosure.

[0033] In order to make the above-mentioned objectives, features and advantages of the present disclosure more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 A flow chart of a method for calibrating the thickness of thermal conductive adhesive of a domain controller provided in an embodiment of the present invention;

[0036] Figure 2 A schematic diagram of a heat conduction path provided by an embodiment of the present invention;

[0037] Figure 3 A functional module diagram of a device for calibrating the thickness of thermal conductive adhesive of a domain controller provided in an embodiment of the present invention;

[0038] Figure 4 A schematic diagram of the hardware architecture of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] In the current chip design process, the thickness of the thermal conductive adhesive is generally calculated based on the dimension chain between the chip and the water cooling plate. However, the thickness of the thermal conductive adhesive determined in this way may cause abnormal chip simulation results in the later chip simulation process. That is, although the currently determined thickness of the thermal conductive adhesive meets the requirements, in the subsequent chip simulation, the thickness of the thermal conductive adhesive will cause problems with the safety of the chip design. At this time, it is often necessary to redesign the chip and perform simulation operations again based on the redesigned chip to determine whether the redesigned chip meets the safety requirements.

[0041] It can be seen that the existing method of determining the thickness of thermal conductive adhesive is not reasonable and may lead to repeated design and repeated simulation of the chip. The chip simulation process is relatively cumbersome, and repetitive simulation will lead to low chip design efficiency.

[0042] Based on this, an embodiment of the present invention provides a method, device and electronic device for calibrating the thickness of the thermal conductive paste of a domain controller. By adding a calibration operation before the simulation step, the technical problem of repetitive simulation design adjustment of the controller caused by unreasonable thickness of the thermal conductive paste in subsequent simulation steps is alleviated.

[0043] To facilitate understanding of this embodiment, a method for calibrating the thickness of the thermal conductive adhesive of a domain controller disclosed in an embodiment of the present invention is first introduced in detail. This method can be used in corresponding devices with control functions such as smart devices, controllers, host computers, servers, etc.

[0044] Figure 1 A flow chart of a method for calibrating the thickness of thermal conductive adhesive of a domain controller provided in an embodiment of the present invention.

[0045] like Figure 1 As shown, the method comprises the following steps:

[0046] Step S102: Calculate a first thickness of the thermally conductive adhesive according to a dimension chain of a thermally conductive path of a chip in a domain controller.

[0047] The domain controller can be used as an autonomous driving controller for vehicles. The domain controller includes chip settings. The heat generated by the chip during operation is transferred to the coolant through a heat conduction path to ensure that the domain controller works at an appropriate temperature. The heat conduction path includes a chip path through which heat flows inside the chip and a heat transfer path through which heat is transferred outside the chip. A ring of the heat transfer medium in the heat transfer path includes thermal conductive glue.

[0048] It can be understood that the dimension chain is an effective tool for analyzing and technical process dimensions. During the process of parts processing or machine assembly, a closed dimension group is formed by interconnected dimensions arranged end to end in a certain order.

[0049] Step S104, determining the thermal resistance R of the heat transfer path according to the junction temperature parameters of the chip t .

[0050] The junction temperature is the actual operating temperature of the semiconductor in the electronic device, and the junction temperature parameter refers to the related parameters under the influence of the junction temperature. Here, according to the junction temperature of the chip, the thermal resistance R generated by the heat transfer path used for heat conduction of the chip can be determined. t .

[0051] Step S106, according to the thermal resistance R in the heat transfer path t and heat transfer parameters to determine the second thickness of the thermally conductive adhesive.

[0052] The heat transfer parameters may be understood as related parameters that may affect the heat transfer speed, efficiency, transfer range, etc. during the heat transfer process of the chip, and the second thickness is used to calibrate the first thickness.

[0053] In a preferred embodiment of practical application, the thermal resistance R of the heat transfer path for conducting the chip heat is determined according to the chip junction temperature. t , and then according to the thermal resistance R t and heat transfer parameters used to characterize heat conduction conditions, determine a more reasonable second thickness of the thermally conductive adhesive, which is the maximum thermally conductive adhesive thickness that can meet the chip junction temperature requirements, and verify the first thickness obtained based on the dimension chain of the domain controller's thermal conduction path according to the second thickness, and then determine a more accurate design value of the thermally conductive adhesive thickness, so that subsequent simulation experiments will not involve the redesign and adjustment of the domain controller due to the thermally conductive adhesive thickness not meeting the requirements.

[0054] In some embodiments, Figure 2 As shown, the heat generated by the chip is transferred to the coolant through the heat transfer path, and the heat transfer path includes a water cooling plate, a heat conducting boss arranged on the upper layer of the water cooling plate, and the heat conducting glue arranged on the heat conducting boss.

[0055] The heat-conducting boss can be welded on the water-cooling plate.

[0056] In some embodiments, the first thickness of the thermal conductive adhesive initially determined may be obtained in the following manner. Specifically, step S102 in the above embodiment includes:

[0057] Step 1.1), determining the limit tolerance according to the sum of the tolerances of the dimension chain of the heat conduction path.

[0058] Among them, the tolerances of the dimension chain of the heat conduction path include: the tolerance from the lower layer of the water cooling plate to the heat conduction boss is ±0.5, the tolerance from the middle frame to the mounting surface of the PCB board is ±0.3, and the flatness tolerance after the PCB is installed is ±0.2; the limit tolerance from the heat conduction boss to the chip is ±1.0.

[0059] Step 1.2), based on the limit tolerance and the gap between the chip and the thermally conductive boss, a first thickness of the thermally conductive adhesive is calculated.

[0060] Among them, the first thickness is the minimum thickness of the thermal conductive adhesive obtained according to the assembly dimension chain. For example, the setting gap from the thermal conductive boss to the chip is 1.0mm. Based on its limit tolerance, it can be known that the first thickness of the thermal conductive adhesive can be 0-2.0mm. Preferably, the first thickness of the thermal conductive adhesive is selected to be 1.0mm.

[0061] In some embodiments, according to the junction temperature of the chip, the influence of the heat generated during operation on the heat transfer path is determined, and then the thermal resistance R of the heat transfer path is calculated. t , so that the subsequent thermal resistance R t Determine a second thickness for verification; illustratively, step S104 may also be implemented by the following steps, including:

[0062] Step 2.1), determine the junction temperature parameters of the chip according to the selected chip, the junction temperature parameters include junction temperature, chip thermal resistance R jc , maximum chip heat generation and chip area.

[0063] For example, the junction temperature of chip x is ≤150℃, and the chip thermal resistance R jc =0.8℃ / W, the maximum heat of the chip is Φ7W, the chip area A = 0.014×0.014 = 0.000196m 2 .

[0064] In actual application, the maximum temperature of the coolant under the heat dissipation of the chip can also be determined according to the installation position of the domain controller in the thermal management circuit of the whole vehicle; for example, under the heat of the chip x, the maximum temperature of the coolant is 55°C.

[0065] Step 2.2), based on the junction temperature parameter, calculating the thermal resistance R of the heat conduction path.

[0066] Exemplarily, the thermal resistance R of the heat conduction path is determined according to the first thermal resistance calculation formula R=ΔT / Φ and the aforementioned junction temperature parameters.

[0067] Among them, Figure 2 As shown, R can be understood as the thermal resistance (℃ / W) on the entire path, that is, the thermal resistance from the z-center of the chip to the coolant, △T is the heat exchange temperature difference between the water cooling plate and the chip, and Φ is the heat generated by the chip.

[0068] In practical applications, △T = chip x maximum junction temperature 150-coolant maximum temperature 55 = 95℃, Φ is the heat generated by chip x, which is 7W. Therefore, the theoretical value of thermal resistance R is = △T / Φ = 95℃ / 7W = 13.57℃ / W.

[0069] It can be understood that the water-cooled plate is in contact with the cooling liquid, and the temperature of the cooling liquid is equivalent to the temperature of the water-cooled plate.

[0070] Step 2.3), based on the thermal resistance R of the thermal conduction path and the thermal resistance R of the chip path jc The difference in thermal resistance R of the heat transfer path is determined t .

[0071] like Figure 2 As shown, the thermal resistance R of the heat transfer patht It can be seen that the thermal resistance from the chip housing to the coolant is equal to the thermal resistance R of the heat transfer path. t The chip's own thermal resistance R jc sum.

[0072] Therefore, according to the above steps, the thermal resistance R of the heat transfer path can be known. t =RR jc =13.57-0.8=12.77℃ / W.

[0073] In some embodiments, the maximum thickness of the thermal conductive adhesive can be determined by the thermal resistance of the heat transfer path under the influence of the chip junction temperature. That is, if the thermal conductive adhesive with a thickness exceeding the maximum thickness is selected, the use safety of the domain controller will be affected. The above step S106 can also be implemented by the following steps, specifically including:

[0074] Step 3.1), according to the heat transfer parameters in the heat transfer path, determine the thermal resistance of the thermal conductive glue, the thermal resistance of the thermal conductive boss and the thermal resistance of the water cooling plate in the heat transfer path.

[0075] According to the second thermal resistance calculation formula R = δ / Aλ, the thermal resistance of the thermal conductive glue, the thermal resistance of the thermal conductive boss and the thermal resistance of the water cooling plate can be calculated;

[0076] Among them, A is the heat transfer area, δ is the thickness, and λ is the thermal conductivity.

[0077] Step 3.2), according to the thermal resistance R in the heat transfer path t The second thickness of the thermally conductive adhesive is determined according to the corresponding relationship between the thermal resistance of the thermally conductive adhesive, the thermal resistance of the thermally conductive boss, and the thermal resistance of the water cooling plate in the heat transfer path.

[0078] Reference Figure 2 It can be seen that the corresponding relationship between the various thermal resistances, the thermal resistance R in the heat transfer path t =R thermal conductive adhesive + R thermal conductive boss + R water cooling plate. According to the above embodiment, in order to meet the reliability of subsequent simulation experiments and the safety of the controller, the thermal resistance R in the heat transfer path corresponding to the chip x is t ≤12.77℃ / W.

[0079] Therefore, R t =1 / A*(δ thermal conductive adhesive / λ thermal conductive adhesive+δ thermal conductive boss / λ thermal conductive boss+δ water cooling plate / λ water cooling plate)≤12.77℃ / W. The heat transfer area and the thermal conductivity of the thermal conductive adhesive, thermal conductive boss, and water cooling plate in the heat transfer path are known, and the thickness of the thermal conductive boss and water cooling plate are also known, and the maximum thickness of the thermal conductive adhesive, that is, the second thickness, can be calculated.

[0080] It can be understood that the heat transfer areas of the heat transfer mediums, such as the heat conductive adhesive, the heat conductive boss, and the water cooling plate, in the heat transfer path are all equal.

[0081] As an optional embodiment, in order to ensure the reliability of the checked thermal conductive adhesive thickness in subsequent simulation experiments, a certain margin can be left in the selection of the heat transfer area, for example, the thermal conductive adhesive bonding area is 70%;

[0082] At this time, according to R t =1 / (0.7*A)*(δthermal conductive adhesive / λthermal conductive adhesive+δthermal conductive boss / λthermal conductive boss+δwater cooling plate / λwater cooling plate)≤12.77°C / W, and the second thickness δ of the thermal conductive adhesive is determined.

[0083] In practical applications, according to customer requirements or design drawings, the thermal conductivity of the thermal conductive adhesive corresponding to chip x can be selected as 3W / m*K; the thickness of the thermal conductive boss can be selected as 9.8mm, and the thermal conductivity of the thermal conductive boss can be selected as 96W / m*K; the wall thickness of the water cooling plate can be selected as 1.2mm, and the thermal conductivity of the water cooling plate can be selected as 200W / m*K.

[0084] It should be noted that the thickness of the heat-conducting boss and the thickness of the water-cooling plate are both subject to the upper tolerance limit to ensure that the calculated second thickness of the thermal conductive adhesive is the most stringent case, and the first thickness is calibrated accordingly to ensure the reliability of the calibration.

[0085] In some embodiments, based on the second thickness of the thermally conductive adhesive, the first thickness may be checked in the following manner. Exemplarily, the method provided in the above embodiment further includes:

[0086] Step 4.1), checking the first thickness by the second thickness of the thermal conductive adhesive.

[0087] The first thickness is verified by comparing the second thickness with the first thickness.

[0088] Step 4.2), if the first thickness is not greater than the second thickness, the simulation operation of the domain controller may be performed according to the first thickness.

[0089] It can be understood that if the minimum thickness of the thermally conductive adhesive obtained by preliminary calculation of the dimension chain, i.e. the first thickness, meets the maximum thickness of the thermally conductive adhesive, i.e. the second thickness requirement, then the first thickness is considered to be more reliable, and subsequent simulation operations can be performed based on the first thickness, and the application security issues of the domain controller chip will not be caused due to the first thickness.

[0090] Step 4.3), if the first thickness is greater than the second thickness, the dimension chain design of the domain controller is adjusted, and the verification steps S102 to S106 of the thickness of the thermal conductive adhesive are re-executed.

[0091] Among them, if the minimum thickness that the thermal conductive adhesive needs to meet is greater than the maximum thickness that can ensure the safety of chip application, then it can be clearly known that the first thickness is not reasonable, and there is no need to conduct subsequent simulation experiments, saving the subsequent tedious simulation steps. At the same time, by redesigning the dimension chain between the various components in the domain controller and following the steps of the aforementioned embodiment, the calculated new first thickness of the thermal conductive adhesive is checked to obtain a first thickness that meets the requirements and participate in subsequent simulation operations.

[0092] The embodiment of the present invention adds a theoretical verification operation before the simulation step to confirm whether the thickness selection of the thermal conductive adhesive is reasonable, without the need for verification through relatively cumbersome simulation tests, thereby greatly improving engineering efficiency.

[0093] like Figure 3 As shown, an embodiment of the present invention further provides a device 200 for checking the thickness of thermal conductive adhesive of a domain controller, the device comprising:

[0094] The calculation module 201 calculates a first thickness of the thermal conductive adhesive according to a size chain of a heat conduction path of a chip in a domain controller, wherein the heat conduction path includes a chip path and a heat transfer path, and a heat transfer medium of the heat transfer path includes the thermal conductive adhesive;

[0095] The first determination module 202 determines the thermal resistance R of the heat transfer path according to the junction temperature parameter of the chip. t ;

[0096] The second determination module 203 determines the heat transfer path according to the thermal resistance R t and heat transfer parameters to determine a second thickness of the thermally conductive adhesive, wherein the second thickness is used to calibrate the first thickness.

[0097] In actual application, the embodiment of the present invention calculates the required minimum thickness of the thermal conductive adhesive based on the dimension chain, and then calculates the junction temperature non-overheating condition of the chip to obtain the maximum thermal resistance value requirement between the coolant and the chip that can meet the chip safety. Based on the thermal resistance value, the maximum thickness of the thermal conductive adhesive is reversely deduced and compared with the minimum thickness result calculated by the dimension chain to achieve the purpose of verification.

[0098] In some embodiments, the heat generated by the chip is transferred to the coolant through the heat transfer path, and the heat transfer path includes a water cooling plate, a heat conductive boss disposed on an upper layer of the water cooling plate, and the heat conductive adhesive disposed on the heat conductive boss.

[0099] In some embodiments, the calculation module 201 is further specifically used to determine a limit tolerance according to the sum of tolerances of the dimension chain of the heat conduction path; and calculate a first thickness of the thermal conductive adhesive based on the limit tolerance and the gap between the chip and the heat conduction boss.

[0100] In some embodiments, the first determination module 202 is further specifically used to determine the junction temperature parameter according to the selection of the chip; calculate the thermal resistance R of the heat conduction path based on the junction temperature parameter; determine the thermal resistance R of the heat transfer path based on the difference between the thermal resistance R of the heat conduction path and the thermal resistance of the chip path. t .

[0101] In some embodiments, the second determination module 203 is further specifically used to determine the thermal resistance of the thermal conductive glue, the thermal resistance of the thermal conductive boss, and the thermal resistance of the water cooling plate in the heat transfer path according to the heat transfer parameters in the heat transfer path; according to the thermal resistance R in the heat transfer path t The second thickness of the thermally conductive adhesive is determined according to the corresponding relationship between the thermal resistance of the thermally conductive adhesive, the thermal resistance of the thermally conductive boss, and the thermal resistance of the water-cooling plate in the heat transfer path.

[0102] In some embodiments, the device further includes a calibration module for calibrating the first thickness through the second thickness of the thermally conductive adhesive; if the first thickness is not greater than the second thickness, the simulation operation of the domain controller can be performed based on the first thickness.

[0103] In some embodiments, the verification module is further specifically used to adjust the dimension chain design of the domain controller and re-execute the verification step of the thickness of the thermal conductive adhesive if the first thickness is greater than the second thickness.

[0104] Figure 4 Schematic diagram of the hardware architecture of the electronic device 300 provided in an embodiment of the present invention. Figure 4 As shown, the electronic device 300 includes: a machine-readable storage medium 301 and a processor 302, and may also include a non-volatile storage medium 303, a communication interface 304 and a bus 305; wherein the machine-readable storage medium 301, the processor 302, the non-volatile storage medium 303 and the communication interface 304 complete mutual communication through the bus 305. The processor 302 can execute the method for checking the thickness of the thermal conductive glue of the domain controller described in the above embodiment by reading and executing the machine-executable instructions for checking the thickness of the thermal conductive glue of the domain controller in the machine-readable storage medium 301.

[0105] The machine-readable storage medium mentioned in this article can be any electronic, magnetic, optical or other physical storage device that can contain or store information, such as executable instructions, data, etc. For example, the machine-readable storage medium can be: RAM (Radom Access Memory), volatile memory, non-volatile memory, flash memory, storage drive (such as hard disk drive), any type of storage disk (such as CD, DVD, etc.), or similar storage medium, or a combination thereof.

[0106] The non-volatile medium may be a non-volatile memory, a flash memory, a storage drive (such as a hard drive), any type of storage disk (such as a CD, DVD, etc.), or a similar non-volatile storage medium, or a combination thereof.

[0107] It can be understood that the specific operation methods of each functional module in this embodiment can refer to the detailed description of the corresponding steps in the above method embodiment, and will not be repeated here.

[0108] The computer-readable storage medium provided in the embodiment of the present invention stores a computer program. When the computer program code is executed, the method for calibrating the thickness of the thermal conductive adhesive of the domain controller described in any of the above embodiments can be implemented. For specific implementation, please refer to the method embodiment, which will not be repeated here.

[0109] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system and device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0110] In addition, in the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0111] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0112] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present invention, which are used to illustrate the technical solutions of the present invention rather than to limit them. The protection scope of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the aforementioned embodiments, those of ordinary skill in the art should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the aforementioned embodiments within the technical scope disclosed by the present invention, or can easily conceive of changes, or make equivalent replacements for some of the technical features therein. Such modifications, changes or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered within the protection scope of the present invention.

Claims

1. A method for checking the thickness of thermal conductive adhesive of a domain controller, characterized in that: The method comprises: Calculating a first thickness of the thermally conductive adhesive according to a dimension chain of a thermally conductive path of a chip in the domain controller, wherein the thermally conductive path includes a chip path and a heat transfer path, and a heat transfer medium of the heat transfer path includes the thermally conductive adhesive; According to the junction temperature parameters of the chip, determine the thermal resistance R of the heat transfer path t ; According to the thermal resistance R in the heat transfer path t and heat transfer parameters, determining a second thickness of the thermally conductive adhesive, wherein the second thickness is used to calibrate the first thickness; According to the second thermal resistance calculation formula R=δ / Aλ, the thermal resistance of the thermal conductive glue, the thermal resistance of the thermal conductive boss and the thermal resistance of the water cooling plate in the heat transfer path can be calculated; Where A is the heat transfer area, δ is the thickness, and λ is the thermal conductivity; The thermal resistance R in the heat transfer path t The corresponding relationship between the thermal resistance of the thermal conductive glue, the thermal resistance of the thermal conductive boss and the thermal resistance of the water cooling plate in the heat transfer path is: the thermal resistance R in the heat transfer path t =R thermal conductive adhesive + R thermal conductive boss + R water cooling plate; Wherein, when the heat transfer area and the thermal conductivity coefficients corresponding to the thermally conductive adhesive, the thermally conductive boss and the water-cooling plate in the heat transfer path are known in advance, the thicknesses of the thermally conductive boss and the water-cooling plate are determined, and the second thickness of the thermally conductive adhesive is calculated.

2. The method according to claim 1, characterized in that The heat generated by the chip is transferred to the coolant through the heat transfer path, and the heat transfer path includes a water cooling plate, a heat conducting boss arranged on the upper layer of the water cooling plate, and the heat conducting glue arranged on the heat conducting boss.

3. The method according to claim 2, characterized in that The step of calculating a first thickness of the thermal conductive adhesive according to a dimension chain of a thermal conductive path of a chip in a domain controller includes: Determining a limit tolerance according to the sum of tolerances of the dimension chain of the heat conduction path; Based on the limit tolerance and the gap between the chip and the thermally conductive boss, a first thickness of the thermally conductive adhesive is calculated.

4. The method according to claim 1 or 2, characterized in that: According to the junction temperature parameters of the chip, determine the thermal resistance R of the heat transfer path t The steps include: Determining junction temperature parameters according to the selection of the chip; Based on the junction temperature parameter, calculating the thermal resistance R of the heat conduction path; Based on the difference between the thermal resistance R of the heat conduction path and the thermal resistance R of the chip path, the thermal resistance R of the heat transfer path is determined. t .

5. The method according to claim 1, characterized in that The method further comprises: Verifying the first thickness by using the second thickness of the thermally conductive adhesive; If the first thickness is not greater than the second thickness, the simulation operation of the domain controller may be performed according to the first thickness.

6. The method according to claim 5, characterized in that The method further comprises: If the first thickness is greater than the second thickness, the dimension chain design of the domain controller is adjusted, and the calibration step of the thickness of the thermal conductive adhesive is re-executed.

7. A device for checking the thickness of thermal conductive adhesive of a domain controller, characterized in that: The device comprises: A calculation module, which calculates a first thickness of the thermal conductive adhesive according to a size chain of a heat conduction path of a chip in the domain controller, wherein the heat conduction path includes a chip path and a heat transfer path, and a heat transfer medium of the heat transfer path includes the thermal conductive adhesive; The first determination module determines the thermal resistance R of the heat transfer path according to the junction temperature parameters of the chip. t ; The second determining module determines the heat transfer path according to the thermal resistance R t and heat transfer parameters, determining a second thickness of the thermally conductive adhesive, wherein the second thickness is used to calibrate the first thickness; The second determination module is further used to calculate the thermal resistance of the thermal conductive glue, the thermal resistance of the thermal conductive boss and the thermal resistance of the water cooling plate in the heat transfer path according to the second thermal resistance calculation formula R=δ / Aλ; wherein A is the heat transfer area, δ is the thickness, and λ is the thermal conductivity; The thermal resistance R in the heat transfer path t The corresponding relationship between the thermal resistance of the thermal conductive glue, the thermal resistance of the thermal conductive boss and the thermal resistance of the water cooling plate in the heat transfer path is: the thermal resistance R in the heat transfer path t =R thermally conductive adhesive + R thermally conductive boss + R water-cooling plate; wherein, when the heat transfer area and the thermal conductivity coefficients corresponding to the thermally conductive adhesive, the thermally conductive boss, and the water-cooling plate in the heat transfer path are known in advance, the thicknesses of the thermally conductive boss and the water-cooling plate are determined, and the second thickness of the thermally conductive adhesive is calculated.

8. An electronic device comprising a memory and a processor, wherein the memory stores a computer program that can be run on the processor, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A machine-readable storage medium, characterized in that: The machine-readable storage medium stores machine-executable instructions, and when the machine-executable instructions are called and executed by a processor, the machine-executable instructions prompt the processor to implement the steps of the method described in any one of claims 1 to 6.

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