Recovery mechanism, substrate processing device, and recovery method

Abstract

A recovery mechanism is a recovery mechanism for the peripheral portion of a substrate removed in a peripheral removal mechanism, the recovery mechanism comprising: a discharge section that connects the recovery section for recovering the removed peripheral portion to the peripheral removal mechanism; and a path switching section that is configured to switch the discharge path of the peripheral portion in the discharge section.

Description

Technical Field

[0001] The present disclosure relates to a recycling mechanism, a substrate processing device, and a recycling method. Background Art

[0002] Patent Document 1 discloses that a disc-shaped grinding tool with abrasive grains on its outer periphery is rotated so that at least the outer periphery of the grinding tool contacts a semiconductor wafer in a linear manner, thereby grinding the peripheral end of the semiconductor wafer into a substantially L-shaped shape. Semiconductor wafers are manufactured by bonding two silicon wafers together.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 9-216152 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] The technology disclosed herein appropriately recovers the peripheral portion removed from the substrate.

[0008] Solutions for solving problems

[0009] One technical solution disclosed herein is a recovery mechanism for the peripheral portion of a substrate removed in a peripheral removal mechanism, the recovery mechanism comprising: a discharge portion, which connects a recovery portion for recovering the removed peripheral portion to the peripheral removal mechanism; and a path switching portion, which is configured to switch the discharge path of the peripheral portion in the discharge portion.

[0010] Effects of the Invention

[0011] According to the present disclosure, the peripheral portion removed from the substrate can be appropriately recovered. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a side view showing a structural example of stacked wafers.

[0013] Figure 2 It is a plan view showing a configuration example of a wafer processing system.

[0014] Figure 3 This is an explanatory diagram showing an example of the main steps of wafer processing.

[0015] Figure 4 This is a flowchart showing an example of the main steps of wafer processing.

[0016] Figure 5 It is an explanatory diagram showing an example of forming a modified layer on a superposed wafer.

[0017] Figure 6 It is a side view schematically showing the structure of the peripheral edge removal device according to this embodiment.

[0018] Figure 7 It is an enlarged view schematically showing the structure of the shutter portion according to this embodiment.

[0019] Figure 8 It is an explanatory diagram showing an operation example of the recovery mechanism according to this embodiment.

[0020] Figure 9 It is an explanatory diagram showing an operation example of the recovery mechanism according to this embodiment.

[0021] Figure 10 It is an explanatory diagram showing an operation example of the recovery mechanism according to this embodiment.

[0022] Figure 11 It is an explanatory diagram showing another structural example of the recovery mechanism.

[0023] Figure 12 It is an explanatory diagram showing another structural example of the recovery mechanism.

[0024] Figure 13 This is an explanatory diagram schematically showing the structure of a recovery unit according to another embodiment. DETAILED DESCRIPTION

[0025] In recent years, in the manufacturing process of semiconductor devices, a superimposed substrate formed by bonding a semiconductor substrate (hereinafter referred to as the "first substrate") having multiple electronic circuits and other devices formed on its surface to a second substrate is subjected to a treatment to thin the back surface of the first substrate by grinding.

[0026] Furthermore, the peripheral edge of the first substrate is typically chamfered. However, as disclosed in Patent Document 1, when the back surface of the first substrate is ground, the peripheral edge of the first substrate becomes sharp (so-called blade shape). This can result in fragments being generated at the peripheral edge of the first substrate, potentially damaging the first substrate. Therefore, prior to grinding, the peripheral edge of the first substrate is pre-cut, a process known as edge trimming.

[0027] The end surface grinding device described in Patent Document 1 is a device that performs this edge trimming. However, in this end surface grinding device, edge trimming is performed by grinding, and therefore a large amount of dust (hereinafter referred to as "particles") is generated during the grinding process. If these particles are scattered within the device, they may contaminate the substrate being processed.

[0028] Therefore, the present inventors focused a laser beam on the boundary between the peripheral portion and the central portion to be removed by edge trimming, thereby forming a modified layer, and then peeling the peripheral portion along the modified layer (laser trimming). According to this laser trimming process, the peripheral portion can be removed without grinding as in Patent Document 1, thereby reducing the amount of particles generated during edge trimming.

[0029] Furthermore, when the peripheral portion is removed by laser cutting, the removed peripheral portion is temporarily collected and stored in a collection box, for example, and then discarded from the collection box. However, when discarding the peripheral portion stored in the collection box, the subsequent laser cutting process needs to be interrupted. In other words, the laser cutting device needs to be temporarily stopped when discarding the peripheral portion.

[0030] Therefore, the disclosed technology appropriately recovers the peripheral edge portion removed from the substrate. Below, with reference to the accompanying drawings, a description is given of the peripheral edge removal device and the recovery mechanism included in the substrate processing apparatus of this embodiment. Furthermore, in this specification and the accompanying drawings, elements having substantially the same functional structure are denoted by the same reference numerals to omit repeated descriptions.

[0031] In a wafer processing system including a peripheral edge removal device 70 described later according to this embodiment, as shown in FIG. Figure 1 As shown, a superimposed wafer T as a superimposed substrate formed by bonding a first wafer W as a first substrate and a second wafer S as a second substrate is processed. Moreover, in the peripheral edge removal device 70, the peripheral edge portion We of the first wafer W is removed, and the removed peripheral edge portion We is recovered. Hereinafter, in the first wafer W, the surface on the side bonded to the second wafer S is referred to as the surface Wa, and the surface on the side opposite to the surface Wa is referred to as the back surface Wb. Similarly, in the second wafer S, the surface on the side bonded to the first wafer W is referred to as the surface Sa, and the surface on the side opposite to the surface Sa is referred to as the back surface Sb.

[0032] The first wafer W is, for example, a semiconductor wafer such as a silicon substrate, and a device layer D containing a plurality of devices is formed on the surface Wa. A surface film Fw is also formed on the device layer D, which is bonded to the second wafer S via the surface film Fw. As the surface film Fw, for example, an oxide film (SiO2 film, TEOS film), a SiC film, a SiCN film or an adhesive can be cited. In addition, the peripheral portion We of the first wafer W is chamfered, and the cross-section of the peripheral portion We becomes thinner as it moves toward its front end. In addition, the peripheral portion We is a portion that is removed in the edge cutting portion described later, for example, a range of 0.5 mm to 3 mm radially from the outer end of the first wafer W.

[0033] The second wafer S is, for example, a wafer supporting the first wafer W. A surface film FS is formed on the surface Sa of the second wafer S, and chamfering is performed on the peripheral portion. As the surface film FS, for example, an oxide film (SiO2 film, TEOS film), a SiC film, a SiCN film or an adhesive can be cited. In addition, the second wafer S functions as a protective member (supporting wafer) for protecting the device layer D of the first wafer W. In addition, the second wafer S does not need to be a supporting wafer, and can also be a device wafer with a device layer formed in the same manner as the first wafer W. In this case, a surface film FS is formed on the surface Sa of the second wafer S across the device layer.

[0034] In addition, in the drawings used in the following description, illustration of the device layer D and the surface films Fw and FS may be omitted in order to avoid cluttering the drawings.

[0035] First, the configuration of a wafer processing system 1 including a peripheral edge removal device 70 described later according to this embodiment will be described.

[0036] like Figure 2 As shown, the wafer processing system 1 has a structure in which a loading and unloading station 2 and a processing station 3 are connected as a whole. The loading and unloading station 2 loads and unloads, for example, a cassette Ct capable of storing a plurality of overlapped wafers T to and from the outside. The processing station 3 includes various processing devices for performing desired processing on the overlapped wafers T.

[0037] A cassette loading table 10 is provided at the loading and unloading station 2. In the illustrated example, a plurality of, for example, three, cassettes Ct are loaded freely in a row along the Y-axis direction on the cassette loading table 10. The number of cassettes Ct loaded on the cassette loading table 10 is not limited to this embodiment and can be arbitrarily determined.

[0038] In the carrying in and out station 2, a wafer conveying device 20 is provided adjacent to the box loading platform 10 on the negative side of the X-axis of the box loading platform 10. The wafer conveying device 20 is configured to be movable on a conveying path 21 extending in the Y-axis direction. In addition, the wafer conveying device 20 has, for example, two conveying arms 22, 22 for holding and conveying overlapping wafers T. Each conveying arm 22 is configured to be movable in the horizontal direction, in the vertical direction, around the horizontal axis, and around the vertical axis. In addition, the structure of the conveying arm 22 is not limited to the present embodiment, and any structure can be adopted. Thus, the wafer conveying device 20 is configured to be able to convey overlapping wafers T relative to the box Ct of the box loading platform 10 and the conveying device 30 described later.

[0039] In the carry-in / out station 2 , a transfer device 30 for delivering and receiving the superimposed wafers T is provided adjacent to the wafer transfer device 20 on the negative side of the wafer transfer device 20 in the X-axis direction.

[0040] For example, three processing blocks B1 to B3 are provided in the processing station 3. The first processing module B1, the second processing module B2, and the third processing module B3 are arranged in order from the positive side of the X axis (the side of the feeding and unloading station 2) to the negative side.

[0041] The first processing module B1 is provided with an etching device 40 for etching the ground surface of the first wafer W ground by the processing device 90 (described later), a cleaning device 41 for cleaning the ground surface of the first wafer W, and a wafer conveying device 50. The etching device 40 and the cleaning device 41 are arranged in a stacked manner. The number and arrangement of the etching devices 40 and the cleaning devices 41 are not limited to this. For example, the etching devices 40 and the cleaning devices 41 may be arranged side by side in the X-axis direction. Furthermore, the etching devices 40 and the cleaning devices 41 may be stacked.

[0042] The wafer conveying device 50 is, for example, arranged on the negative side of the Y-axis of the etching device 40 and the cleaning device 41. The wafer conveying device 50 has, for example, two conveying arms 51, 51 for holding and conveying the overlapping wafers T. Each conveying arm 51 is configured to be movable in the horizontal direction, in the vertical direction, around the horizontal axis, and around the vertical axis. In addition, the structure of the conveying arm 51 is not limited to this embodiment, and any structure can be adopted. Thus, the wafer conveying device 50 is configured to be able to convey the overlapping wafers T relative to the conveying device 30, the etching device 40, the cleaning device 41, the later-described modification device 60, and the later-described peripheral edge removal device 70.

[0043] The second processing module B2 is provided with a modifying device 60 for forming a modified layer inside the first wafer W, a peripheral edge removal device 70 as a substrate processing device for trimming the edge of the first wafer W, and a wafer conveying device 80. The modifying device 60 and the peripheral edge removal device 70 are arranged in a stacked manner. In addition, the number and arrangement of the modifying devices 60 and the peripheral edge removal device 70 are not limited to this. For example, the modifying device 60 and the peripheral edge removal device 70 can also be placed in an aligned manner in the X-axis direction. In addition, these modifying devices 60 and the peripheral edge removal devices 70 can also be stacked separately. In addition, the detailed structure of the peripheral edge removal device 70 will be described later.

[0044] The wafer conveying device 80 is, for example, arranged on the Y-axis positive direction side of the modifying device 60 and the peripheral edge removal device 70. The wafer conveying device 80 has, for example, two conveying arms 81, 81 that use an adsorption holding surface (not shown) to adsorb and hold the overlapping wafers T and convey them. Each conveying arm 81 is supported by a multi-jointed arm member 82 and is configured to be movable horizontally, vertically, around a horizontal axis, and around a vertical axis. In addition, the structure of the conveying arm 81 is not limited to this embodiment, and any structure can be adopted. Thus, the wafer conveying device 80 is configured to be able to convey overlapping wafers T relative to the etching device 40, the cleaning device 41, the modifying device 60, the peripheral edge removal device 70, and the processing device 90 described later.

[0045] The third processing module B3 is provided with a processing device 90 .

[0046] The processing apparatus 90 includes a rotating table 91. Four chucks 92 are mounted on the rotating table 91 to hold the stacked wafers T by suction. The rotating table 91 rotates about a rotation centerline 93, allowing the four chucks 92 to move to a transfer position A0 and processing positions A1 to A3. Furthermore, each of the four chucks 92 is rotatable about a vertical axis using a rotation mechanism (not shown).

[0047] At the transfer position A0, the wafer conveyor 80 transfers the overlapped wafers T. A rough grinding unit 94 is located at the processing position A1 to perform rough grinding on the first wafer W. A medium grinding unit 95 is located at the processing position A2 to perform medium grinding on the first wafer W. A fine grinding unit 96 is located at the processing position A3 to perform fine grinding on the first wafer W. Furthermore, the back surface Wb of the first wafer W may also be cleaned at the transfer position A0.

[0048] The above wafer processing system 1 is provided with a control device 100. The control device 100 is, for example, a computer and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of the overlapping wafers T in the wafer processing system 1. In addition, the program storage unit also stores a program for controlling the operation of the drive system of the various processing devices, conveying devices, etc. mentioned above to realize the wafer processing described later in the wafer processing system 1. In addition, the above program can also be stored in a storage medium H that can be read by a computer and loaded into the control device 100 from the storage medium H.

[0049] Next, wafer processing using the wafer processing system 1 configured as described above will be described. In this embodiment, a first wafer W and a second wafer S are bonded together in a bonding apparatus (not shown) outside the wafer processing system 1 to form a superposed wafer T in advance.

[0050] First, there are multiple Figure 3The cassette Ct of the overlapped wafers T shown in (a) is placed on the cassette placement table 10 of the carry-in / out station 2 . Next, the overlapped wafers T in the cassette Ct are taken out by the wafer transport device 20 and transported to the conveyor device 30 .

[0051] Next, the wafer conveying device 50 takes out the overlapped wafer T from the conveying device 30 and conveys it to the modifying device 60. In the modifying device 60, a laser beam (internal laser beam, such as YAG laser) is irradiated to the inside of the first wafer W. Figure 3 (b) and Figure 5 As shown, a peripheral modified layer M1 and a segmented modified layer M2 are formed ( Figure 4 The peripheral modified layer M1 becomes the base point for removing the peripheral portion We in the edge cutting described later. The segmented modified layer M2 becomes the base point for dividing the removed peripheral portion We into smaller pieces.

[0052] When the edge reforming layer M1 and the divided reforming layer M2 are formed inside the first wafer W, the wafer conveying device 80 is used to convey the overlapped wafer T from the reforming device 60 to the edge removing device 70. In the edge removing device 70, as shown in FIG. Figure 3 As shown in (c), the peripheral edge portion We of the first wafer W is removed with the peripheral edge modified layer M1 and the crack C1 extending from the peripheral edge modified layer M1 as the starting point. Figure 4 Step P3). In addition, at this time, the peripheral portion We is divided into small pieces and separated based on the split modified layer M2 and the crack C2 extending from the split modified layer M2. In addition, the detailed method of edge cutting of the peripheral edge removal device 70 will be described later.

[0053] Next, the wafer transport device 80 transports the overlapped wafer T from which the peripheral edge We of the first wafer W has been removed from the peripheral edge removal device 70 to the chuck 92 at the transfer position A0 of the processing device 90. Next, the rotary table 91 is rotated to sequentially move the chuck 92 to the processing positions A1 to A3.

[0054] At the processing position A1, the back surface Wb of the first wafer W is rough ground by the rough grinding unit 94 ( Figure 4 At the processing position A2, the back surface Wb of the first wafer W is subjected to intermediate grinding by the intermediate grinding unit 95 ( Figure 4 Then, at the processing position A3, the back surface Wb of the first wafer W is finely ground by the fine grinding unit 96 ( Figure 4 Step P6).

[0055] like Figure 3As shown in (d), when the first wafer W is thinned to a desired thickness by grinding, the chuck 92 is then moved to the transfer position A0. The wafer transfer device 80 then transfers the overlapped wafer T moved to the transfer position A0 to the cleaning device 41. In the cleaning device 41, the ground surface (back surface Wb) of the first wafer W is scrubbed ( Figure 4 In addition, in the cleaning device 41, the back surface Sb of the second wafer S and the ground surface of the first wafer W may be cleaned together.

[0056] Next, the wafer conveying device 50 conveys the superposed wafer T to the etching device 40. In the etching device 40, the ground surface (back surface Wb) of the first wafer W is wet-etched using a chemical solution ( Figure 4 Step P8).

[0057] Thereafter, the wafer transport device 50 transports the superimposed wafer T that has undergone all the processing to the transfer device 30, and further transports it to the cassette Ct on the cassette stage 10 by the wafer transport device 20. Thus, a series of wafer processing in the wafer processing system 1 is completed.

[0058] Next, the detailed structure of the aforementioned peripheral edge removing device 70 will be described.

[0059] like Figure 6 As shown, the peripheral edge removal device 70 comprises a peripheral edge removal mechanism 110 and a recovery mechanism 120 connected to each other. The peripheral edge removal mechanism 110 removes the peripheral edge portion We of the first wafer W. The recovery mechanism 120 recovers and accumulates the peripheral edge portion We of the first wafer W removed by the peripheral edge removal mechanism 110. Furthermore, when the amount recovered by the recovery mechanism 120 exceeds a predetermined storage capacity, the recovered peripheral edge portion We is discarded.

[0060] The peripheral edge removal mechanism 110 includes a chuck 111 that holds the superimposed wafers T on its upper surface. The chuck 111 holds the first wafer W on the upper side and the second wafer S on the lower side. The chuck 111 is rotatable about a vertical axis by a rotation mechanism 112 .

[0061] An insertion member 113 is provided on the side of the chuck 111 for applying an impact to the peripheral portion We of the first wafer W to remove the peripheral portion We. The insertion member 113 is configured to be able to move toward the overlapping wafer T held on the chuck 111 by a moving mechanism (not shown), and is configured to be able to rotate around a vertical axis by a rotating mechanism (not shown). The insertion member 113 is inserted from the outer end of the first wafer W and the second wafer S to the interface between the first wafer W and the second wafer S. As a result, the peripheral portion We is pushed up by the insertion member 113 inserted into the interface, and then the chuck 111 is rotated with the insertion member 113 inserted into the interface, so that the peripheral portion We is separated and removed from the first wafer W with the peripheral modified layer M1 as the base point. In addition, at this time, the peripheral portion We is fragmented with the split modified layer M2 as the base point.

[0062] A cup 114 is provided on the side of the chuck 111 to surround the superimposed wafer T held by the chuck 111. The lower portion of the cup 114 is connected to a recovery mechanism 120, described later. The cup 114 receives the peripheral edge portion We removed by the insert member 113 and particles generated during the removal of the peripheral edge portion We, and discharges them to the recovery mechanism 120.

[0063] The recovery mechanism 120 includes a discharge portion 130 , a shutter portion 140 , and a recovery portion 150 in order from the top.

[0064] The discharge unit 130 includes a pipe 131 that connects the cup 114 of the peripheral edge removal mechanism 110 to the recovery unit 150 (described later). This pipe 131 forms a discharge path for the peripheral edge portion We removed by the peripheral edge removal mechanism 110 and the particles generated during the removal of the peripheral edge portion We. The material of the pipe 131 is not particularly limited, but it is preferably made of a conductive member to prevent the peripheral edge portion We and particles from adhering to the pipe due to static electricity.

[0065] A screen 131a (or punched holes) serving as a separation mechanism is formed on at least a portion of the circumferential surface of the pipe 131 constituting the discharge flow path. In addition, a cover 132 is provided on the radially outer side of the pipe 131 in a manner that covers at least the circumferential surface on which the screen 131a is formed. The cover 132 is connected to an exhaust mechanism 133 serving as an exhaust section that includes a filter (not shown) for recovering particulate matter. Thus, in the discharge section 130, by activating the exhaust mechanism 133, the interior of the pipe 131 and the interior of the cup 114 of the connected peripheral edge removal mechanism 110 are exhausted, and particulate matter can be recovered through the screen 131a using the aforementioned filter.

[0066] Furthermore, the peripheral portion We removed by the peripheral edge removal mechanism 110 is not sucked by the exhaust mechanism 133, but passes through the interior of the pipe 131 under its own weight and is recovered in the recovery unit 150 described later. In other words, it is preferable to determine the opening ratio of the screen 131a and the exhaust volume of the exhaust mechanism 133 so that the peripheral portion We can appropriately fall to the recovery unit 150.

[0067] The structure of the separation mechanism is not limited to the above-mentioned mesh 131a and cover 132, and any structure can be used as long as the peripheral portion We can be appropriately separated from the particles. For example, the separation mechanism can also be composed of a labyrinth structure or a cyclone structure.

[0068] A buffer space 134 is formed below the cover 132 to temporarily store the peripheral portion We when the gate portion 140 (described later) is closed. The peripheral surface of the buffer space 134 is formed by the portion of the piping 131 located below the cover 132. Furthermore, the bottom surface of the buffer space 134 is formed by a plate-like member 141 (described later) of the gate portion 140. Furthermore, a detection unit 135 for detecting the amount of accumulation of the peripheral portion We in the buffer space 134 may be provided within the buffer space 134. The detection unit 135 may be, for example, a load cell, a photoelectric sensor, a camera, or the like.

[0069] like Figure 7 As shown, the gate portion 140, serving as a path switching unit, includes a plate-shaped member 141 disposed at the boundary between the discharge portion 130 and the recovery portion 150 (described later). The plate-shaped member 141 can be moved along a linear guide 143 using a drive mechanism 142, such as a pneumatic cylinder, thereby enabling the gate portion 140 to be freely opened and closed. Thus, in the recovery mechanism 120, the plate-shaped member 141 is moved to open the gate portion 140, thereby establishing communication between the discharge portion 130 and the recovery portion 150.

[0070] In addition, if Figure 7 As shown, a gap G is formed between the plate-shaped member 141 of the gate portion 140 and the pipe 131 forming the buffer space 134 to allow the plate-shaped member 141 to move appropriately. Here, when the gate portion 140 is opened and closed, that is, when the plate-shaped member 141 is moved, while the gap G is formed in this manner, the peripheral edge portion We accumulated on the upper surface of the plate-shaped member 141 in the buffer space 134 as described above may intrude into the gap G, thereby potentially hindering the movement of the plate-shaped member 141.

[0071] Therefore, in this embodiment, a sealing member 144 is provided to prevent the peripheral edge portion We from intruding into the gap G. The upper end of the sealing member 144 is connected to the lower end of the pipe 131 that forms the buffer space 134. In addition, the lower end of the sealing member 144 contacts the plate-shaped member 141 at least during the opening and closing operation of the gate portion 140. As the sealing member 144, a member that can appropriately prevent the peripheral edge portion We from intruding into the gap G when in contact with the plate-shaped member 141, such as a brush, rubber, etc., can be used.

[0072] The recovery unit 150 includes a recovery box 151 , a box storage body 152 , a connecting pipe 153 , and a weight sensor 154 .

[0073] The collection box 151 collects the peripheral edge portion We removed by the peripheral edge removal mechanism 110. An opening 151a is formed on the upper surface of the collection box 151, facing the shutter portion 140. The peripheral edge portion We that falls from the discharge portion 130 is collected inside through this opening 151a. The collection box 151 is configured to be removable from the box storage body 152 (collection unit 150).

[0074] Furthermore, the shutter portion 140 is controlled to open and close according to the attachment and detachment state of the recovery box 151 relative to the recovery portion 150. Specifically, when the recovery box 151 is attached to the recovery portion 150, the shutter portion 140 is opened, and when the recovery box 151 is detached from the recovery portion 150, the shutter portion 140 is closed.

[0075] Furthermore, the recovery box 151 is provided with a sliding door 151b for sealing the opening 151a and hermetically sealing the interior of the recovery box 151. This is to prevent contamination within the clean room where the peripheral edge removal device 70 is installed when the recovery box 151 is removed from the recovery unit 150 to discard the peripheral edge portion We. The sliding door 151b is opened when the recovery box 151 is attached to the recovery unit 150 and is closed when the recovery box 151 is removed from the recovery unit 150.

[0076] The box storage body 152 is fixedly provided below the discharge portion 130 (gate portion 140) and is configured to store the collection box 151 therein. Thus, by removing the collection box 151 from the box storage body 152, the peripheral portion We collected inside the collection box 151 can be discarded.

[0077] Connecting pipe 153 is provided between recovery box 151 and box storage body 152 of recovery section 150 to appropriately recover the peripheral portion We that has fallen from discharge section 130 into the recovery box. The opening at the upper end of connecting pipe 153 is formed to be at least larger than the opening of gate section 140 and piping 131. Furthermore, the opening at the lower end of connecting pipe 153 is formed to be at least smaller than opening 151a of recovery box 151.

[0078] The weight sensor 154 serving as a detection unit is provided at the bottom of the box storage body 152. When the recovery box 151 is mounted on the box storage body 152, the weight sensor 154 places the recovery box 151 on its upper surface. The weight sensor 154 then detects the amount (weight) of the peripheral portion We collected within the mounted recovery box 151.

[0079] Furthermore, the collection box 151 is controlled for attachment and detachment based on the amount of the peripheral portion We detected by the weight sensor 154. Specifically, when the amount of the peripheral portion We exceeds the amount that can be stored in the collection box 151, the collection box 151 is removed from the collection unit 150. Thereafter, after the peripheral portion We accumulated inside is discarded, the collection box 151 is reattached to the collection unit 150.

[0080] In addition, the detection of the amount of recovery of the peripheral portion We by the recovery box 151 may replace the detection of the weight of the peripheral portion We by the weight sensor 154, or may be based on this. Figure 6 As shown, the detection is performed using the detection sensor 155 as a detection unit. As the detection sensor 155, for example, a photoelectric sensor, a camera, etc. can be used.

[0081] Furthermore, the interior of the recovery unit 150 is preferably sealed to prevent contamination of the clean room where the peripheral edge removal device 70 is installed.

[0082] Next, a method of removing and recovering the peripheral edge portion We using the peripheral edge removing device 70 configured as described above will be described.

[0083] First, the wafer transfer device 80 delivers and holds the overlapped wafer T to the chuck 111 of the peripheral edge removal mechanism 110. On the first wafer W of the overlapped wafer T, the peripheral edge reformed layer M1 and the divided reformed layer M2 are previously formed in the reforming device 60.

[0084] Next, the insert member 113 is moved toward the superimposed wafer T and abuts against the interface between the first wafer W and the second wafer S. At this point, the insert member 113 and the chuck 111 (superimposed wafer T) are rotated in opposite directions. Furthermore, at this point, the drive mechanism 142 is preferably used to move the plate-shaped member 141, thereby opening the shutter 140.

[0085] Next, the insert member 113 is further moved toward the center of the superimposed wafer T and inserted into the interface between the first wafer W and the second wafer S. This pushes the peripheral edge We of the first wafer W upward, separating the peripheral edge We from the first wafer W with the peripheral edge modified layer M1 as the starting point. At this point, the peripheral edge We is fragmented and separated with the segmented modified layer M2 as the starting point.

[0086] Here, the peripheral edge portion We removed by the insert member 113 falls under its own weight toward the recovery mechanism 120 connected to the lower portion of the cup body 114. Furthermore, while the peripheral edge portion We is being removed, the exhaust mechanism 133 performs suction as described above. Thus, the interior of the cup body 114 is exhausted via the exhaust unit 130, and the particles generated during the removal of the peripheral edge portion We are appropriately suctioned toward the recovery mechanism 120.

[0087] like Figure 8 As shown, the peripheral portion We that falls toward the recovery mechanism 120 passes through the pipe 131, the cover 132, and the buffer space 134 under the action of its own weight and is recovered by the recovery unit 150. In addition, the particles sucked into the recovery mechanism 120 are sucked by the exhaust mechanism 133 and pass through the pipe 131, the cover 132, and the screen 131a and are recovered by the filter of the exhaust mechanism 133.

[0088] In the peripheral edge removal device 70 of this embodiment, the weight sensor 154 and the detection sensor 155 are used to detect the amount of peripheral edge portions We collected into the collection box 151. Then, when the detected amount of peripheral edge portions We collected exceeds the storage capacity of the collection box 151, the collection box 151 is removed from the collection unit 150 and the accumulated peripheral edge portions We are discarded.

[0089] Here, if Figure 9 As shown, when discarding the peripheral edge portion We collected in the collection box 151, before removing the collection box 151, the plate-shaped member 141 is moved by the driving mechanism 142 to close the shutter portion 140. Thus, by closing the shutter portion 140 in this manner, even when the collection box 151 is removed from the collection unit 150, the peripheral edge portion We removed by the peripheral edge removal mechanism 110 is accumulated on the upper surface of the plate-shaped member 141, that is, in the buffer space 134. That is, when discarding the peripheral edge portion We from the collection box 151, the peripheral edge removal device 70 does not need to stop operating, and the peripheral edge removal mechanism 110 can continue to remove the peripheral edge portion We.

[0090] When the peripheral portion We accumulated in the collection box 151 is discarded, the collection box 151 is mounted on the collection unit 150. Thereafter, the plate-shaped member 141 is moved by the driving mechanism 142 to open the gate 140. Figure 10 As shown, the peripheral portion We temporarily accumulated in the buffer space 134 is caused to fall toward the recovery box 151. At this time, since the sealing member 144 is provided in the gap G between the plate-shaped member 141 of the gate portion 140 and the pipe 131 of the buffer space 134, the peripheral portion We does not intrude into the gap G but is appropriately recovered into the recovery box 151.

[0091] When the discharge portion 130 and the recovery portion 150 are connected to each other by opening the shutter portion 140 , the peripheral portion We removed by the insertion member 113 is directly recovered in the recovery portion 150 without being accumulated in the buffer space 134 again.

[0092] Furthermore, in the peripheral edge removal device 70 of this embodiment, when the recovery box 151 is removed, the shutter portion 140 is closed, and the peripheral edge portion We is temporarily accumulated in the buffer space 134, thereby continuing the edge trimming by the peripheral edge removal mechanism 110. However, for example, if the amount of peripheral edge portion We detected by the detection unit 135 exceeds the amount that can be accumulated in the buffer space 134, the edge trimming by the peripheral edge removal mechanism 110 may be interrupted. In this case, a warning may be issued before interrupting the edge trimming. In this case, the recovery box 151 is installed in the recovery unit 150, and the edge trimming is resumed after the shutter portion 140 is opened.

[0093] Alternatively, for example, if the amount of the peripheral portion We detected by the weight sensor 154 exceeds the amount of storage capacity of the recovery box 151 and the recovery box 151 cannot be removed, the edge trimming may be interrupted. In this case, the recovery box 151 is removed, the peripheral portion We is discarded, and the edge trimming is resumed after the recovery box 151 is installed in the recovery unit 150.

[0094] Furthermore, in the case where the amount of the peripheral portion We detected by the weight sensor 154 exceeds the amount that can be accumulated in the recovery box 151 and the recovery box 151 cannot be disassembled, the gate portion 140 can be controlled to be temporarily closed. Thus, even in the case where the recovery box 151 cannot be disassembled, the peripheral portion We can be accumulated in the buffer space 134, so that the edge cutting can be continued. Moreover, later, in the case where the amount of the peripheral portion We exceeds the amount that can be accumulated in the buffer space 134, the edge cutting can be interrupted. In this case, the recovery box 151 is disassembled, the peripheral portion We is discarded, and the edge cutting is resumed after the recovery box 151 is installed in the recovery unit 150.

[0095] Furthermore, in the above embodiment, the case where only one recovery unit 150 is connected to the discharge unit 130 is described as an example. However, a plurality of recovery units 150 may be connected to the discharge unit 130 .

[0096] For example, Figure 11 As shown, two recovery parts 150 may be connected to the discharge part 130. In this case, as shown in FIG. Figure 11As shown, two gate parts 140 are provided, and when one collection box 151 is replaced, the discharge path is switched so that the peripheral part We is collected in the other collection box 151, thereby allowing the peripheral part We accumulated in the collection box 151 to be discarded without interrupting the edge cutting of the peripheral removal mechanism 110. Figure 12 As shown, the discharge portion 130 may be provided with two recovery portions 150 , and the discharge path of the peripheral portion We may be switched by a single shutter portion 140 .

[0097] As described above, according to the peripheral edge removal device 70 of this embodiment, by closing the shutter portion 140 when the collection box 151 for collecting the peripheral edge portion We is disassembled, the peripheral edge portion We can be temporarily stored in the buffer space 134. Therefore, the peripheral edge portion We accumulated in the collection box 151 can be discarded without stopping the operation of the peripheral edge removal device 70 or interrupting the edge cutting of the peripheral edge removal mechanism 110.

[0098] Furthermore, the peripheral portion We temporarily accumulated in the buffer space 134 can be appropriately recovered in the recovery unit 150 by opening the gate unit 140 after the recovery box 151 is installed. At this time, since the sealing member 144 is provided in the gap G between the plate-shaped member 141 and the buffer space 134, the peripheral portion We can be more appropriately dropped and recovered in the recovery unit 150 while the accumulated peripheral portion We is cleaned as the gate unit 140 opens. Furthermore, a connecting pipe 153 having an opening at least larger than the opening of the gate unit 140 is provided below the gate unit 140, thereby enabling the peripheral portion We to be more appropriately recovered in the recovery unit 150.

[0099] Furthermore, according to this embodiment, the exhaust mechanism 133 is connected to the cover 132 of the discharge unit 130, thereby enabling suction to be applied to the interior of the recovery mechanism 120 and the cup 114. Therefore, particles generated when the peripheral portion We is removed can be appropriately recovered by the exhaust mechanism 133. Furthermore, since the recovery mechanism 120 has a sealed structure, the outflow of particles from the recovery mechanism 120 can be appropriately suppressed.

[0100] Furthermore, in the above embodiment, the recovery unit 150 is configured to directly recover the peripheral portion We removed by the peripheral edge removal mechanism 110 into the recovery box 151. However, for example, a recovery bag (not shown) may be installed inside the recovery box 151. In this case, the recovered peripheral portion We can be discarded from the recovery box 151 simply by replacing the recovery bag, thereby making it easier to discard the peripheral portion We.

[0101] In addition, the recovery unit 150 may also be configured to be provided with a recovery bag (not shown) instead of the recovery box 151. That is, the recovery bag may also be directly mounted on the connecting pipe 153. Even in this case, the recovery bag can be easily replaced by closing the gate portion 140.

[0102] Furthermore, for example, in the above embodiment, the peripheral edge removal mechanism 110, the discharge unit 130, and the recovery unit 150 are located in the same clean room. However, the peripheral edge removal mechanism 110 and the discharge unit 130 and / or the recovery unit 150 may be located on different floors. In this case, the recovery unit may also be a sub-fab. In other words, the peripheral edge portion We removed by the peripheral edge removal mechanism 110 may be directly discarded in the sub-fab.

[0103] Specifically, if Figure 13 As shown, the recovery unit 250 includes a sliding frame 251, which corresponds to the recovery box 151; a frame storage body 252, which corresponds to the box storage body 152; a recovery bag 253 mounted inside the sliding frame 251; and a weight sensor 254. The frame storage body 252 forms a sealed area. In the recovery unit 250, the weight sensor 254 detects the amount of the peripheral portion We recovered into the recovery bag 253. When the detected recovery amount exceeds the recyclable amount of the recovery bag 253, the sliding frame 251 is removed from the frame storage body 252 and the peripheral portion We is discarded. The peripheral portion We is discarded by replacing the recovery bag 253.

[0104] Furthermore, the recovery unit 250 may be further provided with a detection mechanism (not shown) for detecting the amount of recovery of the peripheral portion We in the recovery bag 253. As the detection mechanism, for example, a photoelectric sensor, a camera, or the like can be used.

[0105] Furthermore, in the above embodiment, the peripheral edge removal mechanism 110 removes the peripheral edge portion We by inserting the insert member 113 into the interface between the first wafer W and the second wafer S. However, the structure of the peripheral edge removal mechanism 110 is not limited thereto.

[0106] In addition, in the above embodiment, the gate portion 140 is opened and closed by sliding the drive mechanism 142, but the opening and closing method of the gate portion 140 is not limited thereto. For example, the gate portion 140 can also be opened and closed by a throttle mechanism, or can be opened and closed on the recovery portion 150 side.

[0107] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope of the appended claims and their spirit.

[0108] Description of Reference Numerals

[0109] 110 , peripheral edge removal mechanism; 120 , recovery mechanism; 130 , discharge unit; 140 , gate unit; 150 , recovery unit; W, first wafer; We, peripheral edge unit.

Claims

1. A recovery mechanism for recovering the peripheral edge of a substrate removed by a peripheral edge removal mechanism, wherein: The recycling organization has: a recovery unit that recovers the removed peripheral portion, the recovery unit including a recovery box that accumulates the peripheral portion therein; a discharge portion connecting the recovery portion and the peripheral edge removal mechanism, wherein the discharge portion includes a buffer space for temporarily storing the removed peripheral edge portion; as well as a path switching portion configured to switch a discharge path of the peripheral portion of the discharge portion; When the recovery box is installed relative to the recovery part, the path switching part is opened so that the removed peripheral part is recovered in the recovery box; when the recovery box is disassembled relative to the recovery part, the path switching part is closed so that the removed peripheral part is temporarily stored in the buffer space.

2. The recovery mechanism according to claim 1, wherein: The discharge portion is provided with a separation mechanism that separates a discharge path of the removed peripheral portion from a discharge path of particles generated by the peripheral edge removal mechanism. An exhaust section is connected to the discharge path of the fine particles in the separation mechanism.

3. The recovery mechanism according to claim 2, wherein: The separation mechanism comprises: a screen formed on at least a portion of a circumferential surface of the discharge portion; and The cover is arranged in a manner of covering the screen.

4. The recovery mechanism according to any one of claims 1 to 3, wherein: The recovery mechanism includes a sealing member that closes a gap between the path switching portion and the discharge portion.

5. The recovery mechanism according to claim 4, wherein: The sealing member is a brush having one end connected to the discharge portion and the other end in contact with the path switching portion.

6. The recovery mechanism according to any one of claims 1 to 3, wherein: The collecting mechanism includes a detecting portion that detects the peripheral portion accumulated on the upper surface of the path switching portion when the path switching portion is closed.

7. The recovery mechanism according to any one of claims 1 to 3, wherein: The collection box is configured to be attachable to and detachable from the collection portion.

8. The recovery mechanism according to any one of claims 1 to 3, wherein: The recovery mechanism includes a connecting pipe, which is provided below the path switching portion and connects the recovery box and the discharge portion. The connecting pipe has an opening at the upper end that is larger than the discharge portion. The connecting pipe has an opening at a lower end portion that is smaller than an opening formed in the recovery tank.

9. The recovery mechanism according to any one of claims 1 to 3, wherein: The collection mechanism includes a second detection unit configured to detect the peripheral portion accumulated in the collection box.

10. A substrate processing device for processing a substrate, wherein: The substrate processing device comprises: a peripheral edge removal mechanism for removing a peripheral edge portion of the substrate to be removed; and A recovery mechanism according to any one of claims 1 to 9.

11. The substrate processing apparatus according to claim 10, wherein: The peripheral edge removal mechanism includes a cup body provided so as to surround the outer periphery of the substrate.

12. The substrate processing apparatus according to claim 11, wherein: The lower end of the cup body is connected to the discharge portion.

13. A recycling method for recycling a peripheral edge portion of a substrate removed in a peripheral edge removal portion, wherein: The recovery mechanism for recovering the peripheral portion comprises: a recovery unit that recovers the removed peripheral portion, the recovery unit including a recovery box that accumulates the peripheral portion therein; a discharge portion, wherein the recovery portion is connected to the peripheral edge removal portion, wherein the discharge portion includes a buffer space for temporarily storing the removed peripheral edge portion; as well as a path switching portion configured to switch a discharge path of the peripheral portion of the discharge portion; The recycling method comprises the following steps: removing the peripheral edge portion of the substrate to be removed; and The removed peripheral portion is recovered by the recovery mechanism, When the recovery box is installed relative to the recovery part, the path switching part is opened so that the removed peripheral part is recovered in the recovery box; when the recovery box is disassembled relative to the recovery part, the path switching part is closed so that the removed peripheral part is temporarily stored in the buffer space.

14. The recycling method according to claim 13, wherein: This recovery method includes the step of separating the removed peripheral edge portion from fine particles generated in the peripheral edge removal portion in the discharge portion.

15. The recycling method according to claim 14, wherein: The recovery method comprises the following steps: at least exhausting the interior of the recovery mechanism.

16. The recovery method according to any one of claims 13 to 15, wherein The recovery method includes the following steps: when the path switching portion is closed, accumulating the peripheral portion on the upper surface of the path switching portion.

17. The recycling method according to claim 16, wherein: The recovery method includes the step of detecting the peripheral portion accumulated on the upper surface of the path switching portion.

18. The recycling method according to claim 16, wherein: The recovery mechanism includes a sealing member that closes a gap between the path switching portion and the discharge portion. The sealing member cleans the peripheral portion of the upper surface of the path switching portion and causes the accumulated liquid to fall toward the recovery portion during the opening operation of the path switching portion.

19. The recovery method according to any one of claims 13 to 15, wherein The recovery box is configured to be attachable to and detachable from the recovery portion.

20. The recovery method according to any one of claims 13 to 15, wherein The collection method includes the step of detecting the peripheral portion accumulated in the collection box.

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